A feeding device and feeding method for semiconductor laser chip processing

Abstract

The present invention relates to the technical field of semiconductor laser chips, and discloses a feeding device and a feeding method for semiconductor laser chip processing, including a bottom plate. A positioning plate is fixedly connected to the top of the bottom plate, a motor is fixedly connected to the surface of the positioning plate, a belt is arranged at the output end of the motor, and a processing device is fixedly connected to the surface of the positioning plate. In the present invention, a blanking component is arranged above the bottom plate. After placing the semiconductor laser chip into the blanking component, the blanking component starts to work and sequentially blanks the semiconductor laser chips to the top of the conveying component. After the motor is powered on, the motor drives the conveying component to start working through the connection of the pulley and the belt, so that the conveying component can transport the semiconductor laser chips to the processing position of the processing device for processing. An extrusion component is arranged on the top of the blanking component, and the extrusion component is used to push the semiconductor laser chips to move downward inside the blanking component.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser chips, and specifically to a feeding device and a feeding method for semiconductor laser chip processing. Background Art

[0002] A semiconductor laser chip refers to a laser chip made of semiconductor materials. A laser is a device that generates electromagnetic radiation with high brightness, monochromaticity, and directivity, and is widely used in fields such as optical communication, lidar, medicine, and material processing. Semiconductor laser chips have the advantages of small size, low power consumption, and low price. In the field of optical communication, semiconductor laser chips are used in laser driver chips, optical amplifier chips, photodetector chips, and other optoelectronic devices;

[0003] During processing, it is necessary to place the semiconductor laser chip at the processing location of the processing device, and it requires an operator to place the semiconductor laser chip at the processing location of the processing device. After the semiconductor laser chip is processed, it is necessary for the operator to replace the semiconductor laser chip, which causes the operator to constantly perform loading and unloading work, resulting in a large amount of manpower being required to assist during the processing of semiconductor laser chips. Summary of the Invention

[0004] The purpose of the present invention is to provide a feeding device and a feeding method for semiconductor laser chip processing to solve the problems raised in the above background art.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a feeding device and a feeding method for semiconductor laser chip processing, including a bottom plate. A positioning plate is fixedly connected to the top of the bottom plate. A motor is fixedly connected to the surface of the positioning plate. A belt is provided at the output end of the motor. A processing device is fixedly connected to the surface of the positioning plate. It further includes:

[0007] A transportation component, the transportation component includes a rotating rod. The surface of the rotating rod is fixedly connected to the inner wall of the positioning plate. A meshing wheel is fixedly connected to the surface of the rotating rod. Belt wheels are respectively fixedly connected to the surface of the rotating rod and the output end of the motor. The belt wheels are connected by a belt in transmission;

[0008] A blanking component, the blanking component includes a support plate. The support plate is fixedly connected to the surface of the positioning plate. One end of the support plate away from the positioning plate is fixedly connected to a blanking frame. An inclined frame is fixedly connected to the upper surface of the blanking frame;

[0009] An extrusion component, the extrusion component includes a semi-circular frame. The semi-circular frame is hinged to the bottom of the inclined frame. One end of the semi-circular frame away from the inclined frame is hinged to an inclined plate;

[0010] A limiting component is arranged on the surface of the blanking rack.

[0011] Further, the number of the belts is two, and the two belts are symmetrically arranged with the motor as the center. The motor is arranged at one end of the positioning plate far from the meshing wheel.

[0012] Further, the conveying component includes a grooved belt. The inner wall of the grooved belt meshes with the surface of the meshing wheel. A conveyor belt is fixedly connected to the surface of the grooved belt, and a row of skeleton frames is fixedly connected to the surface of the conveyor belt.

[0013] The number of the row of skeleton frames is several rods, and the several row of skeleton frames are evenly laid on the surface of the conveyor belt.

[0014] Further, the end of the rotating rod penetrates through the positioning plate and extends to the outer end of the positioning plate. The end of the conveyor belt contacts the surface of the positioning plate. One end of the processing device far from the positioning plate extends above the conveyor belt.

[0015] Further, the blanking component includes a through-hole frame. The through-hole frame is fixedly connected to the surface of the blanking rack. A round-hole frame is fixedly connected to the inner wall of the through-hole frame. A bent rod is slidably connected to the inner wall of the round-hole frame. A plug board is fixedly connected to the end of the bent rod. One end of the bent rod far from the plug board is hinged with a telescopic frame, and a linkage rod is fixedly connected to the center of the telescopic frame.

[0016] A driving machine is fixedly connected to the surface of the support plate. Driving wheels are respectively fixedly connected to the output end of the driving machine and the end of the linkage rod. A vertical frame is fixedly connected to the surface of the support plate, and a stabilizing frame is fixedly connected to the end of the vertical frame.

[0017] Further, the through-hole frame and the blanking rack are interlocked. The two driving wheels are meshed with each other. The surface of the linkage rod is rotatably connected to the inner wall of the stabilizing frame. The end of the bent rod penetrates through the round-hole frame and extends to the outer end of the round-hole frame. The number of the bent rods is two, and the two bent rods are symmetrically arranged with the round-hole frame as the center.

[0018] Further, the pressing component includes a central rod. The central rod is hinged to the end of the inclined plate. A spherical rack is fixedly connected to the bottom of the central rod. A spring piece is hinged to the inner wall of the semi-circular rack. One end of the spring piece far from the semi-circular rack is fixedly connected to the inner wall of the inclined rack.

[0019] A rubber plate is fixedly connected to the lower surface of the spherical rack. The end of the rubber plate contacts the inner wall of the blanking rack. A pressure rack is fixedly connected to the surface of the linkage rod. The surface of the pressure rack contacts the surface of the semi-circular rack.

[0020] Furthermore, the number of the inclined plates is set to two. One ends of the two inclined plates close to each other are inclined downward. The central rod is arranged at the end of the inclined plate away from the semi-circular frame. The bottom of the spherical ball frame extends below the inclined frame.

[0021] Furthermore, the limiting component includes a sliding plate. The sliding plate is fixedly connected to the surface of the blanking frame. A lifting frame is slidably connected to the surface of the sliding plate. A synchronous rod is fixedly connected to the surface of the lifting frame. A fixing rod is fixedly connected to the bottom of the lifting frame. A limiting plate is fixedly connected to the bottom of the fixing rod;

[0022] One end of the synchronous rod away from the lifting frame is fixedly connected to the end of the central rod. The bottom of the limiting plate and the top of the conveyor belt are horizontally arranged.

[0023] Furthermore, a feeding method of the feeding device for semiconductor laser chip processing includes the following steps:

[0024] S1: A row of skeletons is arranged on the top of the conveyor belt. The semiconductor laser chips are supported by the row of skeletons to prevent the processing deviation of the semiconductor laser chips caused by the toughness of the conveyor belt;

[0025] S2: The inserting plates can support the semiconductor laser chips. When the semiconductor laser chips need to be blanked, the telescopic frame pulls the upper inserting plate into the inside of the through-hole frame, and the lower inserting plate will enter the inside of the blanking frame. At this time, the semiconductor laser chips will contact the lower inserting plate. After the upper inserting plate enters the inside of the blanking frame, the lower inserting plate will enter the inside of the through-hole frame;

[0026] S3: When the semi-circular frame contracts, it pushes the central rod to move downward through the inclined plate, so that the central rod can push the spherical ball frame and the rubber plate to squeeze the semiconductor laser chips, and the rubber plate is used to level the semiconductor laser chips;

[0027] S4: When the lifting frame moves downward, it pushes the limiting plate to move downward through the fixing rod, so that the limiting plate can contact the top of the conveyor belt. When the semiconductor laser chips are blanked onto the top of the conveyor belt, the limiting plate can limit the semiconductor laser chips.

[0028] The present invention has the following beneficial effects:

[0029] The present invention is provided with a blanking component above the bottom plate. After placing the semiconductor laser chip into the interior of the blanking component, the blanking component starts to work and sequentially blanks the semiconductor laser chips to the top of the transport component. After powering on the motor, the motor drives the transport component to start working through the connection of the pulley and the belt, enabling the transport component to transport the semiconductor laser chips to the processing location of the processing device for processing. A pressing component is arranged on the top of the blanking component, and the pressing component is used to push the semiconductor laser chip to move downward inside the blanking component, preventing the semiconductor laser chip from getting stuck inside the blanking component and reducing the processing efficiency of the semiconductor laser chip.

[0030] When the rotating rod of the present invention rotates, it drives the meshing wheel to rotate. The meshing wheel drives the transmission belt to rotate on the surface of the positioning plate through the groove belt. Two rotating rods are provided to support the transmission belt, improving the stability of the transport work of the transmission belt. A row of skeletons is arranged on the top of the transmission belt, and the row of skeletons is used to support the semiconductor laser chip, preventing the semiconductor laser chip from deviating during processing due to the toughness of the transmission belt, and improving the stability of the semiconductor laser chip during processing.

[0031] After placing the semiconductor laser chip into the interior of the inclined rack, the semiconductor laser chip slides down along the slope of the inclined rack to the inner wall of the blanking rack and contacts the top of the plug board. The driving machine drives the linkage rod to rotate by the rotation of the driving wheel. When the linkage rod rotates, it drives the telescopic rack to rotate. When the upper end of the telescopic rack moves towards the end of the through-hole rack, the bottom of the telescopic rack will move away from one end of the through-hole rack. At this time, the upper plug board can support the semiconductor laser chip. When it is necessary to blank the semiconductor laser chip, the telescopic rack pulls the upper plug board into the interior of the through-hole rack, and the lower plug board will enter the interior of the blanking rack. At this time, the semiconductor laser chip will contact the lower plug board. After the upper plug board enters the interior of the blanking rack, the lower plug board will enter the interior of the through-hole rack. At this time, the semiconductor laser chip will be blanked to the top of the transmission belt for transportation processing. The blanking process of the semiconductor laser chip is carried out by the opposite movement of the two plug boards, enabling the semiconductor laser chips to be processed one by one, and preventing too many semiconductor laser chips from being blanked and accumulating at the processing location of the processing device.

[0032] When the upper end of the telescopic frame of the present invention moves away from the through-hole frame, the elastic piece elastically pushes the semi-circular frame to expand outwards. When the semi-circular frame expands, it pulls the central rod upwards through the inclined plate. When the central rod moves upwards, it pushes the spherical frame upwards. At this time, the semiconductor laser chip inside the inclined frame can slide into the inside of the blanking frame and move. The pressure frame squeezes the semi-circular frame to contract as the linkage rod rotates. When the semi-circular frame contracts, it pushes the central rod downwards through the inclined plate, so that the central rod can push the spherical frame and the rubber plate to squeeze the semiconductor laser chip, and use the rubber plate to flatten the semiconductor laser chip, avoiding the semiconductor laser chip being stuck inside the blanking frame and causing blockage, and further improving the convenience of the semiconductor laser chip during processing.

[0033] When the central rod of the present invention moves downwards, it pushes the lifting frame downwards through the synchronous rod. When the lifting frame moves downwards, it pushes the limiting plate downwards through the fixed rod, so that the limiting plate can contact the top of the conveyor belt. After the semiconductor laser chip is blanked onto the top of the conveyor belt, the limiting plate can limit the semiconductor laser chip to avoid damage caused by the semiconductor laser chip falling off.

[0034] Of course, it is not necessary for any product implementing the present invention to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0037] Figure 2 It is a schematic diagram of the positioning plate structure of the present invention;

[0038] Figure 3 It is a schematic diagram of the overall structure of the transportation component of the present invention;

[0039] Figure 4 It is a schematic diagram of the sectional structure of the conveyor belt of the present invention;

[0040] Figure 5 It is a schematic diagram of the overall structure of the blanking component of the present invention;

[0041] Figure 6 It is another schematic diagram of the blanking component of the present invention;

[0042] Figure 7 It is a schematic diagram of the overall structure of the extrusion component of the present invention;

[0043] Figure 8 It is a schematic diagram of the overall structure of the limiting component of the present invention;

[0044] Figure 9 It is a schematic diagram of the process structure of the present invention.

[0045] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0046] In the figure: 1, bottom plate; 2, positioning plate; 3, processing device; 4, motor; 5, belt; 6, pulley; 7, transportation component; 8, unloading component; 9, extrusion component; 10, limiting component; 20, transmission belt; 21, groove belt; 22, rack frame; 23, rotating rod; 24, meshing wheel; 30, unloading rack; 31, inclined rack; 32, driving machine; 33, driving wheel; 34, supporting plate; 35, vertical rack; 36, through-hole rack; 37, connecting rod; 38, stabilizing rack; 39, telescopic rack; 40, bending rod; 41, round hole rack; 42, plug plate; 50, semicircular rack; 51, inclined plate; 52, center rod; 53, spring piece; 54, ball rack; 55, rubber plate; 56, pressure rack; 60, synchronization rod; 61, slide plate; 62, lifting rack; 63, fixing rod; 64, limiting plate. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] See also Figures 1-9 As shown, the present invention is a feeding device for semiconductor laser chip processing and a feeding method thereof, comprising a bottom plate 1, a positioning plate 2 is fixedly connected to the top of the bottom plate 1, a motor 4 is fixedly connected to the surface of the positioning plate 2, a belt 5 is provided at the output end of the motor 4, a processing device 3 is fixedly connected to the surface of the positioning plate 2, and further comprising:

[0049] The transport component 7 includes a rotating rod 23, the surface of the rotating rod 23 is fixedly connected to the inner wall of the positioning plate 2, the surface of the rotating rod 23 is fixedly connected to a meshing wheel 24, the surface of the rotating rod 23 and the output end of the motor 4 are respectively fixedly connected to a pulley 6, and the pulley 6 is connected through a belt 5;

[0050] A material unloading component 8, the material unloading component 8 comprises a support plate 34, the support plate 34 is fixedly connected to the surface of the positioning plate 2, one end of the support plate 34 away from the positioning plate 2 is fixedly connected to a material unloading frame 30, and an upper surface of the material unloading frame 30 is fixedly connected to an inclined frame 31;

[0051] The extrusion member 9 includes a semi-circular frame 50. The semi-circular frame 50 is hinged to the bottom of the inclined frame 31. In the present invention, a blanking member 8 is provided above the bottom plate 1. After placing the semiconductor laser chip into the interior of the blanking member 8, the blanking member 8 starts to work and sequentially blanks the semiconductor laser chips to the top of the transport member 7. After the motor 4 is powered on, the motor 4 drives the transport member 7 to start working through the connection of the pulley 6 and the belt 5, so that the transport member 7 can transport the semiconductor laser chips to the processing location of the processing device 3 for processing. An extrusion member 9 is provided on the top of the blanking member 8. The extrusion member 9 is used to push the semiconductor laser chip to move downward inside the blanking member 8 to prevent the semiconductor laser chip from getting stuck inside the blanking member 8, resulting in a reduction in the processing efficiency of the semiconductor laser chip. One end of the semi-circular frame 50 away from the inclined frame 31 is hinged with an inclined plate 51;

[0052] A limiting member 10 is provided on the surface of the blanking frame 30.

[0053] The number of belts 5 is two. The two belts 5 are symmetrically arranged with the motor 4 as the center. The motor 4 is arranged at one end of the positioning plate 2 away from the meshing wheel 24.

[0054] The transport member 7 includes a groove belt 21. The inner wall of the groove belt 21 meshes with the surface of the meshing wheel 24. A transmission belt 20 is fixedly connected to the surface of the groove belt 21. A row skeleton 22 is fixedly connected to the surface of the transmission belt 20;

[0055] The number of row skeletons 22 is several rods. In the present invention, when the rotating rod 23 rotates, it drives the meshing wheel 24 to rotate. The meshing wheel 24 drives the transmission belt 20 to rotate on the surface of the positioning plate 2 through the groove belt 21. Two rotating rods 23 are provided to support the transmission belt 20, improving the stability of the transportation work of the transmission belt 20. A row skeleton 22 is provided on the top of the transmission belt 20 to support the semiconductor laser chip, preventing the semiconductor laser chip from deviating during processing due to the toughness of the transmission belt 20, and improving the stability of the semiconductor laser chip during processing. Several row skeletons 22 are evenly laid on the surface of the transmission belt 20.

[0056] The end of the rotating rod 23 penetrates through the positioning plate 2 and extends to the outside of the positioning plate 2. The end of the transmission belt 20 contacts the surface of the positioning plate 2. One end of the processing device 3 away from the positioning plate 2 extends above the transmission belt 20.

[0057] The blanking member 8 includes a through-hole frame 36. The through-hole frame 36 is fixedly connected to the surface of the blanking frame 30. A circular-hole frame 41 is fixedly connected to the inner wall of the through-hole frame 36. A bent rod 40 is slidably connected to the inner wall of the circular-hole frame 41. A plug board 42 is fixedly connected to the end of the bent rod 40. One end of the bent rod 40 away from the plug board 42 is hinged with a telescopic frame 39. A linkage rod 37 is fixedly connected to the center of the telescopic frame 39;

[0058] A driving machine 32 is fixedly connected to the surface of the support plate 34. The output end of the driving machine 32 and the end of the linkage rod 37 are respectively fixedly connected with driving wheels 33. After the semiconductor laser chip is placed into the inclined frame 31 in the present invention, the semiconductor laser chip slides down to the inner wall of the blanking frame 30 by using the slope of the inclined frame 31 and contacts the top of the insertion plate 42. The driving machine 32 drives the linkage rod 37 to rotate by using the rotation of the driving wheels 33. When the linkage rod 37 rotates, it drives the telescopic frame 39 to rotate. When the upper end of the telescopic frame 39 moves towards the end of the through-hole frame 36, the bottom of the telescopic frame 39 will move towards the end away from the through-hole frame 36. At this time, the upper insertion plate 42 can support the semiconductor laser chip. When it is necessary to blank the semiconductor laser chip, the telescopic frame 39 pulls the upper insertion plate 42 into the through-hole frame 36, and the lower insertion plate 42 will enter the blanking frame 30. At this time, the semiconductor laser chip will contact the lower insertion plate 42. After the upper insertion plate 42 enters the blanking frame 30, the lower insertion plate 42 will enter the through-hole frame 36. At this time, the semiconductor laser chip will be blanked onto the top of the conveyor belt 20 for transportation processing. The blanking process of the semiconductor laser chip is carried out by using the opposite movements of the two insertion plates 42, and the semiconductor laser chips can be processed one by one, avoiding excessive accumulation of the blanked semiconductor laser chips at the processing location of the processing device 3. A vertical frame 35 is fixedly connected to the surface of the support plate 34, and a stabilizing frame 38 is fixedly connected to the end of the vertical frame 35.

[0059] The through-hole frame 36 and the blanking frame 30 are interlocked with each other. The two driving wheels 33 are meshed with each other. The surface of the linkage rod 37 is rotationally connected to the inner wall of the stabilizing frame 38. The end of the bent rod 40 penetrates through the circular hole frame 41 and extends to the outer end of the circular hole frame 41. The number of the bent rods 40 is set to be two, and the two bent rods 40 are symmetrically arranged with the circular hole frame 41 as the center.

[0060] The extrusion component 9 includes a central rod 52. The central rod 52 is hinged to the end of the inclined plate 51. A spherical frame 54 is fixedly connected to the bottom of the central rod 52. A spring piece 53 is hinged to the inner wall of the semi-circular frame 50, and the end of the spring piece 53 away from the semi-circular frame 50 is fixedly connected to the inner wall of the inclined frame 31;

[0061] A rubber plate 55 is fixedly connected to the lower surface of the spherical ball holder 54. When the upper end of the telescopic holder 39 of the present invention moves away from the through-hole holder 36, the elastic piece 53 elastically pushes the semi-circular holder 50 to expand outwards. When the semi-circular holder 50 expands, it pulls the central rod 52 upwards through the inclined plate 51. When the central rod 52 moves upwards, it pushes the spherical ball holder 54 upwards. At this time, the semiconductor laser chip inside the inclined holder 31 can slide into the inside of the blanking holder 30 and move. The pressure holder 56 squeezes the semi-circular holder 50 to contract as the linkage rod 37 rotates. When the semi-circular holder 50 contracts, it pushes the central rod 52 downwards through the inclined plate 51, so that the central rod 52 can push the spherical ball holder 54 and the rubber plate 55 to squeeze the semiconductor laser chip, and use the rubber plate 55 to flatten the semiconductor laser chip, avoiding the semiconductor laser chip being stuck inside the blanking holder 30 and causing blockage, and further improving the convenience of the semiconductor laser chip during processing. The end of the rubber plate 55 contacts the inner wall of the blanking holder 30. A pressure holder 56 is fixedly connected to the surface of the linkage rod 37, and the surface of the pressure holder 56 contacts the surface of the semi-circular holder 50.

[0062] The number of inclined plates 51 is set to two. One ends of the two inclined plates 51 close to each other are inclined downwards. The central rod 52 is arranged at the end of the inclined plate 51 far from the semi-circular holder 50. The bottom of the spherical ball holder 54 extends below the inclined holder 31.

[0063] The limiting component 10 includes a sliding plate 61. The sliding plate 61 is fixedly connected to the surface of the blanking holder 30. A lifting holder 62 is slidably connected to the surface of the sliding plate 61. A synchronous rod 60 is fixedly connected to the surface of the lifting holder 62. A fixing rod 63 is fixedly connected to the bottom of the lifting holder 62. When the central rod 52 of the present invention moves downwards, it pushes the lifting holder 62 downwards through the synchronous rod 60. When the lifting holder 62 moves downwards, it pushes the limiting plate 64 downwards through the fixing rod 63, so that the limiting plate 64 can contact the top of the conveyor belt 20. After the semiconductor laser chip is blanked onto the top of the conveyor belt 20, the limiting plate 64 can limit the semiconductor laser chip to prevent the semiconductor laser chip from falling off and being damaged. A limiting plate 64 is fixedly connected to the bottom of the fixing rod 63;

[0064] One end of the synchronous rod 60 far from the lifting holder 62 is fixedly connected to the end of the central rod 52. The bottom of the limiting plate 64 and the top of the conveyor belt 20 are horizontally arranged.

[0065] A feeding method for a feeding device used in the processing of semiconductor laser chips includes the following steps:

[0066] S1: A row of skeleton 22 is arranged on the top of the conveyor belt 20. The semiconductor laser chips are supported by the row of skeleton 22 to prevent the processing of the semiconductor laser chips from being deviated due to the toughness of the conveyor belt 20;

[0067] S2: The plug board 42 can support the semiconductor laser chip. When it is necessary to cut the semiconductor laser chip, the telescopic frame 39 pulls the upper plug board 42 into the inside of the through hole frame 36, and the lower plug board 42 will enter the inside of the blanking frame 30. At this time, the semiconductor laser chip will contact the lower plug board 42. After the upper plug board 42 enters the inside of the blanking frame 30, the lower plug board 42 will enter the inside of the through hole frame 36;

[0068] S3: When the semi-circular frame 50 contracts, it pushes the central rod 52 downward through the inclined plate 51, so that the central rod 52 can push the spherical frame 54 and the rubber plate 55 to squeeze the semiconductor laser chip, and the rubber plate 55 is used to level the semiconductor laser chip;

[0069] S4: When the lifting frame 62 moves downward, it pushes the limiting plate 64 downward through the fixed rod 63, so that the limiting plate 64 can contact the top of the conveyor belt 20. When the semiconductor laser chip is blanked onto the top of the conveyor belt 20, the limiting plate 64 can limit the semiconductor laser chip.

[0070] During use, a blanking component 8 is arranged above the bottom plate 1. After placing the semiconductor laser chip into the interior of the blanking component 8, the blanking component 8 starts to work and feeds the semiconductor laser chips one by one to the top of the transport component 7. After powering on the motor 4, the motor 4 drives the transport component 7 to start working through the connection of the pulley 6 and the belt 5, enabling the transport component 7 to transport the semiconductor laser chips to the processing location of the processing device 3 for processing. An extrusion component 9 is arranged on the top of the blanking component 8. The extrusion component 9 is used to push the semiconductor laser chips to move downward inside the blanking component 8, preventing the semiconductor laser chips from getting stuck inside the blanking component 8 and causing a reduction in the processing efficiency of the semiconductor laser chips. When the rotating rod 23 rotates, it drives the meshing wheel 24 to rotate. The meshing wheel 24 drives the transmission belt 20 to rotate on the surface of the positioning plate 2 through the groove belt 21. Two rotating rods 23 are provided to support the transmission belt 20, improving the stability of the transportation work of the transmission belt 20. A row of skeletons 22 is arranged on the top of the transmission belt 20. The row of skeletons 22 is used to support the semiconductor laser chips, preventing the semiconductor laser chips from deviating during processing due to the toughness of the transmission belt 20, and improving the stability of the semiconductor laser chips during processing. After placing the semiconductor laser chip into the interior of the inclined frame 31, the semiconductor laser chip slides down along the slope of the inclined frame 31 to the inner wall of the blanking frame 30 and contacts the top of the insertion plate 42. The driving machine 32 drives the connecting rod 37 to rotate by the rotation of the driving wheel 33. When the connecting rod 37 rotates, it drives the telescopic frame 39 to rotate. When the upper end of the telescopic frame 39 moves towards the end of the through-hole frame 36, the bottom of the telescopic frame 39 will move away from one end of the through-hole frame 36. At this time, the upper insertion plate 42 can support the semiconductor laser chip. When it is necessary to blank the semiconductor laser chip, the telescopic frame 39 pulls the upper insertion plate 42 into the interior of the through-hole frame 36, and the lower insertion plate 42 will enter the interior of the blanking frame 30. At this time, the semiconductor laser chip will contact the lower insertion plate 42. After the upper insertion plate 42 enters the interior of the blanking frame 30, the lower insertion plate 42 will enter the interior of the through-hole frame 36. At this time, the semiconductor laser chip will be blanked to the top of the transmission belt 20 for transportation processing. The blanking process of the semiconductor laser chip is carried out by the opposite movement of the two insertion plates 42, and the semiconductor laser chips can be processed one by one, preventing too many semiconductor laser chips from being blanked and accumulating at the processing location of the processing device 3. When the upper end of the telescopic frame 39 moves away from the through-hole frame 36, the elastic piece 53 elastically pushes the semi-circular frame 50 to expand outwards. When the semi-circular frame 50 expands, it pulls the central rod 52 upwards through the inclined plate 51. When the central rod 52 moves upwards, it pushes the spherical frame 54 upwards. At this time, the semiconductor laser chips inside the inclined frame 31 can slide into the interior of the blanking frame 30 and move. The pressure frame 56 squeezes the semi-circular frame 50 to contract as the connecting rod 37 rotates. When the semi-circular frame 50 contracts, it pushes the central rod 52 downwards through the inclined plate 51.The central rod 52 can push the spherical ball holder 54 and the rubber plate 55 to extrude the semiconductor laser chip, and the rubber plate 55 is used to flatten the semiconductor laser chip, so as to avoid the semiconductor laser chip being stuck inside the blanking rack 30 and causing blockage, further improving the convenience of the semiconductor laser chip during processing. When the central rod 52 moves downward, it pushes the lifting frame 62 to move downward through the synchronous rod 60. When the lifting frame 62 moves downward, it pushes the limiting plate 64 to move downward through the fixed rod 63, so that the limiting plate 64 can contact the top of the conveyor belt 20. After the semiconductor laser chip is blanked onto the top of the conveyor belt 20, the limiting plate 64 can limit the semiconductor laser chip to prevent the semiconductor laser chip from falling off and being damaged.

[0071] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A feeding device for semiconductor laser chip processing, comprising a bottom plate (1), a positioning plate (2) is fixedly connected to the top of the bottom plate (1), a motor (4) is fixedly connected to the surface of the positioning plate (2), a belt (5) is arranged at the output end of the motor (4), and a processing device (3) is fixedly connected to the surface of the positioning plate (2), characterized in that, Also includes: A transport component (7), the transport component (7) comprising a rotating rod (23), the surface of the rotating rod (23) being fixedly connected to the inner wall of the positioning plate (2), the surface of the rotating rod (23) being fixedly connected to a meshing wheel (24), the surface of the rotating rod (23) and the output end of the motor (4) being fixedly connected to a pulley (6), respectively, the pulley (6) being connected via a belt (5); A material unloading component (8), the material unloading component (8) comprising a support plate (34), the support plate (34) being fixedly connected to the surface of the positioning plate (2), one end of the support plate (34) away from the positioning plate (2) being fixedly connected to a material unloading frame (30), and the upper surface of the material unloading frame (30) being fixedly connected to an inclined frame (31); An extrusion component (9), the extrusion component (9) comprising a semicircular frame (50), the semicircular frame (50) being hinged to the bottom of the inclined frame (31), and an end of the semicircular frame (50) away from the inclined frame (31) being hinged to an inclined plate (51); A limiting component (10) is provided on the surface of the unloading rack (30); The material removal component (8) comprises a through-hole frame (36), wherein the through-hole frame (36) is fixedly connected to the surface of the material removal frame (30), the inner wall of the through-hole frame (36) is fixedly connected to a round hole frame (41), the inner wall of the round hole frame (41) is slidably connected to a bent rod (40), the end of the bent rod (40) is fixedly connected to a plug plate (42), the end of the bent rod (40) away from the plug plate (42) is hingedly connected to a telescopic frame (39), and the center of the telescopic frame (39) is fixedly connected to a linkage rod (37); The surface of the support plate (34) is fixedly connected to a driving machine (32), and the output end of the driving machine (32) and the end of the connecting rod (37) are respectively fixedly connected to a driving wheel (33); The semiconductor laser chip slides down to the inner wall of the unloading frame (30) by utilizing the inclination of the inclined frame (31) and contacts the top of the plug plate (42). The driving machine (32) drives the linkage rod (37) to rotate by utilizing the rotation of the driving wheel (33). The linkage rod (37) drives the telescopic frame (39) to rotate when rotating. When the upper end of the telescopic frame (39) moves toward the end of the through-hole frame (36), the bottom of the telescopic frame (39) moves toward the end away from the through-hole frame (36). At this time, the upper plug plate (42) can support the semiconductor laser chip, and the extrusion component (9) is used to push the semiconductor laser chip to move toward the lower part of the unloading component (8).

2. The feeding device for semiconductor laser chip processing according to claim 1, wherein: The number of the belts (5) is two, and the two belts (5) are symmetrically arranged with the motor (4) as the center. The motor (4) is arranged at one end of the positioning plate (2) away from the meshing wheel (24).

3. The feeding device for semiconductor laser chip processing according to claim 2, wherein: The transport component (7) comprises a grooved belt (21), the inner wall of the grooved belt (21) meshes with the surface of the meshing wheel (24), the surface of the grooved belt (21) is fixedly connected to a conveyor belt (20), and the surface of the conveyor belt (20) is fixedly connected to a rack frame (22); The number of the slat frames (22) is set to several rods, and the several slat frames (22) are evenly laid on the surface of the conveyor belt (20).

4. A feeding device for semiconductor laser chip processing according to claim 3, characterized in that: The end of the rotating rod (23) penetrates through the positioning plate (2) and extends to the outer end of the positioning plate (2). The end of the conveyor belt (20) contacts the surface of the positioning plate (2). One end of the processing device (3) away from the positioning plate (2) extends above the conveyor belt (20).

5. The feeding device for semiconductor laser chip processing according to claim 4, wherein: A vertical frame (35) is fixedly connected to the surface of the support plate (34), and a stabilizing frame (38) is fixedly connected to the end of the vertical frame (35).

6. The feeding device for semiconductor laser chip processing according to claim 5, characterized in that: The through-hole frame (36) and the blanking frame (30) are interlocked with each other. The two driving wheels (33) are meshed with each other. The surface of the linkage rod (37) is rotatably connected to the inner wall of the stabilizing frame (38). The end of the bent rod (40) penetrates through the circular hole frame (41) and extends to the outer end of the circular hole frame (41). The number of the bent rods (40) is set to two, and the two bent rods (40) are symmetrically arranged with the circular hole frame (41) as the center.

7. The feeding device for semiconductor laser chip processing according to claim 6, characterized in that: The pressing member (9) includes a central rod (52). The central rod (52) is hinged to the end of the inclined plate (51). A spherical frame (54) is fixedly connected to the bottom of the central rod (52). A spring piece (53) is hinged to the inner wall of the semi-circular frame (50). One end of the spring piece (53) away from the semi-circular frame (50) is fixedly connected to the inner wall of the inclined frame (31). A rubber plate (55) is fixedly connected to the lower surface of the spherical frame (54). The end of the rubber plate (55) contacts the inner wall of the blanking frame (30). A pressure frame (56) is fixedly connected to the surface of the linkage rod (37). The surface of the pressure frame (56) contacts the surface of the semi-circular frame (50).

8. A feeding device for semiconductor laser chip processing according to claim 7, characterized in that: The number of the inclined plates (51) is set to two. One ends of the two inclined plates (51) close to each other are inclined downward. The central rod (52) is arranged at one end of the inclined plate (51) away from the semi-circular frame (50). The bottom of the spherical frame (54) extends below the inclined frame (31).

9. The feeding device for semiconductor laser chip processing according to claim 8, characterized in that: The limiting member (10) includes a sliding plate (61). The sliding plate (61) is fixedly connected to the surface of the blanking frame (30). A lifting frame (62) is slidably connected to the surface of the sliding plate (61). A synchronous rod (60) is fixedly connected to the surface of the lifting frame (62). A fixing rod (63) is fixedly connected to the bottom of the lifting frame (62). A limiting plate (64) is fixedly connected to the bottom of the fixing rod (63). One end of the synchronous rod (60) away from the lifting frame (62) is fixedly connected to the end of the central rod (52). The bottom of the limiting plate (64) and the top of the conveyor belt (20) are horizontally arranged.

10. The feeding method of the feeding device for semiconductor laser chip processing according to claim 9, characterized in that, Including the following steps: S1: The slat frame (22) is arranged on the top of the conveyor belt (20). The semiconductor laser chip is supported by the slat frame (22) to prevent the processing deviation of the semiconductor laser chip caused by the toughness of the conveyor belt (20). S2: The plug board (42) can support the semiconductor laser chip. When it is necessary to cut the semiconductor laser chip, the telescopic frame (39) pulls the upper plug board (42) into the inside of the through-hole frame (36), and the lower plug board (42) will enter the inside of the blanking frame (30). At this time, the semiconductor laser chip will contact the lower plug board (42). After the upper plug board (42) enters the inside of the blanking frame (30), the lower plug board (42) will enter the inside of the through-hole frame (36); S3: When the semi-circular frame (50) contracts, it pushes the central rod (52) downward through the inclined plate (51), so that the central rod (52) can push the spherical frame (54) and the rubber plate (55) to squeeze the semiconductor laser chip, and use the rubber plate (55) to flatten the semiconductor laser chip; S4: When the lifting frame (62) moves downward, it pushes the limiting plate (64) downward through the fixed rod (63), so that the limiting plate (64) can contact the top of the conveyor belt (20). When the semiconductor laser chip is blanked onto the top of the conveyor belt (20), the limiting plate (64) can limit the semiconductor laser chip.

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