A fully automatic PCB mounting machine and mounting method

Abstract

The present invention relates to a fully automatic PCB mounting machine and mounting method, wherein the mounting machine comprises a component loading module, a component stripping and mounting module, a PCB board loading module, a PCB board discharging module and a control module. The component loading module comprises at least one calibration bin; the calibration bin comprises a plurality of limit vertical plates, a plurality of independent lifting units, and a driving unit for driving the independent lifting units to move. A height sensor is arranged on the top of the limit vertical plate, and the height sensor is used to detect the height information of one side of the sheet. The top of the independent lifting unit is respectively supported on the opposite side of the bottom of the sheet. The driving unit drives the independent lifting unit to perform lifting movement according to the height information of the side of the sheet measured by the height sensor, so as to adjust the height of one side of the sheet. The present invention overcomes the defect that the upper surface of the stacked sheets is tilted due to the uneven surface of the sheet in the traditional sheet picking process, thereby affecting the reliability of the picking.

Description

Technical Field

[0001] The present invention relates to the technical field related to equipment and method for assembling printed circuits using electrical components, and in particular to a fully automatic PCB mounting machine and mounting method. Background Art

[0002] The so-called PCB placement machine refers to a device that accurately places surface mount components on PCB pads by moving the placement head. It is a key equipment in the SMT production line. Among them, surface mount components can be electronic components such as chips, resistors, capacitors, etc. The main steps of PCB placement include material removal, component stripping, component transfer placement, etc. In order to achieve efficient, accurate and fully automated PCB placement, it is necessary to pay attention to each process of placement so that each process can achieve efficient collaboration, thereby improving the work efficiency and accuracy of the overall equipment. This is also a hot topic in this field.

[0003] In the prior art, a considerable number of patents for automatic placement machines have been disclosed. Typically, for example, Fuding Electronic Technology (Jiashan) Co., Ltd. discloses an automatic placement machine (patent announcement number CN106550551B), including a loading component, a material transport component, a transfer position component, a bonding component and a bonding support component. The loading component is used to place a plurality of adhesive-backed sheets, and the bonding support component is used to place the workpiece to be processed. The automatic placement machine also includes a lifting component, which is located at the bottom of the loading component to eject a plurality of adhesive-backed sheets on the loading component, and the material transport component is located on one side of the loading component to cooperate with the lifting component to absorb the adhesive-backed sheets on the loading component. The material transport component can transfer the adhesive-backed sheets to the transfer position component. The bonding component includes a suction tray and an air knife. The suction tray is used to absorb the adhesive-backed sheets on the transfer position component, and the air knife is located on one side of the suction tray to blow the lower release film away from the adhesive sheet. The suction tray can also be moved to the bonding support component and bond the adhesive sheet to the workpiece to be processed.

[0004] The automatic patch machine disclosed in the prior art can realize automatic and uninterrupted patch loading through a movable carrier; realize accurate positioning during the material transfer process through the arrangement of through holes, positioning rods, positioning holes and positioning bumps; and realize film removal operation through the air knife on the patch assembly. This realizes full automation of patching to a certain extent.

[0005] However, there are still uncertainties in separating the base film and components by blowing air, especially for sheets with different types of components attached, the peeling force required for the components may vary greatly. In order to adapt to such complex working conditions, a more complex control module has to be added to adapt different blowing forces according to different peeling objects in order to improve the success rate of component peeling, which is not worth the loss for actual industrial applications. Therefore, it is necessary to use a mechanical peeling device with a simpler structure and better reliability.

[0006] In addition, considering that the base film material with components is stacked layer by layer on the carrier, and the sheet formed by a single base film with components itself presents an uneven upper surface, when multiple uneven sheets are stacked together, especially when sheets with different types of components are stacked together, the top sheet will most likely be tilted, which is not conducive to the vacuum suction cup sucking up the sheet and transferring it to the film removal station, and may cause the vacuum suction cup to fail to firmly adsorb the sheet, and then the material transfer fails.

[0007] Therefore, how to achieve the reliability and efficiency of PCB placement machine material picking and component stripping, and then improve the reliability, efficiency and accuracy of the overall equipment, is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0008] The object of the present invention is to provide a fully automatic PCB mounting machine and mounting method, aiming to solve the technical problems of insufficient reliability, low accuracy and low mounting efficiency of PCB mounting.

[0009] In order to solve the above technical problems, the present invention provides a fully automatic PCB mounting machine, comprising a workbench, a component loading module, a component stripping and mounting module, a PCB board loading module, a PCB board discharging module and a control module arranged on the upper surface of the workbench, wherein the control module is respectively connected to the component loading module, the component stripping and mounting module, the PCB board loading module and the PCB board discharging module in communication;

[0010] The component loading module includes a sheet material taking robot and at least one calibration bin; the calibration bin is used to store sheets, the sheets include a base film and components attached to the base film, the calibration bin includes a plurality of limit plates, a plurality of independent lifting units, and a driving unit for driving the independent lifting units to move, the number of the independent lifting units is the same as the number of the limit plates, and the limit plates define the storage space for the sheets;

[0011] A height sensor is provided on the top of each of the limiting vertical plates, and the height sensor is used to detect the height information of one side of the sheet. The top ends of the independent lifting units are respectively supported on the opposite sides of the bottom of the sheet. The driving unit can drive the independent lifting unit to perform lifting and lowering movements according to the height information of the side of the sheet measured by the height sensor, so as to achieve height adjustment of one side of the sheet.

[0012] Furthermore, the correction silo also includes a fixed plate, the limiting vertical plate is fixedly connected to the upper surface of the fixed plate, and the fixed plate and the limiting vertical plate further limit the storage space of the sheet material.

[0013] Furthermore, the fixing plate is provided with a hollow area, and the top end of the independent lifting unit passes through the hollow area and is supported on the bottom of the sheet.

[0014] Furthermore, the sheet material picking robot includes a first X-axis moving unit, a first Z-axis moving unit, and a first adsorption head. The first Z-axis moving unit is movably set on the first X-axis moving unit, and the first adsorption head is movably set on the first Z-axis moving unit. The first adsorption head is used to adsorb the sheet material, and the sheet material picking and transferring actions are realized through the first X-axis moving unit and the first Z-axis moving unit.

[0015] Furthermore, the sheet picking robot also includes a first sensor, which is used to identify the non-component area of ​​the sheet, and the first suction head suctions the non-component area of ​​the sheet according to the identification information of the first sensor.

[0016] Furthermore, the component peeling and mounting module includes a movable carrier, a film tearing assembly, and a mounting assembly. The movable carrier is located on the film tearing station and is used to carry the sheet transferred by the sheet picking robot and move it to the film tearing assembly. The film tearing assembly is used to separate the sheet base film and components, and the mounting assembly is used to transfer the components to the mounting station for mounting.

[0017] Furthermore, the film tearing assembly includes a first Y-axis moving unit and a clamp installed on the first Y-axis moving unit, and the clamp is used to clamp the sheet base film.

[0018] Furthermore, the placement component is a first four-axis manipulator, which includes a second adsorption head and a second sensor. The first four-axis manipulator can drive the second adsorption head to move up and down and rotate. The first four-axis manipulator can also drive the second adsorption head to swing between the film tearing station and the placement station to realize the film stripping, transfer, and placement actions of components.

[0019] Furthermore, the second sensor is used to identify the component area of ​​the sheet, and the second adsorption head adsorbs the component area of ​​the sheet according to the identification information of the second sensor; the clamp clamps the sheet base film and moves along the Y-axis direction away from the mounting station, and at the same time, the second adsorption head adsorbs the component and swings toward the direction close to the mounting station and moves upward synchronously to complete the film tearing action.

[0020] Furthermore, in the process that the second suction head suctions the component and moves along the Y-axis toward the mounting station and simultaneously moves upward along the Z-axis, the second suction head suctions the component and simultaneously performs rotational motion.

[0021] Furthermore, the fully automatic PCB mounting machine also includes a first CCD camera, which is invertedly arranged between the film tearing station and the mounting station, and the first CCD camera is used to detect the posture of the components to be mounted.

[0022] Furthermore, the PCB board loading module includes a feeding line, a second four-axis robot and a mounting fixture platform, and the second four-axis robot is used to transfer the PCB board on the feeding line to the mounting fixture platform.

[0023] Furthermore, the PCB board feeding module also includes a second CCD camera, and the second CCD camera is used to detect the posture of the PCB board.

[0024] Furthermore, the PCB board discharging module includes a discharging assembly line and a discharging robot, and the discharging robot is used to transfer the PCB board with mounted components to the discharging assembly line.

[0025] Furthermore, the discharging robot includes a second X-axis moving unit, a second Y-axis moving unit, a second Z-axis moving unit and a third adsorption head, the second Y-axis moving unit is movably set on the second X-axis moving unit, the second Z-axis moving unit is movably set on the second Y-axis moving unit, and the third adsorption head is movably set on the second Z-axis moving unit.

[0026] Furthermore, the discharging robot also includes a third sensor, and the third sensor is used to identify the non-component area of ​​the PCB board. The third adsorption head adsorbs the non-component area of ​​the PCB board according to the identification information of the third sensor.

[0027] In addition, the present invention also provides a method for mounting components using the above-mentioned fully automatic PCB mounting machine, comprising the following steps:

[0028] S1: Performing a horizontal leveling action on the top sheet stored in the correction silo, specifically, detecting the height information of the side of the sheet through the height sensor, and transmitting the height information to the control module, and the control module controls the corresponding driving unit to drive the independent lifting unit to perform lifting movement according to the height information, so that the horizontal deviation of the top sheet is within the range of ±1°;

[0029] S2: The sheet material stored at the top of the calibration bin is picked up and transferred. Specifically, the first sensor identifies the non-component area of ​​the sheet material, and the first suction head adsorbs the non-component area of ​​the sheet material according to the identification information of the first sensor to complete the adsorption action. The first suction head moves upward following the first Z-axis moving unit to complete the picking action. After that, the first Z-axis moving unit moves along the X-axis direction on the first X-axis moving unit to transfer the sheet material to the mobile stage to complete the transfer action.

[0030] S3: Perform film-tearing action on the sheet material transferred to the movable carrier. Specifically, the movable carrier transfers the sheet material to the clamp, and the clamp clamps the bottom film of the sheet material. At the same time, the second sensor identifies the component area of ​​the sheet material, and the second adsorption head adsorbs the component area of ​​the sheet material according to the identification information of the second sensor; the clamp clamps the bottom film of the sheet material and moves along the Y-axis direction away from the mounting station. At the same time, the second adsorption head adsorbs the components and swings towards the direction close to the mounting station and moves upward synchronously to complete the film-tearing action.

[0031] S4: while performing any of the above steps S1-S3, the PCB board is loaded. Specifically, the second four-axis manipulator transfers the PCB board on the feeding assembly line to the mounting fixture platform;

[0032] S5: performing a component placement operation on the PCB board. Specifically, the second adsorption head transfers the components after film removal to the top of the placement fixture platform, and completes the placement operation on the PCB board;

[0033] S6: performing a discharge operation on the PCB board with mounted components. Specifically, the third sensor identifies the non-component area of ​​the PCB board, and the third adsorption head adsorbs the non-component area of ​​the PCB board according to the identification information of the third sensor to complete the adsorption operation. Thereafter, the third adsorption head moves along with the second X-axis moving unit, the second Y-axis moving unit and the second Z-axis moving unit to transfer the PCB board with mounted components to the discharge assembly line.

[0034] Further, in step S3, while the second suction head adsorbs the component and swings toward the mounting station and moves upward synchronously, the second suction head adsorbs the component and performs a rotational motion synchronously.

[0035] Furthermore, in step S4, it also includes a PCB board posture detection action. Specifically, the second CCD camera is used to detect the posture of the PCB board loaded onto the mounting fixture platform, and the posture of the PCB board is transmitted to the control module.

[0036] Furthermore, in step S5, before the component placement operation is performed, a component posture detection operation is also included. Specifically, the posture of the component to be placed is detected using the first CCD camera, and the posture information of the component to be placed is transmitted to the control module.

[0037] Furthermore, in step S5, after completing the posture detection of the components to be mounted, the control module matches the posture information of the PCB board and the posture information of the components to be mounted, and controls the rotation movement of the second adsorption head according to the matching results to adjust the posture of the components to be mounted so that it is consistent with the posture of the PCB board.

[0038] Implementing the embodiments of the present invention will have the following beneficial effects:

[0039] 1. The fully automatic PCB mounting machine and mounting method in the present application, due to the provision of a correction bin, detects the height information of the side of the sheet by a height sensor, and then cooperates with an independent lifting unit to achieve height adjustment of the side of the sheet. This overcomes the problem that in the traditional sheet picking process, the upper surface of the stacked sheets is tilted due to the uneven surface of the sheet, thereby affecting the reliability of the picking.

[0040] 2. The fully automatic PCB mounting machine and mounting method in this application ensure the success rate of film tearing through the cooperation of the film tearing component and the tile laying component. At the same time, it can also be applied to the scene where different types of sheet materials have different requirements for film tearing force. Specifically, the claws of the film tearing component clamp the sheet bottom film and drive the bottom film to move along the Y axis away from the mounting station. At the same time, the second adsorption head of the mounting component adsorbs the components and swings toward the direction close to the mounting station and moves upward and rotates synchronously to complete the film tearing action. In addition, the movement direction of the film tearing component and the tile laying component is specially designed in this application, so that while completing the film tearing, the transfer and placement of the bottom film waste, as well as the transfer and angle adjustment of the components before mounting are completed, further improving the mounting efficiency of the overall equipment.

[0041] 3. The fully automatic PCB mounting machine and mounting method in the present application enable the PCB board loading process and the sheet material loading process or the film tearing process to work together and be carried out simultaneously, overcoming the drawbacks of the traditional assembly line in which the PCB board loading process and the sheet material loading process or the film tearing process are carried out sequentially, and greatly improving the mounting efficiency of the overall equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 This is a schematic diagram of a fully automatic PCB mounting machine according to an embodiment of the present invention;

[0044] Figure 2 This is a schematic diagram of a calibration silo according to an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of the first four-axis manipulator according to an embodiment of the present invention;

[0046] Figure 4 This is a flow chart of the fully automatic PCB mounting method described in an embodiment of the present invention.

[0047] Among them: 1. Components; 2. Base film; 3. First X-axis moving unit; 4. First Z-axis moving unit; 5. First adsorption head; 6. Moving stage; 7. First Y-axis moving unit; 8. Gripper; 9. First four-axis manipulator; 10. Infeed line; 11. PCB board; 12. Limit sensor; 13. Mounting fixture platform; 14. Second four-axis manipulator; 15. Second Y-axis moving unit; 16. Second X-axis moving unit; 17. Outfeed line; 18. Limit vertical plate; 19. Independent lifting unit; 20. Driving unit; 21. Height sensor; 22. Fixed plate; 23. Base film waste; 24. First Z-axis; 25. Second Z-axis; 26. Third Z-axis; 27. Fourth Z-axis. DETAILED DESCRIPTION

[0048] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0051] Please refer to Figure 1-Figure 3 The embodiment of the present invention provides a fully automatic PCB mounting machine, including a workbench, a component loading module, a component stripping and mounting module, a PCB board loading module, a PCB board discharging module and a control module arranged on the upper surface of the workbench, the control module is respectively communicated with the component loading module, the component stripping and mounting module, the PCB board loading module and the PCB board discharging module, and controls the coordinated action of each functional module to realize the full automation of the entire PCB mounting process.

[0052] The component loading module includes a sheet material taking robot and at least one calibration silo; the calibration silo is used to store sheets, and the sheets include a base film 2 and components 1 attached to the base film. The calibration silo includes a plurality of limit plates 18, a plurality of independent lifting units 19, and a driving unit 20 for driving the independent lifting units 19 to move. The number of the independent lifting units 19 is the same as the number of the limit plates 18. The limit plates 18 limit the storage space of the sheets. A height sensor 21 is provided on the top of the limit plates 18. The height sensor is used to detect the height information of one side of the sheet. The top ends of the independent lifting units 19 are respectively supported on the opposite sides of the bottom of the sheet. The driving unit 20 drives the independent lifting units 19 to perform lifting movements according to the height information of the side of the sheet measured by the height sensor 21, so as to achieve height adjustment of one side of the sheet. Specifically, when there is a large deviation in the height information detected by the multiple height sensors 21, for example, the deviation is greater than ±1°, the control module controls the drive unit 20 to drive the independent lifting unit 19 to rise or fall, so that the side of the sheet corresponding to the independent lifting unit 19 rises or falls, thereby achieving the purpose of adjusting the horizontality of the sheet, until the deviation of the horizontality of the sheet is no more than ±1°.

[0053] In a possible implementation, the number of the limiting plates 18 may be three or four or more, which mainly depends on the shape characteristics of the sheet. The plurality of limiting plates 18 may be evenly spaced or unevenly spaced according to the actual shape characteristics of the special-shaped sheet. Regardless of the distribution method, the limiting plates 18 need to define the storage space of the sheet, and each adjacent two limiting plates 18 may limit one side of the sheet. Figure 2 As shown, the four limiting upright plates 18 arranged in a regular rectangular shape define a regular rectangular space, which is suitable for storing rectangular sheets of similar shape and size.

[0054] In a possible implementation, the number of the independent lifting units 19 is adapted to the number of the limiting uprights 18. For example, when the number of the limiting uprights 18 is four, the number of the independent lifting units 19 is also four. Figure 2 This is because the sheet storage space formed by the four limiting vertical plates 18 is suitable for storing sheets of a quadrilateral structure, and in order to achieve the horizontal leveling of the sheet of a quadrilateral structure, the best way is to arrange four independent lifting units 19, which can adjust the height of each side or each corner of the sheet of the quadrilateral structure respectively, thereby achieving the horizontal adjustment of the sheet.

[0055] In a possible implementation, the correction silo further includes a fixed plate 22, the limiting vertical plate 18 is fixedly connected to the upper surface of the fixed plate 22, and the fixed plate 22 and the limiting vertical plate 18 further define the storage space for the sheet material.

[0056] In a possible implementation, the fixed plate 22 is provided with a hollow area, and the hollow area is located in the area enclosed by the limiting vertical plate 18, and the top of the independent lifting unit 19 passes through the hollow area and is supported on the bottom of the sheet. The fixed plate 22 is fixedly connected to the workbench, and can be fixedly connected to the workbench by an additional bracket, which is not specifically limited here. The fixed plate 22 is parallel to the upper surface of the workbench. The advantage of such a setting is that it can ensure that the multiple height sensors 21 on the multiple limiting vertical plates 18 are in a nearly horizontal coplanar position, which is convenient for quickly detecting the height difference of the sheet.

[0057] In a possible embodiment, the sheet material taking robot comprises a first X-axis moving unit 3, a first Z-axis moving unit 4, and a first adsorption head 5. The first Z-axis moving unit 4 is movably set on the first X-axis moving unit 3, and the first adsorption head 5 is movably set on the first Z-axis moving unit 4. The first adsorption head 5 is used to adsorb the sheet material, and the sheet material taking and transferring actions are realized through the first X-axis moving unit 3 and the first Z-axis moving unit 4. Specifically, the first adsorption head 5 can be a vacuum suction cup, the first X-axis moving unit 3 and the first Z-axis moving unit 4 can be a slider slot structure or a screw transmission structure, and the first X-axis moving unit 3 and the first Z-axis moving unit 4 are both provided with a driving structure, which can be a servo motor unit, or a cylinder driving unit, etc. These are relatively common transmission structures and driving structures in the field, and will not be elaborated here.

[0058] In a possible implementation, the sheet-taking robot further includes a first sensor (not shown in the figure), the first sensor is used to identify the non-component area of ​​the sheet, and the first adsorption head 5 adsorbs the non-component area of ​​the sheet according to the identification information of the first sensor. The first sensor can be a visual sensor, a photoelectric sensor, or other sensors with the same function, which are not further limited here.

[0059] It is necessary to set up a first sensor to detect the non-component area of ​​the sheet material and then control the first adsorption head to adsorb the non-component area of ​​the sheet material. During the entire mounting process, especially when it involves the transfer of component 1, try not to touch component 1 unless necessary to avoid damage to component 1.

[0060] In a possible embodiment, the component peeling and mounting module includes a movable carrier 6, a film tearing assembly, and a mounting assembly. The movable carrier 6 is located on the film tearing station and is used to carry the sheet transferred by the sheet taking robot and move it to the film tearing assembly. The film tearing assembly is used to separate the sheet base film 2 and the component 1, and the mounting assembly is used to transfer the component 1 to the mounting station for mounting.

[0061] In a possible embodiment, the film tearing assembly includes a first Y-axis moving unit 7 and a clamp 8 installed on the first Y-axis moving unit 7, and the clamp 8 is used to clamp the sheet base film 2. Specifically, a contact sensor (not shown in the figure) is also provided on the inner side of the clamp 8. When the movable platform 6 transfers the sheet, the side of the base film 2 touches the contact sensor inside the clamp 8. The contact sensor transmits a signal to the control module, and the control module controls the clamp 8 to complete the clamping action to clamp the base film 2. It can be imagined that the end of the clamp 8 is connected to a drive motor, which can drive the opening and closing of the clamp 8. This is a common driving method in the field and will not be described here.

[0062] In a possible implementation, the placement component is a first four-axis manipulator 9, which includes a second adsorption head and a second sensor. The first four-axis manipulator 9 can drive the second adsorption head to move up and down and rotate. The first four-axis manipulator 9 can also drive the second adsorption head to swing between the film tearing station and the placement station to achieve the film stripping, transfer, and placement of the components 1. Among them, the first four-axis manipulator 9 is a conventional four-axis manipulator in the field, including a first Z-axis 24, a second Z-axis 25, a third Z-axis 26, and a fourth Z-axis 27 arranged in parallel. As long as it has the function of driving the second adsorption head to swing between the film tearing station and the placement station, the specific structure is not further limited here.

[0063] In a possible implementation, the end of the first Z axis 24 is rotatably connected to the second adsorption head, and the second adsorption head can move up and down following the first Z axis 24, and can rotate around the first Z axis 24. In addition, the second adsorption head can also swing around the second Z axis 25, the third Z axis 26 or the fourth Z axis 27 to achieve the transfer of the components from the film tearing station to the mounting station.

[0064] In a possible implementation, the second sensor is used to identify the component 1 region of the sheet. The second sensor may be a visual sensor, a photoelectric sensor, or other sensors with the same function, which is not further limited herein.

[0065] The second adsorption head adsorbs the component 1 area of ​​the sheet according to the identification information of the second sensor; the clamping jaws 8 clamp the sheet base film 2 and move it in the direction away from the mounting station along the Y axis, and at the same time, the second adsorption head adsorbs the component 1 and swings it in the direction close to the mounting station and synchronously moves upward along the first Z axis to complete the film tearing action. In other words, the base film 2 is clamped by the clamping jaws 8, and the second adsorption head adsorbs the component 1, and the two move in opposite directions, which is conducive to the separation of the base film 2 and the component 1, and greatly improves the success rate of film tearing.

[0066] More preferably, the clamping jaw 8 clamps the base film 2 by moving in a direction away from the mounting station, while the second adsorption head adsorbs the components by swinging in a direction close to the mounting station. This is beneficial after the film tearing process is completed. The clamping jaw 8 can directly place the base film waste 23 in the waste position, and the second adsorption head can adsorb the components and transfer them directly to the mounting station, further improving the equipment mounting efficiency.

[0067] In a possible implementation, while the second adsorption head adsorbs the component 1 and swings toward the direction close to the mounting station and synchronously follows the upward movement of the first Z-axis, the second adsorption head adsorbs the component 1 and synchronously rotates around the first Z-axis. In the process of the reverse movement of the clamp 8 and the second adsorption head to achieve film tearing, adding a rotation action of the second adsorption head is more conducive to the rapid film removal of the component 1. More preferably, in most usage scenarios, before mounting, it is necessary to rotate and adjust the direction of the component 1 to match the mounting angle. Therefore, the action of rotating the component 1 to achieve angle adjustment is completed during the film tearing process, which can further improve the equipment mounting efficiency.

[0068] In a possible implementation, the fully automatic PCB mounting machine further includes a first CCD camera, which is invertedly mounted between the film tearing station and the mounting station, and is used to detect the position of the component 1 to be mounted (mainly the offset angle of the component 1 relative to the X-axis or Y-axis). Before the mounting process is implemented, the PCB board 11 and the component 1 may have angle differences due to processes such as loading and film tearing, that is, the mounting angle is not compatible. Therefore, it is necessary to adjust the mounting angle of the PCB board 11 or the component 1 before mounting to improve the mounting accuracy of the component 1. This technical solution mainly matches the PCB board by adjusting the angle of the component. Of course, it can also match the component by adjusting the angle of the PCB board. The role they play is the same and will not be repeated here.

[0069] In a possible implementation, the PCB board feeding module includes a feeding line 10, a second four-axis manipulator 14 and a mounting fixture platform 13, and the second four-axis manipulator 14 is used to transfer the PCB board 11 on the feeding line to the mounting fixture platform 13. The structure and function of the second four-axis manipulator 14 are similar to those of the first four-axis manipulator 9, and are not described in detail here.

[0070] In a possible implementation, a limit sensor 12 is provided at the front end of the mounting jig platform 13. Specifically, the limit sensor 12 is provided at about 30 mm from the front end of the mounting jig platform 13. The limit sensor 12 can prevent the PCB board 11 from overshooting below the mounting jig platform 13.

[0071] In a possible implementation, the PCB board loading module further includes a second CCD camera, which is used to detect whether there is a PCB board on the mounting fixture platform 13, and also detects the posture of the PCB board 11 (mainly referring to the offset angle of the PCB board relative to the X-axis). In addition, the second CCD camera is provided with a template recognition area. If the mark point of the PCB board exceeds the area frame, the second CCD camera will recognize it and trigger an alarm to remind the user to adjust the position of the PCB board to meet the mounting requirements.

[0072] In a possible implementation, the PCB board discharging module includes a discharging line 17 and a discharging robot, and the discharging robot is used to transfer the PCB board 11 with mounted components 1 to the discharging line 17 .

[0073] In a possible embodiment, the discharging robot includes a second X-axis moving unit 16, a second Y-axis moving unit 15, a second Z-axis moving unit (not shown in the figure) and a third adsorption head (not shown in the figure), the second Y-axis moving unit 15 is movably set on the second X-axis moving unit 16, the second Z-axis moving unit is movably set on the second Y-axis moving unit 15, and the third adsorption head is movably set on the second Z-axis moving unit.

[0074] In a possible implementation, the discharging robot further includes a third sensor (not shown in the figure), and the third sensor is used to identify the non-component area of ​​the PCB board 11. The third sensor can be a visual sensor, a photoelectric sensor, or other sensors with the same function, which are not further limited here. The third adsorption head adsorbs the non-component area of ​​the PCB board 11 according to the identification information of the third sensor.

[0075] Also, please refer to Figure 4The present invention also provides a method for mounting components using the above-mentioned fully automatic PCB mounting machine, comprising the following steps:

[0076] S1: Performing a horizontal leveling action on the top sheet stored in the correction silo, specifically, detecting the height information of the side of the sheet through the height sensor, and transmitting the height information to the control module, and the control module controls the corresponding driving unit 20 to drive the independent lifting unit 19 to perform lifting movement according to the height information, so that the horizontal deviation of the top sheet is within the range of ±1°;

[0077] S2: The sheet material stored at the top of the calibration bin is picked up and transferred. Specifically, the first sensor identifies the non-component area of ​​the sheet material, and the first adsorption head 5 adsorbs the non-component area of ​​the sheet material according to the identification information of the first sensor to complete the adsorption action. The first adsorption head 5 moves upward following the first Z-axis moving unit 4 to complete the picking action. After that, the first Z-axis moving unit 4 moves along the X-axis on the first X-axis moving unit 3 to transfer the sheet material to the movable carrier 6 to complete the transfer action.

[0078] S3: Perform film-tearing action on the sheet material transferred to the movable carrier 6. Specifically, the movable carrier 6 transfers the sheet material to the clamp 8, and the clamp 8 clamps the sheet material bottom film. At the same time, the second sensor identifies the component area of ​​the sheet material, and the second adsorption head adsorbs the component area of ​​the sheet material according to the identification information of the second sensor; the clamp 8 clamps the sheet material bottom film 2 and moves along the Y-axis direction away from the mounting station. At the same time, the second adsorption head adsorbs the component 1 and swings towards the mounting station, and moves upward synchronously to complete the film-tearing action.

[0079] S4: while performing any of the above steps S1-S3, the PCB board 11 is loaded. Specifically, the second four-axis manipulator 14 transfers the PCB board 11 on the feeding assembly line 10 to the mounting fixture platform 13;

[0080] S5: performing a component 1 placement operation on the PCB board 11. Specifically, the second adsorption head transfers the component 1 after the film is removed to the top of the placement fixture platform 13, and completes the placement operation on the PCB board 11;

[0081] S6: The PCB board 11 with the mounted components 1 is unloaded. Specifically, the third sensor identifies the non-component area of ​​the PCB board 11, and the third suction head suctions the non-component area of ​​the PCB board 11 according to the identification information of the third sensor to complete the suction action. After that, the third suction head moves with the second X-axis moving unit 16, the second Y-axis moving unit 15 and the second Z-axis moving unit to transfer the PCB board 11 with the mounted components 1 to the unloading assembly line 17.

[0082] In a possible implementation, in step S3, while the second suction head adsorbs the component 11 and swings toward the mounting station and moves upward synchronously, the second suction head adsorbs the component 1 and performs a rotational motion synchronously.

[0083] In a possible implementation, step S4 also includes a posture detection action for the PCB board 11. Specifically, the second CCD camera is used to detect the posture of the PCB board 11 loaded onto the mounting fixture platform 13, and the posture of the PCB board 11 is transmitted to the control module.

[0084] In a possible implementation, in step S5, before performing the component 1 placement action, it also includes a component 1 posture detection action. Specifically, the first CCD camera is used to detect the posture of the component 1 to be placed, and the posture information of the component 1 to be placed is transmitted to the control module.

[0085] In a possible implementation, in step S5, after completing the posture detection of the component 1 to be mounted, the control module matches the posture information of the PCB board 11 and the posture information of the component 1 to be mounted, and controls the rotation action of the second adsorption head according to the matching result to adjust the posture of the component 1 to be mounted so that it is consistent with the posture of the PCB board 11.

[0086] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A fully automatic PCB placement machine, including a workbench, characterized in that: It also includes a component loading module, a component stripping and patch module, a PCB board loading module, a PCB board discharging module, and a control module arranged on the upper surface of the workbench, wherein the control module is respectively connected to the component loading module, the component stripping and patch module, the PCB board loading module, and the PCB board discharging module in communication; The component loading module includes a sheet material taking robot and at least one calibration bin; the calibration bin is used to store sheets, the sheets include a base film and components attached to the base film, the calibration bin includes a plurality of limit plates, a plurality of independent lifting units, and a driving unit for driving the independent lifting units to move, the number of the independent lifting units is the same as the number of the limit plates, and the limit plates define the storage space for the sheets; A height sensor is provided on the top of each of the limiting uprights, and the height sensor is used to detect the height information of one side of the sheet. The top ends of the independent lifting units are respectively supported on the opposite sides of the bottom of the sheet. The driving unit can drive the independent lifting units to perform lifting and lowering movements according to the height information of the side of the sheet measured by the height sensor, so as to achieve height adjustment of the side of the sheet. The sheet material taking robot comprises a first X-axis moving unit, a first Z-axis moving unit, and a first adsorption head, wherein the first Z-axis moving unit is movably arranged on the first X-axis moving unit, the first adsorption head is movably arranged on the first Z-axis moving unit, the first adsorption head is used to adsorb the sheet material, and the sheet material taking and transferring actions are realized through the first X-axis moving unit and the first Z-axis moving unit; The sheet-taking robot further comprises a first sensor, wherein the first sensor is used to identify a non-component area of ​​the sheet, and the first adsorption head adsorbs the non-component area of ​​the sheet according to the identification information of the first sensor; The component stripping and patch module includes a movable carrier, a film tearing assembly, and a mounting assembly. The movable carrier is located on the film tearing station and is used to carry the sheet transferred by the sheet taking robot and move it to the film tearing assembly. The film tearing assembly is used to separate the sheet base film and components. The mounting assembly is used to transfer the components to the mounting station for mounting. The film tearing assembly includes a first Y-axis moving unit and a clamp installed on the first Y-axis moving unit, wherein the clamp is used to clamp the sheet base film; The placement component is a first four-axis manipulator, which includes a second adsorption head and a second sensor. The first four-axis manipulator can drive the second adsorption head to move up and down, and swing between the film tearing station and the placement station to realize the film stripping, transfer, and placement of the components; The second sensor is used to identify the component area of ​​the sheet, and the second adsorption head adsorbs the component area of ​​the sheet according to the identification information of the second sensor; the clamping claw clamps the sheet bottom film and moves in the direction away from the mounting station along the Y axis, and at the same time, the second adsorption head adsorbs the component and swings in the direction close to the mounting station along the Y axis and moves upward synchronously to complete the film tearing action; During the process in which the second suction head adsorbs the component and swings along the Y-axis in a direction close to the mounting station and moves upward synchronously, the second suction head adsorbs the component and performs a rotating motion synchronously; The fully automatic PCB placement machine further comprises a first CCD camera, which is invertedly mounted between the film tearing station and the placement station, and is used to detect the posture of the components to be placed; The PCB board feeding module includes a feeding line, a second four-axis manipulator, a mounting fixture platform and a second CCD camera, wherein the second four-axis manipulator is used to transfer the PCB board on the feeding line to the mounting fixture platform; the second CCD camera is used to detect the posture of the PCB board; The PCB board discharging module includes a discharging assembly line and a discharging robot, and the discharging robot is used to transfer the PCB board with mounted components to the discharging assembly line; The discharging robot includes a second X-axis moving unit, a second Y-axis moving unit, a second Z-axis moving unit, a third adsorption head and a third sensor. The second Y-axis moving unit is movably set on the second X-axis moving unit, the second Z-axis moving unit is movably set on the second Y-axis moving unit, and the third adsorption head is movably set on the second Z-axis moving unit. The third sensor is used to identify the non-component area of ​​the PCB board, and the third adsorption head adsorbs the non-component area of ​​the PCB board according to the identification information of the third sensor.

2. The fully automatic PCB mounting machine according to claim 1, characterized in that: The correction bin further includes a fixed plate, the limiting vertical plate is fixedly connected to the upper surface of the fixed plate, and the fixed plate and the limiting vertical plate further define the storage space of the sheet material; The fixing plate is provided with a hollow area, and the top end of the independent lifting unit passes through the hollow area and is supported on the bottom of the sheet.

3. A method for PCB mounting using the fully automatic PCB mounting machine according to claim 1, characterized in that: The following steps are involved: S1: Performing a horizontal leveling action on the top sheet stored in the correction silo: Detecting the height information of the side of the sheet through the height sensor, and transmitting the height information to the control module, the control module controls the corresponding driving unit to drive the independent lifting unit to perform lifting movement according to the height information, so that the horizontal deviation of the top sheet is within the range of ±1°; S2: The sheet material stored at the top of the calibration bin is picked up and transferred: the first sensor identifies the non-component area of ​​the sheet material, the first suction head adsorbs the non-component area of ​​the sheet material according to the identification information of the first sensor, and completes the adsorption action, the first suction head moves upward following the first Z-axis moving unit, and completes the picking action, after which the first Z-axis moving unit moves along the X-axis direction on the first X-axis moving unit, and transfers the sheet material to the mobile stage, and completes the transfer action; S3: Performing film-tearing action on the sheet material transferred to the moving stage: the moving stage transfers the sheet material to the clamping claw, the clamping claw clamps the bottom film of the sheet material, and at the same time, the second sensor identifies the component area of ​​the sheet material, and the second adsorption head adsorbs the component area of ​​the sheet material according to the identification information of the second sensor; the clamping claw clamps the bottom film of the sheet material and moves in the direction away from the mounting station along the Y axis, and at the same time, the second adsorption head adsorbs the component and swings in the direction close to the mounting station and moves upward synchronously, completing the film-tearing action; S4: while performing any of the above steps S1-S3, the PCB board is loaded: the second four-axis manipulator transfers the PCB board on the feeding assembly line to the mounting fixture platform; S5: performing component placement on the PCB board: the second adsorption head transfers the components after film removal to the top of the placement fixture platform, and completes the placement action on the PCB board; S6: performing a discharge operation on the PCB board with mounted components: the third sensor identifies the non-component area of ​​the PCB board, and the third adsorption head adsorbs the non-component area of ​​the PCB board according to the identification information of the third sensor to complete the adsorption operation, after which the third adsorption head moves with the second X-axis moving unit, the second Y-axis moving unit and the second Z-axis moving unit to transfer the PCB board with mounted components to the discharge assembly line.

4. The PCB mounting method according to claim 3, characterized in that: In step S3, while the second suction head suctions the component and moves along the Y-axis toward the mounting station and moves upward synchronously, the second suction head suctions the component and performs a synchronous rotational motion.

5. The PCB mounting method according to claim 3, characterized in that: In step S4, it also includes a PCB board posture detection action: using the second CCD camera to detect the posture of the PCB board loaded onto the mounting fixture platform, and transmitting the posture of the PCB board to the control module.

6. The PCB mounting method according to claim 3, characterized in that: In step S5, before the component placement operation is performed, a component posture detection operation is also included: using the first CCD camera to detect the posture of the component to be placed, and transmitting the posture information of the component to be placed to the control module.

7. The PCB mounting method according to claim 6, characterized in that: In step S5, after completing the posture detection of the components to be mounted, the control module matches the posture information of the PCB board and the posture information of the components to be mounted, and controls the rotation movement of the second adsorption head according to the matching results to adjust the posture of the components to be mounted so that it is consistent with the posture of the PCB board.

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