A probe card detection method and system for confirming needle puncture marks

Abstract

The present invention discloses a probe card detection method and system for confirming needle puncture marks, and relates to the field of probe card detection technology. The method comprises the following steps: S1, installing the probe card on the probe table, and calibrating the probe position and the position of the pad to be tested; S2, based on the pre-set initial needle puncture parameters, controlling the probe card to automatically perform the needle puncture operation, so that the probe gradually contacts the solder joint on the surface of the pad to be tested; S3, when the probe is completely in contact with the solder joint, measuring the electrical parameters of the probe; S4, after the measurement is completed, controlling the probe card to leave the needle puncture area, and using the holographic scanning component to scan the surface of the pad to be tested; S5, based on the virtual pad model, identifying and analyzing the needle puncture marks. The present invention combines technologies such as automated probe operation, electrical parameter measurement, holographic scanning and image processing to achieve comprehensive detection and evaluation of needle puncture marks, ensure the accuracy and reliability of the test process, and improve production efficiency and product quality.

Description

Technical Field

[0001] The present invention relates to the field of probe card detection technology, and in particular to a probe card detection method and system for confirming needle puncture marks. Background Art

[0002] The probe card is a key tool for semiconductor wafer testing. Its main function is to contact the pads (PAD) on the wafer during the test process for signal transmission and testing. The probe card usually consists of a set of tiny metal probes that are fixed on a base with a precise geometric arrangement, enabling them to make reliable contact with the surface of the wafer. In the semiconductor industry, probe cards are widely used in the wafer testing stage. When the wafer is loaded onto the test equipment, the probe card contacts the pads on the surface of the wafer to perform various test operations, including electrical connection, signal transmission, and performance testing. The design and manufacture of the probe card needs to take into account the accuracy, stability, and repeatability of the test to ensure the accuracy and reliability of the test results.

[0003] The significance and importance of probe card testing for semiconductor wafer testing are self-evident. As a key link in the semiconductor production process, the effectiveness of the probe card directly affects product quality and production efficiency. By detecting the contact between the probe card and the pad during wafer testing, the transmission accuracy of the test signal and the reliability of the test results can be ensured, thereby improving the quality and stability of the product.

[0004] If the needle marks on the probe card cannot be accurately confirmed, a series of practical problems will occur. First, the failure to promptly detect poor or abnormal contact between the probe and the pad may lead to inaccurate test data, which in turn affects the performance and reliability evaluation of the product. Second, undetected probe problems may affect the quality of the entire production batch, leading to increased costs and product delivery delays, and may even lead to customer complaints and quality disputes, which will have a serious impact on the company's image and market reputation.

[0005] However, some current traditional probe trace detection methods have certain defects. For example, methods that rely on manual visual confirmation are not only time-consuming and laborious, but also prone to subjective misjudgment and missed detection, making it difficult to ensure the accuracy and consistency of detection. In addition, although methods based on electrical parameter measurement can provide some information, they often cannot intuitively reflect the actual contact between the probe and the pad, and are affected by environmental noise and interference, so their accuracy is limited.

[0006] Therefore, in order to solve the above problems, it is necessary to develop and adopt more efficient and accurate probe trace detection methods to ensure the accuracy and reliability of the semiconductor testing process and improve product quality and production efficiency. Summary of the invention

[0007] Based on this, it is necessary to provide a probe card detection method and system for confirming needle puncture marks in response to the above technical problems.

[0008] In a first aspect, the present invention provides a probe card detection method for confirming needle puncture marks, the method comprising the following steps:

[0009] S1. Install the probe card on the probe table and calibrate the probe position and the position of the pad to be tested;

[0010] S2, based on the preset initial needle-piercing parameters, controlling the probe card to automatically perform the needle-piercing operation, so that the probe gradually contacts the solder joint on the surface of the pad to be tested;

[0011] S3. When the probe is in full contact with the solder joint, the electrical parameters of the probe are measured, and based on the changing relationship of the electrical parameters, the insertion depth of each probe is calculated;

[0012] S4, when the measurement is completed, the probe card is controlled to leave the needle insertion area, and the surface of the pad to be measured is scanned by a holographic scanning component to establish a virtual pad model that can display the needle insertion traces;

[0013] S5. Based on the virtual pad model, the needle puncture mark is identified and analyzed, and the detection result of the needle puncture mark and the usage report of the probe corresponding to the needle puncture mark are output.

[0014] Furthermore, measuring the electrical parameters of the probes and calculating the insertion depth of each probe based on the change relationship of the electrical parameters includes the following steps:

[0015] S31, using an electric energy meter to measure the electrical parameters between each probe and the corresponding solder joint in the probe card, wherein the electrical parameters include resistance and capacitance;

[0016] S32, obtaining historical test data of the probe card performing needle piercing detection on the pad to be tested, and establishing a correlation fitting model between electrical parameters and needle piercing depth based on the historical test data, wherein the historical test data includes historical needle piercing parameters, historical electrical parameters, and historical needle piercing depth;

[0017] S33, substituting the currently measured electrical parameters into the associated fitting model to calculate the acupuncture depth of each probe under the initial acupuncture parameters;

[0018] S34, recording the probe number and measurement time of each probe, and associating the electrical parameters and needle insertion depth of each probe.

[0019] Furthermore, based on historical test data, establishing a correlation fitting model between electrical parameters and acupuncture depth includes the following steps:

[0020] S321, establishing a resistance function model between resistance value and acupuncture depth, and performing parameter fitting on a resistance index in the resistance function model based on historical resistance values ​​and corresponding historical acupuncture depths in historical test data, obtaining a resistance index value and substituting it into the resistance function model;

[0021] S322, establishing a capacitance function model between capacitance value and acupuncture depth, and performing parameter fitting on a capacitance index in the capacitance function model based on historical capacitance values ​​and corresponding historical acupuncture depths in historical test data, obtaining a capacitance index value and substituting it into the capacitance function model;

[0022] S323, inputting the resistance value in the currently measured electrical parameter into the resistance function model to calculate the first acupuncture depth, and substituting the capacitance value in the currently measured electrical parameter into the capacitance function model to calculate the second acupuncture depth;

[0023] S324, respectively setting weight factors for the first acupuncture depth and the second acupuncture depth, using the weighted sum equation as a correlation fitting model, and calculating the actual acupuncture depth of the probe.

[0024] Furthermore, the expression of the resistance function model is:

[0025] ;

[0026] In the formula, L D Indicates the first acupuncture depth calculated using the resistance value; R e It indicates the resistance value measured after the probe fully contacts the contact; R 0 Indicates the initial resistance value when the probe is not touching the contact; d The resistance index indicating the relationship between the resistance value and the depth of the needle; L 0 Indicates the length of the probe tip that can penetrate the solder joint;

[0027] The expression of the capacitance function model is:

[0028] ;

[0029] In the formula, L Q Indicates the second acupuncture depth calculated using the capacitance value; C e It indicates the capacitance value measured after the probe fully contacts the contact; C 0 It represents the initial capacitance value when the probe is not touching the contact; q The capacitance index indicating the relationship between capacitance value and acupuncture depth; L0 Indicates the length of the probe tip that can penetrate the solder joint.

[0030] Furthermore, the surface of the pad to be tested is scanned by using a holographic scanning component to establish a virtual pad model that can display needle marks, including the following steps:

[0031] S41, placing the holographic scanning component just above the pad to be tested, scanning the surface of the pad to be tested in parallel, and obtaining a holographic image containing all the needle-piercing points by image stitching;

[0032] S42, based on holographic image processing technology, extracting the three-dimensional information of the puncture points on all the solder joints, and obtaining the hole position coordinates of each puncture point;

[0033] S43, based on the three-dimensional structural information of the pad to be tested, a three-dimensional pad model is established, and the hole position coordinates and the needle piercing depth are combined as the needle piercing trace, and then imported into the three-dimensional pad model, and superimposed and combined to form a virtual pad model;

[0034] S44, importing the virtual pad model into a computer interface for visual display, and utilizing interactive operations to perform all-round observation of the virtual pad model.

[0035] Furthermore, placing the holographic scanning component directly above the pad to be tested, scanning the surface of the pad to be tested in parallel, and obtaining a holographic image containing all the needle points by image stitching includes the following steps:

[0036] S411, setting the S-shaped scanning path and step spacing of the holographic scanning component, preferentially scanning one by one along the positive direction of the x-axis, collecting a sub-region image each time by translation, then translating a single step spacing along the positive direction of the y-axis, and then scanning one by one along the negative direction of the x-axis until all step translation scans are completed;

[0037] S412, parallel mode stitching is adopted, with the center of each sub-region image as the reference, the reference surfaces of adjacent overlapping areas of the sub-region images are unified by translation and rotation, and the full-path wavefront is restored on the designated reference surface to obtain a holographic image containing all acupuncture points.

[0038] Furthermore, based on holographic image processing technology, extracting the three-dimensional information of the puncture points on all solder joints and obtaining the hole coordinates of each puncture point includes the following steps:

[0039] S421, performing denoising, smoothing and contrast enhancement processing on the holographic image;

[0040] S422, using image segmentation technology to extract acupuncture point features in the holographic image, and based on the acupuncture point features, screening and marking all acupuncture point areas;

[0041] S423, extracting the three-dimensional information of the acupuncture point area, calculating the spatial coordinates of the acupuncture point area based on the geometric shape of the acupuncture point area and the principle of holographic imaging, and converting the spatial coordinates into a two-dimensional coordinate system, and selecting the center point of the area as the hole coordinates of the acupuncture point.

[0042] Furthermore, based on the virtual pad model, the needle puncture marks are identified and analyzed, and the detection results of the needle puncture marks and the usage report of the probe corresponding to the needle puncture marks are output, including the following steps:

[0043] S51, based on the preset needle mark standard, comparing the needle marks in sequence according to the probe numbers to determine whether there is a depth and position deviation in the needle marks; if there is a depth or position deviation, recording the probe number and the depth or position deviation value of the needle mark;

[0044] S52, after all the needle puncture marks are compared, based on all the recorded deviation values, analyzing the deviation cause of each needle puncture mark and the structural influence of the corresponding probe;

[0045] S53. Based on the deviation value and the deviation reason of the needle mark, the detection result of the needle mark is combined, and the structural influence of all probes is combined as the probe usage report.

[0046] Further, based on all the recorded deviation values, analyzing the deviation cause of each needle puncture mark and the structural influence of the corresponding probe includes the following steps:

[0047] S521, analyzing the deviation reasons of each needle puncture mark one by one, if the needle puncture mark only has depth deviation but no position deviation, the needle puncture mark is determined to be a probe puncture defect, if the needle puncture mark has position deviation, the needle puncture mark is determined to be a probe deviation defect, and based on the position deviation value, the deviation direction and deviation degree of the needle puncture mark are extracted;

[0048] S522, analyzing the structural problems of each probe one by one. If the corresponding needle piercing mark is a probe piercing defect, it is determined that the probe is affected by its own force. If the corresponding needle piercing mark is a probe offset defect, it is determined that the probe is affected by its own position.

[0049] In a second aspect, the present invention further provides a probe card detection system for confirming needle puncture marks, the system comprising:

[0050] The probe installation and verification module is used to install the probe card on the probe table and calibrate the probe position and the position of the pad to be tested;

[0051] A parameter setting control module is used to control the probe card to automatically perform a needle-piercing operation based on a preset initial needle-piercing parameter, so that the probe gradually contacts the solder joint on the surface of the pad to be tested;

[0052] The needle insertion depth calculation module is used to measure the electrical parameters of the probes after the probes are in full contact with the solder joints, and calculate the needle insertion depth of each probe based on the changing relationship of the electrical parameters;

[0053] The needle insertion position recognition module is used to control the probe card to leave the needle insertion area after the measurement is completed, and use the camera component to take the surface image of the pad to be tested to establish a virtual pad model that can display the needle insertion traces;

[0054] The needle puncture mark detection module is used to identify and analyze the needle puncture marks based on the virtual pad model, and output the detection result of the needle puncture marks and the usage report of the probe corresponding to the needle puncture marks;

[0055] Among them, the probe installation verification module, the parameter setting control module, the needle depth calculation module, the needle position recognition module and the needle mark detection module are connected in sequence.

[0056] The beneficial effects of the present invention are:

[0057] 1. The present invention combines technologies such as automated probe operation, electrical parameter measurement, holographic scanning and image processing to achieve comprehensive detection and evaluation of puncture marks. First, the probe card automatically punctures the pad, measures the puncture depth of each probe, and uses a holographic scanning component to obtain the pad surface image to establish a virtual pad model. On this basis, the puncture marks are identified and analyzed through image processing technology, and the detection results and probe usage reports are output, ensuring the accuracy and reliability of the test process and improving production efficiency and product quality.

[0058] 2. The present invention utilizes a combination of electrical parameter measurement and historical test data analysis to achieve accurate calculation and recording of the probe insertion depth, establishes a correlation model between electrical parameters and insertion depth based on historical test data, and achieves instant calculation of the insertion depth of each probe. It can accurately reflect the depth of the probe in the process of inserting into the pad, providing an important basis for the accuracy of subsequent test results, and by recording the probe number, measurement time, and related electrical parameters and insertion depth, it achieves comprehensive tracking and management of the insertion process, ensuring the controllability and stability of the test process.

[0059] 3. The present invention utilizes holographic scanning technology and image processing technology to achieve high-precision three-dimensional modeling and visual display of the needle marks on the surface of the pad to be tested, and establishes a complete virtual pad model that can accurately display the position and depth of each needle point, so as to more intuitively understand the needle situation on the pad surface, providing convenience and accuracy for further testing and analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0061] Figure 1 is a flow chart of a probe card detection method for confirming needle sticking marks according to an embodiment of the present invention;

[0062] Figure 2 The system principle block diagram of a probe card detection system for confirming needle puncture marks according to an embodiment of the present invention.

[0063] Figure numbers: 1. Probe installation verification module; 2. Parameter setting control module; 3. Needle puncture depth calculation module; 4. Needle puncture position recognition module; 5. Needle puncture mark detection module. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0065] See also Figure 1 , a probe card detection method for confirming needle puncture marks is provided, the method comprising the following steps:

[0066] S1. Install the probe card on the probe station and calibrate the probe position and the position of the pad to be tested.

[0067] Specifically, the probe card is properly fixed on a dedicated probe station to ensure its stability and accuracy, including the appropriate docking and connection of the probe card to the probe station, which is achieved by screws or clamping devices. At the same time, calibrating the probe position and the position of the pad to be tested refers to adjusting the probe on the probe card so that its position accurately corresponds to the solder joint position of the pad to be tested, including fine-tuning and calibration of the probe position to ensure that each probe can accurately contact the solder joint on the pad to ensure the accuracy and reliability of subsequent tests. Through these two steps, the correct positioning and alignment of the probe card and the pad can be guaranteed, providing a reliable foundation for subsequent test operations.

[0068] S2. Based on the preset initial needle-piercing parameters, the probe card is controlled to automatically perform the needle-piercing operation so that the probe gradually contacts the solder joint on the surface of the pad to be tested.

[0069] Specifically, the pre-set initial piercing parameters include information such as the initial position of the probe, the piercing speed and the piercing depth. The settings of these parameters are adjusted according to the specific test requirements and pad characteristics. For example, the initial position refers to the initial position coordinates of the probe, which is used to determine the starting position of the probe to penetrate the pad; the piercing speed refers to the speed at which the probe on the probe card descends, which usually needs to be adjusted according to the material and structure of the pad to ensure the stability and safety of the probe when it contacts the pad; the piercing depth refers to the depth of the probe when it penetrates the pad, which needs to be determined according to the test requirements and the characteristics of the pad to ensure that the probe can fully contact the solder joint on the surface of the pad.

[0070] According to the preset needle-piercing parameters, the probes on the probe card are automatically controlled to perform needle-piercing operations, including controlling the motor or actuator on the probe card to gradually lower the probes on the probe card so that they gradually contact the solder joints on the surface of the pad to be tested. In this process, the probe card will gradually adjust the position and depth of the probes according to the preset parameters until the probes are in full contact with the solder joints on the surface of the pad, ensuring that the probes can accurately contact the solder joints during the test, thereby ensuring the accuracy and reliability of subsequent tests.

[0071] S3. When the probe is in full contact with the solder joint, the electrical parameters of the probe are measured, and based on the changing relationship of the electrical parameters, the insertion depth of each probe is calculated.

[0072] In the description of the present invention, measuring the electrical parameters of the probes and calculating the puncture depth of each probe based on the variation relationship of the electrical parameters includes the following steps:

[0073] S31. Use an electric energy meter to measure the electrical parameters between each probe and the corresponding solder joint in the probe card, wherein the electrical parameters include resistance and capacitance.

[0074] Specifically, the electric energy meter measures the resistance and capacitance between the contact probe and the solder joint. The resistance value reflects the resistance property between the probe and the solder joint, while the capacitance value reflects the capacitance property between the two.

[0075] Generally, the resistance value decreases as the contact area between the probe and the pad increases, because the increase in contact area leads to a shorter current path and lower resistance. Therefore, the change in the distance between the probe and the pad can be estimated based on the change in resistance value, thereby calculating the needle insertion depth.

[0076] When the distance between the probe and the pad decreases, the contact area increases, and the capacitance value usually increases. Conversely, when the distance between the two increases, the contact area decreases, and the capacitance value usually decreases. This is because the capacitance calculation formula includes factors such as the dielectric constant of the dielectric between the two conductors, the distance between the conductors, and the surface area of ​​the conductors. When the distance between the probe and the pad changes, these factors change, causing the capacitance value to change.

[0077] S32, obtaining historical test data of the probe card performing needle piercing detection on the pad to be tested, and establishing a correlation fitting model between electrical parameters and needle piercing depth based on the historical test data, wherein the historical test data includes historical needle piercing parameters, historical electrical parameters, and historical needle piercing depth.

[0078] In the description of the present invention, based on historical test data, establishing a correlation fitting model between electrical parameters and acupuncture depth includes the following steps:

[0079] S321, establishing a resistance function model between resistance value and acupuncture depth, and performing parameter fitting on the resistance index in the resistance function model based on the historical resistance value and the corresponding historical acupuncture depth in the historical test data, obtaining the resistance index value and substituting it into the resistance function model.

[0080] In the description of the present invention, the expression of the resistance function model is:

[0081] ;

[0082] In the formula, L D Indicates the first acupuncture depth calculated using the resistance value. R e It indicates the resistance value measured after the probe fully contacts the contact. R 0 Indicates the initial resistance value when the probe does not touch the contact. d The resistance index that represents the relationship between the resistance value and the depth of the needle. L 0 Indicates the length of the probe tip that can penetrate the solder joint.

[0083] In addition, the process of parameter fitting of the resistance index in the resistance function model adopts a mathematical fitting method, such as the least squares method. This method fits the resistance value and the corresponding needle insertion depth in the historical test data to find the optimal resistance index value so that the model can best fit the historical data. The goal of the least squares method is to minimize the residual sum of squares between the actual data and the model prediction value. By iteratively optimizing the value of the parameter, the residual sum of squares is minimized.

[0084] S322, establishing a capacitance function model between capacitance value and acupuncture depth, and performing parameter fitting on the capacitance index in the capacitance function model based on the historical capacitance values ​​and the corresponding historical acupuncture depths in the historical test data, obtaining the capacitance index value and substituting it into the capacitance function model.

[0085] The expression of the capacitance function model is:

[0086] ;

[0087] In the formula, L Q Indicates the second acupuncture depth calculated using the capacitance value, C e It indicates the capacitance value measured after the probe fully contacts the contact. C 0 represents the initial capacitance value when the probe does not touch the contact, q The capacitance index that represents the relationship between capacitance value and acupuncture depth. L 0 Indicates the length of the probe tip that can penetrate the solder joint.

[0088] S323, inputting the resistance value of the currently measured electrical parameter into the resistance function model to calculate the first acupuncture depth, and substituting the capacitance value of the currently measured electrical parameter into the capacitance function model to calculate the second acupuncture depth.

[0089] S324, respectively setting weight factors for the first acupuncture depth and the second acupuncture depth, using the weighted sum equation as a correlation fitting model, and calculating the actual acupuncture depth of the probe.

[0090] In addition, the weight factors of the two can be determined based on historical test data analysis. If a probe has performed more stably or accurately in past tests, it can be given a higher weight, and then combined with the engineer's experience and expertise, a reasonable trade-off and decision can be made, and the sum of the weights of the two is therefore 1.

[0091] S33, substituting the currently measured electrical parameters into the associated fitting model to calculate the acupuncture depth of each probe under the initial acupuncture parameters.

[0092] S34, recording the probe number and measurement time of each probe, and associating the electrical parameters and needle insertion depth of each probe.

[0093] S4. After the measurement is completed, the probe card is controlled to leave the needle insertion area, and the surface of the pad to be measured is scanned by a holographic scanning component to establish a virtual pad model that can display the needle insertion marks.

[0094] In the description of the present invention, the surface of the pad to be tested is scanned by a holographic scanning component, and a virtual pad model capable of displaying needle marks is established, which includes the following steps:

[0095] S41, placing the holographic scanning component just above the pad to be tested, scanning the surface of the pad to be tested in parallel, and obtaining a holographic image including all the needle-piercing points by image stitching.

[0096] In the description of the present invention, a holographic scanning component is placed directly above the pad to be tested, and the surface of the pad to be tested is scanned in parallel. The holographic image containing all the needle points is obtained by image stitching, which includes the following steps:

[0097] S411. Set the S-shaped scanning path and step spacing of the holographic scanning component, and preferentially scan one by one along the positive direction of the x-axis, collect a sub-area image each time the translation is performed, and then translate a single step spacing along the positive direction of the y-axis, and then scan one by one along the negative direction of the x-axis until all step translation scans are completed.

[0098] S412, parallel mode stitching is adopted, with the center of each sub-region image as the reference, the reference surfaces of adjacent overlapping areas of the sub-region images are unified by translation and rotation, and the full-path wavefront is restored on the designated reference surface to obtain a holographic image containing all acupuncture points.

[0099] Specifically, the splicing generation method of the holographic image can be summarized as follows:

[0100] Benchmark setting: Determine the reference point based on the center of each sub-area image.

[0101] Unification of adjacent overlapping areas: For adjacent sub-area images, the reference surfaces of their overlapping areas are unified through operations such as translation and rotation. This can be achieved through image registration and correction algorithms to ensure that the positions and angles of adjacent images in the overlapping areas are consistent.

[0102] Full-path wavefront restoration: During the stitching process, the full-path wavefront is restored using a specified reference surface. Holographic image processing technology can be used to reconstruct and optimize the image based on the wavefront data to ensure the quality and accuracy of the holographic image.

[0103] Holographic image generation: After the above steps, the obtained holographic image will contain the information of all acupuncture points and ensure the continuity and integrity of the image. The holographic image can be used for subsequent acupuncture mark identification and analysis.

[0104] S42. Based on holographic image processing technology, the three-dimensional information of the puncture points on all solder joints is extracted to obtain the hole position coordinates of each puncture point.

[0105] In the description of the present invention, based on the holographic image processing technology, extracting the three-dimensional information of the puncture points on all the solder joints and obtaining the hole position coordinates of each puncture point includes the following steps:

[0106] S421, denoising, smoothing and contrast enhancement are performed on the holographic image.

[0107] S422, using image segmentation technology to extract acupuncture point features in the holographic image, and based on the acupuncture point features, screening and marking all acupuncture point areas.

[0108] S423, extracting the three-dimensional information of the acupuncture point area, calculating the spatial coordinates of the acupuncture point area based on the geometric shape of the acupuncture point area and the principle of holographic imaging, and converting the spatial coordinates into a two-dimensional coordinate system, and selecting the center point of the area as the hole coordinates of the acupuncture point.

[0109] S43, based on the three-dimensional structural information of the pad to be tested, a three-dimensional pad model is established, and the hole coordinates and the needle insertion depth are combined as needle insertion marks, and then imported into the three-dimensional pad model, and superimposed and combined to form a virtual pad model.

[0110] S44, importing the virtual pad model into a computer interface for visual display, and utilizing interactive operations to perform all-round observation of the virtual pad model.

[0111] S5. Based on the virtual pad model, the needle puncture mark is identified and analyzed, and the detection result of the needle puncture mark and the usage report of the probe corresponding to the needle puncture mark are output.

[0112] In the description of the present invention, based on the virtual pad model, the needle piercing trace is identified and analyzed, and the detection result of the needle piercing trace and the usage report of the probe corresponding to the needle piercing trace are output, which includes the following steps:

[0113] S51. Based on the preset needle mark standard, the needle marks are compared in sequence according to the probe numbers to determine whether there is a depth and position deviation in the needle mark. If there is a depth or position deviation, the probe number and the depth or position deviation value of the needle mark are recorded.

[0114] S52. After all the needle puncture marks are compared, the deviation cause of each needle puncture mark and the structural influence of the corresponding probe are analyzed based on all the recorded deviation values.

[0115] In the description of the present invention, based on all the recorded deviation values, analyzing the deviation cause of each needle puncture mark and the structural influence of the corresponding probe includes the following steps:

[0116] S521. Analyze the deviation reasons of each needle mark one by one. If there is only depth deviation but no position deviation in the needle mark, determine that the needle mark is a probe insertion defect. If there is position deviation in the needle mark, determine that the needle mark is a probe offset defect. Based on the position deviation value, extract the offset direction and offset degree of the needle mark.

[0117] Specifically, if the needle piercing mark only has a depth deviation but no position deviation, the needle piercing mark is determined to be a probe piercing defect. This may be caused by the influence of external force when the probe pierces the pad, or by problems with the structure or material of the probe itself.

[0118] If there is a position deviation in the needle puncture mark, it is determined that the needle puncture mark is a probe deviation defect. According to the position deviation value, the direction and degree of deviation can be determined, and then the possible causes can be analyzed. Possible causes include loose probe fixing structure, poor contact between probe and probe card, or damage to mechanical parts.

[0119] S522, analyzing the structural problems of each probe one by one. If the corresponding needle piercing mark is a probe piercing defect, it is determined that the probe is affected by its own force. If the corresponding needle piercing mark is a probe offset defect, it is determined that the probe is affected by its own position.

[0120] Specifically, if the corresponding needle puncture mark is a probe puncture defect, it may be caused by the probe itself being affected or damaged by external forces, which may involve problems with the material quality, fixing method, mechanical structure design, etc. of the probe.

[0121] If the corresponding needle puncture mark is a probe deviation defect, it may be caused by unstable probe position or the influence of external forces. Possible reasons include improper design of the probe fixing structure, damage to mechanical parts, environmental vibration, etc.

[0122] S53. Based on the deviation value and the deviation reason of the needle mark, the detection result of the needle mark is combined, and the structural influence of all probes is combined as the probe usage report.

[0123] See also Figure 2 , also provides a probe card detection system for confirming needle puncture marks, the system comprising:

[0124] The probe installation and verification module 1 is used to install the probe card on the probe station and calibrate the probe position and the position of the pad to be tested.

[0125] The parameter setting control module 2 is used to control the probe card to automatically perform the needle insertion operation based on the preset initial needle insertion parameters, so that the probe gradually contacts the solder joint on the surface of the pad to be tested.

[0126] The needle insertion depth calculation module 3 is used to measure the electrical parameters of the probes after the probes are in full contact with the solder joints, and calculate the needle insertion depth of each probe based on the variation relationship of the electrical parameters.

[0127] The needle insertion position recognition module 4 is used to control the probe card to leave the needle insertion area after the measurement is completed, and use the camera component to capture the surface image of the pad to be tested, and establish a virtual pad model that can display the needle insertion traces.

[0128] The needle puncture mark detection module 5 is used to identify and analyze the needle puncture mark based on the virtual pad model, and output the detection result of the needle puncture mark and the usage report of the probe corresponding to the needle puncture mark.

[0129] Among them, the probe installation verification module 1, the parameter setting control module 2, the needle insertion depth calculation module 3, the needle insertion position recognition module 4 and the needle insertion mark detection module 5 are connected in sequence.

[0130] In summary, with the help of the above technical scheme of the present invention, the present invention combines the technologies of automated probe operation, electrical parameter measurement, holographic scanning and image processing to realize the comprehensive detection and evaluation of the needle puncture marks. First, the probe card automatically punctures the pad, measures the puncture depth of each probe, and uses the holographic scanning component to obtain the pad surface image, and establishes a virtual pad model; on this basis, the puncture marks are identified and analyzed by image processing technology, and the detection results and probe usage reports are output, ensuring the accuracy and reliability of the test process, and improving production efficiency and product quality. The present invention uses a combination of electrical parameter measurement and historical test data analysis to realize the accurate calculation and recording of the probe puncture depth, establishes an association model of electrical parameters and puncture depth according to historical test data, realizes the instant calculation of the puncture depth of each probe, can accurately reflect the depth of the probe in the process of puncturing the pad, and provides an important basis for the accuracy of subsequent test results, and by recording the probe number, measurement time, and related electrical parameters and puncture depth, realizes the comprehensive tracking and management of the puncture process, ensuring the controllability and stability of the test process. The present invention utilizes holographic scanning technology and image processing technology to achieve high-precision three-dimensional modeling and visual display of the needle marks on the surface of the pad to be tested, and establishes a complete virtual pad model that can accurately display the position and depth of each needle point, so as to more intuitively understand the needle situation on the pad surface, providing convenience and accuracy for further testing and analysis.

[0131] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

Claims

1. A probe card detection method for confirming needle puncture marks, characterized in that: The method comprises the following steps: S1. Install the probe card on the probe station and calibrate the probe position and the position of the pad to be tested; S2. Based on pre-set initial pricking parameters, controlling the probe card to automatically perform a pricking operation so that the probe gradually contacts the solder joint on the surface of the pad to be tested; S3. After the probes are in full contact with the solder joints, measuring electrical parameters of the probes, and calculating the insertion depth of each probe based on a variation of the electrical parameters; S4. After the measurement is completed, the probe card is controlled to leave the pricking area, and the surface of the pad to be measured is scanned by a holographic scanning component to establish a virtual pad model that can display the pricking traces; S5. Identify and analyze the needle puncture mark based on the virtual pad model, and output a detection result of the needle puncture mark and a usage report of the probe corresponding to the needle puncture mark; The measuring of the electrical parameters of the probes and calculating the insertion depth of each probe based on the changing relationship of the electrical parameters comprises the following steps: S31, using an electric energy meter to measure electrical parameters between each probe and the corresponding solder joint in the probe card, wherein the electrical parameters include resistance and capacitance; S32, obtaining historical test data of the probe card performing a needle-piercing test on the pad to be tested, and establishing a correlation fitting model between electrical parameters and needle-piercing depth based on the historical test data, wherein the historical test data includes historical needle-piercing parameters, historical electrical parameters, and historical needle-piercing depths; S33, substituting the currently measured electrical parameters into the correlation fitting model to calculate the acupuncture depth of each probe under the initial acupuncture parameters; S34, recording the probe number and measurement time of each probe, and associating the electrical parameters and the acupuncture depth of each probe; The establishment of a correlation fitting model between electrical parameters and acupuncture depth based on the historical test data comprises the following steps: S321, establishing a resistance function model between resistance value and acupuncture depth, and performing parameter fitting on a resistance index in the resistance function model based on historical resistance values ​​and corresponding historical acupuncture depths in the historical test data, obtaining a resistance index value and substituting it into the resistance function model; S322: Establishing a capacitance function model between capacitance value and acupuncture depth, and performing parameter fitting on a capacitance index in the capacitance function model based on historical capacitance values ​​and corresponding historical acupuncture depths in the historical test data to obtain a capacitance index value and substitute it into the capacitance function model; S323, inputting the resistance value of the currently measured electrical parameter into the resistance function model to calculate a first acupuncture depth, and substituting the capacitance value of the currently measured electrical parameter into the capacitance function model to calculate a second acupuncture depth; S324, respectively setting weight factors for the first acupuncture depth and the second acupuncture depth, using the weighted sum equation as a correlation fitting model, and calculating the actual acupuncture depth of the probe; The expression of the resistance function model is: ； Where, L D Indicates the first acupuncture depth calculated using the resistance value; R e Indicates the resistance value measured after the probe fully contacts the contact; R 0 Indicates the initial resistance value when the probe is not touching the contact; d The resistance index that represents the relationship between the resistance value and the depth of the needle; L 0 Indicates the length of the probe tip that can penetrate the solder joint; The expression of the capacitance function model is: ； Where, L Q Indicates the second acupuncture depth calculated using the capacitance value; C e Indicates the capacitance value measured after the probe fully contacts the contact; C 0 Indicates the initial capacitance value when the probe is not touching the contact; q The capacitance index represents the relationship between capacitance value and acupuncture depth; L 0 Indicates the length of the probe tip that can penetrate the solder joint.

2. A probe card detection method for confirming needle puncture marks according to claim 1, characterized in that: The method of scanning the surface of the pad to be tested by using a holographic scanning component to establish a virtual pad model capable of displaying needle puncture marks comprises the following steps: S41, placing a holographic scanning component directly above the pad to be tested, scanning the surface of the pad to be tested in parallel, and obtaining a holographic image containing all the needle insertion points by image stitching; S42, extracting three-dimensional information of the puncture points on all the solder joints based on holographic image processing technology to obtain the hole coordinates of each puncture point; S43, based on the three-dimensional structural information of the pad to be tested, establishing a three-dimensional pad model, and combining the hole position coordinates and the needle insertion depth as a needle insertion mark, and then importing the three-dimensional pad model, superimposing and combining to form a virtual pad model; S44: importing the virtual pad model into a computer interface for visual display, and performing all-round observation of the virtual pad model through interactive operation.

3. A probe card detection method for confirming needle puncture marks according to claim 2, characterized in that: The holographic scanning component is placed directly above the pad to be tested, and the surface of the pad to be tested is scanned in parallel, and a holographic image containing all the needle points is obtained by image stitching, which includes the following steps: S411. Set the S-shaped scanning path and step spacing of the holographic scanning component, preferentially scanning one by one along the positive x-axis direction, capturing a sub-region image each time the translation is performed, then translate a single step spacing along the positive y-axis direction, and then scan one by one along the negative x-axis direction until all step translation scans are completed; S412. Using parallel mode stitching, taking the center of each sub-region image as a reference, unify the reference surfaces of adjacent overlapping areas of the sub-region images by translation and rotation, and restore the full-path wavefront on the specified reference surface to obtain a holographic image containing all acupuncture points.

4. A probe card detection method for confirming needle puncture marks according to claim 3, characterized in that: The method of extracting the three-dimensional information of the puncture points on all the solder joints based on holographic image processing technology and obtaining the hole coordinates of each puncture point includes the following steps: S421, performing denoising, smoothing, and contrast enhancement processing on the holographic image; S422, using image segmentation technology to extract acupuncture point features in the holographic image, and based on the acupuncture point features, screening and marking all acupuncture point areas; S423, extracting the three-dimensional information of the acupuncture point area, calculating the spatial coordinates of the acupuncture point area based on the geometric shape of the acupuncture point area and the principle of holographic imaging, converting the spatial coordinates into a two-dimensional coordinate system, and selecting the center point of the area as the hole coordinates of the acupuncture point.

5. The probe card detection method for confirming needle puncture marks according to claim 2, characterized in that: The identifying and analyzing the needle puncture marks based on the virtual pad model, and outputting the detection results of the needle puncture marks and the usage report of the probe corresponding to the needle puncture marks include the following steps: S51. Based on a preset needle puncture mark standard, sequentially compare the needle puncture marks according to the probe numbers to determine whether the needle puncture marks have depth and position deviations. If depth or position deviations exist, record the probe numbers and depth or position deviation values ​​of the needle puncture marks. S52. After all the needle puncture marks are compared, the cause of the deviation of each needle puncture mark and the corresponding structural influence of the probe are analyzed based on all the recorded deviation values; S53. Based on the deviation value and the deviation reason of the needle puncture mark, the deviation value and the deviation reason are combined as the detection result of the needle puncture mark, and the structural influence of all the probes are combined as the usage report of the probe.

6. The probe card detection method for confirming needle puncture marks according to claim 5, characterized in that: The step of analyzing the deviation cause of each of the needle puncture marks based on all the recorded deviation values ​​and the corresponding structural impact of the probe comprises the following steps: S521, analyzing the deviation cause of each needle puncture mark one by one. If the needle puncture mark only has a depth deviation but no position deviation, the needle puncture mark is determined to be a probe insertion defect. If the needle puncture mark has a position deviation, the needle puncture mark is determined to be a probe deviation defect. Based on the position deviation value, the deviation direction and degree of the needle puncture mark are extracted; S522. Analyze the structural problems of each probe one by one. If the corresponding needle mark is a probe insertion defect, determine that the probe is affected by its own force. If the corresponding needle mark is a probe deviation defect, determine that the probe is affected by its own position.

7. A probe card detection system for confirming needle puncture marks, used to implement the probe card detection method for confirming needle puncture marks according to any one of claims 1 to 6, characterized in that: The system includes: The probe installation and verification module is used to install the probe card on the probe table and calibrate the probe position and the position of the pad to be tested; A parameter setting control module, configured to control the probe card to automatically perform a needle-piercing operation based on pre-set initial needle-piercing parameters, so that the probe gradually contacts the solder joint on the surface of the pad to be tested; a needle insertion depth calculation module, configured to measure electrical parameters of the probes after the probes are in full contact with the solder joints, and calculate the insertion depth of each probe based on a variation of the electrical parameters; A needle insertion position recognition module is used to control the probe card to leave the needle insertion area after the measurement is completed, and use a camera component to capture the surface image of the pad to be measured to establish a virtual pad model that can display the needle insertion traces; a needle puncture mark detection module, configured to identify and analyze the needle puncture mark based on the virtual pad model, and output a detection result of the needle puncture mark and a usage report of the probe corresponding to the needle puncture mark; Among them, the probe installation verification module, the parameter setting control module, the needle depth calculation module, the needle position recognition module and the needle mark detection module are connected in sequence.

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