Circuit layout of a printed circuit board

Abstract

A circuit layout of a printed circuit board is capable of avoiding stub lines. The circuit layout includes a first routing from a central processing unit (CPU) via a first set of pads to a first module, a second routing from a first set of bridge pads of the first routing via a second set of pads and a second set of bridge pads to a second module, a third routing from a third set of pads to a third module, and a connecting element, wherein each set of pads is formed by separate pads. In a first use of the circuit layout, the connecting element connects a plurality of pads of the first set of pads to electrically connect the CPU and the first module. In a second use of the circuit layout, the connecting element connects the first set of pads and the first set of bridge pads and connects the second set of pads and the second set of bridge pads to electrically connect the CPU and the second module. In a third use of the circuit layout, the connecting element connects the first set of pads and the first set of bridge pads and connects the second set of pads and the third set of pads to electrically connect the CPU and the third module.

Description

Technical Field

[0001] The present invention relates to a circuit layout of a printed circuit board, and in particular to a circuit layout of a printed circuit board capable of avoiding residual lines. Background Art

[0002] Depending on application requirements, a central processing unit (CPU) may need to be electrically connected to one of multiple modules. Therefore, to facilitate production or use, a printed circuit board (PCB) is typically provided with multiple routings for electrically connecting the CPU to the modules. Furthermore, the PCB also reserves space for the CPU and one of the modules.

[0003] Figure 1 A circuit layout of the prior art is shown, which allows a CPU to be electrically connected to one of a plurality of modules via one of a plurality of wirings. Figure 1 As shown, on a PCB 10, a circuit layout 110 includes a CPU arrangement space 112, a first module arrangement space 114, a second module arrangement space 116, and a third module arrangement space 118. The circuit layout 110 also includes a first wiring 122 (i.e., Figure 1 Black thin line), a second wiring 124 (ie: Figure 1 thick black line) and a third wiring 126 (ie: Figure 1 The first wiring 122 is coupled between the CPU arrangement space 112 and the first module arrangement space 114; the second wiring 124 is coupled between the third wiring 126 and the second module arrangement space 116; and the third wiring 126 is coupled between the first wiring 122 and the third module arrangement space 118. Each wiring includes electrically isolated pads (i.e., Figure 1 It is worth noting that the third wiring 126 (ie: Figure 1 The dotted line) is located on the back side of the PCB 10, and the remaining wiring is located on the front side of the PCB 10. The wiring on the front side and the wiring on the back side can be connected through vias (not shown).

[0004] See also Figure 1 In practice, a CPU only needs to couple to one of the multiple modules, rather than to the multiple modules. Figure 1Only one of the first wiring 122, the second wiring 124 and the third wiring 126 needs to be conductive. When the circuit layout 110 is used to couple a CPU and a first module, the electrically isolated pads of the first wiring 122 are connected through a zero-ohm resistor (not shown) bonding / mounting / attachment. At this time, the transmission line coupled between the pads of the first wiring 122 and the third wiring 126 will form bridge taps, and the transmission line coupled between the pads of the third wiring 126 and the second wiring 124 will also form bridge taps. Similarly, when the circuit layout 110 is used to couple the CPU and a second module / third module, the electrically isolated pads of the second wiring 124 / third wiring 126 will be connected through a zero-ohm resistor bonding / mounting / attachment. At this time, the wiring leading to the other two modules will form bridge taps. The above-mentioned bridge taps will significantly affect the transmission of high-speed signals and may cause functional abnormalities. Summary of the Invention

[0005] One of the objectives of the present disclosure is to provide a circuit layout of a printed circuit board to avoid stubs.

[0006] An embodiment of the circuit layout of a printed circuit board disclosed herein includes a first wiring, a second wiring, and at least one set of connecting elements. The first wiring includes a first set of front-end transmission lines, a first set of solder pads, a first set of bridge solder pads, and a first set of back-end transmission lines, wherein: the first set of front-end transmission lines is used to couple to a central processing unit transmission interface and to the first set of solder pads; the first set of solder pads includes a plurality of first solder pads, any two of which are separated; the first set of bridge solder pads includes a plurality of first bridge solder pads, any two of which are separated, and any one of the plurality of first bridge solder pads is separated from any one of the plurality of first solder pads; and in a first use of the circuit layout, the first set of back-end transmission lines couples the first set of solder pads to a first module transmission interface. The second wiring includes a second set of front-end transmission lines, a second set of front-end pads, a second set of bridging pads, and a second set of transmission circuits, wherein: the second set of front-end transmission lines couples the first set of bridging pads and the second set of front-end pads; the second set of front-end pads includes a plurality of second front-end pads, any two of the plurality of second front-end pads are separated; the second set of bridging pads includes a plurality of second bridging pads, any two of the plurality of second bridging pads are separated, and any one of the plurality of second bridging pads is separated from any one of the plurality of second front-end pads; and in a second use of the circuit layout, the second set of transmission circuits couples the second set of bridging pads to a second module transmission interface. In the first use of the circuit layout, the at least one set of connecting elements includes a first set of connecting elements, the first set of connecting elements connecting multiple bonding pads of the plurality of first bonding pads to electrically connect the first set of front-end transmission lines and the first set of back-end transmission lines, thereby electrically connecting the central processing unit transmission interface and the first module transmission interface. In this case, the first set of bonding pads and the first set of bridging pads are electrically isolated. In the second use of the circuit layout, the at least one set of connecting elements includes a second set of connecting elements and a third set of connecting elements, the second set of connecting elements connecting the first set of bonding pads and the first set of bridging pads to electrically connect the first set of front-end transmission lines and the second set of front-end transmission lines, and the third set of connecting elements connecting the second set of front-end bonding pads and the second set of bridging pads to electrically connect the second set of front-end transmission lines and the second set of transmission circuits, thereby electrically connecting the central processing unit transmission interface and the second module transmission interface. In this case, any two of the plurality of first bonding pads are electrically isolated.

[0007] Another embodiment of the printed circuit board circuit layout disclosed herein includes a first wiring, a second wiring, and at least one set of connecting elements. The first wiring includes a first set of front-end transmission lines, a first set of solder pads, a first set of bridge solder pads, and a first set of back-end transmission lines, wherein: the first set of front-end transmission lines is used to couple to a central processing unit transmission interface and to the first set of solder pads; the first set of solder pads includes a plurality of first solder pads, any two of which are separated; the first set of bridge solder pads includes a plurality of first bridge solder pads, any two of which are separated, and any one of which is separated from any one of the first solder pads; and in a first application of the circuit layout, the first set of back-end transmission lines couples the first set of solder pads to a first module transmission interface. The second wiring includes a second set of transmission circuits, wherein in a second application of the circuit layout, the second set of transmission circuits couples the first set of bridge solder pads to a second module transmission interface. In the first use of the circuit layout, the at least one set of connecting elements includes a first set of connecting elements, the first set of connecting elements connecting multiple bonding pads of the plurality of first bonding pads to electrically connect the first set of front-end transmission lines and the first set of back-end transmission lines, thereby electrically connecting the central processing unit transmission interface and the first module transmission interface. In this case, the first set of bonding pads and the first set of bridging pads are electrically isolated. In the second use of the circuit layout, the at least one set of connecting elements includes a second set of connecting elements connecting the first set of bonding pads and the first set of bridging pads to electrically connect the first set of front-end transmission lines and the second set of transmission circuits, thereby electrically connecting the central processing unit transmission interface and the second module transmission interface. In this case, any two of the plurality of first bonding pads are electrically isolated.

[0008] The features, implementation and technical effects of the present invention are described in detail below with reference to the accompanying drawings for preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 Showing a prior art circuit layout;

[0010] Figure 2a An embodiment of a circuit layout of a printed circuit board of the present disclosure is shown;

[0011] Figure 2b Shown in Figure 2a how to arrange at least one set of connection elements under a first use of the circuit layout;

[0012] Figure 2c Shown in Figure 2a how to arrange at least one set of connection elements in the second use of the circuit layout;

[0013] Figure 2d Shown in Figure 2ahow to arrange at least one set of connection elements under the third use of the circuit layout;

[0014] Figure 3 show Figure 2a A first embodiment of a second transmission circuit;

[0015] Figure 4 show Figure 2a A second embodiment of the second transmission circuit;

[0016] Figure 5 show Figure 2a A variation of the embodiment;

[0017] Figure 6a show Figure 2a A variation of the embodiment of ; and

[0018] Figure 6b show Figure 2a A variation of the embodiment.

[0019] Explanation of symbols

[0020] 10: Printed Circuit Board

[0021] 110: Circuit Layout

[0022] 112: Central processing unit installation space

[0023] 114: Setting space of the first module

[0024] 116: Setting space for the second module

[0025] 118: Setting space for the third module

[0026] 122: First wiring

[0027] 124: Second wiring

[0028] 126: Third wiring

[0029] 20: Printed Circuit Board

[0030] 22: Central processing unit installation space

[0031] 24: Setting space of the first module

[0032] 26: Setting space for the second module

[0033] 28: Setting space for the third module

[0034] 200: Circuit Layout

[0035] 212: The first set of front-end transmission lines

[0036] 214: First set of pads

[0037] 216: First set of bridge pads

[0038] 218: The first set of back-end transmission lines

[0039] 222: The second set of front-end transmission lines

[0040] 224: Second set of front-end pads

[0041] 226: Second set of bridge pads

[0042] 228: Second set of transmission circuits

[0043] 232: The third set of pads

[0044] 234: The third set of transmission lines

[0045] 242: The first set of connection elements

[0046] 244: Second set of connection elements

[0047] 246: The third set of connection elements

[0048] 248: The fourth set of connection elements

[0049] 310: Second set of intermediate transmission lines

[0050] 320: Second set of back-end pads

[0051] 330: The second set of back-end transmission lines

[0052] 340: Connecting elements

[0053] 410: The second set of back-end transmission lines

[0054] 610: Transmission Line DETAILED DESCRIPTION

[0055] This specification discloses a circuit layout of a printed circuit board (PCB), which can connect a central processing unit (CPU) to one of multiple modules as needed while avoiding bridge taps that would adversely affect high-speed signal transmission.

[0056] Figure 2a An embodiment of a circuit layout of a printed circuit board of the present disclosure is shown. Figure 2a The circuit layout 200 is disposed on a PCB 20 and includes a first wiring (ie: Figure 2a The black thin line in the figure), a second wiring (ie: Figure 2a The black composite dotted line and the black composite line in FIG), a third wiring (ie: Figure 2a gray dotted line in the figure) and at least one set of connecting elements (such as Figures 2b to 2d ). PCB 20 reserves: a CPU installation space 22 for installing a CPU; a first module installation space 24 for installing a first module; a second module installation space 26 for installing a second module; and a third module installation space 28 for installing a third module. The first wiring is used to electrically connect the transmission interface of the CPU with the transmission interface of the first module; the second wiring is used to electrically connect the transmission interface of the CPU with the transmission interface of the second module; and the third wiring is used to electrically connect the transmission interface of the CPU with the transmission interface of the third module. A non-limiting embodiment of each of the above transmission interfaces is a serializer / deserializer (SerDes) interface. Of the first, second, and third wirings, the wiring located on a first surface (e.g., the front) of PCB 20 is represented by a solid line, and the wiring located on a second surface (e.g., the back) of PCB 20 is represented by a dotted line. Details of the first, second, and third wirings are described in the following paragraphs.

[0057] See also Figure 2a The first wiring includes a first set of front-end transmission lines 212, a first set of bonding pads 214 (ie: Figure 2a a first set of bridging pads 216 (ie, a first white square in the first wiring diagram); Figure 2a ) and a first set of back-end transmission lines 218. The first set of front-end transmission lines 212 is used to couple the transmission interface of the CPU and couple the first set of pads 214. The first set of pads 214 includes a plurality of first pads, any two of which are separated. The first set of bridge pads 216 includes a plurality of first bridge pads, any two of which are separated, and any one of which is separated from any one of which. The first set of back-end transmission lines 218 is coupled to the first set of pads 214 and is coupled to the transmission interface of the first module under a first use of the circuit layout 200. It is worth noting that the first wiring is located on the first surface of the PCB 20.

[0058] See also Figure 2a The second wiring includes a second set of front-end transmission lines 222, a second set of front-end bonding pads 224 (ie: Figure 2a The second white square in the wiring), a second set of bridging pads (i.e.: Figure 2a2 (the gray blocks representing the second wiring in the circuit layout 200) 226 and a second set of transmission circuits 228. The second set of front-end transmission lines 222 couples the first set of bridge pads 216 to the second set of front-end pads 224. The second set of front-end pads 224 includes a plurality of second front-end pads, any two of which are separated. The second set of bridge pads 226 includes a plurality of second bridge pads, any two of which are separated, and any one of which is separated from any other of which. The second set of transmission circuits 228 couples the second set of bridge pads 226 and, for a second purpose of the circuit layout 200, is coupled to the transmission interface of the second module. It is worth noting that a portion of the second wiring (from the first set of bridging pads 216 to the second set of front-end pads 224) is located on the second surface of the PCB 20, and another portion of the second wiring (from the second set of bridging pads 226 to the transmission interface of the second module) is located on the first surface of the PCB 20. Therefore, the second wiring further includes a plurality of vias (i.e., the dark gray dots in Figure 2), which are used to couple the second wiring located on the first surface with the second wiring located on the second surface.

[0059] See also Figure 2a The third wiring includes a third set of pads 232 (ie: Figure 2a The third set of transmission lines 234 is coupled to the third set of pads 232 and is coupled to the transmission interface of the third module in a third use of the circuit layout 200. Figure 2a A non-limiting example of the transmission line is traces, or other known / self-developed signal transmission means that can serve as a transmission line.

[0060] Figure 2b It shows how to arrange at least one set of connection elements in the first use of the circuit layout 200. Figure 2b As shown, the at least one set of connecting elements includes a first set of connecting elements 242. The first set of connecting elements 242 connects to the pads of the first set of pads 214 to electrically connect the first set of front-end transmission lines 212 and the first set of back-end transmission lines 218, thereby electrically connecting the transmission interface of the CPU and the transmission interface of the first module. At this time, the first set of pads 214 and the first set of bridge pads 216 are electrically isolated, that is, the path from the CPU to the second module and the path from the CPU to the third module are both non-conductive. A non-limiting embodiment of the at least one set of connecting elements includes at least one of the following: a zero-ohm resistor; a jumper; and a DIP (dual in-line package) switch.

[0061] Figure 2c It shows how to arrange at least one set of connection elements in the second use of the circuit layout 200. Figure 2c As shown, at least one set of connection elements includes a second set of connection elements 244 and a third set of connection elements 246. The second set of connection elements 244 connects the first set of pads 214 and the first set of bridging pads 216 to electrically connect the first set of front-end transmission lines 212 and the second set of front-end transmission lines 222; the third set of connection elements 246 connects the second set of front-end pads 224 and the second set of bridging pads 226 to electrically connect the second set of front-end transmission lines 222 and the second set of transmission circuits 228, thereby electrically connecting the transmission interface of the CPU and the transmission interface of the second module. At this time, any two pads of the first set of pads 214 are electrically isolated, and the second set of front-end pads 224 and the third set of pads 232 are electrically isolated. In other words, the path from the CPU to the first module and the path from the CPU to the third module are both non-conductive.

[0062] Figure 2d It shows how to arrange at least one set of connection elements in the third use of the circuit layout 200. Figure 2d As shown, at least one set of connection elements includes a second set of connection elements 244 and a fourth set of connection elements 248. As previously described, the second set of connection elements 244 connects the first set of pads 214 and the first set of bridging pads 216; the fourth set of connection elements 248 connects the second set of front-end pads 224 and the third set of pads 232 to electrically connect the second set of front-end transmission lines 222 and the third set of transmission lines 234, thereby electrically connecting the transmission interface of the CPU and the transmission interface of the third module. At this time, any two pads of the first set of pads 214 are electrically isolated, and the second set of front-end pads 224 and the second set of bridging pads 226 are electrically isolated. In other words, the path from the CPU to the first module and the path from the CPU to the second module are both non-conductive.

[0063] Figure 3 show Figure 2a A first embodiment of the second set of transmission circuits 228. Figure 3 As shown, the second set of transmission circuits 228 includes a second set of intermediate transmission lines 310, a second set of back-end pads 320, and a second set of back-end transmission lines 330. The second set of intermediate transmission lines 310 couples the second set of bridging pads 226 and the second set of back-end pads 320, wherein the second set of back-end pads 320 includes a plurality of second back-end pads, and any two of the plurality of second back-end pads are separated. The second set of back-end transmission lines 330 couples the second set of back-end pads 320 and couples to the transmission interface of the second module in the second use of the circuit layout. Figure 3In the embodiment of the second use of the circuit layout 200, the at least one set of connecting elements further includes a set of connecting elements 340, which are connected to the pads of the second set of back-end pads 320 to electrically connect the second set of intermediate transmission lines 310 and the second set of back-end transmission lines 330.

[0064] Figure 4 show Figure 2a A second embodiment of the second set of transmission circuits 228. Figure 4 As shown, the second set of transmission circuits 228 includes a second set of back-end transmission lines 410. The second set of back-end transmission lines 410 is coupled to the second set of bridge pads 226 and coupled to the transmission interface of the second module in the second use of the circuit layout 200.

[0065] In an alternative embodiment, Figure 2a The circuit layout 200 is only designed to electrically connect the CPU to one of the first module and the second module, such as Figure 5 As shown. Figure 5 In an alternative embodiment, the third wiring is omitted and the third module installation space 28 is also omitted. Figure 2a The circuit layout 200 is only designed to electrically connect the CPU to one of the first module and the third module, such as Figure 6a As shown. Figure 6a In an embodiment, the second wiring from the second set of bridge pads 226 to the transmission interface of the second module is omitted, and the second module installation space 26 is also omitted; in this case, the second set of front-end transmission lines 222 from the first set of bridge pads 216 to the second set of front-end pads 224 are still required and serve as part of the path between the CPU and the transmission interface of the third module. In an alternative embodiment, Figure 2a The circuit layout 200 is only used to electrically connect the CPU to one of the first module and the third module. Figure 6b As shown. Figure 6b In the embodiment, the second wiring may be omitted, and the third wiring includes a set of transmission lines 610 for coupling the first set of bridge pads 216 and the transmission interface of the third module.

[0066] Since those skilled in the art can refer to Figures 2a to 4 The details and variations of the above-mentioned alternative embodiments can be understood through the disclosure of the embodiments, and repeated and redundant descriptions are omitted here.

[0067] It is worth noting that, under the premise that the implementation is feasible, technicians in this technical field may selectively implement part or all of the technical features of any of the aforementioned embodiments, or selectively implement part or all of the technical features of the aforementioned multiple embodiments; in other words, based on the present disclosure, the way of implementing the present invention is flexible.

[0068] In summary, the circuit layout of the PCB disclosed herein can connect the CPU to one of multiple modules as needed, while avoiding stubs that would adversely affect high-speed signal transmission.

[0069] Although the embodiments of the present invention are described above, the embodiments are not intended to limit the present invention. Those skilled in the art may modify the technical features of the present invention based on the explicit or implicit content of the present invention. All such modifications may fall within the scope of patent protection sought by the present invention. In other words, the scope of patent protection of the present invention shall be determined by the claims of this specification.

Claims

1. A circuit layout of a printed circuit board, capable of avoiding a stub line, the circuit layout comprising: A first wiring, comprising a first set of front-end transmission lines, a first set of bonding pads, a first set of bridging bonding pads, and a first set of back-end transmission lines, wherein: The first set of front-end transmission lines is used to couple to a central processing unit transmission interface and to couple to the first set of bonding pads; The first set of pads includes a plurality of first pads, and any two of the plurality of first pads are separated; The first set of bridging pads includes a plurality of first bridging pads, any two of the plurality of first bridging pads are separated, and any one of the plurality of first bridging pads is separated from any one of the plurality of first pads; and In a first use of the circuit layout, the first set of back-end transmission lines couples the first set of bonding pads to a first module transmission interface; A second wiring, comprising a second set of front-end transmission lines, a second set of front-end pads, a second set of bridging pads, and a second set of transmission circuits, wherein: The second set of front-end transmission lines couples the first set of bridging pads and the second set of front-end pads; The second set of front-end pads includes a plurality of second front-end pads, and any two of the plurality of second front-end pads are separated; The second set of bridging pads includes a plurality of second bridging pads, any two of the plurality of second bridging pads are separated, and any one of the plurality of second bridging pads is separated from any one of the plurality of second front-end pads; and In a second use of the circuit layout, the second set of transmission circuits couples the second set of bridge pads to a second module transmission interface; and At least one set of connecting elements, In the first use of the circuit layout, the at least one set of connecting elements includes a first set of connecting elements, the first set of connecting elements connecting multiple bonding pads of the plurality of first bonding pads to electrically connect the first set of front-end transmission lines and the first set of back-end transmission lines, thereby electrically connecting the central processing unit transmission interface and the first module transmission interface. In this case, the first set of bonding pads and the first set of bridging pads are electrically isolated. In the second use of the circuit layout, the at least one set of connecting elements includes a second set of connecting elements and a third set of connecting elements, the second set of connecting elements connecting the first set of bonding pads and the first set of bridging pads to electrically connect the first set of front-end transmission lines and the second set of front-end transmission lines, the third set of connecting elements connecting the second set of front-end bonding pads and the second set of bridging pads to electrically connect the second set of front-end transmission lines and the second set of transmission circuits, thereby electrically connecting the central processing unit transmission interface and the second module transmission interface. In this case, any two of the plurality of first bonding pads are electrically isolated.

2. The circuit layout of claim 1 , wherein the second set of transmission circuits comprises a second set of intermediate transmission lines, a second set of back-end pads, and a second set of back-end transmission lines; the second set of intermediate transmission lines couples the second set of bridging pads and the second set of back-end pads; the second set of back-end pads comprises a plurality of second back-end pads, any two of the plurality of second back-end pads being separated; the second set of back-end transmission lines couples the second set of back-end pads and, in the second use of the circuit layout, couples to the second module transmission interface; in the second use of the circuit layout, the at least one set of connecting elements further comprises a fourth set of connecting elements, the fourth set of connecting elements connecting a plurality of pads of the plurality of second back-end pads to electrically connect the second set of intermediate transmission lines to the second set of back-end transmission lines.

3. The circuit layout of claim 1 , wherein the second set of transmission circuits comprises a second set of back-end transmission lines, the second set of back-end transmission lines being coupled to the second set of bridge pads and coupled to the second module transmission interface in the second use of the circuit layout.

4. The circuit arrangement of claim 1 , further comprising: a third wiring, comprising a third set of pads and a third set of transmission lines, in: The third set of transmission lines is coupled to the third set of bonding pads and is coupled to a third module transmission interface for a third purpose of the circuit layout; and In the third use of the circuit layout, the at least one set of connecting elements includes the second set of connecting elements and a fourth set of connecting elements; the second set of connecting elements connects the first set of bonding pads and the first set of bridging bonding pads to electrically connect the first set of front-end transmission lines and the second set of front-end transmission lines; the fourth set of connecting elements connects the second set of front-end bonding pads and the third set of bonding pads to electrically connect the second set of front-end transmission lines and the third set of transmission lines, thereby electrically connecting the central processing unit transmission interface and the third module transmission interface.

5. The circuit layout of claim 1 , wherein the first wiring is located on a first surface of the printed circuit board, a portion of the second wiring is located on the first surface of the printed circuit board, and another portion of the second wiring is located on a second surface of the printed circuit board, and the second wiring further comprises a plurality of vias, the plurality of vias being configured to couple the second wiring located on the first surface with the second wiring located on the second surface.

6. The circuit layout of claim 1, wherein the at least one set of connecting elements comprises at least one of the following: a zero-ohm resistor; a jumper; and a dip switch.

7. A circuit layout of a printed circuit board capable of avoiding a stub line, the circuit layout comprising: A first wiring, comprising a first set of front-end transmission lines, a first set of bonding pads, a first set of bridging bonding pads, and a first set of back-end transmission lines, wherein: The first set of front-end transmission lines is used to couple to a central processing unit transmission interface and to couple to the first set of bonding pads; The first set of pads includes a plurality of first pads, and any two of the plurality of first pads are separated; The first set of bridge pads includes a plurality of first bridge pads, any two of the plurality of first bridge pads are separated, and any one of the plurality of first bridge pads is separated from any one of the plurality of first pads; as well as In a first use of the circuit layout, the first set of back-end transmission lines couples the first set of bonding pads to a first module transmission interface; a second wiring, comprising a second set of transmission circuits, wherein in a second use of the circuit layout, the second set of transmission circuits couples the first set of bridge pads and a second module transmission interface; and At least one set of connecting elements, In the first use of the circuit layout, the at least one set of connecting elements includes a first set of connecting elements, which connects multiple pads of the multiple first pads to electrically connect the first set of front-end transmission lines and the first set of back-end transmission lines, thereby electrically connecting the central processing unit transmission interface and the first module transmission interface. In this case, the first set of pads and the first set of bridging pads are electrically isolated. In the second use of the circuit layout, the at least one set of connecting elements includes a second set of connecting elements, which connects the first set of pads and the first set of bridging pads to electrically connect the first set of front-end transmission lines and the second set of transmission circuits, thereby electrically connecting the central processing unit transmission interface and the second module transmission interface. In this case, any two of the multiple first pads are electrically isolated.

8. The circuit arrangement of claim 7, wherein: The second set of transmission circuits includes a second set of front-end transmission lines, a second set of bonding pads, and a second set of back-end transmission lines, wherein: The second set of front-end transmission lines couples the first set of bridging pads and the second set of pads; The second set of pads includes a plurality of second pads, and any two of the plurality of second pads are separated; and The second set of back-end transmission lines is coupled to the second set of pads and is coupled to the second module transmission interface under the second use of the circuit layout. In the second use of the circuit layout, the at least one set of connecting elements further includes a third set of connecting elements, which connect multiple bonding pads of the multiple second bonding pads to electrically connect the second set of front-end transmission lines and the second set of back-end transmission lines.

9. The circuit layout of claim 7, wherein the second set of transmission circuits comprises a second set of transmission lines, the second set of transmission lines coupled to the first set of bridge pads and coupled to the second module transmission interface in the second use of the circuit layout.

10. The circuit layout of claim 7, wherein the at least one set of connecting elements comprises at least one of the following: a zero-ohm resistor; a jumper; and a dip switch.

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