Multilayer circuit board processing device and processing method thereof

Abstract

The present invention relates to the technical field of manufacturing multi-layer circuits, and discloses a multi-layer circuit board processing device and a processing method thereof, wherein a multi-layer circuit board processing device comprises a base plate, a plurality of X-axis limiting mechanisms, a Y-axis limiting mechanism, a plurality of internal limiting mechanisms and a plurality of linear drive mechanisms; the present invention adds a plurality of internal limiting mechanisms to an original pressing mold, and can limit a plurality of multi-layer circuit boards distributed in upper and lower intervals to the center position of the base plate without affecting the already stacked multi-layer circuit boards and the corresponding partitions and copper foils, and is suitable for circuit boards of different specifications, and can also be suitable for the pressing process of special-shaped circuit boards, without opening corresponding pin connection holes on the mold according to the specifications of the circuit boards, and without punching the partitions and copper foils, and effectively reduces the cost and efficiency of pressing.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing multi-layer circuits, and more specifically, to a multi-layer circuit board processing device and a processing method thereof. Background Art

[0002] In the production process of multi-layer circuit boards, lamination is one of the most critical processes. Whether the positioning between the layers of circuits is accurate directly affects the connectivity quality and circuit operation stability of the multi-layer circuit board.

[0003] Before laminating a multi-layer circuit board, it is necessary to add a PP film between each layer of the circuit board, and finally add a layer of copper foil at the upper and lower ends for lamination. At present, the most common processing method is to manually stack the circuit board, PP film and copper foil. In order to improve efficiency and reduce wrinkles during the copper foil lamination process, the area of ​​the copper foil is usually set to be larger than the area of ​​the circuit board to facilitate stacking by the staff and reduce wrinkles at the edge of the circuit board after lamination. This also causes the area of ​​the laminating mold for stacking circuit boards to be larger than the area of ​​the circuit board. If only one group of multi-layer circuit boards is pressed, there will be no impact. If multiple groups of multi-layer circuit boards are stacked and pressed uniformly, each group of multi-layer circuit boards may not completely overlap due to manual operation errors. Usually, positioning pins are used to limit the internal position of multiple groups of multi-layer circuit boards, but this requires continuous opening of corresponding positioning holes on the copper foil and the partition between the copper foils according to the specifications of different circuit boards to facilitate the insertion of positioning pins, and the laminating mold also requires corresponding secondary processing, resulting in increased laminating costs. Summary of the invention

[0004] The object of the present invention is to provide a multilayer circuit board processing device and a processing method thereof in order to solve the above-mentioned problems.

[0005] The present invention provides a multi-layer circuit board processing device, comprising a base plate, a plurality of X-axis limiting mechanisms symmetrically slidably connected to the base plate along the Y-axis, a plurality of Y-axis limiting mechanisms symmetrically slidably connected to the base plate along the X-axis, a plurality of internal limiting mechanisms respectively connected between two symmetrically distributed Y-axis limiting mechanisms and between two symmetrically distributed X-axis limiting mechanisms, and a plurality of linear drive mechanisms arranged inside the base plate, wherein the plurality of linear drive mechanisms are respectively matched with the plurality of X-axis limiting mechanisms and the plurality of Y-axis limiting mechanisms, and the linear drive mechanisms are used to drive the corresponding X-axis limiting mechanisms to move along the Y-axis or drive the corresponding Y-axis limiting mechanisms to move along the X-axis;

[0006] The inner limit mechanism comprises a plurality of symmetrically arranged first elastic support components, an adjustable sliding component slidably connected to the first elastic support components, an inner limit rod connected between two symmetrically arranged adjustable sliding components, and a fourth spring connected between two adjacent first elastic support components, and both ends of the inner limit rod are respectively hinged to the corresponding adjustable sliding components;

[0007] The linear drive mechanism includes a drive assembly, a quantitative torque transmission assembly coaxially arranged with the drive assembly, and a screw fixedly connected to one end of the quantitative torque transmission assembly, and the screw is threadedly connected to a corresponding X-axial limiting mechanism or a Y-axial limiting mechanism.

[0008] As a further optimization scheme of the present invention, a plurality of slots and a plurality of limiting grooves are provided on the base plate, and the plurality of limiting grooves are respectively distributed along the X-axis and the Y-axis. The X-axis limiting mechanism is slidably connected in the limiting groove distributed along the Y-axis, and the Y-axis limiting mechanism is slidably connected in the limiting groove distributed along the X-axis. The plurality of slots are symmetrically distributed on both sides of the limiting groove, and the slots have the same distribution direction as the corresponding limiting grooves.

[0009] As a further optimization scheme of the present invention, the X-axis limiting mechanism includes a first C-shaped limiting block, a first multi-section elastic telescopic rod fixedly connected to the first C-shaped limiting block, a first limiting sliding block fixedly connected to the other end of the first multi-section elastic telescopic rod, and a first convex groove arranged on one side wall of the first C-shaped limiting block, and the slot is matched with the first C-shaped limiting block.

[0010] As a further optimization scheme of the present invention, the Y-axis limiting mechanism includes a second C-shaped limiting block, a second multi-section elastic telescopic rod fixedly connected to the second C-shaped limiting block, a second limiting sliding block fixedly connected to the other end of the second multi-section elastic telescopic rod, and a second convex-shaped sliding groove arranged on one side wall of the second C-shaped limiting block, and the slot is matched with the second C-shaped limiting block.

[0011] As a further optimization scheme of the present invention, the first elastic support component includes two parallel long sliders, a third spring connected between the two long sliders, and a sliding groove arranged on one side wall of the long slider, and the long slider is slidably connected to the inner wall of the first convex sliding groove or the second convex sliding groove.

[0012] As a further optimization scheme of the present invention, the adjustable sliding assembly includes a telescopic sliding rod slidably connected to the inner wall of the sliding groove and a second spring connected between the telescopic sliding rod and the inner wall of the first convex sliding groove or the second convex sliding groove, and the telescopic sliding rod is hinged to the inner limit rod.

[0013] As a further optimization solution of the present invention, a plurality of rotation grooves are provided on the bottom plate, and a plurality of cavities are provided in the bottom plate, and the rotation grooves are connected with corresponding limiting sliding grooves through the cavities.

[0014] As a further optimization scheme of the present invention, the driving assembly includes an adjusting wheel movably connected to the inner wall of the rotating groove, a first connecting rod fixedly connected to one end of the wheel axle of the adjusting wheel, and a first ratchet fixedly connected to one end of the first connecting rod, one end of the first connecting rod and the first ratchet are both located in the cavity.

[0015] As a further optimization scheme of the present invention, the quantitative torque transmission assembly includes a second connecting rod movably connected to the inner wall of the cavity, a second ratchet slidably connected to one end of the second connecting rod, and a first spring connected to the flat end of the second ratchet, the other end of the first spring contacts the inner wall of the cavity, and the second ratchet engages with the first ratchet.

[0016] A multi-layer circuit board processing method, using the multi-layer circuit board processing device as described above, comprises the following steps:

[0017] Step S1, driving the corresponding X-axis limiting mechanism and the Y-axis limiting mechanism to move toward the four corners of the base plate through the corresponding linear drive mechanism;

[0018] Step S2, after laying a partition on the bottom plate, laying copper foil on the partition, and after laying the copper foil, laying the laminated multi-layer circuit board on the copper foil;

[0019] Step S3, driving the corresponding X-axis limiting mechanism and the Y-axis limiting mechanism to move toward the multi-layer circuit board through the corresponding linear driving mechanism, driving the corresponding inner limiting mechanism to move in the same direction and distance through the X-axis limiting mechanism and the Y-axis limiting mechanism, so that the multi-layer circuit board is limited to the center position of the bottom plate, and then driving the X-axis limiting mechanism and the Y-axis limiting mechanism to move toward the four corners of the bottom plate through the linear driving mechanism;

[0020] Step S4, laying copper foil, a partition and copper foil in sequence on the multi-layer circuit board located at the center of the bottom plate, and then laying the multi-layer circuit board again, and repeating step S after laying the multi-layer circuit board until the number of stacked layers of the multi-layer circuit board reaches a set value;

[0021] Step S5, after copper foil and separators are laid in sequence on the top multi-layer circuit board, they are sent into a vacuum pressing device for pressing.

[0022] The beneficial effects of the present invention are as follows: the present invention adds a plurality of internal limit mechanisms to the original pressing mold, which can limit the plurality of multi-layer circuit boards spaced apart from each other to the center position of the bottom plate without affecting the already stacked multi-layer circuit boards and the corresponding partitions and copper foils, and is suitable for circuit boards of different specifications, and can also be used for the pressing process of special-shaped circuit boards. There is no need to open corresponding pin connection holes on the mold according to the specifications of the circuit boards, and there is no need to punch the partitions and copper foils, which effectively reduces the cost and efficiency of pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 The present invention Figure 1 Partial 3D cross-sectional view at AA in the middle;

[0025] Figure 3 The present invention Figure 1 Magnified view at B in the middle;

[0026] Figure 4 The present invention Figure 2 Enlarged view at center C;

[0027] Figure 5 The present invention Figure 2 Magnified view at D in the middle;

[0028] Figure 6 This is a diagram showing the cooperation between the Y-axis inner limit mechanism and the X-axis inner limit mechanism of the present invention;

[0029] Figure 7 The present invention Figure 6 Enlarged view at E in the middle;

[0030] Figure 8 This is a diagram showing the matching of the linear drive mechanism and the X-axis limiting mechanism of the present invention;

[0031] Fig. 9 The present invention Figure 8 Enlarged view at F in the middle;

[0032] Fig.10 It is a matching view of the first ratchet and the second ratchet of the present invention.

[0033] In the figure: 1, bottom plate; 101, slot; 102, limit slide; 21, X-axis limit mechanism; 2101, first C-shaped limit block; 2102, first multi-section elastic telescopic rod; 2103, first limit slider; 22, Y-axis limit mechanism; 2201, second C-shaped limit block; 2202, second multi-section elastic telescopic rod; 2203, second limit slider; 2204, second convex slide; 3, straight line Driving mechanism; 301, adjusting wheel; 302, first connecting rod; 303, first ratchet; 304, second connecting rod; 305, second ratchet; 306, first spring; 307, screw; 4, inner limiting mechanism; 401, long slider; 402, telescopic sliding rod; 403, inner limiting rod; 404, second spring; 405, third spring; 406, fourth spring; 6, multi-layer circuit board; 7, partition; 8, copper foil. DETAILED DESCRIPTION

[0034] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only intended to enable those skilled in the art to better understand and implement the subject matter described herein. In addition, the features described relative to some examples may also be combined in other examples.

[0035] like Figure 1-Figure 10 As shown, a multi-layer circuit board processing device includes a base plate 1, a plurality of X-axis limiting mechanisms 21 symmetrically slidably connected to the base plate 1 along the Y-axis, a plurality of Y-axis limiting mechanisms 22 symmetrically slidably connected to the base plate 1 along the X-axis, a plurality of inner limiting mechanisms 4 respectively connected between two symmetrically distributed Y-axis limiting mechanisms 22 and between two symmetrically distributed X-axis limiting mechanisms 21, and a plurality of linear drive mechanisms 3 arranged inside the base plate 1, wherein the plurality of linear drive mechanisms 3 are respectively matched with the plurality of X-axis limiting mechanisms 21 and the plurality of Y-axis limiting mechanisms 22, and the linear drive mechanisms 3 are used to drive the corresponding X-axis limiting mechanisms 21 to move along the Y-axis or drive the corresponding Y-axis limiting mechanisms 22 to move along the X-axis;

[0036] The inner limit mechanism 4 includes a plurality of symmetrically arranged first elastic support components, an adjustable sliding component slidably connected to the first elastic support components, an inner limit rod 403 connected between two symmetrically arranged adjustable sliding components, and a fourth spring 406 connected between two adjacent first elastic support components, and both ends of the inner limit rod 403 are respectively hinged to the corresponding adjustable sliding components;

[0037] The linear drive mechanism 3 includes a drive assembly, a quantitative torque transmission assembly coaxially arranged with the drive assembly, and a screw 307 fixedly connected to one end of the quantitative torque transmission assembly. The screw 307 is threadedly connected to the corresponding X-axis limit mechanism 21 or Y-axis limit mechanism 22.

[0038] It should be noted that before laminating the multi-layer circuit board 5, copper foil 7 needs to be laid on the upper and lower surfaces of the multi-layer circuit board 5. In order to improve the laminating efficiency, multiple multi-layer circuit boards 5 are often cross-laminated with corresponding copper foil 7 layers and then laminarized uniformly. The specific laminating process is as follows:

[0039] Step S1, driving the corresponding X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22 to move toward the four corners of the base plate 1 through the corresponding linear drive mechanism 3;

[0040] Step S2, after laying the partition 6 on the bottom plate 1, laying the copper foil 7 on the partition 6, and after laying the copper foil 7, laying the laminated multilayer circuit board 5 on the copper foil 7;

[0041] Step S3, driving the corresponding X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22 to move toward the multi-layer circuit board 5 through the corresponding linear drive mechanism 3, and driving the corresponding inner limiting mechanism 4 to move in the same direction and distance through the X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22, so that the multi-layer circuit board 5 is limited to the center position of the bottom plate 1, and then driving the X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22 to move toward the four corners of the bottom plate 1 through the linear drive mechanism 3;

[0042] Step S4, laying copper foil 7, partition 6 and copper foil 7 in sequence on the multilayer circuit board 5 located at the center of the bottom plate 1, and then laying the multilayer circuit board 5 again. After laying the multilayer circuit board 5, repeat step S3 until the number of stacked layers of the multilayer circuit board 5 reaches a set value;

[0043] Step S5, after copper foil 7 and separator 6 are laid in sequence on the top multi-layer circuit board 5, they are sent into a vacuum pressing device for pressing treatment.

[0044] Among them, it should be noted that the partition 6 and the copper foil 7 are both made of flexible materials. During the laying process, the four corner areas will be blocked by the vertically cross-distributed internal limit mechanism 4 from their laying path, but the four corners of the partition 6 and the copper foil 7 can be bent so that the right-angle ends can pass through the bottom of the vertically cross-blocking area. Similarly, when taking it out, you can just take it out directly. The four corners of the copper foil 7 are the areas that need to be trimmed later.

[0045] Among them, Figure 1 and Figure 3As shown, a plurality of slots 101 and a plurality of limiting grooves 102 are provided on the base plate 1, and the plurality of limiting grooves 102 are respectively distributed along the X-axis direction and the Y-axis direction. The X-axis limiting mechanism 21 is slidably connected in the limiting groove 102 distributed along the Y-axis direction, and the Y-axis limiting mechanism 22 is slidably connected in the limiting groove 102 distributed along the X-axis direction. The plurality of slots 101 are symmetrically distributed on both sides of the limiting groove 102, and the slots 101 and the corresponding limiting grooves 102 have the same distribution direction.

[0046] It should be noted that a plurality of limiting grooves 102 are distributed at the four corners of a rectangle, and two adjacent limiting grooves 102 are distributed vertically and parallel to the sides of the adjacent rectangle, that is, they are distributed along the X-axis and the Y-axis directions. The limiting grooves 102 distributed upwardly along the Y-axis direction can allow the corresponding X-axis limiting mechanism 21 to slide along the Y-axis direction, and the X-axis limiting mechanism 21 can limit the X-axis movement stroke of the partition 6. Similarly, the limiting grooves 102 distributed upwardly along the X-axis direction can allow the Y-axis limiting mechanism 22 to slide along the X-axis direction, and the Y-axis limiting mechanism 22 can limit the Y-axis movement stroke of the partition 6. In this way, the partition 6 can be limited on the base plate 1. As long as the area of ​​the circuit board does not exceed the partition 6, there is no need to redesign and manufacture the pressing mold.

[0047] Among them, Figure 3 , Figure 4 , Figure 6 and Figure 8 As shown, the X-axis limiting mechanism 21 includes a first C-shaped limiting block 2101, a first multi-section elastic telescopic rod 2102 fixedly connected to the first C-shaped limiting block 2101, a first limiting slider 2103 fixedly connected to the other end of the first multi-section elastic telescopic rod 2102, and a first convex groove arranged on a side wall of the first C-shaped limiting block 2101, and the slot 101 is matched with the first C-shaped limiting block 2101.

[0048] The Y-axis limiting mechanism 22 includes a second C-shaped limiting block 2201, a second multi-section elastic telescopic rod 2202 fixedly connected to the second C-shaped limiting block 2201, a second limiting slider 2203 fixedly connected to the other end of the second multi-section elastic telescopic rod 2202, and a second convex groove 2204 arranged on a side wall of the second C-shaped limiting block 2201, and the slot 101 is matched with the second C-shaped limiting block 2201.

[0049] It should be noted that, as mentioned above, the first limit slider 2103 in the X-axis limit mechanism 21 is slidably connected to the limit slide groove 102 distributed along the Y-axis. Under the drive of the corresponding linear drive mechanism 3, the first limit slider 2103 can move along the Y-axis. When the first limit slider 2103 moves, it can drive the first multi-section elastic telescopic rod 2102 and the first C-shaped limit block 2101 to move in the same direction and at the same distance. When the first C-shaped limit block 2101 moves, it can drive the inner limit block connected thereto to move. The mechanism 4 moves in the same direction and distance, and when the inner limit mechanism 4 contacts the multi-layer circuit board 5 laid on the corresponding layer, a thrust of a set value can be applied to the multi-layer circuit board 5. When two symmetrically arranged inner limit mechanisms 4 apply a thrust of a set value to the multi-layer circuit board 5, the moving stroke of the inner limit mechanism 4 is terminated, and no excessive extrusion is caused to the multi-layer circuit board 5. When it is terminated, the position of the multi-layer circuit board 5 is at the center position of the base plate 1. Similarly, the principle of the Y-axis limit mechanism 22 is the same as that of the X-axis limit mechanism 21.

[0050] Among them, Figure 2 and Figure 4 The first elastic support assembly shown includes two parallel long sliders 401, a third spring 405 connected between the two long sliders 401, and a sliding groove arranged on one side wall of the long slider 401. The long slider 401 is slidably connected to the inner wall of the first convex sliding groove or the second convex sliding groove 2204.

[0051] The adjustable sliding assembly includes a telescopic sliding rod 402 slidably connected to the inner wall of the sliding groove and a second spring 404 connected between the telescopic sliding rod 402 and the inner wall of the first convex sliding groove or the second convex sliding groove 2204. The telescopic sliding rod 402 is hinged to the inner limit rod 403.

[0052] It should be noted that, as mentioned above, when the inner limit mechanism 4 follows the movement of the first C-shaped limit block 2101 or the second C-shaped limit block 2201, the first C-shaped limit block 2101 or the second C-shaped limit block 2201 drives the long slider 401 to move in the same direction and distance. When the long slider 401 moves, the second spring 404 drives the telescopic sliding rod 402 and the inner limit rod 403 connected to the telescopic sliding rod 402 to move in the same direction and distance. When the inner limit rod 403 contacts the multi-layer circuit board 5, the two inner limit rods 403 can drive the multi-layer circuit board 5 to move in the same direction and distance. The inner limit rods 403 here are in groups of two, but the number can be designed or changed accordingly according to actual conditions. The rod 403 can be disassembled and replaced with an adapted inner limit rod 403, which can be applicable to a multi-layer circuit board 5 with different layers of inner plates stacked. At this time, the second spring 404 is deformed by force, and the elastic force generated is the thrust for pushing the multi-layer circuit board 5 to move. When the symmetrically arranged inner limit plates are in contact with the multi-layer circuit board 5 and generate thrusts of the same magnitude and opposite directions on the multi-layer circuit board 5, the moving stroke of the multi-layer circuit board 5 ends and is located at the center of the bottom plate 1. The inner limit plates are symmetrically distributed on both sides of the multi-layer circuit board 5, so that each layer of the multi-layer circuit board 5 is located at the center of the bottom plate 1, thereby avoiding the uneven pressure transmission due to position deviation between the multi-layer circuit boards 5 distributed up and down;

[0053] When a circuit board with an irregular shape, such as a trapezoid with a bevel, appears, the inner limit rod 403 fits onto the bevel, and the telescopic sliding rods 402 connected to the two ends of the correspondingly inclined inner limit rod 403 are lengthened accordingly to adapt to the inclination of the inner limit rod 403.

[0054] Among them, Figure 1 , Figure 2 , Figure 3 , Figure 8 , Fig. 9 and Fig.10 As shown, a plurality of rotating grooves are provided on the bottom plate 1 , and a plurality of cavities are provided inside the bottom plate 1 , and the rotating grooves are connected with the corresponding limiting sliding grooves 102 through the cavities.

[0055] The driving assembly includes an adjusting wheel 301 movably connected to the inner wall of the rotating groove, a first connecting rod 302 fixedly connected to one end of the wheel shaft of the adjusting wheel 301, and a first ratchet 303 fixedly connected to one end of the first connecting rod 302. One end of the first connecting rod 302 and the first ratchet 303 are both located in the cavity. A part of the adjusting wheel 301 is exposed outside the rotating groove, which can be directly rotated by the staff.

[0056] The quantitative torque transmission assembly includes a second connecting rod 304 movably connected to the inner wall of the cavity, a second ratchet 305 slidably connected to one end of the second connecting rod 304, and a first spring 306 connected to the flat end of the second ratchet 305, the other end of the first spring 306 contacts the inner wall of the cavity, and the second ratchet 305 is meshed with the first ratchet 303.

[0057] It should be noted that when the corresponding X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22 are driven to move by the linear drive mechanism 3, in order to control the thrust exerted by the inner limiting rod 403 on the multi-layer circuit board 5 within a set range, a quantitative torque transmission component is provided. When the movement of the X-axis limiting mechanism 21 and the Y-axis limiting mechanism 22 is adjusted, the adjusting wheel 301 is rotated. When the adjusting wheel 301 rotates, it drives the first connecting rod 302 and the first ratchet 303 to rotate in the same direction and at the same angle. The friction torque between the first ratchet 303 and the second ratchet 305 is provided by the first spring 306. When the resistance torque on the second connecting rod 304 and the screw 307 does not exceed the friction torque, the first The ratchet 303 can drive the second ratchet 305 to rotate, and when the elastic force generated by the deformation of the second spring 404 reaches a set value, the resistance torque applied by the first limit slider 2103 or the second limit slider 2203 on the screw 307 reaches a set value, that is, after exceeding the friction torque, the second ratchet 305 can no longer continue to rotate with the first ratchet 303, and is in a state of intermittently compressing the first spring 306, and the first ratchet 303 is in an idling state. At this time, the intermittent impact sound generated between the first ratchet 303 and the second ratchet 305 can clearly indicate the signal that the position adjustment of the multi-layer circuit board 5 is completed, thereby effectively improving the accuracy of the multi-layer circuit board 5 when it is stacked.

[0058] The present embodiment is described above, but the present embodiment is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is merely illustrative and not restrictive. Under the guidance of the present embodiment, ordinary technicians in this field can also make many forms, which are all within the protection of the present embodiment.

Claims

1. A multi-layer circuit board processing device, characterized in that: The invention comprises a base plate (1), a plurality of X-axis limiting mechanisms (21) symmetrically slidably connected to the base plate (1) along the Y-axis, a plurality of Y-axis limiting mechanisms (22) symmetrically slidably connected to the base plate (1) along the X-axis, a plurality of internal limiting mechanisms (4) respectively connected between two symmetrically distributed Y-axis limiting mechanisms (22) and between two symmetrically distributed X-axis limiting mechanisms (21), and a plurality of linear drive mechanisms (3) arranged inside the base plate (1), wherein the plurality of linear drive mechanisms (3) are respectively matched with the plurality of X-axis limiting mechanisms (21) and the plurality of Y-axis limiting mechanisms (22), and the linear drive mechanisms (3) are used to drive the corresponding X-axis limiting mechanisms (21) to move along the Y-axis or drive the corresponding Y-axis limiting mechanisms (22) to move along the X-axis; The inner limit mechanism (4) comprises a plurality of symmetrically arranged first elastic support components, an adjustable sliding component slidably connected to the first elastic support components, an inner limit rod (403) connected between two symmetrically arranged adjustable sliding components, and a fourth spring (406) connected between two adjacent first elastic support components, wherein both ends of the inner limit rod (403) are respectively hinged to the corresponding adjustable sliding components; The linear drive mechanism (3) comprises a drive assembly, a quantitative torque transmission assembly coaxially arranged with the drive assembly, and a screw (307) fixedly connected to one end of the quantitative torque transmission assembly, wherein the screw (307) is threadedly connected to a correspondingly arranged X-axis limiting mechanism (21) or a Y-axis limiting mechanism (22); The X-axis limiting mechanism (21) comprises a first C-shaped limiting block (2101), a first multi-section elastic telescopic rod (2102) fixedly connected to the first C-shaped limiting block (2101), a first limiting sliding block (2103) fixedly connected to the other end of the first multi-section elastic telescopic rod (2102), and a first convex sliding groove provided on a side wall of the first C-shaped limiting block (2101); The Y-axis limiting mechanism (22) comprises a second C-shaped limiting block (2201), a second multi-section elastic telescopic rod (2202) fixedly connected to the second C-shaped limiting block (2201), a second limiting sliding block (2203) fixedly connected to the other end of the second multi-section elastic telescopic rod (2202), and a second convex-shaped sliding groove (2204) provided on a side wall of the second C-shaped limiting block (2201); The first elastic support assembly comprises two parallel long sliders (401), a third spring (405) connected between the two long sliders (401), and a sliding groove provided on a side wall of the long slider (401); the long slider (401) is slidably connected to the inner wall of the first convex-shaped sliding groove or the second convex-shaped sliding groove (2204).

2. A multi-layer circuit board processing device according to claim 1, characterized in that: The bottom plate (1) is provided with a plurality of slots (101) and a plurality of limiting slide grooves (102), the plurality of limiting slide grooves (102) are respectively distributed along the X-axis direction and the Y-axis direction, the X-axis limiting mechanism (21) is slidably connected in the limiting slide groove (102) distributed along the Y-axis direction, the Y-axis limiting mechanism (22) is slidably connected in the limiting slide groove (102) distributed along the X-axis direction, the plurality of slots (101) are symmetrically distributed on both sides of the limiting slide groove (102), the slots (101) and the corresponding limiting slide grooves (102) are distributed in the same direction, the slots (101) are matched with the first C-shaped limiting block (2101), and the slots (101) are matched with the second C-shaped limiting block (2201).

3. A multi-layer circuit board processing device according to claim 2, characterized in that: The adjustable sliding assembly comprises a telescopic sliding rod (402) slidably connected to the inner wall of the sliding groove, and a second spring (404) connected between the telescopic sliding rod (402) and the inner wall of the first convex-shaped sliding groove or the second convex-shaped sliding groove (2204); the telescopic sliding rod (402) is hinged to the inner limit rod (403).

4. A multi-layer circuit board processing device according to claim 3, characterized in that: The bottom plate (1) is provided with a plurality of rotation grooves, and the bottom plate (1) is provided with a plurality of cavities, and the rotation grooves are connected to corresponding limiting sliding grooves (102) through the cavities.

5. A multi-layer circuit board processing device according to claim 4, characterized in that: The driving assembly comprises an adjusting wheel (301) movably connected to the inner wall of the rotating groove, a first connecting rod (302) fixedly connected to one end of the wheel shaft of the adjusting wheel (301), and a first ratchet (303) fixedly connected to one end of the first connecting rod (302), one end of the first connecting rod (302) and the first ratchet (303) are both located in the cavity.

6. A multi-layer circuit board processing device according to claim 5, characterized in that: The quantitative torque transmission assembly comprises a second connecting rod (304) movably connected to the inner wall of the cavity, a second ratchet (305) slidably connected to one end of the second connecting rod (304), and a first spring (306) connected to the flat end of the second ratchet (305), the other end of the first spring (306) contacts the inner wall of the cavity, and the second ratchet (305) is meshed with the first ratchet (303).

7. A method for processing a multilayer circuit board, characterized in that: The multilayer circuit board processing device according to any one of claims 1 to 6 comprises the following steps: Step S1, driving the corresponding X-axis limiting mechanism (21) and the Y-axis limiting mechanism (22) to move toward the four corners of the base plate (1) through the corresponding linear drive mechanism (3); Step S2, after laying a partition (6) on the base plate (1), laying a copper foil (7) on the partition (6), and after laying the copper foil (7), laying the laminated multilayer circuit board (5) on the copper foil (7); Step S3, driving the corresponding X-axis limiting mechanism (21) and the Y-axis limiting mechanism (22) to move toward the multi-layer circuit board (5) through the corresponding linear drive mechanism (3), and driving the corresponding inner limiting mechanism (4) to move in the same direction and distance through the X-axis limiting mechanism (21) and the Y-axis limiting mechanism (22), so that the multi-layer circuit board (5) is limited to the center position of the base plate (1), and then driving the X-axis limiting mechanism (21) and the Y-axis limiting mechanism (22) to move toward the four corners of the base plate (1) through the linear drive mechanism (3); Step S4, laying copper foil (7), a partition (6) and copper foil (7) in sequence on the multilayer circuit board (5) located at the center of the bottom plate (1), and then laying the multilayer circuit board (5) again. After laying the multilayer circuit board (5), repeating step S3 until the number of stacked layers of the multilayer circuit board (5) reaches a set value; Step S5: After copper foil (7) and a partition (6) are laid in sequence on the top multilayer circuit board (5), they are sent into a vacuum pressing device for pressing.

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