A laser device

Abstract

The specification discloses a laser device, and relates to the field of semiconductor manufacturing technology.The laser device comprises a heat-conducting substrate, a cavity enclosure is arranged around the heat-conducting substrate, a three-layer step structure is arranged inside the cavity enclosure, the bottommost step structure is provided with a through hole penetrating from top to bottom, a laser diode chip is arranged in the through hole, a collimating lens is arranged on the first layer step structure from bottom to top, a light homogenizing lens is arranged on the second layer step structure, and a color converter is fixed on the third layer step structure, wherein the color converter comprises a support body, inorganic fluorescent material and an upper transparent substrate, the inorganic fluorescent material is filled in a through hole arranged on the support body, the upper transparent substrate is fixed on the upper side of the support body and the inorganic fluorescent material, and the lower side of the support body is fixed on the third layer step structure from bottom to top of the cavity enclosure.The laser device has the advantages that the laser energy distribution irradiated to the fluorescent material is uniform through the collimating lens and the light homogenizing lens, the light color quality is improved, and a regular small-size packaging structure is formed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a laser device. BACKGROUND

[0002] At present, compared with the existing light emitting diode (LED) lighting source technology, the laser diode (LD) lighting source technology not only avoids the problem of efficiency drop, but also has the advantages of super power, super brightness, high collimation, long irradiation distance, etc., and can be applied to special lighting, automobile headlamps, projection display, medical health, visible light communication and other fields. At present, laser lighting sources often use laser fluorescence technology, that is, a blue light LD chip excites a remote fluorescence conversion material. Since the blue light LD has high light power density and small radiation spot, the fluorescence conversion material has to withstand high laser radiation energy and fluorescence conversion heat, which puts higher requirements on the heat resistance of the fluorescence conversion material.

[0003] In the prior art, inorganic fluorescence conversion materials are generally used to replace traditional organic fluorescence conversion materials to package blue light LDs, so as to avoid irreversible problems such as ablation and carbonization of organic materials under laser excitation.

[0004] However, in the existing fluorescence conversion visible light, the laser light source only has different light color illumination effects, and the light color quality is poor, and at the same time, it does not realize the same small size device level packaging as the LED device. The current laser lighting source is difficult to meet the application requirements in the miniaturization and integration scene due to the defects of light color and packaging. SUMMARY

[0005] The laser device provided by the embodiments of the present application is used to partially solve the problems existing in the prior art.

[0006] The embodiments of the present application adopt the following technical solutions:

[0007] The present specification provides a laser device, comprising:

[0008] A heat-conducting substrate fixedly installed with a laser diode chip;

[0009] A heat-conducting substrate, a cavity dam is arranged around the heat-conducting substrate, a three-layer stepped structure is arranged inside the cavity dam, and the bottommost stepped structure is provided with a through hole penetrating from top to bottom;

[0010] A collimating lens is placed on the first layer stepped structure from bottom to top of the cavity dam, and a laser diode chip is arranged in a cavity formed by the heat-conducting substrate, the through hole of the bottommost stepped structure of the cavity dam and the collimating lens; the collimating lens is used for collimating the laser emitted by the laser diode chip;

[0011] A homogenizing lens is arranged on the second step structure from bottom to top of the cavity enclosure to homogenize the collimated laser beam energy;

[0012] The color converter comprises a support, an inorganic fluorescent body, and an upper transparent substrate; the support is provided with a through hole, the inorganic fluorescent body is filled in the through hole of the support, the upper transparent substrate is fixed on the upper side of the support and the inorganic fluorescent body, and the lower side of the support is fixed on the third step structure from bottom to top of the cavity enclosure; the inorganic fluorescent body is used for emitting light under excitation of homogenized laser; and the transparent substrate is used for heat dissipation of the inorganic fluorescent body.

[0013] Optionally, the color converter further comprises a reflective coating arranged on the side wall of the through hole of the support.

[0014] The reflective coating is a micro-nano particle doped coating, which is used for reflecting backscattered light of the inorganic fluorescent body.

[0015] Optionally, the support is a high-thermal-conductivity ceramic layer or a metal layer, which is used for lateral heat conduction of the inorganic fluorescent body.

[0016] Optionally, the through hole of the support is a reverse taper structure, which is used for providing support force for the inorganic fluorescent body in the through hole.

[0017] Optionally, the upper transparent substrate is a sapphire sheet or a diamond sheet, which is used for surface heat conduction of the inorganic fluorescent body.

[0018] Optionally, the upper surface of the upper transparent substrate is a plane or a micro-nano structure, which is used for forward light extraction of the inorganic fluorescent body.

[0019] Optionally, the inorganic fluorescent body is a fluorescent glass or a fluorescent ceramic of different colors, and the inorganic fluorescent body is at least partially filled in the through hole of the support.

[0020] Optionally, the positions of the collimating lens and the homogenizing lens are adjustable.

[0021] Optionally, the heat-conducting substrate, the color converter, and the cavity enclosure form a closed cavity structure, which is used for isolating external environment from interfering with the laser device.

[0022] Optionally, the color converter further comprises a lower transparent substrate fixed on the lower side of the support, which carries the support and is fixed on the third step structure from bottom to top of the cavity enclosure; and the lower transparent substrate is used for surface heat conduction of the inorganic fluorescent body.

[0023] The above at least one technical scheme adopted by the embodiments of the present specification can achieve the following beneficial effects:

[0024] The application comprises a heat-conducting substrate, a cavity dam is arranged around the heat-conducting substrate, a three-layer step structure is arranged inside the cavity dam, and the bottommost step structure is provided with a through hole penetrating from top to bottom, a laser diode chip is placed in the through hole, a collimating lens is placed on the first layer step structure from bottom to top, a uniform light lens is placed on the second layer step structure, and a color converter is fixed on the third layer step structure. The color converter comprises a support body, inorganic fluorescent powder arranged in the through hole of the support body, and an upper transparent substrate covering the inorganic fluorescent powder. The laser emitted by the laser diode chip is collimated through the collimating lens, and the energy of the collimated laser beam is homogenized through the uniform light lens, so that the laser energy of the fluorescent material irradiated on the color converter is uniformly distributed, the light color quality is improved, and at the same time, a regular miniaturized packaging structure is formed through the upper transparent substrate, the cavity dam, the support body and the heat-conducting substrate, which takes into account the heat dissipation, light color quality and miniaturization of the laser device. BRIEF DESCRIPTION OF DRAWINGS

[0025] The drawings described herein are used to provide further understanding of the present application, constitute a part of the present application, the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0026] Figure 1 A laser device schematic diagram is provided for the present specification;

[0027] Figure 2 An improved laser device schematic diagram is provided for the present specification. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the present specification clearer, the technical scheme of the present application will be described in detail below in combination with the specific embodiments of the present specification and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present specification, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0029] The technical scheme provided by each embodiment of the present application will be described in detail below in combination with the drawings.

[0030] At present, the existing fluorescent conversion visible light laser light source only has different light color illumination effects, and still has problems of low luminous brightness, poor light color quality, poor heat dissipation performance, large volume and the like, and has not realized the same small size device level packaging as the LED device, which limits the miniaturization and integration application of the laser illumination light source.

[0031] Figure 1 A laser device schematic diagram is provided in the present specification. By Figure 1It can be seen that the laser device comprises a heat-conducting substrate 11, a laser diode chip 12, a cavity enclosure 13, a collimating lens 19, a light homogenizing lens 18 and a color converter.

[0032] Specifically, the heat-conducting substrate 11 is surrounded by the cavity enclosure 13, which is internally provided with a three-layer stepped structure, and the bottommost layer of the stepped structure is provided with a through hole penetrating from top to bottom.

[0033] The collimating lens 19 is placed on the first layer of the stepped structure from bottom to top of the cavity enclosure 13, and the laser diode chip 12 is arranged in the cavity formed by the heat-conducting substrate 11, the through hole of the bottommost layer of the stepped structure of the cavity enclosure 13 and the collimating lens 19. The collimating lens 19 is used to collimate the laser emitted by the laser diode chip 12. The light homogenizing lens 18 is placed on the second layer of the stepped structure from bottom to top of the cavity enclosure 13, which is used to homogenize the energy of the collimated laser beam, so as to make the subsequent laser irradiated to the fluorescent material uniformly distributed. The color converter is fixed on the third layer of the stepped structure from bottom to top of the cavity enclosure 13.

[0034] The color converter comprises a support body 14, an inorganic fluorescent material 16 and an upper transparent substrate 15. The support body 14 is provided with a through hole, the inorganic fluorescent material 16 is filled in the through hole of the support body 14, and the upper transparent substrate 15 is fixed on the upper side of the support body 14 and the inorganic fluorescent material 16. The lower side of the support body 14 is fixed on the third layer of the stepped structure from bottom to top of the cavity enclosure 13. The inorganic fluorescent material 16 is used to emit light under the excitation of the homogenized laser, and the transparent substrate 15 is used for heat dissipation of the inorganic fluorescent material 16.

[0035] The laser emitted by the laser diode chip 12 can be irradiated on the inorganic fluorescent material 16 through the collimating lens 19 and the light homogenizing lens 18 in turn, so as to obtain high-brightness visible light through laser fluorescence conversion.

[0036] In addition, in one or more embodiments of the present specification, the color converter can further comprise a reflective coating 17 arranged on the side wall of the through hole of the support body 14. The reflective coating 17 can be a micro-nanoparticle doped coating, which is used to reflect the backscattered light of the inorganic fluorescent material 16.

[0037] Further, in one or more embodiments of the present specification, the support body 14 can be a high-thermal-conductivity ceramic layer or a metal layer, which is used for lateral heat conduction of the inorganic fluorescent material 16, so as to improve the heat dissipation performance of the inorganic fluorescent material 16.

[0038] Still further, in one or more embodiments of the present specification, the through hole of the support body 14 can be a reverse taper structure, which is used to provide support force for the inorganic fluorescent material 16 in the through hole thereof, so as to prevent the inorganic fluorescent material 16 from falling down in the through hole. Figure 1 It can be seen that the support body 14 can provide the inorganic fluorescent material 16 in the through hole thereof with support force inclined to the central axis of the through hole, so as to prevent the inorganic fluorescent material 16 from falling down in the through hole.

[0039] In addition, in one or more embodiments of the present disclosure, the upper transparent substrate 15 can be a sapphire sheet or a diamond sheet for heat conduction on the upper surface of the inorganic fluorescent material 16, further improving the heat dissipation performance of the inorganic fluorescent material 16.

[0040] Further, in one or more embodiments of the present disclosure, the color converter can further include a lower transparent substrate 20, as shown in FIG. 1. Figure 2 Figure 2 In one or more embodiments of the present disclosure, an improved laser device is shown, which includes a color converter including a support 14, an upper transparent substrate 15 and a lower transparent substrate 20, an inorganic fluorescent material 16 and a reflective coating 17, wherein the support 14 has a through hole, the reflective coating 17 is located on the sidewall of the through hole of the support 14, the inorganic fluorescent material 16 is filled in the through hole of the support 14, the upper transparent substrate 15a is fixed on the upper surface of the support 14 and the inorganic fluorescent material 16, and the lower transparent substrate 20 is fixed on the lower surface of the support 14 and the inorganic fluorescent material 16.

[0041] Further, in one or more embodiments of the present disclosure, the upper surface of the upper transparent substrate 25 can be a micro-nano structure, as shown in FIG. 2, wherein the plurality of triangles 15b on the upper part of the upper transparent substrate 15 represent that the surface of the upper transparent substrate 15a is a micro-nano structure. The micro-nano structure is used for the forward light extraction of the inorganic fluorescent material 16. Of course, the upper surface of the upper transparent substrate 15 can also be a planar structure. Figure 2

[0042] In addition, in one or more embodiments of the present disclosure, the inorganic fluorescent material 16 can be a fluorescent glass or a fluorescent ceramic of different colors, and the inorganic fluorescent material 16 is at least partially filled in the through hole of the support 14. Thus, based on the fluorescent glass or the fluorescent ceramic of different colors, different colors of light can be emitted under the irradiation of the laser, and the specific color to be used can be determined as needed, which is not limited in the present disclosure.

[0043] Further, in one or more embodiments of the present disclosure, the positions of the collimating lens 19 and the homogenizing lens 18 can be adjusted, the collimating lens 19 is used to collimate the laser emitted by the laser diode chip 12, and the homogenizing lens 18 is used to homogenize the laser emitted by the laser diode chip 12.

[0044] In addition, in one or more embodiments of the present disclosure, the heat-conducting substrate 11, the color converter and the cavity dam 13 form a closed cavity structure for isolating the external environment from interfering with the laser device, so as to improve the long-term reliability of the laser device.

[0045] Further, in one or more embodiments of the present disclosure, the LD chip can be a blue or ultraviolet LD chip.

[0046] ​​It should also be noted that the terms "comprise", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0047] Various embodiments in the specification are described in progressive manner, and the same or similar parts between various embodiments can be mutually referred to, and each embodiment focuses on the difference from other embodiments.

[0048] The above only describes the embodiments of the specification and is not intended to limit the specification. The specification can have various changes and modifications for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the specification shall be included in the scope of claims of the specification.

Claims

1. A laser device, characterized by, The application relates to a laser device, which comprises the following parts: a heat-conducting substrate (11) with a cavity enclosure (13) arranged thereon, wherein a three-layer step structure is arranged inside the cavity enclosure (13), and the bottom layer of the step structure is provided with a through hole penetrating from top to bottom; a collimating lens (19) arranged on the first layer of the step structure from bottom to top of the cavity enclosure (13), wherein a laser diode chip (12) is arranged in a cavity formed by the heat-conducting substrate (11), the through hole of the bottom layer of the step structure of the cavity enclosure (13) and the collimating lens (19), and the collimating lens (19) is used for collimating the laser emitted by the laser diode chip (12); a light homogenizing lens (18) arranged on the second layer of the step structure from bottom to top of the cavity enclosure (13) and used for homogenizing the energy of the collimated laser beam; a color converter, which comprises a support body (14), inorganic fluorescent material (16) and an upper transparent substrate (15); the support body (14) is provided with a through hole, the inorganic fluorescent material (16) is filled in the through hole of the support body (14), the upper transparent substrate (15) is fixed on the upper side of the support body (14) and the inorganic fluorescent material (16), and the lower side of the support body (14) is fixed on the third layer of the step structure from bottom to top of the cavity enclosure (13); the inorganic fluorescent material (16) is used for emitting light under the excitation of the homogenized laser; the transparent substrate (15) is used for heat dissipation of the inorganic fluorescent material (16).

2. The laser device according to claim 1, wherein the color converter further comprises a reflective coating (17) arranged on the side wall of the through hole of the support body (14); the reflective coating (17) is a micro-nano particle doped coating and is used for reflecting backscattered light of the inorganic fluorescent material (16).

3. The laser device of claim 1, wherein, the support body (14) is a high-heat-conducting ceramic layer or a metal layer and is used for lateral heat conduction of the inorganic fluorescent material (16).

4. The laser device of claim 1, wherein, the through hole of the support body (14) is a reverse taper structure and is used for providing support force for the inorganic fluorescent material (16) in the through hole.

5. The laser device of claim 1, wherein, the upper transparent substrate (15) is a sapphire sheet or a diamond sheet and is used for surface heat conduction of the inorganic fluorescent material (16).

6. The laser device of claim 1, wherein, the upper surface of the upper transparent substrate (15) is a plane or a micro-nano structure and is used for forward light extraction of the inorganic fluorescent material (16).

7. The laser device of claim 1, wherein, the inorganic fluorescent material (16) is different color fluorescent glass or fluorescent ceramic and is at least partially filled in the through hole of the support body (14).

8. The laser device of claim 1, wherein, the positions of the collimating lens (19) and the light homogenizing lens (18) are adjustable.

9. The laser device of claim 1, wherein, the heat-conducting substrate (11), the color converter and the cavity enclosure (13) form a closed cavity structure and are used for isolating the laser device from the external environment.

10. The laser device of claim 1, wherein, the color converter further comprises a lower transparent substrate (20) fixed on the lower side of the support body (14), used for bearing the support body (14) and fixed on the third layer of the step structure from bottom to top of the cavity enclosure (13); and the lower transparent substrate (20) is used for surface heat conduction of the inorganic fluorescent material (16).

Images