Heat dissipation device, power module and communication device

Abstract

The application discloses a heat dissipation device, a power module and communication equipment. The heat dissipation device comprises a main heat sink, a deformation part and at least one sub heat sink, the at least one sub heat sink is connected with the main heat sink through the deformation part; the main heat sink is arranged above a circuit board and abuts against a power device on the circuit board; the main heat sink is connected with the circuit board or a first fixing structure outside the circuit board; and the at least one sub heat sink is connected with the circuit board or the first fixing structure outside the circuit board. The heat dissipation device has a large heat dissipation area and high heat dissipation efficiency, the weight of the heat dissipation device is dispersed to the circuit board or the first fixing structure, the risk of the power device being damaged by pressure is reduced, the heat dissipation device is decoupled from the circuit board, the occupation of the layout space on the circuit board is small, the influence on the circuit board layout is small, the layout space outside the circuit board can be fully utilized, and the arrangement mode is flexible.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, and in particular to a heat dissipation device, a power module and a communication device. BACKGROUND

[0002] With the increasing power consumption of chips, the heat dissipation area needs to be increased, thereby increasing the weight of the heat sink. In order to improve the heat dissipation performance of the chip body, chip suppliers introduce more packaging forms of bare Die (without a packaging metal shell), so that the chip surface is more fragile and is prone to chip edge collapse, breakage and other failures in the vibration drop scene. The increasing weight of the heat sink plus the more fragile chip makes the weight control of the heat sink a big problem in the current high-power bare Die chip productization process.

[0003] At present, the heat sink is directly arranged on the circuit board (PCB), which not only does not significantly reduce the pressure on the chip, but also occupies a large layout space on the circuit board, greatly affects the circuit board layout, and even needs to design a special circuit board, which is not conducive to product standardization and cost control. SUMMARY

[0004] Embodiments of the present application provide a heat dissipation device, a power module and a communication device to solve the problem of the influence of the chip heat sink on the circuit board layout.

[0005] In a first aspect, the embodiments of the present application provide a heat dissipation device, comprising a main heat sink, a deformation part and at least one sub-heat sink, the at least one sub-heat sink is connected with the main heat sink through the deformation part; the main heat sink is arranged above a circuit board and abuts against a power device on the circuit board; the main heat sink is connected with the circuit board or a first fixing structure other than the circuit board; and the at least one sub-heat sink is connected with the circuit board or the first fixing structure other than the circuit board.

[0006] According to an aspect of the embodiments of the present application, a heat conduction layer is arranged between the main heat sink and the power device.

[0007] According to an aspect of the embodiments of the present application, the main heat sink comprises a main heat sink body and a first auxiliary heat conduction member, and the main heat sink body is connected with the deformation part through the first auxiliary heat conduction member.

[0008] According to an aspect of the embodiments of the present application, the deformation part and the first auxiliary heat conduction member are integrally formed.

[0009] According to an aspect of the embodiment of the present application, the main heat sink body comprises a main heat sink substrate and main heat sink fins, the main heat sink fins are arranged on the main heat sink substrate; the first auxiliary heat conduction member is connected with the main heat sink substrate; the first auxiliary heat conduction member is connected with the main heat sink fins.

[0010] According to an aspect of the embodiment of the present application, the dispersion heat sink comprises a dispersion heat sink body and a second auxiliary heat conduction member, the dispersion heat sink body is connected with the deformation part through the second auxiliary heat conduction member.

[0011] According to an aspect of the embodiment of the present application, the deformation part is integrally formed with the second auxiliary heat conduction member.

[0012] According to an aspect of the embodiment of the present application, the dispersion heat sink body comprises a dispersion heat sink substrate and dispersion heat sink fins, the dispersion heat sink fins are arranged on the dispersion heat sink substrate; the second auxiliary heat conduction member is connected with the dispersion heat sink substrate; the second auxiliary heat conduction member is connected with the dispersion heat sink fins.

[0013] According to an aspect of the embodiment of the present application, the deformation part is a flexible heat pipe, a three-dimensional bent heat pipe or a three-dimensional bent columnar structure.

[0014] According to an aspect of the embodiment of the present application, the main heat sink is connected with the circuit board or the first fixing structure through a first connecting member; the dispersion heat sink is connected with the circuit board or the first fixing structure through a second connecting member.

[0015] According to an aspect of the embodiment of the present application, the first fixing structure comprises a first fixing part and a second fixing part; the main heat sink is connected with the circuit board or the first fixing part; the at least one dispersion heat sink is connected with the circuit board or the second fixing part.

[0016] In a second aspect, the embodiment of the present application provides a power module, comprising a power device, a circuit board and a heat dissipation device as described above; the power device is arranged on the circuit board; the main heat sink of the heat dissipation device is in abutment with the power device.

[0017] In a third aspect, the embodiment of the present application provides a communication device, a second fixing structure and a power module as described above; the circuit board of the power module is fixedly connected on the second fixing structure; the main heat sink of the heat dissipation device is connected with the circuit board or the first fixing structure, and the dispersion heat sink is connected with the circuit board or the first fixing structure.

[0018] According to an aspect of the embodiment of the present application, the first fixing structure comprises a case or a fixing frame; the second fixing structure comprises a case or a fixing frame.

[0019] The heat dissipation device provided by the embodiments of the present application has a main heat sink with ideal uniform temperature performance, and the main heat sink can conduct the heat of the power device to the distributed heat sink through the deformation part for heat exchange to dissipate the heat of the power device. The heat dissipation device adopts a split design of the main heat sink and the distributed heat sink, has a large heat dissipation area, and can improve the overall heat dissipation capacity of the device and has high heat dissipation efficiency. The main heat sink and the distributed heat sink can be connected to the circuit board or the first fixing structure, and the weight of the heat dissipation device is dispersed to the circuit board or the first fixing structure, so that the pressure of the heat dissipation device on the power device can be reduced and the risk of the power device being crushed can be reduced. Moreover, the heat dissipation device is decoupled from the circuit board and is not directly arranged on the circuit board, so that the occupation of the layout space on the circuit board is small, the influence on the circuit board layout is small, the layout space outside the circuit board can be fully utilized, and the arrangement mode is flexible. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0021] Figure 1 A structural schematic diagram of the heat dissipation device provided by the embodiments of the present application is shown in the figure.

[0022] Figure 2 Another structural schematic diagram of the heat dissipation device provided by the embodiments of the present application is shown in the figure.

[0023] Figure 3 A top view structural schematic diagram of the heat dissipation device provided by the embodiments of the present application is shown in the figure.

[0024] Figure 4 A structural schematic diagram of the heat dissipation device provided by the embodiments of the present application is shown in the figure.

[0025] Reference signs:

[0026] 100-main heat sink, 200-distributed heat sink, 300-deformation part, 400-circuit board, 500-power device;

[0027] 600-first fixing structure, 700-heat conduction layer, 800-first connecting piece, 900-second connecting piece;

[0028] 101-first auxiliary heat conduction piece, 102-main heat sink substrate, 103-main heat sink fin;

[0029] 201-second auxiliary heat conduction piece, 202-distributed heat sink substrate, 203-distributed heat sink fin. Detailed Implementation

[0030] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0031] In the description of this application, it should be noted that, unless otherwise stated, the terms "first" and "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance; "multiple" means two or more; the terms "inner," "outer," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Please see Figure 1 and Figure 2 This application provides a heat dissipation device, which may include a main heat sink 100, a deformable part 300 and at least one heat diffuser 200. The at least one heat diffuser 200 can be connected to the main heat sink 100 through the deformable part 300.

[0033] The main heat sink 100 can be disposed above the circuit board 400 and abut against the power device 500 (such as a chip) on the circuit board 400; the main heat sink 100 can be connected to the circuit board 400 or a first fixed structure 600 other than the circuit board 400. At least one heat dissipator 200 can be connected to the circuit board 400 or a first fixed structure 600 other than the circuit board 400.

[0034] The heat dissipation device provided by the embodiment of the present application has a main heat sink 100 with ideal uniform temperature performance. The main heat sink 100 can conduct the heat of the power device 500 to the distributed heat sink 200 for heat exchange, thereby achieving heat dissipation of the power device 500. The heat dissipation device adopts a split design of the main heat sink 100 and the distributed heat sink 200, has a large heat dissipation area, and can improve the overall heat dissipation capacity of the device and has high heat dissipation efficiency. The main heat sink 100 and the distributed heat sink 200 can be connected to the circuit board 400 or the first fixing structure 600 outside the circuit board 400. The weight of the heat dissipation device is dispersed to the circuit board 400 or the first fixing structure 600, so that the pressure of the heat dissipation device on the power device 500 can be reduced, and the risk of the power device 500 being crushed can be reduced. Moreover, the arrangement of the heat dissipation device is decoupled from the circuit board 400, rather than being directly arranged on the circuit board 400, so that the occupation of the layout space on the circuit board 400 is small, the influence on the layout of the circuit board 400 is small, the layout space outside the circuit board 400 can be fully utilized, and the arrangement mode is flexible.

[0035] In specific implementation, the installation of the main heat sink 100 and the distributed heat sink 200 can be flexibly set, Figure 1 The main heat sink 100 is connected to the circuit board 400; the distributed heat sink 200 is not directly in contact with the circuit board 400, and the distributed heat sink 200 is suspended relative to the circuit board 400. Specifically, the distributed heat sink 200 is connected to the first fixing structure 600. Figure 2 The main heat sink 100 is connected to the circuit board 400; the distributed heat sink 200 is suspended and connected to the circuit board 400, and part of the distributed heat sink 200 is also connected to the first fixing structure 600. In addition, the main heat sink 100 can directly contact the circuit board 400, and the distributed heat sink 200 does not directly contact the circuit board 400.

[0036] In specific implementation, the first fixing structure 600 connected to the main heat sink 100 and the first fixing structure 600 connected to the distributed heat sink 200 can be independent of each other. Specifically, the first fixing structure 600 can include a first fixing part and a second fixing part. The main heat sink 100 can be connected to the circuit board 400 or the first fixing part, and at least one distributed heat sink 200 can be connected to the circuit board 400 or the second fixing part. Exemplarily, the first fixing part can be a case or a fixing frame, and the fixing frame can be connected to the circuit board 400, the case or other fixing structures. The second fixing part can also be a case or a fixing frame.

[0037] The position of the distributed heat sink 200 can be flexibly set relative to the main heat sink 100, for example, in combination with Figure 3As shown, multiple distributed heat sinks 200 can be distributed around the main heat sink 100, and the installation height of the distributed heat sink 200 relative to the main heat sink 100 can be different, and the layout space outside the circuit board 400 can be effectively utilized to improve the overall heat dissipation capacity of the device.

[0038] In specific implementation, the main heat sink 100 can be connected with the circuit board 400 or the first fixing structure 600 outside the circuit board 400 through the first connecting piece 800. The distributed heat sink 200 can be connected with the circuit board 400 or the first fixing structure 600 outside the circuit board 400 through the second connecting piece 900. The first connecting piece 800 can adopt screws, spring screws, spring buckles, etc., and the second connecting piece 900 can also adopt screws, spring screws, spring buckles, etc.

[0039] In specific implementation, a heat conduction layer 700 can be arranged between the main heat sink 100 and the power device 500 to improve the heat transfer efficiency and facilitate efficient heat dissipation of the power device 500. The heat conduction layer 700 can be made of a thermal interface material (TIM). The heat conduction layer 700 can be bonded to the power device 500.

[0040] As a possible implementation, the main heat sink 100 can include a main heat sink body and a first auxiliary heat conduction piece 101, and the main heat sink body can be connected with the deformed part 300 through the first auxiliary heat conduction piece 101 to realize heat conduction. In specific arrangement, the deformed part 300 can be integrally formed with the first auxiliary heat conduction piece 101, facilitating processing and assembly.

[0041] In specific implementation, the main heat sink body can include a main heat sink substrate 102 and a main heat sink fin 103, and the main heat sink fin 103 can be arranged on the main heat sink substrate 102. The arrangement of the main heat sink fin 103 can increase the heat dissipation area. The first auxiliary heat conduction piece 101 can be connected with the main heat sink substrate 102, or the first auxiliary heat conduction piece 101 can be connected with the main heat sink fin 103, or the first auxiliary heat conduction piece 101 can be connected with both the main heat sink substrate 102 and the main heat sink fin 103.

[0042] As a possible implementation, the distributed heat sink 200 can include a distributed heat sink body and a second auxiliary heat conduction piece 201, and the distributed heat sink body can be connected with the deformed part 300 through the second auxiliary heat conduction piece 201 to realize heat conduction. Similarly, the second auxiliary heat conduction piece 201 can be integrally formed with the deformed part 300, facilitating processing and assembly. In combination with the above, the first auxiliary heat conduction piece 101, the second auxiliary heat conduction piece 201, and the deformed part 300 can be integrally formed.

[0043] In a specific implementation, the distributed heat sink body can include a distributed heat sink substrate 202 and distributed heat sink fins 203, which can be arranged on the distributed heat sink substrate 202. The arrangement of the distributed heat sink fins 203 can increase the heat dissipation area. Similarly, the second auxiliary heat conduction member 201 can be connected with the distributed heat sink substrate 202, or the second auxiliary heat conduction member 201 can be connected with the distributed heat sink fins 203, or the second auxiliary heat conduction member 201 can be connected with both the distributed heat sink substrate 202 and the distributed heat sink fins 203.

[0044] As a possible implementation, the deformation part 300 can be a heat-conducting connecting member, for example, the deformation part 300 can be but is not limited to a flexible heat pipe, a three-dimensional bending heat pipe, a three-dimensional bending columnar structure, etc. Unlike the arched bending or spatial cantilever bending structure which cannot be three-dimensionally deformed, the deformation part 300 of the embodiment of the present application can be deformed in a three-dimensional space, can absorb three-dimensional dimensional tolerances, and can adapt to the mismatched design between the main heat sink 100 and the distributed heat sink 200 in different directions and different heights.

[0045] The embodiment of the present application also provides a power module, which can include a power device 500, a circuit board 400, and a heat dissipation device as described in the above embodiment, the power device 500 is arranged on the circuit board 400, and the main heat sink 100 of the heat dissipation device can abut against the power device 500.

[0046] In a specific implementation, in addition to the power device 500 corresponding to the main heat sink 100 of the heat dissipation device for heat dissipation, the distributed heat sink 200 can dissipate heat for another power device 500 or other heat source on the circuit board 400, so that the heat dissipation device can serve as a multi-heat-source shared heat sink of the power module.

[0047] In actual application, as shown in Figure 4 , a plurality of heat dissipation devices can be used to dissipate heat for a plurality of power devices 500 (or other heat sources), and the main heat sinks 100 of the plurality of heat dissipation devices can share one or more distributed heat sinks 200. Figure 4 An example is given of a case where two heat dissipation devices are used to dissipate heat for two power devices 500, and the main heat sinks 100 of the two heat dissipation devices share one distributed heat sink 200.

[0048] The embodiment of the present application also provides a communication device, which can include a second fixed structure and a power module as described in the above embodiment, the circuit board 400 of the power module is fixedly connected to the second fixed structure. The main heat sink 100 of the heat dissipation device can be connected with the circuit board 400 or the first fixed structure 600, and the distributed heat sink 200 can also be connected with the circuit board 400 or the first fixed structure 600.

[0049] In a specific implementation, the first fixing structure 600 can be a case or a fixing rack, and the second fixing structure can also be a case or a fixing rack. The main heat sink 100 and the sub heat sink 200 of the heat dissipation device can be suspended in the case or the fixing rack, or can be connected to the side wall of the case or the fixing rack, so that the internal space of the communication equipment can be fully utilized to expand the heat dissipation area.

[0050] Those skilled in the art should understand that the above description is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technologies thereof, the present application also intends to include these modifications and variations.

Claims

1. A heat dissipation device, characterized in that, It includes a main radiator, a deformable part, and at least one heat dissipator, wherein the at least one heat dissipator is connected to the main radiator through the deformable part; The main heat sink is used to be mounted above the circuit board and to abut against the power devices on the circuit board; the main heat sink is connected to the circuit board or a first fixed structure other than the circuit board. The at least one heat diffuser is connected to the circuit board or the first fixed structure other than the circuit board.

2. The heat dissipation device according to claim 1, characterized in that, A thermally conductive layer is provided between the main heat sink and the power device.

3. The heat dissipation device according to claim 1, characterized in that, The main heat sink includes a main heat sink body and a first auxiliary heat-conducting component. The main heat sink body is connected to the deformable part through the first auxiliary heat-conducting component.

4. The heat dissipation device according to claim 3, characterized in that, The deformable part is integrally formed with the first auxiliary heat-conducting component.

5. The heat dissipation device according to claim 3, characterized in that, The main heat sink body includes a main heat sink base plate and main heat sink fins, wherein the main heat sink fins are disposed on the main heat sink base plate; The first auxiliary heat-conducting component is connected to the main heat sink substrate; The first auxiliary heat-conducting component is connected to the fins of the main heat sink.

6. The heat dissipation device according to claim 1 or 3, characterized in that, The heat disperser includes a heat disperser body and a second auxiliary heat-conducting component, and the heat disperser body is connected to the deformable part through the second auxiliary heat-conducting component.

7. The heat dissipation device according to claim 6, characterized in that, The deformable part is integrally formed with the second auxiliary heat-conducting component.

8. The heat dissipation device according to claim 6, characterized in that, The diffuser body includes a diffuser substrate and diffuser fins, wherein the diffuser fins are disposed on the diffuser substrate. The second auxiliary heat-conducting component is connected to the heat dissipator substrate; The second auxiliary heat-conducting component is connected to the diffuser fins.

9. The heat dissipation device according to claim 1, characterized in that, The deformable part is a flexible heat pipe, a three-dimensional bent heat pipe, or a three-dimensional bent columnar structure.

10. The heat dissipation device according to claim 1, characterized in that, The main heat sink is connected to the circuit board or the first fixing structure via a first connector; The heat diffuser is connected to the circuit board or the first fixed structure via a second connector.

11. The heat dissipation device according to claim 1, characterized in that, The first fixing structure includes a first fixing part and a second fixing part; The main heat sink is connected to the circuit board or the first fixing part; The at least one heat diffuser is connected to the circuit board or the second fixing part.

12. A power module, characterized in that, Includes power devices, circuit boards, and heat dissipation devices as described in any one of claims 1 to 11; The power device is mounted on the circuit board; The main heat sink of the heat dissipation device abuts against the power device.

13. A communication device, characterized in that, Includes a second fixing structure and the power module as described in claim 12; The circuit board of the power module is fixedly connected to the second fixed structure; The main heat sink of the heat dissipation device is connected to the circuit board or the first fixed structure, and the heat dissipator is connected to the circuit board or the first fixed structure.

14. The communication device according to claim 13, characterized in that, The first fixing structure includes a chassis or a mounting frame; The second fixing structure includes a chassis or a mounting frame.

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