A micro integrated piezoelectric pump device

Abstract

The present invention relates to a micro-integrated piezoelectric pump device, which belongs to the technical field of piezoelectric pumps. It solves the problems in the prior art that piezoelectric pumps are insufficiently integrated and poorly adaptable, and are difficult to meet the increasingly miniaturized and refined application requirements. The present invention comprises: a pump body, which comprises, assembled from top to bottom: a top heat sink, a flow channel plate, a resonance plate, an outer frame with an embedded vibrator, and an electrode plate; and a valve body installed under the pump body, which comprises, assembled from top to bottom: a first fixed layer, an elastic film layer, a second fixed layer, a side wall portion for fixing and installing the first fixed layer, the elastic film layer, and the second fixed layer, and a bottom substrate fixed to the bottom surface of the side wall portion and serving as the bottom plate of the valve body; wherein the bottom substrate serves as the bottom plate of the micro-integrated piezoelectric pump device to power and control the pump body; the vibrator comprises an elastic plate and a piezoelectric element; and the outer frame has a square opening for accommodating the vibrator.

Description

Technical Field

[0001] The present invention relates to the technical field of piezoelectric pumps, and in particular to a micro-integrated piezoelectric pump device. Background Art

[0002] As a micro device with strong coupling across multiple disciplines of materials, structures, fluids, electronics, and processes, piezoelectric pumps have the advantages of small size, low power consumption, high specific back pressure, large specific flow rate, high-speed response, and high flow accuracy. They have a wide range of applications in the fields of medical devices and semiconductor thermal management, and are particularly suitable for wearable and portable medical devices and micro-space heat dissipation management applications. However, the existing piezoelectric pump structure in this technical field is still difficult to adapt to the increasingly miniaturized and ultra-thin application requirements, and because the various components of the piezoelectric pump are specially customized, the pump, valve, and control part are independent components, with insufficient integration and poor adaptability, resulting in high production and application costs.

[0003] The Chinese patent application, publication number CN108302016A, titled “A continuous fluid passive valve piezoelectric pump”, discloses a piezoelectric pump including a pump body and a valve body, which still requires additional connection to a power supply and a control device, and lacks integration.

[0004] The Chinese patent application, publication number CN107476964A, titled "A piezoelectric pump with integrated valve chamber", discloses a piezoelectric pump including a pump body and a chamber, wherein the inlet and outlet of the fluid require separate water inlet pipes, water outlet pipes, connecting pipes and other parts, and also requires additional connection to a power supply and a control device, and its structure is relatively complex and the degree of integration is insufficient.

[0005] In the technical field, there is a demand for a micro piezoelectric pump device with simple structure, high integration, high reliability and durability, and wide applicability. Summary of the invention

[0006] In order to solve the above problems, a miniature integrated piezoelectric pump device is provided according to an embodiment of the present invention, which can further reduce the volume of the traditional piezoelectric pump body and greatly reduce the area and volume of the overall mechanical and electronic structures, which is conducive to high integration requirements, greatly improves the space benefits and utilization efficiency of downstream users, and reduces application costs; an original structure and shape design is carried out for the vibrator, and the high specific modulus characteristics of fiber-reinforced composite materials are fully utilized to improve the performance of the piezoelectric pump, and the preparation of large-flow and high-back-pressure piezoelectric pumps can be realized; based on the non-silicon MEMS process, the preparation consistency and yield of the piezoelectric pump are improved, the calibration link of the piezoelectric pump is reduced, and the preparation efficiency is improved.

[0007] According to one embodiment of the present invention, a micro integrated piezoelectric pump device is provided, comprising:

[0008] A pump body, which includes, assembled from top to bottom: a top heat sink, a flow channel plate, a resonance plate, an outer frame with an embedded vibrator, and an electrode plate; and

[0009] A valve body installed below the pump body, the valve body comprising, assembled from top to bottom: a first fixing layer, an elastic film layer, a second fixing layer, a side wall portion for fixing and installing the first fixing layer, the elastic film layer and the second fixing layer, and a bottom base plate fixed to the bottom surface of the side wall portion and serving as a bottom plate of the valve body;

[0010] Wherein, the bottom substrate serves as the bottom plate of the micro-integrated piezoelectric pump device to supply power to and control the pump body;

[0011] Wherein, the vibrator comprises an elastic plate and a piezoelectric element, the elastic plate has a central reinforcement portion and a support frame surrounding the reinforcement portion, and the piezoelectric element is fixed to the lower surface of the reinforcement portion;

[0012] And wherein, the outer frame has a square opening for accommodating the vibrator.

[0013] In an optional embodiment, in the pump body:

[0014] The flow channel plate has a central through hole and a flow channel connecting the central through hole with the outside of the flow channel plate;

[0015] The resonant plate has a central hole, which is connected to the central through hole of the flow channel plate;

[0016] The electrode plate has a surrounding frame and a cantilever extending inwardly from the surrounding frame;

[0017] Wherein, the central through hole of the flow channel plate, the central hole of the resonance plate, the reinforcing portion of the elastic plate and the piezoelectric element are coaxial;

[0018] And wherein, the top heat sink, flow channel plate, resonance plate and outer frame of the pump body have the same outer peripheral size and shape.

[0019] In an optional embodiment, the support frame of the elastic plate includes four side beams and four diagonal bracing beams that are alternately connected to each other to form an octagonal structure.

[0020] In an optional embodiment, the flow channel plate, the resonance plate, and the outer frame of the embedded vibrator are assembled together by bonding.

[0021] In an optional embodiment, the first fixed layer, the elastic film layer, the second fixed layer and the side wall portion of the valve body together constitute a normally closed valve and a normally open valve.

[0022] In an optional embodiment, in the valve body:

[0023] The first fixed layer is formed with a normally closed hole and a first avoidance opening;

[0024] The elastic film layer is formed with a film transmission hole, and the position of the film transmission hole deviates from the position of the normally closed hole;

[0025] The second fixed layer is formed with a transmission opening and a second avoidance opening, the area of ​​the transmission opening covers the area of ​​the normally closed hole and the area of ​​the film transmission hole, and the position of the second avoidance opening corresponds to the first avoidance opening;

[0026] The side wall portion has a boss extending inward from one side, a boss transmission hole extending downward from the upper surface thereof is formed in the boss, and a side wall outlet is formed on the side wall where the boss is provided, which is connected from the boss transmission hole to the outside of the side wall portion in a side direction, and the position of the boss transmission hole corresponds to the first avoidance opening and the second avoidance opening;

[0027] The normally closed hole of the first fixed layer, the film transmission hole of the elastic film layer, and the transmission opening of the second fixed layer constitute a normally closed valve;

[0028] And the first avoidance opening of the first fixed layer, the elastic film layer, the second avoidance opening of the second fixed layer and the boss transmission hole of the boss form a normally open valve.

[0029] In an optional embodiment, in the valve body: two separated through holes extending vertically are formed in the side wall portion, and conductive material is filled in the through holes to form conductive through holes, through which the power supply unit of the bottom substrate is electrically connected to the electrode plate of the pump body.

[0030] In an optional embodiment, in the valve body: a power supply unit and a control unit are provided on the bottom substrate, and a through substrate hole is provided at a central position.

[0031] In an optional embodiment, the frame of the electrode plate of the pump body includes a frame part one and a frame part two separated by an insulating strip, wherein a cantilever extends inwardly from the frame part two, and the frame part one is electrically connected to an outer frame above it; the upper ends of the two conductive through holes in the side wall portion of the valve body are electrically connected to the frame part one and the frame part two, respectively, and the lower ends of the two conductive through holes are electrically connected to the power supply unit of the bottom substrate.

[0032] In an optional embodiment, the outer circumference of the pump body and the valve body is rectangular or circular.

[0033] Compared with the prior art, the micro-integrated piezoelectric pump device provided according to the embodiment of the present invention has at least the following beneficial effects.

[0034] 1. The pump body in the micro-integrated piezoelectric pump device provided by the embodiments of the present invention has at least the following advantages.

[0035] (1) The vibrator has a sidewall-free structure and can be assembled with a separately manufactured outer frame, so that the elastic plate and the outer frame of the vibrator can be made of different materials, which makes the pump body have better vibration performance. At the same time, it is beneficial to the airtight design of the shell and the cutting requirements of the dicing machine, reducing the overall volume of the piezoelectric pump, improving the integration, and is suitable for the bonding process.

[0036] (2) The flow channel plate, the vibrator and the outer frame, as well as the resonance plate can be assembled by one-time bonding, thereby improving processing efficiency.

[0037] (3) The elastic plate structure of the vibrator allows it to be processed in one plane, simplifying the process difficulty and improving processing efficiency; the ineffective area (volume) of the vibrator is concentrated in the corners, which is conducive to further reducing the overall volume of the vibrator while meeting the vibrator performance and improving the device integration; and composite materials can be used to make elastic plates and other components, making full use of the high elastic modulus and low density characteristics of composite materials such as carbon fiber to achieve a higher resonant frequency on extremely thin materials, making the pump body further thinner.

[0038] 2. The valve body in the micro-integrated piezoelectric pump device provided by the embodiments of the present invention has at least the following advantages.

[0039] (1) The integration of microelectronics and micromechanics makes the valve body's microsystem more powerful and able to complete more complex tasks. The integrated design reduces external interference and improves the stability and reliability of the system.

[0040] (2) Power is supplied from the bottom substrate to the upper pump body through the conductive through-holes in the valve body, without the need for external electrode terminals, resulting in a more compact integrated structure.

[0041] (3) The bottom substrate serves as both the substrate for installing the chip after sealing and the bottom plate of the valve body, with high space utilization.

[0042] 3. Each element in the micro-integrated piezoelectric pump device provided by the embodiments of the present invention is manufactured using a non-silicon MEMS (micro-electromechanical system) process, thereby having at least the following advantages.

[0043] (1) High production efficiency. The chip base plate structure as the bottom substrate is a square unit. Array microstructures can be directly produced on wafers made of non-silicon materials (such as stainless steel, fiber-reinforced composites, etc.) to achieve mass production. After bonding and molding, a dicing machine is used for batch cutting, thereby greatly improving production capacity.

[0044] (2) By using eutectic bonding or resin bonding after making microstructures on non-silicon wafers, the bonding of materials can be completed quickly at a relatively low temperature, which helps to protect the integrity of the device and avoid high temperature damage to the device or large thermal deformation, thereby achieving a higher yield. Because alignment bonding has micron-level alignment accuracy and the highest parallelism accuracy currently available, the prepared devices have better consistency and are better for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. The features and advantages of the present invention can be more clearly understood by referring to the drawings. The drawings are schematic and should not be understood as limiting the present invention in any way. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 Detailed description of the invention is given in conjunction with an exploded view of a pump body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0047] Figure 2 It is a schematic diagram of an assembled pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0048] Figure 3 is an isometric view of a flow channel plate of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0049] Figure 4 is an isometric view of a resonant plate of a pump body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0050] Figure 5 4 is a top view of an elastic plate of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0051] Figure 6 is an isometric view of an outer frame of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0052] Figure 7 Schematic diagram of a combination of an elastic plate and an outer frame of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0053] Figure 8 is an isometric view of an electrode plate of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0054] Fig. 9Schematic diagram of a first working state of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0055] Fig.10 Schematic diagram of a second working state of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0056] Fig.11 3 is a schematic diagram of a third working state of a pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0057] Fig.12 FIG. 4 is an exploded view of a valve body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0058] Fig.13 is an isometric view of a first fixing layer of a valve body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0059] Fig.14 is an isometric view of an elastic film layer of a valve body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0060] Fig.15 is an isometric view of a second fixing layer of a valve body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0061] Fig.16 1 is an isometric view of a side wall portion of a valve body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0062] Fig.17 FIG. 4 is a top view of a bottom substrate of a valve body of a micro-integrated piezoelectric pump device according to an embodiment of the present invention.

[0063] Fig.18 Schematic diagram of a first working state of a valve body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0064] Fig.19 Schematic diagram of a second working state of a valve body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0065] Fig. 20 3 is a schematic diagram of a third working state of a valve body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0066] Fig.21 is a schematic diagram of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention.

[0067] Fig. 22 is a schematic diagram of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention.

[0068] Fig.23 is an isometric view of a top heat sink of a miniature integrated piezoelectric pump device according to another embodiment of the present invention.

[0069] Fig.24 is an isometric view of a flow channel plate of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention.

[0070] Description of reference numerals:

[0071] 100 Pump body;

[0072] 102 vibration cavity;

[0073] 104 pump chamber;

[0074] 110 top heat sink;

[0075] 120 flow channel plate;

[0076] 122 center through hole;

[0077] 124 flow channel;

[0078] 126 short track;

[0079] 130 resonant plate;

[0080] 132 center hole;

[0081] 134 Avoidance slot;

[0082] 140 vibrator;

[0083] 150 elastic plate;

[0084] 152 reinforcement;

[0085] 154 support frame;

[0086] 155 side beams;

[0087] 156 diagonal bracing beam;

[0088] 157 mounting convex part;

[0089] 158 inner beam;

[0090] 160 Piezoelectric element;

[0091] 170 outer frame;

[0092] 172 square opening;

[0093] 177 mounting groove;

[0094] 180 internal hollowing;

[0095] 182 Corner hollowing;

[0096] 184 side cutouts;

[0097] 190 electrode plate;

[0098] 192 Frame;

[0099] 194 Cantilever;

[0100] 195 Insulation strip;

[0101] 196 frame one;

[0102] 198 Frame II;

[0103] 200 Valve body;

[0104] 210 first fixed layer;

[0105] 212 Normally closed foramen;

[0106] 214 First Avoidance Opening;

[0107] 220 elastic film layer;

[0108] 222 film transmission hole;

[0109] 230 Second fixed layer;

[0110] 232 Transmission opening;

[0111] 234 Second avoidance opening;

[0112] 240 side wall;

[0113] 241 sidewall outlet;

[0114] 242 First step wall;

[0115] 244 Second step wall;

[0116] 246 Third step wall;

[0117] 248 boss;

[0118] 249 boss transmission hole;

[0119] 250 conductive vias;

[0120] 300 bottom substrate;

[0121] 310 substrate holes;

[0122] 320 control unit;

[0123] 350 Power supply unit;

[0124] 1100 Pump body;

[0125] 1110 top heat sink;

[0126] 1120 flow channel plate;

[0127] 1130 resonant plate;

[0128] 1170 Frame;

[0129] 1190 electrode plate;

[0130] 1200 Valve body;

[0131] 1210 first fixed layer;

[0132] 1220 elastic film layer;

[0133] 1230 second fixed layer;

[0134] 1240 side wall;

[0135] 1300 Bottom substrate

[0136] 2100 Pump body;

[0137] 2110 top heat sink;

[0138] 2112 heat sink hole

[0139] 2120 flow channel plate;

[0140] 2122 center through hole;

[0141] 2124 flow channel;

[0142] 2200 valve body. DETAILED DESCRIPTION

[0143] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0144] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0145] A micro integrated piezoelectric pump device provided according to an embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0146] Example 1

[0147] Figure 1 Detailed description of the invention is given in Figure 4. Detailed description of the invention is given in Figure 4. Figure 2 It is a schematic diagram of an assembled pump body of a micro-integrated piezoelectric pump device provided according to an embodiment of the present invention.

[0148] like Figure 1 and Figure 2 As shown, a micro integrated piezoelectric pump device according to an embodiment of the present invention includes: a pump body 100 and a valve body 200; wherein the bottom substrate 300 of the valve body 200 serves as the bottom plate of the micro integrated piezoelectric pump device to power and control the pump body 100. The pump body 100 and the valve body 200 may have a consistent outer peripheral shape and size, so that the assembled micro integrated piezoelectric pump device has a uniform and consistent appearance, is easy to transport and store, and is suitable for integration into a variety of practical application products.

[0149] The following references Figures 1 to 11 First, the pump body 100 of the micro-integrated piezoelectric pump device of this embodiment will be described in detail.

[0150] like Figure 1 As shown, the pump body 100 of this embodiment includes, from top to bottom, a top heat sink 110, a flow channel plate 120, a resonance plate 130, an outer frame 170 with an embedded vibrator 140, and an electrode plate 190. The flow channel plate 120 has a central through hole 122 and a flow channel 124 connected to the central through hole 122; the resonance plate 130 has a central hole 132, which is connected to the central through hole 122 of the flow channel plate 120; the electrode plate 190 has a surrounding frame 192 and a cantilever 194 extending inward from the surrounding frame 192; the vibrator 140 includes an elastic plate 150, which has a central reinforcement part 152 and a support frame 154 surrounding it; and a piezoelectric element 160 is fixed to the lower surface of the reinforcement part 152. The above-mentioned multi-layer components included in the pump body 100 have consistent peripheral size and shape, and form a consistent appearance of the pump body 100 after assembly. Optionally, the flow channel plate 120 , the resonance plate 130 , and the outer frame 170 with the embedded vibrator 140 may be assembled together by bonding.

[0151] In this embodiment, the top heat sink 110 is located at the top of the pump body 100 and cooperates with the flow channel plate 120 below to form a channel for the fluid to enter. The top heat sink 110 can be made of copper, aluminum alloy or carbon fiber composite material to have good thermal conductivity and heat dissipation capabilities. Alternatively, in other embodiments, the top heat sink 110 can also be made of ceramic material as needed.

[0152] like Figure 3 As shown, in this embodiment, the flow channel plate 120 located below the top heat sink 110 has a central through hole 122 that runs through the flow channel plate 120 at the center, and a groove-shaped structure arranged on the surface of the flow channel plate 120 to form a flow channel 124. The flow channel 124 connects the central through hole 122 with the side of the flow channel plate 120, so that the fluid can flow in from the side. In this embodiment, the central through hole 122 is circular, and the four flow channels 124 are evenly distributed around the central through hole 122 and extend to the four corners of the flow channel plate 120 in a straight line. Optionally, as Figure 3 As shown, each flow channel 124 may be provided with a short channel 126 bidirectionally connected to the outside at the four corner ends of the flow channel plate 120, which crosses the four corner ends, so that the ends of each flow channel 124 are connected to the outside at the two sides of the flow channel plate through the short channel 126, and the shape of the four corners of the flow channel plate 120 is kept intact. Through the short channel 126 bidirectionally connected to the outside, a larger fluid inflow can be provided when the micro-integrated piezoelectric pump device is working, and a buffering effect can be provided at the connection point between the flow channel 124 and the outside, so as to achieve smoother fluid inflow and outflow, avoid excessive rapid fluid flow, and retain the corners around the flow channel plate, so as to facilitate alignment and assembly with other upper and lower components during installation. The flow channel plate 120 can be made of stainless steel or carbon composite material.

[0153] refer to Figure 4In this embodiment, the resonance plate 130 located below the flow channel plate 120 may have a central hole 132 extending therethrough, and the central hole 132 is connected to the central through hole 122 of the flow channel plate 120. Optionally, the central hole 132 of the resonance plate 130 is coaxial with the central through hole 122 of the flow channel plate 120, and the aperture of the central hole 132 of the resonance plate 130 is smaller than the aperture of the central through hole 122 of the flow channel plate 120, thereby ensuring that the amount of fluid reflux from the inside of the pump body 100 to the outside is small enough when the micro-integrated piezoelectric pump device is working, forming a one-way transport of the fluid into the pump body 100. For example, but not limited to this, the aperture of the central through hole 122 of the flow channel plate 120 can be set in the range of 4.5 mm to 6.0 mm, and needs to be calculated and optimized according to different required resonance frequencies. The aperture of the central hole 132 of the resonance plate 130 can be set in the range of 0.5 mm to 1.2 mm. Optionally, the resonance plate 130 may also be hollowed out with an avoidance groove 134 around the center hole 132, and the position of the avoidance groove 134 corresponds to the vibration part of the support frame 154 of the vibrator 140, so as to avoid the vibration part of the support frame 154 that vibrates up and down when the vibrator 140 vibrates, reduce the impact and collision between components, avoid component failure caused by vibration, and improve the overall durability of the miniature integrated piezoelectric pump device.

[0154] like Figures 5 to 7 As shown, in this embodiment, below the resonant plate 130 is a combination of a vibrator 140 and an outer frame 170. The space between the resonant plate 130 and the vibrator 140 below forms a resonant cavity 102. The space below the vibrator 140 forms a pump cavity 104. The vibrator 140 includes an elastic plate 150 and a piezoelectric unit 160 fixed to the middle of the elastic plate 150. The vibrator 140 is a sidewall-free structure, and is assembled to an outer frame 170 manufactured separately by fitting the elastic plate 150 with the outer frame 170. During assembly, when fitting the elastic plate 150 with the outer frame 170, an adhesive method can also be used at the same time to make the combination more firm and able to withstand vibration for a longer time without loosening. The outer frame 170 has a square opening 172 in the middle, and a mounting groove 177 is formed on the inner side facing the square opening 172 for mounting the elastic plate 150. The elastic plate 150 can be integrally formed, for example, cut and formed on a carbon composite sheet. The outer frame 170 can be made of materials such as stainless steel and carbon fiber composite materials.

[0155] like Figure 5 , Figure 6As shown, the elastic plate 150 includes a circular reinforcement portion 152 in the center, and a support frame 154 surrounding the reinforcement portion 152. The piezoelectric element 160 can be fixed to the reinforcement portion 152 by bonding or welding. In this embodiment, the support frame 154 is a structure of multiple beams, which roughly constitutes an octagonal structure around the reinforcement portion 152. Specifically, the support frame 154 includes four side beams 155 and four diagonal bracing beams 156 that are alternately connected to each other to form the octagonal structure, wherein the four side beams 155 are narrower than the four diagonal bracing beams 156, thereby providing a larger elastic deformation range, and the four diagonal bracing beams 156 play the role of connecting and fixing the side beams 155. Optionally, the support frame 154 also includes an inner beam 158 extending inwardly from the side beams 155 to the reinforcement portion 152, and is connected to the reinforcement portion 152 through the inner beam 158 to provide better vibration performance. Optionally, the structure of the elastic plate 150 may be that four inner beams 158 extending radially outward are evenly spaced around the central circular reinforcement portion 152, and four side beams 155 of equal length are respectively arranged at the outer ends of the four inner beams 158, and the four side beams 155 are arranged so that adjacent side beams 155 are perpendicular to each other. Adjacent side beams 155 are connected by diagonal bracing beams 156, and the diagonal bracing beams 156 extend beyond the outer edges of the side beams 155 to form mounting protrusions 157, and the mounting protrusions 157 match the mounting grooves 177 of the outer frame 170 so as to fit together during installation. This design allows the elastic plate 150 to only require a material of appropriate thickness (such as 0.25mm to 0.3mm) to be processed by etching or laser processing, and to be realized by different steps or hollowing processing in a layer of material. At the same time, the wider side beam 155 and diagonal support beam 156 structure of this embodiment can make the entire elastic plate 150 have good overall flatness, and it is not easy to produce local deformation, thereby causing a decrease in pump yield. Optionally, the diagonal support beam 156 extends from the connection with the side beam 155 to form an oblique installation protrusion 157, which matches the installation groove 177 of the outer frame 170 with the same oblique shape. This shape makes the fitting of the vibrator 140 and the outer frame 170 more stable and not easy to loosen.

[0156] like Figure 7As shown, after the elastic plate 150 and the outer frame 170 are assembled, the side beams 155 are parallel to the sides of the square opening 172 of the outer frame 170; the diagonal bracing beams 156 are respectively beveled at the four corners of the square opening 172 of the outer frame 170, so as to form corner hollows 182 at the four corners. The diagonal bracing beams 156 can play a role in adjusting the vibration frequency of the straight beam. The closer the diagonal bracing beams 156 are to the reinforcement part 152, the higher the vibration frequency of the reinforcement part 152 during operation; the farther the diagonal bracing beams 156 are from the reinforcement part 152, the lower the vibration frequency of the reinforcement part 152 during operation. Thus, the vibration frequency of the vibrator 140 can be adjusted so that its vibration frequency is higher than 20KHz and works in the ultrasonic frequency band, but not too high. Too high a frequency, for example, exceeding 30 KHz, will lead to a decrease in flow rate, an increase in heat generation of the pump body, and easy fatigue failure.

[0157] A plurality of internal hollow areas 180 are formed between the support frame 154 of the elastic plate 150 and the reinforcing portion 152. The support frame 154 can be arranged so that the width of one of the side beams 155 from the outside to the outside of the other side beam 155 parallel thereto is slightly narrower than the corresponding width of the square opening 172 of the outer frame 170, thereby forming an elongated side hollow 184 between the side beam 155 and the side of the outer frame 170. Figure 7As shown, after the elastic plate 150 and the outer frame 170 are assembled, corner hollows 182 located at four corners are formed between the support frame 154 of the elastic plate 150 and the outer frame 170, and side hollows 184 located between the side beam 155 and the outer frame 170. The corner hollows 182 and the side hollows 184 are multiple gaps separated from each other formed between the elastic plate 150 and the outer frame 170. Thus, in the assembled combination of the vibrator 140 and the outer frame 170, there are multiple internal hollows 180, corner hollows 182 and side hollows 184 spaced from each other, so that during operation, the fluid can quickly flow through the hollow space to reduce the flow resistance. The thickness of the outer frame 170 should be greater than or equal to the thickness of the vibrator 140 formed by the superposition of the elastic plate 150 and the piezoelectric element 160. Optionally, the thickness of the outer frame 170 may range from 0.35 mm to 0.5 mm, and the thickness of the vibrator 140 may range from 0.35 mm to 0.45 mm. This dimension setting can ensure that sufficient vibration space is provided while ensuring that the overall size of the micro-integrated piezoelectric pump device meets a variety of ultra-thin application requirements. The elastic plate 150 of the above structure can provide excellent vibration performance for the pump body 100 of the micro-integrated piezoelectric pump device, and the structure enables the elastic plate 150 to be integrally cut and processed on a single sheet of material, which is convenient for manufacturing, saves raw materials, and reduces manufacturing costs. The method of fitting the elastic plate 150 and the outer frame 170 is conducive to improving the tolerance of the manufacturing error of the elastic plate 150, facilitating assembly, and also having excellent adaptability. The elastic plate 150 can be assembled on an outer frame with different external shapes, so as to be suitable for different pump bodies and pump devices, and then suitable for a variety of different application products. The elastic plate 150 can use fiber-reinforced composite materials. The vibrator 140 can make full use of the reinforcement modulus of the fiber direction of the fiber-reinforced composite material by including the above-mentioned substantially straight-line support frame 154, and provide better vibration performance and durability. The elastic plate 150 and the outer frame 170 can be made of different materials, embedded and bonded or bonded, which is conducive to meeting the ultra-thin, low-heat vibrator structure while enabling the outer frame 170 to meet the dicing requirements of the dicing machine. For example, the elastic plate 150 can be made of stainless steel or carbon fiber composite material, and the outer frame 170 can be made of glass fiber or carbon fiber composite material, ceramic, stainless steel and other materials, and the glass fiber and ceramic materials used can be metallized.

[0158] like Figure 8As shown, the electrode plate 190 located below the vibrator 140 has a frame 192 and a cantilever 194 extending inward from the frame 192. The frame 192 may include two insulating strips 195, and two parts separated by the insulating strips 195, namely, the first frame part 196 and the second frame part 198, wherein the cantilever 194 extends inward from the second frame part 198. The electrode plate 190 is made of a conductive metal material, and the electrical connection between the first frame part 196 and the second frame part 198 is cut off by the insulating strips 195, so that they are insulated from each other. When the pump body 100 is working, the cantilever 194 of the electrode plate 190 supplies power to the side of the piezoelectric element 160 away from the reinforcement part 152. The first frame part 196 is connected to the elastic plate 150 through a conductive glue. Since the elastic plate 150 is a good conductor, the piezoelectric element 160 facing the reinforcement part 152 is powered through the first frame part 196, the conductive glue, and the elastic plate 150. This enables low-impedance power supply to the two electrode surfaces of the piezoelectric element, reducing power loss.

[0159] The electrode plate 190 is fixed to the outer frame 170 of the vibrator 140 in such a way that the first frame part 196 of the electrode plate 190 is bonded or bonded to the outer frame 170 by conductive adhesive, and the second frame part 198 is bonded or bonded to the outer frame 170 by insulating adhesive. The cantilever 194 of the electrode plate 190 is connected to the vibrator 140 by spot soldering or high temperature curing of silver paste.

[0160] Optionally, in the assembled pump body 100, the central through hole 122 of the flow channel plate 120, the central hole 132 of the resonance plate 130, the reinforcement portion 152 of the elastic plate 150, and the piezoelectric element 160 are coaxial, thereby cooperating to provide excellent fluid flow performance and oscillation effect.

[0161] The following references Figures 9 to 11 , the working process of the pump body 100 of this embodiment is described in detail. When the pump body 100 according to the embodiment of the present invention performs pumping, the piezoelectric element 160 of the vibrator 140 is energized to generate radial expansion and contraction motion, driving the vibrator 140 to vibrate, thereby achieving fluid pumping.

[0162] Specifically, Fig. 9 As shown, the pump body 100 is in a first working state, the vibrator 140 is not powered, and the piezoelectric element 160 is in a flat and undeformed state.

[0163] like Fig.10 As shown, the pump body 100 is in the second working state. During the vibration of the vibrator 140, when the piezoelectric element 160 stretches, the reinforcement portion 152 of the vibrator 140 is driven to be concave, so that the vibration cavity 102 is expanded; at the same time, the support frame 154 bends upward to form a high-pressure area above it; at this time, the space of the vibration cavity 102 expanded above the reinforcement portion 152 generates a low pressure; so that the fluid moves along Fig.10The direction of the middle arrow is from the outside of the pump body 100 through the flow channel 124 and the central through hole 122 of the flow channel plate 120, and then through the central hole 132 of the resonance plate 130, and enters the enlarged vibration cavity 102, thereby achieving fluid suction.

[0164] like Fig.11 As shown, the pump body 100 is in the third working state. During the vibration of the vibrator 140, when the piezoelectric element 160 contracts, the reinforcing portion 152 of the vibrator 140 is driven to bulge upward, so that the vibration cavity 102 is squeezed and narrowed to generate a high-pressure area; at the same time, the support frame 154 area is concave to form a low-pressure area above it; at this time, since the central position above the reinforcing portion 152 is a high-pressure area, the flow resistance is very large, and the surrounding is a low-pressure area, the flow resistance is very small, as shown in FIG. Fig.11 As shown by the middle arrow, the fluid flows from the high-pressure area at the center to the surrounding low-pressure areas, and part of the fluid flows downward from the surrounding low-pressure areas through the hollow part of the support frame 154; and due to the size setting of the central hole 132 and the central through hole 122, only a small amount of fluid is discharged from the vibration cavity 102 to the outside of the pump body 100 through the central hole 132, the central through hole 122 and the flow channel 124. This makes the amount of fluid flowing out when the piezoelectric element 160 vibrates upward far less than the amount of fluid sucked in when the piezoelectric element 160 vibrates downward, realizing unidirectional flow of the fluid. When the pressure in the cavity of the pump body 100 increases and reaches a certain pressure value, when the piezoelectric element 160 vibrates downward, the amount of fluid flowing back from the pump cavity 104 below the vibrator 140 through the multiple hollow structures of the vibrator 140 to the vibration cavity 102 above the vibrator 140 is roughly equal to the amount of fluid flowing from the vibration cavity 102 through the multiple hollow structures of the vibrator 140 into the pump cavity 104 when the piezoelectric element 160 vibrates upward, reaching a dynamic balance. At this time, the micro-integrated piezoelectric pump device reaches a zero flow back pressure state, and the fluid therein only oscillates, and no unidirectional flow is formed.

[0165] The following references Figures 12 to 20 , the valve body 200 of the micro-integrated piezoelectric pump device of this embodiment is described in detail.

[0166] like Fig.12As shown, the valve body 200 of this embodiment includes: a first fixed layer 210 assembled in sequence from top to bottom; an elastic film layer 220; a second fixed layer 230; a side wall portion 240 for fixing and installing the first fixed layer 210, the elastic film layer 220 and the second fixed layer 230; and a bottom substrate 300 fixed to the bottom surface of the side wall portion 240 and serving as a bottom plate; wherein the bottom substrate 300 includes a power supply unit 350 and a control unit 320; and wherein the elastic film layer 220 and the second fixed layer 230 have the same size, and the length and width of the first fixed layer 210 are greater than the length and width of the elastic film layer 220 and the second fixed layer 230. The side wall portion 240 and the bottom substrate 300 included in the valve body 200 have consistent peripheral size and shape, and form a consistent appearance of the valve body 200 after assembly. In addition, the pump body 100 and the valve body 200 may have consistent peripheral shape and size, so that the assembled micro integrated piezoelectric pump device has a uniform and consistent appearance. The thickness of the side wall portion 240 is greater than the total thickness of the first fixed layer 210, the elastic film layer 220 and the second fixed layer 230, so as to form a space in the valve body 200 for accommodating the chips and devices on the bottom substrate 300, accommodating the deformation of the elastic film layer 220, and providing a fluid flow. The first fixed layer 210, the elastic film layer 220, the second fixed layer 230 and the side wall portion 240 of the valve body 200 together form a normally closed valve and a normally open valve.

[0167] refer to Fig.13 The first fixed layer 210 is formed with a normally closed hole 212 and a first avoidance opening 214, and the size of the first avoidance opening 214 is larger than that of the normally closed hole 212. The first avoidance opening 214 is used to provide an avoidance space to accommodate the upward deformation of the elastic film layer 220 when the elastic film layer 220 deforms upward.

[0168] like Fig.14As shown, below the first fixed layer 210 is an elastic film layer 220. The elastic film layer 220 is made of a material with good elasticity. A film transmission hole 222 is formed on the elastic film layer 220, and the film transmission hole 222 corresponds to the normally closed hole 212 of the first fixed layer 210. The film transmission hole 222 can be set as a plurality of independent fan-shaped small holes, which surround a circular area, the center part of the circular area is a solid part and corresponds to the normally closed hole 212 of the first fixed layer 210. This setting allows the normally closed hole 212 to be blocked by the solid circular area when the elastic film layer 220 is in a flat state or an upwardly deformed state; when the elastic film layer 220 is in a downwardly deformed state, the solid circular area of ​​the elastic film layer 220 deforms downward to open the normally closed hole 212, and the normally closed hole 212 is connected to the film transmission hole 222. In this embodiment, the elastic film layer 220 is made of a single piece of elastic film material. In other embodiments, two elastic film sheets may be respectively arranged at positions corresponding to the normally closed hole 212 and the first avoidance opening 214 .

[0169] like Fig.15 As shown, the second fixed layer 230 is below the elastic film layer 220. The second fixed layer 230 is formed with a transmission opening 232 corresponding to the film transmission hole 222 of the elastic film layer 220, and a second avoidance opening 234 corresponding to the first avoidance opening 214 of the first fixed layer 210. The transmission opening 232 may be circular, and its size is larger than the circular area surrounded by the film transmission hole 222, and is used to provide an avoidance space to accommodate the downward deformation of the elastic film layer 220 when it is deformed downward, and at the same time provide a fluid communication passage from the normally closed hole 212 through the film transmission hole 222 of the elastic film layer 220 that is deformed downward and the transmission opening 232. The size of the second avoidance opening 234 may be consistent with the size of the first avoidance opening 214 of the first fixed layer 210, and the position of the second avoidance opening 234 corresponds to the position of the first avoidance opening 214 of the first fixed layer 210, and is used to provide an avoidance space to accommodate the downward deformation of the elastic film layer 220 when it is deformed downward.

[0170] refer to Fig.16In this embodiment, the side wall portion 240 of the valve body 200 is a multi-layer step structure with a hollow opening surrounded by four side walls, so as to facilitate the installation of the first fixed layer 210, the elastic film layer 220 and the second fixed layer 230. The multi-layer step structure includes, from top to bottom, a first step wall 242 forming a first opening size, a second step wall 244 forming a second opening size, and a third step wall 246 forming a third opening size, wherein the third step wall 246 also includes a boss 248 extending inward from one side, and a boss transmission hole 249 formed in the boss 248 and extending downward from the upper surface of the boss 248, and the thickness of the boss 248 is lower than the thickness of the third step wall 246. Optionally, the boss transmission hole 249 can extend downward from the upper surface of the boss 248 and pass through the boss 248. The side wall portion 240 is provided with a side wall outlet 241 on the side wall where the boss 248 is provided, which is connected from the boss transmission hole 249 to the outside of the side wall portion 240. One end of the side wall outlet 241 is connected to the outside of the side wall, and the other end is connected to the transmission hole 249 in the boss 248. The figure shows that the side wall outlet 241 is located at the bottom of the side wall portion 240. It should be understood that the side wall outlet 241 can be set at other suitable positions of the side wall portion as needed. The first opening size of the first step wall 242 matches the first fixed layer 210, and the second opening size of the second step wall 244 matches the elastic film layer 220 and the second fixed layer 230. When the first fixing layer 210, the elastic film layer 220 and the second fixing layer 230 are assembled to the side wall portion 240, the first fixing layer 210 is accommodated in the first opening surrounded by the first step wall 242 and supported by the top surface of the second step wall 244, and the elastic film layer 220 and the second fixing layer 230 are accommodated in the second opening surrounded by the second step wall 244 and supported by the top surface of the third step wall 246. The boss transmission hole 249 of the boss 248 corresponds to the position of the second avoidance opening 234. Thus, the boss 248 of the side wall portion 240 can cooperate with the elastic film layer 220 and the first fixing layer 210 and the second fixing layer 230, and when the elastic film layer 220 is in a downward deformation state, the boss transmission hole 249 of the boss 248 is blocked; when the elastic film layer 220 is in a flat state or an upward deformation state, the boss transmission hole 249 is connected to the space inside the valve body 200. The side wall portion 240 of the valve body 200 is made of an insulating material.

[0171] After assembly, the normally closed hole 212 of the first fixed layer 210 and the film transmission hole 222 of the elastic film layer 220 jointly form a normally closed valve. When the elastic film layer 220 is in an undeformed and flat state, the normally closed hole 212 is closed and the passage is closed; and the first avoidance opening 214 of the first fixed layer 210 and the elastic film layer 220 and the boss transmission hole 249 of the boss 248 jointly form a normally open valve. When the elastic film layer 220 is in an undeformed and flat state, the passage from the inside of the valve body 200 through the boss transmission hole 249 is opened.

[0172] In addition, continue to refer to Fig.16 , two separated through holes that penetrate up and down may be formed in the side wall portion 240, and the through holes are filled with conductive material to form a conductive through hole 250, through which the power supply unit 350 of the bottom substrate 300 is electrically connected to the electrode plate 190 of the pump body 100, thereby supplying power to the piezoelectric element 160 of the pump body 100 and controlling its vibration action. The two conductive through holes 250 are respectively connected to the frame part 196 and the frame part 2 198 of the electrode plate 190 and electrically connected thereto, and then electrically connected to the frame body 170 and the cantilever 194 respectively, thereby supplying power to the piezoelectric element 160 of the vibrator 140 and avoiding short circuit. The provision of the conductive through hole 250 that penetrates up and down of the valve body 200 can effectively reduce the number of components, realize a compact, efficient and reliable power supply and control method, reduce the structural size, and enable the micro integrated piezoelectric pump device to be applicable to more application scenarios. The conductive material can be, for example but not limited to, copper material, silver material, etc.

[0173] like Fig.17 As shown, in this embodiment, the valve body 200 uses the bottom substrate 300 as its bottom plate. The bottom substrate 300 is consistent with the outer shape and size of the side wall portion 240, and the bottom substrate 300 is fixedly connected to the side wall portion 240 below. The bottom substrate 300 is provided with: a power supply unit 350, which corresponds to and is electrically connected to the conductive through hole 250 in the side wall portion 240; a substrate hole 310, which is arranged at the center of the bottom substrate 300, for allowing fluid to enter and exit the valve body 200 without the need for an additional connecting pipe. The bottom substrate 300 also includes a chip as a control unit, a driving device, and an input and output port for electrical connection and communication with the outside. The components arranged on the bottom substrate 300 can avoid the position of the substrate hole 310 and the boss 248 of the side wall portion 240 for easy assembly. The bottom substrate 300 is made of a circuit layer and an insulating layer stacked.

[0174] The following references Figures 18 to 20 , the working process of the valve body 200 of this embodiment is described in detail.

[0175] like Fig.18 As shown, the valve body 200 provided according to an embodiment of the present invention is in a first working state. When the internal and external pressures are consistent, the elastic film layer 220 is in a flat and undeformed state, and the normally closed one-way valve is closed, that is, the normally closed hole 212 of the first fixed layer 210 is blocked by the elastic film layer 220; the normally open one-way valve is opened, that is, the gap between the top of the boss transmission hole 249 and the flat elastic film layer 220 is not blocked, allowing fluid to flow.

[0176] like Fig.19As shown, the valve body 200 provided according to the embodiment of the present invention is in the second working state. When the pump body 100 above the valve body 200 is working, the pressure P2 above the valve body 200 is higher than the pressure P1 inside the valve body 200, the elastic film layer 220 is deformed downward, and the normally closed one-way valve is opened, that is, the elastic film layer 220 deformed downward makes way for the normally closed hole 212 of the first fixed layer 210, so that the normally closed hole 212 is connected to the interior of the valve body 200 via the film transmission hole 222 of the elastic film layer 220. As shown by the arrows in the figure, the fluid enters the interior of the valve body 200 from above through the normally closed hole 212 and the film transmission hole 222, and flows out from the substrate hole 310 of the bottom substrate 300; at the same time, the normally open one-way valve is closed, that is, the elastic film layer 220 deformed downward blocks the boss transmission hole 249 on the boss 248, and the fluid cannot flow from there.

[0177] like Fig. 20 As shown, the valve body 200 provided according to the embodiment of the present invention is in the third working state. When the pump body 100 stops working, the pressure P1 in the valve body 200 is higher than the pressure P2 above the valve body 200, and the elastic film layer 220 is deformed upward, and the normally closed one-way valve is closed, that is, the elastic film layer 220 deformed upward blocks the normally closed hole 212 of the first fixed layer 210, and the fluid cannot flow therethrough; at the same time, the normally open one-way valve is opened, that is, the elastic film layer 220 deformed upward opens the boss transmission hole 249 on the boss 248, as shown by the arrow in the figure, and the fluid enters the interior of the valve body 200 from the bottom through the substrate hole 310 in the center of the bottom substrate 300, passes through the boss transmission hole 249, and is discharged from the valve body 200 through the side wall outlet 241.

[0178] The following is an explanation of the assembly and fixing method of the pump body 100 and the valve body 200. The pump body 100 and the valve body 200 are assembled by fixing the bottom surface of the electrode plate 190 at the bottom of the pump body 100 and the top surface of the side wall portion 240 of the valve body 200 together. The bottom surface of the electrode plate 190 at the bottom of the pump body 100 and the top surface of the side wall portion 240 of the valve body 200 can be bonded by an insulating flexible adhesive, and when bonding, the flexible adhesive avoids the conductor of the conductive through hole 250 of the side wall portion 240 of the valve body 200, so that the conductor of the conductive through hole 250 is respectively in contact with the frame part 196 and the frame part 2 198 of the electrode plate 190 and electrically connected, so as to realize the power supply and control of the piezoelectric element 160 in the pump body 100 from the bottom substrate 300. The circuit for supplying power to the piezoelectric element 160 in the pump body 100 from the bottom substrate 300 is as follows: from one power supply unit 350 of the bottom substrate 300, through one conductive through hole 250 in the side wall 240, the frame portion 196 of the electrode plate 190 electrically connected to the conductive through hole 250, the outer frame 170 above the frame portion 196, and the elastic plate 150 engaged with the outer frame 170, and then electrically connected to the upper surface of the piezoelectric element 160; from another power supply unit 350 of the bottom substrate 300, through another conductive through hole 250 in the side wall 240, the frame portion 198 of the electrode plate 190 electrically connected to the conductive through hole 250, and the cantilever 194 extending from the frame portion 198, and then electrically connected to the lower surface of the piezoelectric element 160. Thus, a power supply circuit for the piezoelectric element 160 is formed.

[0179] In addition, between the pump body 100 and the valve body 200 and between their various layers, a microstructure can be fabricated on a wafer and then combined using eutectic bonding or resin bonding. This allows the bonding of materials to be completed quickly at a relatively low temperature, helps protect the integrity of the device, avoids damage to the device due to high temperature, provides a higher yield, better consistency, and facilitates rapid mass production.

[0180] According to the valve body 200 provided in this embodiment, an integrated design of microelectronics and micromechanics is adopted, and the chip and driving device are integrated on the PCB baseboard. The internal structure is reasonably distributed, which reduces the volume of the piezoelectric pump body and greatly reduces the area and volume of the overall mechanical and electronic solutions. The integrated algorithm IC, i.e., the chip, is integrated on the PCB baseboard, which greatly reduces the downstream application development cycle and improves the space benefits of downstream users. By arranging a circuit path on the side wall to power and communicate with the pump body 100, not only the volume is reduced and the space utilization rate is high, but also external interference is reduced, thereby improving the stability and reliability of the system.

[0181] Example 2

[0182] Fig.21 is a schematic diagram of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention.

[0183] like Fig.21 As shown, a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention includes a pump body 1100 and a valve body 1200 with a circular outer periphery. The pump body 1100 includes, from top to bottom, a top heat sink 1110, a flow channel plate 1120, a resonant plate 1130, an outer frame 1170 with an embedded vibrator 140, and an electrode plate 1190. The above-mentioned multilayer elements included in the pump body 1100 have consistent outer peripheral dimensions and circular outer peripheral shapes, and form a pump body 1100 with a circular outer periphery after assembly. Among them, although the outer peripheral shape of the multilayer element is circular, its internal structure is the same as that of the pump body 100 in the first embodiment above, and will not be repeated here. Since the square opening structure in the middle of the outer frame 1170 is the same as the square opening in the middle of the outer frame 170 in the first embodiment above, the vibrator 140 composed of the elastic plate 150 and the piezoelectric element 160 in the first embodiment can be matched therein.

[0184] The valve body 1200 of this embodiment includes: a first fixing layer 1210 assembled in sequence from top to bottom; an elastic film layer 1220; a second fixing layer 1230; a side wall portion 1240 for fixing and installing the first fixing layer, the elastic film layer and the second fixing layer; and a bottom substrate 1300 fixed to the bottom surface of the side wall portion 1240 and serving as a bottom plate. The side wall portion 1240 and the bottom substrate 1300 included in the valve body 1200 have the same outer peripheral size and circular outer peripheral shape, and after assembly, a valve body 1200 with a circular outer periphery is formed, and matches the above-mentioned pump body 1100. Among them, although the outer peripheral shapes of the side wall portion 1240 and the bottom substrate 1300 of the valve body 1200 are circular, its internal structure is the same as that of the pump body 100 of the first embodiment above, and the first fixing layer, the elastic film layer and the second fixing layer of the valve body 1200 are the same as those in the first embodiment, and no further description is given here.

[0185] Example 3

[0186] Fig. 22 is a schematic diagram of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention. Fig.23 is an isometric view of a top heat sink of a miniature integrated piezoelectric pump device according to another embodiment of the present invention. Fig.24 is an isometric view of a flow channel plate of a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention.

[0187] like Figure 22 to Figure 24As shown, a micro-integrated piezoelectric pump device provided according to another embodiment of the present invention includes a pump body 2100 and a valve body 2200. The valve body 2200 is the same as the valve body 200 in the aforementioned first embodiment. The pump body 2100 includes, from top to bottom, a top heat sink 2110, a flow channel plate 2120, a resonance plate, an outer frame with an embedded vibrator, and an electrode plate. The resonance plate, vibrator, outer frame, and electrode plate of the pump body 2100 have the same structure as the resonance plate 130, vibrator 140, outer frame 170, and electrode plate 190 in the aforementioned first embodiment. As Fig.23 As shown, a plurality of heat dissipation plate holes 2112 are formed in the top heat dissipation plate 2110 of this other embodiment, and penetrate the heat dissipation plate 2110 in the vertical direction. Fig.24 As shown, the flow channel plate 2120 of another embodiment has a central through hole 2122 and a flow channel 2124 connected to the central through hole 2122, wherein the flow channel 2124 is respectively connected to the heat sink hole 2112 formed in the top heat sink 2110, thereby forming a passage for the fluid to enter the pump body 2100. The central through hole 2122 of the flow channel plate 2120 is connected to the central hole of the resonance plate below. The micro integrated piezoelectric pump device provided by this embodiment has a simple processing technology and a low manufacturing cost.

[0188] In the above, the embodiments of the micro-integrated piezoelectric pump device with a rectangular shape and a circular shape are described. However, according to other embodiments of the present invention, as required, the micro-integrated piezoelectric pump device can also be set to other shapes, such as but not limited to rectangle, ellipse, polygon, etc. Among them, the outer frame of the pump body is set to have a square opening, which can adapt to the vibrator structure of the above embodiment without the need to design and manufacture the vibrator separately.

[0189] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A micro integrated piezoelectric pump device, characterized in that: include: The pump body includes, assembled from top to bottom: a top heat sink, a flow channel plate, a resonance plate, an outer frame with an embedded vibrator, and an electrode plate; as well as A valve body installed below the pump body, the valve body comprising, assembled from top to bottom: a first fixing layer, an elastic film layer, a second fixing layer, a side wall portion for fixing and installing the first fixing layer, the elastic film layer and the second fixing layer, and a bottom base plate fixed to the bottom surface of the side wall portion and serving as a bottom plate of the valve body; Wherein, the bottom substrate serves as the bottom plate of the micro-integrated piezoelectric pump device to supply power to and control the pump body; Wherein, the vibrator comprises an elastic plate and a piezoelectric element, the elastic plate has a central reinforcement portion and a support frame surrounding the reinforcement portion, and the piezoelectric element is fixed to the lower surface of the reinforcement portion; And wherein, the outer frame has a square opening for accommodating the vibrator; The first fixed layer, the elastic film layer, the second fixed layer and the side wall of the valve body together form a normally closed valve and a normally open valve; Wherein, in the valve body: The first fixed layer is formed with a normally closed hole and a first avoidance opening; The elastic film layer is formed with a film transmission hole, and the position of the film transmission hole deviates from the position of the normally closed hole; The second fixed layer is formed with a transmission opening and a second avoidance opening, the area of ​​the transmission opening covers the area of ​​the normally closed hole and the area of ​​the film transmission hole, and the position of the second avoidance opening corresponds to the first avoidance opening; The side wall portion has a boss extending inward from one side, a boss transmission hole extending downward from the upper surface thereof is formed in the boss, and a side wall outlet is formed on the side wall where the boss is provided, which is connected from the boss transmission hole to the outside of the side wall portion in a side direction, and the position of the boss transmission hole corresponds to the first avoidance opening and the second avoidance opening; The normally closed hole of the first fixed layer, the film transmission hole of the elastic film layer, and the transmission opening of the second fixed layer constitute a normally closed valve; And the first avoidance opening of the first fixed layer, the elastic film layer, the second avoidance opening of the second fixed layer and the boss transmission hole of the boss form a normally open valve.

2. The micro-integrated piezoelectric pump device according to claim 1, characterized in that: In the pump body: The flow channel plate has a central through hole and a flow channel connecting the central through hole with the outside of the flow channel plate; The resonant plate has a central hole, which is connected to the central through hole of the flow channel plate; The electrode plate has a surrounding frame and a cantilever extending inwardly from the surrounding frame; Wherein, the central through hole of the flow channel plate, the central hole of the resonance plate, the reinforcing portion of the elastic plate and the piezoelectric element are coaxial; And wherein, the top heat sink, flow channel plate, resonance plate and outer frame of the pump body have the same peripheral size and shape.

3. The micro-integrated piezoelectric pump device according to claim 2, characterized in that: The support frame of the elastic plate includes four side beams and four diagonal support beams which are alternately connected to each other to form an octagonal structure.

4. The micro-integrated piezoelectric pump device according to claim 1, characterized in that: The flow channel plate, the resonance plate, and the outer frame with the embedded vibrator are assembled together by bonding.

5. The micro-integrated piezoelectric pump device according to claim 1, characterized in that: In the valve body: Two separated through holes extending vertically and horizontally are formed in the side wall portion, and the through holes are filled with conductive material to form conductive through holes, through which the power supply unit of the bottom substrate is electrically connected to the electrode plate of the pump body.

6. The micro-integrated piezoelectric pump device according to claim 5, characterized in that: In the valve body: The bottom substrate is provided with a power supply unit and a control unit, and a through substrate hole is provided at a central position.

7. The micro-integrated piezoelectric pump device according to claim 6, characterized in that: The surrounding frame of the electrode plate of the pump body comprises a first frame portion and a second frame portion separated by an insulating strip, wherein the cantilever extends inwardly from the second frame portion, and the first frame portion is electrically connected to the outer frame above it; The upper ends of the two conductive through holes in the side wall of the valve body are electrically connected to the first and second enclosure frames respectively, and the lower ends of the two conductive through holes are electrically connected to the power supply unit of the bottom substrate.

8. The micro-integrated piezoelectric pump device according to any one of claims 1 to 7, characterized in that: The outer circumference of the pump body and the valve body is rectangular or circular.

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