A method for evaluating the solder filling capacity of heterogeneous brazing joints

Abstract

The present invention relates to a method for evaluating the solder filling capacity of a heterogeneous brazing joint, comprising: step one, assembling a test piece A and a test piece B made of different materials into a test assembly; step two, placing the solder at a preset position of the test assembly, heating the solder to melt the solder, and measuring and recording the climbing height of the solder on the test piece A after the solder solidifies. h A , and the height of the solder climbing on the B test piece h B ; Step 3, calculate h A and h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ;according to k The value of the value can be used to judge whether the brazing filler metal is suitable for brazing heterogeneous components composed of material A and material B. The method provided by the present invention can complete the evaluation of the brazing filler metal filling capacity of heterogeneous brazing joints with only a small number of tests. The test method is simple, highly operable, and has a small test error, which has a strong guiding significance for the selection of brazing filler metal for brazing heterogeneous components.

Description

Technical Field

[0001] The invention belongs to the technical field of brazing, and in particular relates to a method for evaluating the filling capacity of brazing material of a heterogeneous brazing joint. Background Art

[0002] With the rapid development of materials science, new materials such as light metals (aluminum, magnesium, titanium) and lightweight and high-strength ceramics and ceramic-based composites, C / C composites, and intermetallic compounds are constantly emerging, and these materials have put forward new requirements for welding technology. At the same time, in actual production, energy conservation and emission reduction, low-cost manufacturing, and structural and functional integration are gradually taken as the goals, so that composite structures composed of different materials (dissimilar metals or metal-non-metals) are increasingly widely used. The connection of heterogeneous material components can maximize the performance of each material and is the key to obtaining heterogeneous material composite structures with excellent performance. The connection of heterogeneous material components and the safe and long-term use of their connection structures are increasingly valued by related industries, and brazing has gradually become the mainstream method for connecting heterogeneous material components. At present, when brazing heterogeneous material components, there are mainly the following technical difficulties: the difference in wettability of the brazing material to the heterogeneous material components leads to problems such as asynchronous wetting, difficulty in coordinated flow laying, and difficulty in complete filling.

[0003] In the face of the above technical difficulties, in order to achieve reliable brazing of heterogeneous material components, it is necessary to select and evaluate the brazing filler metal according to the heterogeneous material components to be connected before brazing. Filling capacity refers to the filling process of liquid brazing filler metal in the capillary gap of heterogeneous materials, which determines the fullness, density and joint strength of the brazed joint. It is the main evaluation index for measuring the wetting and filling connection performance of the brazing filler metal on heterogeneous material components. However, there is no evaluation method for the filling capacity of brazing filler metal related to heterogeneous material components in the prior art.

[0004] Therefore, there is an urgent need to propose a method for evaluating the solder filling capacity that meets the requirements of brazing heterogeneous components. Summary of the invention

[0005] The purpose of the present invention is to provide a method for evaluating the filling capacity of solder for heterogeneous brazing joints, to evaluate the filling performance of solder used for connecting dissimilar material components, to provide a reliable basis for the selection of solder, and to achieve highly reliable connection of dissimilar material components.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is: a method for evaluating the filling capacity of a heterogeneous brazing joint, comprising:

[0007] Step 1: prepare a test piece A made of material A and a test piece B made of material B, and assemble the test piece A and the test piece B according to a preset method to obtain a test assembly;

[0008] Step 2: Place the solder at the preset position of the test assembly, heat it to melt it, and measure and record the height of the solder climbing on the A test piece after it solidifies. h A , and the height of the solder climbing on the B test piece h B ;

[0009] Step 3: Calculate h A and h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ;

[0010] When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is equivalent, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material;

[0011] When m< k ≤n, n is the second judgment value, then it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is slightly different, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements;

[0012] when k >n, it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is quite different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of material A and material B.

[0013] Preferably, the first judgment value m is in the range of 1.3 to 1.5, the second judgment value n is in the range of 1.5 to 2, and nm≥0.2.

[0014] The beneficial effects of the present invention are as follows: the method for evaluating the solder filling capacity of heterogeneous brazing joints provided by the present invention uses a test piece A and a test piece B of different materials as test objects, and tests the climbing height of the solder on the two test pieces. h A andh B , innovatively introduces the coefficient of variation k ( k = h A / h B or k = h B / h A ), and according to k The value can be used to judge whether the brazing filler metal is suitable for brazing heterogeneous components composed of material A and material B, thereby providing guidance for the selection of brazing filler metal when brazing heterogeneous components, and ensuring the reliability of brazing heterogeneous components. The method provided by the present invention only requires a small number of tests to complete the evaluation of the filling capacity of the brazing filler metal for brazing heterogeneous components. The test method is simple, highly operable, and has a small test error, which has a strong guiding significance for the selection of brazing filler metal for brazing heterogeneous components.

[0015] Based on the above-mentioned method for evaluating the solder filling capacity of heterogeneous brazing joints, it can be achieved through a variety of technical solutions, among which the first technical solution is:

[0016] Preferably, in step one, the test assembly includes test assembly I and test assembly II; in test assembly I, test piece A is an arc plate with a through hole A radially penetrating the arc plate, and test piece B is a flat plate, and during testing, test piece A is placed on test piece B with its opening facing upward; in test assembly II, test piece A is a flat plate, and test piece B is an arc plate with a through hole B radially penetrating the arc plate, and during testing, test piece B is placed on test piece A with its opening facing upward.

[0017] Optionally, in step 2: place solder at the position of through hole A on the inner surface of the A test piece, heat the solder to melt it, and let the melted solder flow out of through hole A. After the solder solidifies, measure and record the height of the solder climbing on the outer surface of the A test piece. h A ; Place solder at the B through-hole position on the inner surface of the B test piece, heat it to melt the solder, and the melted solder flows out of the B through-hole. After the solder solidifies, measure and record the height of the solder climbing on the outer surface of the B test piece h B .

[0018] The direct measurement used in step 2 above is h A and h B method, because h A and h BThe value of is usually small, and it is difficult to measure directly, which may lead to large errors. Therefore, the present invention also provides another method to obtain h A and h B Method:

[0019] Preferably, in step 2: place solder at the position of through hole A on the inner surface of test piece A, heat to melt the solder, and allow the melted solder to flow out of through hole A, and after the solder solidifies, measure and record the flow length of the solder on the upper surface of test piece B. l B ,according to l B Calculate the height of the solder climbing on the outer surface of test piece A h A , , where R A is the outer surface radius of test piece A; place solder at the B through-hole position on the inner surface of test piece B, heat it to melt the solder, and the melted solder flows out from through-hole B. After the solder solidifies, measure and record the flow length of the solder on the upper surface of test piece A. l A ,according to l A Calculate the height of the solder climbing on the outer surface of test piece B h B , , where R B is the outer surface radius of test piece B.

[0020] Since the solder is relatively easy to spread in the horizontal direction, the spread length is long and the measurement difficulty is relatively small, so it can be measured by l A and l B , then according to l A and l B Calculated h A and h B ,This method can greatly reduce the experimental error and ensure the accuracy of the test data.

[0021] The second technical solution provided by the present invention is:

[0022] Preferably, in step one, the A test piece includes an A arc plate portion and an A flat plate portion, and the B test piece includes a B arc plate portion and a B flat plate portion, the A arc plate portion and the B arc plate portion have the same curvature radius, the A arc plate portion and the B arc plate portion are spliced ​​in a circumferential direction to form a spliced ​​arc plate, a radially penetrating through hole is provided at the splicing position of the spliced ​​arc plate, the A flat plate portion and the B flat plate portion have the same thickness, the A flat plate portion and the B flat plate portion are spliced ​​to form a spliced ​​flat plate, and during testing, the spliced ​​arc plate is placed on the spliced ​​flat plate with its opening facing upward to form a test assembly, and the A arc plate portion is located above the B flat plate portion, and the B arc plate portion is located above the A flat plate portion.

[0023] Optionally, in step 2, solder is placed at the through hole position on the inner surface of the spliced ​​arc plate, heated to melt the solder, and the melted solder flows out of the through hole. After the solder solidifies, the height of the solder climbing on the outer surface of the A arc plate portion is measured and recorded. h A And the climbing height on the outer surface of the B arc plate h B .

[0024] Similarly, in this technical solution, the method of the first technical solution can also be used to calculate indirectly h A and h B .

[0025] Preferably, in step 2: place solder at the through hole position on the inner surface of the spliced ​​arc plate, heat to melt the solder, and the melted solder flows out of the through hole, and after the solder solidifies, measure and record the flow length of the solder on the upper surface of the B flat plate portion. l B , and the flow length of the solder on the upper surface of the A flat plate portion l A , then according to l B Calculate the height of the solder climbing on the outer surface of the A arc plate h A and according to l A Calculate the height of the solder climbing on the outer surface of the B arc plate h B ,in , R A is the outer surface radius of the arc plate part A, R B is the outer surface radius of the B arc plate part.

[0026] Compared with the first technical solution, the advantage of this technical solution is that one test component can be used to obtain hA and h B This can not only save test materials and improve test efficiency, but also avoid test errors caused by factors such as different test components.

[0027] The third technical solution provided by the present invention is:

[0028] Preferably, in step one, both test piece A and test piece B are arc plates, the opening sides of test piece A and test piece B are butt-jointed to form a test tube, the test tube is vertically placed on the bottom plate and sealed to the bottom plate to obtain the test assembly.

[0029] Preferably, in step 2, the solder is placed in the test tube and placed on the bottom plate, heated to melt the solder, and after the solder solidifies, the height of the solder climbing on the test piece A on the inner wall of the test tube is measured and recorded. h A And the climbing height on the B test piece h B .

[0030] The advantages of this technical solution are: the structure of the test component is relatively simple, and one test can obtain h A and h B The numerical value is beneficial to saving test materials and test time and reducing the test errors caused by different tests.

[0031] The fourth technical solution provided by the present invention is:

[0032] Preferably, in step 1, the test component includes test component III and test component IV;

[0033] In test assembly III, test piece A is an axial spiral, and test piece B is a flat plate. During the test, test piece A is placed on test piece B, and the axis of test piece A extends in the vertical direction;

[0034] In test assembly IV, test piece A is a flat plate, and test piece B is an axial spiral. During the test, test piece B is placed on test piece A, and the axis of test piece B extends in the vertical direction.

[0035] Preferably, in step 2: in the test assembly III, the solder is placed inside the test piece A and on the test piece B, heated to melt the solder, and after the solder solidifies, the height of the solder climbing along the test piece A is measured and recorded. h A In the test assembly IV, the solder is placed inside the B test piece and placed on the A test piece, heated to melt the solder, and after the solder solidifies, the solder's climbing height along the B test piece is measured and recorded hB .

[0036] The advantages of this technical solution are: it is simpler and more convenient to measure the climbing height of the solder, and the climbing height of the solder can be seen more intuitively. In addition, the axial spiral style test piece can guide the climbing of the liquid solder, which is more conducive to the climbing of the solder and makes the climbing height of the solder higher, thereby helping to reduce measurement errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 is a schematic diagram of the structure of the test component I in Example 1;

[0039] Figure 2 It is a schematic diagram of the structure of the test component II in Example 1;

[0040] Figure 3 is a schematic diagram of the test component I in Example 1 after being filled with solder;

[0041] Figure 4 This is a schematic diagram of the test component II in Example 1 after being filled with solder;

[0042] Figure 5 Schematic diagram of the calculation model in Example 1;

[0043] Figure 6 This is a schematic diagram of the structure of the test assembly in Example 2;

[0044] Figure 7 This is a schematic diagram after solder filling in Example 2;

[0045] Figure 8 This is a test schematic diagram of the test assembly in Example 3;

[0046] Fig. 9 It is a schematic diagram of the structure of the test component III in Example 4;

[0047] Fig.10 This is a schematic diagram of the structure of the test component IV in Example 4;

[0048] Fig.11 is another structural schematic diagram of the test component III in Example 4;

[0049] Markings in the figure: 100, test component I, 200, test component II; 300, test component III; 400, test component IV;

[0050] 1. Test piece A, 2. Test piece B, 3. Solder, 4. Through hole A, 5. Through hole B, 6. Solder melt, 7. Arc plate part A, 8. Flat plate part B, 9. Flat plate part A, 10. Arc plate part B, 11. Through hole AB, 12. Bottom plate. DETAILED DESCRIPTION

[0051] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, but they are not intended to limit the invention in any way.

[0052] Embodiment 1: A method for evaluating the solder filling capacity of a heterogeneous brazing joint comprises the following steps:

[0053] Step 1: prepare a test piece A 1 and a test piece B 2, wherein the test piece A 1 is made of material A, and the test piece B 2 is made of material B, and assemble the test piece A 1 and the test piece B 2 in a preset manner to form a test assembly;

[0054] Specifically, the test assembly includes a test assembly I100 and a test assembly II200; in the test assembly I100, the A test piece 1 is an arc plate, and is provided with an A through hole 4 radially penetrating the arc plate, and the B test piece 2 is a flat plate. During the test, the A test piece 1 is placed on the B test piece 2 with its opening facing upward, and the lower end of the A through hole 4 contacts the upper surface of the B test piece 2; in the test assembly II200, the A test piece 1 is a flat plate, and the B test piece 2 is an arc plate, and is provided with a B through hole 5 radially penetrating the arc plate. During the test, the B test piece 2 is placed on the A test piece 1 with its opening facing upward, and the lower end of the B through hole 5 contacts the upper surface of the A test piece 1;

[0055] Step 2, such as Figure 1 , 3 As shown, in the test assembly Ⅰ100, the solder 3 is placed at the position of the A through hole 4 on the inner surface of the A test piece 1, and the solder 3 is heated to melt. The molten solder melt flows out from the A through hole 4. After the solder melt solidifies, the climbing height of the solder melt on the outer surface of the A test piece 1 is measured and recorded. h A ;

[0056] like Figure 2 , 4 As shown, in the test assembly II 200, the solder is placed at the position of the B through hole 5 on the inner surface of the B test piece 2, and the solder 3 is heated to melt. The molten solder melt flows out from the B through hole 5. After the solder solidifies, the height of the solder climbing on the outer surface of the B test piece 2 is measured and recorded. h B ;

[0057] Step 3: Calculate h A and h B The coefficient of difference between the two k , k = h A / h B ( h A > h B >0), or k = h B / h A ( h B > h A >0);

[0058] When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing material for the A test piece 1 and the B test piece 2 is equivalent, and the brazing material can be used to braze the heterogeneous components composed of the A material and the B material;

[0059] When m< k ≤n, n is the second judgment value, then it is judged that the filling capacity of the brazing filler metal for the A test piece 1 and the B test piece 2 is slightly different, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements;

[0060] when k >n, it is judged that the filling capacity of the brazing filler metal for the A test piece 1 and the B test piece 2 is quite different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of the A material and the B material.

[0061] It should be noted that m and n can be adjusted according to actual needs. When the post-welding performance and service conditions of the dissimilar material brazing workpiece are more stringent, the values ​​of m and n can be appropriately reduced to meet the use requirements of the workpiece; when the post-welding performance and service conditions of the dissimilar material brazing workpiece are generally required, the values ​​of m and n can be appropriately increased to increase the selection range of brazing filler metals and facilitate the rapid determination of suitable brazing filler metals.

[0062] The present invention provides the value range of m and n in general, wherein the value range of m is 1.3-1.5, the value range of n is 1.5-2, and nm≥0.2. Due to the inevitable existence of some experimental errors, if the difference between n and m is too small, the influence of the experimental error will be magnified, which is not conducive to the selection of solder.

[0063] Preferably, in step 2, the climbing height of the outer surface of the test piece 1 in the measuring test assembly Ⅰ100 is h A When the solder climbing height is measured on the left and right outer surfaces of the A test piece 1, the average value can be obtained. h A This is more conducive to ensuring the accuracy of the measurement data. In addition, it is further preferred that when measuring the climbing height of the outer surface of the test piece A 1 h A When measuring, you can also take multiple points along the axis of the arc plate of the A test piece 1 for measurement, and then calculate the average value to get h A .

[0064] Similarly, in step 2, the climbing height of the outer surface of the B test piece 2 in the measuring test assembly II 200 is h B When the solder climbing height of the left and right outer surfaces of the B test piece 2 is measured, the average value can be obtained. h B This is more conducive to ensuring the accuracy of the measurement data. In addition, it is further preferred that when measuring the climbing height of the outer surface of the B test piece 2 h B When the test piece B is used, it is also possible to measure points at multiple locations along the axis of the arc plate 2 of the test piece B, and then calculate the average value to obtain h B .

[0065] The direct measurement used in step 2 above is h A and h B method, because h A and h B The value of is usually small, and it is difficult to measure directly, which may lead to large errors. Therefore, the present invention also provides another method to obtain h A and h B Method: To obtain h B For example, in step 2, after the solder in the tested component II 200 solidifies, the flow length of the solder on the upper surface of the A test piece 1 is measured and recorded. l A , and establish Figure 5 The calculation model shown in the figure has the following geometric relationship: α+β=π / 2, h B 2 + l A2 =m 2 , according to the cosine theorem:

[0066]

[0067]

[0068] Also because

[0069] but

[0070] Right now:

[0071] The solution is:

[0072] Similarly, in step 2, the flow length of the solder on the upper surface of the B test piece 2 can be measured and recorded from the test assembly Ⅰ100. l B , and then we can get: .

[0073] In the above formulas, R B is the outer radius of test piece 2 B in test assembly II 200, R A is the outer radius of test piece 1 A in test assembly Ⅰ100.

[0074] Preferably, in step 2, for the test assembly I100, the flow length of the upper surface of the test piece B 2 is measured. l B When the flow length of the left and right sides of the B test piece 2 is measured, the average value is calculated. l B This is more conducive to ensuring the accuracy of the measurement data. In addition, it is further preferred that the flow length of the upper surface of the B test piece is measured. l B When the arc plate of the A test piece 1 is extended, it is also possible to measure points at multiple locations of the B test piece 2 along the axis of the arc plate of the A test piece 1, and then calculate the average value to obtain l B .

[0075] Similarly, in step 2, for test component II 200, the flow length of the upper surface of test piece A 1 is measured. l A When the flow length of the left and right sides of the A test piece 1 is measured, the average value is calculated. l AThis is more conducive to ensuring the accuracy of the measurement data. In addition, it is further preferred that the flow length of the upper surface of the A test piece 1 is measured. l A When the arc plate of the test piece B is extended, it is also possible to measure points at multiple positions of the test piece A 1 along the axis of the arc plate of the test piece B 2, and then calculate the average value to obtain l A .

[0076] Since the solder is relatively easy to spread in the horizontal direction, the spread length is long and the measurement difficulty is relatively small, so it can be measured by l A and l B , then according to l A and l B Calculated h A and h B ,This method can greatly reduce the experimental error and ensure the accuracy of the test data.

[0077] Embodiment 2: The method described in this embodiment is different from that in Embodiment 1 in that: this embodiment uses only one test component to obtain h A and h B The value can not only save test materials and improve test efficiency, but also avoid test errors caused by factors such as different test components.

[0078] like Figure 6 As shown, the composition of the test assembly of this embodiment is as follows: the A test piece made of material A includes an A arc plate part 7 and an A flat plate part 9, and the B test piece made of material B includes a B arc plate part 10 and a B flat plate part 8. The A arc plate part 7 and the B arc plate part 10 have the same curvature radius, the A arc plate part 7 and the B arc plate part 10 are spliced ​​in the circumferential direction to form a spliced ​​arc plate, and a radially penetrating AB through hole 11 is provided at the splicing position of the spliced ​​arc plate. The A flat plate part 9 and the B flat plate part 8 have the same thickness, and the A flat plate part 9 and the B flat plate part 8 are spliced ​​to form a spliced ​​flat plate. During testing, the spliced ​​arc plate is placed on the spliced ​​flat plate with its opening facing upward to form a test assembly, and the A arc plate part 7 is located above the B flat plate part 8, and the B arc plate part 10 is located above the A flat plate part 9.

[0079] Recombination Figure 7 As shown, during the test, a solder 3 is placed at the position of the AB through hole 11 on the inner surface of the spliced ​​arc plate, and the solder is heated to melt. The molten solder flows out of the through hole, and after the solder solidifies, the height of the solder climbing on the outer surface of the A arc plate part 7 is measured and recorded.h A And the climbing height on the outer surface of the B arc plate part 10 h B Calculate according to the method of Example 1 h A and h B The coefficient of difference between the two k , the filling performance of the solder for test piece A and test piece B was evaluated based on the difference coefficient.

[0080] Similar to Example 1, when measuring the climbing height h A and h B When measuring the height of the outer surface of the arc plate portion 7, the influence of the measurement error can be reduced by taking the average value through multiple measurements. h A When the A arc plate portion 7 is extended along the axis, multiple points can be taken for measurement, and then the average value can be obtained. h A . When measuring the climbing height of the outer surface of the B arc plate h B When the B arc plate is extended, multiple points can be taken along the axis of the arc plate to measure, and then the average value can be obtained. h B .

[0081] Preferably, this embodiment can also use the method of embodiment 1 to obtain the climbing height by indirect calculation. h A and h B .like Figure 7 As shown, the flow length of the solder on the upper surface of the B flat plate portion 8 is measured. l B , and the flow length of the solder on the upper surface of the A flat plate portion 9 l A , then according to l B Calculate the height of the solder climbing on the outer surface of the A arc plate part 7 h A and according to l A Calculate the climbing height of the solder on the outer surface of the B arc plate portion 10 h B ,in , , R A is the outer surface radius of the A arc plate portion 7, R Bis the outer surface radius of the B arc plate portion 10.

[0082] Similarly, the influence of measurement error can be reduced by measuring the flow length multiple times and averaging the average value. l B When the value is , it is possible to measure at multiple positions of the B flat plate portion 8 along the axis extension direction of the A arc plate portion 7, and then obtain the average value. l B Similarly, when measuring the flow length of the upper surface of the A flat plate portion 9 l A When the value is , it is possible to measure at multiple positions of the A flat plate portion 9 along the axis extension direction of the B arc plate portion 10, and then obtain the average value. l A .

[0083] Embodiment 3: Compared with Embodiment 1, the difference between this embodiment and Embodiment 1 is that: this embodiment uses only one test component to obtain h A and h B The value can not only save test materials and improve test efficiency, but also avoid test errors caused by factors such as different test components.

[0084] The difference between this embodiment and embodiment 2 is that the structure of the test component is different. For details, please refer to Figure 8 As shown, the test assembly includes two arc plates and a bottom plate. The two arc plates are respectively an A test piece 1 made of material A and a B test piece 2 made of material B, and the A test piece 1 and the B test piece 2 can be butt-jointed to form a cylindrical test tube. The bottom plate 12 is a flat plate. Before the test, the test tube is vertically placed on the bottom plate 12 and sealed to the bottom plate 12 to form the test assembly.

[0085] During the test, the solder to be tested is placed in the test tube and placed on the bottom plate 12, heated to melt the solder, and after the solder melt 6 solidifies, the climbing height of the solder melt 6 on the test piece 1 on the inner wall A of the test tube is measured and recorded. h A And the climbing height on B test piece 2 h B Then, according to the method of Example 1, the difference coefficient is calculated, and the filling performance of the solder on the A test piece 1 and the B test piece 2 is evaluated based on the difference coefficient.

[0086] Embodiment 4: Compared with Embodiment 1, this embodiment differs in that the structure of the test assembly is different. Fig. 9 , 10As shown, the test component of this embodiment includes test component III300 and test component IV400. In test component III300, test piece A 1 is an axial spiral made of material A, and test piece B 2 is a flat plate made of material B. During testing, test piece A 1 is placed on test piece B 2, and the axis of test piece A 1 extends in the vertical direction. In test component IV400, test piece A 1 is a flat plate made of material A, and test piece B 2 is an axial spiral made of material B. During testing, test piece B 2 is placed on test piece A 1, and the axis of test piece B 2 extends in the vertical direction.

[0087] When testing with test assembly III300, place the solder inside test piece A 1 and on test piece B 2, heat to melt the solder, and after the solder solidifies, measure and record the height of the solder climbing along test piece A 1. h A When using the test assembly IV400 for testing, place the solder inside the B test piece 2 and on the A test piece 1, heat it to melt the solder, and after the solder solidifies, measure and record the height of the solder climbing along the B test piece 2. h B Then, according to the method of Example 1, the difference coefficient was calculated, and the filling performance of the solder to the A test piece 1 and the B test piece 2 was evaluated based on the difference coefficient.

[0088] exist Fig. 9 , 10 In the embodiment, the axial helical body is made of metal and extends to a certain height in the axial spiral, and the axial helical body is a constant pitch helical body; in other embodiments, the axial helical body can also be a variable pitch helical body. Fig.11 As shown, the A test piece 1 of the test assembly III 300 is the variable pitch helicoid. Similarly, the B test piece 2 in the test assembly IV 400 can also be Fig.11 The variable pitch helicoid shown.

[0089] The above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. Those skilled in the art should understand that the specific implementation modes of the present invention may be modified or replaced by equivalents with reference to the above embodiments. Any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention are within the scope of protection of the pending claims.

Claims

1. A method for evaluating the solder filling capacity of heterogeneous brazing joints, characterized in that: include: Step 1: prepare a test piece A made of material A and a test piece B made of material B, and assemble the test piece A and the test piece B to obtain a test assembly; the test assembly includes a test assembly I and a test assembly II; In the test assembly I, the A test piece is an arc plate, and is provided with an A through hole radially penetrating the arc plate, and the B test piece is a flat plate. During the test, the A test piece is placed on the B test piece with the opening facing upwards; In the test assembly II, the A test piece is a flat plate, the B test piece is an arc plate, and a through hole B is provided which radially penetrates the arc plate. During the test, the B test piece is placed on the A test piece with its opening facing upwards; Step 2: Place solder at the position of through hole A on the inner surface of the A test piece, and place solder at the position of through hole B on the inner surface of the B test piece. Heat the solder to melt it. The melted solder flows out from through hole A and through hole B respectively. After the solder solidifies, measure and record the climbing height of the solder on the A test piece. h A , and the climbing height of the solder on the B test piece h B ; Step 3: Calculate the h A With the h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ; When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing material for the A test piece and the B test piece is equivalent, and the brazing material can be used to braze the heterogeneous components composed of the A material and the B material; When m< k ≤n, n is the second judgment value, then it is judged that the difference in filling capacity of the brazing filler metal for the A test piece and the B test piece is small, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements; when k >n, it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is greatly different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of material A and material B; The value range of the first judgment value m is 1.3~1.5, the value range of the second judgment value n is 1.5~2, and nm≥0.

2.

2. The method for evaluating the solder filling capacity of heterogeneous brazing joints according to claim 1, characterized in that: In the step 2: placing solder at the position of the through hole A on the inner surface of the test piece A, heating the solder to melt the solder, and the melted solder flows out of the through hole A, and after the solder solidifies, measuring and recording the flow length of the solder on the upper surface of the test piece B l B ,according to l B Calculate the height of the solder climbing on the outer surface of the A test piece h A , , where R A is the outer surface radius of test piece A; Place solder at the B through-hole position on the inner surface of the B test piece, heat it to melt the solder, and let the melted solder flow out of the B through-hole. After the solder solidifies, measure and record the flow length of the solder on the upper surface of the A test piece. l A ,according to l A Calculate the height of the solder climbing on the outer surface of the B test piece h B , , where R B is the outer surface radius of test piece B.

3. A method for evaluating the solder filling capacity of heterogeneous brazing joints, characterized in that: include: Step 1: prepare a test piece A made of material A and a test piece B made of material B; The A test piece includes an A arc plate portion and an A flat plate portion, and the B test piece includes a B arc plate portion and a B flat plate portion, the A arc plate portion and the B arc plate portion have the same curvature radius, the A arc plate portion and the B arc plate portion are spliced ​​in the circumferential direction to form a spliced ​​arc plate, a radially penetrating through hole is provided at the splicing position of the spliced ​​arc plate, the A flat plate portion and the B flat plate portion have the same thickness, the A flat plate portion and the B flat plate portion are spliced ​​to form a spliced ​​flat plate, and during testing, the spliced ​​arc plate is placed on the spliced ​​flat plate with its opening facing upward to form a test assembly, and the A arc plate portion is located above the B flat plate portion, and the B arc plate portion is located above the A flat plate portion; Step 2: Place solder at the through hole position on the inner surface of the spliced ​​arc plate, heat to melt the solder, and let the melted solder flow out of the through hole. After the solder solidifies, measure and record the height of the solder climbing on the outer surface of the A arc plate portion. h A And the climbing height on the outer surface of the B arc plate part h B ; Step 3: Calculate the h A With the h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ; When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing material for the A test piece and the B test piece is equivalent, and the brazing material can be used to braze the heterogeneous components composed of the A material and the B material; When m< k ≤n, n is the second judgment value, then it is judged that the difference in filling capacity of the brazing filler metal for the A test piece and the B test piece is small, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements; when k >n, it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is greatly different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of material A and material B; The value range of the first judgment value m is 1.3~1.5, the value range of the second judgment value n is 1.5~2, and nm≥0.

2.

4. The method for evaluating the solder filling capacity of heterogeneous brazing joints according to claim 3, characterized in that: In the step 2, a solder is placed at the through hole position on the inner surface of the spliced ​​arc plate, heated to melt the solder, and the melted solder flows out of the through hole. After the solder solidifies, the flow length of the solder on the upper surface of the B flat plate portion is measured and recorded. l B , and the flow length of the solder on the upper surface of the A flat plate portion l A , then according to l B Calculate the height of the solder climbing on the outer surface of the A arc plate h A and according to l A Calculate the height of the solder climbing on the outer surface of the B arc plate h B ,in , , R A is the outer surface radius of the arc plate part A, R B is the outer surface radius of the B arc plate part.

5. A method for evaluating the solder filling capacity of heterogeneous brazing joints, characterized in that: include: Step 1: prepare a test piece A made of material A and a test piece B made of material B; The A test piece and the B test piece are both arc plates, the opening sides of the A test piece and the B test piece are butted together to form a test cylinder, the test cylinder is vertically placed on a bottom plate and sealedly connected to the bottom plate to obtain a test assembly; Step 2: Place the solder in the test tube and place it on the bottom plate, heat it to melt the solder, and after the solder solidifies, measure and record the height of the solder climbing on the A test piece on the inner wall of the test tube. h A And the climbing height on the B test piece h B ; Step 3: Calculate the h A With the h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ; When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing material for the A test piece and the B test piece is equivalent, and the brazing material can be used to braze the heterogeneous components composed of the A material and the B material; When m< k ≤n, n is the second judgment value, then it is judged that the difference in filling capacity of the brazing filler metal for the A test piece and the B test piece is small, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements; when k >n, it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is greatly different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of material A and material B; The value range of the first judgment value m is 1.3~1.5, the value range of the second judgment value n is 1.5~2, and nm≥0.

2.

6. A method for evaluating the solder filling capacity of heterogeneous brazing joints, characterized in that: include: Step 1: prepare a test piece A made of material A and a test piece B made of material B, and assemble the test piece A and the test piece B in a preset manner to obtain a test assembly; the test assembly includes test assembly III and test assembly IV; In the test assembly III, the A test piece is an axial spiral body, and the B test piece is a plate. During the test, the A test piece is placed on the B test piece, and the axis of the A test piece extends in the vertical direction; In the test assembly IV, the A test piece is plate-shaped, and the B test piece is an axial spiral. During the test, the B test piece is placed on the A test piece, and the axis of the B test piece extends in the vertical direction; Step 2: In the test assembly III, place the solder inside the A test piece and on the B test piece, heat the solder to melt it, and measure and record the height of the solder climbing along the A test piece after the solder solidifies. h A ; In the test assembly IV, the solder is placed inside the B test piece and on the A test piece, heated to melt the solder, and after the solder solidifies, the height of the solder climbing along the B test piece is measured and recorded. h B ; Step 3: Calculate the h A With the h B The coefficient of difference between the two k ,when h A > h B >0 o'clock, k = h A / h B ,when h B > h A >0 o'clock, k = h B / h A ; When 1≤ k ≤m, m is the first judgment value, then it is judged that the filling capacity of the brazing material for the A test piece and the B test piece is equivalent, and the brazing material can be used to braze the heterogeneous components composed of the A material and the B material; When m< k ≤n, n is the second judgment value, then it is judged that the difference in filling capacity of the brazing filler metal for the A test piece and the B test piece is small, and the brazing filler metal can be used to braze the heterogeneous components composed of the A material and the B material while meeting the performance requirements; when k >n, it is judged that the filling capacity of the brazing filler metal for the test piece A and the test piece B is greatly different, and it is not recommended to use the brazing filler metal to braze the heterogeneous components composed of material A and material B; The value range of the first judgment value m is 1.3~1.5, the value range of the second judgment value n is 1.5~2, and nm≥0.2.

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