A gallium nitride device and a gallium nitride packaging structure

Abstract

The present invention discloses a gallium nitride device and a gallium nitride packaging structure, and specifically relates to the field of gallium nitride packaging technology, comprising a gallium nitride device body, wherein the gallium nitride device body comprises a bottom package, wherein a second packaging frame is arranged at the bottom end of the bottom package, and a gallium nitride chip is arranged between the bottom package and the second packaging frame; the present invention, by providing a bottom module, cooperates with a first packaging mechanism and a second packaging mechanism, performs plastic sealing and fixing of a heat dissipation bottom plate and a plurality of connecting pins to form a bottom package, thereby realizing primary packaging of the bottom of the gallium nitride device, and performs plastic sealing and fixing of the bottom package and the gallium nitride chip to realize secondary packaging of the gallium nitride device; the gallium nitride device is packaged and fixed in the form of primary packaging and secondary packaging, thereby facilitating connection and fixing between components in the gallium nitride device, facilitating subsequent separate disassembly of the second packaging frame to perform inspection and repair of the gallium nitride chip, and improving the packaging effect in the gallium nitride device.

Description

Technical Field

[0001] The present invention relates to the technical field of gallium nitride packaging, and in particular to a gallium nitride device and a gallium nitride packaging structure. Background Art

[0002] Gallium nitride devices are electronic devices made based on gallium nitride materials. Gallium nitride is a wide bandgap semiconductor material with a very wide direct band gap, a very high breakdown field strength, a very high thermal conductivity and very good physical and chemical stability. In addition, like nitrides of other group elements, nickel nitride is less sensitive to ionizing radiation and has higher stability.

[0003] When packaging traditional GaN devices, the device chips are mostly placed manually in the plastic packaging mold one by one, and then the mold is transported to the extrusion equipment for extrusion. The plastic fills the entire mold, and then the mold is closed and shaped to package the entire GaN device. After packaging, the mold is demolded. Manual placement and demolding are troublesome and easily damage the device chip, thereby affecting the packaging quality and efficiency of GaN. To this end, we propose a GaN device and a GaN packaging structure to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a gallium nitride device and a gallium nitride packaging structure to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a gallium nitride device, comprising a gallium nitride device body, the gallium nitride device body comprising a bottom package, a second package frame is provided at the bottom end of the bottom package, and a gallium nitride chip is provided between the bottom package and the second package frame;

[0006] The bottom package comprises a heat dissipation base plate, and both sides of the top of the heat dissipation base plate are provided with a plurality of pin grooves evenly distributed, and connecting pins are movably clamped in the pin grooves, and a first packaging frame is provided on the outer sides of the heat dissipation base plate and the plurality of connecting pins, and a clamping groove is provided in the middle of the first packaging frame, and the gallium nitride chip is movably clamped in the clamping groove, and the lower surface of the gallium nitride chip contacts the upper surface of the heat dissipation base plate, and the bottom end of the gallium nitride chip is provided with a connecting protrusion corresponding to the connecting pin, and the connecting protrusion is movably clamped in the corresponding pin groove, and the connecting protrusion is electrically connected to the corresponding connecting pin, and the side ends of the first packaging frame are integrally formed with an extension protrusion, and the side ends of the second packaging frame are provided with an inner groove corresponding to the extension protrusion, and the extension protrusion is fixedly clamped in the corresponding inner groove, and the lower surface of the second packaging frame contacts the upper surface of the gallium nitride chip.

[0007] A gallium nitride packaging structure of a gallium nitride device comprises a base, a linear electric track is fixedly mounted on the top of the base, a bottom mold is fixedly mounted on the driving end of the linear electric track, a support frame is fixedly mounted on the top of the base, a first packaging mechanism is fixedly mounted on one side of the support frame, and a second packaging mechanism is fixedly mounted on the side of the support frame away from the first packaging mechanism.

[0008] As a preferred technical solution of the present invention, the bottom mold member includes a bottom template, the bottom template is fixedly installed on the driving end of the linear electric rail, a plastic outer frame is fixedly installed on the top of the bottom template, the gallium nitride device body is movably clamped in the plastic outer frame, a positioning groove is provided in the middle of the top of the bottom template, the bottom of the heat dissipation base plate is movably clamped in the positioning groove, a guide groove corresponding to the connecting pin is provided on the top of the bottom template, and the bottom of the connecting pin is movably clamped in the corresponding guide groove.

[0009] As a preferred technical solution of the present invention, a through groove is provided in the positioning groove, and a first ring and a second ring are fixedly provided at the bottom and the middle of the through groove respectively, a top bulge is movably provided in the middle of the first ring and the second ring, and the top of the top bulge is movably connected to the top of the through groove, a third ring is provided on the upper surface of the first ring, and the third ring is fixedly installed on the outer side of the top bulge, a spring is provided between the top end of the third ring and the bottom end of the second ring, and the spring is movably sleeved on the outer side of the top bulge, the bottom of the top bulge extends out of the bottom end of the bottom template, and a ball is rolled on the bottom of the top bulge.

[0010] As a preferred technical solution of the present invention, a driving plate is fixedly installed on the side of the top of the base away from the second packaging mechanism, the position of the driving plate corresponds to the position of the top protrusion, and a driving protrusion is integrally formed on the side of the top of the driving plate away from the second packaging mechanism.

[0011] As a preferred technical solution of the present invention, the first packaging mechanism includes a plurality of first lifting cylinders, the first lifting cylinders are fixedly mounted on one side of the support frame, a first injection molding frame is fixedly mounted on the driving end of the first lifting cylinder, a first cooling frame is fixedly mounted on the bottom end of the first injection molding frame, a plurality of injection molding ports evenly distributed are opened at the bottom end of the first injection molding frame, the injection molding ports are located on the outside of the first cooling frame, two first tubes are fixedly mounted on the top end of the first cooling frame, the first tubes movably penetrate the first injection molding frame, a first thermal insulation pad is arranged between the top end of the first cooling frame and the bottom end of the first injection molding frame, a first thermal insulation sleeve is movably sleeved on the outer side of the first tube, the first thermal insulation sleeve is fixedly clamped in the first injection molding frame, a first connecting head is fixedly clamped on the top end of the first tube, a first through groove is opened on the side end of the first injection molding frame, a first material guide pipe is fixedly mounted on the outer side of the first injection molding frame, and a first valve is fixedly mounted on the end of the first material guide pipe away from the first injection molding frame.

[0012] As a preferred technical solution of the present invention, the second packaging mechanism includes a plurality of second lifting cylinders, which are fixedly installed on a side of the support frame away from the first packaging mechanism, a second injection molding frame is fixedly installed on the driving end of the second lifting cylinder, a second cooling frame is fixedly installed on the bottom end of the second injection molding frame, two second tubes are fixedly installed on the top end of the second cooling frame, the second tubes movably pass through the second injection molding frame, a second connecting head is fixedly installed on the top end of the second tube, a second thermal insulation pad is provided on the top end of the second cooling frame and the bottom end of the second injection molding frame, a second thermal insulation pad is provided on the outer movable sleeve of the second tube, the second thermal insulation sleeve is fixedly connected to the second injection molding frame, a plurality of injection molding tubes are fixedly installed on the bottom end of the second injection molding frame, the injection molding tubes movably pass through the second cooling frame, a third thermal insulation sleeve is fixedly connected to the second cooling frame, a second through groove is opened in the middle of the second injection molding frame, a second material guide pipe is fixedly installed on the outer side of the second injection molding frame, and a second valve is fixedly installed on the end of the second material guide pipe away from the second injection molding frame.

[0013] As a preferred technical solution of the present invention, first conduits are fixedly installed at the ends of the first valve and the second valve, first hoses are fixedly installed at the opposite ends of the first conduits, a tee is fixedly installed between the two first hoses, and a first connecting pipe is fixedly installed at the end of the tee.

[0014] As a preferred technical solution of the present invention, a connecting frame is fixedly installed on the outer side of the three-way pipe, and the connecting frame is fixedly installed on the supporting frame.

[0015] As a preferred technical solution of the present invention, a second conduit is fixedly installed on the top of the second connecting head, a third conduit is fixedly installed on the top of the first connecting head, a second hose is fixedly installed between one of the second conduits and one of the third conduits, a second connecting pipe is fixedly installed on one end of the third conduit away from the second hose, and one end of the second connecting pipe away from the third conduit is fixedly clamped on the support frame.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By setting a bottom module, cooperating with the first packaging mechanism and the second packaging mechanism, the heat dissipation base plate and multiple connecting pins are plastic-sealed and fixed to form a bottom package, thereby realizing the primary packaging of the bottom of the gallium nitride device, and the bottom package and the gallium nitride chip are plastic-sealed and fixed to realize the secondary packaging of the gallium nitride device. By adopting the primary packaging and the secondary packaging to package and fix the gallium nitride device, it is convenient to connect and fix the components in the gallium nitride device, and it is convenient to disassemble the second packaging frame separately to repair the gallium nitride chip later, and the packaging effect in the gallium nitride device is improved.

[0018] 2. By setting the bottom mold, using the driving plate and the driving convex in combination, after the entire GaN device is packaged, the bottom mold is controlled to move to one side of the driving plate. At this time, the ball contacts the upper surface of the driving plate, and the bottom mold continues to move. The ball moves from the driving plate to the driving convex, and the driving convex automatically lifts the top convex and squeezes the spring. The top convex automatically lifts the packaged GaN device for automatic demolding and unloading, thereby improving the overall processing efficiency of the GaN device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the structure of the gallium nitride device in the present invention.

[0021] Figure 2 It is a schematic structural diagram of the midsole packaging component of the present invention.

[0022] Figure 3 It is a schematic diagram of the structure of the gallium nitride device after being disassembled in the present invention.

[0023] Figure 4 This is a schematic diagram of the structure of the gallium nitride device after being disassembled from another angle in the present invention.

[0024] Figure 5 It is a structural schematic diagram of the gallium nitride packaging structure in the present invention.

[0025] Figure 6 It is a structural schematic diagram of the bottom module of the present invention.

[0026] Figure 7 For the present invention Figure 6 Enlarged view of point A in the middle.

[0027] Figure 8 For the present invention Figure 7Enlarged view of point B in the middle.

[0028] Fig. 9 It is a schematic diagram of the structure of the first packaging mechanism and the second packaging mechanism in the present invention.

[0029] Fig.10 It is a schematic structural diagram of the first packaging mechanism in the present invention.

[0030] Fig.11 It is a schematic structural diagram of the second packaging mechanism in the present invention.

[0031] In the figure: 1. GaN device body; 11. bottom package; 101. card slot; 102. extension convex; 12. GaN chip; 121. connection convex; 111. heat dissipation base; 1111. pin slot; 112. connection pin; 113. first package frame; 13. second package frame; 131. inner groove; 2. base; 3. linear rail; 4. bottom mold; 5. support frame; 6. first package mechanism; 7. second package mechanism; 8. drive plate; 81. drive convex; 9. first conduit; 91. first hose; 92. three-way pipe; 921. connection frame; 93. first connection pipe; 94. second conduit; 95. second hose; 96. third conduit; 97. second connection pipe; 41. bottom mold plate; 42. molding outer frame; 401. positioning groove; 402 , guide groove; 403, through groove; 43, first ring; 431, second ring; 44, top protrusion; 45, third ring; 46, spring; 47, ball; 61, first lifting cylinder; 601, first through groove; 62, first injection molding frame; 621, first material guide pipe; 622, first valve; 623, injection port; 63, first cooling frame; 64, first pipe; 65, first thermal insulation pad; 651, first thermal insulation sleeve; 66, first connector; 71, second lifting cylinder; 72, second injection molding frame; 701, second through groove; 721, injection molding pipe; 722, second valve; 723, second material guide pipe; 73, second cooling frame; 731, second pipe; 732, second connector; 74, second thermal insulation pad; 741, second thermal insulation sleeve; 742, third thermal insulation sleeve. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example: Figure 1-11As shown, the present invention provides a gallium nitride device, including a gallium nitride device body 1, the gallium nitride device body 1 includes a bottom package 11, a second package frame 13 is provided at the bottom end of the bottom package 11, and a gallium nitride chip 12 is provided between the bottom package 11 and the second package frame 13;

[0034] The bottom package 11 includes a heat dissipation base plate 111. Both sides of the top of the heat dissipation base plate 111 are provided with a plurality of pin grooves 1111 evenly distributed. The pin grooves 1111 are provided with connecting pins 112. The outer sides of the heat dissipation base plate 111 and the plurality of connecting pins 112 are provided with a first packaging frame 113 to perform the primary packaging of the bottom of the gallium nitride device and fix the heat dissipation base plate 111 and the plurality of connecting pins 112.

[0035] A card slot 101 is provided in the middle of the first packaging frame 113, and the gallium nitride chip 12 is movably connected to the card slot 101. The lower surface of the gallium nitride chip 12 contacts the upper surface of the heat dissipation base plate 111. By setting the heat dissipation base plate 111, the gallium nitride chip 12 is cooled to improve the use effect of the entire gallium nitride device. The bottom end of the gallium nitride chip 12 is provided with a connecting protrusion 121 corresponding to the connecting pin 112. The connecting protrusion 121 is movably connected to the corresponding pin groove 1111. The connecting protrusion 121 is electrically connected to the corresponding connecting pin 112 to perform electrical connection between the gallium nitride chip 12 and the connecting pin 112. The side of the first packaging frame 113 The ends are integrally formed with extension bulges 102, and the side ends of the second packaging frame 13 are provided with inner grooves 131 corresponding to the extension bulges 102. The extension bulges 102 are fixedly snapped into the corresponding inner grooves 131. The lower surface of the second packaging frame 13 contacts the upper surface of the gallium nitride chip 12 to perform secondary packaging on the top of the gallium nitride device, and fix the bottom package 11 and the gallium nitride chip 12. The gallium nitride device is packaged and fixed in the form of primary packaging and secondary packaging, which facilitates the connection and fixation of various components in the gallium nitride device, facilitates the subsequent separate disassembly of the second packaging frame 13 for the inspection of the gallium nitride chip 12, and improves the packaging effect of the gallium nitride device.

[0036] A gallium nitride packaging structure of a gallium nitride device includes a base 2, a linear electric track 3 is fixedly installed on the top of the base 2, a bottom mold 4 is fixedly installed on the driving end of the linear electric track 3, the linear electric track 3 is controlled to open and drive the bottom mold 4 to perform stable translation, a support frame 5 is fixedly installed on the top of the base 2, a first packaging mechanism 6 is fixedly installed on one side of the support frame 5, and a second packaging mechanism 7 is fixedly installed on the side of the support frame 5 away from the first packaging mechanism 6.

[0037] The bottom mold 4 includes a bottom mold plate 41, which is fixedly mounted on the driving end of the linear electric rail 3. A plastic outer frame 42 is fixedly mounted on the top of the bottom mold plate 41. The gallium nitride device body 1 is movably clamped in the plastic outer frame 42. A positioning groove 401 is provided in the middle of the top of the bottom mold plate 41. The bottom of the heat dissipation base plate 111 is movably clamped in the positioning groove 401. A guide groove 402 corresponding to the connecting pin 112 is provided on the top of the bottom mold plate 41. The bottom of the connecting pin 112 is movably clamped in the corresponding guide groove 402. When the gallium nitride device is packaged, the heat dissipation base plate 111 with multiple connecting pins 112 is clamped into the plastic outer frame 42, so that the bottom of the heat dissipation base plate 111 is movably clamped in the positioning groove 401, and the bottom of the connecting pin 112 is movably clamped in the corresponding guide groove 402, so as to position the heat dissipation base plate 111 and multiple connecting pins 112.

[0038] The first packaging mechanism 6 includes a plurality of first lifting cylinders 61, which are fixedly mounted on one side of the support frame 5, a first injection molding frame 62 is fixedly mounted on the driving end of the first lifting cylinder 61, a first cooling frame 63 is fixedly mounted on the bottom end of the first injection molding frame 62, a plurality of injection molding ports 623 are evenly distributed at the bottom end of the first injection molding frame 62, the injection molding ports 623 are located on the outside of the first cooling frame 63, two first tubes 64 are fixedly mounted on the top end of the first cooling frame 63, the first tubes 64 movably penetrate the first injection molding frame 62, the top end of the first cooling frame 63 and the first injection molding frame 62 are connected to each other. A first heat insulating pad 65 is provided between the bottom ends of the first tube 64, a first heat insulating sleeve 651 is provided on the outer movable sleeve of the first tube 64, the first heat insulating sleeve 651 is fixedly connected to the first injection molding frame 62, a first connector 66 is fixedly provided on the top of the first tube 64, a first through groove 601 is provided on the side end of the first injection molding frame 62, a first material guide pipe 621 is fixedly installed on the outer side of the first injection molding frame 62, a first valve 622 is fixedly installed on the end of the first material guide pipe 621 away from the first injection molding frame 62, after the heat dissipation bottom plate 111 and the plurality of connecting pins 112 are positioned, the bottom mold 4 is controlled to move to drive the heat dissipation bottom plate 111 and the plurality of connecting pins 112 to move. The connecting pin 112 moves to the bottom of the first packaging mechanism 6, and then the first lifting cylinders 61 are controlled to open to drive the first injection molding frame 62 and the first cooling frame 63 to move downward. The first injection molding frame 62 and the first cooling frame 63 are movably connected to the molding outer frame 42 until the lower surface of the first cooling frame 63 contacts the upper surface of the heat dissipation bottom plate 111. At this time, the lower surface of the first cooling frame 63 will cover a part of the connecting pin 112 to facilitate the subsequent connection of the gallium nitride chip 12. Then, the first valve 622 is opened to introduce the sealing material into the first injection molding frame 62 through the first guide pipe 621. The plasticizer then flows out through multiple injection ports 623 and is exhausted through the first through groove 601. The plasticizer seals the heat dissipation base plate 111 and multiple connecting pins 112. At the same time, the cooling liquid circulating in the first cooling frame 63 accelerates the cooling of the plasticizer until the plasticizer solidifies to form the first packaging frame 113. A convex protrusion 102 is formed at the position of the first through groove 601, and a card groove 101 is formed at the position of the first cooling frame 63 to form a bottom package 11, thereby realizing the first-level packaging of the bottom of the gallium nitride device and fixing the heat dissipation base plate 111 and multiple connecting pins 112.

[0039] The second packaging mechanism 7 includes a plurality of second lifting cylinders 71, which are fixedly mounted on a side of the support frame 5 away from the first packaging mechanism 6. A second injection molding frame 72 is fixedly mounted on the driving end of the second lifting cylinder 71, a second cooling frame 73 is fixedly mounted on the bottom end of the second injection molding frame 72, two second tubes 731 are fixedly mounted on the top end of the second cooling frame 73, the second tubes 731 movably penetrate the second injection molding frame 72, a second connector 732 is fixedly mounted on the top end of the second tubes 731, a second heat insulating pad 74 is provided on the top end of the second cooling frame 73 and the bottom end of the second injection molding frame 72, and the second tubes 731 are fixedly mounted on the top end of the second cooling frame 73 and the bottom end of the second injection molding frame 72. The outer movable sleeve of the second injection molding frame 72 is provided with a second heat insulating sleeve 741, and the second heat insulating sleeve 741 is fixedly connected to the second injection molding frame 72. A plurality of injection molding tubes 721 are fixedly installed at the bottom end of the second injection molding frame 72. The injection molding tubes 721 are movable through the second cooling frame 73. The outer movable sleeve of the injection molding tube 721 is provided with a third heat insulating sleeve 742, and the third heat insulating sleeve 742 is fixedly connected to the second cooling frame 73. A second through groove 701 is opened in the middle of the second injection molding frame 72. A second material guide pipe 723 is fixedly installed on the outer side of the second injection molding frame 72, and a second valve 7 is fixedly installed on the end of the second material guide pipe 723 away from the second injection molding frame 72. 22. After the first-level packaging, the bottom mold 4 is controlled to drive the bottom packaging member 11 to move to the bottom of the second packaging mechanism 7. At the same time, the gallium nitride chip 12 is movably connected to the card slot 101, and the connecting protrusion 121 is movably connected to the corresponding pin slot 1111. The connecting protrusion 121 is electrically connected to the corresponding connecting pin 112. Subsequently, the second lifting cylinders 71 are controlled to be turned on to drive the second injection molding frame 72 and the second cooling frame 73 to descend. The second injection molding frame 72 and the second cooling frame 73 are movably connected to the molding outer frame 42, and a certain distance is left between the second cooling frame 73 and the gallium nitride chip 12. Then, the second valve 722 is opened, and the encapsulating plastic is introduced into the second injection molding frame 72 through the second material guide pipe 723. Then, it flows out through multiple injection molding pipes 721 and is exhausted through the opened second through groove 701. The encapsulating plastic encapsulates the bottom package 11 and the gallium nitride chip 12. At the same time, the cooling liquid circulating in the second cooling frame 73 accelerates the cooling of the encapsulating plastic until the encapsulating plastic solidifies to form a second packaging frame 13. The second packaging frame 13 and the first packaging frame 113 are fixedly connected, thereby realizing the secondary packaging of the gallium nitride device and fixing the bottom package 11 and the gallium nitride chip 12.

[0040] The ends of the first valve 622 and the second valve 722 are fixedly installed with the first conduit 9, the opposite ends of the first conduit 9 are fixedly installed with the first hose 91, a three-way pipe 92 is fixedly installed between the two first hoses 91, and the end of the three-way pipe 92 is fixedly installed with a first connecting pipe 93; the outer side of the three-way pipe 92 is fixedly installed with a connecting frame 921, and the connecting frame 921 is fixedly installed on the supporting frame 5. When in use, the end of the first connecting pipe 93 is connected to the output port of the encapsulating plastic output system, the encapsulating plastic output system is controlled to open, and the encapsulating plastic is introduced into the first conduits 9 on both sides through the first connecting pipe 93, the three-way pipe 92 and the first hoses 91 on both sides.

[0041] A second conduit 94 is fixedly installed on the top of the second connecting head 732, and a third conduit 96 is fixedly installed on the top of the first connecting head 66. A second hose 95 is fixedly installed between one of the second conduits 94 and one of the third conduits 96, and a second connecting pipe 97 is fixedly installed on the end of the third conduit 96 away from the second hose 95. The end of the second connecting pipe 97 away from the third conduit 96 is fixedly clamped on the support frame 5. When in use, the two second connecting pipes 97 are respectively connected to the output port and the input port of the coolant circulation system to control the opening of the coolant circulation system. The coolant is introduced into the first cooling frame 63 and the second cooling frame 73 through one group of the second connecting pipes 97, the third conduit 96, the second hose 95, the second conduit 94 and the second connecting head 732, and is introduced into the coolant circulation system through another group of the second connecting head 732, the second conduit 94, the second hose 95, the third conduit 96 and the second connecting pipe 97, thereby circulating the coolant in the first cooling frame 63 and the second cooling frame 73.

[0042] A through groove 403 is provided in the positioning groove 401, and a first ring 43 and a second ring 431 are fixedly provided at the bottom and the middle of the through groove 403 respectively, and a top protrusion 44 is movably provided in the middle of the first ring 43 and the second ring 431, and the top of the top protrusion 44 is movably connected to the top of the through groove 403, and the upper surface of the top protrusion 44 is flush with the inner lower wall of the positioning groove 401, and a third ring 45 is provided on the upper surface of the first ring 43, and the third ring 45 is fixedly installed on the outer side of the top protrusion 44, and a spring 46 is provided between the top end of the third ring 45 and the bottom end of the second ring 431, and the spring 46 is movably sleeved on the outer side of the top protrusion 44, and the bottom of the top protrusion 44 extends out of the bottom end of the bottom template 41, and the bottom of the top protrusion 44 is rollingly connected. There is a ball 47; a driving plate 8 is fixedly installed on the side of the top of the base 2 away from the second packaging mechanism 7, and the position of the driving plate 8 corresponds to the position of the top protrusion 44. A driving protrusion 81 is integrally formed on the side of the top of the driving plate 8 away from the second packaging mechanism 7. When the entire gallium nitride device is packaged, the bottom mold 4 is controlled to move to one side of the driving plate 8. At this time, the ball 47 contacts the upper surface of the driving plate 8, and the bottom mold 4 continues to move. The ball 47 moves from the driving plate 8 to the driving protrusion 81, and the driving protrusion 81 automatically lifts the top protrusion 44 and squeezes the spring 46. The top protrusion 44 automatically lifts the encapsulated gallium nitride device for automatic demolding and unloading, thereby improving the overall processing efficiency of the gallium nitride device.

[0043] Working principle: When in use, the end of the first connecting tube 93 is connected to the output port of the encapsulating plastic output system, and the encapsulating plastic output system is controlled to be opened, and the encapsulating plastic is introduced into the first conduits 9 on both sides through the first connecting tube 93, the three-way tube 92, and the first hoses 91 on both sides;

[0044] The two second connecting pipes 97 are connected to the output port and the input port of the coolant circulation system respectively, and the coolant circulation system is controlled to be turned on. The coolant is introduced into the first cooling frame 63 and the second cooling frame 73 through one group of the second connecting pipes 97, the third conduit 96, the second hose 95, the second conduit 94 and the second connector 732, and is introduced into the coolant circulation system through another group of the second connector 732, the second conduit 94, the second hose 95, the third conduit 96 and the second connecting pipe 97, so as to circulate the coolant in the first cooling frame 63 and the second cooling frame 73;

[0045] Subsequently, the gallium nitride device is packaged, and the heat dissipation base plate 111 with a plurality of connection pins 112 is inserted into the plastic outer frame 42, so that the bottom of the heat dissipation base plate 111 is movably engaged in the positioning groove 401, and the bottom of the connection pin 112 is movably engaged in the corresponding guide groove 402, so as to position the heat dissipation base plate 111 and the plurality of connection pins 112;

[0046] After the heat dissipation base plate 111 and the plurality of connecting pins 112 are positioned, the bottom mold 4 is controlled to move to drive the heat dissipation base plate 111 and the plurality of connecting pins 112 to move to the bottom of the first packaging mechanism 6. Subsequently, the plurality of first lifting cylinders 61 are controlled to be opened to drive the first injection molding frame 62 and the first cooling frame 63 to move downward. The first injection molding frame 62 and the first cooling frame 63 are movably connected to the molding outer frame 42 until the lower surface of the first cooling frame 63 contacts the upper surface of the heat dissipation base plate 111. At this time, the lower surface of the first cooling frame 63 will cover a part of the connecting pins 112 for the subsequent connection of the gallium nitride chip 12. Subsequently, the first valve 622 is opened to pass The first material guide pipe 621 introduces the encapsulating plastic into the first injection molding frame 62, and then flows out through the multiple injection molding ports 623, and is exhausted through the first through groove 601. The encapsulating plastic seals the heat dissipation base plate 111 and the multiple connecting pins 112. At the same time, the cooling liquid circulating in the first cooling frame 63 accelerates the cooling of the encapsulating plastic until the encapsulating plastic solidifies to form the first encapsulation frame 113, the extension 102 is formed at the position of the first through groove 601, and the card groove 101 is formed at the position of the first cooling frame 63 to form the bottom encapsulation part 11, thereby realizing the primary encapsulation of the bottom of the gallium nitride device and fixing the heat dissipation base plate 111 and the multiple connecting pins 112;

[0047] After the first-level packaging, the bottom mold 4 is controlled to drive the bottom packaging member 11 to move to the bottom of the second packaging mechanism 7. At the same time, the gallium nitride chip 12 is movably connected to the card slot 101, and the connecting protrusion 121 is movably connected to the corresponding pin slot 1111. The connecting protrusion 121 is electrically connected to the corresponding connecting pin 112. Subsequently, the second lifting cylinders 71 are controlled to be turned on to drive the second injection molding frame 72 and the second cooling frame 73 to descend. The second injection molding frame 72 and the second cooling frame 73 are movably connected to the molding outer frame 42, and a certain distance is left between the second cooling frame 73 and the gallium nitride chip 12. After that, the second valve 722 is opened, and the encapsulating plastic is introduced into the second injection molding frame 72 through the second material guide pipe 723, and then flows out through the multiple injection molding pipes 721, and is exhausted through the opened second through groove 701, and the encapsulating plastic encapsulates the bottom package 11 and the gallium nitride chip 12. At the same time, the cooling liquid circulating in the second cooling frame 73 accelerates the cooling of the encapsulating plastic until the encapsulating plastic solidifies to form a second encapsulating frame 13, and the second encapsulating frame 13 and the first encapsulating frame 113 are fixedly connected, thereby realizing the secondary encapsulation of the gallium nitride device and fixing the bottom package 11 and the gallium nitride chip 12;

[0048] When the entire gallium nitride device is packaged, the bottom mold 4 is controlled to move toward one side of the driving plate 8. At this time, the ball 47 contacts the upper surface of the driving plate 8, and the bottom mold 4 continues to move. The ball 47 moves from the driving plate 8 to the driving protrusion 81. The driving protrusion 81 automatically lifts the top protrusion 44 and squeezes the spring 46. The top protrusion 44 automatically lifts the packaged gallium nitride device for automatic demolding and unloading, thereby improving the overall processing efficiency of the gallium nitride device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A gallium nitride device, comprising a gallium nitride device body (1), characterized in that: The gallium nitride device body (1) comprises a bottom package (11), a second package frame (13) is provided at the bottom end of the bottom package (11), and a gallium nitride chip (12) is provided between the bottom package (11) and the second package frame (13); The bottom package (11) comprises a heat dissipation base plate (111), a plurality of pin grooves (1111) evenly distributed are provided on both sides of the top of the heat dissipation base plate (111), and connecting pins (112) are movably inserted in the pin grooves (1111). A first packaging frame (113) is provided outside the heat dissipation base plate (111) and the plurality of connecting pins (112), and a card slot (101) is provided in the middle of the first packaging frame (113), the gallium nitride chip (12) is movably inserted in the card slot (101), the lower surface of the gallium nitride chip (12) is in contact with the upper surface of the heat dissipation base plate (111), and the gallium nitride chip (12) is movably inserted in the card slot (101). The bottom end of the chip (12) is provided with a connecting protrusion (121) corresponding to the connecting pin (112), the connecting protrusion (121) is movably engaged in the corresponding pin groove (1111), the connecting protrusion (121) and the corresponding connecting pin (112) are electrically connected, the side ends of the first packaging frame (113) are integrally formed with an extension protrusion (102), the side ends of the second packaging frame (13) are provided with an inner groove (131) corresponding to the extension protrusion (102), the extension protrusion (102) is fixedly engaged in the corresponding inner groove (131), and the lower surface of the second packaging frame (13) is in contact with the upper surface of the gallium nitride chip (12).

2. A gallium nitride packaging structure using the gallium nitride device according to claim 1, comprising a base (2), characterized in that: A linear electric rail (3) is fixedly mounted on the top of the base (2), a bottom mold (4) is fixedly mounted on the driving end of the linear electric rail (3), a support frame (5) is fixedly mounted on the top of the base (2), a first packaging mechanism (6) is fixedly mounted on one side of the support frame (5), and a second packaging mechanism (7) is fixedly mounted on the side of the support frame (5) away from the first packaging mechanism (6).

3. The gallium nitride packaging structure of a gallium nitride device according to claim 2, characterized in that: The bottom mold (4) comprises a bottom mold plate (41), the bottom mold plate (41) being fixedly mounted on the driving end of the linear electric rail (3), a plastic outer frame (42) being fixedly mounted on the top of the bottom mold plate (41), the gallium nitride device body (1) being movably snap-fitted into the plastic outer frame (42), a positioning groove (401) being provided at the middle of the top of the bottom mold plate (41), the bottom of the heat dissipation base plate (111) being movably snap-fitted into the positioning groove (401), a guide groove (402) corresponding to the connecting pin (112) being provided at the top of the bottom mold plate (41), and the bottom of the connecting pin (112) being movably snap-fitted into the corresponding guide groove (402).

4. The gallium nitride packaging structure of a gallium nitride device according to claim 3, characterized in that: A through groove (403) is provided in the positioning groove (401), and a first ring (43) and a second ring (431) are fixedly clamped at the bottom and the middle of the through groove (403), respectively; a top protrusion (44) is movably clamped at the middle of the first ring (43) and the second ring (431), and the top of the top protrusion (44) is movably clamped at the top of the through groove (403); a third ring (45) is provided on the upper surface of the first ring (43), and the third ring (45) is fixedly mounted on the outer side of the top protrusion (44); a spring (46) is provided between the top end of the third ring (45) and the bottom end of the second ring (431), and the spring (46) is movably sleeved on the outer side of the top protrusion (44); the bottom of the top protrusion (44) extends out of the bottom end of the bottom template (41), and a rolling clamp is provided at the bottom of the top protrusion (44) with a ball (47).

5. The gallium nitride packaging structure of a gallium nitride device according to claim 4, characterized in that: A driving plate (8) is fixedly mounted on a side of the top end of the base (2) away from the second packaging mechanism (7); the position of the driving plate (8) corresponds to the position of the top protrusion (44); and a driving protrusion (81) is integrally formed on a side of the top end of the driving plate (8) away from the second packaging mechanism (7).

6. The gallium nitride packaging structure of a gallium nitride device according to claim 2, characterized in that: The first packaging mechanism (6) comprises a plurality of first lifting cylinders (61), the first lifting cylinders (61) being fixedly mounted on one side of the support frame (5), a first injection molding frame (62) being fixedly mounted on a driving end of the first lifting cylinder (61), a first cooling frame (63) being fixedly mounted on a bottom end of the first injection molding frame (62), a plurality of injection molding ports (623) being evenly distributed being formed on the bottom end of the first injection molding frame (62), the injection molding ports (623) being located on the outside of the first cooling frame (63), two first tubes (64) being fixedly mounted on a top end of the first cooling frame (63), the first tubes (64) being movably disposed to penetrate the first injection molding frame (62). A first heat insulating pad (65) is provided between the top end of the first cooling frame (63) and the bottom end of the first injection molding frame (62); a first heat insulating sleeve (651) is provided on the outer movable sleeve of the first tube (64); the first heat insulating sleeve (651) is fixedly clamped in the first injection molding frame (62); a first connector (66) is fixedly clamped on the top end of the first tube (64); a first through groove (601) is provided on the side end of the first injection molding frame (62); a first material guide pipe (621) is fixedly installed on the outer side of the first injection molding frame (62); and a first valve (622) is fixedly installed on one end of the first material guide pipe (621) away from the first injection molding frame (62).

7. The gallium nitride packaging structure of a gallium nitride device according to claim 6, characterized in that: The second packaging mechanism (7) comprises a plurality of second lifting cylinders (71), the second lifting cylinders (71) being fixedly mounted on a side of the support frame (5) away from the first packaging mechanism (6), a second injection molding frame (72) being fixedly mounted on a driving end of the second lifting cylinder (71), a second cooling frame (73) being fixedly mounted on a bottom end of the second injection molding frame (72), two second tubes (731) being fixedly mounted on a top end of the second cooling frame (73), the second tubes (731) movably passing through the second injection molding frame (72), a second connector (732) being fixedly mounted on a top end of the second tubes (731), a second heat insulating pad (74) being provided at a top end of the second cooling frame (73) and a bottom end of the second injection molding frame (72), and the second tubes (731) being fixedly mounted on a top end of the second cooling frame (73). ) is provided with a second heat-insulating sleeve (741) on the outer side of the movable sleeve, the second heat-insulating sleeve (741) is fixedly connected to the second injection molding frame (72), a plurality of injection molding tubes (721) are fixedly installed on the bottom end of the second injection molding frame (72), the injection molding tubes (721) are movably inserted through the second cooling frame (73), a third heat-insulating sleeve (742) is provided on the outer side of the movable sleeve of the injection molding tubes (721), the third heat-insulating sleeve (742) is fixedly connected to the second cooling frame (73), a second through groove (701) is provided in the middle of the second injection molding frame (72), a second material guide tube (723) is fixedly installed on the outer side of the second injection molding frame (72), and a second valve (722) is fixedly installed on one end of the second material guide tube (723) away from the second injection molding frame (72).

8. The gallium nitride packaging structure of a gallium nitride device according to claim 7, characterized in that: The ends of the first valve (622) and the second valve (722) are both fixedly mounted with a first conduit (9), the opposite ends of the first conduit (9) are both fixedly mounted with a first hose (91), a three-way pipe (92) is fixedly mounted between the two first hoses (91), and a first connecting pipe (93) is fixedly mounted at the ends of the three-way pipe (92).

9. The gallium nitride packaging structure of a gallium nitride device according to claim 8, characterized in that: A connecting frame (921) is fixedly mounted on the outer side of the three-way pipe (92), and the connecting frame (921) is fixedly mounted on the supporting frame (5).

10. The gallium nitride packaging structure of a gallium nitride device according to claim 7, characterized in that: A second conduit (94) is fixedly mounted on the top of each of the second connectors (732), a third conduit (96) is fixedly mounted on the top of each of the first connectors (66), a second hose (95) is fixedly mounted between one of the second conduits (94) and one of the third conduits (96), a second connecting tube (97) is fixedly mounted on one end of each of the third conduits (96) away from the second hose (95), and an end of each of the second connecting tubes (97) away from the third conduit (96) is fixedly clamped on the support frame (5).

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