A graphene heat sink structure and preparation method for heat conduction of electronic equipment

Abstract

The present invention relates to the field of graphene heat spreader technology, and in particular to a graphene heat spreader structure and preparation method for heat conduction of electronic equipment. Technical solution: A graphene heat spreader structure and preparation method for heat conduction of electronic equipment includes a pressure-resistant protection plate, a graphene heat spreader module, an aluminum alloy protection frame, an aluminum alloy bottom plate and a heat conduction module; a graphene heat spreader module is used, located between the pressure-resistant protection plate and the aluminum alloy bottom plate, and is arranged in a honeycomb distribution, which can be used to conduct heat flow for dispersed heat distribution; an aluminum alloy protection frame is used, which is arranged on the periphery of the graphene heat spreader module, which can be used for positioning and installation and heat distribution; a heat conduction module is used, which is arranged in a honeycomb distribution on the aluminum alloy bottom plate in multiple groups, which can correspond to the graphene heat spreader module, which is distributed in a honeycomb shape as a special-shaped structure, can be freely arranged, and has a relatively low cost. Aluminum alloy is used to improve the overall stability performance and meet the requirements of efficient heat conduction.

Description

Technical Field

[0001] The present invention relates to the technical field of graphene vapor chambers, and in particular to a graphene vapor chamber structure for heat conduction of electronic equipment and a preparation method thereof. Background Art

[0002] The heat conduction of electronic equipment mainly depends on the thermal conductivity of the material, which is a key indicator to measure the heat transfer ability of the material. In electronic equipment, thermal conductivity plays a vital role, especially in the cooling process, from the heat generating components to the external environment, conductive heat transfer is an indispensable part of thermal management. The electronic equipment thermal conductive graphene heat spreader is a heat dissipation material developed by utilizing the high thermal conductivity of graphene. The material achieves excellent thermal conductivity through the composite of graphene and aluminum alloy. The graphene heat spreader can replace the traditional VC heat spreader, has a wider temperature range of use, and has no risk of liquid leakage. The existing graphene heat spreader is usually set in a rectangular shape during the heat conduction process. As the heat pipe conducts heat, the heat flow gradually increases. Due to the concentrated range, the heat flow is conducted at the center, and the surrounding heat conduction heat flow is not covered and dissipated in time, so that the heat spread effect is poor, affecting the overall performance; so we propose a graphene heat spreader structure and preparation method for heat conduction of electronic equipment to solve the above problems. Summary of the invention

[0003] In order to overcome the problem of existing graphene heat spreader, as the heat pipe conducts heat, the heat flow gradually increases. Due to the concentrated range, the heat flow is conducted at the center, and the surrounding heat flow is not covered and dissipated in time, resulting in poor heat distribution effect, affecting the overall performance.

[0004] The technical solution of the present invention is: a graphene heat spreader structure for heat conduction of electronic equipment, including a pressure-resistant protection plate, a graphene heat spreader module, an aluminum alloy protection frame, an aluminum alloy bottom plate and a heat conduction module; an aluminum alloy bottom plate for supporting the whole to maintain stable balance is correspondingly connected below the pressure-resistant protection plate, a graphene heat spreader module for conducting heat flow for dispersed heat spread is arranged in a honeycomb pattern between the pressure-resistant protection plate and the aluminum alloy bottom plate, an aluminum alloy protection frame for positioning, installation and heat spread is arranged on the periphery of the graphene heat spreader module, and a plurality of heat conduction modules corresponding to the graphene heat spreader modules are arranged in a honeycomb pattern on the aluminum alloy bottom plate.

[0005] Preferably, an aluminum alloy base plate is provided with a corresponding connection below the pressure-resistant protection plate to support the whole to maintain stable balance. A graphene heat-saturating module is provided between the pressure-resistant protection plate and the aluminum alloy base plate in a honeycomb distribution pattern to conduct heat flow for dispersed heat-saturating. An aluminum alloy protection frame is provided outside the graphene heat-saturating module to position, install and distribute heat.

[0006] Preferably, a connecting cover is provided on the top of the pressure-resistant protection plate, a rubber damper is provided inside the connecting cover, a thermochromic film is provided in the center of the connecting cover, a central sleeve frame is provided at the bottom center of the pressure-resistant protection plate, and connecting sleeve frames are distributed in a honeycomb shape on the periphery of the central sleeve frame, and sleeve protection can be performed by connecting the connecting sleeve frame and the central sleeve frame.

[0007] Preferably, a temperature sensor is provided at the edge of the connecting cover, a built-in signal transmitting antenna is provided inside the temperature sensor, a temperature sensing lamp is provided at the outer end of the built-in signal transmitting antenna, air flow grooves are circumferentially opened at the side ends of the center sleeve and the connecting sleeve, and fins connected to the connecting sleeve are provided at the bottom edge of the connecting cover, and heat flow conduction operations can be performed through the fins.

[0008] Preferably, the graphene heat-equalizing module includes a graphene heat sink, a positioning hole, a first heat sink, a graphene inner frame, a second heat sink and a heat pipe. The side wall of the graphene heat sink is circumferentially provided with four rows of first heat sinks, the top of the graphene heat sink is circumferentially provided with positioning holes near the edge, the center of the graphene heat sink is fitted with a graphene inner frame, and a signal device is provided inside the built-in signal transmitting antenna, through which the temperature signal can be transmitted through the signal transmitting antenna.

[0009] Preferably, a plurality of second heat dissipation holes are circumferentially provided on the side wall of the graphene inner frame, and a plurality of heat pipes are circumferentially distributed in the center of the graphene inner frame, a condensation end is provided at one end of the heat pipe, and an evaporation end is provided at the other end of the heat pipe. The heat flow passes through the guide holes, a part of which is distributed and diffused through the second heat dissipation holes, and a part of which passes through the evaporation end on the heat pipe to boil the internal solution thereof, and then is conducted through the condensation end.

[0010] Preferably, the aluminum alloy protection frame includes a small honeycomb aluminum alloy frame, a large honeycomb aluminum alloy frame, an extension rod, air holes, a reinforcing plate and a spring rod. Six groups of small honeycomb aluminum alloy frames are circumferentially distributed on the periphery of the large honeycomb aluminum alloy frame. An extension rod extending to the small honeycomb aluminum alloy frame is circumferentially arranged on the outer end of the large honeycomb aluminum alloy frame. Air holes are linearly opened on the extension rod, and air flow can be diverted and guided through the air holes.

[0011] Preferably, a reinforcing plate is provided between the two groups of small honeycomb aluminum alloy frames, a spring rod is provided inside the reinforcing plate, and a spring rubber damper is provided inside the spring rod. With the impact of heat flow, mitigation protection is formed by the spring rod and the spring rubber damper.

[0012] Preferably, guide holes corresponding to the thermal conductive module are distributed and penetrated on the aluminum alloy bottom plate, insulating sleeves are fitted at the edges of the guide holes, and support rods are provided between the two groups of guide holes. The thermal conductive module includes a first conductive sleeve, a second conductive sleeve, a third heat dissipation hole, a plug post and a conduction space. The second conductive sleeve is distributed in a honeycomb shape on the periphery of the first conductive sleeve, and a conduction space corresponding to the guide hole is provided in the center of the first conductive sleeve and the second conductive sleeve. The side walls of the first conductive sleeve and the second conductive sleeve are circumferentially provided with third heat dissipation holes connected to the conduction space, and plug posts are circumferentially provided at the top edges of the first conductive sleeve and the second conductive sleeve, and plug-in installation operations can be performed through the plug posts and the positioning holes.

[0013] According to another aspect of the present invention, a method for preparing a graphene vapor chamber structure is provided, comprising the following steps:

[0014] S1. According to the location of heat conduction, the bottom plate is placed in a suitable position in advance so that its guide holes correspond to the positions, and its support rods can be supported and positioned for plug-in installation. The small honeycomb aluminum alloy frame and the large honeycomb aluminum alloy frame correspond to the second guide sleeve and the first guide sleeve and are placed in a corresponding socket;

[0015] S2. Then, in order to ensure uniform heat distribution, the graphene heat sink is placed in the second guide sleeve and the first guide sleeve in turn, and the positioning holes and the plug posts are used to perform corresponding plugging operations to complete the positioning installation, and the gap position is adjusted to conduct the heat flow, and the pressure-resistant protection plate is covered and installed so that the center sleeve and the connecting sleeve correspond to the graphene heat sink.

[0016] S3. As the overall installation is completed, the heat flow passes through the guide hole, part of it is distributed and diffused through the second heat dissipation hole, and part of it passes through the evaporation end of the heat pipe to make the internal solution boil, and is conducted through the condensation end, and quickly diffused through the air flow groove and fins, so that the whole heat is evenly dissipated;

[0017] S4. As the heat flow reaches the middle, it can diffuse through the first heat dissipation hole and the second heat dissipation hole to form a heat flow guide and accelerate the heat flow conduction. When the heat flow reaches the top fin, its temperature-sensitive color-changing film changes and can be directly observed. The signal device transmits the signal through the built-in antenna.

[0018] Beneficial effects of the present invention:

[0019] 1. According to the previous graphene heat spreader, as the heat pipe conducts heat, the heat flow gradually increases. Due to the concentrated range, the heat flow is conducted at the center, and the surrounding heat conduction heat flow is not covered and dissipated in time, so that the heat spread effect is poor, affecting the overall performance. The difference is that through the aluminum alloy bottom plate, the corresponding connection setting is located below the pressure protection plate, which can support the overall stability and balance. The graphene heat spreader module is located between the pressure protection plate and the aluminum alloy bottom plate and is distributed in a honeycomb shape. It can be used to conduct heat flow for dispersed heat spread. The aluminum alloy protection frame is located on the periphery of the graphene heat spreader module and can be used for positioning installation and heat spread diversion. Through the heat conduction module, multiple groups are distributed in a honeycomb shape on the aluminum alloy bottom plate, which can correspond to the graphene heat spreader module. The honeycomb distribution is a special-shaped structure, which can be freely arranged with relatively low cost. Aluminum alloy is used to improve the overall stability performance, meet the requirements of efficient heat conduction, form an overall fast guide, and increase the overall heat spread effect.

[0020] 2. When the heat is evenly distributed, the heat flows through the guide hole, part of it is distributed and diffused through the second heat dissipation hole, and part of it passes through the evaporation end of the heat pipe to make the internal solution boil, and is conducted through the condensation end, and quickly diffused through the air flow grooves and fins to make the whole heat evenly distributed. It can diffuse through the first heat dissipation hole and the second heat dissipation hole to form a heat flow guide and accelerate the heat flow conduction. When the heat flow reaches the top fin, its thermochromic film changes and can be directly observed. The signal device transmits the signal through the built-in antenna to improve the overall rapid diffusion performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall explosion structure of the graphene vapor chamber of the present invention;

[0022] Figure 2 A schematic diagram of a compression protection plate of a graphene vapor chamber of the present invention;

[0023] Figure 3 This is a schematic diagram of the central sleeve of the graphene heat sink of the present invention;

[0024] Figure 4 A schematic diagram of a graphene soaking module of a graphene soaking plate of the present invention;

[0025] Figure 5 A schematic diagram of a heat pipe of a graphene vapor chamber of the present invention;

[0026] Figure 6 A schematic diagram of an aluminum alloy protection frame of a graphene soaking plate of the present invention;

[0027] Figure 7 Schematic diagram of the aluminum alloy bottom plate of the graphene soaking plate of the present invention;

[0028] Figure 8Schematic diagram of the heat conduction module of the graphene heat spreader of the present invention.

[0029] Description of the reference numerals: 1. compression protection plate; 2. graphene soaking module; 3. aluminum alloy protection frame; 4. aluminum alloy bottom plate; 5. heat conduction module; 101. connection cover; 102. temperature-sensitive color film; 103. temperature sensing lamp; 104. connection sleeve; 105. air flow groove; 106. fin; 107. center sleeve; 201. graphene heat sink; 202. positioning hole; 203. first heat dissipation hole; 204. graphene Inner frame; 205, second heat dissipation hole; 206, heat pipe; 301, small honeycomb aluminum alloy frame; 302, large honeycomb aluminum alloy frame; 303, extension rod; 304, air vent; 305, reinforcement plate; 306, spring rod; 401, guide hole; 402, insulating sleeve; 403, support rod; 501, first conductive sleeve; 502, second conductive sleeve; 503, third heat dissipation hole; 504, plug post; 505, conduction space. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0031] See also Figure 1-3 The present invention provides an embodiment: a graphene heat spreader structure for heat conduction of electronic equipment, comprising a pressure-resistant protection plate 1, a graphene heat spreader module 2, an aluminum alloy protection frame 3, an aluminum alloy bottom plate 4 and a heat conduction module 5; an aluminum alloy bottom plate 4 for supporting the whole to maintain stable balance is correspondingly connected to the bottom of the pressure-resistant protection plate 1, a graphene heat spreader module 2 for conducting heat flow for dispersed heat spread is arranged in a honeycomb shape between the pressure-resistant protection plate 1 and the aluminum alloy bottom plate 4, an aluminum alloy protection frame 3 for positioning, installation and heat spread is arranged on the periphery of the graphene heat spreader module 2, and a plurality of heat conduction modules 5 corresponding to the graphene heat spreader modules 2 are arranged in a honeycomb shape on the aluminum alloy bottom plate 4.

[0032] See also Figure 1-4 In this embodiment, a connecting cover 101 is provided on the top of the pressure-resistant protection plate 1, a rubber damping is provided inside the connecting cover 101, a thermochromic film 102 is provided in the center of the connecting cover 101, a central sleeve 107 is provided at the bottom center of the pressure-resistant protection plate 1, and a connecting sleeve 104 is provided on the periphery of the central sleeve 107 in a honeycomb shape, and sleeve protection can be performed by connecting the sleeve 104 and the central sleeve 107, a temperature sensor is provided at the edge of the connecting cover 101, a built-in signal transmitting antenna is provided inside the temperature sensor, and a temperature sensing lamp 103 is provided at the outer end of the built-in signal transmitting antenna, air flow grooves 105 are circumferentially opened at the side ends of the central sleeve 107 and the connecting sleeve 104, and fins 106 connected to the connecting sleeve 104 are provided at the bottom edge of the connecting cover 101, and heat flow conduction operation can be performed through the fins 106.

[0033] See also Figure 3-5 In this embodiment, the graphene heat-saturating module 2 includes a graphene heat sink 201, a positioning hole 202, a first heat dissipation hole 203, a graphene inner frame 204, a second heat dissipation hole 205 and a heat pipe 206. The side wall of the graphene heat sink 201 is circumferentially provided with four rows of first heat dissipation holes 203, the top of the graphene heat sink 201 is circumferentially provided with a positioning hole 202 near the edge, the center of the graphene heat sink 201 is fitted with a graphene inner frame 204, and a signal transmitting antenna is provided inside. The temperature signal can be transmitted through the signal transmitting antenna through the signal device. The side wall of the graphene inner frame 204 is circumferentially provided with multiple groups of second heat dissipation holes 205. The center of the graphene inner frame 204 is circumferentially distributed with multiple groups of heat pipes 206. One end of the heat pipe 206 is provided with a condensation end, and the other end of the heat pipe 206 is provided with an evaporation end. The heat flow passes through the guide hole 401, a part of it is distributed and diffused through the second heat dissipation holes 205, and a part of it passes through the evaporation end on the heat pipe 206 to boil the internal solution, and then is conducted through the condensation end.

[0034] See also Figure 4-6 In this embodiment, the aluminum alloy protection frame 3 includes a small honeycomb aluminum alloy frame 301, a large honeycomb aluminum alloy frame 302, an extension rod 303, an air vent 304, a reinforcing plate 305 and a spring rod 306. Six groups of small honeycomb aluminum alloy frames 301 are circumferentially distributed on the periphery of the large honeycomb aluminum alloy frame 302. An extension rod 303 extending to the small honeycomb aluminum alloy frame 301 is circumferentially arranged on the outer end of the large honeycomb aluminum alloy frame 302. Air vents 304 are linearly opened on the extension rod 303. Air flow diversion and guidance can be performed through the air vents 304. A reinforcing plate 305 is arranged between the two groups of small honeycomb aluminum alloy frames 301. A spring rod 306 is arranged inside the reinforcing plate 305. A spring rubber damper is arranged inside the spring rod 306. With the impact of heat flow, a mitigation protection is formed by the spring rod 306 and the spring rubber damper.

[0035] See also Figure 1-8In this embodiment, guide holes 401 corresponding to the heat conduction module 5 are distributed and opened on the aluminum alloy bottom plate 4, and insulating sleeves 402 are fitted at the edges of the guide holes 401. A support rod 403 is provided between the two groups of guide holes 401. The heat conduction module 5 includes a first guide sleeve 501, a second guide sleeve 502, a third heat dissipation hole 503, a plug post 504 and a conduction space 505. The periphery of the first guide sleeve 501 is provided with a second guide sleeve 502 in a honeycomb shape. The centers of the first guide sleeve 501 and the second guide sleeve 502 are provided with a conduction space 505 corresponding to the guide hole 401. The side walls of the first guide sleeve 501 and the second guide sleeve 502 are circumferentially provided with third heat dissipation holes 503 connected with the conduction space 505. The top edges of the first guide sleeve 501 and the second guide sleeve 502 are circumferentially provided with plug posts 504, and the plug posts 504 and the positioning holes 202 can be used for plugging and installation.

[0036] According to another aspect of the present invention, a method for preparing a graphene vapor chamber structure is provided, comprising the following steps:

[0037] S1. According to the location of heat conduction required, the bottom plate is placed in a suitable position in advance, so that its guide hole 401 corresponds to the position, and its support rod 403 can be supported and positioned for plug-in installation, and the small honeycomb aluminum alloy frame 301 and the large honeycomb aluminum alloy frame 302 correspond to the second guide sleeve 502 and the first guide sleeve 500;

[0038] S2. Then, in order to ensure uniform heat distribution, the graphene heat sink 201 is placed in the second guide sleeve 502 and the first guide sleeve 501 in turn, and the positioning hole 202 is plugged into the plug post 504 to complete the positioning installation, and the gap position is adjusted to conduct the heat flow, and the pressure protection plate 1 is covered and installed, so that the central sleeve 107 and the connecting sleeve 104 are installed corresponding to the graphene heat sink 201;

[0039] S3. As the overall installation is completed, the heat flow passes through the guide hole 401, a part of it is distributed and diffused through the second heat dissipation hole 205, and a part of it passes through the evaporation end of the heat pipe 206 to make the internal solution boil, and is conducted through the condensation end, and quickly diffused through the air flow groove 105 and the fin 106, so that the overall heat is evenly dissipated;

[0040] S4. As the heat flow reaches the middle, it passes through the first heat dissipation hole 203 and the second heat dissipation hole 205 and can be diffused to form a heat flow guide to accelerate the heat flow conduction. When the heat flow reaches the top fin 106, its thermochromic film 102 changes and can be directly observed. The signal device transmits the signal through the built-in antenna.

[0041] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the spirit of the present invention.

Claims

1. A graphene heat spreader structure for heat conduction of electronic equipment, comprising a pressure-resistant protection plate (1); characterized in that: The invention also comprises a graphene heat-saturating module (2), an aluminum alloy protection frame (3), an aluminum alloy bottom plate (4) and a heat-conducting module (5); the aluminum alloy bottom plate (4) for supporting the whole body to maintain stable balance is connected to the lower side of the pressure-resistant protection plate (1); the graphene heat-saturating module (2) for conducting heat flow to disperse and evenly heat is arranged in a honeycomb pattern between the pressure-resistant protection plate (1) and the aluminum alloy bottom plate (4); the aluminum alloy protection frame (3) for positioning, installing and evenly distributing heat is arranged on the periphery of the graphene heat-saturating module (2); the aluminum alloy bottom plate (4) is provided with a plurality of heat-conducting modules (5) for conducting heat flow to disperse and evenly heat. A plurality of groups of heat conducting modules (5) corresponding to the graphene heat equalizing modules (2); the graphene heat equalizing modules (2) comprising a graphene heat dissipation frame (201), a positioning hole (202), a first heat dissipation hole (203), a graphene inner frame (204), a second heat dissipation hole (205) and a heat pipe (206); four rows of first heat dissipation holes (203) are arranged in a circumferential direction on the side wall of the graphene heat dissipation frame (201); a positioning hole (202) is arranged in a circumferential direction near the edge of the top of the graphene heat dissipation frame (201); and a graphene heat dissipation frame (201) is arranged in a center thereof. The inner frame (204) has a built-in signal transmitting antenna and a signal device is arranged inside the inner frame. The side wall of the graphene inner frame (204) is provided with a plurality of second heat dissipation holes (205) in a circumferential direction. The center of the graphene inner frame (204) is provided with a plurality of heat pipes (206) in a circumferential direction. One end of the heat pipe (206) is provided with a condensation end, and the other end of the heat pipe (206) is provided with an evaporation end. The aluminum alloy protection frame (3) includes a small honeycomb aluminum alloy frame (301), a large honeycomb aluminum alloy frame (302), an extension rod (303), a vent hole (304), a reinforcement plate (305) and an elastic A spring rod (306) is provided, six groups of small honeycomb aluminum alloy frames (301) are circumferentially distributed on the periphery of the large honeycomb aluminum alloy frame (302), an extension rod (303) extending to the small honeycomb aluminum alloy frame (301) is circumferentially provided on the outer end of the large honeycomb aluminum alloy frame (302), an air vent (304) is linearly provided on the extension rod (303), a reinforcing plate (305) is provided between the two groups of small honeycomb aluminum alloy frames (301), a spring rod (306) is provided inside the reinforcing plate (305), and a spring rubber damper is provided inside the spring rod (306).

2. The graphene vapor chamber structure for heat conduction of electronic equipment according to claim 1, characterized in that: A connection cover (101) is provided on the top of the pressure-resistant protection plate (1), a rubber damper is provided inside the connection cover (101), a temperature-sensitive color-changing film (102) is provided at the center of the connection cover (101), a center sleeve (107) is provided at the center of the bottom of the pressure-resistant protection plate (1), and connection sleeves (104) are provided in a honeycomb shape around the periphery of the center sleeve (107).

3. The graphene vapor chamber structure for heat conduction of electronic equipment according to claim 2, characterized in that: A temperature sensor is provided at the edge of the connection cover (101), a built-in signal transmitting antenna is provided inside the temperature sensor, a temperature sensing lamp (103) is provided at the outer end of the built-in signal transmitting antenna, air flow grooves (105) are provided in a circumferential direction at the side ends of the central sleeve frame (107) and the connection sleeve frame (104), and fins (106) connected to the connection sleeve frame (104) are provided at the bottom edge of the connection cover (101).

4. The graphene vapor chamber structure for heat conduction of electronic equipment according to claim 1, characterized in that: The aluminum alloy bottom plate (4) is provided with guide holes (401) corresponding to the heat conduction module (5). The edges of the guide holes (401) are fitted with insulating sleeves (402). A support rod (403) is provided between the two groups of guide holes (401). The heat conduction module (5) includes a first guide sleeve (501), a second guide sleeve (502), a third heat dissipation hole (503), a plug post (504) and a conduction space (505). The outer periphery of the first guide sleeve (501) is A second guide sleeve (502) is arranged in a honeycomb pattern, a conduction space (505) corresponding to the guide hole (401) is provided at the center of the first guide sleeve (501) and the second guide sleeve (502), a third heat dissipation hole (503) communicating with the conduction space (505) is circumferentially provided on the side walls of the first guide sleeve (501) and the second guide sleeve (502), and a plug post (504) is circumferentially provided at the top edge of the first guide sleeve (501) and the second guide sleeve (502).

5. A method for preparing a graphene vapor chamber structure, comprising a graphene vapor chamber structure for heat conduction of electronic equipment as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: S1. According to the location where heat conduction is required, the bottom plate is placed in a suitable position in advance so that its guide hole (401) corresponds to the position, and its support rod (403) can be supported and positioned for plug-in installation. The small honeycomb aluminum alloy frame (301) and the large honeycomb aluminum alloy frame (302) correspond to the second guide sleeve (502) and the first guide sleeve (501) and are placed in a corresponding socket manner; S2. Subsequently, in order to ensure uniform heat distribution, the graphene heat sink (201) is placed in the second guide sleeve (502) and the first guide sleeve (501) in turn, and the positioning holes (202) and the plug posts (504) are plugged in correspondingly to complete the positioning installation, and the gap position is adjusted to allow the heat flow to be conducted, and the pressure-resistant protection plate (1) is covered and installed so that the central sleeve (107) and the connecting sleeve (104) are installed corresponding to the graphene heat sink (201); S3. As the overall installation is completed, the heat flow passes through the guide hole (401), a portion of which is distributed and diffused through the second heat dissipation hole (205), and a portion of which passes through the evaporation end of the heat pipe (206) to make the internal solution boil, and is conducted through the condensation end, and is quickly diffused through the air flow groove (105) and the fins (106), so that the heat is evenly dissipated as a whole; S4. As the heat flow reaches the middle, it passes through the first heat dissipation hole (203) and the second heat dissipation hole (205) and can be diffused to form a heat flow guide and accelerate the heat flow conduction. When the heat flow reaches the top fin (106), its temperature-sensitive color-changing film (102) changes and can be directly observed. The signal device transmits the signal through the built-in antenna.

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