Power module cooling device and drive control equipment

Abstract

The present application relates to the technical field of electric vehicles, and in particular to a power module cooling device and a drive control device, wherein the power module cooling device includes a heat sink, and a heat sink pin fin is arranged on its heat sink surface; a flow channel assembly including a coolant flow channel and a partition, and a liquid inlet and a liquid outlet are arranged on opposite sides of the coolant flow channel, respectively; the partition is arranged in the coolant flow channel to divide the coolant flow channel into a first sub-flow channel and a second sub-flow channel, the first sub-flow channel is connected to the liquid inlet, and the second sub-flow channel is connected to the liquid outlet, and a jet hole connecting the first sub-flow channel and the second sub-flow channel is arranged on the partition; the second sub-flow channel has an opening on one side away from the first sub-flow channel, the heat sink is installed at the opening, and its heat sink surface is arranged toward the partition, the heat sink pin fin is inserted in the jet hole, and the aperture of the jet hole is larger than the outer diameter of the heat sink pin fin. The technical problem that the heat exchange efficiency and heat dissipation effect of the heat dissipation method of the prior art need to be broken through and improved is solved.

Description

Technical Field

[0001] The present application relates to the technical field of electric vehicles, and in particular to a power module cooling device and a drive control device. Background Art

[0002] In the field of electric vehicle technology, the drive motor controller usually adopts direct liquid cooling for heat dissipation. The existing technology generally adopts a method of setting multiple pin fins on the heat sink at the bottom of the power module to increase the heat exchange contact area and thereby enhance the heat dissipation effect. Specifically, when the drive motor controller is working, the coolant enters from the water inlet of the drive motor controller flow channel, flows through the pin fins on the heat sink of the power module, and takes away the heat by convection heat exchange.

[0003] However, in actual applications, in order to prevent the flow channel from being blocked by foreign matter, it is usually not possible to add too many pin fins. In other words, the number of pin fins is limited. Then the heat exchange area increased by this method is also limited, that is, the heat exchange efficiency is also limited, and the heat dissipation effect needs to be broken through and improved. Therefore, how to break through the existing technical barriers to improving the heat exchange method, so as to further improve the heat exchange efficiency and heat dissipation effect, has become a problem that needs to be solved in this field. Summary of the invention

[0004] The purpose of the present application is to provide a power module cooling device and a drive control device to solve the technical problem that the heat exchange efficiency and heat dissipation effect of the heat dissipation method in the prior art need to be broken through and improved.

[0005] In a first aspect, the present application provides a power module cooling device, comprising:

[0006] The heat dissipation plate has a heat dissipation surface, on which heat dissipation pin fins are arranged, and the heat dissipation pin fins extend from the heat dissipation surface toward a direction away from the heat dissipation surface;

[0007] A flow channel assembly, comprising a coolant flow channel and a partition, wherein a liquid inlet and a liquid outlet are respectively provided on opposite sides of the coolant flow channel, the partition is arranged in the coolant flow channel to divide the coolant flow channel into a first sub-flow channel and a second sub-flow channel, the first sub-flow channel is connected to the liquid inlet, the second sub-flow channel is connected to the liquid outlet, and the partition is provided with a jet hole connecting the first sub-flow channel and the second sub-flow channel;

[0008] Among them, the second sub-channel has an opening on a side away from the first sub-channel, the heat sink is installed at the opening, and the heat dissipation surface is arranged toward the partition, the heat dissipation pin fin is inserted in the jet hole, and the aperture of the jet hole is larger than the outer diameter of the heat dissipation pin fin, and one end of the heat dissipation pin fin away from the heat dissipation surface extends into the first sub-channel.

[0009] In a second aspect, the present application provides a drive control device, comprising the power module cooling device as described in any one of the above items and a power module, wherein the power module is mounted on the heat sink of the power module cooling device.

[0010] The power module cooling device and drive control device provided in the present application can be specifically applied to electric vehicles. The power module cooling device includes a heat sink, on which a heat sink pin fin is fixedly provided, and also includes a flow channel assembly, which includes a coolant flow channel and a partition, and the coolant flow channel is provided with a liquid inlet and a liquid outlet on opposite sides, respectively, and the partition is arranged in the coolant flow channel to divide the coolant flow channel into a first sub-flow channel and a second sub-flow channel, wherein the first sub-flow channel is connected to the liquid inlet, and the second sub-flow channel is connected to the liquid outlet, and a jet hole connecting the first sub-flow channel and the second sub-flow channel is provided on the partition, and the second sub-flow channel has an opening on one side away from the first sub-flow channel, and the heat sink is installed at the opening, and the heat sink surface is arranged toward the partition, and the heat sink pin fin is inserted in the jet hole, and the aperture of the jet hole is larger than the outer diameter of the heat sink pin fin.

[0011] With such arrangement, the liquid-cooling liquid enters the first sub-channel from the liquid inlet of the cooling liquid channel, and is ejected from bottom to top to the second sub-channel through the jet hole connected to the second sub-channel, and then flows out from the liquid outlet connected to the second sub-channel, forming a three-dimensional flow heat dissipation space, and the heat dissipation pin fins will flow through at least once from bottom to top during the flow process to take away the heat, thereby realizing three-dimensional space flow heat dissipation and taking away the heat of the heat sink, breaking the existing technology of only blindly increasing the number of heat dissipation pin fins on the heat sink to increase the heat exchange contact area in two dimensions, breaking through the inherent idea, realizing three-dimensional flow energy conversion from the perspective of three-dimensional space by setting jet holes, increasing the circuitous flow space, and using the jet principle to double the heat exchange contact and heat dissipation area and heat dissipation time with the heat sink, reducing the thermal resistance of the power module, improving the cooling and heat exchange efficiency, and improving the heat dissipation effect. At the same time, the number of heat dissipation pin fins can be controlled, and the flow channel will not be blocked by foreign matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 A schematic diagram of the structure of a heat sink of a power module cooling device provided in the first embodiment of the present application;

[0014] Figure 2A schematic diagram of the structure of a flow channel assembly of a power module cooling device provided in the first embodiment of the present application;

[0015] Figure 3 A cross-sectional view of the overall structure of the drive control device provided in the first embodiment of the present application;

[0016] Figure 4 for Figure 3 A partial enlarged view of part A shown in FIG.

[0017] Figure 5 for Figure 3 Schematic diagram of water flow direction and dimension marking of heat dissipation pin-fin area in part A shown in FIG.

[0018] Figure 6 A three-dimensional diagram of the overall structure of the drive control device provided in the first embodiment of the present application;

[0019] Figure 7 A top view of the overall structure of the drive control device provided in the first embodiment of the present application;

[0020] Figure 8 A cross-sectional view of a drive control device provided in a second embodiment of the present application;

[0021] Fig. 9 for Figure 8 A partial enlarged view of part B shown in FIG.

[0022] Fig.10 A perspective view of the overall structure of a drive control device provided in the second embodiment of the present application;

[0023] Fig.11 This is a top view of the overall structure of the drive control device provided in the second embodiment of the present application.

[0024] Reference numerals:

[0025] 1000-drive control device; 100-power module cooling device; 10-heat sink; 11-heat sink surface; 111-heat sink pin fin; 112-second jet ring; 121-first heat sink; 122-second heat sink; 20-flow channel assembly; 21-cooling liquid flow channel; 211-liquid inlet; 212-liquid outlet; 213-first sub-flow channel; 214-second sub-flow channel; 22-partition; 221-jet hole; 222-first jet ring; 231-first partition; 2311-first jet hole; 232-second partition; 2321-second jet hole; 30-three-dimensional flow heat dissipation channel; 31-first longitudinal annular jet channel; 32-first transverse annular jet channel; 33-second longitudinal annular jet channel; 34-second transverse annular jet channel; 200-power module; 201-first power module; 202-second power module. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0030] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] like Figures 1 to 11 As shown, an embodiment of the present application provides a power module cooling device 100 and a drive control device 100 using the power module cooling device 100. The power module cooling device 100 and the drive control device 1000 can be specifically applied to electric vehicles. The drive control device 1000 can specifically include the power module cooling device 100 and a power module 200. The power module 200 is specifically installed on the heat sink 10 of the power module cooling device 100.

[0034] like Figures 1 to 7 As shown, a power module cooling device 100 provided in an embodiment of the present application includes a heat sink 10, which can be a copper plate, an aluminum plate or other metal plate suitable for heat dissipation. The heat sink 10 has a heat dissipation surface 11, and a heat dissipation pin fin 111 is provided on the heat dissipation surface 11. The heat dissipation pin fin 111 extends from the heat dissipation surface 11 in a direction away from the heat dissipation surface 11. The heat dissipation pin fin 111 can be specifically arranged along the following lines: Figure 3 The second direction shown extends in the Y direction, and the shape of the heat sink pin fin 111 is not specifically limited. The embodiment of the present application takes the circular heat sink pin fin as an example for explanation. Of course, in the actual implementation scheme, it can be transformed into any other shape of heat sink pin fin 111, such as elliptical heat sink pin fin, diamond heat sink pin fin, etc.

[0035] like Figure 3 As shown, the power module cooling device 100 provided in the embodiment of the present application further includes a flow channel assembly 20, which may include a coolant flow channel 21 and a partition 22. The coolant flow channel 21 may be provided with a liquid inlet 211 and a liquid outlet 212 on opposite sides thereof, respectively. Specifically, the liquid inlet 211 and the liquid outlet 212 may be respectively provided along the coolant flow channel 21 as shown in FIG. Figure 3The partition 22 is disposed in the coolant flow channel 21 on opposite sides of the first direction X shown in FIG. 1 , so as to divide the coolant flow channel 21 into a first sub-flow channel 213 and a second sub-flow channel 214. The first sub-flow channel 213 is connected to the liquid inlet 211, and the second sub-flow channel 214 is connected to the liquid outlet 212. The partition 22 is provided with a jet hole 221 connecting the first sub-flow channel 213 and the second sub-flow channel 214. The second sub-flow channel 214 is away from the first sub-flow channel 213. One side of the channel 213 has an opening, the heat sink 10 is installed at the opening, and the heat dissipation surface 11 of the heat sink 10 is arranged toward the partition 22, the heat dissipation pin fin 111 is inserted into the jet hole 221, and the end of the heat dissipation pin fin 111 away from the heat dissipation surface 11 extends into the first sub-channel 213, and the aperture of the jet hole 221 is larger than the outer diameter of the heat dissipation pin fin 111, so that there is a gap between the heat dissipation pin fin 111 and the jet hole 221, so that water can pass through.

[0036] like Figure 3 The first direction X and the second direction Y shown are perpendicular to each other. The first direction X may be the extension direction of the coolant channel 21, and the second direction Y may be the direction from the first sub-channel 213 to the second sub-channel 214. The heat sink 10 is located on one side of the coolant channel 21 in the second direction Y, and the heat sink 10 is arranged opposite to the partition 22, and the partition 22 is extended along the first direction X.

[0037] In an optional embodiment, a plurality of heat dissipation pin fins 111 may be provided at intervals on the heat dissipation surface 11 of the aforementioned heat dissipation plate 10, and a plurality of jet holes 221 may be correspondingly provided on the aforementioned partition 22. The plurality of jet holes 221 are provided in one-to-one correspondence with the plurality of heat dissipation pin fins 111, and each heat dissipation pin fin 111 is inserted into the corresponding jet hole 221, and the aperture of each jet hole 221 is larger than the outer diameter of the corresponding heat dissipation pin fin 111.

[0038] With such arrangement, the liquid cooling liquid enters the first sub-channel 213 from the liquid inlet 211 of the cooling liquid channel 21, and flows from the bottom to the top to the second sub-channel 214 through the jet hole 221 connected to the second sub-channel 214, and then flows out from the liquid outlet 212 connected to the second sub-channel 214, forming a three-dimensional flow heat dissipation space, and during the flow process, the heat dissipation pin fins 111 flow at least once from bottom to top, taking away the heat, realizing three-dimensional space flow heat dissipation, taking away the heat of the heat sink 10, breaking the existing technology of only Instead of simply increasing the number of heat sink pin fins 111 on the heat sink 10 to increase the heat exchange contact area in two dimensions, we break through the inherent idea and achieve three-dimensional flow energy conversion from a three-dimensional spatial perspective by setting jet holes 221, increase the circuitous flow space, and use the jet principle to double the heat exchange contact and heat dissipation area and heat dissipation time with the heat sink 10, thereby reducing the thermal resistance of the power module, improving the cooling and heat exchange efficiency, and improving the heat dissipation effect. At the same time, we can also control the number of heat sink pin fins 111 to prevent the flow channel from being blocked by foreign matter.

[0039] An optional embodiment, such as Figures 2 to 4 As shown, the aforementioned flow channel assembly 20 may also include: a first jet ring 222 disposed on the aforementioned baffle 22 and located between the baffle 22 and the heat dissipation surface 11 of the heat dissipation plate 10, the first end of the first jet ring 222 is connected to the jet hole 221, the second end of the first jet ring 222 opposite to the first end extends toward the heat dissipation surface 11 and is spaced from the heat dissipation surface 11, the heat dissipation pin fin 111 is inserted in the jet hole 221 and the first jet ring 222, and the inner diameter of the first jet ring 222 is greater than or equal to the aperture of the jet hole 221, so as to form a first longitudinal annular jet channel 31. Specifically, the first jet ring 222 may also be provided in plurality, and the plurality of first jet rings 222 are arranged one-to-one with the aforementioned plurality of jet holes 221, the first end of each of the first jet rings 222 is connected to the corresponding jet hole 221, and the inner diameter of each of the first jet rings 222 is greater than or equal to the aperture of the corresponding jet hole 221.

[0040] The setting of the first jet ring 222 further increases the three-dimensional space circuitous path, increases fluidity, increases the contact conversion area with the heat dissipation surface 11 of the heat dissipation plate 10 and the heat dissipation pin fins 111, improves the cooling heat exchange efficiency, and improves the heat dissipation effect.

[0041] Another optional embodiment, such as Figures 1 to 4As shown, the aforementioned flow channel assembly 20 may also include: a second jet ring 112 disposed on the heat dissipation surface 11 of the heat dissipation plate 10 and located between the partition 22 and the heat dissipation surface 11 of the heat dissipation plate 10, and the inner diameter of the second jet ring 112 is greater than the outer diameter of the heat dissipation pin fin 111, so that the second jet ring 112 is disposed around the heat dissipation pin fin 111, and the second jet ring 112 is spaced apart from the partition 22 to form a first transverse annular jet channel 32. Specifically, the second jet ring 112 may also be provided in plurality, and the plurality of second jet rings 112 are disposed one-to-one with the plurality of first jet rings 222, each of the second jet rings 112 is sleeved on the outer side of the corresponding first jet ring 222, and the inner diameter of each second jet ring 112 is greater than the outer diameter of the corresponding first jet ring 222.

[0042] The provision of the second jet ring 112 also further increases the three-dimensional space circuitous path, increases fluidity, increases the contact energy conversion area with the heat dissipation surface 11 of the heat dissipation plate 10 and the heat dissipation pin fins 111, improves the cooling heat exchange efficiency, and improves the heat dissipation effect.

[0043] Another optional embodiment is, Figures 1 to 7 As shown, the flow channel assembly 20 may include the aforementioned first jet ring 222 and the second jet ring 112 at the same time, the second jet ring 112 is sleeved on the outside of the first jet ring 222, and the inner diameter of the second jet ring 112 is greater than the outer diameter of the first jet ring 222. Specifically, the flow channel assembly 20 may include the aforementioned multiple first jet rings 222 and multiple second jet rings 112 arranged in a one-to-one correspondence, each of the second jet rings 112 is sleeved on the outside of the corresponding first jet ring 222, and the inner diameter of each of the second jet rings 112 is greater than the outer diameter of the corresponding first jet ring 222.

[0044] Such an arrangement can form a more circuitous three-dimensional flow heat dissipation channel 30, further improving the three-dimensional spatial circuitous path, increasing fluidity, improving cooling and heat exchange efficiency, and improving heat dissipation effect.

[0045] A specific embodiment, such as Figure 4 and Figure 5As shown, the inner peripheral side wall of the first jet ring 222 is spaced apart from the outer peripheral side wall of the heat dissipation pin fin 111 to form a first longitudinal annular jet channel 31, and the first longitudinal annular jet channel 31 is connected to the first sub-channel 213 through the jet hole 221; the second end of the first jet ring 222 is spaced apart from the heat dissipation surface 11 of the heat dissipation plate 10 to form a first transverse annular jet channel 32; the outer peripheral side wall of the first jet ring 222 is spaced apart from the inner peripheral side wall of the second jet ring 112 to form a second longitudinal annular jet channel 31. To the annular jet channel 33; the second longitudinal annular jet channel 33 is connected to the second sub-channel 214; the end of the second jet ring 112 close to the partition 22 is spaced apart from the partition 22 to form a second transverse annular jet channel 34, and the second transverse annular jet channel 34 is connected to the second sub-channel 214; the first longitudinal annular jet channel 31, the first transverse annular jet channel 32 and the second longitudinal annular jet channel 33 and the second transverse annular jet channel 34 are sequentially connected to form the three-dimensional flow heat dissipation channel 30.

[0046] Specific as Figure 5 The arrow shown indicates the flow direction. The liquid cooling liquid can enter from the liquid inlet 211, flow from the first longitudinal annular jet channel 31 through the first transverse annular jet channel 32, then through the second longitudinal annular jet channel 33, and then through the second transverse annular jet channel 34, and exit from the liquid outlet 212, completing the flow of a circuitous three-dimensional flow heat dissipation channel 30. Each three-dimensional flow heat dissipation channel 30 flows and circulates along this path in sequence, and finally completes the heat exchange flow of the entire heat sink 10.

[0047] The three-dimensional flow heat dissipation channel 30 arranged in this way greatly broadens the flow heat dissipation circuitous path from the three-dimensional space perspective, greatly increases the circuitous flow space, greatly increases the heat exchange contact heat dissipation area and heat dissipation time with the heat sink 10, greatly reduces the thermal resistance of the power module, improves the cooling heat exchange efficiency, and improves the heat dissipation effect.

[0048] An optional embodiment is as follows Figure 4 As shown, the heat dissipation pin fin 111 can be arranged on the central axis of the second jet ring 112; when the heat dissipation pin fin 111 extends into the corresponding first jet ring 222, the heat dissipation pin fin 111 can be located on the central axis of the first jet ring 222, that is, preferably arranged in a central symmetrical manner. This can greatly increase the overall circuitousness and improve the overall heat dissipation effect.

[0049] A specific embodiment is as follows Figure 5As shown, the first spacing a1 between the inner peripheral side wall of the first jet ring 222 and the outer peripheral side wall of the heat dissipation pin fin 111 is preferably between 0.8 and 1.1 mm; the second spacing a2 between the outer peripheral side wall of the first jet ring 222 and the inner peripheral side wall of the second jet ring 112 is preferably between 0.8 and 1.1 mm; preferably, the first spacing a1 and the second spacing a2 are set equal. This spacing size setting can effectively prevent foreign matter from clogging and ensure appropriate flow resistance for heat dissipation.

[0050] Further, such as Figure 5 As shown, the size of the third spacing b1 between the end surface of the second end of the first jet ring 222 and the heat dissipation surface 11 of the heat dissipation plate 10 is preferably between 0.9 and 1.2 mm; the size of the fourth spacing b2 between the end surface of the second jet ring 112 close to the partition 22 and the top surface of the partition 22 close to the second jet ring 112 is preferably between 0.9 and 1.2 mm; preferably, the third spacing b1 and the fourth spacing b2 are set equal. This spacing size setting can effectively prevent foreign matter from clogging and ensure appropriate flow resistance for heat dissipation.

[0051] Furthermore, Figure 5 As shown, the outer diameter c of the second jet ring 112 is less than or equal to 8 mm, and the size of the spacing setting of the outer diameter c can ensure that a single heat dissipation pin fin 111 can cover a sufficiently large heat dissipation area.

[0052] As described above, in the first embodiment of the present application, a power module 200 and a heat sink 10 and a flow channel assembly 20 are disposed in connection with each other.

[0053] The following, such as Figures 8 to 11 As shown, the second embodiment of the present application also provides a power module cooling device 100, which includes two heat sinks 10, the two heat sinks 10 are respectively a first heat sink 121 and a second heat sink 122, and the first heat sink 121 and the second heat sink 122 can be connected and arranged along the coolant flow channel 21 as shown in FIG. Figure 3 The two opposite sides of the second direction Y are arranged back to back, and correspondingly, the drive control device 1000 provided in the second embodiment of the present application also includes a first power module 201 and a second power module 202 respectively installed and connected to the first heat sink 121 and the second heat sink 122.

[0054] The cooling liquid flow channel 21 is as follows Figure 3The aforementioned liquid inlet 211 and liquid outlet 212 are respectively provided on opposite sides of the first direction X shown in the figure. Two spaced-apart partitions 22 are provided inside the coolant channel 21. The two spaced-apart partitions 22 are respectively a first partition 231 and a second partition 232. The first partition 231 and the second partition 232 divide the coolant channel 21 into a first sub-channel 213 and two second sub-channels 214 located on opposite sides of the first sub-channel 213. The first sub-channel 213 is connected to the liquid inlet 211, and the two second sub-channels 214 are respectively connected to the liquid outlet 212; the first jet hole 2311 on the first partition 231 connects the first sub-channel 213 with one of the second sub-channels 214, and the second jet hole 2321 on the second partition 232 connects the first sub-channel 213 with the other second sub-channel 214.

[0055] The above-mentioned first heat sink 121 is installed at the opening of one of the second sub-channels 214, and the heat dissipation surface 11 of the first heat sink 121 is set toward the first partition 231, and the heat dissipation pin fins 111 of the first heat sink 121 are inserted into the first jet holes 2311 on the first partition 231, and the aperture of the first jet holes 2311 on the first partition 231 is larger than the outer diameter of the heat dissipation pin fins 111 of the first heat sink 121; similarly, the above-mentioned second heat sink 122 is installed at the opening of another second sub-channel 214, and the heat dissipation surface 11 of the second heat sink 122 is set toward the second partition 232, and the heat dissipation pin fins 111 of the second heat sink 122 are inserted into the second jet holes 2321 on the second partition 232, and the aperture of the second jet holes 2321 on the second partition 232 is larger than the outer diameter of the heat dissipation pin fins 111 of the second heat sink 122.

[0056] In this way, two power modules 200 (the first power module 201 and the second power module 202) and two heat sinks 10 (the first heat sink 121 and the second heat sink 122) can share a coolant flow channel 21 and be connected back to back, so that the heat sink pin fins 111 of the heat sinks 10 of the two power modules 200 form mutual disturbance flows, thereby greatly improving the power density of the motor drive controller, and also greatly improving the efficiency of cooling and heat exchange.

[0057] Furthermore, the heat dissipation pin fins 111 on the first heat dissipation plate 121 and the heat dissipation pin fins 111 on the second heat dissipation plate 122 are as follows: Figure 3 The first direction X shown is alternately and spaced apart; the first jet holes 2311 of the first baffle 231 and the second jet holes 2321 of the second baffle 232 are alternately and spaced apart along the first direction X; the two heat sinks are respectively located on the opposite sides of the coolant flow channel 21 in the second direction Y. The mutual disturbance flow effect is reasonably utilized to the maximum extent, the cooling heat exchange efficiency is maximized, and the heat dissipation effect is improved.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power module cooling device, characterized in that: include: The heat dissipation plate has a heat dissipation surface, on which heat dissipation pin fins are arranged, and the heat dissipation pin fins extend from the heat dissipation surface toward a direction away from the heat dissipation surface; A flow channel assembly, comprising a coolant flow channel and a partition, wherein a liquid inlet and a liquid outlet are respectively provided on opposite sides of the coolant flow channel, the partition is arranged in the coolant flow channel to divide the coolant flow channel into a first sub-flow channel and a second sub-flow channel, the first sub-flow channel is connected to the liquid inlet, the second sub-flow channel is connected to the liquid outlet, and the partition is provided with a jet hole connecting the first sub-flow channel and the second sub-flow channel; Among them, the second sub-channel has an opening on a side away from the first sub-channel, the heat sink is installed at the opening, and the heat dissipation surface is arranged toward the partition, the heat dissipation pin fin is inserted into the jet hole, and the aperture of the jet hole is larger than the outer diameter of the heat dissipation pin fin, so that there is a gap between the heat dissipation pin fin and the jet hole, and one end of the heat dissipation pin fin away from the heat dissipation surface extends into the first sub-channel.

2. The power module cooling device according to claim 1, characterized in that: The flow channel assembly comprises: A first jet ring is arranged on the partition and located between the partition and the heat dissipation surface, the first end of the first jet ring is connected to the jet hole, the second end of the first jet ring extends toward the heat dissipation surface and is spaced apart from the heat dissipation surface, the heat dissipation pin fins are inserted in the first jet ring, and the inner diameter of the first jet ring is greater than or equal to the aperture of the jet hole.

3. The power module cooling device according to claim 2, characterized in that: The flow channel assembly comprises: A second jet ring is arranged on the heat dissipation surface of the heat dissipation plate and is located between the partition and the heat dissipation surface. The second jet ring is arranged around the heat dissipation pin fins, and the inner diameter of the second jet ring is larger than the outer diameter of the heat dissipation pin fins. The second jet ring is spaced apart from the partition.

4. The power module cooling device according to claim 3, characterized in that: The flow channel assembly includes the first jet ring and the second jet ring. The second jet ring is sleeved on the outer side of the first jet ring, and the inner diameter of the second jet ring is greater than the outer diameter of the first jet ring.

5. The power module cooling device according to claim 4, characterized in that: The inner peripheral side wall of the first jet ring is spaced apart from the outer peripheral side wall of the heat dissipation pin fin to form a first longitudinal annular jet channel, and the first longitudinal annular jet channel is connected to the first sub-channel through the jet hole; The second end of the first jet ring is spaced apart from the heat dissipation surface to form a first transverse annular jet channel; The outer peripheral side wall of the first jet ring and the inner peripheral side wall of the second jet ring are spaced apart to form a second longitudinal annular jet channel; One end of the second jet ring close to the partition is spaced apart from the partition to form a second transverse annular jet channel, and the second transverse annular jet channel is connected to the second sub-channel; The first longitudinal annular jet channel, the first transverse annular jet channel, the second longitudinal annular jet channel and the second transverse annular jet channel are sequentially connected to form a three-dimensional flow heat dissipation channel.

6. The power module cooling device according to claim 5, characterized in that: The heat dissipation pin fins are arranged on the central axis of the second jet ring; and / or The heat dissipation pin fins are located on the central axis of the first jet ring; and / or A first distance between the inner peripheral side wall of the first jet ring and the outer peripheral side wall of the heat dissipation pin fin is equal to a second distance between the outer peripheral side wall of the first jet ring and the inner peripheral side wall of the second jet ring; and / or A third distance between the end surface of the second end of the first jet ring and the heat dissipation surface is equal to a fourth distance between the end surface of one end of the second jet ring close to the partition and the top surface of the partition close to the second jet ring.

7. The power module cooling device according to claim 5, characterized in that: A first spacing between the inner peripheral side wall of the first jet ring and the outer peripheral side wall of the heat dissipation pin fin is 0.8-1.1 mm, and a second spacing between the outer peripheral side wall of the first jet ring and the inner peripheral side wall of the second jet ring is 0.8-1.1 mm; and / or A third distance between the end surface of the second end of the first jet ring and the heat dissipation surface is 0.9-1.2 mm, and a fourth distance between the end surface of one end of the second jet ring close to the partition and the top surface of the partition close to the second jet ring is 0.9-1.2 mm; and / or The outer diameter of the second jet ring is less than or equal to 8 mm.

8. The power module cooling device according to claim 1, characterized in that: The liquid inlet and the liquid outlet are respectively located on opposite sides of the coolant flow channel in a first direction, the first direction is a direction perpendicular to a second direction, and the second direction is a direction from the first sub-flow channel to the second sub-flow channel; the heat sink is located on one side of the coolant flow channel in the second direction, and the heat sink is arranged opposite to the partition; the partition extends along the first direction.

9. The power module cooling device according to any one of claims 4 to 8, characterized in that: The number of the heat dissipation plates is two, and the two heat dissipation plates are respectively a first heat dissipation plate and a second heat dissipation plate; There are two partitions, the two partitions are arranged opposite to each other and at intervals in the coolant flow channel, the two partitions divide the coolant flow channel into the first sub-flow channel and two second sub-flow channels located on opposite sides of the first sub-flow channel, and the two second sub-flow channels are respectively connected to the liquid outlet; the two partitions are respectively a first partition and a second partition, the jet hole on the first partition connects the first sub-flow channel with one of the second sub-flow channels, and the jet hole on the second partition connects the first sub-flow channel with another of the second sub-flow channels; The first heat sink is installed at the opening of one of the second sub-channels, and the heat dissipation surface of the first heat sink is arranged toward the first partition plate, the heat dissipation pin fins of the first heat sink are inserted into the jet holes on the first partition plate, and the aperture of the jet holes on the first partition plate is larger than the outer diameter of the heat dissipation pin fins of the first heat sink; The second heat sink is installed at the opening of another second sub-channel, and the heat dissipation surface of the second heat sink is arranged toward the second partition plate, the heat dissipation pin fins of the second heat sink are inserted into the jet holes on the second partition plate, and the aperture of the jet holes on the second partition plate is larger than the outer diameter of the heat dissipation pin fins of the second heat sink.

10. The power module cooling device according to claim 9, characterized in that: The heat dissipation pin fins on the first heat dissipation plate and the heat dissipation pin fins on the second heat dissipation plate are alternately and spaced apart in a first direction, the first direction is a direction perpendicular to a second direction, and the second direction is a direction from the first sub-flow channel to any one of the second sub-flow channels; The jet holes on the first baffle plate and the jet holes on the second baffle plate are arranged alternately and at intervals in the first direction; The two heat dissipation plates are respectively located on two opposite sides of the coolant flow channel in the second direction.

11. A drive control device, characterized in that: It comprises the power module cooling device according to any one of claims 1 to 10 and a power module, wherein the power module is mounted on the heat sink of the power module cooling device.

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