Microwave component pin lap welding device and method

Abstract

The present invention relates to the field of electronic component welding, and discloses a microwave component pin lap welding device and method, including: a welding frame; a solder paste box arranged on the top of the welding frame, the solder paste box is filled with solder paste liquid; a positioning frame arranged on the welding frame for placing a printed circuit board, the positioning frame is provided with a positioning part for positioning and fixing the printed circuit board; a solder paste tray arranged on the welding frame, located at the bottom of the solder paste box, and the solder paste tray is provided with a plurality of first openings and second openings; the present application provides a positioning frame and a solder paste tray, so that the printed circuit board can be accurately positioned during the coating process, ensuring that the solder paste can be accurately coated on the pad area. This design effectively avoids the uneven coating phenomenon caused by position offset in traditional manual coating, thereby reducing the problem of poor welding and improving the consistency and reliability of solder joints.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component welding, and in particular to a microwave component pin lap welding device and method. Background Art

[0002] Microwave components play a vital role in modern electronic devices, and their performance and reliability directly affect the overall performance of the equipment. During the manufacturing process, the pins of microwave components need to be precisely soldered to the printed circuit board to ensure the stability of the electrical and mechanical connections. Solder paste coating is one of the key links. Usually, the solder paste is evenly coated on the PCB, and then the component pins are placed on it. The solder paste is melted by heating to form a reliable solder joint.

[0003] In order to improve the accuracy of solder paste coating, more flux or solvent is usually added to the solder paste to reduce viscosity. This low-viscosity solder paste has better fluidity and helps to evenly distribute on the pad when applied, thereby reducing welding defects caused by uneven coating and ensuring the reliability and consistency of solder joints. This method is particularly suitable for the welding of microelectronic components and is particularly critical in the manufacture of high-density packaging components.

[0004] In electronics manufacturing, manual solder paste coating is widely used in small-batch production and R&D due to its flexibility and low cost. However, due to its reliance on operator skills, manual coating is prone to uneven coating, insufficient or excessive pad coverage, especially in the case of dense pads, which increases the difficulty of operation and is prone to defects such as adhesion and bridging. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a microwave component pin soldering device and method, which can significantly improve the uniformity and consistency of solder paste coating, reduce solder paste waste, and improve welding quality and process stability by introducing an automated coating mechanism and technical measures for accurately controlling solder paste flow and coating amount, thereby alleviating the above-mentioned problems to a certain extent.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A microwave component pin lap welding device, comprising:

[0008] Welding rack;

[0009] A solder paste box is arranged on the top of the welding frame, and the solder paste box is filled with solder paste liquid;

[0010] A positioning frame provided on the welding frame for placing a printed circuit board, wherein the positioning frame is provided with a positioning portion for positioning and fixing the printed circuit board;

[0011] A solder paste tray provided on the welding frame, located at the bottom of the solder paste box, and having a plurality of first openings and a second opening;

[0012] A connecting cavity is provided on the solder paste tray, a baffle is slidably connected in the connecting cavity, and a third opening is provided on the baffle, which is connected to the first opening and matched with the second opening;

[0013] A scraper provided on the solder paste tray, used for scraping the solder paste liquid on the solder paste tray;

[0014] A moving component provided between the welding frame and the positioning frame, used for moving the positioning frame up and down;

[0015] A scraper component provided between the solder paste box, the solder paste tray and the positioning frame, used for moving the position of the scraper when the positioning frame moves upward;

[0016] A releasing component disposed between the solder paste box and the solder paste tray is used to quantitatively release the solder paste liquid in the solder paste box.

[0017] Preferably, the positioning portion provided when the positioning frame moves upward to the first preset position can position and fix the printed circuit board located in the positioning frame, the scraper component can reset the position of the scraper when the positioning frame is reset downward, the scraper can push the solder paste liquid on the surface of the solder paste tray into the connecting cavity when it is reset, and the release component can release the solder paste liquid in the solder paste box when the positioning frame is reset downward after moving upward to the second preset position;

[0018] Wherein, when the positioning frame moves upward to the third preset position, the position of the baffle can be moved, and when the baffle moves to the preset position, the third opening on the baffle can be connected with the second opening;

[0019] Wherein, when the positioning frame is reset downward to a preset position, the position of the scraper can be reset and moved, and when the scraper is reset and moved to the preset position, the solder paste liquid in the connecting cavity can be pushed into the second opening;

[0020] The scraper component includes support bars connected to both sides of the solder paste tray, the support bars are rotatably connected to a first screw rod, the scraper is threadedly connected to the first screw rod, a reel is connected to the first screw rod, a first spring is connected between the reel and the support bar, the first spring is initially in a torsion state, a first traction rope is connected to the reel, and the other end of the first traction rope is connected to the positioning frame.

[0021] Preferably, one side of the scraper is connected to a connecting vertical bar, one side of the connecting vertical bar is slidably connected to a connecting horizontal bar, the connecting horizontal bar is threadedly connected to the first screw rod, a second spring is connected between the connecting horizontal bar and the connecting vertical bar, the top of the scraper is connected to a telescopic rod, the telescopic end of the telescopic rod is connected to a first diamond-shaped boss, a third spring is connected between the first diamond-shaped boss and the scraper, and the top of the support bar is connected to a second diamond-shaped boss.

[0022] Preferably, the solder paste tray is connected to a first rod, the first rod is slidably connected to a second rod connected to the solder paste box, a fourth spring is connected between the second rod and the first rod, the second rod is connected to a first wedge-shaped boss, and the top of the baffle is connected to a second wedge-shaped boss corresponding to the first wedge-shaped boss.

[0023] Preferably, connecting strips are respectively connected to both sides of the baffle, one end of the connecting strip extends to the position of the connecting horizontal strip and is connected to a top contact strip, and an oblique opening communicating with the connecting cavity is provided on the top of the solder paste tray.

[0024] Preferably, a channel connected to the third opening is provided on one side of the baffle, a block is provided in the channel, a connecting pipe is slidably connected to the block, a connecting pipe is provided with a connecting port, and a fifth spring is connected between the connecting pipe and the block.

[0025] Preferably, the release component includes a bottom opening opened at the bottom of the solder paste box, a release tube is slidably connected in the bottom opening, a release port is opened on one side of the release tube, and entry ports with a height higher than the release port are opened on both sides of the release tube, and the release port is located in the bottom opening, a sixth spring is connected between the release tube and the solder paste box, a rack is connected to one side of the first rod, and a rotating shaft is rotatably connected to the bottom of the solder paste box, a second traction rope is connected to the rotating shaft, and the other end of the second traction rope is connected to the release tube, the rotating shaft is provided with a gear meshing with the rack, and a ratchet mechanism is provided between the gear and the rotating shaft.

[0026] Preferably, the positioning portion includes a plurality of angle plates slidably connected to the positioning frame, a seventh spring is connected between the angle plate and the positioning frame, a connecting rod is rotatably connected to the bottom of the angle plate, a positioning shaft is connected to the bottom of the positioning frame, a connecting tube is slidably connected to the positioning shaft, the other end of the connecting rod is rotatably connected to the connecting tube, an eighth spring is connected between the connecting tube and the positioning shaft, a fixing frame is connected to the welding frame, and the connecting tube is in contact with the fixing frame.

[0027] Preferably, the moving component includes a second screw rod rotatably connected to the welding frame, the positioning frame is threadedly connected to the second screw rod, a motor is connected to the bottom of the fixed frame, and a chain transmission mechanism is provided between the driving shaft of the motor and the second screw rod.

[0028] A microwave component pin lap welding method is applicable to any of the microwave component pin lap welding devices described above, and the specific steps are as follows:

[0029] Step 1: Fill the solder paste liquid into the solder paste tray so that it flows into the first opening and the third opening on the baffle;

[0030] Step 2: Place the printed circuit board in the positioning frame, use the moving component to move the positioning frame upward to the first preset position, and the positioning part fixes the circuit board to ensure that it is aligned with the solder paste tray;

[0031] Step 3: Move the scraping component and the scraper to push the solder paste liquid evenly into the first opening and the third opening, handle the overflow and insufficient areas, and ensure the uniform distribution of the solder paste liquid;

[0032] Step 4: The positioning frame is further moved upward to a third preset position, and the third opening on the baffle is staggered with the first opening and connected with the second opening, so that the solder paste liquid is released onto the pad of the printed circuit board through the second opening;

[0033] Step 5: After coating is completed, the positioning frame is reset downward, and the scraper and the baffle are also reset accordingly, and the solder paste liquid flows back through the connection between the first opening and the third opening, ensuring the precise control and quantitative use of the solder paste liquid;

[0034] Step 6: When the positioning frame is reset downward, the release component releases a certain amount of solder paste liquid, and the scraper pushes the solder paste into the first opening to handle the excess solder paste liquid to ensure uniform distribution;

[0035] Step 7: After the positioning frame is reset to its initial position, use tweezers to place the microwave component on the solder pad coated with solder paste, and use a hot air tool to heat the solder paste liquid to melt it and combine it with the component pins to complete the welding.

[0036] In summary, the present invention mainly has the following beneficial effects:

[0037] 1. Precise positioning and coating:

[0038] This application introduces a combination of a positioning frame and a solder paste tray in the structural design, so that the printed circuit board can be accurately positioned during the coating process, ensuring that the solder paste is accurately coated on the pad area. This design effectively avoids the uneven coating phenomenon caused by position offset in traditional manual coating, thereby reducing the problem of poor welding and improving the consistency and reliability of solder joints.

[0039] 2. Apply evenly and avoid overdosage:

[0040] By setting up the scraper component and its moving mechanism, the scraper can push the solder paste liquid evenly, deal with the overflow problem of the solder paste liquid and compensate for the insufficient filling area. In this way, the solder paste liquid is distributed more evenly in the pad area, effectively avoiding the phenomenon of excessive or insufficient solder paste in the pad area, thereby ensuring the uniformity of solder paste coating and the consistency of solder joints.

[0041] 3. Reduce solder paste waste:

[0042] The baffle and scraper are designed to accurately control the flow and amount of solder paste. Excess solder paste is recycled through the scraper reset process, which reduces the waste of solder paste, reduces production costs, and prevents unnecessary pollution during the coating process.

[0043] 4. Improved automation and consistency:

[0044] This application improves the accuracy of the solder paste coating process through automated design and reduces the interference of human operation. Automation and quantitative control technology ensures that the amount of solder paste released each time is consistent, thereby improving the consistency and quality of production, and is particularly suitable for electronic manufacturing scenarios that require high precision and high consistency.

[0045] 5. Reduce welding defects:

[0046] By precisely controlling the amount and distribution of solder paste, uneven solder paste coating and soldering defects are avoided, thereby improving the reliability of the soldering process. Ultimately, the quality and stability of microwave component soldering are ensured, soldering defects are reduced, and the excellent performance of the final product is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0048] Figure 2 It is a schematic diagram of the structure of the solder paste box of the present invention;

[0049] Figure 3 yes Figure 2 A schematic diagram of the enlarged local structure at point A in the middle;

[0050] Figure 4 is a front view schematic diagram of the support bar structure of the present invention;

[0051] Figure 5 It is a schematic diagram of the structure of the solder paste tray of the present invention;

[0052] Figure 6 It is a schematic diagram of the structure of the connecting vertical bars and the connecting horizontal bars of the present invention;

[0053] Figure 7 It is a schematic diagram of the connecting pipe structure of the present invention;

[0054] Figure 8 It is a schematic diagram of the structure of the release component of the present invention;

[0055] Fig. 9 It is a schematic diagram of the release tube structure of the present invention;

[0056] Fig.10 It is a schematic diagram of the ratchet mechanism structure of the present invention;

[0057] Fig.11 It is a schematic diagram of the positioning frame structure of the present invention;

[0058] Fig.12 It is a schematic diagram of the connecting rod structure of the present invention.

[0059] Reference numerals:

[0060] 100, welding frame; 101, solder paste box; 102, positioning frame; 103, solder paste tray; 104, first opening; 105, second opening; 106, connecting cavity; 107, baffle; 108, third opening; 109, scraper;

[0061] 200, support bar; 201, first screw rod; 202, reel; 203, first spring; 204, first traction rope; 205, connecting vertical bar; 206, connecting horizontal bar; 207, second spring; 208, telescopic rod; 209, first diamond-shaped boss; 210, third spring; 211, second diamond-shaped boss;

[0062] 300, first rod; 301, second rod; 302, fourth spring; 303, first wedge-shaped boss; 304, second wedge-shaped boss; 305, connecting strip; 306, top contact strip; 307, oblique opening; 308, channel; 309, stopper; 310, connecting pipe; 311, connecting port; 312, fifth spring;

[0063] 400, bottom opening; 401, release tube; 402, release port; 403, entry port; 404, sixth spring; 405, rack; 406, rotating shaft; 407, second traction rope; 408, gear; 409, ratchet mechanism;

[0064] 500, angle plate; 501, seventh spring; 502, connecting rod; 503, positioning shaft; 504, connecting pipe; 505, eighth spring; 506, fixing frame;

[0065] 600, second screw rod; 601, motor; 602, chain transmission mechanism. DETAILED DESCRIPTION

[0066] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0067] refer to Figure 1-Figure 12 , a microwave component pin lap welding device, comprising:

[0068] Welding frame 100;

[0069] A solder paste box 101 is arranged on the top of the soldering frame 100, and the solder paste box 101 is filled with solder paste liquid;

[0070] A positioning frame 102 is provided on the welding frame 100 for placing a printed circuit board, and a positioning portion is provided on the positioning frame 102 for positioning and fixing the printed circuit board;

[0071] A solder paste tray 103 disposed on the soldering frame 100 is located at the bottom of the solder paste box 101, and a plurality of first openings 104 and second openings 105 are formed on the solder paste tray 103;

[0072] A connecting cavity 106 is provided on the solder paste tray 103, a baffle 107 is slidably connected in the connecting cavity 106, and a third opening 108 is provided on the baffle 107, which is communicated with the first opening 104 and matched with the second opening 105;

[0073] A scraper 109 disposed on the solder paste tray 103, used for scraping the solder paste liquid on the solder paste tray 103;

[0074] The moving component disposed between the welding frame 100 and the positioning frame 102 is used to move the positioning frame 102 up and down. When the positioning frame 102 moves upward to the first preset position, the positioning part disposed therein can position and fix the printed circuit board located in the positioning frame 102;

[0075] The scraper component is provided between the solder paste box 101, the solder paste tray 103 and the positioning frame 102, and is used to move the position of the scraper 109 when the positioning frame 102 moves upward. The scraper component can reset the position of the scraper 109 when the positioning frame 102 moves downward. The scraper 109 can push the solder paste liquid on the surface of the solder paste tray 103 into the connecting cavity 106 when resetting.

[0076] A release component provided between the solder paste box 101 and the solder paste tray 103, used for quantitatively releasing the solder paste liquid in the solder paste box 101, and the release component can release the solder paste liquid in the solder paste box 101 when the positioning frame 102 moves upward to the second preset position and then returns downward;

[0077] When the positioning frame 102 moves upward to the third preset position, the baffle 107 can be moved. When the baffle 107 moves to the preset position, the third opening 108 thereon can be connected to the second opening 105.

[0078] When the positioning frame 102 is reset downward to a preset position, the position of the movable scraper 109 can be reset, and when the scraper 109 is reset to a preset position, the solder paste liquid in the connecting cavity 106 can be pushed into the second opening 105;

[0079] By setting the solder paste tray 103, in the initial state, the solder paste liquid can be filled into the solder paste tray 103, and the solder paste liquid can enter the first opening 104 and the third opening 108 on the baffle 107. When in use, the operator can place the printed circuit board in the positioning frame 102, and can use the moving component to move the position of the positioning frame 102 upward. When the positioning frame 102 moves upward to the first preset position, the provided positioning part can position and fix the printed circuit board located in the positioning frame 102 to ensure that the printed circuit board corresponds to the position of the solder paste tray 103, so that in the subsequent solder paste coating process, the solder paste can be accurately coated on the predetermined pad area, avoiding the problem of poor welding caused by uneven coating due to position offset. 02 When the scraper 109 moves upward, the scraper 109 can move the position of the scraper 109. When the scraper 109 moves, the solder paste liquid on the solder paste tray 103 can be pushed into the first opening 104 and the third opening 108. For some of the solder paste liquid overflowing from the first opening 104 and the third opening 108, the part can be scraped flat. For some of the insufficient solder paste liquid in the first opening 104 and the second opening 105, the scraper 109 will push the surrounding solder paste liquid to these areas evenly, and the distribution of the solder paste liquid is more uniform. The scraper 109 can not only handle the overflowed solder paste, but also compensate for the insufficient filling area, avoiding the phenomenon of excessive or insufficient solder paste in the pad area, ensuring that all pads are fully and evenly coated with solder paste, ensuring the consistency of the solder joints, and in the positioning frame When the body 102 moves upward to the third preset position, the position of the baffle 107 can be moved. At this time, the printed circuit board on the positioning frame 102 is at the bottom of the solder paste tray 103, corresponding to the second opening 105. When the baffle 107 moves, the third opening 108 on the baffle 107 is gradually staggered from the first opening 104. When the baffle 107 continues to move to the preset position, the third opening 108 is completely staggered from the first opening 104 and is connected to the second opening 105. At this time, the solder paste liquid in the third opening 108 is accurately released and reaches the pad of the printed circuit board through the second opening 105. Through the precise movement of the baffle 107, the flow of the solder paste liquid is effectively controlled, and the excess solder paste liquid is retained, thereby avoiding the excess solder paste during the coating process. The solder paste liquid can be evenly distributed in the area corresponding to the solder pad, which ensures the high automation and accuracy of the solder paste coating process, reduces the uncertainty of manual operation, and improves the reliability of the welding process. After the solder paste coating is completed, the position of the positioning frame 102 can be reset downward. When the positioning frame 102 is reset downward, the scraper 109 can be reset. In addition, after the positioning frame 102 moves upward to the second preset position and moves downward to reset, the solder paste liquid in the solder paste box 101 is released. The release component can release a certain amount of solder paste liquid. This release action is completed before the scraper 109 is reset, ensuring that the scraper 109 can push the solder paste liquid into the first opening 104.When the scraper 109 moves, the baffle 107 has not yet reset and moved, and the first opening 104 and the third opening 108 are in a staggered state. The solder paste liquid on the solder paste tray 103 can be scraped into the first opening 104 through the reset movement of the scraper 109, and the excess solder paste liquid can be pushed into the connecting cavity 106 as the scraper 109 moves. When the positioning frame 102 resets and moves downward to the initial position, the scraper 109 and the baffle 107 can reset and move to the initial position. During this process, the first opening 104 is connected to the third opening 108, and the solder paste liquid in the first opening 104 can enter the third opening 108. The volume of the first opening 104 and the third opening 108 is the same, which can ensure that the solder paste liquid in the third opening 108 is quantitative, so that the amount of solder paste used each time can be accurately controlled to ensure consistency. In addition, during the reset movement of the baffle 107, the solder paste liquid in the connecting cavity 106 can be pushed to the third opening 108. The solder paste liquid overflowing from the third opening 108 can return to the solder paste tray 103 through the first opening 104. Through the cooperation of the scraper 109 and the baffle 107, the flow and usage of the solder paste liquid during the coating process are precisely controlled, and the excess solder paste liquid is scraped back into the connecting cavity 106 and further recycled through the resetting process to reduce waste. The resetting movement of the scraper 109 ensures the uniform distribution of the solder paste liquid and the effective collection of excess solder paste liquid, thereby avoiding uneven coating and welding defects. This process also ensures that the amount of solder paste liquid released each time is the same through quantitative control during resetting, thereby improving the consistency and quality of production. After the positioning frame 102 is reset downward to the initial position, the operator can use tools such as tweezers to place the microwave component on the solder pad coated with solder paste liquid. Subsequently, the solder paste liquid at the solder pad is heated with a hot air tool to melt and flow it, tightly combining it with the pins of the microwave component to form a firm electrical and mechanical connection. This step is the last step of the welding process, ensuring that the component is firmly fixed on the circuit board. Compared with the traditional manual solder paste coating method in the prior art, the present application is prone to uneven solder paste coating, insufficient or excessive pad coverage, and affects the subsequent welding quality. The present application sets a positioning frame 102 and a solder paste tray 103, so that the printed circuit board can be accurately positioned to ensure that the solder paste can be accurately coated on the pad area. In addition, the movement of the scraper component enables the scraper 109 to evenly push the solder paste liquid, avoiding uneven coating, thereby ensuring the consistency and reliability of the solder joints. The present application effectively solves many technical problems existing in the traditional manual solder paste coating process through automation and precise control technology, significantly improving the reliability, consistency and production efficiency of the microwave component welding process, and is suitable for electronic manufacturing scenarios that require high precision and high consistency. It can significantly reduce welding defects and ensure the quality of the final product. ,

[0080] As a further solution of the present invention, the scraping component includes a support bar 200 connected to both sides of the solder paste tray 103, the support bar 200 is rotatably connected to a first screw rod 201, the scraper 109 is threadedly connected to the first screw rod 201, the first screw rod 201 is connected to a reel 202, a first spring 203 is connected between the reel 202 and the support bar 200, the first spring 203 is initially in a torsion state, the reel 202 is connected to a first traction rope 204, and the other end of the first traction rope 204 is connected to the positioning frame 102;

[0081] By setting the first spring 203, in the initial state, the first spring 203 is in a torsion state and has potential energy. During the upward movement of the positioning frame 102, the first spring 203 gradually releases the potential energy, allowing the first screw rod 201 to rotate and reeling in the first traction rope 204. When the first screw rod 201 rotates, the scraper 109 can be moved by the force of the thread, and the scraper 109 can perform a scraping operation on the solder paste tray 103. Under the push of the scraper 109, the solder paste liquid is evenly distributed between the first opening 104 and the third opening 108, ensuring the uniformity of solder paste coating in the pad area.

[0082] As a further solution of the present invention, a connecting vertical bar 205 is connected to one side of the scraper 109, a connecting horizontal bar 206 is slidably connected to one side of the connecting vertical bar 205, the connecting horizontal bar 206 is threadedly connected to the first screw rod 201, a second spring 207 is connected between the connecting horizontal bar 206 and the connecting vertical bar 205, a telescopic rod 208 is connected to the top of the scraper 109, a telescopic end of the telescopic rod 208 is connected to a first diamond-shaped boss 209, a third spring 210 is connected between the first diamond-shaped boss 209 and the scraper 109, and a second diamond-shaped boss 211 is connected to the top of the support bar 200;

[0083] By setting a connecting horizontal bar 206, the scraper 109 can be connected to the first screw rod 201 by using the connecting horizontal bar 206 and the connecting vertical bar 205 to ensure that when the first screw rod 201 rotates, the scraper 109 can generate a moving motion. In addition, the third spring 210 and the telescopic rod 208 can limit the first diamond-shaped boss 209 to ensure that the first diamond-shaped boss 209 and the second diamond-shaped boss 211 are in the same plane. When the scraper 109 drives the first diamond-shaped boss 209 to move to the position of the second diamond-shaped boss 211 through the telescopic rod 208, one of the inclined surfaces contacts. When the scraper 109 continues to move, the first diamond-shaped boss 209 is limited by the second diamond-shaped boss 211 and can move upward. The connecting vertical bar 205 is allowed to slide on the connecting horizontal bar 206 through the telescopic rod 208 and the scraper 109. When the scraper 109 moves horizontally to scrape the solder paste liquid, some of the solder paste liquid will be It is pushed to one side of the solder paste tray 103. At this time, the first diamond-shaped boss 209 and the scraper 109 move upward to allow the scraper 109 to leave the solder paste liquid pile. The first diamond-shaped boss 209 slides on the second diamond-shaped boss 211 for a distance, allowing the scraper 109 to pass over the solder paste liquid pile. After the first diamond-shaped boss 209 is separated from the second diamond-shaped boss 211, during the process of the positioning frame 102 being reset downward, the first traction rope 204 can be used to make the first screw 201 rotate in the opposite direction, and the scraper 109 moves back to its original position. The first diamond-shaped boss 209 contacts the other sloped surface of the second diamond-shaped boss 211. At this time, the first diamond-shaped boss 209 moves downward to avoid the position of the second diamond-shaped boss 211. After the scraper 109 passes over the solder paste liquid pile and resets downward to contact the solder paste tray 103 again, during the process of resetting to the original position, the excess solder paste liquid can be pushed back, thereby effectively achieving the purpose of uniform distribution of the solder paste liquid.

[0084] As a further solution of the present invention, a first rod 300 is connected to the solder paste tray 103, a second rod 301 connected to the solder paste box 101 is slidably connected to the first rod 300, a fourth spring 302 is connected between the second rod 301 and the first rod 300, a first wedge-shaped boss 303 is connected to the second rod 301, and a second wedge-shaped boss 304 corresponding to the first wedge-shaped boss 303 is connected to the top of the baffle 107;

[0085] By setting the first rod 300 and the second rod 301, the first rod 300 and the second rod 301 can limit and support the position of the solder paste tray 103, and when the positioning frame 102 moves upward to the position of the support bar 200, it can contact the support bar 200, and the bottom height of the support bar 200 is lower than the solder paste tray 103, so as to ensure that when the positioning frame 102 moves upward, it can contact the support bar 200 instead of the printed circuit board, thereby reducing possible interference and misalignment. In addition, after the positioning frame 102 contacts the support bar 200 and continues to move upward, the solder paste tray 103 and the baffle 107 on the solder paste tray 103 can be moved upward through the support bar 200. When the baffle 107 moves upward to a preset position, the second The wedge-shaped boss 304 can contact the first wedge-shaped boss 303, and the second wedge-shaped boss 304 is limited to produce lateral displacement, and the baffle 107 is displaced to achieve the purpose of staggering the third opening 108 with the first opening 104 and connecting the third opening 108 with the second opening 105, thereby achieving accurate release and control of the solder paste liquid. In addition, the movement of the solder paste tray 103 is used to move the baffle 107 to release the solder paste liquid, rather than allowing the positioning frame 102 to move to the bottom of the solder paste tray 103 to immediately release the solder paste liquid, so that the solder paste tray 103 can be closer to the solder paste box 101. In this way, when releasing the solder paste liquid, the distance between the solder paste tray 103 and the solder paste box 101 is reduced, thereby avoiding the problem of excessive sputtering when the solder paste liquid is released on the solder paste tray 103.

[0086] As a further solution of the present invention, connecting strips 305 are respectively connected to both sides of the baffle 107, one end of the connecting strip 305 extends to the position of the connecting horizontal strip 206 and is connected to a top contact strip 306, and an oblique opening 307 communicating with the connecting cavity 106 is opened on the top of the solder paste tray 103;

[0087] By setting the connecting strip 305, after the first screw rod 201 rotates to allow the scraper 109 to move to the position of the second diamond-shaped boss 211, when the solder paste tray 103 moves upward to move the position of the baffle 107, the top contact strip 306 can be moved through the connecting head, and when the positioning frame 102 is subsequently reset downward and the first screw rod 201 is rotated in the opposite direction by the first traction rope 204 to reset the position of the scraper 109, the scraper 109 can push excess solder paste liquid to the oblique opening 307, and the solder paste liquid can enter the connecting cavity 106 through the oblique opening 307. When the baffle 107 is reset to the initial position, the connecting cross bar 206 can press the position of the top contact strip 306, and force the top contact strip 306 to move, so as to reset the baffle 107 through the top contact strip 306 and the connecting strip 305, thereby achieving the purpose of resetting the baffle 107.

[0088] As a further solution of the present invention, a channel 308 communicating with the third opening 108 is provided on one side of the baffle 107, a stopper 309 is provided in the channel 308, a connecting pipe 310 is slidably connected to the stopper 309, a connecting port 311 is provided on the connecting pipe 310, and a fifth spring 312 is connected between the connecting pipe 310 and the stopper 309;

[0089] By setting the baffle 309, the connecting pipe 310, the connecting port 311, and the fifth spring 312, a one-way valve mechanism can be formed, which can close the oblique opening 307 when the scraper 109 is reset to the preset position. After the oblique opening 307 is closed, the continued movement of the baffle 107 can compress the solder paste liquid in the connecting cavity 106, allowing the solder paste liquid to enter the third opening 108, so as to achieve the purpose of recycling.

[0090] As a further solution of the present invention, the release component includes a bottom opening 400 opened at the bottom of the solder paste box 101, a release tube 401 is slidably connected in the bottom opening 400, a release port 402 is opened on one side of the release tube 401, and entry ports 403 with a height higher than the release port 402 are opened on both sides of the release tube 401, and the release port 402 is located in the bottom opening 400, a sixth spring 404 is connected between the release tube 401 and the solder paste box 101, a rack 405 is connected to one side of the first rod 300, a rotating shaft 406 is rotatably connected to the bottom of the solder paste box 101, a second traction rope 407 is connected to the rotating shaft 406, and the other end of the second traction rope 407 is connected to the release tube 401, and a gear 408 meshing with the rack 405 is provided on the rotating shaft 406, and a ratchet mechanism 409 is provided between the gear 408 and the rotating shaft 406;

[0091] By setting the rack 405, when the solder paste tray 103 moves upward, the first rod 300 slides outside the second rod 301 and drives the rack 405 to move upward. The rack 405 moves upward and can mesh with the gear 408. The gear 408 rotates on the shaft 406 through the ratchet mechanism 409. When the positioning frame 102 is subsequently reset downward, the fourth spring 302 between the first rod 300 and the second rod 301 can release potential energy, and the solder paste tray 103 is reset downward. At this time, the rack 405, the gear 408, and the ratchet mechanism 409 can be used to rotate the shaft 406. The rotating shaft 406 rotates to reel in the second traction rope 407, allowing the release tube 401 to move downward, and the solder paste liquid can enter the release tube 401 through the inlet port 403. When the release tube 401 moves down to a preset position, the inlet port 403 is closed by the bottom opening 400, and the release port 402 leaves the bottom opening 400, and the solder paste liquid can be released onto the solder paste tray 103 through the bottom opening 400. By using the fixed volume of the release tube 401, the release amount of the solder paste liquid can be accurately controlled to ensure that the amount of solder paste released each time is consistent, thereby optimizing the uniformity and accuracy of solder paste coating.

[0092] As a further solution of the present invention, the positioning part includes a plurality of angle plates 500 slidably connected to the positioning frame 102, a seventh spring 501 is connected between the angle plate 500 and the positioning frame 102, a connecting rod 502 is rotatably connected to the bottom of the angle plate 500, a positioning shaft 503 is connected to the bottom of the positioning frame 102, a connecting pipe 504 is slidably connected to the positioning shaft 503, the other end of the connecting rod 502 is rotatably connected to the connecting pipe 504, an eighth spring 505 is connected between the connecting pipe 504 and the positioning shaft 503, a fixing frame 506 is connected to the welding frame 100, and the connecting pipe 504 is in contact with the fixing frame 506;

[0093] By setting the seventh spring 501 and the eighth spring 505, the seventh spring 501 is initially in a stretched state and the eighth spring 505 is initially in a compressed state. When the positioning frame 102 is moved upward, the positioning frame 102 gradually moves away from the fixing frame 506, and the eighth spring 505 and the seventh spring 501 gradually release potential energy, and the angle plate 500 can move toward the central axis of the positioning frame 102, and the printed circuit board located in the positioning frame 102 is accurately clamped and fixed at a predetermined position. The design of the connecting rod 502 ensures the stability of the angle plate 500 when moving, and the sliding connection between the positioning shaft 503 and the connecting tube 504 enables the positioning frame 102 to maintain a stable clamping state of the printed circuit board during the movement of different heights. Through this arrangement, it is ensured that the printed circuit board will not be offset in the subsequent operation, thereby improving the accuracy and reliability of the subsequent solder paste coating and welding process.

[0094] As a further solution of the present invention, the moving component includes a second screw rod 600 rotatably connected to the welding frame 100, the positioning frame 102 is threadedly connected to the second screw rod 600, the bottom of the fixed frame 506 is connected to a motor 601, and a chain transmission mechanism 602 is provided between the driving shaft of the motor 601 and the second screw rod 600;

[0095] By setting up the motor 601, when in use, the driving shaft of the motor 601 can be used to rotate, and the driving shaft of the motor 601 drives the second screw rod 600 to rotate through the chain transmission mechanism 602. Since the positioning frame 102 is threadedly connected to the second screw rod 600, the rotation of the second screw rod 600 will drive the positioning frame 102 to move up and down along the second screw rod 600.

[0096] A microwave component pin lap welding method is applicable to any of the microwave component pin lap welding devices described above, and the specific steps are as follows:

[0097] Step 1: Fill the solder paste liquid into the solder paste tray 103 so that it flows into the first opening 104 and the third opening 108 on the baffle 107;

[0098] Step 2: Place the printed circuit board in the positioning frame 102, use the moving component to move the positioning frame 102 upward to the first preset position, and the positioning part fixes the circuit board to ensure that it is aligned with the solder paste tray 103;

[0099] Step 3: Move the scraping component and the scraper 109 to push the solder paste liquid evenly into the first opening 104 and the third opening 108, handle the overflow and insufficient areas, and ensure the uniform distribution of the solder paste liquid;

[0100] Step 4: The positioning frame 102 is further moved upward to the third preset position, and the third opening 108 on the baffle 107 is staggered from the first opening 104 and communicated with the second opening 105, so that the solder paste liquid is released onto the pad of the printed circuit board through the second opening 105;

[0101] Step 5: After coating is completed, the positioning frame 102 is reset downward, and the scraper 109 and the baffle 107 are also reset accordingly, and the solder paste liquid flows back through the connection between the first opening 104 and the third opening 108, ensuring accurate control and quantitative use of the solder paste liquid;

[0102] Step 6: When the positioning frame 102 is reset downward, the release component releases a certain amount of solder paste liquid, and the scraper 109 pushes the solder paste liquid into the first opening 104 to process the excess solder paste liquid to ensure uniform distribution;

[0103] Step 7: After the positioning frame 102 is reset to the initial position, tweezers are used to place the microwave component on the solder pad coated with solder paste, and a hot air tool is used to heat the solder paste liquid to melt it and combine it with the component pins to complete the welding.

[0104] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A microwave component pin lap welding device, characterized in that: include: Welding rack (100); A solder paste box (101) arranged on the top of the soldering frame (100), wherein the solder paste box (101) is filled with solder paste liquid; A positioning frame (102) provided on the welding frame (100) for placing a printed circuit board, wherein the positioning frame (102) is provided with a positioning portion for positioning and fixing the printed circuit board; A solder paste tray (103) provided on the soldering frame (100) and located at the bottom of the solder paste box (101), wherein the solder paste tray (103) is provided with a plurality of first openings (104) and second openings (105); A connecting cavity (106) is provided on the solder paste tray (103), a baffle (107) is slidably connected in the connecting cavity (106), and a third opening (108) is provided on the baffle (107) and is communicated with the first opening (104) and is adapted to the second opening (105); A scraper (109) provided on the solder paste tray (103) and used for scraping the solder paste liquid on the solder paste tray (103); A moving component provided between the welding frame (100) and the positioning frame (102), used for moving the positioning frame (102) up and down; a paste scraping component provided between the solder paste box (101), the solder paste tray (103) and the positioning frame (102), and used for moving the position of the scraper (109) when the positioning frame (102) moves upward; A release component provided between the solder paste box (101) and the solder paste tray (103), used for quantitatively releasing the solder paste liquid in the solder paste box (101); The solder paste tray (103) is connected to a first rod (300), a second rod (301) connected to the solder paste box (101) is slidably connected to the first rod (300), a fourth spring (302) is connected between the second rod (301) and the first rod (300), a first wedge-shaped boss (303) is connected to the second rod (301), and a second wedge-shaped boss (304) corresponding to the first wedge-shaped boss (303) is connected to the top of the baffle (107).

2. A microwave component pin lap welding device according to claim 1, characterized in that: The positioning portion provided when the positioning frame (102) moves upward to the first preset position can position and fix the printed circuit board located in the positioning frame (102); the scraping component can reset the position of the scraper (109) when the positioning frame (102) resets downward; the scraper (109) can push the solder paste liquid on the surface of the solder paste tray (103) into the connecting cavity (106) when resetting; and the releasing component can release the solder paste liquid in the solder paste box (101) when the positioning frame (102) resets downward after moving upward to the second preset position; Wherein, when the positioning frame (102) moves upward to a third preset position, the position of the baffle (107) can be moved, and when the baffle (107) moves to the preset position, the third opening (108) thereon can be connected to the second opening (105); When the positioning frame (102) is reset downward to a preset position, the position of the scraper (109) can be reset, and when the scraper (109) is reset to the preset position, the solder paste liquid in the connecting cavity (106) can be pushed into the second opening (105); The scraper component comprises a support bar (200) connected to both sides of the solder paste tray (103); a first screw rod (201) is rotatably connected to the support bar (200); the scraper (109) is threadedly connected to the first screw rod (201); a reel (202) is connected to the first screw rod (201); a first spring (203) is connected between the reel (202) and the support bar (200); the first spring (203) is initially in a twisted state; a first traction rope (204) is connected to the reel (202); the other end of the first traction rope (204) is connected to the positioning frame (102).

3. A microwave component pin lap welding device according to claim 2, characterized in that: One side of the scraper (109) is connected to a connecting vertical bar (205), one side of the connecting vertical bar (205) is slidably connected to a connecting horizontal bar (206), the connecting horizontal bar (206) is threadedly connected to the first screw rod (201), a second spring (207) is connected between the connecting horizontal bar (206) and the connecting vertical bar (205), the top of the scraper (109) is connected to a telescopic rod (208), the telescopic end of the telescopic rod (208) is connected to a first rhombus boss (209), a third spring (210) is connected between the first rhombus boss (209) and the scraper (109), and the top of the support bar (200) is connected to a second rhombus boss (211).

4. A microwave component pin lap welding device according to claim 3, characterized in that: The baffle (107) is respectively connected to connecting strips (305) on both sides, one end of the connecting strip (305) extends to the position of the connecting horizontal strip (206) and is connected to a top contact strip (306), and the top of the solder paste tray (103) is provided with an oblique opening (307) that is connected to the connecting cavity (106).

5. A microwave component pin lap welding device according to claim 1, characterized in that: A channel (308) communicating with the third opening (108) is provided on one side of the baffle plate (107); a block (309) is provided in the channel (308); a connecting pipe (310) is slidably connected to the block (309); a connecting port (311) is provided on the connecting pipe (310); and a fifth spring (312) is connected between the connecting pipe (310) and the block (309).

6. A microwave component pin lap welding device according to claim 1, characterized in that: The release component comprises a bottom opening (400) opened at the bottom of the solder paste box (101), a release tube (401) is slidably connected in the bottom opening (400), a release port (402) is opened on one side of the release tube (401), and entry ports (403) with a height higher than the release port (402) are opened on both sides of the release tube (401), the release port (402) is located in the bottom opening (400), and a first release port (403) is connected between the release tube (401) and the solder paste box (101). Six springs (404), one side of the first rod (300) is connected to a rack (405), the bottom of the solder paste box (101) is rotatably connected to a rotating shaft (406), a second traction rope (407) is connected to the rotating shaft (406), the other end of the second traction rope (407) is connected to the release tube (401), the rotating shaft (406) is provided with a gear (408) meshing with the rack (405), and a ratchet mechanism (409) is provided between the gear (408) and the rotating shaft (406).

7. A microwave component pin lap welding device according to claim 1, characterized in that: The positioning portion comprises a plurality of angle plates (500) slidably connected to the positioning frame (102); a seventh spring (501) is connected between the angle plates (500) and the positioning frame (102); a connecting rod (502) is rotatably connected to the bottom of the angle plates (500); a positioning shaft (503) is connected to the bottom of the positioning frame (102); a connecting tube (504) is slidably connected to the positioning shaft (503); the other end of the connecting rod (502) is rotatably connected to the connecting tube (504); an eighth spring (505) is connected between the connecting tube (504) and the positioning shaft (503); a fixing frame (506) is connected to the welding frame (100); and the connecting tube (504) is in contact with the fixing frame (506).

8. A microwave component pin lap welding device according to claim 7, characterized in that: The moving component comprises a second screw rod (600) rotatably connected to the welding frame (100), the positioning frame (102) is threadedly connected to the second screw rod (600), a motor (601) is connected to the bottom of the fixed frame (506), and a chain transmission mechanism (602) is provided between the driving shaft of the motor (601) and the second screw rod (600).

9. A method for lap welding a microwave component pin, applicable to a microwave component pin lap welding device according to any one of claims 1 to 8, characterized in that: The specific steps are as follows: Step 1: Fill the solder paste liquid into the solder paste tray (103) so that it flows into the first opening (104) and the third opening (108) on the baffle (107); Step 2: placing the printed circuit board in the positioning frame (102), using a moving component to move the positioning frame (102) upward to a first preset position, and using the positioning part to fix the circuit board to ensure alignment with the solder paste tray (103); Step 3: Move the scraping component and the scraper (109) to push the solder paste liquid evenly into the first opening (104) and the third opening (108), handle the overflow and insufficient areas, and ensure the uniform distribution of the solder paste liquid; Step 4: the positioning frame (102) is further moved upward to a third preset position, and the third opening (108) on the baffle (107) is staggered from the first opening (104) and communicated with the second opening (105), so that the solder paste liquid is released onto the pad of the printed circuit board through the second opening (105); Step 5: After coating is completed, the positioning frame (102) is reset downward, and the scraper (109) and the baffle (107) are also reset accordingly, and the solder paste liquid flows back through the connection between the first opening (104) and the third opening (108), thereby ensuring accurate control and quantitative use of the solder paste liquid; Step 6: When the positioning frame (102) is reset downward, the release component releases a fixed amount of solder paste liquid, and the scraper (109) pushes the solder paste liquid into the first opening (104), and handles the excess solder paste liquid to ensure uniform distribution; Step 7: After the positioning frame (102) is reset to the initial position, the microwave component is placed on the solder pad coated with solder paste using tweezers, and the solder paste liquid is heated using a hot air tool to melt it and combine it with the component pins to complete the soldering.

Images