Plasma automatic control line for PCB production

Abstract

The application discloses a kind of Plasma automatic control line for PCB board production, including feeding production line, PCB board feeding device, carrier feeding device, plate frame and PCB board automatic transfer device, double-station plasma cleaning and etching machine, carrier unloading and buffer device, PCB board unloading device and unloading production line, PCB board feeding device is vertically transferred to the PCB board sent by feeding production line;Carrier feeding device sequentially vertically inserts multiple PCB boards supplied in the clamping plate frame of vacant carrier;Plate frame and PCB board automatic transfer device transport the carrier after loading multiple PCB boards into Plasma station plasma cleaning and after cleaning, unload and buffer station of carrier unloading and buffer device together, and transport the empty carrier after unloading to feeding station;Realize the automation of PCB board whole process plasma cleaning, cancel the dross removal section of copper plating line, simplify production process and procedure, effectively reduce production cost and improve production efficiency.

Description

Technical field

[0001] The present invention relates to PCB board processing technology, in particular to a Plasma automatic control line for PCB board production. [Background Technology]

[0002] PCBs are the most important components in the electronics industry. With the rapid development of the electronics industry, HDI (High Density Interconnection) boards, IC packaging substrates, rigid-flex boards, embedded component boards, optoelectronic boards, and specialty substrate printed boards represent the current development direction of printed circuit boards (PCBs). The development trend of electronic products requires PCBs to develop in the direction of miniaturization, lightweight, high speed, high frequency, and multifunctionality.

[0003] Plasma technology was first used in the semiconductor industry, but its application in PCB manufacturing was relatively recent. Plasma cleaning involves the directional movement of highly activated plasma under the influence of an electric field, where it undergoes a gas-curing reaction with drill contaminants on the hole walls. The resulting gas products and some unreacted particles are simultaneously expelled by a vacuum pump. With the advancement of PCB manufacturing processes, plasma equipment has also been continuously improved. Plasma uniformity is a key parameter. If the PCB hole cleaning process is uneven, drill contaminants will remain, hindering the electrical connection of the metallized plate. New plasma equipment has improved uniformity, enabling repeatable process quality within the same vacuum chamber, both during the same process and across different batches. Efficiently cleaning blind vias, dealing with various drill contaminants generated by different media and lasers, is currently a hot topic in the industry.

[0004] In the prior art, the typical PCB production process includes: cutting, drilling, copper plating, pattern transfer, pattern electroplating, etching, solder mask application, texturing, surface treatment, external molding, final inspection, and packaging for shipment. The hole metallization process in PCBs remains a critical step in production, directly impacting the electrical connection performance of electronic products. The effectiveness of drill smear removal directly impacts the quality of the plating within the holes, which in turn determines the product's yield. Currently, numerous methods exist for desmearing, including wet and dry methods. Wet treatments include treatments with concentrated sulfuric acid, concentrated chromic acid, potassium permanganate, and polyimide (PI) for conditioning. The copper plating process is a critical step within the wet process. Failure to properly control process parameters can lead to numerous functional issues, such as voids in the hole walls. Electroless copper plating (ECP) is short for electroless copper plating. Prior to electroless copper plating, the drilled holes in multilayer PCBs undergo a desmearing process to effectively ensure the subsequent copper plating process. However, with the development of technology, existing multi-layer PCB circuit board structures seek higher aspect ratios and smaller apertures. The traditional desmear cleaning method (i.e., wet treatment) for drilling and hole drilling is greatly limited. In particular, due to the different specifications of the PCB boards to be cleaned, the PCB boards are difficult to fix during the cleaning process. The operation of cleaning them individually is very cumbersome and the cleaning efficiency is low.

[0005] Dry treatment involves removing drill contamination from hole walls using plasma in a vacuum environment. PCB plasma cleaning and etching equipment utilizes plasma degumming, surface roughening / cleaning, and activation to physically impact and chemically react with the PCB surface. This releases the cleaned surface material into particles and gaseous matter, which are then vacuumed to achieve the surface treatment. Furthermore, in existing technologies, the materials of flexible printed circuit boards and rigid-flexible boards swell in wet treatment solutions, causing delamination of multilayer boards and environmental pollution. Therefore, plasma treatment is preferred for flexible multilayer boards and rigid-flexible boards. Plasma degumming eliminates the need for an entire wet process line, reducing chemical treatment costs and water usage.

[0006] Therefore, how to effectively combine PCB plasma cleaning and etching equipment with the existing plated through hole (PTH) production line in the PCB board processing process, simplify or eliminate the existing desmear cleaning method in chemical copper plating, effectively utilize plasma cleaning (PLASMA) to reduce operating costs, eliminate the discharge of chemicals and wastewater during the production process, and save energy and protect the environment and reduce production costs, so as to change the existing plated through hole (PTH) production line's manual loading and unloading process and further optimize production efficiency. This is a technical problem that urgently needs to be solved in the current plated through hole (PTH) processing of PCB boards. SUMMARY

[0007] The application provides a plasma automatic control line for PCB production, which realizes processing of a large number of PCBs in the same batch through automatic control, and effectively improves production efficiency and reduces material transfer.

[0008] The technical scheme adopted by the application to solve the technical problem is:

[0009] A plasma automatic control line for PCB production is used for automatic plasma cleaning of PCBs, and comprises:

[0010] A feeding production line is used for automatic feeding and conveying of PCBs to be processed.

[0011] A PCB feeding device vertically transfers the PCBs horizontally fed by the feeding production line to the next station one by one.

[0012] A carrier feeding device vertically inserts the plurality of PCBs fed by the PCB feeding device into the clamping frame of the empty carrier.

[0013] A board frame and PCB automatic transfer device transfers the carrier loaded with the plurality of PCBs to the plasma station for plasma cleaning, and transfers the cleaned PCBs and carrier to the unloading station, and transfers the double-station empty carrier to the unloading station to the unloading station of the carrier feeding device.

[0014] A double-station plasma cleaning and etching machine automatically feeds the plurality of PCBs of the same batch transferred by the board frame and PCB automatic transfer device to one cavity or two cavities for simultaneous cleaning and deslagging.

[0015] A carrier unloading and buffering device is provided with double stations, and pre-stores the PCBs on the clamping frame according to the processing progress, or vertically extracts the PCBs on the clamping frame and transfers them to the unloading station one by one.

[0016] A PCB unloading device vertically feeds the PCBs extracted by the carrier unloading and buffering device to the next station one by one after being turned over by 90°.

[0017] An unloading production line is used for horizontally receiving the cleaned PCBs vertically transferred by the PCB unloading device, and automatically unloading and outputting the PCBs.

[0018] Preferably, the PCB board loading device adopts a double-station feed port setting, and a hoisting and transverse movement mechanism is also provided between the PCB board loading device and the loading production line, which is used for the PCB boards placed horizontally on the loading production line to enter from two different feed channels in the relative feeding direction and the longitudinal direction after hoisting.

[0019] Preferably, the PCB board loading device includes a loading support frame, a PCB board positioning platform, a multi-joint loading robot and two carrier board collection boxes, the PCB board positioning platform is installed on the upper side of the loading support frame, and a visual camera for obtaining PCB board position information is installed on the loading support frame above the PCB board positioning platform, the multi-joint loading robot is fixedly installed in the middle of the loading support frame, and the two carrier board collection boxes are separately installed on the loading support frame on both sides of the multi-joint loading robot, and the end of the multi-joint loading robot is installed with a vacuum adsorption gripper frame for vacuum adsorption to grab each PCB board to be processed transmitted from the loading production line, the multi-joint loading robot deflects the PCB boards to be processed one by one to a vertical state through the vacuum adsorption gripper frame and sends them to the clamping station of the carrier loading device, and at the same time, the multi-joint loading robot adsorbs and grabs the empty carrier boards supporting and carrying PCB boards on the loading production line through the vacuum adsorption gripper frame and places them in the carrier board collection boxes on both sides respectively.

[0020] Preferably, the carrier loading device includes a mounting frame, two sets of plug-in and unplugging clamping mechanisms arranged in parallel and in a double-station configuration, a clamping frame and a board frame positioning seat arranged in parallel in a double-station configuration for inserting PCB boards, and the board frame positioning seat is provided with a plurality of slide rails for supporting the clamping frame and sliding forward and backward to guide input or output, and a locking assembly for locking the clamping frame in position;

[0021] The two sets of plug-in and clamping mechanisms are installed on the top side of the installation frame and are used to clamp the vertical PCB board transferred to the PCB board feeding device after feeding and then move backward and respectively inserted into each station of the clamping frame;

[0022] Each group of the plugging and unclamping mechanisms includes a plate moving drive motor, a linear slide assembly, an up and down lifting plugging assembly and multiple groups of clamping assemblies, multiple groups of the clamping assemblies are evenly installed at the bottom end of the up and down lifting plugging assembly, each group of the clamping assembly includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board, the up and down lifting plugging assembly is installed on a beam that slides left and right on the linear slide assembly, and the plate moving drive motor drives the beam and the up and down lifting plugging assembly through a gear belt to slide left and right along the slide rails on both sides of the linear slide assembly;

[0023] The up and down lifting and plugging assembly includes a lifting motor and a worm gear linear lifting frame. The lifting motor is installed on the crossbeam on the linear slide assembly. Multiple groups of clamping assemblies are evenly installed on the bottom end of the worm gear linear lifting frame. The lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives the PCB boards clamped by the multiple groups of clamping assemblies to move downward synchronously through the lifting frame at the lower end and be inserted into each limit slot of the clamping frame.

[0024] Preferably, the plate frame and PCB board automatic transfer device includes a linear guide mechanism and a plate frame transfer mechanism, the plate frame transfer mechanism is slidably mounted on the linear guide mechanism and is positioned and stopped at the carrier loading and unloading station of the carrier loading device, the carrier loading and unloading station of each cavity on the double-station plasma cleaning and etching machine, and the carrier loading and unloading station of the PCB board unloading device;

[0025] The linear guide mechanism includes a track frame, two first linear guide rails disposed on the front and rear edges of the track frame, and a track rack located in the middle of the track frame, wherein the track rack is parallel to the first linear guide rails and spaced apart from each other;

[0026] The plate frame transfer mechanism includes a moving frame and a first drive motor, wherein the moving frame is slidably mounted on the first linear guide rail, the first drive motor is mounted on the moving frame, and a gear meshing with the track rack is provided at the driving end of the first drive motor, and the first drive motor drives the moving frame to slide laterally and linearly along the first linear guide rail;

[0027] The movable frame is further provided with a second linear guide and a second motor, the second linear guide is provided with a positioning frame, the positioning frame is provided with a docking linear slide, and the second motor drives the positioning frame to slide along the second linear guide to drive the docking linear slide to dock with the loading station or the unloading station;

[0028] The alignment frame is also fixedly connected to a third linear guide rail and a third motor, and the third linear guide rail is provided with a plate frame locking mechanism for locking the clamping frame, and the plate frame locking mechanism driven by the third motor through an annular gear belt slides forward along the third linear guide rail, approaches and locks the clamping frame through the pneumatic gripper of the plate frame locking mechanism, and drags the clamping frame along the docking linear slide rail to the alignment frame through the reverse sliding of the third motor; conversely, the empty clamping frame on the movable frame is sent to the carrier loading device.

[0029] Preferably, the plate frame locking mechanism includes a base, a guide seat and a push-pull cylinder are provided on the base, an F-shaped fastener that can slide relatively is provided on the guide seat, the movable end of the push-pull cylinder is connected to a driving plate that moves laterally along a linear groove, and the end of the F-shaped fastener cooperates with the inclined driving groove on the driving plate through a pin shaft; the push-pull cylinder drives the F-shaped fastener to slide back and forth through the driving plate, and controls the F-shaped clamp head at the front end of the F-shaped fastener through the inclined driving groove to lock the splint frame or release the lock of the splint frame.

[0030] Preferably, the carrier unloading and caching device includes a base frame, two sets of parallel and double-station extraction and clamping mechanisms, and a plate frame loading seat for caching the plate frame and directly loading the plate frame respectively. The plate frame loading seat is provided with a plurality of slide rails for supporting the plate frame and sliding forward and backward to guide input or output, and a locking assembly for positioning and locking the plate frame.

[0031] The two sets of extraction and clamping mechanisms are installed on the top side of the base frame and are fed and moved horizontally to support and clamp the vertical PCB board transferred to the clamping frame, and after clamping, extract it from each workstation of the clamping frame and then move horizontally to the PCB board unloading device;

[0032] Each set of the extraction and clamping mechanism includes a plate moving drive motor, a linear slide assembly, an up and down lifting and plugging assembly and multiple sets of clamping assemblies, multiple sets of the clamping assemblies are evenly installed at the bottom end of the up and down lifting and plugging assembly, each set of the clamping assembly includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board, the up and down lifting and plugging assembly is installed on a beam that slides left and right on the linear slide assembly, and the plate moving drive motor drives the beam and the up and down lifting and plugging assembly through a gear belt to slide left and right along the slide rails on both sides of the linear slide assembly;

[0033] The up and down lifting and plugging assembly includes a lifting motor and a worm gear linear lifting frame. The lifting motor is installed on the crossbeam on the linear slide assembly. Multiple groups of clamping assemblies are evenly installed on the bottom end of the worm gear linear lifting frame. The lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives multiple groups of clamping assemblies through the lifting frame at the lower end to synchronously clamp the PCB board in each limit slot of the clamp frame and move it upward to extract it.

[0034] Preferably, the PCB board unloading device includes a unloading support frame, a PCB board positioning platform, a multi-joint unloading manipulator, an unloading slide board loading line and two board loading collection boxes. The PCB board positioning platform is installed on the top side of the support frame. A visual camera for obtaining PCB board position information is installed on the unloading support frame above the PCB board positioning platform. The multi-joint unloading manipulator is fixedly installed in the middle of the top side of the unloading support frame. The multi-joint unloading manipulator on the upper side corresponding to the unloading slide board loading line is installed in the middle of the unloading support frame and is used to receive the PCB board that is deflected 90° by the multi-joint unloading manipulator and is in a horizontal state. , the two carrier collection boxes are separately installed on the unloading support frames on both sides of the unloading slide carrier line, and the end of the multi-joint unloading manipulator is installed with a vacuum adsorption gripper frame for grabbing the carrier unloading and the PCB board transferred from the cache device by vacuum adsorption. The multi-joint unloading manipulator deflects the cleaned PCB boards one by one from a vertical state to a horizontal state through the vacuum adsorption gripper frame, sends them to the unloading slide carrier line and directly guides them out from the unloading production line. At the same time, the multi-joint unloading manipulator adsorbs and grabs the empty carriers supporting and carrying PCB boards on the splint frame through the vacuum adsorption gripper frame and places them in the carrier collection boxes on both sides respectively.

[0035] Preferably, the PCB board unloading device is further provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

[0036] Preferably, the PCB board loading device is further provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

[0037] The beneficial effects of the above technical solution are:

[0038] Compared with the existing PCB board processing process, manual work is required to load the incoming boards from the previous process at the plasma cleaning site, manually insert the boards on the racks during plasma cleaning, manually push the racks in during plasma cleaning, manually pull out the racks during plasma cleaning, manually unload the boards during plasma cleaning, manually transport them with a trolley, and manually place the boards during chemical copper deposition (PTH).

[0039] Dual-station plasma cleaning and etching machine

[0040] The present invention improves the processing technology and realizes automatic PCB processing equipment through a PCB board loading device, a carrier loading device, a board frame and PCB board automatic transfer device, a carrier unloading and buffering device, and a PCB board unloading device. Through the carrier loading and unloading stations, the carrier and board body transfer station, and the clamping frame exchange station, automatic board loading and unloading and cleaning conveyor lines are realized, and the plasma cleaning process is fully automated. PCB board processing can completely eliminate the desmear section of the plated through hole (PTH) line, simplifying the production process and flow, effectively reducing PCB board material transfer, and significantly reducing the equipment cost of traditional desmear and plated through hole (PTH) lines. Zero discharge of desmear wastewater and zero water consumption before chemical copper deposition are achieved, thereby reducing environmental pollution, effectively reducing production costs, and improving production efficiency.

[0041] The traditional PCB processing process of plasma cleaning, desmearing and plated through hole (PTH) is simplified into a plasma cleaning and plated through hole (PTH) process, achieving zero wastewater discharge and zero water consumption for desmearing before the plated through hole (PTH) process, eliminating the consumption of various chemicals and gases in the desmearing process, effectively reducing labor and production costs, and realizing automatic optimization and coordination of the production line.

Brief Description of the Drawings

[0042] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0043] Figure 2 It is a left-side perspective structural diagram of the present invention;

[0044] Figure 3 It is a right-side perspective structural diagram of the present invention;

[0045] Figure 4 This is a schematic diagram of the main three-dimensional structure of the present invention after removing the plasma cleaning equipment;

[0046] Figure 5 This is a side view of the three-dimensional structure of the present invention after removing the plasma cleaning equipment and part of the housing;

[0047] Figure 6 This is a schematic diagram of the main three-dimensional structure of the present invention after removing the plasma cleaning equipment and part of the shell;

[0048] Figure 7 This is a left-side perspective structural diagram of the present invention after removing the plasma cleaning equipment and part of the housing;

[0049] Figure 8 This is a schematic diagram of the explosion structure after removing the plasma cleaning equipment and part of the shell in the present invention;

[0050] Figure 9 This is a schematic diagram of a partially exploded structure of the plate frame and PCB board automatic transfer device of the present invention;

[0051] Figure 10 This is a schematic diagram of the three-dimensional enlarged structure of the PCB board feeding device of the present invention after removing the outer shell and part of the frame;

[0052] Figure 11 This is a schematic diagram of the enlarged structure of the carrier loading device of the present invention after removing the outer shell and part of the frame;

[0053] Figure 12 It is a three-dimensional enlarged structural diagram of the plate-frame transfer mechanism in the present invention;

[0054] Figure 13 It is a three-dimensional enlarged structural diagram of the plate-frame locking mechanism in the present invention;

[0055] Figure 14 This is a schematic diagram of the enlarged structure of the carrier blanking and caching device of the present invention after removing the outer shell and part of the frame;

[0056] Figure 15 It is a three-dimensional enlarged structural schematic diagram of the PCB board blanking device of the present invention with the outer shell removed. [Specific implementation method]

[0057] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0058] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0059] A Plasma automatic control line for PCB production, used for automated plasma cleaning of PCB boards, such as Figures 1 to 3As shown, it includes a loading production line 1, a PCB board loading device 2, a carrier loading device 3, a plate frame and PCB board automatic transfer device 4, a double-station plasma cleaning and etching machine 5, a carrier unloading and buffer device 6, a PCB board unloading device 7 and an unloading production line 8, wherein the loading production line 1 is used for automatic loading and conveying of PCB boards to be processed; the PCB board loading device 2 uses a manipulator to vertically transfer the PCB boards horizontally fed by the loading production line 1 to the next station one by one; the carrier loading device 3 vertically inserts multiple PCB boards fed by the PCB board loading device 2 into the clamping plate frame 32 of the empty carrier in sequence; the plate frame and PCB board automatic transfer device 4 transfers the carrier loaded with multiple PCB boards by the carrier loading device 3 into the Plasma station for plasma cleaning and transfers the cleaned PCB boards and carriers to the unloading station together, and transfers the double-station empty carrier after unloading to the The loading station of the carrier loading device 3; the double-station plasma cleaning and etching machine 5 automatically loads multiple PCB boards of the same batch transferred by the plate frame and PCB board automatic transfer device 4 to one cavity or two cavities for simultaneous cleaning and desmearing, and then automatically unloads; the carrier unloading and buffering device 6 adopts a double-station setting, which transfers the plate frame and PCB board automatic transfer device 4 to the clamping frame 32 after cleaning and desmearing, and pre-stores the PCB boards according to the processing progress, or vertically extracts the PCB boards on the clamping frame 32 and transfers them one by one to the unloading station; the PCB board unloading device 7 uses a robot to flip the PCB boards vertically fed by the carrier unloading and buffering device 6 by 90° one by one, and then transfer them to the next station in a horizontal state; the unloading production line 8 is used to horizontally receive the PCB boards that have been cleaned and transferred from the vertical to the horizontal direction by the PCB board unloading device 7, and automatically unload and output them.

[0060] Continue as Figures 1 to 3 As shown, the PCB board loading device 2 adopts a double-station feed port setting, and a hoisting and transverse movement mechanism 9 is further provided between the PCB board loading device 2 and the loading production line 1 for adaptively entering the PCB boards horizontally placed on the loading production line 1 from two different feed channels relative to the feeding direction and along the longitudinal direction after hoisting. The hoisting and transverse movement mechanism 9 is used to realize that the PCB boards on the loading production line 1 are respectively input from the two feed ports of the PCB board loading device 2, thereby effectively improving the loading efficiency.

[0061] like Figures 4 to 8 、 Figure 10As shown, the PCB feeding device 2 includes a feeding support frame 20, a PCB positioning table (not shown in the figure), a multi-joint PCB feeding manipulator 21, and two PCB carrier collecting boxes 22. The PCB positioning table is installed on the upper side of the feeding support frame 20. A visual camera 23 for obtaining PCB position information is installed on the feeding support frame 20 above the PCB positioning table. The multi-joint PCB feeding manipulator 21 is fixedly installed on the middle part of the feeding support frame 20. The two PCB carrier collecting boxes 22 are separately installed on the feeding support frame 20 on both sides of the multi-joint PCB feeding manipulator 21. A vacuum suction gripper frame for vacuum suction of each PCB to be processed transmitted from the feeding production line 1 is installed at the end of the multi-joint PCB feeding manipulator 21. The multi-joint PCB feeding manipulator 21 deflects the PCB to be processed to a vertical state one by one through the vacuum suction gripper frame and feeds it to the clamping station of the carrier feeding device 3. At the same time, the multi-joint PCB feeding manipulator 21 places the empty PCB carriers supporting the PCBs on the feeding production line 1 in the two PCB carrier collecting boxes 22 through the vacuum suction gripper frame. Moreover, a manual feeding port 24 for manual feeding of unqualified or defective products and PCBs to be processed is arranged on the PCB feeding device 2, realizing switching of multiple working modes and effectively improving production efficiency.

[0062] As shown in Figures 4 to 8 , Figure 11 The carrier feeding device 3 includes a mounting frame 30, two sets of parallel and double-station plug-in and pull-out clamping mechanisms 31, double-station parallel clamping plate frames 32 for plug-in of PCBs, and plate frame positioning seats 33. The plate frame positioning seats 33 are provided with a plurality of slide rails 330 for supporting the clamping plate frames 32 and forward and backward sliding guiding input or output, and locking assemblies 331 for positioning and locking the clamping plate frames 32. The two sets of plug-in and pull-out clamping mechanisms 31 are installed on the top side of the mounting frame and are fed to move horizontally after being used to clamp the PCBs in the vertical state transferred from the PCB feeding device 2 and moved backward to be respectively plugged into each station of the clamping plate frame 32.

[0063] As shown in Figure 11As shown, each set of plug-in and pull-out clamping mechanism 31 includes a plate moving drive motor 310, a linear slide assembly 311, an up-down lifting plug-in and pull-out assembly 312, and a plurality of sets of clamping assembly 313, which are evenly installed at the bottom end of the up-down lifting plug-in and pull-out assembly 312. Each set of clamping assembly 313 includes a clamping cylinder 3130 and a clamping hand 3131 driven to open and close by the clamping cylinder 3130 to clamp the end of the PCB board. The up-down lifting plug-in and pull-out assembly 312 is installed on the cross beam 314 which slides left and right on the linear slide assembly 311. The plate moving drive motor 310 drives the cross beam 314 and the up-down lifting plug-in and pull-out assembly 312 to slide left and right along the slide rails on both sides of the linear slide assembly 311 through a gear belt. The up-down lifting plug-in and pull-out assembly 312 includes a lifting motor 3120 and a worm gear linear lifting frame 3121. The lifting motor 3120 is installed on the cross beam 314 of the linear slide assembly 311. A plurality of sets of clamping assembly 313 are evenly installed at the bottom end of the worm gear linear lifting frame 3121. The lifting motor 3120 drives the worm gear linear lifting frame 3121 to rotate and drives the plurality of sets of clamping assembly 313 to synchronously clamp the PCB board and move down to be inserted into each limiting groove of the clamping frame 32.

[0064] As shown in Figures 4 to 8 , Figure 12 The plate frame and PCB board automatic transfer device 4 includes a linear guide rail mechanism 40 and a plate frame transfer mechanism 41. The plate frame transfer mechanism 41 is slidingly installed on the linear guide rail mechanism 40 and is positioned and stopped at the carrier loading and unloading station of the carrier loading device 3, the carrier loading and unloading station of each cavity of the double-station plasma cleaning and etching machine 5, and the carrier loading and unloading station of the PCB board unloading device 7, respectively. The linear guide rail mechanism 40 includes a rail frame 400, two first linear guide rails 401 arranged on the front and rear edges of the rail frame 400, and a rail rack 402 arranged in the middle of the rail frame 400. The rail rack 402 is parallel and spaced apart from the first linear guide rails 401. The plate frame transfer mechanism 41 includes a moving frame 410 and a first drive motor 411. The moving frame 410 is slidingly installed on the first linear guide rails 401. The first drive motor 411 is installed on the moving frame 410 and has a gear engaged with the rail rack 402 at the driving end. The first drive motor 411 drives the moving frame 410 to slide horizontally and linearly along the first linear guide rails 401. The moving frame 410 is further provided with a second linear guide rail 412 and a second motor 413. The second linear guide rail 412 is provided with a positioning frame 414. The positioning frame 4120 is provided with a butt joint linear slide rail 4140. The second motor 413 drives the positioning frame 414 to slide along the second linear guide rail 412 to drive the butt joint linear slide rail 4140 to butt joint with the loading station or the unloading station.

[0065] As shown in Figure 12As shown, a third linear guide rail 415 and a third motor 416 are also fixed to the alignment frame 414, and a plate frame locking mechanism 417 for locking the clamping plate frame 32 is provided on the third linear guide rail 415. The plate frame locking mechanism 417 driven by the third motor 416 through a ring gear belt slides forward along the third linear guide rail 415, approaches and locks the clamping plate frame 32 through the pneumatic gripper of the plate frame locking mechanism 417, and drags the clamping plate frame 32 along the docking linear slide rail 4140 to the alignment frame 414 through the reverse sliding of the third motor 416; conversely, the empty clamping plate frame 32 on the movable frame 410 is sent to the carrier loading device 3.

[0066] like Figure 13 As shown, the plate frame locking mechanism 417 includes a base 4170, on which a guide seat 4171 and a push-pull cylinder 4172 are provided, and the guide seat 4171 is provided with an F-shaped clip 4173 that can slide relatively, and the movable end of the push-pull cylinder 4172 is connected to a driving plate 4174 that moves linearly along the slide groove on the guide seat 4171, and the end of the F-shaped clip 4173 cooperates with the inclined driving slide groove 41740 on the driving plate 4174 through a pin shaft; the push-pull cylinder 4172 drives the F-shaped clip 4173 to slide back and forth through the driving plate 4174, and controls the F-shaped clip head at the front end of the F-shaped clip 4173 through the inclined driving slide groove 41740 to lock the splint frame 32 or release the lock of the splint frame 32.

[0067] like Figures 4 to 8 、 Figure 14 As shown, the carrier unloading and caching device 6 is similar in structure to the carrier loading device 3, except that one is used for unloading the clamping frame 32, and the other is used for loading and caching the clamping frame 32, that is, a station for caching the clamping frame 32 to be processed is added to the carrier unloading and caching device 6; the carrier unloading and caching device 6 includes a base frame 60, two sets of parallel and double-station extraction and opening mechanisms 61 and a plate frame loading seat for caching and directly loading the clamping frame 32 respectively 62, the board frame loading seat 62 is provided with a plurality of slide rails 63 for supporting the clamping frame 32 and sliding forward and backward to guide input or output, and a locking assembly 64 for positioning and locking the clamping frame 32; two sets of extraction and clamping mechanisms 61 are installed on the top side of the base frame 60 and are fed and moved horizontally to support the vertical state PCB board transferred to the clamping frame 32, and after clamping, they are extracted from each station of the clamping frame 32 and moved horizontally to the PCB board unloading device 7; each set of extraction and clamping mechanisms 61 and Figure 11The structure of the plug-in and clamping mechanism 31 used for loading materials is similar, so no excessive annotation is given here. Each set of extraction and clamping mechanisms 61 includes a plate moving drive motor, a linear slide assembly, an up and down lifting plug-in assembly 610 and multiple sets of clamping assemblies. The multiple sets of clamping assemblies are evenly installed at the bottom end of the up and down lifting plug-in assembly. Each set of clamping assemblies includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board. The up and down lifting plug-in assembly is installed on the horizontal beam that slides left and right on the linear slide assembly. The plate moving drive motor drives the horizontal beam and the up and down lifting plug-in assembly through the gear belt, and slides left and right along the slide rails on both sides of the linear slide assembly.

[0068] like Figure 14 As shown, each group of up and down lifting plug components 610 and Figure 11 The structure of the upper and lower lifting and plugging components 312 used for loading materials is similar, so no excessive annotation is given here; the upper and lower lifting and plugging components 610 include a lifting motor and a worm gear linear lifting frame, the lifting motor is installed on the beam on the linear slide assembly, and multiple sets of clamping components are evenly installed at the bottom end of the worm gear linear lifting frame. The lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives multiple sets of clamping components through the lifting frame at the lower end to synchronously clamp the PCB board in each limit slot of the clamping plate frame 32 and move it upward to extract it.

[0069] like Figures 4 to 8 、 Figure 15As shown, the PCB board unloading device 7 includes a unloading support frame 70, a PCB board positioning platform (not shown in the figure), a multi-joint unloading manipulator 71, an unloading slide board loading line 72 and two loading board collection boxes 73. The PCB board positioning platform is installed on the top side of the support frame. A visual camera (not shown in the figure) for obtaining PCB board position information is installed on the unloading support frame 70 above the PCB board positioning platform. The multi-joint unloading manipulator 71 is fixedly installed in the middle of the top side of the unloading support frame 70. The unloading slide board loading line 72 is installed in the middle of the top side of the unloading support frame 70 corresponding to the multi-joint unloading manipulator 71 on the upper side, and is used to receive the multi-joint unloading manipulator 71 deflected 90° to be horizontal The PCB boards in the unloading state, two carrier collection boxes 73 are installed on the unloading support frame 70 on both sides of the unloading slide carrier line 72, and the end of the multi-joint unloading manipulator 71 is installed with a vacuum adsorption gripper frame for vacuum adsorption of the grabbing carrier unloading and the caching device 6 to transfer the PCB boards. The multi-joint unloading manipulator 71 uses the vacuum adsorption gripper frame to deflect the cleaned PCB boards one by one from the vertical state to the horizontal state, send them to the unloading slide carrier line 72 and directly export them from the unloading production line 8. At the same time, the multi-joint unloading manipulator 71 uses the vacuum adsorption gripper frame to adsorb and grab the empty carriers supporting and carrying PCB boards on the splint frame 32 and place them in the carrier collection boxes 73 on both sides respectively. Moreover, the PCB board unloading device 7 is also provided with an artificial feeding port 74 for manually loading unqualified or defective PCB boards and PCB boards to be processed. The lower side of the carrier collection box 22 corresponding to the artificial feeding port 74 is provided with a return slide carrier line 75 for inputting unqualified or defective PCB boards and PCB boards to be processed.

[0070] In this embodiment, the plasma cleaning and etching equipment uses two working chambers, which can effectively ensure the simultaneous processing of multiple PCB boards in the same batch, prevent material mixing, and improve material transfer efficiency; in addition, the board frame and PCB board automatic transfer device effectively cooperates with the carrier loading device, carrier unloading and buffering device to effectively control the loading and unloading and transfer of the clamping frame, effectively ensuring the smooth transfer of the PCB boards; fully automated plasma cleaning of PCB boards can completely eliminate the desmear section of the plated through hole (PTH) line, simplify the production process and flow, effectively reduce the material transfer of PCB boards, and significantly reduce the equipment cost of traditional desmear and plated through hole (PTH) lines, achieving zero discharge of desmear wastewater and zero water consumption before chemical copper deposition, reducing environmental pollution, effectively reducing production costs and improving production efficiency.

[0071] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Any equivalent changes made based on the shape, structure and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A Plasma automatic control line for PCB production, used for automated plasma cleaning of PCB boards, characterized in that: include: Loading production line, used for automatic loading and conveying of PCB boards to be processed; PCB board loading device, which uses a robot to vertically transfer the PCB boards fed horizontally from the loading production line to the next station one by one; A carrier loading device is used to vertically insert the multiple PCB boards supplied by the PCB board loading device into the clamping plate frame of the empty carrier in sequence; An automatic transfer device for board frames and PCBs, which transfers the carrier loaded with multiple PCBs from the carrier loading device to the plasma station for plasma cleaning and transfers the cleaned PCBs and carriers to the unloading station, and transfers the empty carriers in the double stations after unloading to the loading station of the carrier loading device; A double-station plasma cleaning and etching machine automatically loads multiple PCB boards of the same batch transferred by the plate frame and the PCB board automatic transfer device into one or two cavities for simultaneous cleaning and desmearing, and then automatically unloads the boards; The carrier unloading and buffering device adopts a dual-station setting, which transfers the board frame and PCB board automatic transfer device to the clamping frame after cleaning and desmearing. The PCB boards are pre-stored according to the processing progress, or the PCB boards on the clamping frame are vertically extracted and transferred one by one to the unloading station; The PCB board unloading device uses a robot to turn the PCB boards unloaded by the carrier and vertically fed by the buffer device 90 degrees one by one and transfer them to the next workstation in a horizontal state; The blanking production line is used to horizontally receive the cleaned PCB boards that are transferred from the vertical direction to the horizontal direction by the PCB board blanking device, and automatically unload and output them.

2. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The PCB board loading device adopts a double-station feed port setting. A hoisting and transverse movement mechanism is also provided between the PCB board loading device and the loading production line, which is used to feed the PCB boards horizontally placed on the loading production line relative to the feeding direction and adaptively enter from two different feed channels in the longitudinal direction after hoisting.

3. The Plasma automatic control line for PCB production according to claim 2, characterized in that: The PCB board loading device includes a loading support frame, a PCB board positioning platform, a multi-joint loading robot and two carrier board collection boxes, the PCB board positioning platform is installed on the upper side of the loading support frame, and a visual camera for obtaining PCB board position information is installed on the loading support frame above the PCB board positioning platform, the multi-joint loading robot is fixedly installed in the middle of the loading support frame, and the two carrier board collection boxes are separately installed on the loading support frame on both sides of the multi-joint loading robot, and the end of the multi-joint loading robot is installed with a vacuum adsorption gripper frame for vacuum adsorption to grab each PCB board to be processed transmitted from the loading production line, the multi-joint loading robot deflects the PCB boards to be processed one by one to a vertical state through the vacuum adsorption gripper frame and sends them to the clamping station of the carrier loading device, while the multi-joint loading robot adsorbs and grabs the empty carrier boards supporting and carrying PCB boards on the loading production line through the vacuum adsorption gripper frame and places them in the carrier board collection boxes on both sides respectively.

4. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The carrier loading device includes a mounting frame, two sets of parallel and double-station plug-in and clamping mechanisms, a double-station parallel clamping frame for inserting PCB boards and a board frame positioning seat, the board frame positioning seat is provided with a plurality of slide rails for supporting the clamping frame and sliding forward and backward to guide input or output, and a locking assembly for locking the clamping frame in position; The two sets of plug-in and clamping mechanisms are installed on the top side of the installation frame and are used to clamp the vertical PCB board transferred to the PCB board feeding device after feeding and then move backward and respectively inserted into each station of the clamping frame; Each group of the plugging and unclamping mechanisms includes a plate moving drive motor, a linear slide assembly, an up and down lifting plugging assembly and multiple groups of clamping assemblies, multiple groups of the clamping assemblies are evenly installed at the bottom end of the up and down lifting plugging assembly, each group of the clamping assembly includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board, the up and down lifting plugging assembly is installed on a beam that slides left and right on the linear slide assembly, and the plate moving drive motor drives the beam and the up and down lifting plugging assembly through a gear belt to slide left and right along the slide rails on both sides of the linear slide assembly; The up and down lifting and plugging assembly includes a lifting motor and a worm gear linear lifting frame. The lifting motor is installed on the crossbeam on the linear slide assembly. Multiple groups of clamping assemblies are evenly installed on the bottom end of the worm gear linear lifting frame. The lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives the PCB boards clamped by the multiple groups of clamping assemblies to move downward synchronously through the lifting frame at the lower end and be inserted into each limit slot of the clamping frame.

5. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The plate frame and PCB board automatic transfer device includes a linear guide mechanism and a plate frame transfer mechanism, and the plate frame transfer mechanism is slidably mounted on the linear guide mechanism and positioned and stopped at the carrier loading and unloading station of the carrier loading device, the carrier loading and unloading station of each cavity on the double-station plasma cleaning and etching machine, and the carrier loading and unloading station of the PCB board unloading device; The linear guide mechanism includes a track frame, two first linear guide rails disposed on the front and rear edges of the track frame, and a track rack located in the middle of the track frame, wherein the track rack is parallel to the first linear guide rails and spaced apart from each other; The plate frame transfer mechanism includes a moving frame and a first drive motor, wherein the moving frame is slidably mounted on the first linear guide rail, the first drive motor is mounted on the moving frame, and a gear meshing with the track rack is provided at the driving end of the first drive motor, and the first drive motor drives the moving frame to slide laterally and linearly along the first linear guide rail; The movable frame is further provided with a second linear guide and a second motor, the second linear guide is provided with a positioning frame, the positioning frame is provided with a docking linear slide, and the second motor drives the positioning frame to slide along the second linear guide to drive the docking linear slide to dock with the loading station or the unloading station; The alignment frame is also fixedly connected to a third linear guide rail and a third motor, and the third linear guide rail is provided with a plate frame locking mechanism for locking the clamping frame, and the plate frame locking mechanism driven by the third motor through an annular gear belt slides forward along the third linear guide rail, approaches and locks the clamping frame through the pneumatic gripper of the plate frame locking mechanism, and drags the clamping frame along the docking linear slide rail to the alignment frame through the reverse sliding of the third motor; conversely, the empty clamping frame on the movable frame is sent to the carrier loading device.

6. The Plasma automatic control line for PCB production according to claim 5, characterized in that: The plate frame locking mechanism includes a base, a guide seat and a push-pull cylinder are provided on the base, an F-shaped clip that can slide relatively is provided on the guide seat, the movable end of the push-pull cylinder is connected to a driving plate that moves laterally along a linear groove, and the end of the F-shaped clip cooperates with the oblique driving groove on the driving plate through a pin shaft; the push-pull cylinder drives the F-shaped clip to slide back and forth through the driving plate, and controls the F-shaped clip head at the front end of the F-shaped clip through the oblique driving groove to lock the splint frame or release the lock of the splint frame.

7. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The carrier unloading and caching device includes a base frame, two sets of parallel and double-station extraction and clamping mechanisms, and a plate frame loading seat for caching the plate frame and directly loading the plate frame respectively. The plate frame loading seat is provided with a plurality of slide rails for supporting the plate frame and sliding forward and backward to guide input or output, and a locking assembly for positioning and locking the plate frame; The two sets of extraction and clamping mechanisms are installed on the top side of the base frame and are fed and moved horizontally to support and clamp the vertical PCB board transferred to the clamping frame, and after clamping, extract it from each workstation of the clamping frame and then move horizontally to the PCB board unloading device; Each set of the extraction and clamping mechanism includes a plate moving drive motor, a linear slide assembly, an up and down lifting and plugging assembly and multiple sets of clamping assemblies, multiple sets of the clamping assemblies are evenly installed at the bottom end of the up and down lifting and plugging assembly, each set of the clamping assembly includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board, the up and down lifting and plugging assembly is installed on a beam that slides left and right on the linear slide assembly, and the plate moving drive motor drives the beam and the up and down lifting and plugging assembly through a gear belt to slide left and right along the slide rails on both sides of the linear slide assembly; The up and down lifting and plugging assembly includes a lifting motor and a worm gear linear lifting frame. The lifting motor is installed on the crossbeam on the linear slide assembly. Multiple groups of clamping assemblies are evenly installed on the bottom end of the worm gear linear lifting frame. The lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives multiple groups of clamping assemblies through the lifting frame at the lower end to synchronously clamp the PCB board in each limit slot of the clamp frame and move it upward to extract it.

8. The Plasma automatic control line for PCB production according to claim 7, characterized in that: The PCB board unloading device includes a unloading support frame, a PCB board positioning platform, a multi-joint unloading manipulator, an unloading slide board loading line and two loading board collection boxes. The PCB board positioning platform is installed on the top side of the support frame. A visual camera for obtaining PCB board position information is installed on the unloading support frame above the PCB board positioning platform. The multi-joint unloading manipulator is fixedly installed in the middle of the top side of the unloading support frame. The multi-joint unloading manipulator on the upper side corresponding to the unloading slide board loading line is installed in the middle of the unloading support frame and is used to receive the PCB board that is deflected 90° by the multi-joint unloading manipulator in a horizontal state. The carrier collection boxes are separately installed on the unloading support frames on both sides of the unloading slide carrier line. The end of the multi-joint unloading manipulator is installed with a vacuum adsorption gripper frame for vacuum adsorption to grab the carrier unloading and the PCB board transferred from the cache device. The multi-joint unloading manipulator deflects the cleaned PCB boards one by one from a vertical state to a horizontal state through the vacuum adsorption gripper frame, sends them to the unloading slide carrier line and directly guides them out from the unloading production line. At the same time, the multi-joint unloading manipulator adsorbs and grabs the empty carriers supporting and carrying PCB boards on the splint frame through the vacuum adsorption gripper frame and places them in the carrier collection boxes on both sides respectively.

9. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The PCB board unloading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

10. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The PCB board loading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

Images