A PECVD coating process and coating system

By designing fixed units and air pressure adsorption technology on the PECVD coating system, the problem of incomplete coating is solved, and the full area coating of circular wafers is realized, which reduces the process and avoids waste of raw materials.

CN118895495BActive Publication Date: 2025-03-21CHUZHOU AIWOFU PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202411154828.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-03-21
Estimated Expiration
2044-08-22

AI Technical Summary

Technical Problem

When the existing PECVD coating system coats the circular wafer, the actual coating area is smaller than the wafer area, resulting in incomplete coating. Additional processes are required for polishing and polishing to remove the uncoated edge parts, wasting raw materials.

Method used

A PECVD coating system is designed, and a fixed unit is provided on the carrier plate. Each fixed unit fixes two wafers. Through the cooperation of the cam and the baffle, the wafer does not fall off during the coating process. It avoids blockage by adsorbing and rotating the cam and baffle, and realizes full-area coating.

Benefits of technology

The full area coating of the circular wafer surface is realized, reducing the process and avoiding waste of raw materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a PECVD coating process and coating system, which relates to the coating technology field, and specifically includes a coating chamber, wherein a plurality of electrode plates parallel to each other are fixedly installed on the top surface of the coating chamber, an air inlet is arranged on the top surface of the coating chamber, and an air outlet is arranged on the bottom surface of the coating chamber; it also includes a translation seat, wherein a plurality of carrier plates parallel to each other are fixedly installed on the translation seat; a plurality of fixing units are arranged on the carrier plate, and each fixing unit fixes two wafers; the fixing unit includes three rotating shafts that are rotatably matched with the carrier plate, and cams are fixedly sleeved at both ends of the rotating shaft, and baffles are fixedly installed on the end surface of the side of the cam away from the carrier plate; grooves are provided on the side wall of the carrier plate corresponding to the position of each fixing unit, and a piston plate is horizontally slidably installed in the groove. In the present invention, after the electrode plate is energized, the surface of the wafer can be coated everywhere, and after the coating is completed, there is no need to grind and polish the edge of the wafer, which saves the process and avoids the waste of raw materials.
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Description

Technical Field

[0001] The present invention relates to the field of film coating technology, in particular to a PECVD film coating process and a film coating system. Background Art

[0002] The PECVD coating process is a process that uses plasma energy to form solid deposits by chemical reactions in gaseous or vaporous chemical substances in the gas phase or gas-solid interface in a reactor. The PECVD system used in the manufacture of photovoltaic crystalline silicon products is divided into direct method and indirect method according to different coating methods. Some research on PECVD coating systems has been done in the prior art.

[0003] For example, a PECVD device disclosed in a Chinese invention patent with a publication number of CN103866282B includes a chamber, a wafer holder, a plurality of radio frequency electrodes, a transmission device and a lifting device. The chamber is provided with an air inlet and an air outlet, and the chamber is provided with a first transmission port and a second transmission port; the wafer holder includes a plurality of carrier plates arranged at intervals in the front-to-back direction and placed vertically, and the wafer holder is movable between an upper position and a lower position in the reaction chamber along the vertical direction; a plurality of radio frequency electrodes are arranged at the top of the reaction chamber and placed perpendicular to the top surface, and the plurality of radio frequency electrodes are arranged at intervals in the front-to-back direction, and when the wafer holder is located in the upper position of the reaction chamber, the plurality of radio frequency electrodes are respectively inserted into the adjacent carrier plates.

[0004] Another example is a PECVD coating device disclosed in a Chinese invention patent with a publication number of CN103695870B. The PECVD coating device includes: a pretreatment chamber for performing surface pretreatment on a substrate; a coating chamber located downstream of the pretreatment chamber for coating the substrate pretreated by the pretreatment chamber; and a receiving chamber located downstream of the coating chamber for collecting the substrate coated by the coating chamber; the pretreatment chamber, the coating chamber and the receiving chamber are connected in a vacuum-tight manner.

[0005] In the PECVD system in the prior art including the above-mentioned patent, in order to prevent the wafer from falling off during the coating process, the fixing parts on the carrier used to fix the wafer will have a certain extension, and the extended part will form a blockage on the edge of the wafer. In this way, the coated area can only avoid the blocking part of the fixing part, that is, the actual coated area is smaller than the area of ​​the wafer; in fact, when coating a circular wafer, the actual coated area diameter will be smaller than the diameter of the wafer. After the coating is completed, the edge of the wafer is ground and polished to remove the uncoated part of the edge of the wafer; such operation not only increases the process, but also wastes part of the wafer raw materials. Based on this, how to achieve full coating of the surface of a circular wafer while ensuring that the wafer does not fall off is a problem that technicians in this field need to solve. Summary of the invention

[0006] The object of the present invention is to provide a PECVD coating process and a coating system to solve the above-mentioned deficiencies in the prior art.

[0007] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a PECVD coating system, comprising a coating chamber, a plurality of electrode plates parallel to each other are fixedly installed on the inner top surface of the coating chamber, an air inlet is arranged on the top surface of the coating chamber, and an air outlet is arranged on the bottom surface of the coating chamber; it also comprises a translation seat, a plurality of carrier plates parallel to each other are fixedly installed on the translation seat; a plurality of fixing units are arranged on the carrier plate, and each fixing unit fixes two wafers; the fixing unit comprises three rotating shafts which are rotatably matched with the carrier plate, cams are fixedly sleeved at both ends of the rotating shafts, and baffles are fixedly installed on the end surface of the cam away from the carrier plate; grooves are opened on the side wall of the carrier plate corresponding to the position of each fixing unit, and a piston plate is horizontally slidably installed in the groove.

[0008] As a preferred technical solution of the present invention, the rotating shaft is fixedly sleeved with a first gear located inside the carrier plate, and the fixing unit also includes an arc-shaped rack movably installed inside the carrier plate and meshing with the three first gears.

[0009] As a preferred technical solution of the present invention, a lifting rod extending into the interior of the carrier plate is vertically slidably installed on the top of the carrier plate, a lifting plate is fixedly installed on the bottom end of the lifting rod, and a spring is connected between the lifting plate and the carrier plate; a wing plate extending into the interior of the carrier plate is fixedly installed on the piston plate, and a round pin is rotatably installed on the wing plate; a guide groove cooperating with the round pin is opened on the lifting plate.

[0010] As a preferred technical solution of the present invention, the guide groove includes a vertical upper part and an inclined lower part; there are two wing plates on each piston plate, and the round pin passes through the guide groove and the two ends of the round pin are respectively rotatably matched with the two corresponding wing plates.

[0011] As a preferred technical solution of the present invention, a horizontal support arm is fixedly installed on the lifting plate, and a roller located below the support arm is rotatably installed at one end of the arc-shaped rack corresponding to the position of the support arm; an elastic rope is connected between one end of the arc-shaped rack and the carrier plate.

[0012] As a preferred technical solution of the present invention, a horizontal connecting rod is commonly installed at the top of each lifting rod on the carrier plate.

[0013] As a preferred technical solution of the present invention, the coating chamber is a structure with an opening on one side, and a guide rail is fixedly installed on the coating chamber, a part of the guide rail is located inside the coating chamber, and the other part of the guide rail extends from the opening of the coating chamber to the outside of the coating chamber, the translation seat slides with the guide rail, and a positioning block for positioning the translation seat is fixedly installed at one end of the guide rail; a sealing door is vertically slidably installed at the opening of the coating chamber.

[0014] As a preferred technical solution of the present invention, a lifting unit for lifting the translation seat is arranged in the coating chamber, and the lifting unit includes a base fixedly connected to the translation seat, and a lifting plate vertically slidingly cooperated with the base; a first spur rack is vertically fixedly installed on the bottom of the lifting plate, and a second spur rack is vertically fixedly installed on the inner wall of the base; a first horizontal axis is rotatably installed on the base, a first connecting rod is fixedly installed on the first horizontal axis, a lifting block is vertically slidably installed in the base, a second gear meshing with the first spur rack and the second spur rack is rotatably installed on the lifting block, and a second connecting rod hinged to the first connecting rod is also rotatably installed on the lifting block.

[0015] As a preferred technical solution of the present invention, a second horizontal shaft is rotatably installed in the coating chamber, one end of the first horizontal shaft extends to the outside of the base and is fixedly installed with a first bevel gear; a second bevel gear meshing with the first bevel gear is fixedly installed on the second horizontal shaft; and a motor for driving the second horizontal shaft to rotate is fixedly installed outside the coating chamber.

[0016] The present invention also provides a PECVD coating process, which is completed by using the above-mentioned PECVD coating system.

[0017] In the above technical scheme, the present invention provides a PECVD coating system, on which a fixing unit is arranged on a carrier, each fixing unit fixes two wafers, and before the carrier enters the coating chamber, the operator inserts a plurality of wafers into the corresponding fixing units, at which time the cam and the baffle fix the wafers so that the wafers and the carrier fit each other and remain stationary; when the carrier enters the coating chamber and rises, the wafers will be adsorbed on the carrier under the action of air pressure, and still remain stationary relative to the carrier, and the cam and the baffle will rotate a certain angle, so as not to block the wafers; in this way, after the electrode plate is energized, the surface of the wafer can be coated everywhere, and after the coating is completed, there is no need to grind and polish the edge of the wafer, which saves the process and avoids the waste of raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0019] Figure 1 is a first stereoscopic schematic diagram of a PECVD coating system in an embodiment;

[0020] Figure 2 for Figure 1 The enlarged schematic diagram of point A in the middle;

[0021] Figure 3 for Figure 1 The enlarged schematic diagram of point B in the middle;

[0022] Figure 4 is a second stereoscopic schematic diagram of a PECVD coating system in an embodiment;

[0023] Figure 5 is a schematic diagram of a first structure inside the carrier board in the embodiment;

[0024] Figure 6 is a schematic diagram of a second structure inside the carrier board in the embodiment;

[0025] Figure 7 It is a partial structural schematic diagram of the lifting unit in the embodiment.

[0026] Description of reference numerals:

[0027] 1. Coating chamber; 101. Air inlet; 102. Air outlet; 2. Electrode plate; 3. Translation seat; 4. Carrier plate; 401. Groove; 5. Rotating shaft; 6. Cam; 7. Block; 8. Piston plate; 9. First gear; 10. Arc rack; 11. Lifting rod; 12. Lifting plate; 1201. Guide groove; 13. Spring; 14. Wing plate; 15. Round pin; 16. Support arm; 17. Roller; 18. Elastic rope; 19. Connecting rod; 20. Guide rail; 21. Positioning block; 22. Sealing door; 23. Base; 24. Lifting plate; 25. First straight rack; 26. Second straight rack; 27. First horizontal axis; 28. First connecting rod; 29. ​​Lifting block; 30. Second gear; 31. Second connecting rod; 32. Second horizontal axis; 33. First bevel gear; 34. Second bevel gear; 35. Motor. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0029] like Figure 1 and Figure 4 As shown, this embodiment provides a PECVD coating system, including a coating chamber 1, wherein a plurality of vertical electrode plates 2 are fixedly mounted on the inner top surface of the coating chamber 1, and each electrode plate 2 is parallel to each other; an air inlet 101 is arranged on the top surface of the coating chamber 1, and an air outlet 102 is arranged on the bottom surface of the coating chamber 1; the process gas enters the coating chamber 1 from the air inlet 101, and leaves the coating chamber 1 from the air outlet 102; during specific operation, the wafer to be coated is located between adjacent electrode plates 2, and the electrode plates 2 are energized to excite the process gas in the coating chamber 1 into plasma, thereby coating the surface of the wafer.

[0030] like Figure 1 and Figure 4As shown, the PECVD coating system also includes a translation seat 3, on which a number of mutually parallel carrier plates 4 are fixedly installed, the carrier plates 4 are in a vertical state and parallel to the electrode plates 2, and the positions of the carrier plates 4 and two adjacent electrode plates 2 correspond; the coating chamber 1 is a structure with an opening on one side, and a guide rail 20 is fixedly installed on the coating chamber 1, a part of the guide rail 20 is located inside the coating chamber 1, and the other part of the guide rail 20 extends from the opening of the coating chamber 1 to the outside of the coating chamber 1, the translation seat 3 is slidably matched with the guide rail 20, and a positioning block 21 for positioning the translation seat 3 is fixedly installed at one end of the guide rail 20 located in the coating chamber 1; a sealing door 22 is vertically slidably installed at the opening of the coating chamber 1, and a window made of transparent material is opened on the sealing door 22 for observing the situation inside the coating chamber 1.

[0031] Specifically, in the initial state, the translation seat 3 is located on the guide rail 20 at a position outside the coating chamber 1. The operator places the wafers to be coated on the carrier 4 in turn. Then, the operator pushes the translation seat 3 to the inside of the coating chamber 1 until the translation seat 3 is in contact with the positioning block 21, and then closes the sealing door 22, so that the coating chamber 1 is connected to the outside only through the air inlet 101 and the air outlet 102. In this way, after the process gas enters the coating chamber 1 through the air inlet 101, it can only leave from the air outlet 102.

[0032] like Figure 2 and Figure 5 As shown, the carrier plate 4 is provided with a plurality of fixing units, each fixing unit fixes two wafers; the fixing unit comprises three rotating shafts 5 which are rotatably matched with the carrier plate 4, the rotating shafts 5 are perpendicular to the carrier plate 4 and the rotating shafts 5 are parallel to each other, two of the three rotating shafts 5 are in the same horizontal position, the other is in a lower position, and the connecting line of the three rotating shafts 5 forms a right-angled isosceles triangle; cams 6 are fixedly sleeved at both ends of the rotating shafts 5, and a baffle 7 is fixedly installed on the end surface of the cam 6 on the side away from the carrier plate 4; in the initial state, the operator inserts the wafer between the three cams 6 on the same side, and the three cams 6 support the edge of the wafer, and the surface of one side of the wafer is in contact with the carrier plate 4, and the surface of the other side of the wafer is in contact with the baffle 7, that is, the baffle 7 plays a limiting role on the wafer, so that the wafer is always in contact with the carrier plate 4; a circular groove 401 is opened on the side wall of the carrier plate 4 corresponding to the position of each fixing unit, and a piston plate 8 is horizontally slidably installed in the groove 401.

[0033] Specifically, after the operator pushes the translation seat 3 into the coating chamber 1, the piston plate 8 first slides along the groove 401, so that a lower air pressure is generated in the groove 401, so that the wafer is adsorbed on the carrier 4 under the action of the air pressure, and then the three shafts 5 rotate simultaneously, driving the three cams 6 and the baffle 7 to rotate simultaneously until the cam 6 and the baffle 7 are separated from the wafer, so that the wafer is completely kept relatively still with the carrier 4 by the action of the air pressure, and the cam 6 and the baffle 7 will not block the wafer; after the electrode plate 2 is energized to excite the process gas in the coating chamber 1 into plasma, all surfaces of the wafer that are not in contact with the carrier 4 can be coated; after the coating is completed, the shaft 5, the cam 6 and the baffle 7 are first synchronously reversed to the initial position to support and fix the wafer, and then the piston plate 8 slides in the opposite direction along the groove 401 to the initial position, and the wafer is no longer subjected to the action of the air pressure; after the operator opens the sealing door 22, the translation seat 3 can be pulled out of the coating chamber 1 along the guide rail 20, and then the coated wafers on the carrier 4 are taken out one by one.

[0034] like Figure 1 and Figure 6 As shown, the rotating shaft 5 is fixedly sleeved with a first gear 9 located inside the carrier plate 4, and the fixing unit also includes an arc-shaped rack 10 movably installed inside the carrier plate 4 and meshing with the three first gears 9; a lifting rod 11 extending to the inside of the carrier plate 4 is vertically slidably installed on the top of the carrier plate 4, and a lifting plate 12 is fixedly installed at the bottom of the lifting rod 11, and a spring 13 is connected between the lifting plate 12 and the carrier plate 4; a wing plate 14 extending to the inside of the carrier plate 4 is fixedly installed on the piston plate 8, and a round pin 15 is rotatably installed on the wing plate 14; a guide groove cooperating with the round pin 15 is opened on the lifting plate 12 1201; the guide groove 1201 includes a vertical upper part and an inclined lower part; there are two wing plates 14 on each piston plate 8, a round pin 15 passes through the guide groove 1201 and the two ends of the round pin 15 are respectively rotatably matched with the two corresponding wing plates 14; a horizontal connecting rod 19 is commonly installed on the top of the lifting rod 11; a horizontal support arm 16 is fixedly installed on the lifting plate 12, and a roller 17 located below the support arm 16 is rotatably installed at one end of the arc-shaped rack 10 corresponding to the position of the support arm 16; an elastic rope 18 is connected between one end of the arc-shaped rack 10 and the carrier plate 4.

[0035] Specifically, the operator pushes the translation seat 3 into the coating chamber 1 until the translation seat 3 fits with the positioning block 21, and then closes the sealing door 22; at this time, the state is as follows: Figure 6As shown, the translation seat 3 then drives the carrier plate 4, the fixing unit, the connecting rod 19 and the wafer to rise synchronously under the action of external force until the wafer reaches a predetermined height, that is, a height corresponding to the horizontal position of the wafer and the electrode plate 2; during this process, the connecting rod 19 first fits against the inner top surface of the coating chamber 1, and as the translation seat 3 continues to rise under the action of external force, the carrier plate 4 and the wafer continue to rise synchronously, and the lifting rod 11 and the lifting plate 12 fall relative to the carrier plate 4; the piston plate 8, the wing plate 14 and the round pin 15 rise relative to the lifting plate 12, and the round pin 15 first moves along the inclined lower half of the guide groove 1201. During the movement, the wing plate 14, the round pin 15 and the piston plate 8 move horizontally relative to the carrier plate 4, so that the air pressure in the groove 401 is reduced, that is, the wafer is adsorbed; during this process, the support arm 16 gradually approaches the roller 17; when the round pin 15 moves to the vertical upper half of the guide groove 1201, the support arm 16 fits against the roller 17 The wafer 1201 is moved along the guide groove 1201, and the wing plate 14, the round pin 15 and the piston plate 8 no longer move horizontally relative to the carrier plate 4, and the wafer remains adsorbed on the carrier plate 4; the support arm 16 begins to press the roller 17 downward, and the roller 17 overcomes the action of the elastic rope 18 under the action of the support arm 16 to push the arc rack 10 to move, and the arc rack 10 drives the first gear 9 meshing with it to rotate, so that each shaft 5, cam 6 and baffle 7 rotate synchronously; it should be noted that, in the process of the support arm 16 pressing the roller 17 downward, the roller 17 rolls along the lower surface of the support arm 16, and the elastic rope 18 is stretched and stores energy. After the support arm 16 is reset, the resilience of the elastic rope 18 will drive the arc rack 10 to reset, so that each shaft 5, cam 6 and baffle 7 rotate in the opposite direction and reset synchronously.

[0036] To sum up, in this embodiment, when the translation seat 3 is lifted by external force, the chip is first automatically adsorbed on the carrier 4, and then the cam 6 and the baffle 7 automatically rotate to avoid blocking the chip and ensure that all surfaces of the chip that are not in contact with the carrier 4 can be coated.

[0037] In order to allow the translation seat 3 entering the predetermined position of the coating chamber 1 to rise and fall stably, a commonly used technical means is to install an electric telescopic rod at the position corresponding to the translation seat 3 in the coating chamber 1. When the electric telescopic rod is extended, it pushes the translation seat 3 to rise, and when the electric telescopic rod is retracted, the translation seat 3 falls. However, in addition to its telescopic section, the electric telescopic rod also has a sleeve section, and its overall length is relatively long. If it is installed vertically in the coating chamber 1, it will occupy a large space. The height of the coating chamber 1 also needs to be designed to be relatively high. The process gas required to fill the coating chamber 1 is also relatively large, which will undoubtedly cause a waste of process gas. Based on this, the present embodiment also designs the following structure to save the longitudinal space in the coating chamber 1.

[0038] like Figure 1 , Figure 3 and Figure 7 As shown, the coating chamber 1 is provided with a lifting unit for lifting the translation seat 3, and the lifting unit includes a base 23 fixedly connected to the translation seat 3, and a lifting plate 24 vertically slidingly matched with the base 23; a first straight rack 25 is vertically fixedly installed at the bottom of the lifting plate 24, and a second straight rack 26 is vertically fixedly installed on the inner wall of the base 23; a first horizontal shaft 27 is rotatably installed on the base 23, a first connecting rod 28 is fixedly installed on the first horizontal shaft 27, and a lifting block 29 is vertically slidably installed in the base 23, and the lifting block 29 A second gear 30 meshing with the first spur rack 25 and the second spur rack 26 is rotatably mounted on the upper portion, and a second connecting rod 31 hinged to the first connecting rod 28 is rotatably mounted on the lifting block 29; a second horizontal shaft 32 is rotatably mounted in the coating chamber 1, one end of the first horizontal shaft 27 extends to the outside of the base 23 and is fixedly mounted with a first bevel gear 33; a second bevel gear 34 meshing with the first bevel gear 33 is fixedly mounted on the second horizontal shaft 32; a motor 35 for driving the second horizontal shaft 32 to rotate is fixedly mounted outside the coating chamber 1.

[0039] Specifically, the operator pushes the translation seat 3 into the coating chamber 1 until the translation seat 3 is in contact with the positioning block 21, and then closes the sealing door 22; at this time, the top surface of the lifting plate 24 is located within 1 cm below the translation seat 3, and then the motor 35 is started, driving the second horizontal axis 32 and the second bevel gear 34 to rotate a certain angle (90° in this embodiment), and the second bevel gear 34 drives the first bevel gear 33 meshing therewith to rotate a certain angle, and the first horizontal axis 27 and the first connecting rod 28 also rotate synchronously. When the first connecting rod 28 rotates, it drives the second connecting rod 31 to rise, and the second connecting rod 31 pushes the lifting block 29 and the second gear 30 to rise. During the rising process, the second gear 30 maintains an engagement state with the second spur rack 26 and rolls clockwise, and the first spur rack 25 drives the lifting plate 24 to rise under the action of the second gear 30, and the lifting plate 24 pushes the translation seat 3 to rise. It should be noted that in this embodiment, the rising height of the first straight rack 25 and the lifting plate 24 is greater than the rising height of the lifting block 29. Compared with the traditional lifting mechanism, it saves longitudinal space, reduces the demand for process gas, and avoids gas waste.

[0040] This embodiment also provides a PECVD coating process, which is completed using the above-mentioned PECVD coating system.

[0041] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A PECVD coating system, comprising a coating chamber (1), wherein a plurality of electrode plates (2) parallel to each other are fixedly mounted on the top surface of the coating chamber (1), an air inlet (101) is arranged on the top surface of the coating chamber (1), and an air outlet (102) is arranged on the bottom surface of the coating chamber (1); and further comprising a translation seat (3), wherein a plurality of carrier plates (4) parallel to each other are fixedly mounted on the translation seat (3), characterized in that: The carrier plate (4) is provided with a plurality of fixing units, each fixing unit fixing two wafers; the fixing units include three rotating shafts (5) rotatably matched with the carrier plate (4), cams (6) are fixedly sleeved at both ends of the rotating shafts (5), and a baffle (7) is fixedly installed on the end surface of the cam (6) away from the carrier plate (4); a groove (401) is opened on the side wall of the carrier plate (4) at a position corresponding to each fixing unit, and a piston plate (8) is horizontally slidably installed in the groove (401); The rotating shaft (5) is fixedly sleeved with a first gear (9) located inside the carrier plate (4), and the fixing unit also includes an arc-shaped rack (10) movably installed inside the carrier plate (4) and meshing with the three first gears (9); A lifting rod (11) extending into the interior of the carrier plate (4) is vertically slidably mounted on the top of the carrier plate (4); a lifting plate (12) is fixedly mounted on the bottom of the lifting rod (11); a spring (13) is connected between the lifting plate (12) and the carrier plate (4); a wing plate (14) extending into the interior of the carrier plate (4) is fixedly mounted on the piston plate (8); a round pin (15) is rotatably mounted on the wing plate (14); a guide groove (1201) cooperating with the round pin (15) is provided on the lifting plate (12); The guide groove (1201) includes a vertical upper part and an inclined lower part; the number of wing plates (14) on each piston plate (8) is two, the round pin (15) passes through the guide groove (1201) and the two ends of the round pin (15) are respectively rotatably matched with the two corresponding wing plates (14); A horizontal support arm (16) is fixedly mounted on the lifting plate (12); a roller (17) located below the support arm (16) is rotatably mounted on one end of the arc-shaped rack (10) corresponding to the position of the support arm (16); and an elastic rope (18) is connected between one end of the arc-shaped rack (10) and the carrier plate (4).

2. A PECVD coating system according to claim 1, characterized in that: A horizontal connecting rod (19) is commonly installed at the top end of each lifting rod (11) on the carrier plate (4).

3. A PECVD coating system according to claim 2, characterized in that: The coating chamber (1) is a structure with an opening on one side. A guide rail (20) is fixedly installed on the coating chamber (1). A portion of the guide rail (20) is located inside the coating chamber (1), and another portion of the guide rail (20) extends from the opening of the coating chamber (1) to the outside of the coating chamber (1). The translation seat (3) and the guide rail (20) are slidably matched. A positioning block (21) for positioning the translation seat (3) is fixedly installed at one end of the guide rail (20); a sealing door (22) is vertically slidably installed at the opening of the coating chamber (1).

4. A PECVD coating system according to claim 3, characterized in that: The coating chamber (1) is provided with a lifting unit for lifting the translation seat (3), the lifting unit comprising a base (23) fixedly connected to the translation seat (3), and a lifting plate (24) vertically slidably matched with the base (23); a first straight rack (25) is vertically fixedly installed at the bottom of the lifting plate (24), and a second straight rack (26) is vertically fixedly installed on the inner wall of the base (23); a first horizontal axis (27) is rotatably installed on the base (23), a first connecting rod (28) is fixedly installed on the first horizontal axis (27), a lifting block (29) is vertically slidably installed in the base (23), a second gear (30) meshing with both the first straight rack (25) and the second straight rack (26) is rotatably installed on the lifting block (29), and a second connecting rod (31) hinged to the first connecting rod (28) is also rotatably installed on the lifting block (29).

5. A PECVD coating system according to claim 4, characterized in that: A second horizontal shaft (32) is rotatably mounted in the coating chamber (1); one end of the first horizontal shaft (27) extends to the outside of the base (23) and is fixedly mounted with a first bevel gear (33); a second bevel gear (34) meshing with the first bevel gear (33) is fixedly mounted on the second horizontal shaft (32); and a motor (35) for driving the second horizontal shaft (32) to rotate is fixedly mounted outside the coating chamber (1).

Citation Information

Patent Citations

  • PECVD coating equipment

    CN103695870B

  • PECVD equipment

    CN103866282B

  • PECVD apparatus

    CN103866282A

  • Automatic positioning device for wafer processing

    CN116995012A