Probe mounting structure for wafer-level reliability testing

Abstract

The present application relates to the field of probe testers, and in particular to a probe installation structure for wafer-level reliability testing, including a mounting frame and a beam needle assembly arranged on the mounting frame, the beam needle assembly including two winding parts symmetrically distributed about the vertical center line of the mounting frame, the probe being coaxial with the vertical center line of the mounting frame; the winding part including a rotating block and a twisted wire arm, a side of the rotating block facing away from the probe is provided with a mounting blind groove in a direction close to the probe, a mounting plate is placed in the mounting blind groove, a rotating rod rotating through the mounting frame and connected to the twisted wire arm is arranged on the mounting plate, two elastic beam needle wires parallel to each other are tied between the two twisted wire arms, the probe is located between the two elastic beam needle wires, and a limiting beam bead is arranged on the probe for cooperating with the elastic beam needle wire to realize axial limiting of the probe. The present application has the advantage of improving the stability of probe installation.

Description

Technical Field

[0001] The present application relates to the field of probe testing machines, and in particular to a probe mounting structure for wafer-level reliability testing. Background Art

[0002] With the development of the semiconductor industry, wafer-level reliability testing has become increasingly important. As an important component in the test, the stability and accuracy of the probe's installation structure directly affect the accuracy of the test results.

[0003] At present, common probe installation structures mostly adopt clamping or bonding methods. Although this method is simple and easy to use, it is easy to cause problems such as probe loosening and deviation during long-term testing or in complex environments, which has obvious shortcomings. Summary of the invention

[0004] In order to improve the stability of probe installation, the present application provides a probe installation structure for wafer-level reliability testing.

[0005] The present application provides a probe installation structure for wafer-level reliability testing using the following technical solution:

[0006] A probe mounting structure for wafer-level reliability testing comprises a mounting frame and a beam needle assembly arranged on the mounting frame, the beam needle assembly comprises two winding parts symmetrically distributed about the vertical center line of the mounting frame, and the probe is coaxial with the vertical center line of the mounting frame; the winding part comprises a rotating block and a twisted wire arm, a side of the rotating block facing away from the probe is provided with a mounting blind groove in a direction close to the probe, a mounting plate is placed in the mounting blind groove, a rotating rod that rotates through the mounting frame and is connected to the twisted wire arm is arranged on the mounting plate, two elastic beam needle wires parallel to each other are tied between the two twisted wire arms, the probe is located between the two elastic beam needle wires, and a device for cooperating with the elastic beam needle wire is arranged on the probe The limiting bead realizes axial limiting; the two rotating blocks are respectively connected to the first winding wheels, a linkage pull wire is wound between the two first winding wheels, the winding direction of the linkage pull wire on the two first winding wheels is the same, one of the first winding wheels is coaxially arranged with a handle, a side bracket is arranged on the mounting frame, a fastening bolt that is threadedly connected to the handle and is tightly pressed against the side bracket, a second winding wheel is coaxially arranged with the other first winding wheel, a third winding wheel is rotatably arranged on the mounting frame, an elastic reset wire is tied between the second winding wheel and the third winding wheel, when the first winding wheel where the handle is located winds the linkage pull wire, the second winding wheel synchronously reels the elastic reset wire.

[0007] By adopting the above technical solution, the worker manually places the probe vertically between the two elastic bundle needles and then turns the handle, which drives the corresponding first winding wheel to wind the linkage wire, and the other first winding wheel to unwind the linkage wire, so that the two rotating blocks respectively drive the corresponding twisting arms to rotate synchronously and in opposite directions, and the two elastic bundle needles are twisted into one strand and the probe is twisted between the two elastic bundle needles. At the same time, the elastic reset wire on the third winding wheel is wound onto the second winding wheel and is continuously stretched. Subsequently, it is only necessary to tighten the fastening bolts to make them close to the side bracket to achieve a stable installation of the probe. Compared with clamping and bonding, the installation method of the probe in this application is simple and firm, and is not prone to problems such as loosening and offset.

[0008] Optionally, the winding parts are arranged in multiple groups in pairs along the direction from top to bottom on the support frame, and the rotating block is provided with a linkage gear through a keyway and a flat key sliding sleeve, and the linkage gears on two vertically adjacent rotating blocks on the same side of the probe are meshed.

[0009] By adopting the above technical solution, multiple groups of winding parts that cooperate with each other can jointly tighten multiple locations of the axial position of the probe, further improving the stability of the probe installation.

[0010] Optionally, an elastic arc piece is arranged in the mounting blind groove on a side facing the probe relative to the mounting piece, both ends of the elastic arc piece abut against the closed end of the mounting blind groove, and the rotating rod slides and rotates through the elastic arc piece.

[0011] By adopting the above technical solution, when the probe descends for testing, the tip of the probe will be inserted into the pad of the wafer, and the elastic arc plate can transform the contact between the probe and the pad into flexible contact, which on the one hand improves the stability of the contact, and on the other hand reduces the possibility of the wafer being damaged due to the rigid contact of the probe.

[0012] Optionally, the diameter of the limiting bead gradually decreases from the top and bottom ends to the midpoint of its height, and the two elastic needle threads corresponding to the limiting bead are twisted at the point where its diameter is smallest.

[0013] By adopting the above technical solution, the position of the twisted wire is arranged at the position where the diameter of the limiting bead is the smallest, so that the position where the diameter of the limiting bead is larger can limit the possibility of axial movement of the probe relative to the position of the twisted wire.

[0014] Optionally, a slide groove parallel to the probe is opened on the mounting frame, the slide groove is slidably matched with a slide, a reset tension spring is arranged between the slide and the end of the slide groove, a needle holder is rotatably arranged on the slide, and the probe slides through the needle holder.

[0015] By adopting the above technical solution, when installing the probe, the worker pulls the needle holder downward and rotates it at a certain angle, passes the probe through the needle holder and then rotates it until the probe remains vertical. After releasing the needle holder, the reset spring pulls the needle holder upward to achieve reset.

[0016] Optionally, the end of the needle holder is L-shaped, and a limiting plug hole for plugging and cooperating with the end of the needle holder is formed at the bottom of the mounting frame.

[0017] By adopting the above technical solution, the end of the needle holder is plugged into and matched with the limiting socket, which is conducive to keeping the probe vertical.

[0018] Optionally, an annular groove is formed on the twisting arm, and a tying wire is tied on the twisting arm for tying the end of the elastic bundle needle thread into the annular groove.

[0019] By adopting the above technical solution, workers use the binding wire to tie the end of the elastic bundle needle thread into the ring groove, which is easy to operate.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] 1. The worker manually places the probe vertically between the two elastic bundles of needles and wires, and then turns the handle. The handle drives the corresponding first winding wheel to wind the linkage wire, and the other first winding wheel to unwind the linkage wire. The two rotating blocks drive the corresponding twisting arms to rotate synchronously and in opposite directions. The two elastic bundles of needles and wires are twisted into one strand and the probe is twisted between the two elastic bundles of needles and wires. At the same time, the elastic reset wire on the third winding wheel is wound onto the second winding wheel and is continuously stretched. Subsequently, it is only necessary to tighten the fastening bolts to make them close to the side bracket to achieve a stable installation of the probe. Compared with clamping and bonding, the installation method of the probe in this application is simple and firm, and is not prone to loosening and offset problems.

[0022] 2. When the probe descends for testing, the tip of the probe will be inserted into the pad of the wafer. The elastic arc plate can transform the contact between the probe and the pad into a flexible contact, which can improve the stability of the contact on the one hand and reduce the possibility of damage to the wafer due to the rigid contact of the probe on the other hand. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the structure of an embodiment of the present application.

[0024] Figure 2 It is a cross-sectional view of the positional relationship among the mounting frame, the side bracket and the rotating block bracket in the embodiment of the present application.

[0025] Explanation of the reference numerals in the accompanying drawings: 1. Probe; 2. Mounting frame; 21. Slide groove; 22. Limiting socket; 3. Wire winding part; 31. Rotating block; 310. Mounting blind groove; 32. Wire twisting arm; 321. Ring groove; 33. Mounting plate; 34. Rotating rod; 35. Elastic needle thread; 4. Limiting bead; 5. First winding wheel; 6. Linkage wire; 7. Handle; 8. Side bracket; 9. Fastening bolt; 10. Second winding wheel; 11. Third winding wheel; 12. Elastic reset wire; 13. Linkage gear; 14. Elastic arc sheet; 15. Slide; 16. Needle frame; 17. Reset spring; 18. Wire tying. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-2 This application is described in further detail.

[0027] An embodiment of the present application discloses a probe mounting structure for wafer-level reliability testing.

[0028] Reference Figure 1 and Figure 2 The probe mounting structure for wafer-level reliability testing includes an inverted concave-shaped mounting frame 2 and a beam needle assembly arranged on the mounting frame 2. The beam needle assembly includes two winding parts symmetrically distributed about the vertical center line of the mounting frame 2. The installation position of the probe 1 is coaxial with the vertical center line of the mounting frame 2.

[0029] Reference Figure 1 and Figure 2 The winding part includes a rotating block 31 and a twisting arm 32. The rotating block 31 has a blind mounting groove 310 on one side facing away from the probe 1 and in a direction close to the probe 1. A mounting plate 33 slides in the mounting groove. A rotating rod 34 is bolted to the mounting plate 33. The rotating rod 34 rotates through the mounting frame 2 and is integrally formed with the twisting arm 32.

[0030] Reference Figure 1 and Figure 2 An elastic arc piece 14 is placed in the mounting blind groove 310 on the side facing the probe 1 relative to the mounting piece 33 , and both ends of the elastic arc piece 14 abut against the closed end of the mounting blind groove 310 , and the rotating rod 34 slides and rotates through the elastic arc piece 14 .

[0031] Reference Figure 1 and Figure 2 Two elastic bundle needle wires 35 are arranged parallel to each other between the two twisted wire arms 32, and the probe 1 is located between the two elastic bundle needle wires 35. An annular groove 321 is formed on the twisted wire arm 32, and a binding wire 18 is tied to the position of the twisted wire arm 32 relative to the annular groove 321, and the binding wire 18 binds the end of the elastic bundle needle wire 35 in the annular groove 321.

[0032] The probe 1 is fixedly sleeved with a limiting bead 4, the diameter of which gradually decreases from the top and bottom ends to the midpoint of its height. The limiting bead 4 cooperates with the elastic needle line 35 to achieve axial limiting of the probe 1.

[0033] Reference Figure 1 and Figure 2 The winding parts are arranged in multiple groups in pairs along the direction from top to bottom on the mounting frame 2. Each rotating block 31 is provided with a linkage gear 13 through a keyway and a flat key sliding sleeve. The linkage gears 13 on two vertically adjacent rotating blocks 31 on the same side of the probe 1 are meshed.

[0034] Reference Figure 1 and Figure 2 The opposite sides of the two rotating blocks 31 at the highest point are bolted with first winding wheels 5, and a linkage cable 6 is tied between the first winding wheels 5. The winding direction of the linkage cable 6 on the two first winding wheels 5 is the same.

[0035] Reference Figure 1 and Figure 2 A handle 7 is coaxially bolted to one of the first winding wheels 5 , an L-shaped side bracket 8 is bolted to the mounting frame 2 , and a fastening bolt 9 for tightening against the side bracket 8 is threadedly connected to the handle 7 .

[0036] A second winding wheel 10 is coaxially arranged with the other first winding wheel 5, and a third winding wheel 11 is rotatably arranged near the bottom of the mounting frame 2, and an elastic reset line 12 is tied between the second winding wheel 10 and the third winding wheel 11.

[0037] Reference Figure 1 and Figure 2 A slide groove 21 with a closed top and an open bottom is vertically opened on the mounting frame 2. The slide groove 21 is slidably matched with a slide 15. A reset spring 17 is arranged between the slide 15 and the top of the slide groove 21. A needle holder 16 is rotatably penetrated on the slide 15, and the probe 1 slides through the needle holder 16.

[0038] Reference Figure 2 The end of the needle frame 16 is L-shaped, and a limiting plug hole 22 for plugging and cooperating with the end of the needle frame 16 is opened at the bottom of the mounting frame 2.

[0039] The implementation principle of the probe installation structure for wafer-level reliability testing in the embodiment of the present application is as follows: during installation, the worker manually pulls the beam needle frame 16 downward and rotates it to a certain angle, then inserts the probe 1 on the beam needle frame 16, and then manually rotates the probe 1 to a vertical position. The beam needle frame 16 is released, and the reset spring 17 drives the beam needle frame 16 upward through the slide 15 to achieve reset, and the probe 1 is driven by the beam needle frame 16 to between the corresponding elastic beam needle lines 35.

[0040] At this time, the worker manually rotates the handle 7, and the handle 7 drives the corresponding rotating block 31 to rotate through the first winding wheel 5 where it is located. Since the winding directions of the linkage wire 6 on the two first winding wheels 5 are the same, the first winding line where the handle 7 is located realizes winding of the linkage wire 6, and the other first winding wheel 5 realizes unwinding of the linkage wire 6, so that the two rotating blocks 31 at the highest position rotate synchronously and in opposite directions. The rotating block 31 at the highest position drives the corresponding rotation of the remaining rotating blocks 31 through the meshing action between the linkage gears 13.

[0041] The two twisting arms 32 in the same group rotate synchronously and in opposite directions, and the corresponding elastic bundle needle threads 35 are twisted into one strand and the twisting part is just located at the minimum diameter of the limiting bundle bead 4. The corresponding elastic bundle needle threads 35 also undergo a certain degree of tensile deformation during the process of being twisted into one strand.

[0042] When the first winding wheel 5 where the handle 7 is located winds the linkage wire 6, the elastic reset wire 12 on the third winding wheel 11 is also synchronously wound onto the second winding wheel 10 and the elastic reset wire 12 is continuously stretched. After the handle 7 is rotated the required number of times, the worker manually tightens the fastening bolt 9 until it is pressed against the side bracket 8, thereby achieving a stable installation of the probe 1.

[0043] When the probe 1 needs to be replaced, it is only necessary to tighten the fastening bolt 9, the elastic reset line 12 recovers its deformation, the elastic reset line 12 on the second winding wheel 10 is rewound onto the third winding wheel 11, and each linkage gear 13 rotates accordingly under the force, and the two elastic needle wires 35 of the same group are twisted in opposite directions to untwist the strands, thereby contacting the twisting effect of the elastic needle wire 35 on the probe 1, and then the needle frame 16 is pulled downward to replace the probe 1.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A probe mounting structure for wafer-level reliability testing, characterized in that: It comprises a mounting frame (2) and a beam needle assembly arranged on the mounting frame (2), wherein the beam needle assembly comprises two winding parts symmetrically distributed about the vertical center line of the mounting frame (2), and the probe (1) is coaxial with the vertical center line of the mounting frame (2); The winding part comprises a rotating block (31) and a twisted wire arm (32); a side of the rotating block (31) facing away from the probe (1) is provided with a mounting blind groove (310) in a direction close to the probe (1); a mounting plate (33) is placed in the mounting blind groove (310); a rotating rod (34) is arranged on the mounting plate (33) and is rotated through the mounting frame (2) and connected to the twisted wire arm (32); two elastic beam needle lines (35) parallel to each other are arranged between the two twisted wire arms (32); the probe (1) is located between the two elastic beam needle lines (35); and a limiting beam bead (4) is arranged on the probe (1) and is used to cooperate with the elastic beam needle line (35) to achieve axial limiting of the probe (1); The two rotating blocks (31) are respectively connected with a first winding wheel (5), a linkage wire (6) is wound between the two first winding wheels (5), and the winding direction of the linkage wire (6) on the two first winding wheels (5) is the same, one of the first winding wheels (5) is coaxially arranged with a handle (7), a side bracket (8) is arranged on the mounting frame (2), a fastening bolt (9) which is threadedly connected to the handle (7) and is pressed against the side bracket (8), the other first winding wheel (5) is coaxially arranged with a second winding wheel (10), a third winding wheel (11) is rotatably arranged on the mounting frame (2), an elastic reset wire (12) is tied between the second winding wheel (10) and the third winding wheel (11), and when the first winding wheel (5) where the handle (7) is located winds the linkage wire (6), the second winding wheel (10) synchronously rewinds the elastic reset wire (12); The probe (1) is placed vertically between two elastic bundle needle threads (35), and then the handle (7) is rotated, the handle (7) drives the corresponding first winding wheel (5) to wind the linkage pull wire (6), and the other first winding wheel (5) unwinds the linkage pull wire (6), and the two rotating blocks (31) respectively drive the corresponding twisting arms (32) to rotate synchronously and in opposite directions, the two elastic bundle needle threads (35) are twisted into one strand, and the probe (1) is twisted between the two elastic bundle needle threads (35).

2. The probe installation structure for wafer-level reliability testing according to claim 1, characterized in that: The winding parts are arranged in pairs on the support frame in a direction from top to bottom. The rotating block (31) is provided with a linkage gear (13) through a keyway and a flat key sliding sleeve. The linkage gears (13) on two vertically adjacent rotating blocks (31) on the same side of the probe (1) are meshed.

3. The probe installation structure for wafer-level reliability testing according to claim 1, characterized in that: An elastic arc piece (14) is arranged in the mounting blind groove (310) on a side facing the probe (1) relative to the mounting piece (33), both ends of the elastic arc piece (14) abut against the closed end of the mounting blind groove (310), and the rotating rod (34) slides and rotates through the elastic arc piece (14).

4. The probe installation structure for wafer-level reliability testing according to claim 1, characterized in that: The diameter of the limiting bead (4) gradually decreases from the top and bottom ends to the midpoint of its height, and the two elastic needle threads (35) corresponding to the limiting bead (4) are twisted at the point where its diameter is the smallest.

5. The probe installation structure for wafer-level reliability testing according to claim 1, characterized in that: The mounting frame (2) is provided with a slide groove (21) parallel to the probe (1), the slide groove (21) is slidably matched with a slide frame (15), a return tension spring (17) is arranged between the ends of the slide frame (15) and the slide groove (21), a needle holder (16) is rotatably arranged on the slide frame (15), and the probe (1) slides through the needle holder (16).

6. The probe installation structure for wafer-level reliability testing according to claim 5, characterized in that: The end of the needle holder (16) is L-shaped, and the bottom of the mounting frame (2) is provided with a limiting insertion hole (22) for plugging and matching with the end of the needle holder (16).

7. The probe installation structure for wafer-level reliability testing according to claim 1, characterized in that: The twisted wire arm (32) is provided with an annular groove (321), and the twisted wire arm (32) is provided with a binding wire (18) for binding the end of the elastic bundle needle thread (35) in the annular groove (321).

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