A packaging structure of a composite sensor chip

Abstract

The present invention relates to the field of chip packaging technology, and discloses a packaging structure of a composite sensor chip, including a power mechanism, wherein the power mechanism also includes an equipment base. The present invention utilizes the characteristics that a thermistor is divided into two components, namely a main body and a lead, and the two components have different cross-sections, and a correction tube and a correction groove are arranged inside the equipment. Before using the equipment, the power supply of the power motor is turned on, the raw material chip is placed inside the feeding mechanism, and finally the thermistor is placed inside the feeding box. The thermistor is affected by the inclination angle of the feeding box and enters the correction tube. At this time, the thermistor will present a V state with the main body downward or the main body upward in Figure 5. When the thermistor presents a V state, since the volume of the main body is larger than that of the lead, the main body directly passes through the correction groove along the inner wall of the correction tube and hits the side wall of the material blocking plate. At this time, due to the smaller volume of the lead part, it will directly pass through the correction groove and fall on the surface of the material blocking slide plate.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging equipment, and in particular to a packaging structure of a composite sensor chip. Background Art

[0002] Composite sensors are sensor systems that integrate multiple types of sensor technologies into a single device or module. By integrating multiple independent sensor elements, they can simultaneously detect and measure multiple physical or chemical parameters, thereby providing more comprehensive and accurate environmental data. Through sensor fusion algorithms, they combine the data of multiple sensors to provide measurement results with higher accuracy and reliability than a single sensor. Common sensors include pressure sensors, temperature sensors, and humidity sensors.

[0003] Among them, when the temperature sensor (thermistor NTC 10K) is soldered on the surface of the chip, it is necessary to manually determine the position between the sensor output end and the input end and the installed chip. In this process, the port position of the sensor is the main position for adjustment. Manual adjustment is time-consuming and laborious. In view of the above problems, the following solutions are proposed. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a packaging structure of a composite sensor chip, including a power mechanism, the power mechanism also includes a device base, the top of the device base is fixedly connected to a support plate, and one end of the support plate away from the device base is fixedly connected to a slide plate;

[0005] The control mechanism includes a support frame fixedly connected to the top of the chute plate, an end of the support frame away from the chute plate is fixedly connected to a feed box, a correction pipe 1 is connected through the side wall of the feed box, and a thermistor is placed on the inner wall of the feed box;

[0006] The welding mechanism comprises an L-shaped sliding rod slidably connected to the inner wall of the equipment base, and a pushing spring is fixedly connected to the side wall of the L-shaped sliding rod.

[0007] Preferably, the power mechanism also includes a rolling bracket fixedly connected to the top of the equipment base, a conveying belt is sleeved on the outer wall of the rolling bracket, and a material blocking plate is fixedly connected to the top of the support plate.

[0008] Preferably, the power mechanism also includes a rolling bracket 2 rotatably connected to the top of the slide plate, a conveying belt 2 is sleeved on the outer wall of the rolling bracket 2, a storage plate is fixedly connected to the side wall of the baffle plate, a power motor is fixedly connected to the top of the equipment base, and the output end of the power motor is fixedly connected to the outer wall of the rolling bracket 2.

[0009] Preferably, the power mechanism also includes a power belt mounted on the outer wall of the rolling bracket one, and one end of the power belt away from the rolling bracket one is rotatably connected to the outer wall of the rolling bracket two. The top of the equipment base is fixedly connected to the feeding mechanism, and the inner wall of the feeding mechanism is slidably connected to the raw material chip. Taking advantage of the fact that the thermistor is divided into two components, a main body and a lead, and the two components have different cross-sections, a correction tube 1 and a correction groove are provided inside the equipment. Before using the equipment, turn on the power supply of the power motor, place the raw material chip inside the feeding mechanism, and finally place the thermistor inside the feeding box. The thermistor is affected by the inclination angle of the feeding box and enters the correction tube 1. At this time, the thermistor will present Figure 5 The state of the middle V with the main body downward or upward.

[0010] Preferably, the control mechanism also includes a correction groove provided on the inner wall of the correction tube, a U-shaped slide is slidably connected to the inner wall of the slide plate, a pulling spring is fixedly connected to the side wall of the U-shaped slide, the end of the pulling spring away from the U-shaped slide is fixedly connected to the outer wall of the slide plate, and a damper is fixedly connected inside the pulling spring. When the thermistor is in a V state, since the volume of the main body is larger than that of the lead wire, the main body directly passes through the correction groove along the inner wall of the correction tube and hits the side wall of the material baffle plate. At this time, the lead wire part will directly pass through the correction groove due to its smaller volume and fall on the surface of the material baffle plate, finally forming a Figure 5 When the thermistor is in the main body upward state, the lead wire part passes through the correction groove and contacts the second surface of the conveyor belt. Figure 5 In the F state, as the power motor drives the conveyor belt 2 through the rolling bracket 2 to start running, the conveyor belt 2 drives the thermistor in the F state to move to one end, and the main body tilts until the main body tilts up too much and cannot support the balance, and falls along the inner wall of the correction groove to the surface of the conveyor belt 2. Through the application of the above components, the self-adjustment direction of the thermistor is achieved, which is convenient for the subsequent welding process of the sensor and the chip.

[0011] Preferably, the control mechanism also includes a tilting rod fixedly connected to the outer wall of the U-shaped slide, a material blocking slide is slidably connected to the inner wall of the support frame, a roller is rotatably connected to the inner wall of the material blocking slide, and some electronic components are welded on the outer wall of the copper foil conductive layer of the chip. After the equipment completes the direction adjustment of the thermistor, the thermistor is restricted by the storage plate and enters the gap of the storage plate, and is finally restricted by the U-shaped slide to stop transportation, and the rolling bracket 2 drives the rolling bracket 1 and the conveying belt 1 to rotate and transmit through the power belt, wherein the conveying belt 1 is made of rubber, and when the raw material chip is fed from the feeder When the electronic component falls onto the surface of conveyor belt one, the electronic component will enter the gap position of conveyor belt one. At this time, the raw material chip will contact the outer wall of the U-shaped slide along with conveyor belt one and push the U-shaped slide to move outward. The U-shaped slide forces the material blocking slide to move upward through the inclined surface of the tilting rod, thereby releasing the restriction on the thermistor, allowing the thermistor to enter the interior of correction tube two and slide downward along the inner wall of correction tube two, and finally inserting the thermistor into the through hole of the raw material chip. Through the application of the above components, the components can enter the interior of the equipment in an orderly manner to avoid blockage of the equipment feed and damage to the product.

[0012] Preferably, the welding mechanism also includes a correction tube 2 that is connected through the side wall of the storage plate, an L-shaped welding frame is fixedly connected to the side wall of the L-shaped slide bar, and a welding machine is fixedly connected to the side wall of the L-shaped welding frame. After welding is completed, as the electronic components of the raw material chip are clamped by the conveyor belt 1 and move outward, when the conveyor belt 1 reaches the corner position of the rolling bracket 1, the gap of the conveyor belt 1 at the corner position is enlarged, and the conveyor belt 1 cannot achieve the clamping restriction effect. The thermistor that loses the clamping enters the through hole on the surface of the equipment base due to its own weight, thereby realizing autonomous discharging of the equipment; in addition, a damper is arranged inside the pulling spring. After the equipment completes discharging, the damper will slow down the speed of contraction of the U-shaped slide, so that the thermistor has enough time to fall into the equipment base, avoiding rapid recovery of the U-shaped slide and damage to the thermistor. Through the application of the above-mentioned components, autonomous discharge of the components is realized.

[0013] Preferably, the welding mechanism also includes a return spring fixedly connected to the end of the L-shaped welding frame away from the welding machine, and the end of the return spring away from the welding machine is fixedly connected to the outer wall of the L-shaped slide bar. When the component assembly is completed, as the U-shaped slide is pushed outward under pressure, the U-shaped slide will squeeze the bottom end of the L-shaped welding frame, causing the other end of the L-shaped welding frame to rotate downward, forcing the welding machine to approach the connection position between the thermistor and the raw material chip, and perform a welding combination, wherein, as the U-shaped slide moves outward, the L-shaped slide bar will move outward along the inner wall of the equipment base, thereby realizing synchronous movement of the welding point and avoiding internal movement of the equipment to cause offset of the welding point.

[0014] The present invention has the following beneficial effects:

[0015] (1) The present invention utilizes the characteristics that the thermistor is composed of two components, the main body and the lead wire, and the two components have different cross-sections. A correction tube and a correction slot are provided inside the device. Before using the device, the power of the power motor is turned on, the raw material chip is placed inside the feed mechanism, and finally the thermistor is placed inside the feed box. The thermistor is affected by the inclination angle of the feed box and enters the correction tube. At this time, the thermistor will present Figure 5 When the thermistor is in the V state, the body is larger than the lead wire, so the body passes through the correction groove along the inner wall of the correction tube and hits the side wall of the baffle plate. At this time, the lead wire part, due to its smaller volume, will directly pass through the correction groove and fall on the surface of the baffle plate, eventually forming a Figure 5 When the thermistor is in the main body upward state, the lead wire part passes through the correction groove and contacts the second surface of the conveyor belt. Figure 5 In the F state, as the power motor drives the conveyor belt 2 through the rolling bracket 2 to start running, the conveyor belt 2 drives the thermistor in the F state to move to one end, and the main body tilts until the main body tilts up too much and cannot support the balance, and falls along the inner wall of the correction groove to the surface of the conveyor belt 2. Through the application of the above components, the self-adjustment direction of the thermistor is achieved, which is convenient for the subsequent welding process of the sensor and the chip.

[0016] (2) The present invention utilizes the copper foil conductive layer of the chip to weld some electronic components on its outer wall. After the device completes the adjustment of the thermistor direction, the thermistor is restricted by the storage plate and enters the gap of the storage plate. Finally, it is restricted by the U-shaped slide and stops transportation. The rolling bracket 2 drives the rolling bracket 1 and the conveying belt 1 to rotate and transmit through the power belt. The conveying belt 1 is made of rubber. When the raw material chip falls from the feeding mechanism to the surface of the conveying belt 1, the electronic components will enter the gap of the conveying belt 1. At this time, the raw material chip will contact the outer wall of the U-shaped slide along with the conveying belt 1 and push the U-shaped slide to move outward. The U-shaped slide forces the material blocking slide to move upward through the inclined surface of the tilting rod, thereby releasing the restriction on the thermistor and allowing the thermistor to enter the interior of the correction tube 2 and slide downward along the inner wall of the correction tube 2. Finally, the thermistor is inserted into the through hole of the raw material chip. Through the application of the above components, the components can enter the interior of the device in an orderly manner to avoid blockage of the equipment feed and damage to the product.

[0017] (3) When the present invention completes the assembly of the components, as the U-shaped slide is pushed outward under pressure, the U-shaped slide will squeeze the bottom end of the L-shaped welding frame, causing the other end of the L-shaped welding frame to rotate downward, forcing the welding machine to approach the connection position between the thermistor and the raw material chip, and perform the welding assembly. As the U-shaped slide moves outward, the L-shaped slide bar will move outward along the inner wall of the equipment base, realizing the synchronous movement of the welding point, avoiding the internal movement of the equipment, which may cause the welding point to shift.

[0018] (4) After the welding is completed, as the electronic component of the raw material chip is clamped by the conveyor belt 1 and moves outward, when the conveyor belt 1 reaches the corner position of the rolling bracket 1, the gap of the conveyor belt 1 at the corner position is enlarged, and the conveyor belt 1 cannot achieve the clamping and limiting effect. The thermistor that loses the clamping enters the through hole on the surface of the device base due to its own weight, thereby realizing autonomous discharge of the device. In addition, a damper is arranged inside the pulling spring. After the device completes the discharge, the damper will slow down the speed of the U-shaped slide to retract, so that the thermistor has enough time to fall into the device base, thereby avoiding the rapid recovery of the U-shaped slide and causing damage to the thermistor. Through the application of the above components, autonomous discharge of the components is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the internal components of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the internal components of the power mechanism of the present invention;

[0023] Figure 4 It is a cross-sectional schematic diagram of the control mechanism of the present invention;

[0024] Figure 5 For the present invention Figure 4 A is an enlarged schematic diagram;

[0025] Figure 6 For the present invention Figure 4 A magnified schematic diagram of B;

[0026] Figure 7 It is a cross-sectional schematic diagram of the welding mechanism of the present invention;

[0027] Figure 8 For the present invention Figure 7 A magnified schematic diagram of C in the middle.

[0028] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0029] In the figure: 1. Power mechanism; 101. Equipment base; 102. Support plate; 103. Slide plate; 104. Rolling bracket one; 105. Conveyor belt one; 106. Material blocking plate; 107. Rolling bracket two; 108. Conveyor belt two; 109. Storage plate; 110. Power motor; 111. Power belt; 112. Feeding mechanism; 113. Raw material chip; 2. Control mechanism; 201. Support frame; 202. Feeding box; 203. Correction tube one; 204. Correction groove; 205. U-shaped slide; 206. Pull spring; 207. Tilt rod; 208. Material blocking slide; 209. Roller; 210. Thermistor; 3. Welding mechanism; 301. L-shaped slide; 302. Push spring; 303. Correction tube two; 304. L-shaped welding frame; 305. Welding machine; 306. Reset spring. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] For example, see Figure 1 - Figure 3 The present invention is a packaging structure of a composite sensor chip, including a power mechanism 1, the power mechanism 1 also includes a device base 101, the top of the device base 101 is fixedly connected to a support plate 102, and one end of the support plate 102 away from the device base 101 is fixedly connected to a slide plate 103;

[0032] The control mechanism 2 includes a support frame 201 fixedly connected to the top of the slide plate 103, and an end of the support frame 201 away from the slide plate 103 is fixedly connected to a feed box 202, a correction pipe 203 is connected through the side wall of the feed box 202, and a thermistor 210 is placed on the inner wall of the feed box 202;

[0033] The welding mechanism 3 includes an L-shaped slide bar 301 slidably connected to the inner wall of the equipment base 101 , and a push spring 302 is fixedly connected to the side wall of the L-shaped slide bar 301 .

[0034] The power mechanism 1 also includes a rolling bracket 104 fixedly connected to the top of the equipment base 101, a conveying belt 105 is sleeved on the outer wall of the rolling bracket 104, and a material blocking plate 106 is fixedly connected to the top of the support plate 102.

[0035] The power mechanism 1 also includes a rolling bracket 107 rotatably connected to the top of the slide plate 103, a conveyor belt 108 is sleeved on the outer wall of the rolling bracket 107, a storage plate 109 is fixedly connected to the side wall of the baffle plate 106, and a power motor 110 is fixedly connected to the top of the equipment base 101, and the output end of the power motor 110 is fixedly connected to the outer wall of the rolling bracket 107.

[0036] The power mechanism 1 also includes a power belt 111 sleeved on the outer wall of the rolling bracket 104, and the end of the power belt 111 away from the rolling bracket 104 is rotatably connected to the outer wall of the rolling bracket 2 107. The top of the equipment base 101 is fixedly connected to a feeding mechanism 112, and the inner wall of the feeding mechanism 112 is slidably connected to a raw material chip 113. Taking advantage of the fact that the thermistor 210 is divided into two components, a main body and a lead, and the two have different cross-sections, a correction tube 203 and a correction groove 204 are provided inside the equipment. Before using the equipment, turn on the power supply of the power motor 110, place the raw material chip 113 inside the feeding mechanism 112, and finally place the thermistor 210 inside the feeding box 202. The thermistor 210 is affected by the inclination angle of the feeding box 202 and enters the correction tube 203. At this time, the thermistor 210 will present Figure 5 The state of the middle V with the main body downward or upward.

[0037] For example 2, please refer to Figure 4 - Figure 8 The present invention is a packaging structure of a composite sensor chip. On the basis of the first embodiment, the control mechanism 2 also includes a correction groove 204 opened on the inner wall of the correction tube 203, a U-shaped slide 205 is slidably connected to the inner wall of the slide plate 103, and a pulling spring 206 is fixedly connected to the side wall of the U-shaped slide 205. The end of the pulling spring 206 away from the U-shaped slide 205 is fixedly connected to the outer wall of the slide plate 103, and a damper is fixedly connected inside the pulling spring 206. When the thermistor 210 is in a V state, since the volume of the main body is larger than that of the lead, the main body directly passes through the correction groove 204 along the inner wall of the correction tube 203 and hits the side wall of the material blocking plate 106. At this time, due to the smaller volume of the lead part, it will directly pass through the correction groove 204 and fall on the surface of the material blocking slide plate 208, and finally form Figure 5 and when the thermistor 210 presents the main body upward state, the lead portion passes through the correction groove 204 and contacts the surface of the conveyor belt 108, presenting Figure 5In the F state, as the power motor 110 drives the conveyor belt 108 to start running through the rolling bracket 107, the conveyor belt 108 drives the thermistor 210 in the F state to move to one end, and the main body tilts until the main body tilts up too much and cannot support the balance, and falls along the inner wall of the correction groove 204 to the surface of the conveyor belt 108. Through the application of the above components, the self-adjustment direction of the thermistor is achieved, which is convenient for the subsequent welding process of the sensor and the chip.

[0038] The control mechanism 2 also includes a tilting rod 207 fixedly connected to the outer wall of the U-shaped slide 205, a material blocking slide 208 is slidably connected to the inner wall of the support frame 201, and a roller 209 is rotatably connected to the inner wall of the material blocking slide 208. Some electronic components are welded on the outer wall of the copper foil conductive layer of the chip. After the device completes the direction adjustment of the thermistor 210, the thermistor 210 is restricted by the storage plate 109 and enters the gap of the storage plate 109. Finally, it is restricted by the U-shaped slide 205 and stops transportation. The rolling bracket 2 107 drives the rolling bracket 1 104 and the conveying belt 1 105 to rotate and transmit through the power belt 111. Among them, the conveying belt 105 is made of rubber. When the raw material chip 113 is fed from the feeder, When the structure 112 falls onto the surface of the conveyor belt 105, the electronic component will enter the gap position of the conveyor belt 105. At this time, the raw material chip 113 will contact the outer wall of the U-shaped slide 205 along the conveyor belt 105 and push the U-shaped slide 205 to move outward. The U-shaped slide 205 forces the material blocking slide 208 to move upward through the inclined surface of the tilting rod 207, thereby releasing the restriction on the thermistor 210, allowing the thermistor 210 to enter the interior of the correction tube 303 and slide downward along the inner wall of the correction tube 303, finally inserting the thermistor 210 into the through hole of the raw material chip 113. Through the application of the above-mentioned components, the components can enter the interior of the equipment in an orderly manner to avoid blockage of the equipment feed and damage to the product.

[0039] The welding mechanism 3 also includes a correction tube 303 connected to the side wall of the storage plate 109, an L-shaped welding frame 304 is fixedly connected to the side wall of the L-shaped slide bar 301, and a welding machine 305 is fixedly connected to the side wall of the L-shaped welding frame 304. After the welding is completed, as the electronic component of the raw material chip 113 is clamped by the conveyor belt 105 and moves outward, when the conveyor belt 105 reaches the corner position of the rolling bracket 104, the gap of the conveyor belt 105 at the corner position is enlarged, and the conveyor belt 105 cannot be moved. 5 achieves the effect of clamping restriction. The thermistor 210 that loses the clamping enters the through hole on the surface of the device base 101 due to its own weight, thereby realizing the autonomous discharge of the device. In addition, a damper is arranged inside the pulling spring 206. After the device completes the discharge, the damper will slow down the speed of the U-shaped slide 205 contraction, so that the thermistor 210 has enough time to fall into the device base 101, thereby avoiding the rapid recovery of the U-shaped slide 205 and causing damage to the thermistor 210. Through the application of the above components, the autonomous discharge of the components is realized.

[0040] The welding mechanism 3 also includes a return spring 306 fixedly connected to the end of the L-shaped welding frame 304 away from the welding machine 305. The end of the return spring 306 away from the welding machine 305 is fixedly connected to the outer wall of the L-shaped slide bar 301. When the component assembly is completed, as the U-shaped slide 205 is pushed outward under pressure, the U-shaped slide 205 will squeeze the bottom end of the L-shaped welding frame 304, causing the other end of the L-shaped welding frame 304 to rotate downward, forcing the welding machine 305 to approach the connection position between the thermistor 210 and the raw material chip 113, and perform a welding assembly. As the U-shaped slide 205 moves outward, the L-shaped slide bar 301 will move outward along the inner wall of the equipment base 101, realizing the synchronous movement of the welding point, avoiding the internal movement of the equipment and causing the welding point to shift.

[0041] A specific application of this embodiment is: the present invention utilizes the characteristics that the thermistor 210 is composed of two components, the main body and the lead, and the two components have different cross-sections. A correction tube 203 and a correction slot 204 are arranged inside the device. Before using the device, the power supply of the power motor 110 is turned on, the raw material chip 113 is placed inside the feed mechanism 112, and finally the thermistor 210 is placed inside the feed box 202. The thermistor 210 is affected by the inclination angle of the feed box 202 and enters the correction tube 203. At this time, the thermistor 210 will present Figure 5 In the state of the main body downward or upward in the middle V, when the thermistor 210 is in the V state, since the main body volume is larger than the lead wire, the main body directly passes through the correction groove 204 along the inner wall of the correction tube 203 and hits the side wall of the material blocking plate 106. At this time, the lead wire part will directly pass through the correction groove 204 due to its smaller volume and fall on the surface of the material blocking slide plate 208, finally forming Figure 5and when the thermistor 210 presents the main body upward state, the lead portion passes through the correction groove 204 and contacts the surface of the conveyor belt 108, presenting Figure 5 In the F state, as the power motor 110 drives the conveyor belt 108 to start running through the rolling bracket 107, the conveyor belt 108 drives the thermistor 210 in the F state to move to one end, and the main body tilts until the main body tilts up too much and cannot support the balance, and falls along the inner wall of the correction groove 204 to the surface of the conveyor belt 108. Through the application of the above components, the self-adjustment direction of the thermistor is achieved.

[0042] The outer wall of the copper foil conductive layer of the chip is welded with some electronic components. After the device completes the direction adjustment of the thermistor 210, the thermistor 210 is restricted by the storage plate 109 and enters the gap of the storage plate 109. Finally, it is restricted by the U-shaped slide 205 and stops transportation. The rolling bracket 107 drives the rolling bracket 104 and the conveying belt 105 to rotate and transmit through the power belt 111. The conveying belt 105 is made of rubber. When the raw material chip 113 falls from the feeding mechanism 112 to the surface of the conveying belt 105, the electrical The sub-element will enter the gap position of the conveyor belt 105. At this time, the raw material chip 113 will contact the outer wall of the U-shaped slide 205 along the conveyor belt 105 and push the U-shaped slide 205 to move outward. The U-shaped slide 205 forces the material blocking slide 208 to move upward through the inclined surface of the tilting rod 207, thereby releasing the restriction on the thermistor 210, allowing the thermistor 210 to enter the interior of the correction tube 2 303 and slide downward along the inner wall of the correction tube 2 303, and finally insert the thermistor 210 into the through hole of the raw material chip 113, through The application of the above components allows the components to enter the equipment in an orderly manner, avoiding blockage of the equipment feed and damage to the product. When the components are assembled, as the U-shaped slide 205 is pushed outward under pressure, the U-shaped slide 205 will squeeze the bottom end of the L-shaped welding frame 304, causing the other end of the L-shaped welding frame 304 to rotate downward, forcing the welding machine 305 to approach the connection position between the thermistor 210 and the raw material chip 113, and perform welding assembly. As the U-shaped slide 205 moves outward, the L-shaped slide bar 301 will move along the equipment base 101. The inner wall of the device moves outward to achieve synchronous movement of the welding point and avoid internal movement of the device, which may cause the welding point to shift. After welding is completed, as the electronic component of the raw material chip 113 clamped by the conveyor belt 105 moves outward, when the conveyor belt 105 reaches the corner position of the rolling bracket 104, the gap of the conveyor belt 105 at the corner position enlarges, and the conveyor belt 105 cannot achieve the clamping restriction effect. The thermistor 210 that loses the clamping enters the through hole on the surface of the device base 101 due to its own weight, thereby realizing autonomous discharge of the device.

[0043] In addition, a damper is provided inside the pulling spring 206. After the device completes discharging, the damper will slow down the retraction speed of the U-shaped slide 205, so that the thermistor 210 has enough time to fall into the device base 101, thereby avoiding the rapid recovery of the U-shaped slide 205 and causing damage to the thermistor 210. Through the application of the above-mentioned components, autonomous discharge of the components can be achieved.

[0044] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging structure of a composite sensor chip, comprising a power mechanism (1), the power mechanism (1) further comprising a device base (101), the top of the device base (101) being fixedly connected to a support plate (102), and one end of the support plate (102) away from the device base (101) being fixedly connected to a slide plate (103), characterized in that: Also includes: A control mechanism (2), the control mechanism (2) comprising a support frame (201) fixedly connected to the top of the slide plate (103), an end of the support frame (201) away from the slide plate (103) being fixedly connected to a feed box (202), a correction pipe 1 (203) being connected through a side wall of the feed box (202), and a thermistor (210) being placed on an inner wall of the feed box (202); A welding mechanism (3), the welding mechanism (3) comprising an L-shaped sliding rod (301) slidably connected to the inner wall of the device base (101), and a push spring (302) fixedly connected to the side wall of the L-shaped sliding rod (301); The power mechanism (1) further comprises a rolling bracket (104) fixedly connected to the top of the equipment base (101), a conveying belt (105) being sleeved on the outer wall of the rolling bracket (104), and a material blocking plate (106) being fixedly connected to the top of the support plate (102); The control mechanism (2) further comprises a correction groove (204) provided on the inner wall of the correction tube (203); a U-shaped slide (205) is slidably connected to the inner wall of the slide plate (103); a pulling spring (206) is fixedly connected to the side wall of the U-shaped slide (205); an end of the pulling spring (206) away from the U-shaped slide (205) is fixedly connected to the outer wall of the slide plate (103); and a damper is fixedly connected inside the pulling spring (206); The thermistor (210) is affected by the tilt angle of the feed box (202). When entering the correction tube (203), the thermistor (210) will be in a state with the main body facing downward or facing upward.

2. The packaging structure of a composite sensor chip according to claim 1, characterized in that: The power mechanism (1) further comprises a second rolling bracket (107) rotatably connected to the top of the slide plate (103); a second conveying belt (108) is sleeved on the outer wall of the second rolling bracket (107); a storage plate (109) is fixedly connected to the side wall of the baffle plate (106); a power motor (110) is fixedly connected to the top of the equipment base (101); and an output end of the power motor (110) is fixedly connected to the outer wall of the second rolling bracket (107).

3. The packaging structure of a composite sensor chip according to claim 2, characterized in that: The power mechanism (1) further comprises a power belt (111) sleeved on the outer wall of the first rolling bracket (104); one end of the power belt (111) away from the first rolling bracket (104) is rotatably connected to the outer wall of the second rolling bracket (107); a feed mechanism (112) is fixedly connected to the top of the equipment base (101); and a raw material chip (113) is slidably connected to the inner wall of the feed mechanism (112).

4. The packaging structure of a composite sensor chip according to claim 3, characterized in that: The control mechanism (2) further comprises a tilting rod (207) fixedly connected to the outer wall of the U-shaped slide (205); a material blocking slide (208) is slidably connected to the inner wall of the support frame (201); and a roller (209) is rotatably connected to the inner wall of the material blocking slide (208).

5. The packaging structure of a composite sensor chip according to claim 4, characterized in that: The welding mechanism (3) further comprises a second correction pipe (303) which is connected through the side wall of the storage plate (109); an L-shaped welding frame (304) is fixedly connected to the side wall of the L-shaped sliding rod (301); and a welding machine (305) is fixedly connected to the side wall of the L-shaped welding frame (304).

6. The packaging structure of a composite sensor chip according to claim 5, characterized in that: The welding mechanism (3) further comprises a return spring (306) fixedly connected to one end of the L-shaped welding frame (304) away from the welding machine (305); the end of the return spring (306) away from the welding machine (305) is fixedly connected to the outer wall of the L-shaped sliding rod (301).

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