A dual-color temperature CSP light source and its preparation method and application

Abstract

The present invention relates to the technical field of CSP light sources, and in particular to a dual-color temperature CSP light source and a preparation method and application thereof, comprising a high color temperature CSP light source and a low color temperature CSP light source, wherein the color temperature of the high color temperature CSP light source is 6000-7000K, and the color temperature of the low color temperature CSP light source is 2000-3000K; the high color temperature CSP light source and the low color temperature CSP light source are both composed of an internal blue light chip and a fluorescent layer wrapping the exposed surface of the chip, wherein the blue light chip comprises at least three blue light chips with different wavelengths within a wavelength range of 400-500nm, and when used in COB, no additional layer of fluorescent glue is required, so that the preparation method of COB is simpler, and the dual-color temperature CSP in the full-spectrum COB not only has excellent aging performance and good stability, but also has a high color rendering index and high brightness.

Description

Technical Field

[0001] The present invention relates to the technical field of CSP light sources, and in particular to a dual-color temperature CSP light source and a preparation method and application thereof. Background Art

[0002] Full spectrum refers to a spectrum curve that includes ultraviolet light, visible light, and infrared light, and the ratio of red, green, and blue in the visible light part is similar to that of sunlight, and the color rendering index is close to 100. The development of artificial light sources tends to achieve "full spectrum lighting". In the field of LED applications, the structure of the CSP (Chip Scale Package, i.e., a point light source formed by chip-scale packaging) light source is a flip-chip blue light chip structure coated with a phosphor silicone film. After the CSP light source is powered on, the blue light and other colors of light emitted by the phosphor in the silicone excited by the blue light combine to form white light with different color temperatures and rendering indices. The current CSP application process for COB has the following problems: (1) It is impossible to achieve adjustable color temperature; (2) The color mixing effect is poor, and the light distribution is uneven; (3) The process control is difficult and requires additional coverage of fluorescent glue. For example, a Chinese patent (authorization announcement number CN106229312B) discloses a full-spectrum CSP packaged light source and a manufacturing method thereof, which mainly achieves color temperature adjustment and uniform light mixing by optimizing LED light sources including high and low color temperature light sources and monochromatic cyan CSP light sources, green CSP light sources and red CSP light sources, but its color rendering index needs to be further improved. Summary of the invention

[0003] In order to solve the above problems, the present invention provides a dual-color temperature CSP light source. When used in COB, there is no need to additionally cover it with a layer of fluorescent glue, which makes the preparation method of COB simpler. The dual-color temperature CSP in the full-spectrum COB not only has excellent aging performance and good stability, but also has a high color rendering index and high brightness.

[0004] On one hand, the present invention provides a dual-color temperature CSP light source, including a high color temperature CSP light source and a low color temperature CSP light source, wherein the color temperature of the high color temperature CSP light source is 6000-7000K, and the color temperature of the low color temperature CSP light source is 2000-3000K; the high color temperature CSP light source and the low color temperature CSP light source are both composed of an internal blue light chip and a fluorescent layer wrapping the exposed surface of the chip, and the blue light chip includes at least three blue light chips with different wavelengths within a wavelength range of 400-500nm.

[0005] As a preferred technical solution, the blue light chip includes three blue light chips with different wavelengths, namely, wavelength ranges of 440-445nm, 450-455nm, and 460-465nm.

[0006] Preferably, the blue light chip includes three blue light chips with different wavelengths, namely, wavelength ranges of 440-442.5 nm, 450-452.5 nm, and 460-462.5 nm.

[0007] Most preferably, the blue light chip includes three blue light chips with different wavelengths of 440nm, 450nm and 460nm.

[0008] The dual-color temperature CSP light source provided by the present invention is applied to the preparation of full-spectrum COB, which effectively solves the problem that the existing full-spectrum COB light source needs to use fluorescent glue to realize the preparation of full-spectrum COB after the solid crystal is completed, simplifies the preparation process of full-spectrum COB, and provides a new idea for the preparation of full-spectrum COB. Specifically, the present invention optimizes the preparation of three blue light chips with different wavelengths in the low color temperature CSP light source and the high color temperature CSP light source, and then combines the low color temperature CSP and the high color temperature CSP in the COB to realize the preparation of full-spectrum COB products in the dual color temperature lighting field, and can make the spectrum of the full-spectrum COB maintain continuity and integrity, so that the spectrum is more similar to the spectrum of the sun.

[0009] As a preferred technical solution, the raw materials for preparing the fluorescent layer include at least 45-75% of fluorescent powder and the rest of the packaging agent, calculated by mass percentage.

[0010] As a preferred technical solution, the phosphor comprises at least yellow-green phosphor and red phosphor, and the mass ratio of the yellow-green phosphor to the red phosphor is (35-60): (5-20).

[0011] Preferably, the wavelength of the yellow-green phosphor is 500-540nm, and the wavelength of the red-pink phosphor is 640-660nm.

[0012] Preferably, the phosphor is a combination of yellow-green phosphor and red phosphor, the wavelength of the yellow-green phosphor is 535nm, and the wavelength of the red phosphor is 650nm.

[0013] As a preferred technical solution, the color temperature of the high color temperature CSP light source is 6500K. The raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 35-45% yellow-green fluorescent powder, 5-15% red fluorescent powder, and an encapsulant to make up the balance.

[0014] Preferably, the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 39-41% yellow-green fluorescent powder, 7.1-9.1% red fluorescent powder, and an encapsulant to make up the balance.

[0015] As a preferred technical solution, the color temperature of the low color temperature CSP light source is 2700K. The raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 50-60% yellow-green phosphor, 15-20% red phosphor, and an encapsulant to make up the balance.

[0016] Preferably, the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 54-56% yellow-green fluorescent powder, 16.5-18.5% red fluorescent powder, and an encapsulant to make up the balance.

[0017] As a preferred technical solution, the thickness of the fluorescent layer is 250-400 μm, preferably 290-310 μm.

[0018] Furthermore, the present invention optimizes the mass ratio of yellow-green phosphor and red phosphor in the fluorescent layer of high and low color temperature CSP light sources, while ensuring that the product has a high relative luminous efficiency, color rendering index and spectral width, so as to better meet the actual application needs.

[0019] As a preferred technical solution, the encapsulant is an addition type liquid silicone, preferably LED encapsulation silicone. Preferably, the LED encapsulation silicone is methyl low fold silicone or phenyl high fold silicone, preferably phenyl high fold silicone, specifically the LED encapsulation silicone of Guangzhou Huigu New Materials Technology Co., Ltd.

[0020] Another aspect of the present invention provides a method for preparing a dual-color temperature CSP light source, comprising at least the following steps:

[0021] (1) Mixing and stirring the raw materials of the fluorescent layer to make a fluorescent film in the B-Stage state;

[0022] (2) The fluorescent film and the blue light chip are subjected to high-temperature vacuum pressing and dicing to obtain a high color temperature CSP light source and a low color temperature CSP light source respectively.

[0023] As a preferred technical solution, the temperature of the high-temperature vacuum pressing is 70-90°C, the pressure is 4-6 kN, and the time is 5-10 minutes.

[0024] Preferably, the temperature of the high-temperature vacuum pressing is 90° C., the pressure is 5 kN, and the time is 5 minutes.

[0025] Regarding the explanation of the "B-Stage state" in the present invention, the curing reaction of thermosetting resin can be divided into three stages: A / B / C:

[0026] A Stage: The resin is in the early stages of the reaction. Due to the low degree of polymerization, the molecular weight is still very low and the material is in a liquid state.

[0027] B Stage: The resin continues to react, and most of the structure is linear and partially cross-linked. The molecular weight is large enough to be semi-cured. At this stage, the material can be dissolved by specific solvents and can flow or melt at a specific temperature. The reaction of some resins is not obvious at this stage.

[0028] C Stage: This stage is the late stage of the resin reaction. The molecular structure presents a network cross-linked structure. The material can no longer be heated and melted, nor can it be dissolved by solvents. It is the final state of the material after the curing reaction. The surface is usually non-sticky and has a stable Tg.

[0029] The dual-color temperature CSP light source provided by the present invention has simple selection conditions for the fluorescent layer and the chip, and is easy to prepare and operate. It can be formed only by high-temperature vacuum pressing. The product has stable luminous performance, reduces labor costs and equipment costs, is easy to realize large-scale industrial production, and has high market promotion and application value.

[0030] Another aspect of the present invention provides an application of a dual-color temperature CSP light source, which is applied to the preparation of a full-spectrum COB. The preparation method of the dual-color temperature CSP light source is: a high color temperature CSP light source and a low color temperature CSP light source are packaged in a COB in an array in an alternating manner.

[0031] Beneficial Effects

[0032] 1. The present invention provides a dual-color temperature CSP light source. When used in COB, it does not need an additional layer of fluorescent glue to be covered, making the preparation method of COB simpler. The dual-color temperature CSP in the full-spectrum COB not only has excellent aging performance and good stability, but also has a high color rendering index and high brightness.

[0033] 2. The dual-color temperature CSP light source provided by the present invention is applied to the preparation of full-spectrum COB, which effectively solves the problem that the existing full-spectrum COB light source needs to use fluorescent glue to prepare the full-spectrum COB after the solid crystal is completed, simplifies the preparation process of the full-spectrum COB, and provides a new idea for the preparation of the full-spectrum COB.

[0034] 3. The present invention optimizes the preparation of three blue light chips with different wavelengths in low color temperature CSP light sources and high color temperature CSP light sources, and then combines the low color temperature CSP and the high color temperature CSP in COB for use, thereby realizing the preparation of full-spectrum COB products in the field of dual color temperature lighting, and can maintain the continuity and integrity of the spectrum of the full-spectrum COB, thereby making the spectrum more similar to the spectrum of the sun.

[0035] 4. The present invention optimizes the mass ratio of yellow-green phosphor and red phosphor in the fluorescent layer of high and low color temperature CSP light sources, while ensuring that the product has a high relative luminous efficiency, color rendering index and spectral width, so as to better meet the actual application needs.

[0036] 5. The dual-color temperature CSP light source provided by the present invention has simple selection conditions for the fluorescent layer and the chip, and is easy to prepare and operate. It can be formed only by high-temperature vacuum pressing. The product has stable luminous performance, reduces labor costs and equipment costs, is easy to realize large-scale industrial production, and has high market promotion and application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is the structure of the dual-color temperature CSP light source provided in Example 1, where 1 is a blue light chip and 2 is a fluorescent layer.

[0038] Figure 2 The array of high color temperature CSP light sources 1, 2, 3 and low color temperature CSP light sources 1, 2, 3 in the COB provided in Example 1 is alternating. In the figure, 1-6 correspond to high color temperature CSP light sources 1, 2, 3 and low color temperature CSP light sources 1, 2, 3 respectively.

[0039] Figure 3 Spectrum diagram of the low color temperature CSP light source provided in Examples 1-3.

[0040] Figure 4 Spectrum diagram of the high color temperature CSP light source provided in Examples 1-3.

[0041] Figure 5 Spectra of the low color temperature CSP light sources provided for Comparative Examples 1-3.

[0042] Figure 6 Spectra of the high color temperature CSP light sources provided in Comparative Examples 1-3. DETAILED DESCRIPTION

[0043] Example 1

[0044] See also Figure 1 Embodiment 1 of the present invention provides a dual-color temperature CSP light source, including a high color temperature CSP light source and a low color temperature CSP light source. Both the high color temperature CSP light source and the low color temperature CSP light source are composed of an internal blue light chip 1 and a fluorescent layer 2 wrapping the exposed surface of the chip. The blue light chip includes three blue light chips with different wavelengths of 440nm, 450nm, and 460nm.

[0045] The color temperature of the high color temperature CSP light source is 6500K. The raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 40% yellow-green fluorescent powder, 8.1% red fluorescent powder, and an encapsulant to make up the balance.

[0046] The color temperature of the low color temperature CSP light source is 2700K. The raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 55% yellow-green fluorescent powder, 17.5% red fluorescent powder, and an encapsulant to make up the balance.

[0047] The yellow-green phosphor has a wavelength of 535nm, and the red-pink phosphor has a wavelength of 650nm, both of which are sourced from Jiangsu Borui Optoelectronics Priority Co., Ltd.

[0048] The thickness of the fluorescent layer is 300 μm.

[0049] The encapsulant is an addition-type liquid silicone, specifically the LED encapsulation silicone of Guangzhou Huigu New Materials Technology Co., Ltd.

[0050] Embodiment 1 of the present invention provides a method for preparing a dual-color temperature CSP light source, comprising the following steps:

[0051] (1) Mixing and stirring the raw materials of the fluorescent layer to make a fluorescent film in the B-Stage state;

[0052] (2) The fluorescent film was subjected to high-temperature vacuum pressing and pelletizing with blue light chips with wavelengths of 440nm, 450nm and 460nm, respectively, to obtain high color temperature CSP light source 1 (6500K, 440nm blue light chip), high color temperature CSP light source 2 (6500K, 450nm blue light chip), high color temperature CSP light source 3 (6500K, 460nm blue light chip) and low color temperature CSP light source 1 (2700K, 440nm blue light chip), low color temperature CSP light source 2 (2700K, 450nm blue light chip), low color temperature CSP light source 3 (2700K, 460nm blue light chip).

[0053] The temperature of the high temperature vacuum pressing is 90° C., the pressure is 5 kN, and the time is 5 minutes.

[0054] The third aspect of the embodiment of the present invention provides an application of a dual-color temperature CSP light source, which is applied to the preparation of a full-spectrum COB. The preparation method of the dual-color temperature CSP light source is: a high color temperature CSP light source 1, 2, 3 and a low color temperature CSP light source 1, 2, 3 are packaged in an array in an alternating manner in a COB (see Figure 2 ).

[0055] Example 2

[0056] Embodiment 2 of the present invention provides a dual-color temperature CSP light source and a preparation method and application thereof. The specific implementation method is the same as that of Embodiment 1, except that the color temperature of the high color temperature CSP light source is 6500K, and the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 39% yellow-green fluorescent powder, 9.1% red powder, and an encapsulant to make up the balance. The color temperature of the low color temperature CSP light source is 2700K, and the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 54% yellow-green fluorescent powder, 18.5% red powder, and an encapsulant to make up the balance.

[0057] Example 3

[0058] Embodiment 3 of the present invention provides a dual-color temperature CSP light source and a preparation method and application thereof. The specific implementation method is the same as that of Embodiment 1, except that the color temperature of the high color temperature CSP light source is 6500K, and the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 41% yellow-green fluorescent powder, 7.1% red powder, and an encapsulant to make up the balance. The color temperature of the low color temperature CSP light source is 2700K, and the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 56% yellow-green fluorescent powder, 16.5% red powder, and an encapsulant to make up the balance.

[0059] Comparative Example 1

[0060] Comparative Example 1 of the present invention provides a dual-color temperature CSP light source and a preparation method and application thereof, and its specific implementation method is the same as that of Example 1, except that the color temperature of the high color temperature CSP light source is 6500K, and the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 20% yellow-green fluorescent powder, 9% red powder, and an encapsulant to make up the balance. The color temperature of the low color temperature CSP light source is 2700K, and the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 30% yellow-green fluorescent powder, 29% red powder, and an encapsulant to make up the balance.

[0061] Comparative Example 2

[0062] Comparative Example 2 of the present invention provides a dual-color temperature CSP light source and a preparation method and application thereof, and its specific implementation method is the same as that of Example 1, except that the color temperature of the high color temperature CSP light source is 6500K, and the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 19% yellow-green fluorescent powder, 10% red powder, and an encapsulant to make up the balance. The color temperature of the low color temperature CSP light source is 2700K, and the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 29% yellow-green fluorescent powder, 30% red powder, and an encapsulant to make up the balance.

[0063] Comparative Example 3

[0064] Comparative Example 3 of the present invention provides a dual-color temperature CSP light source and a preparation method and application thereof. The specific implementation method is the same as that of Example 1, except that the color temperature of the high color temperature CSP light source is 6500K, and the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 21% yellow-green fluorescent powder, 8% red powder, and an encapsulant to make up the balance. The color temperature of the low color temperature CSP light source is 2700K, and the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 31% yellow-green fluorescent powder, 28% red powder, and an encapsulant to make up the balance.

[0065] Performance Testing Methods

[0066] The test current was controlled to be 280 mA, and the spectrum test was performed on the products provided in the embodiments and comparative examples. The test items and test results are shown in Table 1. The spectrum diagrams of the high color temperature CSP light source and the low color temperature CSP light source in Examples 1-3 are shown in Table 1. Figure 3 , Figure 4 The spectra of the high color temperature CSP light source and the low color temperature CSP light source in Comparative Examples 1-3 are respectively shown in Figure 5 , Figure 6 .

[0067] Table 1

[0068]

[0069] By analyzing the test results in Table 1, it can be seen that the products prepared in Examples 1-3 have excellent relative luminous efficacy, color rendering index and spectral width relative to Comparative Examples 1-3.

Claims

1. A dual color temperature CSP light source, characterized in that: The high color temperature CSP light source and the low color temperature CSP light source are included. The color temperature of the high color temperature CSP light source is 6000-7000K, and the color temperature of the low color temperature CSP light source is 2000-3000K. Both the high color temperature CSP light source and the low color temperature CSP light source are composed of an internal blue light chip and a fluorescent layer wrapping the exposed surface of the chip. The blue light chip includes three different wavelength ranges of 440-445nm, 450-455nm, and 460-465nm. The blue light chip has a wavelength; the raw materials for preparing the fluorescent layer of the high color temperature CSP light source include, by mass percentage: 35-45% yellow-green phosphor, 5-15% red powder, and an encapsulant to make up the balance; the raw materials for preparing the fluorescent layer of the low color temperature CSP light source include, by mass percentage: 50-60% yellow-green phosphor, 15-20% red powder, and an encapsulant to make up the balance; the wavelength of the yellow-green phosphor is 500-540nm, and the wavelength of the red powder is 640-660nm.

2. The dual color temperature CSP light source according to claim 1, characterized in that: The thickness of the fluorescent layer is 250-400 μm.

3. A method for preparing a dual-color temperature CSP light source according to claim 2, characterized in that: At least the following steps are included: (1) Mixing and stirring the raw materials of the fluorescent layer to make a fluorescent film in a B-Stage state; (2) The fluorescent film and the blue light chip are subjected to high-temperature vacuum pressing and pelletizing to obtain a high color temperature CSP light source and a low color temperature CSP light source respectively.

4. An application of the dual color temperature CSP light source according to any one of claims 1-2, characterized in that: Applied to the preparation of full-spectrum COB, the preparation method of the dual-color temperature CSP light source is: a high color temperature CSP light source and a low color temperature CSP light source are packaged in a COB in an array alternately.

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