Ceramic matrix composite drilling device assisted by ultrasonic vibration and laser

Abstract

The application discloses an ultrasonic vibration and laser-assisted combined ceramic matrix composite material drilling device and belongs to the field of composite material processing.The device comprises a laser, a main shaft laser channel, a compressed air channel, an optical path adjusting device, an ultrasonic vibration device, a fixing device, a drill bit and the like, wherein the laser is used for emitting laser light, the laser light is incident to the optical path adjusting device through the main shaft laser channel, the optical path adjusting device and the fixing device ensure that two beams of laser light emitted after light splitting are always irradiated by a drill bit through hole on the drill bit, and the function of heating and softening workpiece material is realized; the ultrasonic vibration device makes the end of the drill bit output the main shaft rotation movement and simultaneously output a longitudinal-torsional composite ultrasonic vibration with a certain amplitude, realizes an intermittent contact cutting drilling mode, and reduces cutting force and torque; compressed air blows away cutting chips through the compressed air channel and the drill bit through hole on the drill bit; longitudinal-torsional composite ultrasonic vibration, laser-assisted processing and drilling are organically combined, the damage of the air outlet and inlet is reduced, and the processing quality is improved.

Description

Ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance Technical Field

[0001] This invention belongs to the field of composite material processing, and more specifically, relates to a ceramic matrix composite material drilling device that combines ultrasonic vibration and laser assistance. Background Technology

[0002] Ceramic matrix composites are a class of composite materials that use ceramic materials as the matrix and combine them with various fibers, whiskers, etc. The ceramic matrix can be high-temperature structural ceramics such as silicon nitride, silicon carbide, and alumina. These advanced ceramics have excellent properties such as high temperature resistance, high strength and stiffness, relatively light weight, and corrosion resistance. However, their weakness is brittleness. Under stress, they will crack and even lead to brittle fracture failure. When ceramic materials are used as the matrix and combined with high-strength, high-elasticity fibers (such as carbon fiber, silica fiber, alumina fiber, etc.), the toughness and reliability of the ceramic are improved, thus obtaining ceramic matrix composites with excellent strength and toughness. Ceramic matrix composites have many applications in temperature ranges that metals cannot withstand, including aerospace and other fields with a high demand for high-performance new materials.

[0003] Ultrasonic vibration-assisted machining is a machining method that combines ultrasonic vibration with traditional machining. It applies high-frequency ultrasonic vibration to the cutting tool or workpiece, utilizing the concentrated energy, instantaneous action, and rapid cutting characteristics of ultrasonic vibration to change the material removal mechanism and improve the machining process and effect. Ultrasonic vibration-assisted machining has unique advantages in the field of hard and brittle material machining, especially in that it can significantly reduce cutting forces, and the machining method is pulsed high-frequency vibration machining. Ultrasonic vibration-assisted machining technology has been widely used in turning, drilling, milling, and grinding of hard and brittle materials such as engineering ceramics, optical glass, single crystal silicon, cemented carbide, and composite materials.

[0004] The technical principle of laser-assisted machining is as follows: a high-energy laser beam is used as a heat source to directly heat the surface of the part, thereby increasing the surface temperature and decreasing the hardness of the material, which reduces the cutting force during machining. Therefore, laser-assisted machining technology is increasingly being used in the machining of various hard and brittle materials and other difficult-to-machine materials. For hole machining of ceramic matrix composites, at a certain relatively high temperature, laser heating assistance can effectively improve the machinability and, to some extent, improve problems such as poor machining quality, low efficiency, and high tool wear.

[0005] As a crucial component of the manufacturing and assembly process for missiles, aircraft, and other aircraft, hole machining requires guaranteed processing quality while simultaneously maximizing processing efficiency. With the increasing application of ceramic matrix composites in aerospace manufacturing, problems such as poor processing quality, low efficiency, and high tool wear have become increasingly apparent. The high hardness, wear resistance, and toughness of ceramic matrix composites make them prone to defects such as fiber breakage and pull-out, delamination at the hole exit, matrix fracture, spalling, and cracks, severely impacting manufacturing quality. Therefore, a method is needed to achieve heating and softening of ceramic matrix composites followed by intermittent vibration cutting to improve processing quality and efficiency, thereby addressing these issues to some extent. Summary of the Invention

[0006] The purpose of this invention is to solve the above-mentioned problems by providing a ceramic matrix composite drilling device that combines ultrasonic vibration and laser assistance.

[0007] A ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance, the device includes a fixing part, a spindle, a spindle mounting part 24, a drill bit 1, and an ultrasonic vibration device;

[0008] The upper part of the main shaft passes through the fixing part and is axially connected to the fixing part; the top end of the upper mounting part of the main shaft is axially connected to the lower end of the fixing part.

[0009] The lower end of the lower mounting part of the spindle is provided with a chuck to fix the drill bit 1;

[0010] The piezoelectric transducer 51 of the ultrasonic vibration device is mounted on the main shaft and is located between the upper and lower mounting parts of the main shaft.

[0011] The ultrasonic vibration device includes an ultrasonic amplitude transformer 50, a piezoelectric transducer 51, an electrical power transmission system 52, and an ultrasonic generator 53.

[0012] The ultrasonic generator 53 is mounted on the fixed part, and the piezoelectric transducer 51 and ultrasonic amplitude transformer 50 are mounted on the main shaft mounting part 24.

[0013] The drill bit 1 is a straight flute drill, and the drill bit 1 is provided with two drill bit through holes 10, which are symmetrically arranged on both sides of the transverse cutting edge 14 and between the chip removal groove 12 on the drill bit 1.

[0014] The main spindle is equipped with a main spindle laser channel 41 and an optical path adjustment device 3. The main spindle laser channel 41 is located at the center of the main spindle, and the optical path adjustment device 3 is located below the main spindle laser channel 41 and above the drill bit 1. The laser emitted by the laser 6 changes direction after passing through the optical path adjustment device 3 and enters the drill bit through hole 10 of the drill bit 1, irradiating the workpiece to be processed.

[0015] The lens box of the optical path adjustment device 3 is a cuboid, and is provided with a laser inlet 300, a first reflector 301, a second reflector 302, a third reflector 303, a beam splitter 304, a first laser outlet 305, and a second laser outlet 306. The laser emitted by the laser 6 enters the optical path adjustment device 3 through the main spindle laser channel 41 from the laser inlet 300, is reflected by the first reflector 301 to the second reflector 302, and then reflected to the beam splitter 304. Half of the laser is distributed to the first laser outlet 305, and the other half of the laser is reflected to the third reflector 303 and then reflected to the second laser outlet 306, and then enters the two drill through holes 10 of the drill bit 1 respectively.

[0016] The bottom of the lens box of the optical path adjustment device 3 is sealed with a transparent material;

[0017] The compressed air channel (42) is located around the spindle laser channel (41), and the compressed air port 31, the compressed air channel (42), and the compressed air port 31 are connected to the drill bit through hole 10.

[0018] This invention provides a drilling device for ceramic matrix composites that combines ultrasonic vibration and laser assistance. It organically integrates laser heating assistance, longitudinal-torsional ultrasonic vibration, and spindle rotary drilling. In this invention, the laser heats the area to be processed through a drill bit through-hole on the cutting tool. Even with the combined rotational motion from the spindle and the longitudinal-torsional motion from the ultrasonic vibration device, the laser can still exit through the drill bit through-hole via an optical path adjustment device. This reduces the hardness of the ceramic matrix composite workpiece and decreases drilling force and torque. This processing device improves processing quality while maintaining processing efficiency and reducing tool wear, thus addressing the problem of difficult machining of ceramic matrix composites as hard and brittle materials to a certain extent.

[0019] Compared with existing technologies, the following beneficial technical effects have been achieved:

[0020] 1. This invention combines ultrasonic vibration-assisted machining with laser heating-assisted machining. Based on the existing ultrasonic vibration-assisted hole machining technology for ceramic matrix composites, laser heating is added to soften the ceramic matrix composite material to be machined, further reducing cutting force and torque, increasing tool life, and solving the problem of edge chipping at the hole entry and exit of ceramic matrix composites to a certain extent.

[0021] 2. The drill bit 1 in this invention is a straight flute drill with two through holes 10 extending from front to back, which can ensure that the laser heating of the workpiece can be achieved without affecting the cutting process.

[0022] 3. In this invention, the laser beam can be split into two beams by adjusting the reflector and beam splitter 304 in the optical path adjustment device 3, so that the laser beam entering from the center can be aligned with the drill through hole 10 on the drill bit 1. Moreover, no matter what position the drill bit 1 moves to, the laser beam can be guaranteed to be emitted from the drill through hole 10 on the drill bit 1.

[0023] 4. The present invention includes a compressed air inlet 7, a compressed air channel 42, a compressed air port 31 on the optical path adjustment device 3 and a drill through hole 10 on the drill bit 1. Compressed gas is introduced through the compressed air inlet 7 to remove the chips generated by cutting without interfering with the laser, thus preventing debris and dust from interfering with the optical path. Attached Figure Description

[0024] Figure 1 is a schematic diagram of the ceramic matrix composite drilling device that combines ultrasonic vibration and laser assistance in this invention.

[0025] Figure 2 is a schematic diagram of the drill bit structure in this invention;

[0026] Figure 3 is a bottom view of the structure of the optical path adjustment device in this invention;

[0027] Figure 4 is a schematic diagram of the compressed air inlet in this invention;

[0028] Figure 5 is a schematic diagram of the process of the drill bit drilling the workpiece in this invention;

[0029] Figure 6 is a schematic diagram of the transmission gear of the present invention;

[0030] Figure 7 is a schematic diagram of the power transmission system in the ultrasonic vibration device of the present invention;

[0031] Figure 8 is a top view of the ER clamping head in the clamping device of the present invention;

[0032] Figure 9 is a schematic diagram of the compressed air circulation process of the present invention.

[0033] In the diagram: 1-Drill bit, 10-Drill bit through hole, 11-Locking pin, 12-Chip groove, 13-Cutting edge, 14-Chisel edge, 21-ER chuck, 210-ER chuck slot, 22-ER nut, 23-Set screw, 24-Spindle mounting part, 25-Wire hole, 3-Optical path adjustment device, 300-Laser inlet, 301-First reflector, 302-Second reflector, 303-Third reflector, 304-Beam splitter, 305-First laser outlet, 306-Second laser outlet, 307-Balance block, 31-Compression 32-Air inlet, 33-Locking recess, 34-Sealing rubber ring, 41-Main spindle laser channel, 42-Compressed air channel, 50-Ultrasonic amplitude transformer, 51-Piezoelectric transducer, 52-Power transmission system, 520-Primary magnetic core, 521-Primary coil, 522-Secondary coil, 523-Secondary magnetic core, 53-Ultrasonic generator, 6-Laser, 7-Compressed air inlet, 70-Air seal ring, 71-Compressed air inlet center hole, 8-Transmission gear, 90-Tap roller bearing, 91-Thrust ball bearing. Detailed Implementation

[0034] The purpose of this invention is to provide a ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance to solve the problems existing in the prior art. To make the above-mentioned objectives, features, and advantages of this invention more apparent and understandable, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Furthermore, in the description of this invention, the X-axis in the drawings represents the vertical direction and is designated as the front-to-back position, with the positive direction of the X-axis representing the front and correspondingly, the negative direction of the X-axis representing the rear.

[0035] As shown in Figure 1, a ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance is described. The device includes a fixing part, a spindle, a spindle mounting part 24, a drill bit 1, and an ultrasonic vibration device. Specifically:

[0036] As shown in Figure 6, the transmission gear 8 can be connected to a power source such as a motor through transmission components such as gears and belts, so that the main shaft can rotate as a whole.

[0037] As shown in Figure 1, the fixed part and the main shaft mounting part 24 are connected by a pair of two tapered roller bearings 90 and a thrust ball bearing 91, which serves to link the main shaft and the fixed part. The outer ring of the tapered roller bearing 90 is fixed on the fixed part, and the inner ring is fixed on the main shaft mounting part 24. The inner ring rotates with the main shaft. The two tapered roller bearings 90 adopt a back-to-back bearing configuration, which can simultaneously bear radial load and bidirectional axial load. The seat ring of the thrust ball bearing 91 is fixed on the fixed part, and the shaft ring is fixed on the main shaft mounting part 24. The shaft ring rotates with the main shaft. The thrust ball bearing 91 can withstand the axial load caused by the vibration of the piezoelectric transducer 51.

[0038] The laser 6 is fixed on the fixed part, and the laser outlet on the laser 6 is set at the center of the rear of the spindle, so that the laser emitted by the laser 6 enters the central hole 71 of the compressed air inlet along the rotation axis of the spindle. The laser plays the role of auxiliary heating and softening of the material. Therefore, the laser emission power of the laser 6 is less than 100W. The specific power should be determined by the processing material, etc.

[0039] The spindle laser channel 41 is a rigid rubber tube with a slight elasticity. There is a sealing ring on the outer edge of the front. The spindle laser channel 41 is fixed in the middle of the compressed air channel 42 and connected to the compressed air inlet 7 at the rear. It is fixed in the center hole 71 of the compressed air inlet. The buckle 33 on the optical path adjustment device 3 locks the sealing ring at the front of the spindle laser channel 41, so that the spindle laser channel 41 is connected to the periphery of the laser inlet 300 on the optical path adjustment device 3. The laser emitted from the laser 6 enters the laser inlet 300 on the optical path adjustment device 3 through the spindle laser channel 41.

[0040] As shown in Figure 3, the optical path adjustment device 3 is a structure integrating the functions of adjusting the laser optical path, supplying compressed air, and positioning and fixing. It includes a lens box, a compressed air port 31, a locking recess 32, a buckle 33, and a sealing rubber ring 34. The lens box is used to adjust the laser optical path. Looking along the axial direction, the lens box is in the middle of the optical path adjustment device 3, and the compressed air ports 31 are on both sides. The rear of the optical path adjustment device 3 is connected to the spindle laser channel 41 and the compressed air channel 42 via the buckle 33. Two locking recesses 32 are provided in the middle of the side of the outer shell of the optical path adjustment device 3. The set screw 23 is screwed into the screw hole at the front end of the spindle mounting part 24. The tip of the set screw 23 presses against the bottom of the locking recess 32 and is tightened, thereby fixing the optical path adjustment device 3 to the front end of the spindle mounting part 24 by the set screw 23, thus positioning the optical path adjustment device 3. The sealing rubber ring 34 is provided at the front of the optical path adjustment device 3 and is pressed together with the rear end of the drill bit 1 to seal the front end of the compressed air port 31 and the rear end of the drill bit 1 to prevent compressed air leakage.

[0041] The lens box in the optical path adjustment device 3 is a completely enclosed structure. Externally, it includes a laser inlet 300, a first laser outlet 305, and a second laser outlet 306. The first laser outlet 305 and the second laser outlet 306 are symmetrically arranged along the rotation axis. The laser inlet 300, the first laser outlet 305, and the second laser outlet 306 are all equipped with flat mirrors to isolate them from the outside and prevent compressed air from affecting the optical path. Internally, the lens box includes a first reflector 301, a second reflector 302, a third reflector 303, a beam splitter 304 with a ratio of 50:50, and a balance block 307. The lens box ensures that the laser can enter the laser inlet 300 along the rotation axis regardless of the spindle's rotation position, and can exit from the first laser outlet 305 and the second laser outlet 306, which are symmetrical with respect to the rotation axis, and illuminate the two drill through holes 10 on the drill bit 1. The balance block 307 ensures that the mass of the lens box is the same on both sides of the rotation axis, ensuring that the spindle maintains dynamic balance during machining rotation around the rotation axis.

[0042] As shown in Figure 3, inside the lens box, the first reflector 301 is positioned in front of the laser inlet 300, the second reflector 302 is positioned on the radial side of the first reflector 301 and behind the first laser outlet 305, the beam splitter 304 is positioned in front of the second reflector 302 and behind the first laser outlet 305, and the third reflector 303 is positioned symmetrically with respect to the axis of rotation of the beam splitter 304 and behind the second laser outlet 306; all four lenses are arranged at an angle of 45°; the first reflector 301 and the second reflector 302 are tilted in the same direction, the second reflector 302 and the beam splitter 304 are tilted in opposite directions, and the beam splitter 304 and the third reflector 303 are tilted in the same direction;

[0043] The laser beam passes through the main spindle laser channel 41 and enters the laser inlet 300 from the rear along the rotation axis. After being reflected 90° by the first reflector 301, it shines radially to the side onto the second reflector 302. After being reflected 90° by the second reflector 302, it shines forward onto the beam splitter 304 and is split into two laser beams in a 50:50 ratio. 50% of the laser beam that hits the beam splitter 304 is split and transmitted forward, exiting from the first laser outlet 305 and illuminating the drill bit through hole 10. The other 50% of the laser beam that hits the beam splitter 304 is split and reflected by the beam splitter 304 and shines radially along the rotation axis onto the third reflector 303. After being reflected 90° by the third reflector 303, it shines forward from the second laser outlet 306 and illuminating the drill bit through hole 10.

[0044] As shown in Figure 4, the compressed air inlet 7 is fixed on the fixed part and does not rotate with the spindle. The front part of the compressed air inlet 7 is inserted into the compressed air channel 42. The compressed air channel 42 rotates with the spindle, and compressed air enters the compressed air channel 42 from the side inlet of the compressed air inlet 7. The front end of the compressed air inlet 7 and the compressed air channel 42 are sealed with three sets of six air sealing rings 70 to prevent compressed air leakage. The compressed air inlet 7 is provided with a central hole 71 so that the laser can enter the laser channel 41 of the spindle.

[0045] The compressed air channel 42 is a rigid rubber tube with a slight elasticity. There is a sealing ring on the outer edge of the front. The compressed air channel 42 is fixed around the spindle laser channel 41 and connected to the compressed air inlet 7 at the rear. The buckle 33 on the optical path adjustment device 3 locks the sealing ring at the front of the compressed air channel 42, so that the compressed air channel 42 is connected to the outer periphery of the compressed air port 31 on the optical path adjustment device 3.

[0046] As shown in Figure 9, compressed air is introduced into the compressed air channel 42 from the compressed air inlet 7. The compressed air enters the compressed air port 31 on the optical path adjustment device 3 through the compressed air channel 42, and finally enters the drill bit through hole 10 on the drill bit 1, which plays the role of blowing away chips and keeping the optical path clean.

[0047] As shown in Figure 1, the ultrasonic vibration device includes an ultrasonic generator 53, an electrical power transmission system 52, a piezoelectric transducer 51, and an ultrasonic amplitude transformer 50. The ultrasonic generator 53 is fixed on the fixed part, the front end of the piezoelectric transducer 51 is connected to the rear end of the ultrasonic amplitude transformer 50, and the rear end of the piezoelectric transducer 51 and the front end of the ultrasonic amplitude transformer 50 are fixed to the spindle mounting part 24. The piezoelectric transducer 51 and the ultrasonic amplitude transformer 50 rotate together with the spindle. The ultrasonic generator 53 converts 220V or 380V AC power into ultrasonic frequency electrical signals. The ultrasonic frequency electrical signals are transmitted from the ultrasonic generator 53 located on the fixed part to the piezoelectric transducer 51 fixed to the spindle through the electrical power transmission system 52. The piezoelectric transducer 51 then converts the ultrasonic frequency electrical signals into mechanical vibration. Finally, the ultrasonic amplitude transformer 50 amplifies the mechanical vibration and outputs a longitudinal torsional composite ultrasonic vibration with a certain amplitude at the front end of the drill bit 1. The specific frequency and amplitude of the ultrasonic amplitude transformer 50 vibrating due to the piezoelectric transducer 51 are determined by the processing material, etc.

[0048] As shown in Figure 7, the power transmission system 52: During the machining process, the tool rotates with the spindle, while the ultrasonic generator 53 is a fixed device. To efficiently and stably transmit the ultrasonic frequency electrical signal to the rotating moving part, a non-contact power transmission system 52 based on the principle of electromagnetic induction can be used to transmit the ultrasonic frequency electrical signal. The power transmission system 52 mainly consists of a primary side and a secondary side. The primary side magnetic core 520 and the primary side coil 521 are connected to the fixed part to receive the ultrasonic frequency electrical signal from the ultrasonic generator 53. The secondary side coil 522 and the secondary side magnetic core 523 are connected to the spindle mounting part 24. The primary side magnetic core 520 and the primary side coil 521, and the secondary side coil 522 and the secondary side magnetic core 523 are all arc-shaped. As shown in Figure 1, a wire hole 25 is provided on the spindle mounting part 24 between the secondary side magnetic core 523 and the piezoelectric transducer 51, so that the secondary side of the power transmission system 52 transmits the ultrasonic frequency electrical signal to the piezoelectric transducer 51 while rotating with the spindle.

[0049] As shown in Figure 2, drill bit 1 is a straight flute drill made of cemented carbide. It includes two drill bit through holes 10, two locating pins 11, two chip removal grooves 12, two cutting edges 13, and a chisel edge 14. The two drill bit through holes 10 penetrate the front and back of drill bit 1 and are symmetrically arranged on both sides of the chisel edge 14 and between the chip removal grooves 12. The laser is emitted from the drill bit through holes 10 to heat the material to be processed in the area behind the rotation direction of drill bit 1, softening the material and reducing its hardness, making it easier for the cutting edges 13 to cut the material. The chips generated by the cutting edges 13 are discharged from the chip removal grooves 12 in front of the rotation direction of drill bit 1. Compressed air is blown out from the drill bit through holes 10 to blow away the chips behind the rotation direction of drill bit 1, so that the chips are discharged from the chip removal grooves 12, preventing chips from entering the drill bit through holes 10 and affecting the laser beam path. The chisel edge 14 plays a centering role during drilling to prevent the hole diameter from being too large or the hole from being misaligned.

[0050] As shown in Figures 1 and 8, for the positioning and installation of drill bit 1, drill bit 1 is inserted into ER chuck 21. After aligning the positioning pin 11 on drill bit 1 with the ER chuck slot 210, drill bit 1 is inserted into ER chuck 21, thereby aligning the first laser outlet 305 and the second laser outlet 306 on optical path adjustment device 3 with the drill bit through hole 10 on drill bit 1. The rear end of drill bit 1 is pressed against the sealing rubber ring 34 on optical path adjustment device 3. Finally, ER nut 22 is tightened to fix the front end of spindle mounting part 24, the front end of optical path adjustment device 3 and the rear end of drill bit 1 together.

[0051] As shown in Figure 5, when the combined rotational motion from the spindle and the longitudinal-torsional motion from the ultrasonic vibration device are combined, the laser can heat the area to be processed through the drill bit through hole 10 on the drill bit 1, thereby reducing the hardness of the ceramic matrix composite workpiece to be processed, reducing the drilling force and torque, and reducing tool wear.

Claims

1. A ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance, characterized in that: It includes a fixed part, a main spindle, a main spindle mounting part (24), a drill bit (1), and an ultrasonic vibration device; the main spindle mounting part (24) is divided into an upper mounting part and a lower mounting part; the upper part of the main spindle passes through the fixed part and is axially connected to the fixed part, and the top end of the upper mounting part of the main spindle is axially connected to the lower end of the fixed part; the lower end of the lower mounting part of the main spindle is provided with a chuck to fix the drill bit (1); the piezoelectric transducer (51) of the ultrasonic vibration device is mounted on the main spindle and is located between the upper mounting part and the lower mounting part of the main spindle; the ultrasonic waves of the ultrasonic vibration device... The generator (53) is mounted on the fixed part and is electrically connected to the piezoelectric transducer (51) through the power transmission system (52); the piezoelectric transducer (51) is equipped with an ultrasonic amplitude transformer (50); the drill bit (1) is a straight flute drill, and the drill bit (1) is provided with drill bit through holes (10), there are two drill bit through holes (10), which are symmetrically arranged on both sides of the transverse cutting edge (14) and between the chip removal groove (12) on the drill bit (1); the spindle is equipped with a spindle laser channel (41) and an optical path adjustment device (3), and the spindle laser channel (41) is located on the... At the center of the spindle, the optical path adjustment device (3) is located below the laser channel (41) of the spindle and above the drill bit (1). The laser emitted by the laser (6) changes direction after passing through the optical path adjustment device (3) and enters the drill bit through hole (10) of the drill bit (1), irradiating the workpiece to be processed. The lens box of the optical path adjustment device (3) is a cuboid, equipped with a laser inlet (300), a first reflector (301), a second reflector (302), a third reflector (303), a beam splitter (304), and a first laser outlet. The laser emitted by the laser (6) passes through the main spindle laser channel (41), enters the optical path adjustment device (3) from the laser inlet (300), is reflected by the first reflector (301) to the second reflector (302), and then reflected to the beam splitter (304). Half of the laser is distributed to the first laser outlet (305), and the other half of the laser is reflected to the third reflector (303), and then reflected to the second laser outlet (306), and enters the two drill through holes (10) of the drill bit (1) respectively.

2. The ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance according to claim 1, characterized in that: The spindle is provided with a compressed air port (31) and a compressed air channel (42), which are connected to the drill bit through hole (10).

3. The ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance according to claim 2, characterized in that: The bottom of the lens box of the optical path adjustment device (3) is sealed with transparent material.

4. The ceramic matrix composite drilling device combining ultrasonic vibration and laser assistance according to claim 3, characterized in that: The compressed air channel (42) is located around the spindle laser channel (41).

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