Double-layer heterogeneous medium modular high-performance thermal storage device and its control method

Abstract

This invention relates to the field of thermal storage device technology, and particularly to a dual-layer, heterogeneous medium modular high-performance thermal storage device and its control method. The device includes: an inner high-temperature thermal storage medium for storing the target volume of heat; an outer medium-low temperature thermal storage medium for heat exchange with the inner high-temperature thermal storage medium; a temperature gradient control interlayer disposed between the inner and outer thermal storage media to control the heat transfer efficiency between the two layers; a thermal insulation layer disposed outside the outer medium-low temperature thermal storage medium to insulate against external ambient temperature; and at least two heat transfer devices for heating the inner high-temperature thermal storage medium and the outer medium-low temperature thermal storage medium to supply heat to the target external heating pipeline, thereby meeting the target thermal storage and heating needs. This solves the problems of existing thermal storage devices that use a single substance for heat storage, have high performance requirements for the outer insulation material, high construction costs, and are not conducive to directly supplying heat to low-temperature operating loads.

Description

Technical Field

[0001] This invention relates to the field of thermal energy storage technology, and in particular to a dual-layer heterogeneous medium modular high-performance thermal energy storage device and its control method. Background Technology

[0002] From the perspective of the thermal storage devices themselves, existing devices often use a single material as the storage medium, which can be broadly divided into low-temperature thermal storage media represented by water and high-temperature thermal storage media represented by sand, molten salt, etc. Thermal storage devices using water as the medium operate at relatively low temperatures, and the stored heat is basically only suitable for low-temperature applications such as residential heating, limiting their uses, especially during the non-heating season. While media such as sand and molten salt can provide higher operating temperatures, the high temperatures place higher demands on the performance of the outer insulation material, reducing the operating efficiency of the thermal storage system and increasing construction costs, which is not conducive to large-scale promotion and application. Furthermore, using a single high-temperature medium also places higher demands on the heat exchange system, making it unsuitable for directly supplying heat to low-temperature loads.

[0003] From the perspective of energy storage serving the power system, the commonly used electrochemical energy storage devices are expensive and subject to low-temperature degradation, making them unsuitable for large-scale application in cold regions. Pumped storage is also limited by geographical conditions and cannot be deployed on a large scale. Summary of the Invention

[0004] This invention provides a dual-layer heterogeneous medium modular high-performance thermal storage device and its control method to solve the problems of existing thermal storage devices that use a single material for thermal storage, have high requirements for the performance of the outer insulation material, have high construction costs, and are not conducive to directly supplying heat to thermal loads under low-temperature conditions.

[0005] A first aspect of this invention provides a dual-layer, heterogeneous medium modular high-performance thermal storage device, comprising: an inner high-temperature thermal storage medium, disposed in the innermost layer, for storing a target volume of heat; a temperature gradient control interlayer, disposed outside the inner high-temperature thermal storage medium and fully enclosing it, for controlling the heat transfer efficiency between the inner and outer thermal storage media; and an outer low-temperature thermal storage medium, disposed outside the temperature gradient control interlayer and fully enclosing it, for controlling the heat transfer efficiency between the inner and outer thermal storage media; and an outer medium-low temperature thermal storage medium, disposed outside the temperature gradient control interlayer and fully enclosing it, for controlling the heat transfer efficiency between the inner and outer thermal storage media. A gradient control interlayer exchanges heat with the inner high-temperature heat storage medium; a heat insulation layer is disposed outside the outer low-temperature heat storage medium and completely encloses it to isolate it from the external ambient temperature; at least two heat transfer devices are respectively disposed in the inner high-temperature heat storage medium and the outer low-temperature heat storage medium, and are connected to the target external heating pipeline through a preset pipeline to heat the inner high-temperature heat storage medium and the outer low-temperature heat storage medium, and to supply heat to the target external heating pipeline to meet the target heat storage and heating needs.

[0006] Optionally, the inner high-temperature heat storage medium is made of at least one of the following: a non-flammable and inert solid material, a material that can be heated to at least 1200°C and will not chemically react with or melt with air.

[0007] Optionally, the interior of the temperature gradient control interlayer is filled with an inert gas as a heat-conducting medium.

[0008] Optionally, the heat insulation layer uses a low thermal conductivity material of a preset thickness, which is determined according to the actual deployment scenario and the temperature range of the low-temperature heat storage medium in the outer layer.

[0009] Optionally, each heat transfer device includes a gas circuit consisting of at least one stainless steel pipe, a preset medium, a fan, and an electric heating device, wherein the preset medium, the fan, and the electric heating device are all disposed inside the gas circuit.

[0010] Optionally, a heating valve is provided on the gas circuit consisting of at least one stainless steel pipe, and the heating valve is connected to the electric heating equipment.

[0011] A second aspect of the present invention provides a control method for a dual-layer heterogeneous medium modular high-performance thermal storage device, comprising the following steps: obtaining actual operating conditions, wherein the actual operating conditions include thermal storage requirements and heating requirements; when the actual operating conditions require thermal storage, evacuating the temperature gradient control jacket to a vacuum state, closing the heating valve, and turning on the electric heating equipment to heat the inner high-temperature thermal storage medium and the outer low-temperature thermal storage medium until the target volume of heat is stored; when the actual operating conditions require heating, injecting inert gas into the temperature gradient control jacket, opening the heating valve, and turning off the associated electric heating equipment, so that the heat of the inner high-temperature thermal storage medium is transferred to the outer low-temperature thermal storage medium, and heat is supplied to the target external heating pipeline through a stainless steel pipe until the target volume of heat is exhausted.

[0012] A third aspect of the present invention provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the control method for the dual-layer heterogeneous medium modular high-performance thermal storage device as described in the above embodiments.

[0013] A fourth aspect of the present invention provides a computer program product, wherein when the computer program / instructions are executed by a processor, the control method of the above-described dual-layer heterogeneous medium modular high-performance thermal storage device is implemented.

[0014] A fifth aspect of the present invention provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the control method of the dual-layer heterogeneous medium modular high-performance thermal storage device described above.

[0015] The dual-layer heterogeneous medium modular high-performance thermal storage device and its control method proposed in this invention select materials such as steel balls or concrete as the inner thermal storage medium based on cost and material properties. These materials undertake the core thermal storage task, have strong thermal storage capacity, and reduce construction costs. At the same time, since the outer medium can be flexibly selected from insulating materials with higher heat exchange efficiency and certain heat storage capacity, the application scenarios of the constructed thermal storage device are also highly flexible. The outer medium does not need to be in direct contact with the high-temperature thermal storage medium, so the direct heat loss of the inner medium is zero. The temperature gradient control of the interlayer creates a natural temperature gradient inside the thermal storage system, improving thermal storage efficiency. The transition from the high temperature of the inner layer to the medium and low temperature of the outer layer solves the problems of limited application scenarios and poor thermal storage capacity of low-temperature thermal storage, while avoiding the problems of high requirements and high costs for insulation materials in high-temperature energy storage. Both the inner and outer layers adopt a modular design, which can be flexibly replaced as needed. This ensures that the constructed energy storage device can be applied to various heating needs in different seasons and regions, which is conducive to large-scale promotion and application in areas with heat load demand.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 This is a schematic diagram of the structure of a dual-layer heterogeneous medium modular high-performance thermal storage device provided in an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the specific structure of a dual-layer heterogeneous medium modular high-performance thermal storage device provided in an embodiment of the present invention;

[0020] Figure 3 This is a heating diagram based on a building heating load, provided as an embodiment of the present invention.

[0021] Figure 4 A flowchart illustrating a control method for a dual-layer heterogeneous medium modular high-performance thermal storage device provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the electronic device provided in an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1-Inner high-temperature heat storage medium, 2-Temperature gradient control interlayer, 3-Outer medium and low temperature heat storage medium, 4-Insulation layer, 5-Heat transfer equipment, 51-Gas circuit, 52-Electric heating equipment, 53-Heating valve, 6-Primary heating network and 7-Secondary heating network. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0026] The following description, with reference to the accompanying drawings, describes a dual-layer heterogeneous medium modular high-performance thermal storage device and its control method according to embodiments of the present invention.

[0027] Figure 1 This is a schematic diagram of the structure of the dual-layer heterogeneous medium modular high-performance thermal storage device provided in an embodiment of the present invention.

[0028] like Figure 1As shown, the dual-layer heterogeneous medium modular high-performance thermal storage device includes: an inner high-temperature thermal storage medium 1, a temperature gradient control interlayer 2, an outer medium-low temperature thermal storage medium 3, a thermal insulation layer 4, and at least two heat transfer devices 5.

[0029] The system comprises the following components: an inner high-temperature heat storage medium 1, located at the innermost layer, for storing the target volume of heat; a temperature gradient control interlayer 2, located outside and completely enclosing the inner high-temperature heat storage medium 1, for controlling the heat transfer efficiency between the two layers; and an outer low-temperature heat storage medium 3, located outside and completely enclosing the temperature gradient control interlayer 2, for heat exchange with the inner high-temperature heat storage medium 1 via the temperature gradient control interlayer 2; and a thermal insulation layer 4, located outside and completely enclosing the outer low-temperature heat storage medium 3, for isolating it from the external ambient temperature. At least two heat transfer devices 5 are respectively installed in the inner high-temperature heat storage medium 1 and the outer low-temperature heat storage medium 3, and connected to the target external heating pipeline via pre-set pipes, for heating the inner high-temperature heat storage medium 1 and the outer low-temperature heat storage medium 3, and supplying heat to the target external heating pipeline to meet the target heat storage and heating needs.

[0030] In some embodiments, the inner high-temperature heat storage medium 1 is made of at least one of a non-flammable and inert solid material, a material that can be heated to at least 1200°C and will not chemically react with or melt with air.

[0031] Specifically, the inner high-temperature heat storage medium 1 can be made of non-flammable and inert solid material, or a material that can be heated to at least 1200°C without undergoing a significant chemical reaction or melting with air, or a mixture of any materials that meet the above requirements.

[0032] The heat storage capacity of the inner high-temperature heat storage medium 1 is defined by the amount of heat that can be stored per unit volume of material when the temperature rises by one degree Celsius. That is, the total volume of the inner heat storage medium can be flexibly selected according to the required total heat storage capacity. The specific calculation method is as follows:

[0033] Thermal storage capacity = specific heat capacity * density (unit: kJ / m³) 3 ℃)

[0034] Among common materials, iron (3540kJ / m³) is one that meets the requirements and is relatively inexpensive. 3 ℃), concrete (1940~2716kJ / m 3 (℃). Considering that a sphere has the smallest surface area for the same volume, the recommended shape for high-temperature solid heat storage media is spherical to minimize heat loss. If a precise sphere cannot be achieved, it should be as close as possible to shapes with a smaller surface area per unit volume, such as ellipsoids or cylinders.

[0035] In some embodiments, the interior of the temperature gradient control interlayer 2 is filled with an inert gas as a heat-conducting medium.

[0036] Specifically, this embodiment of the invention adopts a double-layer heat storage structure with an outer layer enclosing an inner layer. A temperature gradient control interlayer 2 is placed in the gap between the two heat storage media and is responsible for controlling the heat transfer between the inner and outer heat storage media. The temperature gradient control interlayer 2 can be filled with nitrogen or other inert gases as heat conduction media, and the heat transfer efficiency between the inner and outer layers is controlled by controlling the gas density. When the device is in heating mode, high-density gas is injected into the interlayer, and the heat stored in the inner heat medium is accelerated to be transferred to the outer layer. When the device is in heat storage mode, the interlayer is in a near-vacuum state, and the inner heat medium hardly transfers heat to the outer layer. The outer medium is at a lower temperature to reduce heat loss caused by heat transfer to the environment.

[0037] In some embodiments, the low-temperature heat storage medium 3 in the outer layer is responsible for heat exchange with the heat load at a suitable temperature, and also has a certain heat storage function.

[0038] Specifically, the low-temperature heat storage medium 3 in the outer layer can be selected from conventional heat storage materials such as molten salt, concrete, sand, and water, provided that it can transfer heat to the high-temperature heat storage medium 1 in the inner layer. For example, if the embodiment of the present invention is mainly responsible for providing heating to residents, then liquid low-temperature heat storage medium such as water is preferred, which can facilitate heat exchange with the heating network through a heat exchange station.

[0039] In some embodiments, the thermal insulation layer 4 is made of a low thermal conductivity material of a preset thickness, which is determined according to the actual deployment scenario and the temperature range of the low-temperature heat storage medium 3 in the outer layer.

[0040] Specifically, the thermal insulation layer 4 in this embodiment of the invention is mainly composed of materials with low thermal conductivity, such as expanded clay or other non-combustible materials with low thermal conductivity (less than 0.3 W / mK). The thickness of the thermal insulation layer 4 depends on the actual deployment scenario and the temperature range of the low-temperature heat storage medium 3 in the outer layer. In specific situations, in addition to directly utilizing high-performance insulation materials for heat preservation, this device can also improve heat storage efficiency by increasing the external ambient temperature of this embodiment of the invention (heat storage device). To this end, the (semi-)natural environment provided by the natural zero-cost insulation materials of (semi-)underground shelters and (semi-)mountain caves can be utilized to ensure that the external ambient temperature is not too low. For example, the heat storage device can be designed as an underground cylinder and an above-ground hemisphere, with the two seamlessly connected. The insulation material of the underground cylindrical heat storage part can be relatively thinner, and the insulation material of the above-ground hemisphere heat storage part can be relatively thicker. For the above-ground hemispherical heat storage section, if it is in the field or the site permits, a certain specification of insulated kiln can be built to cover it (the insulated kiln can also serve as a site for the installation, maintenance, pipeline layout and extension of the main equipment).

[0041] In some embodiments, each heat transfer device 5 includes a gas circuit 51 composed of at least one stainless steel pipe, a preset medium, a fan, and an electric heating device 52, all of which are disposed inside the gas circuit 51.

[0042] In some embodiments, a heating valve is provided on the stainless steel pipe, and the heating valve is connected to an electric heating device.

[0043] Specifically, such as Figure 2 As shown, in this embodiment of the invention, each heat transfer device 5 consists of a gas circuit 51 composed of at least one stainless steel pipe. Each stainless steel pipe is equipped with a fan and an electric heating device 52. Each stainless steel pipe is equipped with a heating valve 53, which is connected to the electric heating device 52, so that the heating valve 53 and the electric heating device 52 are linked. When the heating valve is closed, the electric heating device 52 is turned on; when the heating valve is turned on, the electric heating device 52 is turned off. In addition, each stainless steel pipe is preferably arranged vertically through the inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3. Horizontal or angled arrays are also possible, and can be selected according to actual needs.

[0044] Furthermore, the electric heating device 52 is responsible for converting electrical energy into heat energy and storing it in the inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3. At least one electric heating device is present in both the inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3, and they are evenly distributed within each medium to ensure that the heat storage medium is heated as uniformly as possible during heat storage operations. The specific number depends on the size of the heat storage device. The electric heating device 52 can be composed of a resistance temperature detector (RTD), a thermocouple, or a thermoelectric electrode.

[0045] When in heat storage mode, the electric heating device 52 heats the preset medium in the stainless steel pipe with electric energy. The preset medium is preferably an inert gas such as nitrogen. If necessary, the pressure of the gas circuit 51 can be changed or the fan can be turned on to circulate the preset medium in the gas circuit 51, so that the preset medium is heated evenly, thereby increasing the heat transfer rate without excessively increasing the gas flow rate.

[0046] Taking the electric heating device 52 constructed with resistance wire as an example, the heat storage process is as follows:

[0047] Q e =I 2 Rt(1)

[0048] In the formula, Q e I represents the heat energy produced by the electric heating device per unit time, R represents the current flowing through the electric heating device, and t represents the resistance of the resistance wire.

[0049] The heat transfer efficiency from the resistance wire to the inner high-temperature heat storage medium 1 and the outer low-temperature heat storage medium 3 is η1, assuming that the inner high-temperature heat storage medium 1 and the outer low-temperature heat storage medium 3 are heated uniformly.

[0050] The inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3 increase in temperature ΔT per unit time up The calculation method is as follows:

[0051]

[0052] In the formula, V s ρ s C s These represent the volume, density, and specific heat capacity of the heat storage medium, respectively.

[0053] When in heating mode, the heat transfer equipment arranged in the outer low-temperature heat storage medium 3 also undertakes the task of supplying heat to the target heat load. The opening and closing of the heating valve 53 controls whether to supply heat to the outside. When the valve is open, the electric heating device is turned off, and the preset medium in the gas circuit 51 of the outer low-temperature heat storage medium 3 enters the preset external heating pipeline through the heating valve 53 to release heat to the heat load. After releasing heat, the low-temperature gas flows back to the outer low-temperature heat storage medium 3. The interlayer 2 is heated again by the inner high-temperature heat storage medium 1 through temperature gradient control. This process is repeated to achieve the heating mode.

[0054] To ensure a reasonable distribution of heat between the low-temperature heat storage medium 3 in the outer layer and the high-temperature heat storage medium 1 in the inner layer to form a temperature gradient, and to control the temperature of the low-temperature heat storage medium 3 in the outer layer within a reasonable range (meeting heating requirements while maximizing heat storage efficiency), this embodiment of the invention achieves the above requirements by controlling the gas density in the gap between the interlayer 2 by controlling the temperature gradient. The specific process is as follows:

[0055] The gaseous state in the gap of the temperature gradient-controlled interlayer 2 can be regarded as static, and the total heat transferred between the low-temperature heat storage medium 3 in the outer layer and the high-temperature heat storage medium 1 in the inner layer per unit time is considered. The method is thermal radiation heat Composed of heat conduction and heat formation

[0056]

[0057] The specific calculation method is as follows:

[0058]

[0059] In the formula, k represents the thermal conductivity of the gas filling the air gap, which is positively correlated with the gas density. The specific value is usually obtained through experimental fitting. T in T outdenoted by , respectively, are the temperatures of the inner high-temperature heat storage medium and the outer medium-low temperature heat storage medium; A is the cross-sectional area perpendicular to the heat transfer direction; d is the width of the air gap; ∈ is the radiation coefficient of the outer shell material; σ is the Boltzmann constant; and t is the unit time.

[0060] Through automated control of k, the temperature of the low-temperature heat storage medium 3 in the outer layer will be reasonably controlled.

[0061] It should be noted that when the heat storage is insufficient but heating is urgently needed, the electric heating device 52 can also be turned on. The electric heating device 52 can heat the inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3, thereby heating the preset medium in the gas circuit 51. At the same time, the inner high-temperature heat storage medium 1 transfers heat to the outer medium-low temperature heat storage medium 3, thereby heating the preset medium in the gas circuit 51.

[0062] Furthermore, the heat transfer efficiency from the outer low-temperature heat storage medium 3 to the heat load through the air is η2, assuming that the temperature of the heat storage medium remains constant and the electric heating equipment 52 does not participate:

[0063]

[0064] In the formula, Q load ΔT is the heat load per unit time. down This represents the temperature drop of the outer medium per unit time.

[0065] When the heat load is less than the total heat transferred from the inner high-temperature heat storage medium 1, ΔT down When the value is negative, the temperature of the low-temperature heat storage medium 3 in the outer layer increases; when the heat load is greater than the total heat transferred from the high-temperature heat storage medium 1 in the inner layer, ΔT down When the value is positive, the temperature of the low-temperature heat storage medium 3 in the outer layer decreases. When the temperature cannot meet the heating demand, the heating process will be forced to stop. At this time, if heating is to continue, the electric heating equipment 52 must be started. When the electric heating equipment 52 is started, the heating process is as follows:

[0066]

[0067] like Figure 3As shown, taking heating load as an example, when the embodiment of the present invention undertakes the heating task, under the heating condition, the heating valve 53 is opened, and the gas in the heat transfer device 5, which is heated to a temperature close to that of the outer low-temperature heat storage medium 3, heats the water in the primary heating network 6 through at least one stainless steel pipe. The high-temperature water in the primary heating network 6 is then reheated and directly connected to the secondary heating network 7 of the building, thus realizing the transfer of heat from the heat storage device constructed by the embodiment of the present invention to the heat load. The gas after releasing heat is reheated in the part of the heat transfer device 5 that is in contact with the outer low-temperature heat storage medium 3 until the heat storage medium is exhausted or the heating condition ends, and then the heating valve 53 is closed.

[0068] The dual-layer heterogeneous medium modular high-performance thermal storage device proposed according to embodiments of the present invention has the following beneficial effects:

[0069] (1) Based on cost and material properties, materials such as steel balls or concrete were selected as the inner heat storage medium, which undertook the core heat storage task, had strong heat storage capacity, and reduced construction costs. At the same time, since the outer medium can be flexibly selected with higher heat exchange efficiency and certain heat storage capacity, the application scenarios of the constructed heat storage device are also highly flexible.

[0070] (2) The outer medium does not need to be in direct contact with the high-temperature heat storage medium, so that the direct heat loss of the inner medium is zero, and the temperature gradient control layer forms a natural temperature gradient inside the heat storage system, which improves the heat storage efficiency.

[0071] (3) The transition from high temperature in the inner layer to medium and low temperature in the outer layer solves the problems of small application scenarios and poor heat storage capacity of low temperature heat storage, while avoiding the problems of high requirements for insulation materials and high cost of high temperature energy storage.

[0072] (4) Both the inner and outer layers are modularly designed and can be flexibly replaced as needed, ensuring that the constructed energy storage device can be used for various heating needs in different seasons and regions, which is conducive to large-scale promotion and application in areas with heat load demand.

[0073] (5) Compared with existing electrochemical energy storage devices, the thermal storage device constructed in this embodiment of the invention has extremely low cost, low deployment requirements, and low safety risks. Moreover, since this thermal storage device can operate under high temperature (1000℃) conditions, it can drive turbines to generate electricity. Compared with common water thermal storage, it can achieve year-round operation and has room for promotion in non-heating areas. It can absorb surplus and cheap new energy power and free up the adjustment space of cogeneration units.

[0074] Next, with reference to the accompanying drawings, the control method of the dual-layer heterogeneous medium modular high-performance thermal storage device proposed according to an embodiment of the present invention is described.

[0075] Figure 4This is a flowchart illustrating a control method for a dual-layer heterogeneous medium modular high-performance thermal storage device provided in an embodiment of the present invention.

[0076] like Figure 4 As shown, the control method of this dual-layer heterogeneous medium modular high-performance thermal storage device includes the following steps:

[0077] In step S401, the actual operating conditions are obtained, including heat storage requirements and heating requirements.

[0078] In step S402, when the actual working condition requires heat storage, the temperature gradient control interlayer is evacuated to a vacuum state, the heating valve is closed, and the electric heating equipment is turned on to heat the inner high-temperature heat storage medium and the outer medium-low temperature heat storage medium until the target volume of heat is stored.

[0079] In step S403, when the actual working condition requires heating, inert gas is injected into the temperature gradient control interlayer, and the heating valve is opened to shut down the electric heating equipment. This allows the heat from the high-temperature heat storage medium in the inner layer to be transferred to the low-temperature heat storage medium in the outer layer, and then heat is supplied to the target external heating pipeline through the stainless steel pipe until the target volume of heat is exhausted.

[0080] Furthermore, when there is insufficient heat storage but an urgent need for heating, the electric heating device 52 can be turned on. The electric heating device 52 can heat the inner high-temperature heat storage medium 1 and the outer medium-low temperature heat storage medium 3, thereby heating the preset medium in the gas circuit 51. At the same time, the inner high-temperature heat storage medium 1 transfers heat to the outer medium-low temperature heat storage medium 3, thereby heating the preset medium in the gas circuit 51.

[0081] It should be noted that the foregoing explanation of the embodiment of the dual-layer heterogeneous medium modular high-performance thermal storage device also applies to the control method of the dual-layer heterogeneous medium modular high-performance thermal storage device in this embodiment, and will not be repeated here.

[0082] The control method for a dual-layer heterogeneous medium modular high-performance thermal storage device proposed in this embodiment of the invention has the following beneficial effects:

[0083] (1) Based on cost and material properties, materials such as steel balls or concrete were selected as the inner heat storage medium, which undertook the core heat storage task, had strong heat storage capacity, and reduced construction costs. At the same time, since the outer medium can be flexibly selected with higher heat exchange efficiency and certain heat storage capacity, the application scenarios of the constructed heat storage device are also highly flexible.

[0084] (2) The outer medium does not need to be in direct contact with the high-temperature heat storage medium, so that the direct heat loss of the inner medium is zero, and the temperature gradient control layer forms a natural temperature gradient inside the heat storage system, which improves the heat storage efficiency.

[0085] (3) The transition from high temperature in the inner layer to medium and low temperature in the outer layer solves the problems of small application scenarios and poor heat storage capacity of low temperature heat storage, while avoiding the problems of high requirements for insulation materials and high cost of high temperature energy storage.

[0086] (4) Both the inner and outer layers are modularly designed and can be flexibly replaced as needed, ensuring that the constructed energy storage device can be used for various heating needs in different seasons and regions, which is conducive to large-scale promotion and application in areas with heat load demand.

[0087] (5) Compared with existing electrochemical energy storage devices, the thermal storage device constructed in this embodiment of the invention has extremely low cost, low deployment requirements, and low safety risks. Moreover, since this thermal storage device can operate under high temperature (1000℃) conditions, it can drive turbines to generate electricity. Compared with common water thermal storage, it can achieve year-round operation and has room for promotion in non-heating areas. It can absorb surplus and cheap new energy power and free up the adjustment space of cogeneration units.

[0088] Figure 5 This is a schematic diagram of an electronic device provided in an embodiment of the present invention. The electronic device may include:

[0089] The memory 501, the processor 502, and the computer program stored on the memory 501 and capable of running on the processor 502.

[0090] When the processor 502 executes the program, it implements the control method of the dual-layer heterogeneous medium modular high-performance thermal storage device provided in the above embodiments.

[0091] Furthermore, electronic devices also include:

[0092] Communication interface 503 is used for communication between memory 501 and processor 502.

[0093] The memory 501 is used to store computer programs that can run on the processor 502.

[0094] The memory 501 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0095] If the memory 501, processor 502, and communication interface 503 are implemented independently, then the communication interface 503, memory 501, and processor 502 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, Figure 5 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0096] Optionally, in a specific implementation, if the memory 501, processor 502, and communication interface 503 are integrated on a single chip, then the memory 501, processor 502, and communication interface 503 can communicate with each other through an internal interface.

[0097] Processor 502 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present invention.

[0098] This invention also provides a computer program product, which, when executed by a processor, implements the control method for the dual-layer heterogeneous medium modular high-performance thermal storage device described above.

[0099] This invention also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the control method for the dual-layer heterogeneous medium modular high-performance thermal storage device described above.

[0100] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0101] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0102] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or N executable instructions for implementing custom logic functions or processes, and the scope of preferred embodiments of the invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of the invention pertain.

[0103] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0104] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0105] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0106] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0107] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A dual-layer heterogeneous medium modular high-performance thermal storage device, characterized in that, include: The inner high-temperature heat storage medium is located in the innermost layer and is used to store the heat of the target volume. A temperature gradient control interlayer is provided on the outside of the inner high-temperature heat storage medium and completely encloses the inner high-temperature heat storage medium, in order to control the heat transfer efficiency between the inner and outer heat storage media. The outer layer low-temperature heat storage medium is disposed on the outside of the temperature gradient control interlayer and completely encloses the temperature gradient control interlayer, and is used to exchange heat with the inner high-temperature heat storage medium through the temperature gradient control interlayer. A heat insulation layer is provided outside the low-temperature heat storage medium in the outer layer and completely encloses the low-temperature heat storage medium in the outer layer to isolate it from the external ambient temperature. At least two heat transfer devices are respectively installed in the inner high-temperature heat storage medium and the outer low-temperature heat storage medium, and are connected to the target external heating pipeline through a preset pipeline. They are used to heat the inner high-temperature heat storage medium and the outer low-temperature heat storage medium, and to supply heat to the target external heating pipeline to meet the target heat storage and heating needs.

2. The dual-layer heterogeneous medium modular high-performance thermal storage device according to claim 1, characterized in that, The inner high-temperature heat storage medium is made of at least one of the following: a non-flammable and inert solid material, or a material that can be heated to at least 1200°C and will not chemically react with or melt with air.

3. The dual-layer heterogeneous medium modular high-performance thermal storage device according to claim 1, characterized in that, The temperature gradient control interlayer is filled with an inert gas as a heat-conducting medium.

4. The dual-layer heterogeneous medium modular high-performance thermal storage device according to claim 1, characterized in that, The thermal insulation layer uses a low thermal conductivity material of a preset thickness, which is determined based on the actual deployment scenario and the temperature range of the low-temperature heat storage medium in the outer layer.

5. The dual-layer heterogeneous medium modular high-performance thermal storage device according to claim 1, characterized in that, Each heat transfer device includes a gas circuit consisting of at least one stainless steel pipe, a preset medium, a fan, and an electric heating device, wherein the preset medium, the fan, and the electric heating device are all disposed inside the gas circuit.

6. The dual-layer heterogeneous medium modular high-performance thermal storage device according to claim 5, characterized in that, A heating valve is provided on the gas circuit consisting of at least one stainless steel pipe, and the heating valve is connected to the electric heating equipment.

7. A control method for a dual-layer heterogeneous medium modular high-performance thermal storage device, characterized in that, The dual-layer heterogeneous medium modular high-performance thermal storage device according to any one of claims 1-6 includes the following steps: Obtain actual operating conditions requirements, wherein the actual operating conditions requirements include heat storage requirements and heating requirements; When the actual working condition requires heat storage, the temperature gradient control interlayer is evacuated to a vacuum state, the heating valve is closed, and the electric heating equipment is turned on to heat the inner high-temperature heat storage medium and the outer medium-low temperature heat storage medium until the target volume of heat is stored. When the actual operating condition demand is for heating, inert gas is injected into the temperature gradient control interlayer, the heating valve is opened to shut down the electric heating equipment, so that the heat of the inner high-temperature heat storage medium is transferred to the outer low-temperature heat storage medium, and heat is supplied to the target external heating pipeline through the stainless steel pipeline until the heat of the target volume is exhausted.

8. An electronic device, characterized in that, include: The device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the control method for the dual-layer heterogeneous medium modular high-performance thermal storage device as described in claim 7.

9. A computer program product, characterized in that, When the computer program / instruction is executed by the processor, it implements the control method of the dual-layer heterogeneous medium modular high-performance thermal storage device as described in claim 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to implement the control method for the dual-layer heterogeneous medium modular high-performance thermal storage device as described in claim 7.

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