A quick-installation universal high-speed bus optical fiber module

Abstract

The present invention discloses a universal high-speed bus optical fiber module for rapid installation, comprising a PCB board, a packaging shell and an optical module; the packaging shell is installed on the PCB board, an optical module carrier is arranged in the packaging shell, the optical module carrier is electrically connected to the PCB board through an optical fiber probe connector, and the optical module is installed on the optical module carrier; a filter matching attenuation circuit is arranged on the optical module carrier, the input end of the filter matching attenuation circuit is electrically connected to the optical fiber probe connector, and the output end is electrically connected to the optical module. The optical fiber module of the present invention realizes the connection between the optical module and the PCB board through the optical fiber probe connector, is easy to install, does not need to design a special PCB board, and improves the applicability of the equipment; the signal enters the optical module after being processed by the filter matching attenuation circuit, and improves the stability and reliability of the signal; the performance of the optical fiber module is greatly improved, and has excellent promotion value.

Description

Technical Field

[0001] The invention relates to the technical field of optical fiber modules, and in particular to a universal high-speed bus optical fiber module for rapid installation. Background Art

[0002] High-speed bus simulation, acquisition, fault injection, and stress testing are the performances that fiber optic cards need to include. Most of the existing fiber optic modules use dedicated bus protocol PCB boards, including but not limited to PCIe, PXIe, and CPCI boards. These boards need to design their own separate PCB boards, which are not suitable for applicability. High-speed buses generally rely on optical fiber physical media and have the characteristics of high speed and high bandwidth. These characteristics determine that many existing design concepts are not suitable due to changes in quantity, such as real-time analysis of high-speed buses leading to packet loss, insufficient DMA bandwidth, and insufficient processing power. Another feature is that there are many existing high-speed optical fiber hardware platforms, but they are not enough to cover some scenarios with higher speeds and larger bandwidths, and the stability, reliability, and testability of the original platforms are also insufficient. Summary of the invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is expected to provide a universal high-speed bus optical fiber module that can be quickly installed. The optical module and the PCB board are connected through an optical fiber probe connector. The installation is convenient and there is no need to design a special PCB board, thereby improving the applicability of the equipment. The signal enters the optical module after being processed by a filtering matching attenuation circuit, thereby improving the stability and reliability of the signal. The performance of the optical fiber module is greatly improved, and it has excellent promotion value.

[0004] The present invention provides a universal high-speed bus optical fiber module for quick installation, comprising a PCB board, a packaging shell and an optical module;

[0005] The packaging shell is fixedly mounted on the PCB board, an optical module carrier is fixedly arranged in the packaging shell, the optical module carrier is electrically connected to the PCB board through an optical fiber probe connector, and the optical module is fixedly mounted on the optical module carrier; a filter matching attenuation circuit is arranged on the optical module carrier, an input end of the filter matching attenuation circuit is electrically connected to the optical fiber probe connector, and an output end is electrically connected to the optical module;

[0006] The filter matching attenuation circuit comprises:

[0007] a resistor R1, a first end of which is connected to the optical fiber probe connector;

[0008] a resistor R2, a first end of which is connected to the optical fiber probe connector;

[0009] A capacitor C1, a first end of which is connected to the first end of the resistor R1, and a second end of which is grounded;

[0010] A capacitor C2, a first end of which is connected to the first end of the resistor R1;

[0011] a resistor R3, a first end of which is connected to the second end of the capacitor C2, and a second end of which is connected to the first end of the resistor R2;

[0012] A capacitor C3, a first end of which is connected to the first end of the resistor R2, and a second end of which is grounded;

[0013] an inductor L1, a first end of which is connected to the second end of the resistor R1;

[0014] a resistor R13, a first end of which is connected to the second end of the inductor L1, and a second end of which is connected to the optical module;

[0015] A capacitor C8 is connected in parallel with the resistor R13;

[0016] an inductor L2, a first end of which is connected to the second end of the resistor R2;

[0017] a resistor R14, a first end of which is connected to the second end of the inductor L2, and a second end of which is connected to the optical module;

[0018] A capacitor C9 is connected in parallel with the resistor R14;

[0019] A capacitor C6, a first end of which is connected to the second end of the inductor L1;

[0020] a resistor R11, a first end of which is connected to the second end of the capacitor C6, and a second end of which is connected to the second end of the inductor L2;

[0021] A resistor R4, a first end of which is connected to a power supply, and a second end of which is connected to the second end of the resistor R13;

[0022] The resistor R5 has a first end connected to the ground, and a second end connected to the second end of the resistor R14.

[0023] Furthermore, the packaging shell is fixedly mounted on the PCB board by a first screw.

[0024] Furthermore, the packaging shell includes a main shell, a cover plate is fixedly mounted on the back of the main shell by a second screw, and a through groove is formed on the cover plate corresponding to the optical fiber probe connector.

[0025] Furthermore, heat dissipation teeth are evenly distributed on the packaging shell, and a thermal pad is arranged between the optical module and the packaging shell.

[0026] Furthermore, metal contacts are reserved on the optical module carrier, the optical module is electrically connected to the filter matching attenuation circuit via the metal contacts, and the optical module is fixedly mounted on the optical module carrier via a third screw.

[0027] Furthermore, the optical module is provided with twelve transmission channels, the optical fiber probe connector is configured with corresponding twelve connection channels, and the filtering matching attenuation circuit is provided between the corresponding transmission channels and connection channels.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] (1) When the optical fiber module of the present invention is in operation, the PCIE signal enters the signal through the filter matching attenuation circuit after passing through the PCB board and the optical fiber probe connector, and enters the optical module after being processed. The optical module converts it into an optical signal and transmits it to the terminal device. The setting of the filter matching attenuation circuit greatly improves the stability and reliability of the signal, ensures the processing efficiency of the signal, greatly improves the performance of the optical fiber module, and has excellent promotion value.

[0030] (2) The optical fiber module of the present invention installs the optical module and the optical module carrier into a packaging shell, and the optical fiber probe connector on the optical module carrier extends out of the packaging shell. After the optical fiber probe connector is connected to the PCB board, the packaging shell and the PCB board are fixed by a first screw. The structure is compact and easy to install. There is no need to design a separate PCB board, which improves the applicability of the equipment.

[0031] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0033] Figure 1 It is a structural diagram of a high-speed bus optical fiber module;

[0034] Figure 2 It is a schematic diagram of the exploded structure of the high-speed bus optical fiber module;

[0035] Figure 3 It is a signal transmission diagram of a high-speed bus optical fiber module;

[0036] Figure 4 A connection diagram of a fiber optic probe connector;

[0037] Figure 5 The circuit diagram of the filter matching attenuation circuit is shown in FIG.

[0038] Figure 6 Schematic diagram of the circuit connection of the fiber optic probe connector.

[0039] Numbers in the figure: 1, PCB board; 2, package shell; 3, optical module; 4, optical module carrier board; 5, optical fiber probe connector; 6, thermal pad;

[0040] 21. Main housing; 22. Cover plate; 23. First screw; 24. Second screw; 25. Through slot; 26. Heat dissipation teeth;

[0041] 31. The third screw. DETAILED DESCRIPTION

[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0043] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] Please refer to Figure 1 to Figure 6 , an embodiment of the present invention provides a universal high-speed bus optical fiber module for rapid installation, comprising a PCB board 1, a packaging shell 2 and an optical module 3;

[0045] The packaging shell 2 is fixedly mounted on the PCB board 1, and an optical module carrier board 4 is fixedly arranged in the packaging shell 2. The optical module carrier board 4 is electrically connected to the PCB board 1 through the optical fiber probe connector 5, and the optical module 3 is fixedly mounted on the optical module carrier board 4; a filter matching attenuation circuit is arranged on the optical module carrier board 4, and the input end of the filter matching attenuation circuit is electrically connected to the optical fiber probe connector 5, and the output end is electrically connected to the optical module 3;

[0046] The filter matching attenuation circuit includes:

[0047] a resistor R1, a first end of which is connected to a fiber optic probe connector;

[0048] a resistor R2, a first end of which is connected to the optical fiber probe connector;

[0049] A capacitor C1, a first end of which is connected to the first end of the resistor R1, and a second end of which is grounded;

[0050] A capacitor C2, a first end of which is connected to a first end of the resistor R1;

[0051] A resistor R3, a first end of which is connected to the second end of the capacitor C2, and a second end of which is connected to the first end of the resistor R2;

[0052] A capacitor C3, a first end of which is connected to the first end of the resistor R2, and a second end of which is grounded;

[0053] An inductor L1, a first end of which is connected to the second end of the resistor R1;

[0054] A resistor R13, a first end of which is connected to the second end of the inductor L1, and a second end of which is connected to the optical module;

[0055] Capacitor C8, connected in parallel with resistor R13;

[0056] An inductor L2, a first end of which is connected to the second end of the resistor R2;

[0057] A resistor R14, a first end of which is connected to the second end of the inductor L2, and a second end of which is connected to the optical module;

[0058] Capacitor C9, connected in parallel with resistor R14;

[0059] A capacitor C6, a first terminal of which is connected to the second terminal of the inductor L1;

[0060] a resistor R11, a first end of which is connected to the second end of the capacitor C6, and a second end of which is connected to the second end of the inductor L2;

[0061] A resistor R4, a first end of which is connected to a power supply, and a second end of which is connected to a second end of the resistor R13;

[0062] The resistor R5 has a first end connected to the ground, and a second end connected to the second end of the resistor R14.

[0063] In this embodiment, when the optical fiber module is running, the PCIE signal is input through the PCB board 1 and the optical fiber probe connector 5, enters the filter matching attenuation circuit, and enters the resistor after the first-level filtering (C1 / C3) to complete the matching of the differential mode signal. Then, it passes through the resistor (R1 / R2) to achieve impedance matching, reduce signal reflection, improve signal quality and control the energy of the extracted signal. After that, the signal passes through the inductor (L1 / L2) to suppress high-frequency noise. In differential signal transmission, PCIE signals are easily affected by external noise. As a passive component, the inductor can effectively suppress the interference of high-frequency noise during transmission. According to the inductor reactance formula: X L =2πfL. By adjusting the L value, the link impedance can be adjusted together with the previous resistor while suppressing high-frequency noise. The inductor outputs the differential signal, which is matched with the second-stage differential mode signal and then output after completing the secondary impedance matching through the second-stage matching resistor. Then it is connected to the input end of the optical module 3, which converts it into an optical signal and transmits it to the terminal device. The setting of the filter matching attenuation circuit greatly improves the stability and reliability of the signal, ensures the signal processing efficiency, greatly improves the performance of the optical fiber module, and has excellent promotion value.

[0064] The optical module 3 and the optical module carrier board 4 are installed in the packaging shell 2. After the optical fiber probe connector 5 on the optical module carrier board 4 is connected to the PCB board 1, the packaging shell 2 and the PCB board 1 are fixed. The structure is compact and easy to install. There is no need to design a separate PCB board, which improves the applicability of the equipment.

[0065] In a preferred embodiment, if Figure 2 As shown, the packaging shell 2 is fixedly mounted on the PCB board 1 by means of a first screw 23, and the installation is convenient and the fixation is stable.

[0066] In a preferred embodiment, if Figure 2 As shown, the packaging shell 2 includes a main shell 21 , a cover plate 22 is fixedly mounted on the back of the main shell 21 by second screws 24 , and a through slot 25 is formed on the cover plate 22 corresponding to the optical fiber probe connector 5 .

[0067] In this embodiment, the optical module 3 and the optical module carrier 4 are encapsulated by the main housing 21 and the cover 22, and the structure is compact, which can be used in occasions where the size requirement is small. The optical fiber probe connector 5 on the optical module carrier 4 extends out of the encapsulation housing 2 through the through slot 25 and is connected to the PCB board 1.

[0068] In a preferred embodiment, if Figure 2 As shown, the packaging shell 2 is evenly distributed with heat dissipation teeth 26, and a thermal pad 6 is provided between the optical module 3 and the packaging shell 2, which has excellent heat dissipation capability, ensuring that the optical fiber module transmits high-speed data without easily causing overheating of the device.

[0069] In a preferred embodiment, if Figure 2 As shown, metal contacts are reserved on the optical module carrier 4, and the optical module 3 is electrically connected to the filter matching attenuation circuit through the metal contacts. The metal contacts are elastic and have good anti-vibration and connection performance; the optical module 3 is fixedly installed on the optical module carrier 4 by the third screw 31, which is convenient to install and firmly fixed.

[0070] In a preferred embodiment, if Figure 6 As shown, the optical module 3 is provided with twelve transmission channels, and the optical fiber probe connector 5 is configured with corresponding twelve connection channels. Filter matching attenuation circuits are provided between the corresponding transmission channels and the connection channels. The bandwidth meets most signal transmission requirements and has strong signal processing capability.

[0071] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0072] In the description of this specification, the description of the terms "one embodiment", "some embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A universal high-speed bus optical fiber module for quick installation, characterized in that: It comprises a PCB board (1), a packaging shell (2) and an optical module (3); The packaging shell (2) is fixedly mounted on the PCB board (1); an optical module carrier board (4) is fixedly arranged in the packaging shell (2); the optical module carrier board (4) is electrically connected to the PCB board (1) via an optical fiber probe connector (5); the optical module (3) is fixedly mounted on the optical module carrier board (4); a filter matching attenuation circuit is arranged on the optical module carrier board (4); an input end of the filter matching attenuation circuit is electrically connected to the optical fiber probe connector (5), and an output end is electrically connected to the optical module (3); The filter matching attenuation circuit comprises: a resistor R1, a first end of which is connected to the optical fiber probe connector; a resistor R2, a first end of which is connected to the optical fiber probe connector; A capacitor C1, a first end of which is connected to the first end of the resistor R1, and a second end of which is grounded; A capacitor C2, a first end of which is connected to the first end of the resistor R1; a resistor R3, a first end of which is connected to the second end of the capacitor C2, and a second end of which is connected to the first end of the resistor R2; A capacitor C3, a first end of which is connected to the first end of the resistor R2, and a second end of which is grounded; an inductor L1, a first end of which is connected to the second end of the resistor R1; a resistor R13, a first end of which is connected to the second end of the inductor L1, and a second end of which is connected to the optical module; A capacitor C8 is connected in parallel with the resistor R13; an inductor L2, a first end of which is connected to the second end of the resistor R2; a resistor R14, a first end of which is connected to the second end of the inductor L2, and a second end of which is connected to the optical module; A capacitor C9 is connected in parallel with the resistor R14; A capacitor C6, a first end of which is connected to the second end of the inductor L1; a resistor R11, a first end of which is connected to the second end of the capacitor C6, and a second end of which is connected to the second end of the inductor L2; A resistor R4, a first end of which is connected to a power supply, and a second end of which is connected to the second end of the resistor R13; The resistor R5 has a first end connected to the ground, and a second end connected to the second end of the resistor R14.

2. The quick-install universal high-speed bus optical fiber module according to claim 1, characterized in that: The packaging shell (2) is fixedly mounted on the PCB board (1) by means of a first screw (23).

3. The quick-install universal high-speed bus optical fiber module according to claim 1, characterized in that: The packaging shell (2) comprises a main shell (21), a cover plate (22) is fixedly mounted on the back of the main shell (21) by means of a second screw (24), and a through slot (25) is provided on the cover plate (22) corresponding to the optical fiber probe connector (5).

4. The quick-install universal high-speed bus optical fiber module according to claim 1, characterized in that: The packaging shell (2) is evenly distributed with heat dissipation teeth (26) and a heat conductive pad (6) is provided between the optical module (3) and the packaging shell (2).

5. The quick-install universal high-speed bus optical fiber module according to claim 1, characterized in that: Metal contacts are reserved on the optical module carrier (4), the optical module (3) is electrically connected to the filter matching attenuation circuit via the metal contacts, and the optical module (3) is fixedly mounted on the optical module carrier (4) via a third screw (31).

6. The quick-install universal high-speed bus optical fiber module according to claim 1, characterized in that: The optical module (3) is provided with twelve transmission channels, the optical fiber probe connector (5) is provided with corresponding twelve connection channels, and the filtering matching attenuation circuit is provided between the corresponding transmission channels and the connection channels.

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