Test device and method for measuring temperature and thermal deformation of optical lens group in exposure machine

Abstract

The present invention discloses a test device for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine. The device comprises a measuring platform, an optical assembly, and a control and sensing assembly. The optical assembly comprises a servo motor, a lens assembly mounting plate, an optical lens assembly, a gantry bracket, and an alignment camera. The control and sensing assembly comprises a strain sensor patch, a main control computer, an industrial computer, a semiconductor laser, a static strain system, a temperature data system, a host computer, and a temperature sensor patch. The temperature data system and the static strain system are mounted on the front surface of the measuring platform. The temperature sensor patch is attached to the sleeve of the optical lens assembly and connected to the temperature data system via a wire. The strain sensor patch is attached to the sleeve of the optical lens assembly and connected to the static strain system via a wire. The device can obtain the most accurate data on the temperature and thermal deformation of the optical lens assembly under different laser power conditions in real time, and collect and analyze the data.

Description

Technical Field

[0001] The invention relates to a test device and method for measuring the temperature and thermal deformation of an optical lens group in an exposure machine, belonging to the field of measurement. Background Art

[0002] As a crucial component of the exposure machine, the optical lens system plays a key role in the lithography process, directly impacting the equipment's resolution, precision, and stability. During the exposure process, heat generated by internal electronic components and laser irradiation affects the temperature distribution around the optical lens system. Uneven temperature distribution can easily cause thermal deformation of the optical components, thereby reducing the system's exposure and imaging quality.

[0003] The specific analysis is as follows: 1. When the exposure machine is working, under the laser illumination system, the reflection, transmission, and absorption of light will cause the temperature distribution around the optical lens group to be uneven. The generation of temperature gradients will cause the surface shapes of the incident and transmission surfaces of the lens to change, resulting in changes in the imaging focal length. 2. As the temperature rises, the expansion of the lens barrel and spacers made of metal materials will cause the distance between the lenses to increase, causing the focal length to change. As the working time goes by, the quality of photolithography will continue to decline. 3. The lens will be squeezed by the expansion caused by the lens barrel and spacers. Under the action of expansion and squeezing, the optical material will undergo stress birefringence due to the photoelastic effect. When light passes through the birefringent material, it will experience two refractions or birefringence. The applied stress modifies the refractive index of the glass in the plane of the lens and in both directions parallel and perpendicular to the stress, resulting in poor imaging quality.

[0004] Therefore, when designing the entire optical system, the thermal deformation caused by the temperature changes of the optical lens assembly due to laser irradiation must be considered to ensure that the exposure equipment achieves high-quality exposure results. Therefore, it is necessary to conduct thermal stability analysis of the optical lens assembly under different operating conditions, taking the optical system as the object. However, due to the complexity of the environment, the temperature and deformation data calculated based on simulation and theoretical calculations are not realistic enough. Summary of the Invention

[0005] The present invention aims to provide a test device for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine. This device can obtain the most accurate data on the temperature and thermal deformation of the optical lens assembly under different laser power conditions in real time, and collect and analyze the data. The present invention also provides a method for measuring the temperature and thermal deformation of the optical lens assembly in an exposure machine.

[0006] The present invention relates to a test device for measuring the temperature and thermal deformation of an optical lens group in an exposure machine, which comprises a measuring platform, an optical component, and a control sensor component; the optical component comprises a servo motor, a lens group mounting plate, an optical lens group, a gantry bracket, and an alignment camera; the control sensor component comprises a strain sensor patch, a main control computer, an industrial computer, a semiconductor laser, a static strain system, a temperature data system, a host computer, and a temperature sensor patch; the gantry bracket is fixed on the upper surface of the rear surface of the measuring platform, the servo motor is fixed on the upper surface of the gantry bracket, the lens group mounting plate is fixed on the upper surface of the servo motor slider, the optical lens group and the alignment camera are fixed on the upper surface of the gantry bracket, and the gantry bracket is fixed on the upper surface of the gantry bracket. The cameras are all installed in front of the lens group mounting plate; the temperature data system and the static strain system are installed on the front surface of the measuring platform, the temperature sensor patch is attached to the sleeve of the optical lens group and is connected to the temperature data system through a wire, and the strain sensor patch is attached to the sleeve of the optical lens group and is connected to the static strain system through a wire; the semiconductor laser, industrial computer and main control computer are set in the lower support part of the measuring platform; the industrial computer is connected to the semiconductor laser through a control line; the host computer is fixed on the back surface of the measuring platform; the main control computer and the host computer are both connected to the static strain system and the temperature data system.

[0007] Furthermore, the alignment camera is equipped with a ring light source.

[0008] Furthermore, the optical assembly further includes an optical cover, which covers the outside of the optical lens group, the alignment camera and the lens group mounting plate.

[0009] Furthermore, the measuring test device also includes a thermal imager, which is located next to the measuring table and has its head aligned with the optical engine cover.

[0010] Furthermore, the test device for measurement also includes a temperature controller, which is located next to the measuring platform and is connected to the semiconductor laser through a water channel.

[0011] The method for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine of the present invention comprises the following steps:

[0012] ① Determine the optimal focal length of the optical lens group: Install the optical lens group to be tested, move the servo motor to move the focal plane of the optical lens group to the appropriate position, and at the same time align the camera to capture the image pattern of the optical lens group;

[0013] ② Installing patches on the optical lens group: Arrange temperature sensing patches and strain sensing patches on the lens barrel of the optical lens group. The temperature sensing patches are connected to the temperature data system through wires, and the strain sensing patches are connected to the static strain system through wires.

[0014] ③ Run the exposure program: set the on and off time of the semiconductor laser to put the optical lens group in the on and off exposure environment. The temperature data system and the static strain system collect the temperature data of the temperature sensor patch and the strain data of the strain sensor patch in real time.

[0015] ④ The main control computer analyzes and plots the temperature and strain data and displays them on the host computer;

[0016] ⑤ Move the servo motor to move the focal plane of the optical lens assembly to the appropriate position, and obtain the focal length error data by comparing it with the focal plane in step 1.

[0017] Furthermore, step ① is specifically as follows: during the adjustment process of the optical lens assembly, the industrial computer sends pattern data to the board controlling the optical lens assembly, so that the optical lens assembly is exposed and imaged, and the pattern is captured by the alignment camera, the position where the pattern is clearest is found, and the servo motor is controlled to stop at the clearest position. At this time, it is necessary to ensure that there is no interference from other external factors, that is, the controller, laser, chip in the optical lens assembly and other heating components are powered off and at room temperature.

[0018] Furthermore, step ② is specifically as follows: according to the test plan, multiple temperature probe patches are arranged on the barrel of the optical lens group, and the temperature data system transmits the collected temperature data to the host computer and the main control computer through the serial port. In order to ensure the stability of the temperature acquisition system, the temperature channels connected to various positions of the optical lens group are initially observed by the host computer to ensure that they are at room temperature; according to the test plan, multiple strain sensor patches are arranged on the barrel of the optical lens group, and the static strain system transmits the collected strain data to the host computer and the main control computer through the serial port. In order to ensure the feasibility of the strain acquisition system, the strain channels connected to various positions of the optical lens group are initially observed by the host computer to ensure that they are in a balanced state.

[0019] Furthermore, step ③ is specifically as follows: when the temperature data of each position of the optical system is at room temperature and the strain data is in a balanced state, the temperature controller, semiconductor laser and other equipment are powered on and operated, the output power of the semiconductor laser and the power-on and power-off time interval are set, and the exposure program is run to place the optical lens group in a power-on and power-off exposure environment. During this process, the temperature data system and the static strain system collect the temperature data of the temperature sensor patch and the strain data of the strain sensor patch in real time, and transmit them to the host computer and the main control computer.

[0020] Furthermore, step ④ is specifically as follows: after the semiconductor laser has been operated in an on-off exposure state for a period of time and the optical lens group has reached a temperature stable state, the main control computer fits, analyzes and processes the received temperature data of the specific point and the overall temperature distribution data collected by the thermal imager, and draws a line graph of the changes over time; at the same time, the main control computer processes the received strain data to convert it into deformation data, and then draws a line graph of the deformation data changing over time.

[0021] The advantages of the measurement test device of the present invention are: it uses a semiconductor laser to place the optical lens group in an on-off exposure environment, and obtains the most accurate temperature and thermal deformation data in real time through temperature sensor patches and strain sensor patches, and collects and analyzes the data through a main control computer, thereby providing a theoretical basis for a solution to ensure high-quality exposure results. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an overall schematic diagram of the test device for measurement of the present invention.

[0023] Figure 2 It is a schematic diagram of the optical component and its connecting parts in the present invention.

[0024] Figure 3 This is a diagram of the detection principle used in the temperature data system of the present invention.

[0025] Figure 4 This is a diagram of the detection principle used in the static strain system of the present invention. DETAILED DESCRIPTION

[0026] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments.

[0027] Example 1

[0028] from Figure 1 、 Figure 2It can be seen that the test device for measuring the temperature and thermal deformation of the optical lens group in the exposure machine of the present invention includes a measuring table 303, an optical component, and a control sensor component; the optical component includes a servo motor 103, a lens group mounting plate 104, an optical lens group 101, a gantry bracket 105, an alignment camera 106, and a distance measuring plate 107; the control sensor component includes a temperature sensor patch 201, a temperature data system 202, a static strain system 203, a strain sensor patch 204, a host computer 301, a main control computer 302, a semiconductor laser 401, and an industrial computer 402; the gantry bracket 105 is fixed on the back surface of the measuring table 303, the servo motor 103 is fixed on the gantry bracket 105, the lens group mounting plate 104 is fixed on the slider of the servo motor 103, the optical lens group 101 and the alignment camera 106 are both installed in front of the lens group mounting plate 104, and the distance measuring plate 107 is placed The measuring platform 303 is located above the rear surface and below the optical lens assembly 101. The front surface of the measuring platform 303 is equipped with a temperature data system 202 and a static strain system 203. The temperature sensor patch 201 is attached to the sleeve of the optical lens assembly 101 and is connected to the temperature data system 202 via a wire. The strain sensor patch 204 is attached to the sleeve of the optical lens assembly 101 and is connected to the static strain system 203 via a wire. The lower support portion of the measuring platform 303 is equipped with a semiconductor laser 401, an industrial computer 402, and a main control computer 302. The industrial computer 402 is connected to the semiconductor laser 401 via a control line, and the semiconductor laser 401 is connected to the optical lens assembly 101 via an optical fiber 403. The host computer 301 is fixed on the rear surface of the measuring platform 303. The main control computer 302 and the host computer 301 are both connected to the static strain system 203 and the temperature data system 202.

[0029] The servo motor 502 drives the optical lens assembly 101 up and down through the lens assembly mounting plate 104, enabling adjustment of the optimal position of the optical lens assembly 101 with different focal lengths. The alignment camera 106 follows the up and down movement of the servo motor 502, capturing the image pattern of the optical lens assembly 101 to detect the optimal adjustment position of the optical lens assembly 101 with different focal lengths, thus preparing for testing. The semiconductor laser 401 operates, exposing the optical lens assembly 101 and causing the optical lens assembly 101 to change its temperature. The temperature data system 202 and the static strain system 203 collect temperature and strain data from the temperature sensor patch 201 and the strain sensor patch 204 and transmit them to the host computer 301 and the main control computer 302. The main control computer 302 analyzes and plots the data. The industrial computer 402 controls the laser output power of the semiconductor laser 401 to regulate the temperature of the optical lens assembly 101.

[0030] Example 2

[0031] from Figure 1 、 Figure 2It can be seen that the measuring test device of the present invention is equipped with a ring light source for the alignment camera 106 .

[0032] The ring light source emits illumination light to make the image captured by the alignment camera 106 clearer.

[0033] In order to adapt to optical lenses of different models and bands, the ring light source is a three-band light source.

[0034] Example 3

[0035] from Figure 1 、 Figure 2 It can be seen that the optical assembly of the measuring test device of the present invention further includes an optical cover 102 , which covers the outside of the optical lens group 101 , the alignment camera 106 and the lens group mounting plate 104 .

[0036] The optical cover 102 is used to block light and prevent interference from light sources of other bands to ensure the accuracy of the test.

[0037] Example 4

[0038] from Figure 1 、 Figure 2 It can be seen that the measuring test device of the present invention further includes a thermal imager 404 . The thermal imager 404 is located beside the measuring platform 303 , with its head aligned with the optical engine cover 102 .

[0039] The thermal imager 404 can collect the overall temperature distribution of the optical lens assembly 101 and fit it with the temperature data of specific points collected by the temperature sensing patch 201 to improve the accuracy of temperature determination.

[0040] Example 5

[0041] from Figure 1 、 Figure 2 It can be seen that the measuring test device of the present invention further includes a temperature controller 403 . The temperature controller 403 is located next to the measuring platform 303 and is connected to the semiconductor laser 401 through a water channel.

[0042] The temperature controller 403 ensures that the semiconductor laser 401 does not overheat: the cooling method of the temperature controller 403 is water cooling, the control method is PID control, the set temperature range is +5 to +40°C, the temperature stability is ±0.1°C, the cooling capacity (50Hz) is 1100W, the heating capacity (50Hz) is 530W, and the rated flow rate is 7L / min.

[0043] Example 6

[0044] from Figure 1 、 Figure 2It can be seen that the measuring test device of the present invention has two wire threading tubes 108 on the measuring table 303 of the measuring test device. The wires of the strain sensing patch 204 and the wires of the temperature sensing patch 201 are respectively connected to the static strain system 203 and the temperature data system 202 after passing through a wire threading tube 108.

[0045] Example 7

[0046] The test device for measurement of the present invention: The temperature data system 202 has eight channels, can collect eight channels of temperature data simultaneously, has a temperature measurement accuracy of 0.02, a temperature recording frequency of 1 time / 10ms, has data storage and output functions, and has a USB connection port.

[0047] Example 8

[0048] The test device for measurement of the present invention: The static strain system 203 supports up to 10-channel input, supports 1 / 4 bridge, half bridge and full bridge bridge modes, the sampling frequency can reach 512Hz, and the accuracy is ±0.2%Fs±2με.

[0049] Example 9

[0050] The measuring test device of the present invention has a stroke of the servo motor 502 of 250 mm, and a back intercept of the optical lens assembly to be tested ranging from 300 to 550 mm.

[0051] Example 10

[0052] The measuring test device of the present invention: The height of the host computer 301 and the height of the keyboard thereon can be freely adjusted.

[0053] The keyboard height is about 1000mm, and the center height of the host computer 301 is about 1300mm. The height is suitable for the operator to sit on the stool and operate, which is ergonomic.

[0054] Example 11

[0055] A method for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine comprises the following steps:

[0056] ① Determine the optimal focal length of the optical lens assembly: Install the optical lens assembly 101 to be tested, move the servo motor 103 to move the focal plane of the optical lens assembly to the appropriate position, and simultaneously align the camera 106 to capture the image pattern of the optical lens assembly 101;

[0057] ② Installing patches on the optical lens assembly: Arrange a temperature sensing patch 201 and a strain sensing patch 204 on the lens barrel of the optical lens assembly 101. The temperature sensing patch 201 is connected to the temperature data system 202 via a wire, and the strain sensing patch 204 is connected to the static strain system 203 via a wire.

[0058] ③ Run the exposure program: Set the on / off time of the semiconductor laser 401 so that the optical lens assembly 101 is in an on / off exposure environment. The temperature data system 202 and the static strain system 203 collect the temperature data of the temperature sensor patch 201 and the strain data of the strain sensor patch 204 in real time.

[0059] ④ The main control computer 302 analyzes and plots the temperature data and strain data, and displays them on the host computer 301;

[0060] ⑤ Move the servo motor 103 to move the focal plane of the optical lens assembly to a suitable position, and obtain the focal length error data by comparing it with the focal plane in step 1.

[0061] Example 12

[0062] Method for measuring the temperature and thermal deformation of the optical lens assembly in an exposure machine: Step ① is specifically as follows: During the adjustment process of the optical lens assembly 101, the industrial computer 402 sends pattern data to the board controlling the optical lens assembly 101, causing the optical lens assembly 101 to expose and image. The pattern is captured by the alignment camera 106, and the position where the pattern is clearest is found. The servo motor is controlled to stop at the clearest position. At this time, it is necessary to ensure that there is no interference from other external factors, that is, the controller, laser, chip in the optical lens assembly, and other heating components are powered off and at room temperature.

[0063] Example 13

[0064] Method for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine: Step ② specifically comprises: arranging multiple temperature probe patches 201 on the lens barrel of the optical lens assembly 101 according to the test plan, and the temperature data system 202 transmits the collected temperature data to the host computer 301 and the main control computer 302 via the serial port. To ensure the stability of the temperature acquisition system, the host computer 301 initially observes that the temperature channels connected to various positions of the optical lens assembly 101 are at room temperature; arranging multiple strain sensor patches 204 on the lens barrel of the optical lens assembly 101 according to the test plan, and the static strain system 203 transmits the collected strain data to the host computer 301 and the main control computer 302 via the serial port. To ensure the feasibility of the strain acquisition system, the host computer initially observes whether the strain channels connected to various positions of the optical lens assembly 101 are in a balanced state.

[0065] Among them, the temperature detection principle is as follows Figure 3 As shown, the resistance value of the thermal resistor element will change in a certain proportion according to the temperature change: let a certain current pass through the resistor element, and use a data acquisition instrument to collect the voltage across the resistor element, and then calculate the resistance value according to Ohm's law E=IR, and thus deduce the temperature.

[0066] Among them, the strain detection principle is as follows Figure 4As shown, a Wheatstone bridge circuit is used to convert small changes in resistance into large voltage changes. Strain measurement involves using the fundamental principle of resistance: R = L / A. In the strain gauge equation, R is the resistance, L is the conductor length, and A is its cross-sectional area. In other words, the derivative of Ohm's law can be used to record the resistivity change in the strain gauge material caused by bending: when the resistance of the strain gauge is the same as the other three resistors, the output voltage E0 is 0V. When strain is applied to the strain gauge, causing the resistance to change by ΔR, this equilibrium is disrupted, generating a voltage difference between points A and B. This voltage difference is then measured to calculate strain.

[0067] The pasting process of the strain gauge is as follows: if there is rust or coating on the pasting position, it will cause the strain gauge and the metal plate to slip and cannot collect accurate data, so it is necessary to prepare a surface suitable for pasting; in order to process the flat surface, the surface part slightly larger than the strain gauge area is polished with sandpaper (200#-300#), and the ground surface is degreased and cleaned with a cleaning cloth soaked in acetone until there is no stain on the surface; use a pencil of about 4H to draw a cross mark at the pasting position of the strain gauge to accurately identify the center and direction; drop an appropriate amount of adhesive on the back of the strain gauge and paste the strain gauge along the drawn line; press it with your fingers for about 1 minute under the pressure of the polyethylene sheet; wait for the adhesive to harden before collecting data.

[0068] Example 14

[0069] Method for measuring temperature and thermal deformation of an optical lens assembly in an exposure machine: Step ③ is specifically as follows: when the temperature data at each position of the optical system is at room temperature and the strain data is in a balanced state, the temperature controller 403, the semiconductor laser 401 and other devices are powered on and operated, the output power and the power-on and power-off time interval of the semiconductor laser 401 are set, and the exposure program is run to place the optical lens assembly 101 in a power-on and power-off exposure environment. During this process, the temperature data system 202 and the static strain system 203 collect the temperature data of the temperature sensor patch 201 and the strain data of the strain sensor patch 204 in real time, and transmit them to the host computer 301 and the main control computer 302.

[0070] The power-on time of semiconductor laser 401 is set according to the different optical lens assemblies 101, and the power-off time is 5 seconds. To ensure that exposure equipment such as the laser and optical fiber is not damaged, the industrial computer 402 is used to set the power-on and power-off intervals of semiconductor laser 401: for example, the power-on time is 25 seconds and the power-off time is 5 seconds. This time cycle is repeated until the temperature stabilizes, at which point exposure is stopped to ensure the accuracy of the offline test results. The exposure data acquisition time mentioned above is 120-240 minutes, and the cooling time of the optical system after the exposure stops is 120 minutes.

[0071] Example 15

[0072] Method for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine: Step 4 specifically comprises: after the semiconductor laser 401 has been operating in an on-off exposure state for a period of time and the optical lens assembly 101 has reached a temperature stable state, the main control computer 302 fits, analyzes, and processes the received temperature data of specific points and the overall temperature distribution data collected by the thermal imager 404, and plots a line graph of the changes over time; simultaneously, the main control computer 302 processes the received strain data to convert it into deformation data, and then plots the deformation data as a line graph of the changes over time.

[0073] Among them, after the strain data is converted into deformation data, the results of thermal expansion can be seen more intuitively.

[0074] The advantages of the measurement test device of the present invention are: it uses a semiconductor laser to place the optical lens group in an on-off exposure environment, and obtains the most accurate temperature and thermal deformation data in real time through temperature sensor patches and strain sensor patches, and collects and analyzes the data through a main control computer, thereby providing a theoretical basis for a solution to ensure high-quality exposure results.

[0075] After obtaining temperature, strain, and focal length error data using the test device of the present invention, the materials or structures of the optical lens assembly can be optimized: 1. After measuring strain data at specific points, the appropriate tolerance range of the lens barrel or spacer can be determined to prevent expansion from squeezing the lens, thereby reducing the refractive index change caused by squeezing the lens. 2. Because different materials experience uneven thermal expansion, the axial deformation of each spacer varies. Therefore, by determining the different materials of each spacer, the focal length error caused by the different materials is balanced. 3. Determining the thermal expansion coefficient of lenses made of different materials and selecting materials with relatively low thermal expansion coefficients can reduce the changes in focal length and refractive index caused by changes in the lens itself. In this way, as long as the difference between the change in the focal length of the optical component and the change in the image plane caused by thermal expansion and contraction of the mechanical structure is sufficiently small, the imaging quality of the entire system can be improved.

[0076] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and deformations may be made to these embodiments without departing from the principles and spirit of the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A test device for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine, characterized by: It comprises a measuring platform (303), an optical component, and a control sensor component; the optical component comprises a servo motor (103), a lens group mounting plate (104), an optical lens group (101), a gantry bracket (105), and an alignment camera (106); the control sensor component comprises a strain sensor patch (204), a main control computer (302), an industrial computer (402), a semiconductor laser (401), a static strain system (203), a temperature data system (202), a host computer (301), and a temperature sensor patch (201); the gantry bracket (105) is fixed on the back surface of the measuring platform (303), the servo motor (103) is fixed on the gantry bracket (105), the lens group mounting plate (104) is fixed on the slider of the servo motor (103), and the optical lens group (101) and the alignment camera (106) are both mounted on the lens group mounting plate ( 104); a temperature data system (202) and a static strain system (203) are installed on the front surface of the measuring platform (303); a temperature sensing patch (201) is attached to the sleeve of the optical lens group (101) and is connected to the temperature data system (202) through a wire; a strain sensing patch (204) is attached to the sleeve of the optical lens group (101) and is connected to the static strain system (203) through a wire; a semiconductor laser (401), an industrial control computer (402), and a main control computer (302) are arranged in the lower support part of the measuring platform (303); the industrial control computer (402) is connected to the semiconductor laser (401) through a control line; a host computer (301) is fixed on the upper surface of the rear surface of the measuring platform (303); the main control computer (302) and the host computer (301) are both connected to the static strain system (203) and the temperature data system (202).

2. The measuring test device according to claim 1, wherein: The alignment camera (106) is equipped with a ring light source.

3. The measuring test device according to claim 1, wherein: The optical assembly further comprises an optical cover (102), which covers the outside of the optical lens group (101), the alignment camera (106) and the lens group mounting plate (104).

4. The measuring test device according to claim 1, wherein: It also includes a thermal imager (404), which is located beside the measuring platform (303) and has its head aligned with the optical engine cover (102).

5. The measuring test device according to claim 1, wherein: It also includes a temperature controller (403), which is located beside the measuring platform (303) and is connected to the semiconductor laser (401) through a water channel.

6. A method for measuring the temperature and thermal deformation of an optical lens assembly in an exposure machine, comprising the following steps: ① Determine the optimal focal length of the optical lens group: Install the optical lens group to be tested, move the servo motor to move the focal plane of the optical lens group to the appropriate position, and at the same time align the camera to capture the image pattern of the optical lens group; ② Installing patches on the optical lens group: Arrange temperature sensing patches and strain sensing patches on the lens barrel of the optical lens group. The temperature sensing patches are connected to the temperature data system through wires, and the strain sensing patches are connected to the static strain system through wires. ③ Run the exposure program: set the on and off time of the semiconductor laser to put the optical lens group in the on and off exposure environment. The temperature data system and the static strain system collect the temperature data of the temperature sensor patch and the strain data of the strain sensor patch in real time. ④ The main control computer analyzes and plots the temperature and strain data and displays them on the host computer; ⑤ Move the servo motor to move the focal plane of the optical lens assembly to the appropriate position, and obtain the focal length error data by comparing it with the focal plane in step 1.

7. The measuring method according to claim 6, wherein: Step ① is specifically as follows: during the adjustment process of the optical lens group, the industrial computer sends pattern data to the board that controls the optical lens group, so that the optical lens group is exposed and imaged, and the pattern is collected by aligning the camera, the position where the pattern is clearest is found, and the servo motor is controlled to stop at the clearest position. At this time, it is necessary to ensure that there is no interference from other external factors, that is, the controller, laser, chip in the optical lens group and other heating components are powered off and at room temperature.

8. The measuring method according to claim 6, wherein: Step ② is specifically as follows: according to the test plan, multiple temperature probe patches are arranged on the barrel of the optical lens group. The temperature data system transmits the collected temperature data to the host computer and the main control computer through the serial port. In order to ensure the stability of the temperature acquisition system, the temperature channels connected to various positions of the optical lens group are initially observed through the host computer to ensure that they are at room temperature; according to the test plan, multiple strain sensor patches are arranged on the barrel of the optical lens group. The static strain system transmits the collected strain data to the host computer and the main control computer through the serial port. In order to ensure the feasibility of the strain acquisition system, the strain channels connected to various positions of the optical lens group are initially observed through the host computer to ensure that they are in a balanced state.

9. The measuring method according to claim 6, wherein: Step ③ is specifically as follows: when the temperature data at each position of the optical system is at room temperature and the strain data is in a balanced state, the temperature controller, semiconductor laser and other equipment are powered on, the output power of the semiconductor laser and the power-on and power-off time interval are set, and the exposure program is run to put the optical lens group in an on-off exposure environment. During this process, the temperature data system and the static strain system collect the temperature data of the temperature sensor patch and the strain data of the strain sensor patch in real time, and transmit them to the host computer and the main control computer.

10. The measuring method according to claim 6, wherein: Step ④ is specifically as follows: after the semiconductor laser has been running in the on-off exposure state for a period of time and the optical lens group has reached a temperature stable state, the main control computer fits, analyzes and processes the received temperature data of the specific point and the overall temperature distribution data collected by the thermal imager, and draws a line graph of the changes over time; at the same time, the main control computer processes the received strain data to convert it into deformation data, and then draws a line graph of the deformation data changing over time.

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