A wafer processing device

Abstract

A wafer processing device disclosed by the present invention belongs to the technical field of wafer processing, and includes an etching tank for etching wafers, a cleaning tank for cleaning, a drying component and a fixing component for drying the cleaned wafers. The fixing component is respectively movably arranged in the etching tank, the cleaning tank and the drying component. Connection components are installed in both the cleaning tank and the drying component. Mounting plates are connected to the outer side walls of the drying component and the cleaning tank. A driving component is installed on the mounting plate. The driving component is arranged between the cleaning tank and the drying component. The output end of the driving component is connected to the etching tank. A driving rod is installed on the driving component. Two ends of the driving rod are respectively connected to the connection components in the cleaning tank and the drying component. It can uniformly etch wafers, and at the same time, can efficiently clean and quickly dry the wafers during etching.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing, and particularly relates to a wafer processing device. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Various circuit element structures can be processed and fabricated on the silicon wafer to form an IC product with specific electrical functions; high-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed; during the production process of the wafer, the wafer needs to be etched. The wafer to be etched is placed in an etching tank with etching liquid for etching. After etching, it is sent into a cleaning device for cleaning, then dried by a drying device, and then stored. This process requires different devices to cooperate in sequence, with cumbersome operations and low efficiency; moreover, during the etching process of the existing wafer, there is a phenomenon that the surface of the wafer is unevenly contacted with the etching liquid, which affects the etching speed and uniformity of the wafer surface, resulting in a decline in product quality. Summary of the Invention

[0003] In view of the above situation, to overcome the defects of the prior art, the present invention provides a wafer processing device.

[0004] The technical solution adopted by the present invention is as follows: A wafer processing device includes an etching tank for etching the wafer, a cleaning tank for cleaning, a drying component and a fixing component for drying the cleaned wafer. An etching liquid for etching the wafer is placed in the etching tank, and a cleaning liquid for cleaning the etched wafer is placed in the cleaning tank. The fixing components are respectively movably arranged in the etching tank, the cleaning tank, and the drying component. Connection components are installed in both the cleaning tank and the drying component. Mounting plates are connected to the outer side walls of the drying component and the cleaning tank. A driving component is installed on the mounting plate. The driving component is arranged between the cleaning tank and the drying component. The output end of the driving component is connected to the etching tank. A driving rod is installed on the driving component, and both ends of the driving rod are respectively connected to the connection components in the cleaning tank and the drying component.

[0005] Preferably, the driving assembly includes a support plate, which is arranged on the bottom wall of the mounting plate, and the support plate is arranged between the cleaning box and the drying assembly. A motor seat and a support ring are provided on the support plate, and a motor is mounted on the motor seat and the mounting plate. A driving shaft is movably mounted on the support ring, and the output shaft end of the motor is connected to the driving shaft, and the other end of the driving shaft movably penetrates the side wall of the corrosion box, and an eccentric wheel is installed on the driving shaft, and the eccentric wheel is arranged between the support ring and the corrosion box. A driving member is movably sleeved on the outer side of the eccentric wheel, and a sleeve second is installed on the upper end of the driving member, and the driving rod movably penetrates the sleeve second. Pushing rod one and pushing rod two are respectively installed on both sides of the driving member, and the pushing rod one is arranged close to the drying assembly, and the pushing rod two is arranged close to the cleaning box.

[0006] Further, the connecting assembly includes a fixing plate 1, which is respectively arranged in the cleaning box and the drying assembly, and a sleeve 1 is installed on the fixing plate 1, and the sleeve 1 is a cavity structure with openings at both ends. A rotating rod 1 is movably installed in the sleeve 1, and the two ends of the rotating rod 1 respectively extend out of the two sides of the sleeve 1 and are movably installed in the opposite side walls of the cleaning box and the drying assembly. The connecting assembly also includes a toggle member, which is respectively movably arranged on the outer side wall of the cleaning box and the outer side wall of the drying assembly, one end of the rotating rod 1 is connected to one end of the toggle member, and one end of the driving rod is movably clamped in the other end of the toggle member.

[0007] As a preferred embodiment of the present invention, connecting member 1 and connecting member 2 are respectively installed at both ends of the rotating rod 1, and connecting member 1 and connecting member 2 are respectively arranged on both sides of sleeve 1 and arranged in the cleaning box and the drying component, and connecting nets are installed on connecting member 1 and connecting member 2.

[0008] In which, the drying component includes a drying box, two ends of the rotating rod one are respectively movably connected to the two opposite inner walls of the drying box, a pushing component one is installed on the outer wall of the drying box, and a pushing component two is installed on the outer wall of the cleaning box, the pushing component one is movably connected to the pushing rod one, and the pushing component two is movably connected to the pushing rod two, the pushing component one and the pushing component two have the same structure, and only one group is introduced here, the pushing component one includes a spring one and a telescopic rod, the spring is set on the telescopic rod, one end of the spring one and one end of the telescopic rod are both installed on the outer wall of the drying box, the other end of the spring one and the other end of the telescopic rod are installed with a connecting plate one, a folding bag is connected between the connecting plate one and the outer wall of the drying box, and the spring one and the telescopic rod are arranged in the folding bag.

[0009] Furthermore, a pushing plate 1 is installed at one end of the pushing rod 1, and a pushing plate 2 is installed at one end of the pushing rod 2. The side walls of the pushing plate 1 and the pushing plate 2 are both installed with multiple groups of balls for reducing friction. The pushing plate 1 is movably connected to the connecting plate 1, and the pushing plate 2 is movably connected to the connecting plate 1 in the pushing component 2.

[0010] Wherein, a drying chamber 1 and a drying chamber 2 are arranged in the side wall of the drying box, a drying hole 1 and a drying hole 2 are arranged in the inner side wall of the drying box, the drying chamber 1 is connected to the drying hole 1, the drying chamber 2 is connected to the drying hole 2, a ventilation pipe is installed between the drying box and the pushing component 2, one end of the ventilation pipe is connected to the drying chamber 2, and the other end of the ventilation pipe is connected to the folding bag in the pushing component 2;

[0011] When rotating rod 1 drives the connecting net to deviate to a position close to drying hole 2, pushing component 2 is squeezed, the folded bag is compressed, the internal gas enters drying chamber 2 through the ventilation pipe and is discharged from drying hole 2, thereby drying the wafer on the connecting net. The folded bag in pushing component 1 is stretched, and the gas in the drying box enters the folded bag in pushing component 1.

[0012] The cam is provided with a plurality of fixing wheels, and the fixing wheels are provided with a plurality of fixing wheels respectively. The fixing wheels are fixedly provided with the limiting components, and the sliding wheels are movably connected to the limiting components. The fixing wheels and the sliding wheels are staggered. The plurality of connecting wheels are provided with connecting parts three on the outer walls of the plurality of sliding wheels, and one end of the connecting part three movably passes through the connecting wheel two. The connecting wheel two is provided with a fixing plate, and one end of the connecting part three is provided in the fixing plate. A spring two is provided between the connecting part three and the fixing plate. Fixing rods are provided on the opposite side walls of the sliding wheel and the fixing wheel, and the fixing rods are used to fix the wafer. The sliding wheel is provided with a blocking piece, and the fixing wheel is provided with a socket, and the blocking piece is movably connected in the socket, and the blocking piece is a grid structure to facilitate liquid to enter the fixing assembly.

[0013] Preferably, a driving wheel is movably installed on the side wall of the corrosion box, the other end of the driving shaft is connected to the driving wheel, the connecting wheel 1 is arranged on the driving wheel, the connecting wheel 2 is provided with a rotating rod 2, the rotating rod 2 movably passes through one end of the connecting piece 3 and the fixed plate, a slide groove is provided in the corrosion box, and the rotating rod 2 is movably clamped in the slide groove.

[0014] Wherein, a clamping groove is provided on the side wall of the toggle member, and the end of the driving rod is movably clamped in the clamping groove.

[0015] After adopting the above structure, the beneficial effects of the present invention are as follows:

[0016] (1) When the driving shaft rotates, it drives the driving wheel to rotate, and the driving wheel drives the fixed components in the etching box to rotate, and the wafers in the etching box rotate to facilitate uniform etching.

[0017] (2) When the driving shaft rotates, the eccentric wheel is driven to rotate to adjust the position of the driving member. Under the action of the driving member, the rotating rod 1 performs a reciprocating rotation motion, driving the connecting member 1 and the connecting member 2 to perform a reciprocating arc-shaped swing. The connecting member 1 and the connecting member 2 drive the connecting net to perform a reciprocating arc-shaped swing, thereby accelerating the cleaning or drying of the wafer.

[0018] (3) At the same time, the driving shaft can also drive pushing component 1 and pushing component 2 when rotating. When the rotating rod 1 drives the connecting net to deviate to a position close to the drying hole 2, the pushing component 2 blows the wafer. When the rotating rod 1 drives the connecting net to deviate to a position close to the drying hole 1, the pushing component 1 blows the wafer to accelerate the drying of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0020] Figure 1 A schematic diagram of the structure of a wafer processing device proposed by the present invention;

[0021] Figure 2 A three-dimensional diagram of a wafer processing device proposed by the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the pushing component 1 and the pushing component 2 proposed by the present invention;

[0023] Figure 4 A position relationship diagram of the driving wheels proposed by the present invention;

[0024] Figure 5 A schematic diagram of the structure of the fixing assembly proposed by the present invention;

[0025] Figure 6 A top perspective view of a wafer processing device proposed by the present invention;

[0026] Figure 7 for Figure 6 A partial enlarged view of point A.

[0027] In the attached drawings: 1, corrosion box, 2, cleaning box, 3, drying assembly, 4, fixing assembly, 5, connecting assembly, 6, mounting plate, 7, driving assembly, 8, driving rod, 9, supporting plate, 10, motor seat, 11, supporting ring, 12, motor, 13, driving shaft, 14, eccentric wheel, 15, driving member, 16, sleeve two, 17, pushing rod one, 18, pushing rod two, 19, fixing plate one, 20, sleeve one, 21, rotating rod one, 22, toggle member, 23, connecting member one, 24, connecting member two, 25, connecting net, 26, drying box, 27, Pushing component one, 28, pushing component two, 29, fixed wheel, 30, sliding wheel, 31, connecting plate one, 32, folding bag, 33, pushing plate one, 34, pushing plate two, 35, drying chamber one, 36, drying chamber two, 37, drying hole one, 38, drying hole two, 39, ventilation pipe, 40, connecting wheel one, 41, connecting wheel two, 42, limiting piece, 43, connecting piece three, 44, fixed plate, 45, spring two, 46, fixing rod, 47, enclosure, 48, socket, 49, driving wheel, 50, rotating rod two, 51, slide groove, 52, card groove. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] like Figures 1-7As shown in the figure, a wafer processing device includes an etching tank 1 for etching the wafer, a cleaning tank 2 for cleaning, a drying component 3 for drying the cleaned wafer, and a fixing component 4. An etching liquid for etching the wafer is placed in the etching tank 1, and a cleaning liquid for cleaning the etched wafer is placed in the cleaning tank 2. The fixing component 4 is respectively movably arranged in the etching tank 1, the cleaning tank 2, and the drying component 3. Connection components 5 are installed in both the cleaning tank 2 and the drying component 3. Mounting plates 6 are connected to the outer sidewalls of the drying component 3 and the cleaning tank 2. A driving component 7 is installed on the mounting plate 6. The driving component 7 is arranged between the cleaning tank 2 and the drying component 3. The output end of the driving component 7 is connected to the etching tank 1. A driving rod 8 is installed on the driving component 7. Both ends of the driving rod 8 are respectively connected to the connection component 5 in the cleaning tank 2 and the connection component 5 in the drying component 3.

[0031] The driving component 7 includes a support plate 9. The support plate 9 is arranged on the bottom wall of the mounting plate 6. The support plate 9 is arranged between the cleaning tank 2 and the drying component 3. A motor base 10 and a support ring 11 are arranged on the support plate 9. A motor 12 is installed on the motor base 10 and the mounting plate 6. A driving shaft 13 is movably installed on the support ring 11. The output shaft end of the motor 12 is connected to the driving shaft 13. The other end of the driving shaft 13 movably penetrates through the sidewall of the etching tank 1. An eccentric wheel 14 is installed on the driving shaft 13. The eccentric wheel 14 is arranged between the support ring 11 and the etching tank 1. A driving member 15 is movably sleeved outside the eccentric wheel 14. A second sleeve 16 is installed at the upper end of the driving member 15. The driving rod 8 movably penetrates through the second sleeve 16. Push rods one 17 and two 18 are respectively installed on both sides of the driving member 15. The push rod one 17 is arranged close to the drying component 3, and the push rod two 18 is arranged close to the cleaning tank 2;

[0032] In this embodiment, when the motor 12 works, it drives the driving shaft 13 to rotate. The driving shaft 13 drives the eccentric wheel 14 to rotate. The eccentric wheel 14 drives the driving member 15 to rotate. If initially the driving shaft 13 is arranged on the right side of the eccentric wheel 14, the motor 12 drives the driving shaft 13 to rotate clockwise. The driving shaft 13 drives the eccentric wheel 14 to rotate clockwise. The driving shaft 13 is arranged at the lowermost end of the eccentric wheel 14. While the eccentric wheel 14 drives the driving member 15 to lift, it also moves to the right. The second sleeve 16 lifts the driving rod 8, and at the same time, the second sleeve 16 moves to the right along the driving rod 8;

[0033] The driving shaft 13 drives the eccentric wheel 14 to continue rotating. The driving shaft 13 is arranged on the left side of the eccentric wheel 14. The eccentric wheel 14 drives the driving member 15 to descend while continuing to move to the right. The second sleeve 16 pulls down the driving rod 8, and at the same time, the second sleeve 16 moves to the right along the driving rod 8;

[0034] The driving shaft 13 drives the eccentric wheel 14 to continue rotating. The driving shaft 13 is arranged at the uppermost end of the eccentric wheel 14. The eccentric wheel 14 drives the driving member 15 to move to the left while descending. The second sleeve 16 pulls down the driving rod 8. At the same time, the second sleeve 16 moves to the left along the driving rod 8.

[0035] The driving shaft 13 drives the eccentric wheel 14 to continue rotating. The driving shaft 13 is arranged on the right side of the eccentric wheel 14. The eccentric wheel 14 drives the driving member 15 to rise and move to the left at the same time. The second sleeve 16 lifts the driving rod 8, and the second sleeve 16 moves to the left along the driving rod 8.

[0036] The connecting assembly 5 includes a fixing plate 19, which is respectively arranged in the cleaning box 2 and the drying assembly 3. A sleeve 20 is installed on the fixing plate 19. The sleeve 20 is a cavity structure with two ends opened. A rotating rod 21 is movably installed in the sleeve 20. The two ends of the rotating rod 21 extend out of the two sides of the sleeve 20 and are movably installed in the opposite side walls of the cleaning box 2 and the drying assembly 3. The connecting assembly 5 also includes a toggle member 22, which is movably arranged on the outer side wall of the cleaning box 2 and the outer side wall of the drying assembly 3. One end of the rotating rod 21 is connected to one end of the toggle member 22, and one end of the driving rod 8 is movably connected to the other end of the toggle member 22.

[0037] It should be noted that when the driving rod 8 is lifted or lowered, one end of the toggle member 22 is driven, so that the toggle member 22 rotates with the connection with the rotating rod 21 as the rotation axis, and the toggle member 22 drives the rotating rod 21 to perform reciprocating rotational motion when rotating.

[0038] The two ends of the rotating rod 1 21 are respectively installed with a connecting piece 1 23 and a connecting piece 24, the connecting piece 1 23 and the connecting piece 24 are respectively arranged on both sides of the sleeve 1 20, and are arranged in the cleaning box 2 and the drying component 3, and the connecting piece 1 23 and the connecting piece 24 are installed with a connecting net 25;

[0039] It should be noted that the fixed component 4 with the wafer that needs to be dried or cleaned is placed on the connecting net 25 for drying or cleaning. When the rotating rod 1 21 makes a reciprocating rotational motion, it drives the connecting member 1 23 and the connecting member 2 24 to make a reciprocating arc-shaped swing. The connecting member 1 23 and the connecting member 2 24 drive the connecting net 25 to make a reciprocating arc-shaped swing, thereby accelerating the cleaning or drying of the wafer.

[0040] The drying assembly 3 includes a drying box 26. Both ends of the first rotating rod 21 are movably clamped and arranged on two opposite inner side walls of the drying box 26. A first pushing assembly 27 is installed on the outer side wall of the drying box 26, and a second pushing assembly 28 is installed on the outer side wall of the cleaning box 2. The first pushing assembly 27 is movably connected to the first pushing rod 17, and the second pushing assembly 28 is movably connected to the second pushing rod 18. The first pushing assembly 27 and the second pushing assembly 28 have the same structure, and only one of them will be introduced here. The first pushing assembly 27 includes a first spring and a telescopic rod. The first spring is sleeved on the telescopic rod. One end of the first spring and one end of the telescopic rod are both installed on the outer side wall of the drying box 26. The other end of the first spring and the other end of the telescopic rod are installed with a first connecting plate 31. A folding bladder 32 is connected between the first connecting plate 31 and the outer side wall of the drying box 26. The first spring and the telescopic rod are arranged inside the folding bladder 32.

[0041] One end of the first pushing rod 17 is installed with a first pushing plate 33, and one end of the second pushing rod 18 is installed with a second pushing plate 34. Multiple groups of balls for reducing friction are installed on the side walls of the first pushing plate 33 and the second pushing plate 34. The first pushing plate 33 is movably connected to the first connecting plate 31 in the first pushing assembly 27, and the second pushing plate 34 is movably connected to the first connecting plate 31 in the second pushing assembly 28;

[0042] In this embodiment, when the first pushing rod 17 and the second pushing rod 18 move to the right under the action of the eccentric wheel 14, the second pushing rod 18 drives the second pushing plate 34, the second pushing plate 34 squeezes the first connecting plate 31 in the second pushing assembly 28, the first connecting plate 31 squeezes the folding bladder 32 in the second pushing assembly 28, the first spring and the telescopic rod in the second pushing assembly 28 are compressed, and the gas in the folding bladder 32 is discharged. At the same time, the first pushing rod 17 drives the first pushing plate 33 away from the first connecting plate 31 in the first pushing assembly 27, and the first spring in the first pushing assembly 27 pushes the first connecting plate 31 to move towards the first pushing plate 33, driving the folding bladder 32 in the first pushing assembly 27 to stretch, and external gas enters. When the first pushing rod 17 and the second pushing rod 18 move to the left under the action of the eccentric wheel 14, the movement processes of the first pushing assembly 27 and the second pushing assembly 28 are opposite.

[0043] A first drying cavity 35 and a second drying cavity 36 are arranged inside the side wall of the drying box 26. A first drying hole 37 and a second drying hole 38 are arranged on the inner side wall of the drying box 26. The first drying cavity 35 is connected to the first drying hole 37 in a through manner, and the second drying cavity 36 is connected to the second drying hole 38 in a through manner. A ventilation pipe 39 is installed between the drying box 26 and the second pushing assembly 28. One end of the ventilation pipe 39 is connected to the second drying cavity 36 in a through manner, and the other end of the ventilation pipe 39 is connected to the folding bladder 32 in the second pushing assembly 28 in a through manner;

[0044] In this embodiment, when the first rotating rod 21 drives the connecting net 25 to shift towards the position closer to the second drying hole 38, the second pushing component 28 is extruded, the folding bladder 32 is compressed, and the internal gas enters the second drying chamber 36 through the ventilation pipe 39 and is discharged from the second drying hole 38 to dry the wafer on the connecting net 25. The folding bladder 32 in the first pushing component 27 is stretched, and the gas in the drying box 26 enters the folding bladder 32 in the first pushing component 27; when the first rotating rod 21 drives the connecting net 25 to shift towards the position closer to the first drying hole 37, the first pushing component 27 is extruded, the folding bladder 32 is compressed, and the internal gas enters the first drying chamber 35 and is discharged from the first drying hole 37 to dry the wafer on the connecting net 25. The folding bladder 32 in the second pushing component 28 is stretched, and the gas in the drying box 26 enters the folding bladder 32 in the second pushing component 28. Meanwhile, during the swinging process of the connecting net 25, the drying of the cleaned wafer is also accelerated.

[0045] The fixing component 4 includes a first connecting wheel 40, a second connecting wheel 41 and a limiting member 42. The first connecting wheel 40 and the second connecting wheel 41 are respectively arranged at both ends of the limiting member 42. A plurality of fixing wheels 29 and sliding wheels 30 for fixing are installed on the limiting member 42. The fixing wheels 29 are fixedly arranged on the limiting member 42, and the sliding wheels 30 are movably clamped on the limiting member 42. The fixing wheels 29 and the sliding wheels 30 are arranged alternately. A third connecting member 43 is installed on the outer side wall of a plurality of the sliding wheels 30. One end of the third connecting member 43 penetrates through the second connecting wheel 41 movably. A fixing plate 44 is installed on the second connecting wheel 41. One end of the third connecting member 43 is arranged inside the fixing plate 44. A second spring 45 is installed between the third connecting member 43 and the fixing plate 44. Fixing rods 46 are installed on the opposite side walls of the sliding wheels 30 and the fixing wheels 29, and the fixing rods 46 are used to fix the wafer. A surrounding member 47 is installed on the sliding wheels 30. A jack 48 is provided on the fixing wheels 29. The surrounding member 47 is movably clamped in the jack 48. The surrounding member 47 is of a grid structure to facilitate the liquid to enter the fixing component 4;

[0046] It should be noted that by pushing the third connecting member 43 to drive the sliding wheel 30 to move away from the second connecting wheel 41, the second spring 45 is stretched, and the distance between the sliding wheel 30 and the fixing wheel 29 increases. Place the wafer to be etched between the adjacent fixing wheel 29 and sliding wheel 30, and then release the third connecting member 43. The second spring 45 drives the third connecting member 43 to move, the third connecting member 43 drives the sliding wheel 30 to move towards the second connecting wheel 41, and the fixing rods 46 on the sliding wheel 30 and the fixing wheel 29 fix the wafer.

[0047] A driving wheel 49 is movably installed on the side wall of the corrosion box 1, and the other end of the driving shaft 13 is connected to the driving wheel 49. The connecting wheel 1 40 is arranged on the driving wheel 49, and a rotating rod 2 50 is provided on the connecting wheel 2 41. The rotating rod 2 50 movably passes through one end of the connecting piece 3 43 and the fixed plate 44. A slide groove 51 is provided in the corrosion box 1, and the rotating rod 2 50 is movably clamped in the slide groove 51.

[0048] A slot 52 is formed on the side wall of the toggle member 22 , and the end of the driving rod 8 is movably engaged in the slot 52 .

[0049] The specific usage is as follows:

[0050] Push the connecting piece three 43 to drive the sliding wheel 30 to move away from the connecting wheel two 41, the spring two 45 is stretched, the distance between the sliding wheel 30 and the fixed wheel 29 is increased, and the wafer is placed between the adjacent fixed wheels 29 and the sliding wheel 30, and then release the connecting piece three 43, the spring two 45 drives the connecting piece three 43 to move, the connecting piece three 43 drives the sliding wheel 30 to move towards the connecting wheel two 41, the sliding wheel 30 and the fixing rod 46 on the fixed wheel 29 fix the wafer, the fixing assembly 4 with the wafer to be corroded is placed in the corrosion box 1, the fixing assembly 4 with the wafer to be cleaned after corrosion is placed in the cleaning box 2, and the fixing assembly 4 with the wafer to be dried after cleaning is placed in the drying box 26.

[0051] Then the motor 12 works to drive the drive shaft 13 to rotate, the drive shaft 13 drives the eccentric wheel 14 to rotate, and the eccentric wheel 14 drives the drive member 15 to rotate. If the drive shaft 13 is initially arranged on the right side of the eccentric wheel 14, the motor 12 drives the drive shaft 13 to rotate clockwise, the drive shaft 13 drives the eccentric wheel 14 to rotate clockwise, the drive shaft 13 is arranged at the lower end of the eccentric wheel 14, the eccentric wheel 14 drives the drive member 15 to move right while lifting, the sleeve 16 lifts the drive rod 8, and the sleeve 16 moves right along the drive rod 8; the drive shaft 13 drives the eccentric wheel 14 to continue to rotate, the drive shaft 13 is arranged on the left side of the eccentric wheel 14, and the eccentric wheel 14 drives the drive member 15 While descending, it continues to move to the right, and the second sleeve 16 pulls down the drive rod 8, and the second sleeve 16 moves to the right along the drive rod 8; the drive shaft 13 drives the eccentric wheel 14 to continue to rotate, and the drive shaft 13 is arranged at the uppermost end of the eccentric wheel 14. The eccentric wheel 14 drives the driving member 15 to move to the left while descending, and the second sleeve 16 pulls down the drive rod 8, and the second sleeve 16 moves to the left along the drive rod 8; the drive shaft 13 drives the eccentric wheel 14 to continue to rotate, and the drive shaft 13 is arranged on the right side of the eccentric wheel 14. The eccentric wheel 14 drives the driving member 15 to rise and move to the left, and the second sleeve 16 lifts the drive rod 8, and the second sleeve 16 moves to the left along the drive rod 8.

[0052] When the driving shaft 13 rotates, the driving wheel 49 is driven to rotate, and the driving wheel 49 drives the fixed component 4 in the etching box 1 to rotate, and the wafer in the etching box 1 rotates, which facilitates uniform etching.

[0053] When the driving rod 8 is lifted or lowered, one end of the toggle member 22 is driven, so that the toggle member 22 rotates with the connection with the rotating rod 1 21 as the rotation axis. When the toggle member 22 rotates, it drives the rotating rod 1 21 to make a reciprocating rotational motion. The fixed component 4 with the wafer that needs to be dried or cleaned is placed on the connecting net 25 for cleaning or drying. When the rotating rod 1 21 makes a reciprocating rotational motion, it drives the connecting member 1 23 and the connecting member 2 24 to make a reciprocating arc swing. The connecting member 1 23 and the connecting member 2 24 drive the connecting net 25 to make a reciprocating arc swing.

[0054] The wafer on the connection net 25 in the cleaning box 2 swings in the cleaning liquid, which facilitates the rapid cleaning of the etched wafer.

[0055] The wafers on the connection net 25 arranged in the drying box 26 swing in the drying box 26, so as to facilitate the rapid drying process of the etched wafers.

[0056] At the same time, when the pushing rod 17 and the pushing rod 2 18 move to the right under the action of the eccentric wheel 14, the pushing rod 2 18 drives the pushing plate 2 34, the pushing plate 2 34 squeezes the connecting plate 1 31 in the pushing component 2 28, and the connecting plate 1 31 squeezes the folding bag 32 in the pushing component 2 28, the spring 1 and the telescopic rod in the pushing component 2 28 are compressed, and the gas in the folding bag 32 is discharged. At the same time, the pushing rod 17 drives the pushing plate 1 33 away from the connecting plate 1 31 in the pushing component 1 27, and the spring 1 in the pushing component 1 27 pushes the connecting plate 1 31 to move toward the pushing plate 1 33, driving the folding bag 32 in the pushing component 1 27 to stretch, and external gas enters; when the pushing rod 17 and the pushing rod 2 18 move to the left under the action of the eccentric wheel 14, the movement process of the pushing component 1 27 and the pushing component 2 28 is opposite;

[0057] When the rotating rod 21 drives the connecting net 25 to deflect towards the position close to the second drying hole 38, the second pushing component 28 is squeezed, the folding bladder 32 is compressed, and the internal gas enters the second drying cavity 36 through the air pipe 39 and is discharged from the second drying hole 38 to dry the wafer on the connecting net 25. The folding bladder 32 in the first pushing component 27 is stretched, and the gas in the drying box 26 enters the folding bladder 32 in the first pushing component 27; when the rotating rod 21 drives the connecting net 25 to deflect towards the position close to the first drying hole 37, the first pushing component 27 is squeezed, the folding bladder 32 is compressed, and the internal gas enters the first drying cavity 35 and is discharged from the first drying hole 37 to accelerate the drying process of the wafer on the connecting net 25. The folding bladder 32 in the second pushing component 28 is stretched, and the gas in the drying box 26 enters the folding bladder 32 in the second pushing component 28.

[0058] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. In general, if those of ordinary skill in the art are inspired by it and, without departing from the purpose of the present invention, design similar structural methods and embodiments to this technical solution without creative efforts, they should all fall within the protection scope of the present invention.

Claims

1. A wafer processing device, comprising an etching chamber for etching a wafer, a cleaning chamber for cleaning, a drying component and a fixing component for drying the cleaned wafer, wherein the fixing component is respectively movably disposed in the etching chamber, the cleaning chamber and the drying component, and is characterized in that, The cleaning box and the drying component are both installed with a connecting component, the outer side wall of the drying component and the outer side wall of the cleaning box are connected with a mounting plate, the mounting plate is installed with a driving component, the driving component is arranged between the cleaning box and the drying component, the output end of the driving component is connected to the corrosion box, the driving component is installed with a driving rod, and the two ends of the driving rod are respectively connected to the connecting component in the cleaning box and the connecting component in the drying component; The driving assembly comprises a support plate, a support ring is provided on the support plate, a driving shaft is movably mounted on the support ring, and the other end of the driving shaft is movably arranged to penetrate the side wall of the corrosion box; A driving wheel is movably mounted on the side wall of the corrosion box, and the other end of the driving shaft is connected to the driving wheel; The fixing assembly comprises a connecting wheel 1, and the connecting wheel 1 is arranged on the driving wheel.

2. The wafer processing apparatus according to claim 1, wherein The support plate is arranged on the bottom wall of the mounting plate, and the support plate is arranged between the cleaning box and the drying component. A motor seat is also arranged on the support plate, and a motor is installed on the motor seat and the mounting plate, and the output shaft end of the motor is connected to the driving shaft; an eccentric wheel is installed on the driving shaft, and the eccentric wheel is arranged between the support ring and the corrosion box, and a driving member is movably sleeved on the outer side of the eccentric wheel, and a sleeve 2 is installed on the upper end of the driving member, and the driving rod movably penetrates the sleeve 2, and a pushing rod 1 and a pushing rod 2 are respectively installed on both sides of the driving member, and the pushing rod 1 is arranged close to the drying component, and the pushing rod 2 is arranged close to the cleaning box.

3. A wafer processing device according to claim 2, wherein The connecting assembly includes a fixing plate 1, which is respectively arranged in a cleaning box and a drying assembly. A sleeve 1 is installed on the fixing plate 1, and the sleeve 1 is a cavity structure with openings at both ends. A rotating rod 1 is movably installed in the sleeve 1, and the two ends of the rotating rod 1 respectively extend out of the two sides of the sleeve 1 and are movably installed in the opposite side walls of the cleaning box and the drying assembly. The connecting assembly also includes a toggle member, which is movably arranged on the outer side wall of the cleaning box and the outer side wall of the drying assembly, respectively. One end of the rotating rod 1 is connected to one end of the toggle member, and one end of the driving rod is movably clamped in the other end of the toggle member.

4. A wafer processing device according to claim 3, wherein The two ends of the rotating rod 1 are respectively installed with a connecting piece 1 and a connecting piece 2, the connecting piece 1 and the connecting piece 2 are respectively arranged on both sides of the sleeve 1, and are arranged in the cleaning box and the drying component, and the connecting piece 1 and the connecting piece 2 are installed with a connecting net.

5. A wafer processing apparatus according to claim 4, characterized in that, The drying component includes a drying box, two ends of the rotating rod 1 are respectively movably connected to the two opposite inner walls of the drying box, a pushing component 1 is installed on the outer wall of the drying box, and a pushing component 2 is installed on the outer wall of the cleaning box. The pushing component 1 is movably connected to the pushing rod 1, and the pushing component 2 is movably connected to the pushing rod 2. The pushing component 1 includes a spring 1 and a telescopic rod. The spring is sleeved on the telescopic rod. One end of the spring 1 and one end of the telescopic rod are both installed on the outer wall of the drying box, and the other end of the spring 1 and the other end of the telescopic rod are installed with a connecting plate 1. A folding bag is connected between the connecting plate 1 and the outer wall of the drying box, and the spring 1 and the telescopic rod are arranged in the folding bag.

6. A wafer processing device according to claim 5, characterized in that, A pushing plate 1 is installed at one end of the pushing rod 1, and a pushing plate 2 is installed at one end of the pushing rod 2. The side walls of the pushing plate 1 and the pushing plate 2 are both installed with multiple groups of balls for reducing friction. The pushing plate 1 is movably connected to the connecting plate 1, and the pushing plate 2 is movably connected to the connecting plate 1 in the pushing component 2.

7. A wafer processing apparatus according to claim 6, characterized in that, A drying chamber 1 and a drying chamber 2 are provided in the side wall of the drying box, and a drying hole 1 and a drying hole 2 are provided in the inner wall of the drying box. The drying chamber 1 and the drying hole 1 are connected in a through-connection manner, and the drying chamber 2 is connected in a through-connection manner with the drying hole 2. A ventilation pipe is installed between the drying box and the pushing component 2, and one end of the ventilation pipe is connected in a through-connection manner with the drying chamber 2, and the other end of the ventilation pipe is connected in a through-connection manner with the folding bag in the pushing component 2.

8. A wafer processing apparatus according to claim 7, characterized in that, The fixing assembly also includes a connecting wheel two and a limiting member, the connecting wheel one and the connecting wheel two are respectively arranged at two ends of the limiting member, and the limiting member is equipped with multiple groups of fixed wheels and sliding wheels for fixing, the fixed wheel is fixedly arranged on the limiting member, and the sliding wheel is movably connected to the limiting member, and the fixed wheel and the sliding wheel are staggered, and multiple groups of connecting members three are installed on the outer walls of the sliding wheels, one end of the connecting member three movably penetrates the connecting wheel two, a fixing plate is installed on the connecting wheel two, one end of the connecting member three is arranged in the fixing plate, a spring two is installed between the connecting member three and the fixing plate, fixing rods are installed on the opposite side walls of the sliding wheel and the fixed wheel, and a surrounding member is installed on the sliding wheel, a socket is provided on the fixed wheel, and the surrounding member is movably connected in the socket, and the surrounding member is a grid structure.

9. A wafer processing device according to claim 8, characterized in that, The connecting wheel 2 is provided with a rotating rod 2, and the rotating rod 2 movably passes through one end of the connecting member 3 and the fixed plate. A slide groove is provided in the corrosion box, and the rotating rod 2 is movably clamped in the slide groove.

10. A wafer processing apparatus according to claim 9, characterized in that, A clamping groove is arranged on the side wall of the toggle member, and the end of the driving rod is movably clamped in the clamping groove.

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