A process for filling resin into through-holes of circuit boards for new energy vehicles

Abstract

The present invention discloses a process for filling resin in through-holes of circuit boards for new energy vehicles, comprising the following steps: drilling holes in the circuit board and performing deburring operations; copper plating and full-board electroplating of the circuit board; using a fully automatic screen printing machine to fill the holes in the circuit board with resin; the fully automatic screen printing machine is equipped with a return grease knife arranged along the circuit board from top to bottom, and the circuit board is divided into areas according to the layout of the circuit board plug holes, and the area division rule follows the circuit board being divided into multiple areas from left to right. The present invention is aimed at filling the through-holes of circuit boards for new energy vehicles with resin, adopts an ordinary fully automatic screen printing machine, and adds a return grease knife in the up and down directions to the ordinary fully automatic screen printing machine, and divides the circuit board into areas from left to right, effectively solving the problem that residual resin in the same plug hole will cause the resin in some plug holes to be higher than the resin in other plug holes under the traditional operation mode, thereby protruding from the surface of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of processing and manufacturing automotive circuit boards, and in particular to a process for filling resin into through holes of a circuit board for new energy vehicles. Background Art

[0002] Due to the rapid development of the new energy vehicle industry, the demand for circuit boards for these vehicles is increasing. Manufacturing these circuit boards places high demands on durability and reliability. Resin plugging is an essential step in circuit board manufacturing, especially for new energy vehicle circuit boards with many layers or thicker boards. Holes created during the processing require resin filling, followed by copper plating.

[0003] At present, there are two types of resin plugging processes in circuit boards: the first is to use a vacuum plugging machine to fill the holes with resin. The vacuum plugging machine needs to perform resin plugging on the holes on the entire circuit board, that is, plugging the holes on the entire board. In addition, the equipment of the vacuum plugging machine is expensive and difficult to maintain, resulting in only a handful of manufacturers using vacuum plugging machines; the second is to use a non-vacuum plugging machine to fill the holes with resin. The ordinary fully automatic screen printing machine is mainly used. The equipment cost of the ordinary fully automatic screen printing machine is much lower than that of the vacuum filling machine. At present, ordinary fully automatic screen printing machines are widely used for resin filling. According to the aperture of the plugging hole, a suitable screen is selected. The screen can be a silk screen or an aluminum frame. The resin is introduced into the screen frame or the aluminum frame of the silk screen. The mechanical scraper of the ordinary fully automatic screen printing machine pushes the resin to squeeze the resin into the holes of the circuit board until the holes are filled with resin. After the scraper completes the resin plugging, the grease return knife scrapes the residual resin remaining on the surface of the circuit board back into the resin tank.

[0004] At present, ordinary fully automatic screen printing machines have the following problems. The return knife of the ordinary fully automatic screen printing machine generally scrapes the residual resin back and forth along the left and right sides of the circuit board. In the process of scraping from left to right, the return knife scrapes the residual resin on the left side of the plug hole to the right, leaving the resin on the right side of the plug hole partially remaining. In the process of scraping from right to left, the return knife scrapes the residual resin on the right side of the plug hole to the left, leaving the resin on the left side of the plug hole partially remaining. This causes the resin in some plug holes to be higher than the resin in other plug holes, thereby protruding from the surface of the circuit board, resulting in different heights of subsequent copper plating, which in turn causes the circuit board to be scrapped. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a process for filling resin in through-holes of circuit boards for new energy vehicles, so as to solve the problems existing in the prior art.

[0006] The object of the present invention is achieved through the following technical solutions:

[0007] A process for filling a through-hole of a circuit board for a new energy vehicle with resin comprises the following steps:

[0008] S1. Drill holes on the circuit board and perform deburring operations.

[0009] S2. Perform copper deposition and full-board electroplating on the circuit board to metalize the inner wall of the hole.

[0010] S3. Use a fully automatic screen printing machine to fill the holes of the circuit board with resin. A mechanical scraper pushes the resin into the holes of the circuit board until the holes are filled with resin.

[0011] S4. The fully automatic screen printing machine is equipped with a grease return knife arranged along the top-down direction of the circuit board, and the circuit board is divided into areas according to the layout of the circuit board plug holes. The area division rule follows the principle of dividing the circuit board into multiple areas from left to right. The plug holes in each area are arranged from top to bottom and there is only one in the left-right direction.

[0012] S5. Based on the area division of the circuit board, the distance of each area in the left and right directions is stored in the fully automatic screen printing machine to control the stepping distance of the grease return knife.

[0013] S6. Control the left and right directions of the fully automatic screen printing machine to scrape off the residual resin in the first area. The stepping distance of the left and right directions of the return knife is the distance of the first area in the left and right directions. Control the up and down directions of the return knife to scrape off the residual resin hanging in the first area. Repeat the operation in the remaining areas.

[0014] S7. Bake the circuit board to solidify the resin in the plug hole.

[0015] S8. Use a grinding machine to grind the circuit board to remove excess and protruding resin layer.

[0016] The grinding machine in step S8 is any one of a non-woven fabric grinding machine and a sanding belt grinding machine.

[0017] In step S7, the baking time is 80 minutes and the baking temperature is 120°C.

[0018] The thickness of the mechanical scraper and the grease return knife is 2 cm, and the hardness is 80HR.

[0019] The beneficial effects of the present invention are:

[0020] The present invention aims at filling the through holes of the circuit board for new energy vehicles with resin, and adopts an ordinary fully automatic screen printing machine, avoiding the problem of expensive cost of using vacuum plugging machine equipment. A return grease knife in the upper and lower directions is installed on the ordinary fully automatic screen printing machine, and the circuit board is divided into areas from left to right, ensuring that the plug holes in each area are arranged in the top-down direction and there is only one in the left and right directions. After the fully automatic screen printing machine completes the resin filling of the through holes, the return grease knife in the left and right directions scrapes off the residual resin in the first area, and the return grease knife in the upper and lower directions scrapes off the residual resin scraped out of the first area and pushes the residual resin into the resin tank, and then scrapes off the residual resin in the remaining areas, effectively solving the problem that the residual resin in the same plug hole will cause the resin in some plug holes to be higher than the resin in other plug holes under the traditional operation mode, thereby protruding from the surface of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the process of filling resin into the through-holes of the automotive circuit board of the present invention; DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0023] like Figure 1 As shown, a process for filling a through-hole of a circuit board for a new energy vehicle with resin includes the following steps:

[0024] S1. Drill holes on the circuit board and perform deburring operations.

[0025] S2. Perform copper deposition and full-board electroplating on the circuit board to metalize the inner wall of the hole.

[0026] S3. Use a fully automatic screen printing machine to fill the holes of the circuit board with resin. A mechanical scraper pushes the resin into the holes of the circuit board until the holes are filled with resin.

[0027] S4. The fully automatic screen printing machine is equipped with a grease return knife arranged along the top-down direction of the circuit board, and the circuit board is divided into areas according to the layout of the circuit board plug holes. The area division rule follows the principle of dividing the circuit board into multiple areas from left to right. The plug holes in each area are arranged from top to bottom and there is only one in the left-right direction.

[0028] S5. Based on the area division of the circuit board, the distance of each area in the left and right directions is stored in the fully automatic screen printing machine to control the stepping distance of the grease return knife.

[0029] S6. Control the left and right directions of the fully automatic screen printing machine to scrape off the residual resin in the first area. The stepping distance of the left and right directions of the return knife is the distance of the first area in the left and right directions. Control the up and down directions of the return knife to scrape off the residual resin hanging in the first area. Repeat the operation in the remaining areas.

[0030] S7. Bake the circuit board to solidify the resin in the plug hole.

[0031] S8. Use a grinding machine to grind the circuit board to remove excess and protruding resin layer.

[0032] The grinding machine in step S8 is any one of a non-woven fabric grinding machine and a sanding belt grinding machine.

[0033] In step S7, the baking time is 80 minutes and the baking temperature is 120°C.

[0034] The thickness of the mechanical scraper and the grease return knife is 2 cm, and the hardness is 80HR.

[0035] The present invention relates to a process for filling through-holes with resin on circuit boards for new energy vehicles. This process primarily targets through-holes on circuit boards. However, the circuit boards also contain blind vias and other holes that do not require resin filling. Therefore, before filling the through-holes with resin, ink is inserted into the holes that do not require resin filling and then cured. The present invention then proceeds to the through-hole filling process. After polishing the circuit board in step S8, the ink in the non-resin-filled holes is de-oiled.

[0036] At present, the return fat knife of an ordinary fully automatic screen printing machine is generally set along the workbench and is located in the left and right directions of the circuit board. In step S4, it is necessary to install a return fat knife set along the circuit board from top to bottom. It only needs to be installed according to the installation method of the return fat knife in the left and right directions, that is, a displacement mechanism in the up and down directions is installed, and a return fat knife is installed at the end of the displacement mechanism, and a signal line and a control line are installed. The input end of the signal line is connected to the control system of the fully automatic screen printing machine, and the output end of the signal line is connected to the displacement mechanism, so that the fully automatic screen printing machine can control the return fat knife movement in the up and down directions. The installation of the return fat knife in the up and down directions only needs to be customized with the screen printing machine manufacturer.

[0037] In steps S4 and S5, the circuit board needs to be divided into areas from left to right. The area division rule follows the principle of dividing the circuit board into multiple areas from left to right. The plug holes in each area are arranged from top to bottom and there is only one in the left and right directions. Specifically, when the scraper in the left and right directions scrapes off the residual resin in the first area, the resin on the left side of the plug hole is scraped to the right side of the plug hole. The grease return knife in the up and down directions scrapes off the residual resin and does not scrape the residual resin on the right side to the left side of the plug hole in the second area. In this way, it is ensured that the resin in some plug holes will not be higher than the resin in other plug holes and thus protrude from the surface of the circuit board, thereby ensuring the consistency of the subsequent copper plating height.

[0038] The present invention aims at filling the through holes of the circuit board for new energy vehicles with resin, and adopts an ordinary fully automatic screen printing machine, avoiding the problem of expensive cost of using vacuum plugging machine equipment. A return grease knife in the upper and lower directions is installed on the ordinary fully automatic screen printing machine, and the circuit board is divided into areas from left to right, ensuring that the plug holes in each area are arranged in the top-down direction and there is only one in the left and right directions. After the fully automatic screen printing machine completes the resin filling of the through holes, the return grease knife in the left and right directions scrapes off the residual resin in the first area, and the return grease knife in the upper and lower directions scrapes off the residual resin scraped out of the first area and pushes the residual resin into the resin tank, and then scrapes off the residual resin in the remaining areas, effectively solving the problem that the residual resin in the same plug hole will cause the resin in some plug holes to be higher than the resin in other plug holes under the traditional operation mode, thereby protruding from the surface of the circuit board.

[0039] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A process for filling a through-hole of a circuit board for a new energy vehicle with a resin, characterized in that: The following steps are involved: S1. Drill holes on the circuit board and perform deburring operations; S2. Pour copper and electroplate the entire circuit board to metalize the inner wall of the hole; S3. Use a fully automatic screen printer to fill the holes of the circuit board with resin. A mechanical scraper pushes the resin into the holes of the circuit board until the holes are filled with resin. S4. The fully automatic screen printer is equipped with a grease return blade positioned along the PCB from top to bottom. The PCB is divided into zones based on the via layout. The zone division rule is to divide the PCB from left to right into multiple zones. Within each zone, the vias are arranged from top to bottom, with only one via in each left-right direction. S5. Based on the area division of the circuit board, the left-right distance of each area is stored in the fully automatic screen printer to control the stepping distance of the grease return knife; S6. Control the left and right return blades of the fully automatic screen printing machine to scrape off the residual resin in the first area. The stepping distance of the left and right return blades is the left-right distance of the first area. Control the up and down return blades of the fully automatic screen printing machine to scrape off the residual resin in the first area. Repeat the operation for the remaining areas. S7. Bake the circuit board to cure the resin in the plug hole; S8. Use a grinding machine to grind the circuit board to remove excess and protruding resin layer.

2. The process for filling the through-holes of the circuit board for new energy vehicles with resin according to claim 1 is characterized in that: The grinding machine in step S8 is any one of a non-woven fabric grinding machine and a sanding belt grinding machine.

3. The process for filling the through-holes of the circuit board for new energy vehicles with resin according to claim 1 is characterized in that: In step S7, the baking time is 80 minutes and the baking temperature is 120°C.

4. The process for filling the through-holes of the circuit board for new energy vehicles with resin according to claim 1 is characterized in that: The thickness of the mechanical scraper and the grease return knife is 2 cm, and the hardness is 80HR.

Images