A wafer lateral grasping and moving mechanism

Abstract

The present invention discloses a wafer transverse grabbing and moving mechanism, and relates to the field of wafer production technology. The wafer transverse grabbing and moving mechanism comprises a spin coating box and a drying box, wherein a spin coating workbench and a glue dropper are arranged in the spin coating box, a feed port is provided at the top of the spin coating box, and a tray is connected to the spin coating box through a lifting mechanism, a wafer box is arranged on the tray, and two symmetrically arranged cylinders are fixedly connected to the bottom of the spin coating box. The wafer transverse grabbing and moving mechanism can move the carrier plate transversely and automatically rotate the carrier plate, thereby realizing the transverse grabbing and moving of the wafer body, making the movement of the wafer body more convenient, faster and more efficient; in the process of transverse grabbing and moving the wafer body, it can be automatically centered to ensure the quality of subsequent spin coating; in the process of moving the wafer body, the carrier plate can be covered with a protective cover for protection, which can avoid the influence of airflow and ensure the quality of spin coating.

Description

Technical Field

[0001] The invention relates to the technical field of wafer production, in particular to a wafer lateral grasping and moving mechanism. Background Art

[0002] During the processing of the existing wafers, the wafers are generally grasped by a grasping hand for suction grasping. In some processing steps, it is necessary to grasp the stored wafer and move it directly to the spin coating workbench on the corresponding side for spin coating. After the spin coating is completed, it is moved to a drying box for drying. The processing table on the corresponding side and the storage place are both in the same straight line. The use of a multi-axis robot for grasping and placing is cumbersome and inefficient. At the same time, in order to ensure the stability of the wafer during the grasping and moving, the wafer is usually adsorbed on a suction cup. However, the wafer is prone to shift during adsorption, resulting in the wafer being placed on the spin coating workbench to shift, thereby affecting the quality of subsequent spin coating. In addition, after the spin coating is completed, during the movement, the airflow is likely to affect the photoresist film on the surface of the wafer, thereby also affecting the quality of the spin coating. Summary of the invention

[0003] The object of the present invention is to provide a wafer lateral grasping and moving mechanism to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer lateral grabbing and moving mechanism, comprising a wafer lateral grabbing and moving mechanism, comprising a spin coating box and a drying box, a spin coating workbench and a glue dropping head are arranged in the spin coating box, a feed port is opened at the top of the spin coating box, and a tray is connected to the spin coating box through a lifting mechanism, a wafer box is arranged on the tray, two symmetrically arranged cylinders are fixedly connected to the bottom of the spin coating box, and the telescopic end of each cylinder is fixedly connected to a U-shaped seat, the top of the U-shaped seat is rotatably connected to a first rotating block through a rotating rod, and the top of the first rotating block is fixedly connected to an L-shaped block, the side wall of the L-shaped block is fixedly connected to a carrying plate, and the top of the L-shaped block is rotatably connected to A protective cover is connected, two symmetrically arranged avoidance grooves are provided on the top of the carrier plate, and a mounting groove is provided at the center position of the top of the carrier plate, a moving block is connected to the mounting groove through a moving assembly, and the moving assembly is used to guide the movement of the moving block; an exhaust pipe is fixedly inserted on the top of the moving block, and a suction cup is fixedly connected to the upper end of the exhaust pipe, the lower end of the exhaust pipe passes through the bottom of the moving block and is connected to the bottom of the moving block through a telescopic mechanism, and the telescopic mechanism is used to guide and reset the movement of the exhaust pipe; the rotation of the rotating rod is driven by a driving mechanism, and the driving mechanism is used to drive the rotating rod to rotate, and a centering mechanism for centering the wafer body is provided on the top of the suction cup;

[0005] The centering mechanism includes a plurality of strip openings arranged in an array on the top of the carrier plate, and a moving plate is inserted in each strip opening, a first inclined surface is arranged on the top of the moving plate, each of the moving plates is connected to the bottom of the carrier plate through a first reset mechanism, and the movement of the moving plate is driven by a driving mechanism;

[0006] The pushing mechanism comprises a moving frame, and the inner side wall of the moving frame is fixedly connected with a plurality of first connecting blocks arranged in an array, the side wall of each of the first connecting blocks is fixedly connected with the first pushing block, and the bottom of the pushing block is provided with a second inclined surface, the side wall fixing sleeve of the exhaust pipe is provided with a fixing ring, and the bottom of the carrying plate is fixedly connected with a plurality of support blocks arranged in an array, the side wall of each of the support blocks is rotatably connected with a rotating plate through a rotating shaft, and the side wall of the rotating plate is provided with a sliding groove, the bottom of each of the moving plates is fixedly connected with a connecting plate, and the side wall of the connecting plate is fixedly connected with a pushing pin, the pushing pin is inserted in the sliding groove, and the side wall of the support block is fixedly connected with a limiting pin, the side wall of the moving frame is fixedly connected with a plurality of L-shaped frames arranged in an array, and the side wall of each L-shaped frame is connected to the second pushing block through a second reset mechanism, the second pushing block comprises a third inclined surface and a fourth inclined surface, and a lifting assembly is provided between the moving frame and the carrying plate.

[0007] Preferably, the moving component includes a plurality of guide rails arranged in an array and fixedly connected to the inner side wall of the mounting groove, and each guide rail is slidably connected to a slider, and the side wall of each slider is fixedly connected to two symmetrically arranged sleeves, and a sleeve rod is inserted in each sleeve, and the other end of the sleeve rod is fixed to the side wall of the moving block, and a limiting mechanism for limiting the slider is provided on the top of the moving frame.

[0008] Preferably, the driving mechanism includes a first gear fixedly sleeved on the side wall of each rotating rod, and the bottom of the spin coating box is fixedly connected to a first L-shaped plate, the side wall of the first L-shaped plate is fixedly connected to a first rack, and the side wall of the rotating rod is provided with two symmetrically arranged limit grooves, the top of the U-shaped seat is fixedly connected to a fixed plate, and the side wall of the fixed plate is inserted with two symmetrically arranged first T-shaped guide rods, one end of the first T-shaped guide rod is fixedly connected to a limiting block, and the side wall of each first T-shaped guide rod is sleeved with a first spring.

[0009] Preferably, the limiting mechanism comprises a limiting tube fixedly connected to the bottom of each slider, and the top of the moving frame is fixedly connected to a plurality of groups of limiting rods arranged in an array, and each group of limiting rods has a plurality of groups.

[0010] Preferably, the first reset mechanism includes two symmetrically arranged second T-shaped guide rods fixedly connected to the bottom of each movable plate, and the side walls of the second T-shaped guide rods are sleeved with U-shaped blocks, the U-shaped blocks are fixed to the bottom of the carrying plate, and the side walls of each second T-shaped guide rod are sleeved with a second spring.

[0011] Preferably, the second reset mechanism includes two symmetrically arranged third T-shaped guide rods inserted into the side wall of the L-shaped frame, and one end of the third T-shaped guide rod is fixed to the side wall of the second push block, and the side wall of each of the third T-shaped guide rods is sleeved with a third spring.

[0012] Preferably, the lifting assembly includes a fixed tube fixedly connected to the bottom of the carrying plate, and a moving rod is inserted in the fixed tube, the lower end of the moving rod is fixed to the top of the moving frame, and a first threaded tube is fixedly connected to the bottom of the carrying plate, a first threaded rod is threadedly connected to the first threaded tube, the lower end of the first threaded rod is rotatably connected to the top of the moving frame, and a second gear is fixedly connected to the lower end of the first threaded rod, a second L-shaped plate is fixedly connected to the bottom of the spin coating box, and a second rack is fixedly connected to the side wall of the second L-shaped plate.

[0013] Preferably, the telescopic mechanism includes a plurality of fourth T-shaped guide rods arranged in an array and fixedly connected to the bottom of the moving block, and the side wall of the fourth T-shaped guide rod is sleeved with a second connecting block, the second connecting block is fixed to the side wall of the exhaust pipe, and the side wall of each fourth T-shaped guide rod is sleeved with a fourth spring.

[0014] Preferably, the rotating mechanism includes a fixed block fixedly connected to the top of the L-shaped block, and the side wall of the fixed block is fixedly connected to a first motor, the output end of the first motor is fixedly connected to a second rotating block, and the second rotating block is fixed to the side wall of the protective cover.

[0015] Preferably, the lifting mechanism includes a fixed rod fixedly connected to the top of the spin coating box, and the side wall of the fixed rod is sleeved with a moving tube, the lower end of the moving tube is fixed to the top of the tray, and the top of the tray is fixedly connected to a second threaded tube, the second threaded tube is threadedly connected to a second threaded rod, and the second threaded rod is fixed to the top of the spin coating box, the top of the spin coating box is fixedly connected to a second motor, and the output end of the second motor is fixed to the upper end of the second threaded rod.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) This type of wafer lateral grabbing and moving mechanism is provided with a driving mechanism and a lifting mechanism. When not in use, the protective cover covers the carrier plate for protection, thereby preventing the adhesion of impurities such as dust. During spin coating, when the wafer body needs to be grabbed and moved, the first motor is started first. The rotation of the first motor drives the rotation of the second rotating block, thereby turning the protective cover upward and opening it. Next, the cylinder is started to move the U-shaped seat toward the direction close to the wafer box, and drives the carrier plate to move synchronously, thereby moving the suction cup to the bottom of the wafer body. At the same time, the external negative pressure fan is started to make the suction cup move upward. The air pipe operates the suction cup to suck and grab the wafer body, and then the U-shaped seat and the carrier plate are moved away from the wafer box through the cylinder. When the carrier plate is moved out of the wafer box, the protective cover is rotated down to protect the wafer body to ensure the effect of subsequent spin coating. When the first gear is engaged with the first rack, the rotating rod can be pushed to rotate 180 degrees, and the carrier plate can be driven to rotate 180 degrees, thereby rotating the carrier plate to the side facing the spin coating workbench. At the same time, the limit block can slide from the limit groove and slide on the side wall of the rotating rod. At the same time, the first spring is The first spring is used to press the U-shaped seat and the carrier plate to move toward the wafer box and reset the U-shaped seat. Rotate 180 degrees to the side close to the wafer box, and repeat this process to achieve lateral grabbing and movement of the wafer body, making the movement of the wafer body more convenient, quick and efficient. Next, move the push rod downward to reset it, and use the spin coating workbench to adsorb the wafer body. Then, the wafer body can be spin coated through the glue dispenser. After the spin coating is completed, it can be laterally grabbed and moved to the drying box for drying through the carrying plate on the other side. In addition, during the movement, the carrying plate can be covered with a protective cover to avoid the influence of airflow and ensure the quality of spin coating.

[0018] (2) This wafer transverse grasping and moving mechanism, by setting a centering mechanism, etc., when the wafer body is grasped and moved transversely, after the wafer body is adsorbed on the suction cup, when the second gear is meshed with the second rack, the second gear and the first threaded rod are pushed to rotate, so that the moving frame can move upward. When the moving frame moves upward, the second pushing block is driven to move upward by the L-shaped frame and the second reset mechanism. When the third inclined surface abuts against the rotating plate, the rotating plate can be pushed to rotate upward along the rotating shaft, so that the pushing pin slides upward along the sliding groove, and then the moving plate is pushed upward through the connecting plate. At the same time, the second spring is compressed. At the same time, the first pushing block is separated from the fixed ring. When the moving plate moves upward, the first inclined surface abuts against the wafer body. At the same time, the moving block can move adaptively on the moving component, so as to push the wafer body to perform automatic centering adjustment. After the adjustment is completed, when the moving frame continues to move upward, the limit rod can be inserted into the limit tube to limit the slider, and then the moving block is limited, which is more stable. When the second gear is engaged with the second rack, the second gear and the first threaded rod are pushed to reverse, so that the moving frame can move downward and reset, so that the limiting rod withdraws from the limiting tube, ensuring that the slider can move freely. At the same time, the second pushing block can move to the bottom of the rotating plate for reset under the action of the fourth slope and the third spring, and the second slope slides along the side wall of the fixing ring, so that the first pushing block is against the side wall of the fixing ring, thereby pushing the exhaust pipe and the moving block to the initial center position, ensuring the subsequent automatic centering operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the use state of the present invention;

[0020] Figure 2 A schematic diagram of the use state of the present invention from another perspective;

[0021] Figure 3 It is a schematic diagram of the position of the driving mechanism in the present invention;

[0022] Figure 4 It is a schematic diagram of the position of the mobile component in the present invention;

[0023] Figure 5 It is a schematic diagram of the position of the driving mechanism in the present invention;

[0024] Figure 6 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0025] Figure 7 for Figure 3 A schematic diagram of the enlarged structure at B in the middle;

[0026] Figure 8 for Figure 4 Schematic diagram of the enlarged structure at C in the middle;

[0027] Fig. 9 for Figure 5 Schematic diagram of the enlarged structure at D in the middle;

[0028] Fig.10 for Figure 6 Schematic diagram of the enlarged structure at E in the middle;

[0029] Fig.11 for Fig.10 The enlarged structural diagram at F in the middle;

[0030] Fig.12 for Fig. 9 Schematic diagram of the enlarged structure at G in the middle.

[0031] In the figure: 1, spin coating box; 101, spin coating workbench; 102, glue dispensing head; 2, moving assembly; 201, guide rail; 202, slider; 203, sleeve; 204, sleeve rod; 3, first reset mechanism; 301, second T-shaped guide rod; 302, U-shaped block; 303, second spring; 4, limit mechanism; 401, limit tube; 402, limit rod; 5, second reset mechanism; 501, third T-shaped guide rod; 502, third spring; 6, telescopic mechanism; 601, fourth T-shaped guide rod; 602, second connecting block; 603 , the fourth spring; 7, lifting assembly; 701, fixed tube; 702, moving rod; 703, the first threaded tube; 704, the first threaded rod; 705, the second gear; 706, the second L-shaped plate; 707, the second rack; 8, driving mechanism; 801, the first gear; 802, the first L-shaped plate; 803, the first rack; 804, the limiting groove; 805, the fixed plate; 806, the first T-shaped guide rod; 807, the limiting block; 808, the first spring; 9, the rotating mechanism; 901, the fixed block; 902, the first motor; 903 , second rotating block; 10, lifting mechanism; 1001, fixed rod; 1002, moving tube; 1003, second threaded tube; 1004, second threaded rod; 1005, second motor; 11, drying box; 12, feed port; 13, wafer box; 14, cylinder; 15, U-shaped seat; 16, rotating rod; 17, first rotating block; 18, L-shaped block; 19, carrier plate; 20, protective cover; 21, avoidance groove; 22, installation groove; 23, moving block; 24, suction cup; 25, exhaust pipe; 26, centering mechanism; 2601, Strip opening; 2602, moving plate; 2603, first inclined plane; 27, pushing mechanism; 2701, moving frame; 2702, supporting block; 2703, rotating shaft; 2704, rotating plate; 2705, connecting plate; 2706, sliding groove; 2707, pushing pin; 2708, second pushing block; 2709, third inclined plane; 2710, fourth inclined plane; 2711, L-shaped frame; 2712, limiting pin; 28, first connecting block; 29, first pushing block; 2901, second inclined plane; 30, fixing ring; 31, tray. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 12The present invention provides a technical solution: a wafer lateral grabbing and moving mechanism, including a wafer lateral grabbing and moving mechanism, including a spin coating box 1 and a drying box 11, a spin coating workbench 101 and a glue dispensing head 102 are arranged in the spin coating box 1, a feeding port 12 is opened on the top of the spin coating box 1, and a tray 31 is connected to the spin coating box 1 through a lifting mechanism 10, a wafer box 13 is arranged on the tray 31, two symmetrically arranged cylinders 14 are fixedly connected to the bottom of the spin coating box 1, and the telescopic end of each cylinder 14 is fixedly connected to a U-shaped seat 15, the top of the U-shaped seat 15 is rotatably connected to a first rotating block 17 through a rotating rod 16, and the top of the first rotating block 17 is fixedly connected to an L-shaped block 18, the side wall of the L-shaped block 18 is fixedly connected to a carrier plate 19, and the top of the L-shaped block 18 is rotatably connected to a protective plate through a rotating mechanism 9. Cover 20, two symmetrically arranged avoidance grooves 21 are provided on the top of the carrier plate 19, and an installation groove 22 is provided at the center position of the top of the carrier plate 19, and a moving block 23 is connected to the installation groove 22 through a moving component 2, and the moving component 2 is used to guide the movement of the moving block 23; an exhaust pipe 25 is fixedly inserted on the top of the moving block 23, and a suction cup 24 is fixedly connected to the upper end of the exhaust pipe 25, and the lower end of the exhaust pipe 25 passes through the bottom of the moving block 23 and is connected to the bottom of the moving block 23 through a telescopic mechanism 6, and the telescopic mechanism 6 is used to guide and reset the movement of the exhaust pipe 25; the rotation of the rotating rod 16 is driven by the driving mechanism 8, and the driving mechanism 8 is used to drive the rotating rod 16 to rotate, and a centering mechanism 26 for centering the wafer body is provided on the top of the suction cup 24.

[0034] The centering mechanism 26 includes a plurality of array-arranged strip openings 2601 opened on the top of the carrier plate 19, and a movable plate 2602 is inserted in each strip opening 2601. A first inclined surface 2603 is provided on the top of the movable plate 2602. Each movable plate 2602 is connected to the bottom of the carrier plate 19 via a first reset mechanism 3, and the movement of the movable plate 2602 is driven by a driving mechanism 27.

[0035] The pushing mechanism 27 includes a moving frame 2701, and the inner side wall of the moving frame 2701 is fixedly connected with a plurality of first connecting blocks 28 arranged in an array, the side wall of each first connecting block 28 is fixedly connected with a first pushing block 29, and the bottom of the pushing block is provided with a second inclined surface 2901, the side wall of the exhaust pipe 25 is fixedly sleeved with a fixing ring 30, and the bottom of the carrying plate 19 is fixedly connected with a plurality of supporting blocks 2702 arranged in an array, the side wall of each supporting block 2702 is rotatably connected with a rotating plate 2704 through a rotating shaft 2703, and a sliding groove 2706 is provided on the side wall of the rotating plate 2704, the bottom of each moving plate 2602 is fixedly connected with a connecting plate 2705, and the side wall of the connecting plate 2705 is fixedly connected with a pushing pin 2707, the pushing pin 2707 is inserted in the sliding groove 2706, and the side wall of the supporting block 2702 is fixedly connected with a limited The movable frame 2701 is provided with a positioning pin 2712, and the side wall of the movable frame 2701 is fixedly connected with a plurality of L-shaped frames 2711 arranged in an array, and the side wall of each L-shaped frame 2711 is connected with a second push block 2708 through a second reset mechanism 5, and the second push block 2708 includes a third inclined surface 2709 and a fourth inclined surface 2710, and a lifting assembly 7 is arranged between the movable frame 2701 and the carrier plate 19, which can perform lateral movement and automatic rotation of the carrier plate 19, so as to realize lateral grasping and movement of the wafer body, making the movement of the wafer body more convenient, fast and efficient; in the process of lateral grasping and movement of the wafer body, it can be automatically centered to ensure the quality of subsequent spin coating; in the process of moving the wafer body, the protective cover 20 can be used to cover the carrier plate 19 for protection, which can avoid the influence of airflow and ensure the quality of spin coating.

[0036] The moving component 2 includes a plurality of guide rails 201 arranged in an array and fixedly connected to the inner wall of the mounting groove 22, and each guide rail 201 is slidably connected to a slider 202, and the side wall of each slider 202 is fixedly connected to two symmetrically arranged sleeves 203, and each sleeve 203 is inserted with a sleeve rod 204, and the other end of the sleeve rod 204 is fixed to the side wall of the moving block 23, and a limiting mechanism 4 for limiting the slider 202 is provided on the top of the moving frame 2701, and the moving block 23 can move adaptively on the moving component 2, so as to push the wafer body to automatically adjust the center, and when moving, the slider 202 slides along the guide rail 201.

[0037] The driving mechanism 8 includes a first gear 801 fixedly sleeved on the side wall of each rotating rod 16, and a first L-shaped plate 802 is fixedly connected to the bottom of the spin coating box 1, and a first rack 803 is fixedly connected to the side wall of the first L-shaped plate 802, and two symmetrically arranged limiting grooves 804 are opened on the side wall of the rotating rod 16, and a fixed plate 805 is fixedly connected to the top of the U-shaped seat 15, and two symmetrically arranged first T-shaped guide rods 806 are inserted into the side wall of the fixed plate 805, one end of the first T-shaped guide rod 806 is fixedly connected to the limiting block 807, and the side wall of each first T-shaped guide rod 806 is sleeved with a first spring 808, When the first gear 801 is meshed with the first rack 803, it can push the rotating rod 16 to rotate 180 degrees and drive the carrying plate 19 to rotate 180 degrees, thereby rotating the carrying plate 19 to the side facing the spin coating workbench 101. At the same time, the limit block 807 can slide from the limit groove 804 and slide on the side wall of the rotating rod 16. At the same time, the first spring 808 is compressed. When the limit block 807 is aligned with another limit groove 804, under the action of the first spring 808, the limit block 807 is in the other limit groove 804, thereby limiting the rotating rod 16, which is more stable and reliable.

[0038] The limiting mechanism 4 includes a limiting tube 401 fixedly connected to the bottom of each slider 202, and a plurality of groups of limiting rods 402 arranged in an array are fixedly connected to the top of the moving frame 2701, and the number of each group of limiting rods 402 is multiple. After the automatic centering adjustment of the wafer body is completed, when the moving frame 2701 continues to move upward, the limiting rod 402 can be inserted into the limiting tube 401 to limit the slider 202, and then limit the moving block 23, which is more stable and reliable.

[0039] The first reset mechanism 3 includes two symmetrically arranged second T-shaped guide rods 301 fixedly connected to the bottom of each movable plate 2602, and the side wall of the second T-shaped guide rod 301 is sleeved with a U-shaped block 302, the U-shaped block 302 is fixed to the bottom of the supporting plate 19, and the side wall of each second T-shaped guide rod 301 is sleeved with a second spring 303, which guides and resets the movement of the movable plate 2602.

[0040] The second reset mechanism 5 includes two symmetrically arranged third T-shaped guide rods 501 inserted into the side walls of the L-shaped frame 2711, and one end of the third T-shaped guide rod 501 is fixed to the side wall of the second push block 2708. The side wall of each third T-shaped guide rod 501 is sleeved with a third spring 502, which guides and resets the movement of the second push block 2708.

[0041] The lifting assembly 7 includes a fixed tube 701 fixedly connected to the bottom of the carrier plate 19, and a moving rod 702 is inserted into the fixed tube 701, the lower end of the moving rod 702 is fixed to the top of the moving frame 2701, and the bottom of the carrier plate 19 is fixedly connected to a first threaded tube 703, the first threaded tube 703 is internally threaded with a first threaded rod 704, the lower end of the first threaded rod 704 is rotatably connected to the top of the moving frame 2701, and the lower end of the first threaded rod 704 is fixedly connected to a second gear 705, the bottom of the spin coating box 1 is fixedly connected to a second L-shaped plate 706, and the side wall of the second L-shaped plate 706 is fixedly connected to a second rack 707, when the wafer body is being subjected to the spin coating operation. During the horizontal grasping movement, after the wafer body is adsorbed on the suction cup 24, when the second gear 705 is meshed with the second rack 707, the second gear 705 and the first threaded rod 704 are pushed to rotate, so that the movable frame 2701 can move upward. When the movable frame 2701 moves upward, the second pushing block 2708 is driven to move upward through the L-shaped frame 2711 and the second reset mechanism 5. When the third inclined surface 2709 is against the rotating plate 2704, the rotating plate 2704 can be pushed to rotate upward along the rotating shaft 2703, so that the pushing pin 2707 slides upward along the slide groove 2706, and then pushes the movable plate 2602 to move upward through the connecting plate 2705.

[0042] The telescopic mechanism 6 includes a plurality of fourth T-shaped guide rods 601 arranged in an array and fixedly connected to the bottom of the moving block 23, and the side wall of the fourth T-shaped guide rod 601 is sleeved with a second connecting block 602, the second connecting block 602 is fixed to the side wall of the exhaust pipe 25, and the side wall of each fourth T-shaped guide rod 601 is sleeved with a fourth spring 603. After the centering adjustment of the wafer body is completed, when the moving plate 2602 continues to move upward, it can drive the wafer body, the exhaust pipe 25 and the suction cup 24 to move upward. At the same time, the fourth spring 603 is compressed, thereby avoiding damage to the wafer body.

[0043] The rotating mechanism 9 includes a fixed block 901 fixedly connected to the top of the L-shaped block 18, and the side wall of the fixed block 901 is fixedly connected to the first motor 902, the output end of the first motor 902 is fixedly connected to the second rotating block 903, and the second rotating block 903 is fixed to the side wall of the protective cover 20. The first motor 902 is started, and the rotation of the first motor 902 drives the rotation of the second rotating block 903, thereby driving the protective cover 20 to rotate, thereby realizing the rotation opening and closing of the protective cover 20.

[0044] The lifting mechanism 10 includes a fixed rod 1001 fixedly connected to the top of the spin coating box 1, and the side wall of the fixed rod 1001 is sleeved with a moving tube 1002, the lower end of the moving tube 1002 is fixed to the top of the tray 31, and the top of the tray 31 is fixedly connected to a second threaded tube 1003, the second threaded tube 1003 is internally threadedly connected to a second threaded rod 1004, and the second threaded rod 1004 is fixed to the top of the spin coating box 1, and the top of the spin coating box 1 is fixedly connected to a second motor 1005, and the output end of the second motor 1005 is connected to the second threaded rod 1 The upper end of 004 ​​is fixed, and the second motor 1005 is started. The rotation of the second motor 1005 drives the rotation of the second threaded rod 1004, thereby driving the tray 31 and the wafer box 13 to move downward. After the wafer body is grasped and moved, the tray 31 and the wafer box 13 can be moved downward by a certain distance to ensure normal grasping next time. It is more convenient and quick to use, and can improve the efficiency of grasping and moving. When the wafer box 13 is completely grasped and moved, the wafer box 13 can be lifted upward through the feed port 12 to replace other wafer boxes 13.

[0045] Working principle: When in use and when not in use, the carrier plate 19 is covered with a protective cover 20 for protection to prevent the adhesion of dust and other impurities. During spin coating, when the wafer body needs to be grasped and moved, the first motor 902 is started first. The rotation of the first motor 902 drives the rotation of the second rotating block 903, and then the protective cover 20 is rotated upward to open. Then, the cylinder 14 is started to move the U-shaped seat 15 toward the direction close to the wafer box 13, and drive the carrier plate 19 to move synchronously, thereby moving the suction cup 24 to the bottom of the wafer body. At the same time, the external negative pressure fan is started so that the exhaust pipe 25 performs an exhaust operation on the suction cup 24, so that the wafer body can be adsorbed and grasped.

[0046] Next, the cylinder 14 is used to move the U-shaped seat 15 and the carrier plate 19 away from the wafer box 13. After the carrier plate 19 is moved out of the wafer box 13, the protective cover 20 is rotated down to protect the wafer body to ensure the effect of subsequent spin coating.

[0047] When the second gear 705 is meshed with the second rack 707, the second gear 705 and the first threaded rod 704 are pushed to rotate, so that the moving frame 2701 can move upward. When the moving frame 2701 moves upward, the second pushing block 2708 is driven to move upward through the L-shaped frame 2711 and the second reset mechanism 5. When the third inclined surface 2709 abuts against the rotating plate 2704, the rotating plate 2704 can be pushed to rotate upward along the rotating shaft 2703, so that the pushing pin 2707 slides upward along the slide groove 2706, and then pushes the moving plate 2602 to move upward through the connecting plate 2705. At the same time, the second spring 303 is compressed. At the same time, the first pushing block 29 is disengaged from the fixing ring 30. When the moving plate 2602 moves upward, the first inclined surface 2603 abuts against the wafer body. At the same time, the moving block 23 can move adaptively on the moving component 2, thereby pushing the wafer body to be automatically centered.

[0048] After the adjustment is completed, when the moving frame 2701 continues to move upward, the limit rod 402 can be inserted into the limit tube 401 to limit the slider 202, and then limit the moving block 23, which is more stable and reliable. When the rotating plate 2704 is against the limit pin 2712, the rotating plate 2704 no longer rotates. At this time, the third inclined surface 2709 slides along the side wall of the rotating plate 2704, the third spring 502 is compressed, and the second push block 2708 can move to the top of the rotating plate 2704. At this time, the moving plate 2602 can move downward and reset under the action of the second spring 303, so that in the process of lateral grasping and moving of the wafer body, it can be automatically centered to ensure the quality of subsequent spin coating.

[0049] When the first gear 801 is meshed with the first rack 803, it can push the rotating rod 16 to rotate 180 degrees and drive the carrying plate 19 to rotate 180 degrees, thereby rotating the carrying plate 19 to the side facing the spin coating workbench 101. At the same time, the limit block 807 can slide from the limit groove 804 and slide on the side wall of the rotating rod 16. At the same time, the first spring 808 is compressed. When the limit block 807 is aligned with another limit groove 804, under the action of the first spring 808, the limit block 807 is in the other limit groove 804, thereby limiting the rotating rod 16, which is more stable and reliable.

[0050] When the carrier plate 19 is about to reach the spin coating workbench 101, the protective cover 20 is rotated upward to open, and then the carrier plate 19 can be moved to the top of the spin coating workbench 101 and the cylinder 14 is stopped. At the same time, the suction cup 24 is released, and then the wafer body is lifted up by the push rod on the spin coating workbench 101, and then the U-shaped seat 15 and the carrier plate 19 are moved and reset in the direction close to the wafer box 13 by the cylinder 14. In the process of moving, the carrier plate 19 can be rotated 180 degrees to the side close to the wafer box 13, and so on and so forth, so as to realize the lateral grasping and moving of the wafer body, making the movement of the wafer body more convenient, quick and efficient.

[0051] Next, the push rod is moved downward to reset, and the spin coating workbench 101 is used to adsorb the wafer body. Then, the wafer body can be spin coated through the glue head 102. After the spin coating is completed, it can be horizontally grabbed by the carrier plate 19 on the other side and moved to the drying box 11 for drying. In addition, during the movement, the protective cover 20 can be used to cover the carrier plate 19 for protection, which can avoid the influence of airflow and ensure the quality of spin coating.

[0052] When the carrier plate 19 moves toward the direction close to the wafer box 13, when the second gear 705 engages with the second rack 707, the second gear 705 and the first threaded rod 704 can be pushed to reverse, so that the movable frame 2701 can move downward and reset, so that the limiting rod 402 withdraws from the limiting tube 401, ensuring that the slider 202 can move freely. At the same time, the second push block 2708 can move to the bottom of the rotating plate 2704 for reset under the action of the fourth inclined surface 2710 and the third spring 502, and the second inclined surface 2901 slides along the side wall of the fixed ring 30, so that the first push block 29 is against the side wall of the fixed ring 30, thereby pushing the exhaust pipe 25 and the movable block 23 to the center initial position, ensuring the subsequent automatic centering operation.

Claims

1. A wafer lateral grabbing and moving mechanism, comprising a spin coating box (1) and a drying box (11), wherein a spin coating workbench (101) and a glue dispensing head (102) are arranged in the spin coating box (1), characterized in that: The top of the spin coating box (1) is provided with a feed port (12), and a tray (31) is connected to the spin coating box (1) via a lifting mechanism (10), a wafer box (13) is arranged on the tray (31), the bottom of the spin coating box (1) is fixedly connected to two symmetrically arranged cylinders (14), and the telescopic end of each cylinder (14) is fixedly connected to a U-shaped seat (15), the top of the U-shaped seat (15) is rotatably connected to a first rotating block (17) via a rotating rod (16), and the top of the first rotating block (17) is fixedly connected to an L-shaped block (18), the side wall of the L-shaped block (18) is fixedly connected to a carrying plate (19), and the top of the L-shaped block (18) is rotatably connected to a protective cover (20) via a rotating mechanism (9), the top of the carrying plate (19) is provided with two symmetrically arranged avoidance grooves (21), and the supporting plate (19) is provided with a protective cover (20) on its upper side. A mounting groove (22) is provided at the center of the top, and a moving block (23) is connected to the mounting groove (22) via a moving assembly (2), and the moving assembly (2) is used to guide the movement of the moving block (23); an exhaust pipe (25) is fixedly inserted at the top of the moving block (23), and a suction cup (24) is fixedly connected to the upper end of the exhaust pipe (25), and the lower end of the exhaust pipe (25) passes through the bottom of the moving block (23) and is connected to the bottom of the moving block (23) via a telescopic mechanism (6), and the telescopic mechanism (6) is used to guide and reset the movement of the exhaust pipe (25); the rotation of the rotating rod (16) is driven by a driving mechanism (8), and the driving mechanism (8) is used to drive the rotating rod (16) to rotate, and a centering mechanism (26) for centering the wafer body is provided at the top of the suction cup (24); The centering mechanism (26) comprises a plurality of strip openings (2601) arranged in an array on the top of the carrier plate (19), and a movable plate (2602) is inserted in each strip opening (2601), and a first inclined surface (2603) is provided on the top of the movable plate (2602). Each movable plate (2602) is connected to the bottom of the carrier plate (19) via a first reset mechanism (3), and the movement of the movable plate (2602) is driven by a driving mechanism (27); The pushing mechanism (27) comprises a moving frame (2701), and the inner side wall of the moving frame (2701) is fixedly connected to a plurality of first connecting blocks (28) arranged in an array, the side wall of each of the first connecting blocks (28) is fixedly connected to a first pushing block (29), and the bottom of the pushing block is provided with a second inclined surface (2901), the side wall fixed sleeve of the exhaust pipe (25) is provided with a fixing ring (30), and the bottom of the carrying plate (19) is fixedly connected to a plurality of supporting blocks (2702) arranged in an array, the side wall of each of the supporting blocks (2702) is rotatably connected to a rotating plate (2704) via a rotating shaft (2703), and a sliding groove (2706) is provided on the side wall of each of the moving plates (260 2) is fixedly connected to a connecting plate (2705) at the bottom, and a push pin (2707) is fixedly connected to the side wall of the connecting plate (2705), the push pin (2707) is inserted into the slide groove (2706), and the side wall of the support block (2702) is fixedly connected to a limit pin (2712), the side wall of the moving frame (2701) is fixedly connected to a plurality of L-shaped frames (2711) arranged in an array, and the side wall of each L-shaped frame (2711) is connected to a second push block (2708) through a second reset mechanism (5), the second push block (2708) includes a third inclined surface (2709) and a fourth inclined surface (2710), and a lifting component (7) is arranged between the moving frame (2701) and the carrying plate (19).

2. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The moving assembly (2) comprises a plurality of guide rails (201) arranged in an array and fixedly connected to the inner side wall of the mounting groove (22), and each guide rail (201) is slidably connected to a slider (202), and the side wall of each slider (202) is fixedly connected to two symmetrically arranged sleeves (203), and each sleeve (203) is inserted with a sleeve rod (204), the other end of the sleeve rod (204) is fixed to the side wall of the moving block (23), and a limiting mechanism (4) for limiting the slider (202) is provided on the top of the moving frame (2701).

3. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The driving mechanism (8) comprises a first gear (801) fixedly sleeved on the side wall of each rotating rod (16); a first L-shaped plate (802) is fixedly connected to the bottom of the spin coating box (1); a first rack (803) is fixedly connected to the side wall of the first L-shaped plate (802); two symmetrically arranged limiting grooves (804) are provided on the side wall of the rotating rod (16); a fixed plate (805) is fixedly connected to the top of the U-shaped seat (15); two symmetrically arranged first T-shaped guide rods (806) are inserted into the side wall of the fixed plate (805); one end of the first T-shaped guide rod (806) is fixedly connected to a limiting block (807); and a first spring (808) is sleeved on the side wall of each first T-shaped guide rod (806).

4. The wafer lateral grabbing and moving mechanism according to claim 2, characterized in that: The limiting mechanism (4) comprises a limiting tube (401) fixedly connected to the bottom of each slider (202), and the top of the moving frame (2701) is fixedly connected to a plurality of groups of limiting rods (402) arranged in an array, and each group of limiting rods (402) is multiple in number.

5. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The first reset mechanism (3) comprises two symmetrically arranged second T-shaped guide rods (301) fixedly connected to the bottom of each movable plate (2602), and the side walls of the second T-shaped guide rods (301) are sleeved with U-shaped blocks (302), the U-shaped blocks (302) are fixed to the bottom of the carrying plate (19), and the side walls of each second T-shaped guide rod (301) are sleeved with second springs (303).

6. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The second reset mechanism (5) comprises two symmetrically arranged third T-shaped guide rods (501) inserted into the side wall of the L-shaped frame (2711), one end of the third T-shaped guide rod (501) is fixed to the side wall of the second push block (2708), and the side wall of each of the third T-shaped guide rods (501) is sleeved with a third spring (502).

7. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The lifting assembly (7) comprises a fixed tube (701) fixedly connected to the bottom of the carrier plate (19), and a moving rod (702) is inserted into the fixed tube (701), the lower end of the moving rod (702) is fixed to the top of the moving frame (2701), and the bottom of the carrier plate (19) is fixedly connected to a first threaded tube (703), the first threaded tube (703) is internally threadedly connected to a first threaded rod (704), the lower end of the first threaded rod (704) is rotatably connected to the top of the moving frame (2701), and the lower end of the first threaded rod (704) is fixedly connected to a second gear (705), the bottom of the spin coating box (1) is fixedly connected to a second L-shaped plate (706), and the side wall of the second L-shaped plate (706) is fixedly connected to a second rack (707).

8. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The telescopic mechanism (6) comprises a plurality of fourth T-shaped guide rods (601) arranged in an array and fixedly connected to the bottom of the moving block (23), and the side walls of the fourth T-shaped guide rods (601) are sleeved with second connecting blocks (602), the second connecting blocks (602) are fixed to the side walls of the exhaust pipe (25), and the side walls of the fourth T-shaped guide rods (601) are sleeved with fourth springs (603).

9. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The rotating mechanism (9) comprises a fixed block (901) fixedly connected to the top of the L-shaped block (18), a first motor (902) being fixedly connected to the side wall of the fixed block (901), a second rotating block (903) being fixedly connected to the output end of the first motor (902), and the second rotating block (903) being fixed to the side wall of the protective cover (20).

10. The wafer lateral grabbing and moving mechanism according to claim 1, characterized in that: The lifting mechanism (10) comprises a fixed rod (1001) fixedly connected to the top of the spin coating box (1), and a moving tube (1002) is sleeved on the side wall of the fixed rod (1001), the lower end of the moving tube (1002) is fixed to the top of the tray (31), and the top of the tray (31) is fixedly connected to a second threaded tube (1003), the second threaded tube (1003) is internally threadedly connected to a second threaded rod (1004), and the second threaded rod (1004) is fixed to the top of the spin coating box (1), and the top of the spin coating box (1) is fixedly connected to a second motor (1005), and the output end of the second motor (1005) is fixed to the upper end of the second threaded rod (1004).

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