A PCB device welding control method, device and system

Abstract

The embodiment of the present application provides a PCB device welding control method, device and system. In the PCB device welding control method, during the welding process, the temperature-related parameters of the PCB are obtained; it is determined whether the temperature-related parameters of the PCB reach the first preset parameter standard; if the temperature-related parameters reach the first preset parameter standard, the PCB temperature after the next electronic component to be welded is calculated and used as the predicted PCB temperature; it is determined whether the predicted PCB temperature reaches the first preset temperature threshold; if the predicted PCB temperature reaches the first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced and the heat dissipation power of the heat dissipation component for the PCB is increased, so that the temperature-related parameters are reduced to reach the second preset parameter standard. In this way, the welding stability of electronic components on the PCB is improved.

Description

Technical Field

[0001] The present application relates to the field of welding control technology, and in particular to a PCB device welding control method, device and system. Background Art

[0002] PCB (Printed Circuit Board) welding refers to the process of fixing and connecting electronic components on the PCB through welding. For electronic components that require higher welding accuracy, in the process of welding electronic components to the PCB, it is necessary to arrange welding materials on each electronic component that needs to be welded, and weld multiple electronic components to the PCB one by one, so as to ensure the welding accuracy of the electronic components on the PCB.

[0003] However, in the process of soldering multiple electronic components to the PCB one by one, the electronic components soldered subsequently may become unstable, resulting in poor soldering stability of the electronic components soldered later. Summary of the invention

[0004] Based on the above problems, the embodiments of the present application provide a PCB device welding control method, device and system, aiming to improve the welding stability of electronic components on the PCB.

[0005] The embodiments of the present application disclose the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a PCB device welding control method, the method comprising:

[0007] During the welding process, obtaining temperature-related parameters of the PCB;

[0008] Determining whether a temperature-related parameter of the PCB reaches a first preset parameter standard;

[0009] If the temperature-related parameter reaches the first preset parameter standard, the PCB temperature after the next electronic component to be welded is calculated and used as the predicted PCB temperature;

[0010] Determining whether the predicted PCB temperature reaches a first preset temperature threshold;

[0011] If the predicted PCB temperature reaches a first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced and the heat dissipation power of the heat dissipation assembly for the PCB is increased, so that the temperature-related parameters drop to reach a second preset parameter standard.

[0012] In a possible implementation, the temperature-related parameters include real-time temperature and temperature rise acceleration;

[0013] The step of determining whether the temperature-related parameter of the PCB reaches a first preset parameter standard comprises:

[0014] Determining whether the real-time temperature is not less than a second preset temperature threshold;

[0015] If the real-time temperature is not less than the second preset temperature threshold, determining whether the temperature rise acceleration is not less than the preset rise acceleration threshold;

[0016] If the temperature rise acceleration is not less than the preset rise acceleration threshold, it is determined that the temperature-related parameter reaches the first preset parameter standard.

[0017] In a possible implementation, the step of calculating the PCB temperature after the next electronic component to be soldered is soldered and using it as a step of predicting the PCB temperature includes:

[0018] Obtain welding parameters and device parameters of the next electronic component to be welded;

[0019] According to the real-time temperature, the temperature rise acceleration, the welding parameters and the device parameters, the temperature rise amplitude of the PCB after the next electronic component to be welded is predicted;

[0020] The predicted PCB temperature is determined according to the temperature rise amplitude and the real-time temperature.

[0021] In a possible implementation, the step of reducing the welding speed of the next electronic component to be welded and increasing the heat dissipation power of the heat dissipation component for the PCB includes:

[0022] Determining a first influencing factor and a second influencing factor according to the temperature rise amplitude;

[0023] The welding speed of the next electronic component to be welded is correspondingly reduced according to the first influencing factor, and the heat dissipation power of the heat dissipation component for the PCB is correspondingly increased according to the second influencing factor.

[0024] In a possible implementation, reducing the welding speed of the next electronic component to be welded according to the first influencing factor includes:

[0025] Obtaining the number of welding points of the next electronic component to be welded;

[0026] When the number of the welding points includes at least two, extending the welding interval time between the welding points according to the first influencing factor;

[0027] When the number of the welding points is only one, the welding waiting time of the next electronic component to be welded is extended according to the first influencing factor.

[0028] In a possible implementation, increasing the heat dissipation power of the heat dissipation component for the PCB according to the second influencing factor includes:

[0029] Obtaining the current heat dissipation power of the heat dissipation component for the PCB;

[0030] The current heat dissipation power is increased based on the second influencing factor, and the heat dissipation component is cooled by the increased heat dissipation power.

[0031] In a possible implementation, before the step of determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature, the PCB device welding control method further includes:

[0032] Determine whether a soldering operation is currently being performed on electronic components;

[0033] If the electronic component is not currently being soldered, the step of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature" is directly executed;

[0034] If a soldering operation is currently being performed on an electronic component, the real-time temperature is temperature compensated, and based on the compensated real-time temperature, the step of "determining the predicted PCB temperature based on the temperature rise amplitude and the real-time temperature" is performed.

[0035] In a possible implementation, the step of performing temperature compensation on the real-time temperature includes:

[0036] Determine the current soldering level of electronic components;

[0037] Determining a compensation temperature according to the welding degree and the real-time temperature;

[0038] The real-time temperature is temperature compensated according to the compensation temperature to obtain the compensated real-time temperature.

[0039] In a second aspect, an embodiment of the present application provides a PCB device welding control device, comprising:

[0040] A first acquisition module, used to acquire temperature-related parameters of the PCB during the welding process;

[0041] A first judgment module, used to judge whether the temperature-related parameters of the PCB meet the first preset parameter standard;

[0042] A prediction module, configured to calculate the PCB temperature of the next electronic component to be welded after welding is completed and use it as the predicted PCB temperature when the temperature-related parameter reaches the first preset parameter standard;

[0043] A second judgment module is used to determine whether the predicted PCB temperature reaches a first preset temperature threshold;

[0044] The welding control module is used to reduce the welding speed of the next electronic component to be welded and increase the heat dissipation power of the heat dissipation component for the PCB when the predicted PCB temperature reaches the first preset temperature threshold, so that the temperature-related parameters are reduced to reach the second preset parameter standard.

[0045] In a third aspect, an embodiment of the present application provides a PCB device welding control system, on which a computer program is stored, and when the program is executed by a processor, any possible PCB device welding control method in the first aspect is implemented.

[0046] Compared with the prior art, the present application has the following beneficial effects: the embodiment of the present application provides a PCB device welding control method, device and system. In the PCB device welding control method, it is necessary to obtain the temperature-related parameters of the PCB and determine whether the temperature-related parameters of the PCB reach the first preset parameter standard. Since the temperature-related parameters of the PCB reflect the current temperature condition and temperature change condition of the PCB, by matching and judging between the first preset parameter standard and the temperature-related parameters of the PCB, it can be effectively determined whether the current temperature condition of the PCB will have a negative impact on the welding of the next electronic component. Subsequently, when the temperature-related parameters of the PCB reach the first preset parameter standard, the predicted PCB temperature of the next electronic component to be welded is calculated, and when the predicted PCB temperature reaches the first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced, and the heat dissipation power of the heat dissipation component for the PCB is increased, so that the temperature-related parameters of the PCB are reduced to the second preset parameter standard, thereby avoiding the problem of loose welding of the electronic component during the welding process, and improving the welding stability of the electronic component on the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0048] Figure 1 A schematic diagram of a flow chart of a PCB device welding control method provided in an embodiment of the present application;

[0049] Figure 2 A schematic flow chart of another PCB device welding control method provided in an embodiment of the present application;

[0050] Figure 3 A schematic flow chart of another PCB device welding control method provided in an embodiment of the present application;

[0051] Figure 4 A schematic flow chart of another PCB device welding control method provided in an embodiment of the present application;

[0052] Figure 5 A schematic diagram of the structure of a PCB device welding control device provided in an embodiment of the present application;

[0053] Figure 6 A schematic diagram of the structure of a PCB welding control system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. It should be particularly noted that the embodiments described in the embodiments of the present application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0055] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0056] At present, when multiple electronic components are welded to a PCB one by one by single-point welding, the subsequently welded electronic components may become unstable. In actual application scenarios, when multiple electronic welding components are welded to a PCB one by one, since the welding of electronic components needs to be based on welding materials in a high temperature state, each welded electronic component will have a certain degree of temperature accumulation on the welded PCB, causing the temperature of the PCB to gradually increase. Therefore, when the welding speed of each electronic component remains unchanged, since the temperature of the PCB is in a gradually increasing state, the actual temperature of the electronic component is too high when the welding is completed, and the welding material between the electronic component and the PCB will not immediately solidify and convert into a solid state, but may melt to varying degrees, resulting in unstable welding of the electronic component, which reduces the welding stability of the electronic component on the PCB.

[0057] In order to solve the above problems, the embodiment of the present application provides a PCB device welding control method, device and system. In its PCB device welding control method, it is necessary to obtain the temperature-related parameters of the PCB and determine whether the temperature-related parameters of the PCB reach the first preset parameter standard. Since the temperature-related parameters of the PCB reflect the current temperature condition and temperature change condition of the PCB, through the matching judgment between the first preset parameter standard and the PCB temperature-related parameters, it can be effectively determined whether the current temperature condition of the PCB will have a negative impact on the welding of the next electronic component. Subsequently, when the temperature-related parameters of the PCB reach the first preset parameter standard, the predicted PCB temperature of the next electronic component to be welded is calculated, and when the predicted PCB temperature reaches the first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced, and the heat dissipation power of the heat dissipation component for the PCB is increased, so that the temperature-related parameters of the PCB are reduced to the second preset parameter standard, thereby avoiding the problem of loose welding of the electronic components during the welding process, and improving the welding stability of the electronic components on the PCB.

[0058] Next, the PCB device welding control method provided in the embodiment of the present application will be introduced in conjunction with the specific embodiment drawings.

[0059] See also Figure 1 , which is a flow chart of a PCB device welding control method provided in an embodiment of the present application, and specifically includes the following steps:

[0060] S101: During the welding process, obtaining temperature-related parameters of the PCB.

[0061] In the process of soldering electronic components to a PCB, in order to accurately determine the temperature of the PCB, it is necessary to obtain temperature-related parameters of the PCB, which include the real-time temperature of the PCB and the temperature rise acceleration of the PCB.

[0062] Among them, the temperature rise acceleration of the PCB is used to indicate the change of the temperature change rate of the PCB in a unit time. In the actual PCB welding scenario, there are many nonlinear factors affecting the change of the PCB temperature. Therefore, the temperature rise acceleration can accurately reflect the dynamic change of the PCB temperature at each moment during the component welding process. By obtaining the temperature rise acceleration of the PCB, it can more accurately reflect the temperature change trend and temperature change of the PCB within a certain period of time, so as to facilitate the subsequent prediction accuracy of the PCB temperature.

[0063] In a possible implementation, the real-time temperature of the PCB can be obtained through a temperature sensor patch, and the temperature sensor patch is set in a key area inside the PCB, so that the PCB temperature can be obtained. Furthermore, the temperature rise acceleration of the PCB needs to be calculated based on the real-time temperature of the PCB.

[0064] The temperature rise acceleration of the PCB represents the rate of change of the temperature rise speed of the PCB, that is, the second-order derivative of the temperature with respect to time. Therefore, after obtaining the real-time temperature of the PCB, the first-order derivative of the temperature change with time is calculated. Assume that the function of the temperature change with time is T(t), that is, the temperature rise speed = dT / dt. Correspondingly, the temperature rise acceleration is the second-order derivative of the temperature rise speed, that is, the temperature rise acceleration = .

[0065] S102: Determine whether the temperature-related parameters of the PCB meet a first preset parameter standard.

[0066] In the process of determining whether the temperature-related parameters of the PCB meet the first preset parameter standard, the following steps need to be performed to make the determination. Figure 2 , which is a flow chart of another PCB device welding control method provided in an embodiment of the present application, specifically comprising the following steps:

[0067] S1021: Determine whether the real-time temperature is not less than a second preset temperature threshold;

[0068] S1022: If the real-time temperature is not less than the second preset temperature threshold, determining whether the temperature rise acceleration is not less than a preset rise acceleration threshold;

[0069] S1023: If the temperature rise acceleration is not less than a preset rise acceleration threshold, it is determined that the temperature-related parameter reaches a first preset parameter standard.

[0070] After obtaining the temperature-related parameters of the PCB, it is necessary to determine whether the temperature-related parameters of the PCB meet the first preset parameter standard, so as to determine whether the welding of the electronic components needs to be controlled according to the current temperature of the PCB. From the above description of the temperature-related parameters, it can be seen that the temperature-related parameters include the real-time temperature of the PCB and the temperature rise acceleration of the PCB. Accordingly, the first preset parameter standard also needs to be set based on the temperature of the PCB and the temperature rise acceleration.

[0071] In the first preset parameter standard, the judgment is made by the second preset temperature threshold and the preset rising acceleration threshold. Specifically, in the process of judging whether the temperature-related parameters of the PCB match based on the first preset parameter standard, first, it is necessary to judge whether the real-time temperature of the PCB is not less than the second preset temperature threshold. When the real-time temperature of the PCB is not less than the second preset temperature threshold, it is further judged whether the temperature rise acceleration of the PCB is not less than the preset rising acceleration threshold. It can be understood that when the judgment result is that the real-time temperature of the PCB is not less than the second preset temperature threshold, and the temperature rise acceleration of the PCB is not less than the preset rising acceleration threshold, it means that the temperature of the current PCB is high, and the temperature rise trend is too drastic, and the temperature of the next PCB to be welded electronic components makes the probability of the welding material melting extremely high. In this way, the technical solution of the present invention can only determine that the temperature-related parameters of the PCB meet the first preset parameter standard when the temperature rise acceleration of the PCB is also not less than its corresponding preset rising acceleration threshold.

[0072] Correspondingly, when the real-time temperature of the PCB is less than the second preset temperature threshold, it indicates that the actual temperature of the PCB is currently low. Under the condition that the real-time temperature of the PCB is less than the second preset temperature threshold, even if the current temperature rise acceleration of the PCB is at a relatively large value, in this case (usually occurring at the beginning of the welding process), the temperature of the PCB after the next electronic component to be welded will cause the welding material of the welded electronic component to melt. The probability is also extremely low, and thus will not affect the welding stability of the electronic component on the PCB. Therefore, when the real-time temperature of the PCB is less than the second preset temperature threshold, it will be directly determined that the temperature-related parameters of the PCB do not meet the first preset parameter standard, and there is no need to carry out a judgment on the temperature rise acceleration.

[0073] Similarly, even if the real-time temperature of the PCB is not less than (greater than or equal to) the second preset rise acceleration threshold, it is necessary to further determine whether the temperature rise acceleration of the PCB is not less than the preset rise acceleration threshold. When the temperature rise acceleration of the PCB is less than the preset rise acceleration threshold, it indicates that the PCB has a very low probability of melting the welding material between the electronic component and the PCB after the next electronic component to be welded is welded due to the current temperature rise of the PCB. Therefore, it is also not determined that the temperature-related parameters of the PCB meet the first preset parameter standard.

[0074] In this way, by pre-setting the second preset temperature threshold and the preset rising threshold, the temperature-related parameters of the PCB are double-determined, which can ensure that when the actual temperature of the PCB is already high, it is determined whether the temperature rise acceleration of the PCB is too high to affect the normal welding of the electronic components, thereby improving the accuracy of the determination of the temperature-related parameters of the PCB. At the same time, in the process of determining whether the temperature-related parameters of the PCB meet the first preset parameter standard, it will first determine whether the real-time temperature of the PCB is not less than the second preset temperature threshold, thereby improving the determination efficiency of the temperature-related parameters and reducing the determination time of the relevant parameters. In addition, the technical solution of the present invention can also avoid intervening in the heat dissipation power and welding speed in the two cases where the real-time temperature of the PCB is less than the second preset temperature threshold or the temperature rise acceleration of the PCB is less than the preset rising acceleration threshold through a dual determination mechanism based on the real-time temperature of the PCB and the temperature rise acceleration. Therefore, the influence on the welding speed can be significantly reduced, thereby ensuring the welding efficiency of each PCB board.

[0075] S103: If the temperature-related parameter reaches the first preset parameter standard, the PCB temperature after the next electronic component to be soldered is calculated and used as the predicted PCB temperature.

[0076] In the process of calculating the PCB temperature after the next electronic component to be soldered is completed and used as the predicted PCB temperature, the following steps need to be performed to calculate the predicted PCB temperature. Figure 3 , which is a flow chart of another PCB device welding control method provided in an embodiment of the present application, specifically comprising the following steps:

[0077] S1031: Obtain welding parameters and device parameters of the next electronic component to be welded;

[0078] S1032: predicting the temperature rise amplitude of the PCB after the next electronic component to be welded is welded according to the real-time temperature, the temperature rise acceleration, the welding parameters and the device parameters;

[0079] S1033: Determine the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature.

[0080] When the temperature-related parameters of the PCB reach the first preset parameter standard, it indicates that the current temperature of the PCB is high and the temperature rises too quickly. The excessively high temperature of the PCB and the drastic temperature change may cause the actual temperature of the welding material of the next electronic component to be welded to be much higher than the target welding temperature of the welding material when welding is completed, so that the welding material is melted by the excessively high temperature when welding is completed, resulting in the problem of loose welding of the electronic component.

[0081] Therefore, when the temperature-related parameters of the PCB reach the first preset parameter standard, it is necessary to further calculate the predicted PCB temperature after the next electronic component to be welded is completed, and determine whether the predicted PCB temperature reaches the set first preset temperature threshold, so as to judge whether the temperature of the PCB is too high after the next electronic component to be welded is completed. Correspondingly, when the temperature-related parameters of the PCB do not reach the first preset parameter standard, the temperature-related parameters of the PCB will continue to be obtained, and it will be judged whether the temperature-related parameters of the PCB reach the first preset parameter standard until the obtained temperature-related parameters reach the first preset parameter standard; and if the obtained related parameters do not reach the first preset parameter standard until all electronic components on the current PCB board are welded, the step of calculating the predicted PCB temperature after the next electronic component to be welded is never performed during the welding process of the PCB.

[0082] In a possible implementation, when calculating the predicted PCB temperature of the next electronic component to be soldered after soldering is completed, the calculation can be performed based on the known real-time PCB temperature and temperature rise acceleration, combined with the soldering parameters and device parameters of the electronic component to be soldered.

[0083] Specifically, it is necessary to first predict the temperature rise of the PCB after the next electronic component to be welded is completed based on the welding parameters and device parameters of the next electronic component to be welded, as well as the temperature-related parameters of the PCB. The temperature rise of the PCB is used to indicate the temperature change amplitude of the PCB after the next electronic component is welded. By predicting the temperature rise of the PCB and the real-time temperature of the PCB, the predicted PCB temperature after the next electronic component to be welded is determined in advance, thereby understanding the temperature change of the PCB itself after the next electronic component is welded.

[0084] When predicting the temperature rise of the PCB, the temperature rise of the PCB can be predicted by a pre-trained machine learning model. When making predictions based on the input data, the model can consider heat conduction, heat accumulation effect, welding environment, and the properties of the welding components themselves to predict the temperature rise of the PCB, thereby improving the accuracy of the prediction. Therefore, after predicting the temperature rise of the PCB, the temperature rise of the PCB and the real-time temperature of the PCB are superimposed to determine the predicted PCB temperature after the next component to be welded is completed.

[0085] Among them, the welding parameters of the electronic components to be welded can be the number of welding points of the electronic components and the welding interval time between the welding points, or the welding temperature of the electronic components to be welded. It should be noted that when the number of welding points of the electronic component is multiple, the welding interval time can be the interval time between two adjacent welding points of the current welded electronic component. When the number of welding points of the electronic component is only single, the welding interval time can also be the interval time between the current welded electronic component and the next electronic component to be welded. The device parameters of the electronic components to be welded can be the material properties, size, packaging area and contact area between the electronic components to be welded and the PCB. The welding parameter information and the device parameter information can be obtained based on the actual welding construction scene and the attribute information of the next component to be welded itself, and this embodiment does not specifically limit this.

[0086] S104: Determine whether the predicted PCB temperature reaches a first preset temperature threshold.

[0087] After calculating the predicted PCB temperature after the next component to be welded is welded, determine whether the predicted PCB temperature reaches the first preset temperature threshold, so as to judge whether the temperature of the PCB is too high after the next electronic component to be welded is welded, thereby affecting the welding stability of the electronic component. When the predicted PCB temperature reaches the first preset temperature threshold, it indicates that the temperature of the PCB is too high when the next electronic component to be welded is welded, which will cause the melting of the welding material, and it is necessary to subsequently reduce the welding speed of the next electronic component to be welded and increase the heat dissipation power of the heat dissipation component to reduce the temperature of the PCB. When the predicted PCB temperature does not reach the first preset temperature threshold, it indicates that the temperature of the PCB when the next electronic component to be welded is welded will not cause the melting of the welding material, so it is sufficient to maintain the welding speed of the next electronic component to be welded and the heat dissipation power of the heat dissipation component.

[0088] S105: If the predicted PCB temperature reaches a first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced and the heat dissipation power of the heat dissipation assembly for the PCB is increased, so that the temperature-related parameters are reduced to reach a second preset parameter standard.

[0089] In the process of reducing the welding speed of the next electronic component to be welded and increasing the heat dissipation power of the heat dissipation component to the PCB, the following steps need to be performed. The specific steps are as follows:

[0090] S1051: Determine a first influencing factor and a second influencing factor according to the temperature rise amplitude;

[0091] S1052: reducing the welding speed of the next electronic component to be welded according to the first influencing factor, and increasing the heat dissipation power of the heat dissipation component for the PCB according to the second influencing factor.

[0092] S1053: Obtaining the number of welding points of the next electronic component to be welded;

[0093] S1054: when the number of the welding points includes at least two, extend the welding interval time between the welding points according to the first influencing factor;

[0094] S1055: When the number of the welding point is only one, extend the welding waiting time of the next electronic component to be welded according to the first influencing factor.

[0095] S1056: Obtaining the current heat dissipation power of the heat dissipation component for the PCB;

[0096] S1057: Perform power increase processing on the current heat dissipation power based on the second influencing factor, and use the increased heat dissipation power to dissipate heat from the heat dissipation component.

[0097] When the predicted temperature of the PCB reaches the set first preset temperature threshold, the temperature of the PCB is at a relatively high state. Under such a high temperature state of the PCB, when the next electronic component to be welded is welded based on the original welding speed, the high temperature heat of the PCB itself will be transferred to the welding material between the component and the PCB, making the temperature of the welding material much higher than the temperature range that the welding material should be in when welding is completed, thereby causing the welding material to be overheated and melted, resulting in the problem of loose welding of the component.

[0098] Therefore, when the predicted PCB temperature of the next electronic component to be welded reaches the first preset temperature threshold, it is necessary to reduce the welding speed of the next electronic component to be welded, and increase the heat dissipation power of the heat dissipation assembly for the PCB, so as to fully dissipate the heat of the PCB, thereby preventing the temperature of the PCB from being too high. In the process of adjusting the welding speed and heat dissipation power of the next electronic component to be welded, in order to prevent the temperature of the PCB itself from being too high and to have a certain temperature change stability, it is necessary to reduce the temperature-related parameters of the PCB to the second preset parameter standard, so as to ensure that the temperature of the PCB can be reduced and the thermal stability of the PCB is guaranteed.

[0099] In a possible implementation, the second preset parameter standard can be determined based on the first preset parameter standard for PCB in the foregoing text, and the value of the first preset parameter standard can be reduced by a specific percentage coefficient, so as to obtain the second preset parameter standard. The specific percentage coefficient is set to 60%, and by setting the value specified by the second preset parameter standard to 60% of the first preset parameter standard, frequent response of welding control can be avoided in the process of effectively responding to welding control, thereby improving the efficiency of welding control and avoiding the problem of excessive control frequency.

[0100] Specifically, in the process of reducing the welding speed of the next electronic component to be welded and increasing the heat dissipation power of the PCB, it is necessary to adjust the temperature rise of the PCB when the next component to be tested is welded according to the prediction. Next, the adjustment process of the heat dissipation power and the welding speed will be introduced in conjunction with the drawings of the specific embodiment.

[0101] Furthermore, after determining the first influencing factor and the second influencing factor according to the temperature rise amplitude of the PCB, the welding speed and the heat dissipation power are adjusted respectively according to the first influencing factor and the second influencing factor.

[0102] Since the adjustment of the welding speed and the heat dissipation power needs to be determined based on the actual absolute temperature value of the PCB and the severity of the temperature change of the PCB, the adjustment of the welding speed and the heat dissipation power needs to be determined by the predicted temperature rise of the PCB.

[0103] By predicting the temperature rise of the PCB when the next electronic component to be welded is completed, the rate of temperature rise of the PCB when the next component is welded and the specific value of the temperature rise can be known, and then the first influencing factor and the second influencing factor used to adjust the welding speed and the heat dissipation power can be determined by the temperature rise. Among them, the first influencing factor represents the influence of the temperature rise on the welding speed of the next electronic component to be welded, and the second influencing factor represents the influence of the temperature rise on the current PCB heat dissipation power. In a specific optional embodiment, the first influencing factor and the second influencing factor can be percentage coefficients used to adjust the numerical value.

[0104] In this embodiment, both the first influencing factor and the second influencing factor can be obtained by looking up a table. Specifically, after the temperature rise is predicted, the temperature rise interval-first influencing factor mapping table corresponding to the next electronic component to be welded can be called first; the temperature rise interval-first influencing factor mapping table stores multiple preset temperature rise intervals, and each preset temperature rise interval is associated with a preset first influencing factor. By looking up the preset temperature rise interval in which the predicted temperature rise is located, the preset first influencing factor stored in association with the interval can be obtained, and finally the preset first influencing factor can be used as the first influencing factor determined in step S1051.

[0105] The method for obtaining the second influencing factor can refer to the method for obtaining the first influencing factor described above. Specifically, after the temperature rise is predicted, the temperature rise interval-second influencing factor mapping table corresponding to the temperature rise can be called according to the heat dissipation power of the current PCB; the temperature rise interval-second influencing factor mapping table stores multiple preset temperature rise intervals, and each preset temperature rise interval is associated with a preset second influencing factor. By searching the preset temperature rise interval in which the predicted temperature rise is located, the preset second influencing factor associated with the interval can be obtained, and finally the preset second influencing factor can be used as the second influencing factor determined in step S1051.

[0106] The above-mentioned preset temperature rise range-preset first impact factor mapping table and the preset temperature rise range-preset second impact factor mapping table can be obtained through preliminary experiments, and this embodiment does not limit this.

[0107] After determining the first influencing factor, it is necessary to obtain the number of welding points of the next electronic component to be welded, and determine the control method of the welding speed of the electronic component according to the specific situation of the number of welding points.

[0108] In actual electronic component welding scenarios, different electronic components have different numbers of welding points. When there are multiple welding points on an electronic component (such as a chip), each welding point needs to be welded in turn during welding. When one welding point is completed, the welding interval before welding the next welding point will affect the overall welding speed of the electronic component. The longer the welding interval between each welding point, the slower the overall welding speed of the electronic component, and the PCB will have more heat dissipation time. When there is only a single welding point on an electronic component (such as a button), in order to allow the PCB to have more heat dissipation time, it is necessary to wait longer before welding the electronic component, thereby ensuring that the temperature state of the PCB can be stabilized.

[0109] Therefore, in the process of adjusting the welding speed of the next electronic component to be welded according to the first influencing factor, it is necessary to adjust according to the number of welding points of the next electronic component to be welded. First, the number of welding points of the next electronic component to be welded is obtained. When the number of welding points includes at least two, the welding interval time between welding points is extended by the percentage coefficient represented by the first influencing factor, thereby slowing down the welding speed of the welded electronic component. For example, the welding interval time between welding points is set to 1s, and the percentage coefficient represented by the first influencing factor is 20%. Then the welding interval time extended by the first influencing factor is: 1+1*0.2=1.2s.

[0110] When the number of soldering points of an electronic component is only one, the percentage coefficient represented by the first influencing factor is used to extend the soldering waiting time of the next electronic component to be soldered, so that the soldering speed of the next electronic component to be soldered can also be reduced, thereby ensuring sufficient heat dissipation of the PBC. Similarly, the soldering waiting time of the current soldered electronic component and the next electronic component to be soldered is set to 1.5s, and the percentage coefficient represented by the first influencing factor is 20%. The soldering waiting time extended by the first influencing factor is: 1.5+1.5*0.2=1.8s.

[0111] Furthermore, in the process of increasing the heat dissipation power of the heat dissipation component for the PBC through the second influencing factor, in order to ensure that the temperature of the PCB can be reduced to the expected standard in time, it is necessary to obtain the current heat dissipation power of the heat dissipation component for the PCB, and increase the current heat dissipation power through the percentage coefficient represented by the second image factor, so as to ensure the effective increase of the heat dissipation power, thereby ensuring the stability of the temperature state area of ​​the PCB. For example, the current heat dissipation power of the heat dissipation component is set to 50W, and the percentage coefficient represented by the second influencing factor is 20%. The heat dissipation power after the power increase process is: 50+20%*50=60W.

[0112] In some possible implementations, the heat dissipation component for the PCB may be an air cooling device disposed next to the PCB, or may be an independently disposed liquid cooling device. The embodiments of the present application do not limit the specific type of the heated component.

[0113] In actual welding scenarios, the welding operation of PCB for electronic components can be roughly divided into two stages. One is the stage of welding the electronic components, and the other is the stage where the current electronic component has been welded and is waiting for the welding of the next electronic component.

[0114] As described above, in the process of soldering electronic components based on PCB, it is necessary to obtain the real-time temperature and temperature rise acceleration of PCB to monitor the temperature change state of PCB. When the temperature-related parameters of PCB reach the first preset parameter standard, it is necessary to calculate the predicted temperature of the next electronic component to be soldered after soldering is completed. The calculation of the predicted temperature needs to be completed based on the current real-time temperature of PCB, temperature rise acceleration, and soldering parameters and device parameters of the next component.

[0115] In the process of calculating the predicted temperature based on the real-time temperature of the PCB, if the current electronic component has been soldered, the real-time temperature of the PCB obtained at this time is the highest temperature that can cause the PCB to heat up during the soldering process of the electronic component, and the temperature of the PCB will not rise too much. In this case, the predicted temperature when the next electronic component is soldered can be calculated based on the actual temperature of the PCB obtained.

[0116] However, if the PCB is still soldering the current electronic component at this time, it proves that the temperature of the PCB will still rise to a certain extent. If the temperature prediction is performed again based on the real-time temperature of the PCB after the current electronic component is soldered, the efficiency of the temperature prediction is relatively low. Therefore, in order to ensure the efficiency of temperature prediction during PCB soldering, when it is soldering the electronic component, the real-time temperature of the PCB needs to be temperature compensated to simulate the real-time temperature of the PCB after the current electronic component is soldered. When performing temperature prediction, the temperature prediction is performed based on the compensated temperature to improve the efficiency of temperature prediction.

[0117] Next, the temperature prediction process of the PCB in the above two different situations will be introduced in conjunction with the drawings of specific embodiments.

[0118] See also Figure 4 , which is a flow chart of another PCB temperature prediction method provided in an embodiment of the present application, as shown in the figure, specifically includes the following steps:

[0119] S201: Determine whether a welding operation is currently being performed on an electronic component.

[0120] S202: If the electronic component is not currently being soldered, directly executing step S1033 of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature";

[0121] S203: If the electronic component is currently being soldered, the real-time temperature is temperature compensated, and based on the compensated real-time temperature, step S1033 of "determining the predicted PCB temperature based on the temperature rise amplitude and the real-time temperature" is executed.

[0122] In step S203, the step of performing temperature compensation on the real-time temperature includes:

[0123] S2031: Determine the welding degree of the current electronic components;

[0124] S2032: Determine a compensation temperature according to the welding degree and the real-time temperature;

[0125] S2033: performing temperature compensation on the real-time temperature according to the compensation temperature to obtain the compensated real-time temperature;

[0126] In the process of calculating the predicted temperature of the next electronic component to be welded, if the PCB is not welding the electronic component at this time, that is, the current real-time temperature of the PCB is the real real-time temperature that will not change again, then the temperature prediction can be performed based on the current real-time temperature of the PCB and the temperature rise amplitude. In actual use, it is found that if the electronic component is being welded on the PCB, different welding degrees of the electronic component will have different effects on the temperature of the PCB after the electronic component is welded. This is because the temperature of the PCB will rise to a certain extent when the electronic component is welded compared to the temperature before welding. That is, the real-time temperature of the PCB will continue to change when the current electronic component is not welded. If the real-time temperature is directly used to execute step S1033, the final predicted PCB temperature will be low.

[0127] Therefore, in order to ensure the accuracy of temperature compensation, the technical solution of the present application obtains the current welding degree of the electronic component, and performs temperature compensation according to the current welding degree of the electronic component and the real-time temperature of the PCB to determine the compensation temperature for temperature compensation, and then calculates the final predicted PCB temperature through the real-time temperature after temperature compensation and the temperature rise amplitude.

[0128] Specifically, in the process of determining the current welding degree of the electronic component, the welding quality monitoring device can be used to monitor the welding state of the electronic component in real time, and the welding degree of the electronic component can be determined by analyzing the morphology of the electronic component solder joint or the electrical parameters during the welding process. When outputting the result of the welding degree of the electronic component, the welding degree of the electronic component can be expressed in percentage.

[0129] Further, in the process of determining the compensation temperature according to the soldering degree of the electronic components and the real-time temperature of the PCB, the compensation temperature can be determined by the following formula:

[0130] Tcomp=k×(1−Scurrent)×Tpcb

[0131] In the formula, Tcomp is the compensation temperature, k is the adjustment coefficient, Scurrent is the soldering degree of the electronic component, and Tpcb represents the real-time temperature of the PCB. The adjustment coefficient k is used to adjust the influence of the soldering degree of the electronic component on the compensation temperature. The k value can be set to different values ​​according to the different soldering degrees of the electronic component, or can be set by the operator according to soldering experience, which is not limited in this embodiment.

[0132] Therefore, after obtaining the compensated temperature, the real-time temperature of the PCB is compensated by the compensated temperature. Specifically, the compensated temperature is added to the real-time temperature of the PCB to obtain the compensated real-time temperature, so as to complete the calculation of the predicted temperature based on the compensated real-time temperature.

[0133] For example, the soldering degree Scurrent of the electronic component is set to 0.5, k=0.1, and Tpcb=200; the set parameters are introduced into the above formula, that is, Tcomp=0.1×(1-0.5)×200=10. In this way, the compensation temperature can be determined to be 10 degrees, and the compensation temperature is superimposed on the real-time temperature of the PCB, and the real-time temperature after compensation is 210 degrees.

[0134] It should be noted that in this embodiment, temperature compensation is only performed on the real-time temperature in step S1033 of calculating and predicting the PCB temperature, and there is no need to perform temperature compensation on the real-time temperature in step S1032. This is because when predicting the temperature rise of the PCB, the input parameters include the temperature rise acceleration, so the predicted temperature rise will not be distorted, and there is no need to use the temperature-compensated real-time temperature of the PCB to predict the temperature rise.

[0135] The embodiment of the present application provides a PCB device welding control method. In the PCB device welding control method, it is necessary to obtain the temperature-related parameters of the PCB and determine whether the temperature-related parameters of the PCB reach the first preset parameter standard. Since the temperature-related parameters of the PCB reflect the current temperature condition and temperature change condition of the PCB, through the matching judgment between the first preset parameter standard and the temperature-related parameters of the PCB, it can be effectively determined whether the current temperature condition of the PCB will have a negative impact on the welding of the next electronic component. Subsequently, when the temperature-related parameters of the PCB reach the first preset parameter standard, the predicted PCB temperature of the next electronic component to be welded is calculated, and when the predicted PCB temperature reaches the first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced, and the heat dissipation power of the heat dissipation component for the PCB is increased, so that the temperature-related parameters of the PCB are reduced to the second preset parameter standard, thereby avoiding the problem of loose welding of the electronic component during the welding process, and improving the welding stability of the electronic component on the PCB.

[0136] A PCB device welding control device provided in an embodiment of the present application is introduced below. The PCB device welding control device described below and the PCB device welding control method described above can refer to each other.

[0137] See also Figure 5 , which is a schematic diagram of the structure of a PCB device welding control device provided in an embodiment of the present application, specifically including the following modules:

[0138] A first acquisition module 100 is used to acquire temperature-related parameters of the PCB during the welding process;

[0139] A first judging module 200 is used to judge whether the temperature-related parameter of the PCB reaches a first preset parameter standard;

[0140] A prediction module 300, configured to calculate the PCB temperature of the next electronic component to be welded after welding and use it as the predicted PCB temperature when the temperature-related parameter reaches the first preset parameter standard;

[0141] A second judgment module 400 is used to determine whether the predicted PCB temperature reaches a first preset temperature threshold;

[0142] The welding control module 500 is used to reduce the welding speed of the next electronic component to be welded and increase the heat dissipation power of the heat dissipation component for the PCB when the predicted PCB temperature reaches the first preset temperature threshold, so that the temperature-related parameters drop to reach the second preset parameter standard.

[0143] See also Figure 6 , which is a structural schematic diagram of a PCB welding control system provided in an embodiment of the present application, including:

[0144] A memory 11, used for storing computer programs;

[0145] The processor 12 is used to implement the steps of a PCB device welding control method described in any of the above method embodiments when executing the computer program.

[0146] In this embodiment, the control system may be a vehicle-mounted computer, a PC (Personal Computer), or a terminal device such as a smart phone, a tablet computer, a PDA, a portable computer, etc.

[0147] The control system may include a memory 11 , a processor 12 , and a bus 13 .

[0148] Among them, the memory 11 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, hard disk, multimedia card, card-type memory (for example, SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the control system, such as a hard disk of the control system. In other embodiments, the memory 11 can also be an external storage device of the control system, such as a plug-in hard disk equipped on the control system, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (FlashCard), etc. Further, the memory 11 can also include both an internal storage unit of the control system and an external storage device. The memory 11 can not only be used to store application software and various types of data installed in the control system, such as program code for executing a fault prediction method, but also can be used to temporarily store data that has been output or is to be output. The processor 12 can be a central processing unit (CPU) in some embodiments.

[0149] In some embodiments, the processor 12 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor or other data processing chip, and is used to run program codes or process data stored in the memory 11, such as program codes for executing a fault prediction method.

[0150] The bus 13 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0151] Furthermore, the control system may also include a network interface 14, which may optionally include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is usually used to establish a communication connection between the control system and other electronic devices.

[0152] Optionally, the control system may further include a user interface 15, which may include a display (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 15 may also include a standard wired interface and a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode) touch device, etc. The display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the device and to display a visual user interface.

[0153] Figure 6 Only the control system with components 11-15 is shown, and it can be understood by those skilled in the art that Figure 6 The structure shown does not constitute a limitation of the control system, and may include fewer or more components than shown, or combine certain components, or arrange the components differently.

[0154] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, an embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the PCB device welding control method described in any of the above embodiments.

[0155] The computer-readable media of the embodiments of the present application include permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0156] The computer instructions stored in the storage medium of the above embodiment are used to enable the computer to execute the PCB device welding control method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0157] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for methods, devices and systems, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments. The methods, devices and systems described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components indicated as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without creative work.

[0158] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A PCB device welding control method, characterized in that: The method comprises: During the welding process, obtaining temperature-related parameters of the PCB; Determining whether a temperature-related parameter of the PCB reaches a first preset parameter standard; If the temperature-related parameter reaches the first preset parameter standard, the PCB temperature after the next electronic component to be welded is calculated and used as the predicted PCB temperature; Determining whether the predicted PCB temperature reaches a first preset temperature threshold; If the predicted PCB temperature reaches a first preset temperature threshold, the welding speed of the next electronic component to be welded is reduced and the heat dissipation power of the heat dissipation assembly for the PCB is increased, so that the temperature-related parameters are reduced to reach a second preset parameter standard; The step of reducing the welding speed of the next electronic component to be welded and increasing the heat dissipation power of the heat dissipation component for the PCB includes: According to the temperature rise range, the first influencing factor and the second influencing factor are determined; According to the first influencing factor, the welding speed of the next electronic component to be welded is correspondingly reduced, and according to the second influencing factor, the heat dissipation power of the heat dissipation component for the PCB is correspondingly increased; The step of correspondingly reducing the welding speed of the next electronic component to be welded according to the first influencing factor includes: Obtaining the number of welding points of the next electronic component to be welded; When the number of the welding points includes at least two, extending the welding interval time between the welding points according to the first influencing factor; When the number of the welding points is single, extending the welding waiting time of the next electronic component to be welded according to the first influencing factor; Before determining the step of predicting the PCB temperature according to the temperature rise amplitude and the real-time temperature, the PCB device welding control method further includes: Determine whether a soldering operation is currently being performed on electronic components; If the electronic component is not currently being soldered, the step of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature" is directly performed; If the electronic component is currently being soldered, the real-time temperature is temperature compensated, and the step of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature" is performed according to the compensated real-time temperature; The step of performing temperature compensation on the real-time temperature comprises: Determine the current soldering level of electronic components; Determining a compensation temperature according to the welding degree and the real-time temperature; The real-time temperature is temperature compensated according to the compensation temperature to obtain the compensated real-time temperature.

2. The method according to claim 1, characterized in that The temperature-related parameters include real-time temperature and temperature rise acceleration; The step of determining whether the temperature-related parameter of the PCB reaches a first preset parameter standard comprises: Determining whether the real-time temperature is not less than a second preset temperature threshold; If the real-time temperature is not less than the second preset temperature threshold, determining whether the temperature rise acceleration is not less than the preset rise acceleration threshold; If the temperature rise acceleration is not less than the preset rise acceleration threshold, it is determined that the temperature-related parameter reaches the first preset parameter standard.

3. The method according to claim 2, characterized in that The step of calculating the PCB temperature after the next electronic component to be welded is welded and using it as a step of predicting the PCB temperature includes: Obtain welding parameters and device parameters of the next electronic component to be welded; According to the real-time temperature, the temperature rise acceleration, the welding parameters and the device parameters, the temperature rise amplitude of the PCB after the next electronic component to be welded is predicted; The predicted PCB temperature is determined according to the temperature rise amplitude and the real-time temperature.

4. The method according to claim 1, characterized in that Increasing the heat dissipation power of the heat dissipation component for the PCB according to the second influencing factor includes: Obtaining the current heat dissipation power of the heat dissipation component for the PCB; The current heat dissipation power is increased based on the second influencing factor, and the heat dissipation component is cooled by the increased heat dissipation power.

5. A PCB device welding control device, characterized in that: include: A first acquisition module, used to acquire temperature-related parameters of the PCB during the welding process; A first judgment module, used to judge whether the temperature-related parameters of the PCB meet the first preset parameter standard; A prediction module, configured to calculate the PCB temperature of the next electronic component to be welded after welding is completed and use it as the predicted PCB temperature when the temperature-related parameter reaches the first preset parameter standard; A second judgment module is used to determine whether the predicted PCB temperature reaches a first preset temperature threshold; A welding control module, configured to reduce the welding speed of the next electronic component to be welded and increase the heat dissipation power of the heat dissipation assembly for the PCB when the predicted PCB temperature reaches a first preset temperature threshold, so that the temperature-related parameter drops to a second preset parameter standard; The welding control module is specifically used for: According to the temperature rise range, the first influencing factor and the second influencing factor are determined; According to the first influencing factor, the welding speed of the next electronic component to be welded is correspondingly reduced, and according to the second influencing factor, the heat dissipation power of the heat dissipation component for the PCB is correspondingly increased; The step of correspondingly reducing the welding speed of the next electronic component to be welded according to the first influencing factor includes: Obtaining the number of welding points of the next electronic component to be welded; When the number of the welding points includes at least two, extending the welding interval time between the welding points according to the first influencing factor; When the number of the welding points is single, extending the welding waiting time of the next electronic component to be welded according to the first influencing factor; Before determining the step of predicting the PCB temperature according to the temperature rise amplitude and the real-time temperature, the PCB device welding control device is further used for: Determine whether a soldering operation is currently being performed on electronic components; If the electronic component is not currently being soldered, the step of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature" is directly performed; If the electronic component is currently being soldered, the real-time temperature is temperature compensated, and the step of "determining the predicted PCB temperature according to the temperature rise amplitude and the real-time temperature" is performed according to the compensated real-time temperature; The step of performing temperature compensation on the real-time temperature comprises: Determine the current soldering level of electronic components; Determining a compensation temperature according to the welding degree and the real-time temperature; The real-time temperature is temperature compensated according to the compensation temperature to obtain the compensated real-time temperature.

6. A PCB device welding control system having a computer program stored thereon, characterized in that: When the program is executed by a processor, the PCB device welding control method described in any one of claims 1 to 4 is implemented.

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