A new type of semiconductor component test piece

Abstract

The present invention relates to the field of semiconductor component testing technology, and discloses a novel semiconductor component testing piece, comprising: a semiconductor component body, which is the main structure of the semiconductor component at the detected end, and ports for docking with a testing copper sheet are symmetrically arranged on both sides of the semiconductor component body. The novel semiconductor component testing piece increases the connection position of the contact points of the semiconductor component body through the testing copper sheets symmetrically arranged on both sides of the insulating frame, so that a single testing piece can provide a testing environment for the semiconductor, and as the semiconductor component body is placed on the surface of the supporting plate to provide support, the setting of the supporting plate avoids excessive pulling under the influence of the weight of the semiconductor component body during the testing process, causing the testing copper sheet to be deformed by pressure, and the semiconductor component clamping plate 1 and the semiconductor component clamping plate 2 symmetrically arranged on the surface of the testing copper sheet further limit the position of the testing copper sheet to avoid the testing copper sheet being deformed by external force.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor component testing, in particular to a novel semiconductor component testing piece. Background Art

[0002] In today's electronic technology field, semiconductor components play a vital role. Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. From smart phones to high-performance computers, from automotive electronic systems to medical equipment, almost all electronic devices rely on high-quality semiconductor components. With the continuous advancement of semiconductor technology, the integration of semiconductor components is getting higher and higher, the size is getting smaller and smaller, and the performance is getting stronger and stronger. Packaged semiconductor components are the basic components of electronic circuits. Most components have pins for easy access to circuits. In order to ensure the quality of electronic components, it is necessary to test their electrical characteristic parameters. Test pieces are needed to detect the contact between circuits and components. However, there are some defects in the existing test pieces for component testing, such as:

[0003] Ordinary test pieces only have one side, and two test pieces are needed to form a test circuit for the component. After the two test pieces are set up for a long time, performance degradation and poor contact are likely to occur. In addition, since they need to be installed separately, poor contact is likely to occur during testing, resulting in large deviations in test results, and the correctness of the test cannot be accurately guaranteed.

[0004] In view of the above problems, it is urgent to carry out innovative design based on the original semiconductor component test piece. Summary of the invention

[0005] The purpose of the present invention is to provide a new type of semiconductor component test piece to solve the problem proposed in the above background technology that the two test pieces are prone to performance degradation and poor contact during long-term use, and because they need to be installed separately, poor contact is prone to occur during testing, resulting in excessive deviation in test results, and the correctness of the test cannot be accurately guaranteed.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a novel semiconductor component test piece, comprising a semiconductor component body, which is the main structure of the semiconductor component to be tested, and ports for docking with a test copper sheet are symmetrically arranged on both sides of the semiconductor component body, the test copper sheet is connected to the detection spring sheet socket of the semiconductor component body, and the test copper sheet is arranged on the surface of an insulating frame, and the insulating frame and the test copper sheet constitute the main structure of the semiconductor component test piece;

[0007] The insulating frame is provided with a rectangular opening inside, and a supporting plate is installed in the opening of the insulating frame, and the supporting plate is arranged at the bottom end of the semiconductor element body, and the inner wall surface of the rectangular opening of the insulating frame is symmetrically provided with strip openings, and an anti-slip guide rail is arranged in the strip opening of the insulating frame, and a clamping component is slidably connected to the surface of the anti-slip guide rail, which is used to clamp the connection between the semiconductor element body and the test copper sheet, so as to facilitate full contact between the test copper sheet and the semiconductor element body, and ensure accurate transmission of the test signal;

[0008] A test copper sheet is symmetrically arranged on the surface of the insulating frame, one side of the test copper sheet is inserted into one side of the insulating sheet, and positioning bolts are symmetrically arranged at both ends of the insulating sheet, the positioning bolts are installed on the surface of the insulating frame, and the positioning bolts pass through the inside of the insulating sheet, a detection frame is arranged on the surface of the insulating sheet, and docking sockets are equidistantly arranged on the top of the detection frame, one end of the docking socket is connected to the live wire, and a connecting adapter is arranged at the bottom of the live wire, and one side of the connecting adapter is connected to the wire interface.

[0009] By adopting the above technical solution, a double-sided structure is provided to increase the detection ports for semiconductor components, thereby realizing a single detection operation.

[0010] Preferably, the bottom end of the insulating frame is flush with the bottom end of the supporting plate, and the supporting plate is a rectangular sheet structure made of insulating material.

[0011] By adopting the above technical solution, the insulating frame cooperates with the supporting plate to install the semiconductor element body.

[0012] Preferably, the clamping assembly comprises:

[0013] A semiconductor component clamping plate 1, one end of which is disposed on the surface of the anti-slip guide rail, and two ends of the semiconductor component clamping plate 1 are symmetrically connected to an anti-slip guide rail;

[0014] An insulating silicone sheet is attached to a surface of the semiconductor element clamping plate, and the insulating silicone sheet abuts against the surface of the test copper sheet;

[0015] A wave spring column is symmetrically arranged on both sides of the semiconductor element clamping plate 1, and a spring is arranged at one end of the wave spring column that passes through the semiconductor element clamping plate 1;

[0016] The semiconductor component clamping plate 2 is installed at the top of the wave spring column, and the semiconductor component clamping plate 2 is arranged parallel to the semiconductor component clamping plate 1;

[0017] Conductive sheets are arranged equidistantly inside the second semiconductor element clamping plate, and the conductive sheets are located in the gaps between the test copper sheets;

[0018] A power-on test battery is mounted on one end of the semiconductor element clamp plate 2, and the power-on test battery is connected to a conductive sheet at one end;

[0019] A warning light is installed at the other end of the second semiconductor element clamping plate, and the warning light is connected to the conductive sheet at the other end.

[0020] By adopting the above technical solution, a clamping structure is provided through the clamping component, which facilitates maintaining the stability of the detection signal.

[0021] Preferably, the semiconductor component clamping plate 1 and the semiconductor component clamping plate 2 are symmetrically arranged on both sides of the test copper sheet, and the semiconductor component clamping plate 2 is a sheet structure made of insulating material.

[0022] By adopting the above technical solution, as the semiconductor component clamping plate 1 and the semiconductor component clamping plate 2 are clamped on the surface of the test copper sheet, a stable installation structure is provided.

[0023] Preferably, the wave spring column and the second semiconductor element clamping plate form a U-shaped frame structure, and the second semiconductor element clamping plate is a sheet structure made of insulating material.

[0024] By adopting the above technical solution, the wave spring column and the semiconductor element clamping plate 2 cooperate to form a structure for clamping the surface of the test copper sheet.

[0025] Preferably, the energized test battery and the warning light are linked by electricity flowing through the conductive sheet in contact with the test copper sheet.

[0026] By adopting the above technical solution, the battery is connected to the warning light after power-on testing to detect the state of the copper sheet.

[0027] Preferably, a groove for installing the test wire is provided on the surface of the test copper sheet, and the surface of the test wire is in contact with the surface of the insulating sheet.

[0028] By adopting the above technical solution, the groove of the test copper sheet provides support for the test wire to be installed, thereby improving the connection port.

[0029] Preferably, one end of the test wire is butted against one end of the wire interface, and the outer wall of the wire interface is wrapped with an insulating silicone sleeve.

[0030] By adopting the above technical solution, the test wire and the wire interface are connected to form an overall installation structure.

[0031] Preferably, the power line and the connecting adapter end form a U-shaped structure, and the power line and the docking socket form a Z-shaped structure detection frame.

[0032] By adopting the above technical solution, as the power line and the connecting adapter are installed in coordination, an installation space is provided for the test and detection port.

[0033] Preferably, the positioning bolt passes through the interior of the insulating sheet, and a supporting tube is provided between the insulating sheet and the insulating frame.

[0034] By adopting the above technical solution, the positioning bolts are arranged to provide support for the insulating sheet and thus provide stable support for the entire device.

[0035] Compared with the prior art, the present invention has the following beneficial effects: the novel semiconductor component test piece:

[0036] 1. The test copper sheets symmetrically arranged on both sides of the insulating frame increase the connection position of the contact points of the semiconductor element body, so that a single test sheet can provide a testing environment for the semiconductor. As the semiconductor element body is placed on the surface of the support plate to provide support, the setting of the support plate avoids excessive pulling under the influence of the weight of the semiconductor element body during the testing process, causing the test copper sheet to be subjected to pressure deformation. The semiconductor element clamping plate 1 and the semiconductor element clamping plate 2 symmetrically arranged on the surface of the test copper sheet further limit the position of the test copper sheet, avoid the test copper sheet from being deformed by external force, and improve the contact performance and test accuracy between the test copper sheet and the semiconductor element;

[0037] 2. The insulating silicone sheet arranged on the surface of semiconductor component clamp plate 1 cooperates with semiconductor component clamp plate 2 to adhere to the surface of the insulating silicone sheet. When not testing, semiconductor component clamp plate 2 and semiconductor component clamp plate 1 are wrapped around one side of the contact end of the test copper sheet to prevent dust from accumulating on the surface of the test copper sheet during daily storage. At the same time, the conductive sheet arranged between the test copper sheets is made of metal material, so that the power-on test battery supplies power to the warning light, performs preliminary detection of the power-on status of the test copper sheet, realizes rapid detection of the test copper sheet status, and reduces adverse effects during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the overall external three-dimensional structure of the present invention;

[0039] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention with the semiconductor element body removed as a whole;

[0040] Figure 3 This is a schematic diagram of the three-dimensional structure of the semiconductor element body and the test copper sheet installed in the present invention;

[0041] Figure 4 It is a schematic diagram of the overall internal three-dimensional structure of the present invention;

[0042] Figure 5 It is a schematic diagram of the overall internal side-section stereoscopic structure of the present invention;

[0043] Figure 6 It is a schematic diagram of the three-dimensional structure of the semiconductor element body and the clamping assembly of the present invention;

[0044] Figure 7 It is a schematic diagram of the three-dimensional structure of the clamping assembly of the present invention;

[0045] Figure 8 This is a schematic diagram of the three-dimensional structure of the copper sheet and the insulating sheet installed for testing in the present invention;

[0046] Fig. 9 It is a schematic diagram of the side-section stereoscopic structure of the semiconductor element body and the test copper sheet installed in the present invention;

[0047] Fig.10 It is a schematic diagram of the internal side-section stereoscopic structure of the detection frame of the present invention.

[0048] In the figure: 1. semiconductor component body; 2. support plate; 3. insulation frame; 4. anti-skid guide rail; 5. semiconductor component clamp plate 1; 6. insulating silicone sheet; 7. wave spring column; 8. semiconductor component clamp plate 2; 9. conductive sheet; 10. power-on test battery; 11. warning light; 12. test copper sheet; 13. test wire; 14. wire interface; 15. connection adapter; 16. power-on wire; 17. detection frame; 18. docking socket; 19. insulating sheet; 20. positioning bolt; 21. support tube. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] See also Figure 1-Figure 10 The present invention provides a technical solution: a novel semiconductor component test piece, comprising a semiconductor component body 1, a supporting plate 2, an insulating frame 3, an anti-slip guide rail 4, a semiconductor component clamping plate 1 5, an insulating silicone sheet 6, a wave spring column 7, a semiconductor component clamping plate 2 8, a conductive sheet 9, a power-on test battery 10, a warning light 11, a test copper sheet 12, a test wire 13, a wire interface 14, a connecting adapter 15, a power-on wire 16, a detection frame 17, a docking socket 18, an insulating sheet 19, a positioning bolt 20 and a support tube 21;

[0051] Among them, the semiconductor component body 1 is the main structure of the semiconductor component to be tested, and ports for docking with the test copper sheet 12 are symmetrically arranged on both sides of the semiconductor component body 1. The test copper sheet 12 is connected to the detection spring sheet socket of the semiconductor component body 1, and the test copper sheet 12 is arranged on the surface of the insulating frame 3. The insulating frame 3 and the test copper sheet 12 constitute the main structure of the semiconductor component test sheet;

[0052] A rectangular opening is provided inside the insulating frame 3, and a supporting plate 2 is installed in the opening of the insulating frame 3, and the supporting plate 2 is arranged at the bottom end of the semiconductor element body 1, and a strip opening is symmetrically provided on the inner wall surface of the rectangular opening of the insulating frame 3, and an anti-slip guide rail 4 is provided in the strip opening of the insulating frame 3, and a clamping component is slidably connected to the surface of the anti-slip guide rail 4, which is used to clamp the connection between the semiconductor element body 1 and the test copper sheet 12, so that the test copper sheet 12 is in full contact with the semiconductor element body 1, and the accurate transmission of the test signal is ensured, and the bottom end of the insulating frame 3 is flush with the bottom end of the supporting plate 2, and the supporting plate 2 is a rectangular sheet structure provided with insulating material;

[0053] The test copper sheet 12 is symmetrically arranged on the surface of the insulating frame 3, one side of the test copper sheet 12 is inserted into one side of the insulating sheet 19, and the two ends of the insulating sheet 19 are symmetrically arranged with positioning bolts 20, which are installed on the surface of the insulating frame 3 and penetrate the inside of the insulating sheet 19. The surface of the insulating sheet 19 is provided with a detection frame 17, and the top of the detection frame 17 is equidistantly provided with docking sockets 18, one end of the docking socket 18 is connected to the power line 16, and the bottom of the power line 16 is provided with a connection adapter 15, and one side of the connection adapter 15 is connected The wire interface 14, the positioning bolt 20 passes through the inside of the insulating sheet 19, and a support tube 21 is provided between the insulating sheet 19 and the insulating frame 3, the surface of the test copper sheet 12 is provided with a groove for installing the test wire 13, and the surface of the test wire 13 is in contact with the surface of the insulating sheet 19, one end of the test wire 13 is butt-jointed with one end of the wire interface 14, and the outer wall of the wire interface 14 is wrapped with an insulating silicone sleeve, the live wire 16 and the connecting adapter 15 form a U-shaped structure, and the live wire 16 and the docking socket 18 form a Z-shaped structure detection frame 17;

[0054] In conjunction with the accompanying drawings Figure 1-10As shown, the support plate 2 is installed by snapping into the rectangular opening of the insulating frame 3, the support plate 2 provides support for the semiconductor element body 1, the opening symmetrically arranged on the inner wall of the insulating frame 3 provides installation for the anti-slip guide rail 4, and the anti-slip guide rail 4 provides support for the clamping component. The test copper sheet 12 arranged on the surface of the insulating frame 3 is limited by the installation position of the insulating sheet 19, and the positioning bolt 20 cooperates with the insulating sheet 19 to limit the position of the test copper sheet 12, so that the test copper sheet 12 is convenient for installation in contact with the semiconductor element body 1. The test wire 13 arranged on the surface of the test copper sheet 12 is combined with the wire interface 14 for limited installation, and the test wire 13 is transferred through the connecting transfer terminal 15. and a conducting wire 16, wherein an opening is provided on one side of the connecting adapter end 15 for direct docking with the test device for installation, increasing the docking port between the test piece and the external test equipment, enhancing the versatility and adaptability of the test piece, and reducing the test cost and complexity; a detection frame 17 provided on the surface of the insulating piece 19 provides an installation space for the docking socket 18, wherein the docking socket 18 provides a docking socket on the other side for the test copper piece 12, and interconnected quick sockets, so that any two poles can form a four-wire measurement, especially for the on-resistance of the DS end, which can be accurately tested, realize a more stable test contact, make the test result more stable and accurate, improve product quality, improve test accuracy and test piece replacement efficiency;

[0055] The clamping assembly includes:

[0056] The semiconductor component clamping plate 1 5 has one end disposed on the surface of the anti-slip guide rail 4, and the two ends of the semiconductor component clamping plate 1 5 are symmetrically connected with an anti-slip guide rail 4, the semiconductor component clamping plate 1 5 and the semiconductor component clamping plate 2 8 are symmetrically disposed on both sides of the test copper sheet 12, and the semiconductor component clamping plate 2 8 is a sheet structure made of insulating material;

[0057] The insulating silicone sheet 6 is attached to the surface of the semiconductor element clamping plate 5, and the insulating silicone sheet 6 is against the surface of the test copper sheet 12;

[0058] The wave spring column 7 is symmetrically arranged on both sides of the semiconductor element clamping plate 1 5, and a spring is arranged at one end of the wave spring column 7 that penetrates the semiconductor element clamping plate 1 5. The wave spring column 7 and the semiconductor element clamping plate 2 8 form a U-shaped frame structure, and the semiconductor element clamping plate 2 8 is a sheet structure made of insulating material;

[0059] The semiconductor component clamping plate 2 8 is installed at the top of the wave spring column 7, and the semiconductor component clamping plate 2 8 is arranged parallel to the semiconductor component clamping plate 1 5;

[0060] Conductive sheets 9 are arranged equidistantly inside the second semiconductor element clamping plate 8, and the conductive sheets 9 are located in the gaps between the test copper sheets 12;

[0061] A power-on test battery 10 is mounted on one end of the semiconductor element clamp plate 2 8, and the power-on test battery 10 is connected to a conductive sheet 9 at one end, and the power-on test battery 10 and the warning light 11 are linked by the electric power flowing through the conductive sheet 9 and the test copper sheet 12;

[0062] A warning light 11 is mounted on the other end of the semiconductor component clamp plate 2 8, and the warning light 11 is connected to the conductive sheet 9 at the other end;

[0063] In conjunction with the accompanying drawings Figure 1-10 As shown, the semiconductor component clamping plate 5 is arranged between the anti-slip guide rails 4, as shown in FIG. Figure 1-4 As shown, the bottom end of the test copper sheet 12 is supported by the semiconductor component clamping plate 1 5 and the insulating silicone sheet 6 arranged on the surface to prevent the test copper sheet 12 from being deformed by the falling gravity. The wave spring column 7 that penetrates the semiconductor component clamping plate 1 5 supports the semiconductor component clamping plate 2 8. The conductive sheet 9 arranged at the bottom end of the semiconductor component clamping plate 2 8 is arranged in the gap between the test copper sheet 12, so that the test copper sheet 12 and the conductive sheet 9 are connected to the power-on test battery 10 and the warning light 11 circuit. At this time, the test wire 13 is not connected to the external detection equipment. As the power-on test battery 10 and the warning light 11 are connected to the test copper sheet 1 2. Perform power-on detection to prevent the test copper sheet 12 from providing a stable power-on effect during long-term work, improve the accuracy and reliability of semiconductor component testing, and provide strong protection for the quality of electronic products. If poor contact occurs during use, you can try to test it multiple times. Sometimes the poor contact may be caused by accidental factors. Multiple tests can improve the reliability of the test. When in use, a special coating is applied to the contact surface of the test copper sheet 12. The nano conductive coating is used to improve the conductivity and stability of the contact. The self-lubricating coating can reduce friction and make the contact smoother.

[0064] Working principle: When using the new semiconductor component test piece, first place the semiconductor component body 1 on the surface of the supporting plate 2 of the insulating frame 3, so that the test copper sheet 12 is inserted into the socket on the side wall of the semiconductor component body 1, and then slide the semiconductor component clamp 1 5 and the semiconductor component clamp 2 8 from one side of the surface of the test copper sheet 12, so that the semiconductor component clamp 1 5 and the semiconductor component clamp 2 8 are clamped at the connection between the test copper sheet 12 and the semiconductor component body 1, and provide a certain contact pressure to ensure good contact under different test conditions. The insulating silicone sheet 6 located on the surface of the semiconductor component clamp 1 5 contacts the surface of the test copper sheet 12. At the same time, the insulating silicone sheet 6 on the surface of the semiconductor component clamp 1 5 increases the protection of the surface of the test copper sheet 12. The detection frame 17 arranged on the surface of the insulating sheet 19 provides a supporting effect for the docking socket 18. As the power line 16 is connected to the wire interface 14 and the connecting adapter terminal 15 to connect the test wire 13, it is used to detect the docking of the semiconductor component body 1.

[0065] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new type of semiconductor component test piece, comprising: A semiconductor component body (1) is a main structure of a semiconductor component at a detected end, and ports for docking with a test copper sheet (12) are symmetrically arranged on both sides of the semiconductor component body (1), the test copper sheet (12) is connected to a detection spring sheet socket of the semiconductor component body (1), and the test copper sheet (12) is arranged on a surface of an insulating frame (3), and the insulating frame (3) and the test copper sheet (12) constitute a main structure of a semiconductor component test sheet; The invention is characterized in that: a rectangular opening is arranged inside the insulating frame (3), and a supporting plate (2) is installed in the opening of the insulating frame (3), and the supporting plate (2) is arranged at the bottom end of the semiconductor element body (1), and strip openings are symmetrically arranged on the inner wall surface of the rectangular opening of the insulating frame (3), and an anti-slip guide rail (4) is arranged in the strip opening of the insulating frame (3), and a clamping component is slidably connected to the surface of the anti-slip guide rail (4), which is used to clamp the connection between the semiconductor element body (1) and the test copper sheet (12), so as to facilitate full contact between the test copper sheet (12) and the semiconductor element body (1), thereby ensuring accurate transmission of the test signal; A test copper sheet (12) is symmetrically arranged on the surface of the insulating frame (3), one side of the test copper sheet (12) is inserted into one side of the insulating sheet (19), and positioning bolts (20) are symmetrically arranged at both ends of the insulating sheet (19), the positioning bolts (20) are installed on the surface of the insulating frame (3), and the positioning bolts (20) penetrate the inside of the insulating sheet (19), a detection frame (17) is arranged on the surface of the insulating sheet (19), and a docking socket (18) is equidistantly arranged at the top of the detection frame (17), one end of the docking socket (18) is connected to the live wire (16), and a connecting adapter end (15) is arranged at the bottom end of the live wire (16), and one side of the connecting adapter end (15) is connected to the wire interface (14).

2. A novel semiconductor device testing piece according to claim 1, characterized in that: The bottom end of the insulating frame (3) is flush with the bottom end of the supporting plate (2), and the supporting plate (2) is a rectangular sheet structure made of insulating material.

3. The novel semiconductor device testing piece according to claim 1, characterized in that: The clamping assembly comprises: A semiconductor component clamping plate (5), one end of which is disposed on the surface of the anti-slip guide rail (4), and two ends of the semiconductor component clamping plate (5) are symmetrically connected to an anti-slip guide rail (4); An insulating silicone sheet (6) is attached to the surface of the semiconductor element clamping plate (5), and the insulating silicone sheet (6) is against the surface of the test copper sheet (12); A wave spring column (7) is symmetrically arranged on both sides of the semiconductor element clamping plate (5), and a spring is arranged at one end of the wave spring column (7) that passes through the semiconductor element clamping plate (5); A second semiconductor component clamping plate (8), which is installed at the top of the wave spring column (7), and the second semiconductor component clamping plate (8) is arranged parallel to the first semiconductor component clamping plate (5); Conductive sheets (9) are arranged equidistantly inside the second semiconductor element clamping plate (8), and the conductive sheets (9) are located in the gaps between the test copper sheets (12); A power-on test battery (10) is mounted on one end of the second semiconductor element clamping plate (8), and the power-on test battery (10) is connected to a conductive sheet (9) at one end; A warning light (11) is mounted on the other end of the second semiconductor element clamping plate (8), and the warning light (11) is connected to the conductive sheet (9) at the other end.

4. A novel semiconductor device testing piece according to claim 3, characterized in that: The semiconductor component clamping plate 1 (5) and the semiconductor component clamping plate 2 (8) are symmetrically arranged on both sides of the test copper sheet (12), and the semiconductor component clamping plate 2 (8) is a sheet-like structure made of insulating material.

5. The novel semiconductor device testing piece according to claim 3 is characterized in that: The wave spring column (7) and the semiconductor element clamping plate 2 (8) form a U-shaped frame structure, and the semiconductor element clamping plate 2 (8) is a sheet structure made of insulating material.

6. The novel semiconductor device testing piece according to claim 3 is characterized in that: The energized test battery (10) and the warning light (11) are linked by electricity flowing through the conductive sheet (9) and the test copper sheet (12).

7. The novel semiconductor device testing piece according to claim 1, characterized in that: The surface of the test copper sheet (12) is provided with a groove for mounting the test wire (13), and the surface of the test wire (13) is in contact with the surface of the insulating sheet (19).

8. The novel semiconductor device testing piece according to claim 7 is characterized in that: One end of the test wire (13) is butt-jointed with one end of the wire interface (14), and the outer wall surface of the wire interface (14) is wrapped with an insulating silicone sleeve.

9. The novel semiconductor device testing piece according to claim 1, characterized in that: The live wire (16) and the connecting adapter end (15) form a U-shaped structure, and the live wire (16) and the docking socket (18) form a Z-shaped structure detection frame (17).

10. The novel semiconductor device testing piece according to claim 9, characterized in that: The positioning bolt (20) passes through the interior of the insulating sheet (19), and a support tube (21) is provided between the insulating sheet (19) and the insulating frame (3).

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