A spatially integrated optical amplification device and a method for manufacturing the same

Abstract

The present invention discloses a spatially integrated optical amplification device and a preparation method thereof, comprising a heat sink substrate, a first lens assembly, an optical amplifier chip, a second lens assembly, a cylindrical mirror and an electro-optical modulator assembly. The first lens assembly, the optical amplifier chip, the second lens assembly, the cylindrical mirror and the electro-optical modulator assembly are integrated on the heat sink substrate, which improves the spatial integration and stability of the product, is conducive to realizing the integrated design and packaging of the product, is suitable for the spatial integration of any modulator chip and a semiconductor optical amplifier chip, and has a wide range of applications and high application value in the field of communication technology.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communication and quantum communication, and in particular to a spatially integrated optical amplification device and a preparation method thereof. Background Art

[0002] In the field of optical communication and quantum communication technology, optical amplifiers are often used. Optical amplifiers are used to amplify light to improve the transmission quality of optical signals. Existing optical amplifiers are usually implemented by optical coupling of semiconductor optical amplifier chip modules and modulator chip modules. The modulator chip module and the semiconductor optical amplifier chip module are respectively installed on a base, and the modulator chip module and the semiconductor optical amplifier chip module are connected by optical fiber. The product has low integration, and the optical fiber is easily damaged or broken, which affects the service life of the product.

[0003] In view of this, it is necessary to provide a spatially integrated optical amplification device and a preparation method thereof. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a spatially integrated optical amplification device and a preparation method thereof, which integrates a lens assembly, an optical amplifier chip, a cylindrical mirror and an electro-optical modulator assembly on a heat sink substrate, thereby improving the spatial integration and stability of the product and facilitating the realization of integrated design and packaging of the product.

[0005] The technical solution of the present invention provides a spatially integrated optical amplification device, comprising a heat sink substrate, a first lens assembly, an optical amplifier chip, a second lens assembly, a cylindrical mirror and an electro-optical modulator assembly;

[0006] The heat sink substrate is provided with a first positioning groove, a heat dissipation base, a second positioning groove, a third positioning groove and a fourth positioning groove in sequence from front to back, wherein the fourth positioning groove is a straight groove extending along the front-to-back direction of the heat sink substrate;

[0007] The first lens assembly is fixed in the first positioning groove, and the optical amplifier chip is arranged on the heat dissipation base, wherein the light emitted from the front end of the optical amplifier chip is converted into parallel light after passing through the first lens assembly;

[0008] The second lens assembly is fixed in the second positioning groove and converts the amplified light emitted from the rear end of the optical amplifier chip into parallel light;

[0009] The cylindrical mirror is fixed in the third positioning groove, and the cylindrical mirror is used to shape the light spot into a nearly circular light spot;

[0010] The electro-optic modulator assembly is fixed in the fourth positioning groove, and the electro-optic modulator assembly includes a modulator substrate, a third lens, a modulator chip, a fixed axis portion and an optical fiber;

[0011] The modulator chip is integrated on the modulator substrate, the third lens is integrated at the front end of the modulator substrate, the fixed axis portion is integrated at the rear end of the modulator chip, and the optical fiber is glued to the fixed axis portion; the third lens is used to couple the light passing through the cylindrical mirror to the front end face of the modulator chip to minimize the loss.

[0012] In one of the optional technical solutions, the first lens assembly includes a first optical isolator and a first lens;

[0013] The first optical isolator is used to prevent the light from the front end surface of the optical amplifier chip from reflecting back to the seed light source;

[0014] The first lens is used to receive the seed light signal and focus it onto the front end surface of the optical amplifier chip after passing through the first optical isolator and the first lens.

[0015] In one of the optional technical solutions, the second lens assembly includes a half-wave plate, a second optical isolator and a second lens;

[0016] The half-wave plate is used to ensure that the polarization direction of the output light of the optical amplifier chip after passing through the second optical isolator is consistent with the polarization direction of the modulator chip;

[0017] The second optical isolator is used to prevent the optical signal of the modulator chip from being back-reflected back to the optical amplifier chip;

[0018] The second lens is used to shape the light emitted from the rear end face of the optical amplifier chip into a parallel light beam, and then emit it to the cylindrical mirror.

[0019] In one of the optional technical solutions, a fifth positioning groove and a sixth positioning groove are sequentially provided on the modulator substrate along the front-to-back direction, and the sixth positioning groove is a straight groove extending along the front-to-back direction;

[0020] The third lens is installed in the fifth positioning groove, the modulator chip is installed in the sixth positioning groove, and the front and rear ends of the modulator chip extend out of the sixth positioning groove respectively.

[0021] The technical solution of the present invention further provides a method for preparing the optical amplification device as described in any of the above technical solutions, characterized in that it comprises the following steps:

[0022] S1: soldering the optical amplifier chip to a heat dissipation base, energizing the optical amplifier chip, and emitting light at both ends of the optical amplifier chip;

[0023] S2: respectively fixing the first lens assembly, the second lens assembly, and the cylindrical mirror at appropriate positions in the first positioning groove, the second positioning groove, and the third positioning groove;

[0024] S3: adjusting the spatial position of the electro-optic modulator assembly in the fourth positioning groove by means of an adjustment frame, receiving the optical signal output by the cylindrical mirror and coupling and aligning it, and fixing the electro-optic modulator assembly after the optical fiber outputs the maximum optical power.

[0025] In one of the optional technical solutions, the steps of fixing the first lens assembly and the second lens assembly are as follows:

[0026] The first lens assembly is clamped by an adjustment frame and its position in the first positioning groove is adjusted, and after the divergent light at the front end of the optical amplifier chip is converted into parallel light by the first lens assembly, the first lens assembly is fixed;

[0027] The second lens assembly is clamped by an adjustment frame and its position in the second positioning groove is adjusted. After the divergent light at the rear end of the optical amplifier chip is converted into parallel light by the second lens assembly, the second lens assembly is fixed.

[0028] In one of the optional technical solutions, the steps of fixing the cylindrical mirror are as follows:

[0029] The cylindrical mirror is clamped by an adjustment frame and its spatial position in the third positioning groove is adjusted. After the cylindrical mirror changes the elliptical light spot into a nearly circular light spot, the cylindrical mirror is fixed.

[0030] In one of the optional technical solutions, the assembly and positioning step of the electro-optic modulator assembly includes a first pre-assembly step, a second pre-assembly step and an adjustment and positioning step;

[0031] The first preinstallation step comprises:

[0032] Connecting the optical fiber and the fixed axis portion into a whole;

[0033] The spatial position of the fixed axis portion at the rear end of the modulator chip is adjusted by an adjustment frame, and light is passed through one end of the optical fiber. After the maximum light output power is detected from the front end of the modulator chip, the fixed axis portion is fixed, and the fixed axis portion and the optical fiber are integrated at the rear end of the modulator chip.

[0034] In one of the optional technical solutions, the second preinstallation step includes:

[0035] Pre-mounting the third lens and the modulator chip connected with the axis-fixing portion on the modulator substrate respectively;

[0036] The third lens and the modulator substrate are clamped by two adjustment frames respectively, and are moved to the fourth positioning groove of the heat sink substrate, so that the electro-optic modulator assembly is pre-installed on the heat sink substrate.

[0037] In one of the optional technical solutions, the adjusting and positioning step includes:

[0038] The seed light source and the optical amplifier chip transmit light respectively;

[0039] Vertically move the third lens upward, move the modulator substrate, so that the front end surface of the modulator chip receives light, and detect the received power of the optical fiber, and when the output power of the optical fiber reaches the maximum power of the current stage, keep the modulator substrate stationary;

[0040] The third lens is moved downward to be placed in the fifth positioning groove at the front end of the modulator substrate, and the spatial position of the third lens is adjusted until the output power of the optical fiber reaches the maximum power of the current stage, and the third lens is kept stationary;

[0041] The spatial positions of the third lens and the modulator substrate are adjusted simultaneously. When the output power of the optical fiber reaches the maximum power of the current stage, the third lens is first fixed in the fifth positioning groove, and then the modulator substrate is fixed in the fourth positioning groove, and the electro-optic modulator assembly is fixed on the heat sink substrate.

[0042] The above technical solution has the following beneficial effects:

[0043] The spatially integrated optical amplification device and the preparation method thereof provided by the present invention integrate a first lens assembly, an optical amplifier chip, a second lens assembly, a cylindrical mirror and an electro-optical modulator assembly on a heat sink substrate, and utilize a third lens to couple light passing through the cylindrical mirror to the front end surface of the modulator chip to minimize optical loss, and no optical fiber is required for intermediate connection, thereby improving the spatial integration of the product, reducing the volume of the product, and enhancing the stability of the product, which is conducive to realizing device integrated integrated design and packaging, and is suitable for the spatial integration of any modulator chip and a semiconductor optical amplifier chip, and has a wide range of applications and high application value in the field of communication technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the drawings:

[0045] Figure 1 A top view of an optical amplifying device provided by an embodiment of the present invention;

[0046] Figure 2 is a three-dimensional diagram of a heat sink substrate;

[0047] Figure 3 is a stereogram of a first lens assembly;

[0048] Figure 4 is a three-dimensional diagram of an optical amplifier chip;

[0049] Figure 5 is a schematic diagram of a second lens assembly combined with a cylindrical mirror;

[0050] Figure 6 is a front view of an electro-optic modulator assembly;

[0051] Figure 7 is a three-dimensional diagram of a modulator substrate;

[0052] Figure 8 A top view of the preassembled modulator chip, fixed axis part and optical fiber. DETAILED DESCRIPTION

[0053] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. The same components are represented by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0054] like Figure 1-8 As shown, a spatially integrated optical amplification device provided by an embodiment of the present invention includes a heat sink substrate 1, a first lens assembly 2, an optical amplifier chip 3, a second lens assembly 4, a cylindrical mirror 5 and an electro-optical modulator assembly 6.

[0055] The heat sink substrate 1 is provided with a first positioning groove 11 , a heat dissipation base 12 , a second positioning groove 13 , a third positioning groove 14 and a fourth positioning groove 15 in sequence from front to back. The fourth positioning groove 15 is a straight groove extending along the front-to-back direction of the heat sink substrate 1 .

[0056] The first lens assembly 2 is fixed in the first positioning groove 11 , and the optical amplifier chip 3 is disposed on the heat dissipation base 12 , wherein the light emitted from the front end of the optical amplifier chip 3 is converted into parallel light after passing through the first lens assembly 2 .

[0057] The second lens assembly 4 is fixed in the second positioning groove 13 and converts the amplified light emitted from the rear end of the optical amplifier chip 3 into parallel light.

[0058] The cylindrical mirror 5 is fixed in the third positioning groove 14 , and the cylindrical mirror 5 is used to shape the light spot into a nearly circular light spot.

[0059] The electro-optic modulator assembly 6 is fixed in the fourth positioning groove 15 , and the electro-optic modulator assembly 6 includes a modulator substrate 61 , a third lens 62 , a modulator chip 63 , an axis fixing portion 64 and an optical fiber 65 .

[0060] The modulator chip 63 is integrated on the modulator substrate 61, the third lens 62 is integrated on the front end of the modulator substrate 61, the fixed axis portion 64 is integrated on the rear end of the modulator chip 63, and the optical fiber 65 is glued to the fixed axis portion 64. The third lens 62 is used to couple the light passing through the cylindrical mirror 5 to the front end face of the modulator chip 63 to minimize the optical loss.

[0061] The optical amplifying device provided by the present invention is integrated in space and is used to amplify and transmit seed light.

[0062] The optical amplification device comprises a heat sink substrate 1, a first lens assembly 2, an optical amplifier chip 3, a second lens assembly 4, a cylindrical mirror 5 and an electro-optical modulator assembly 6, etc.

[0063] The heat sink substrate 1 is roughly rectangular and is used for heat dissipation of the optical amplifier chip 3 and fixing the first lens assembly 2, the optical amplifier chip 3, the second lens assembly 4, the cylindrical mirror 5 and the electro-optical modulator assembly 6, etc. Copper or tungsten copper is generally selected as the heat dissipation material. The seed light source is arranged on the front side of the heat sink substrate 1, and the seed light source is not shown in the figure of the present invention.

[0064] The top surface of the heat sink substrate 1 is provided with a first positioning groove 11, a heat dissipation base 12, a second positioning groove 12, a third positioning groove 14 and a fourth positioning groove 15 in sequence along the front-to-back direction. The first positioning groove 11 is a U-shaped groove or an arc-shaped groove, which is formed by being recessed downward from the top surface of the heat sink substrate 1. The first positioning groove 11 is used to position and install the first lens assembly 2. The heat dissipation base 12 is arranged at the rear side of the first positioning groove 11 and protrudes from the top surface of the heat sink substrate 1. The heat dissipation base 12 is used to position and install the optical amplifier chip 3. The second positioning groove 13 is between the heat dissipation base 12 and the third positioning groove 14. The second positioning groove 13 is a U-shaped groove or an arc-shaped groove, which is formed by being recessed downward from the top surface of the heat sink substrate 1. The second positioning groove 13 is used to position and install the second lens assembly 4. The third positioning groove 14 is arranged at the rear side of the second positioning groove 13, and the rear end of the second positioning groove 13 is connected to the third positioning groove 14. The third positioning groove 14 is a rectangular groove, which extends along the width direction of the heat sink substrate 1. The third positioning groove 14 is formed by being recessed downward from the top surface of the heat sink substrate 1. The third positioning groove 14 is used to position and install the cylindrical mirror 5. The fourth positioning groove 15 is arranged at the rear side of the third positioning groove 14. The front end of the fourth positioning groove 15 is connected with the third positioning groove 14. The fourth positioning groove 15 is a rectangular straight groove, which extends along the front-to-back direction of the heat sink substrate 1. The third positioning groove 14 is formed by being recessed downward from the top surface of the heat sink substrate 1. The fourth positioning groove 15 is used to position and install the electro-optic modulator assembly 6.

[0065] The optical amplifier chip 3 is arranged on the heat dissipation base 12. The optical amplifier chip 3 is a semiconductor optical amplifier chip, which uses the particle number inversion in the gain medium of the semiconductor to induce stimulated radiation to generate light amplification. The amplified signal is an externally input seed light signal, and the wavelength range can be from visible light to far infrared. The wavelength of the optical amplifier is selected according to the wavelength of the required electro-optic modulator, and the wavelengths of the two can be consistent.

[0066] The optical amplifier chip 3 has an incident end 31 and an output end 32. The incident end 31 and the output end 32 are defined along the propagation path of the seed light, which does not mean that the incident end 31 cannot emit light forward. After the optical amplifier chip 3 is powered on, the incident end 31 can emit light forward, and the output end 32 can emit light backward.

[0067] The process of assembling and positioning the optical amplifier chip 3 is as follows: first, solder is placed on the heat sink 12 and heated to melt, the optimal position of the optical amplifier chip 3 is determined and fixed on the heat sink 12, and then the positive and negative electrodes of the optical amplifier chip 3 are connected to the circuit to ensure that both the incident end 31 and the output end 32 of the optical amplifier chip 3 can emit light normally.

[0068] The first lens assembly 2 is fixed in the first positioning groove 11, and the first lens assembly 2 is located in front of the incident end 31. The positioning standard for the installation of the first lens assembly 2 is: first, the optical amplifier chip 3 is powered on, and the incident end 31 and the output end 32 emit light respectively, and then the spatial position of the first lens assembly 2 in the first positioning groove 11 is adjusted by the adjustment frame. When the light emitted from the incident end 31 becomes parallel light after passing through the first lens assembly 2, it means that the first lens assembly 2 is adjusted in place, and the first lens assembly 2 is fixed in the first positioning groove 11 by gluing. When the seed light source emits light, the divergent light will be shaped by the first lens assembly 2 and will become parallel light and focus on the incident end 31, which plays an amplifying role.

[0069] During bonding, the bottom of the first lens assembly 2 is glued in the first positioning groove 11 , and the main body of the first lens assembly 2 is located above the top surface of the heat sink substrate 1 .

[0070] The second lens assembly 4 is fixed in the second positioning groove 13, and is used to convert the amplified light emitted from the rear end of the optical amplifier chip 3 into parallel light. The adjustment and positioning standard of the second lens assembly 4 is as follows: after the first lens assembly 2 is installed and fixed, the seed light and the optical amplifier chip 3 are powered on to ensure that the seed light is fully coupled to the incident end face of the optical amplifier chip 3. At this time, the optical power of the output end 32 of the optical amplifier chip 3 is amplified, and then the spatial position of the second lens assembly 4 in the second positioning groove 13 is adjusted by the adjustment frame. When the light emitted from the output end 32 becomes parallel light after passing through the second lens assembly 4, it indicates that the second lens assembly 4 is adjusted in place, and the second lens assembly 4 is fixed in the second positioning groove 13 by gluing.

[0071] During bonding, the bottom of the second lens assembly 4 is glued in the second positioning groove 13 , and the main body of the second lens assembly 4 is located above the top surface of the heat sink substrate 1 .

[0072] The present invention Figure 5 It is shown that the rear side of the second lens assembly 4 is connected to the cylindrical mirror 5. In other embodiments, the rear side of the second lens assembly 4 and the cylindrical mirror 5 may be spaced apart by a preset distance.

[0073] The cylindrical mirror 5 is fixed in the third positioning groove 14. The front side of the cylindrical mirror 5 is a convex surface, and the rear side is a flat surface. The cylindrical mirror 5 is used to shape the light spot so that the elliptical light spot becomes a near-circular light spot. When positioning and installing the cylindrical mirror 5, the cylindrical mirror 5 is clamped by an adjustment frame and its spatial position in the third positioning groove 14 is adjusted. When the light emitted from the output end 32 is shaped into a near-circular light spot by the cylindrical mirror 5, it means that the cylindrical mirror 5 is adjusted in place, and the cylindrical mirror 5 is fixed in the third positioning groove 14 by gluing.

[0074] During bonding, the bottom of the cylindrical mirror 5 is glued in the third positioning groove 14 , and the main body of the cylindrical mirror 5 is located above the top surface of the heat sink substrate 1 .

[0075] If the performance of the optical amplifier chip 3 is good, the light emitted from the output end 32 is basically parallel light, and the light spot is similar to an ellipse. After being shaped by the cylindrical mirror 5, the ellipse light spot becomes a near-circular light spot, and propagates to the rear electro-optic modulator component 6. The near-circular light spot is a light spot with a circular or nearly circular outline.

[0076] The electro-optic modulator assembly 6 is fixed in the fourth positioning groove 15 , and the front-end device of the electro-optic modulator assembly 6 is coupled with the output optical path of the cylindrical mirror 5 .

[0077] The electro-optic modulator assembly 6 includes a modulator substrate 61, a third lens 62, a modulator chip 63, a fixed axis portion 64, and an optical fiber 65. The modulator chip 63 is integrated on the modulator substrate 61, and has an input end 631 and an output end 632. The input end 631 and the output end 632 are distinguished by the light propagation path of the seed light source. When the optical fiber 65 emits light, the output end 632 is the light input end, and the input end 631 is the light output end.

[0078] The waveguide end faces of the input end 631 and / or the output end 632 include but are not limited to inclined surfaces or straight surfaces. The third lens 62 is integrated at the front end of the modulator substrate 61 and is located in front of the input end 631. The third lens 62 is a convex lens, and a suitable focal length is selected to receive the optical signal of the cylindrical mirror 5 and couple the optical signal to the input end 631 to minimize the optical coupling loss.

[0079] The fixed axis portion 64 is integrated at the rear end of the modulator chip 63 , and the optical fiber 65 is glue-connected to the fixed axis portion 64 .

[0080] The modulator substrate 61 is used to install and position the third lens 62 and the modulator chip 63. When the optical coupling is positioned, the modulator substrate 61 can be clamped by an adjustment frame without damaging the modulator chip 63. The modulator substrate 61 can be fixed as a whole in the fourth positioning groove 15 of the heat sink substrate 1. The adjustment frame is used to adjust the spatial position of the electro-optic modulator assembly 6 according to the spatial position of the output light of the cylindrical mirror 5, so that the third lens 62 receives the output light of the cylindrical mirror 5 and measures the maximum output optical power of the optical fiber 65, and then the modulator substrate 61 is fixed in the fourth positioning groove 15 by gluing. The modulator substrate 61 can be made of stainless steel.

[0081] The modulator chip 63 is an electro-optic modulator chip, which includes but is not limited to a lithium niobate modulator or a thin-film lithium niobate modulator. The input end 631 and / or the output end 632 of the modulator chip 63 extend out of the outside of the modulator substrate 61, or the input end 631 and / or the output end 632 extend out of the chip mounting groove provided on the modulator substrate 61, so as to facilitate optical coupling with the fixed axis portion 64 and fix it with glue.

[0082] The fixed axis portion 64 has a through hole inside, and one end of the optical fiber 65 passes through the through hole and is fixed with glue. The polarization direction of the optical fiber 65 is determined by observing the cat's eye structure of the optical fiber through the through hole to maintain a high degree of consistency with the polarization direction of the electro-optic modulator. The gap between the optical fiber 65 and the fixed axis portion 64 is glued, and the end faces of the output end 632, the fixed axis portion 64, and the optical fiber 65 facing the output end 632 are precisely polished to reduce end face scattering. The end face of the optical fiber 65 facing the output end 632 is aligned with the optical coupling of the output end 632, and the end face of the fixed axis portion 64 and the output end 632 are fixed by gluing, and the end face gap is filled.

[0083] The optical fiber 65 includes but is not limited to a single-mode polarization-maintaining optical fiber or a single-mode optical fiber. The mode field diameter of the optical fiber 65 is determined according to the mode field of the modulator chip 63 .

[0084] The spatially integrated optical amplification device provided by the present invention integrates a first lens assembly 2, an optical amplifier chip 3, a second lens assembly 4, a cylindrical mirror 5 and an electro-optical modulator assembly 6 on a heat sink substrate 1, and utilizes a third lens 62 to couple light passing through the cylindrical mirror 5 to the front end surface of a modulator chip 63 to realize optical coupling, thereby minimizing optical loss and eliminating the need to use optical fibers for intermediate connection. This improves the spatial integration of the product, reduces the volume of the product, enhances the stability of the product, and is conducive to realizing device integrated integrated design and packaging. The device is suitable for spatial integration of any modulator chip and a semiconductor optical amplifier chip, and has a wide range of applications and high application value in the field of communication technology.

[0085] The spatially integrated optical amplifier device provided by the present invention only needs to consider the coupling alignment problem between the seed light and the optical amplifier device when in use. If there is a special need, the convex lens in the first lens assembly 2 and / or the second lens assembly 4 can be replaced in time, and there is no need to consider the optical transmission docking problem between the optical amplifier chip 3 and the modulator chip 63. The integrated design, coupling and packaging of the optical amplifier device is realized, and the problems of inconvenient spatial alignment operation, fiber splicing breakage, light loss, etc. caused by using optical fiber to connect the optical amplifier chip 3 and the modulator chip 63 in the prior art are overcome, and the problem of low power output of the existing optical amplifier device is solved.

[0086] The spatially integrated optical amplification device provided by the present invention can conveniently and efficiently integrate a small-sized, highly stable and integrally packaged high-power signal transmission system in batches, is suitable for the spatial integration of any electro-optic modulator chip and semiconductor optical amplifier chip, has enhanced versatility, and can be widely promoted and applied in the field of communication technology.

[0087] In one embodiment, if Figure 1-3 As shown, the first lens assembly 2 includes a first optical isolator 22 and a first lens 21 .

[0088] The first optical isolator 22 is used to prevent the light from the front end of the optical amplifier chip 3 from being reflected back to the seed light source. An optical isolator is a passive optical device that only allows one-way light transmission. An isolator with a relatively large isolation of about 60 dB is usually considered.

[0089] The first lens 21 is used to receive the seed light signal and focus it onto the front end surface of the optical amplifier chip 3 after passing through the first optical isolator 22 and the first lens 21 .

[0090] The first lens assembly 2 includes a first optical isolator 22 and a first lens 21. The first optical isolator 22 is integrated at the front end of the first lens 21. The first optical isolator 22 is used to prevent the backlight of the optical amplifier chip 3 from being reflected back to the seed light source. The first lens 21 is a convex lens, which is used to receive the seed light signal and focus it to the incident end 31 of the optical amplifier chip 3. The focal length of the first lens 21 is generally selected between 1 mm and 3 mm.

[0091] When the first lens assembly 2 is spatially adjusted, the first optical isolator 22 and the first lens 21 are adjusted as a whole.

[0092] In one embodiment, if Figure 5 As shown, the second lens assembly 4 includes a half-wave plate, a second optical isolator 42 and a second lens 41.

[0093] The half-wave plate is used to ensure that the polarization direction of the output light of the optical amplifier chip 3 after passing through the second optical isolator 42 is consistent with the polarization direction of the modulator chip 63 .

[0094] The second optical isolator 42 is used to prevent the optical signal of the modulator chip 63 from being reflected back to the optical amplifier chip 3 .

[0095] The second lens 41 is used to shape the light emitted from the rear end face of the optical amplifier chip 3 into a parallel light beam, and then direct it toward the cylindrical mirror 5 .

[0096] When the second lens assembly 4 is spatially adjusted, the half-wave plate, the second optical isolator 42 and the second lens 41 form a whole and move as a whole. The focal length of the second lens 41 is related to the mode field of the third lens 62 and the modulator chip 63. The second optical isolator 42 is arranged at the rear side of the second lens 41, and the half-wave plate is arranged at the rear side of the second optical isolator 42.

[0097] In one embodiment, if Figure 6-7 As shown, a fifth positioning groove 611 and a sixth positioning groove 612 are sequentially provided on the modulator substrate 61 along the front-to-back direction, and the sixth positioning groove 612 is a straight groove extending along the front-to-back direction.

[0098] The third lens 62 is installed in the fifth positioning groove 611 , and the modulator chip 63 is installed in the sixth positioning groove 612 . The front and rear ends of the modulator chip 63 extend out of the sixth positioning groove 612 respectively.

[0099] In this embodiment, the modulator substrate 61 is provided with a fifth positioning groove 611 and a sixth positioning groove 612. The fifth positioning groove 611 is located at the front end of the modulator substrate 61, and the fifth positioning groove 611 is U-shaped or arc-shaped. The fifth positioning groove 611 is used to fix the third lens 62. After the third lens 62 and the modulator substrate 61 are adjusted in place, the third lens 62 is fixed in the fifth positioning groove 611 by gluing.

[0100] The sixth positioning groove 612 is provided on the modulator substrate 61 and is located at the rear side of the fifth positioning groove 611. The sixth positioning groove 612 is a rectangular straight groove extending along the front-to-back direction. The sixth positioning groove 612 is used to fix the modulator chip 63, and the modulator chip 63 is bonded in the sixth positioning groove 612. The length of the sixth positioning groove 612 is shorter than the length of the modulator chip 63, and the modulator chip 63 is bonded to the center position of the sixth positioning groove 612 with glue. When placing the modulator chip 63, ensure that the bottom of the modulator chip 63 is parallel to the bottom of the sixth positioning groove 612, and the two side walls of the modulator chip 63 are parallel to the two side walls of the sixth positioning groove 612. When adjusting the modulator chip 63, the adjustment frame clamps the modulator substrate 61, and the modulator chip 63 will not be damaged.

[0101] After the third lens 62 and the modulator substrate 61 are adjusted to their proper positions, the third lens 62 is first fixed in the fifth positioning groove 611 by gluing, and then the modulator substrate 61 is fixed in the sixth positioning groove 612 .

[0102] The spatial adjustment method of the third lens 62 and the modulator substrate 61 will be described in detail later in this article.

[0103] Combination Figure 1-8 As shown, a method for preparing an optical amplification device provided by an embodiment of the present invention includes the following steps:

[0104] S1: solder the optical amplifier chip 3 onto the heat dissipation base 12, power on the optical amplifier chip 3, and the front and rear ends of the optical amplifier chip 3 emit light.

[0105] S2: respectively fix the first lens assembly 2, the second lens assembly 4, and the cylindrical mirror 5 at appropriate positions in the first positioning groove 11, the second positioning groove 13, and the third positioning groove 14.

[0106] S3: The spatial position of the electro-optic modulator assembly 6 in the fourth positioning groove 15 is adjusted by the adjustment frame, the optical signal output by the cylindrical mirror 5 is received and coupled and aligned, and the electro-optic modulator assembly 6 is fixed after the optical fiber 65 outputs the maximum optical power.

[0107] The preparation method of the optical amplification device provided by the present invention integrates a first lens assembly 2, an optical amplifier chip 3, a second lens assembly 4, a cylindrical mirror 5 and an electro-optical modulator assembly 6 on a heat sink substrate 1, and uses a third lens 62 to couple the light passing through the cylindrical mirror 5 to the front end surface of the modulator chip 63 to realize optical coupling, with minimal light loss, and no need to use optical fiber for connection in the middle, thereby improving the spatial integration of the product, reducing the volume of the product, and enhancing the stability of the product, which is conducive to realizing the integrated design and packaging of device integration, and is suitable for the spatial integration of any modulator chip and a semiconductor optical amplifier chip, and has a wide range of applications and high application value in the field of communication technology.

[0108] The assembly steps of the preparation method are as follows:

[0109] Step 1: Solder the optical amplifier chip 3 on the heat sink 12 so that its incident end 31 is forward and the output end 32 is backward. After the optical amplifier chip 3 is powered on, the incident end 31 can emit light forward and the output end 32 can emit light backward. The specific process is as follows: first place solder on the heat sink 12 and heat it to melt, determine the best position of the optical amplifier chip 3 and fix it on the heat sink 12, and connect the positive and negative electrodes of the optical amplifier chip 3 to the circuit to ensure that both the incident end 31 and the output end 32 of the optical amplifier chip 3 can emit light normally.

[0110] Step 2: Use the adjustment frame to fix the first lens assembly 2, the second lens assembly 4, and the cylindrical mirror 5 at appropriate positions in the first positioning groove 11, the second positioning groove 13, and the third positioning groove 14 respectively.

[0111] Step 3: Use two sets of adjustment frames to adjust the spatial positions of the third lens 62 and the modulator substrate 61 respectively. Specifically, first glue and fix the optical fiber 65 and the fixed axis portion 64 as a whole, then align the optical coupling of the core of the optical fiber 65 with the output end 632 of the modulator chip 63 and glue and fix them, and then bond the modulator chip 63 to the specified position on the modulator substrate 61. After the spatial positions of the third lens 62 and the modulator substrate 61 are adjusted to the right position, it means that the spatial position of the electro-optic modulator assembly 6 in the fourth positioning groove 15 is adjusted to the right position, and the third lens 62 is clamped in the fifth positioning groove 611 in the modulator substrate 61 by the adjustment frame, and the modulator substrate 61 is placed in the fourth positioning groove 15 of the heat sink substrate 1. The cylindrical mirror 5 is optically coupled with the third lens 62, the third lens 62 is optically coupled with the incident end 631, and the optical fiber 65 is optically coupled with the output end 632. At this time, the maximum optical power of the output end of the monitoring optical fiber 65 is G3. The optical coupling alignment in the present invention refers to the optical path coupling alignment between two components.

[0112] In one embodiment, the steps of fixing the first lens assembly 2 are as follows:

[0113] The first lens assembly 2 is clamped by the adjusting frame and its position in the first positioning groove 11 is adjusted. After the divergent light from the front end of the optical amplifier chip 3 is converted into parallel light through the first lens assembly 2, the first lens assembly 2 is fixed.

[0114] Specifically, the first lens assembly 2 is clamped by the adjustment frame, and the position of the first lens assembly 2 in the first positioning groove 11 is adjusted. When the light emitted from the incident end 31 becomes parallel light after passing through the first lens assembly 2, it means that the first lens assembly 2 is adjusted in place, and the first lens assembly 2 is fixed in the first positioning groove 11 by gluing. At this time, the seed light is energized, and the seed light source emits light through the first lens assembly 2 and focuses on the incident end 31, and the optical amplifier chip 3 amplifies the optical power.

[0115] In one embodiment, the fixing steps of the second lens assembly 4 are as follows:

[0116] The second lens assembly 4 is clamped by the adjusting frame and its position in the second positioning groove 13 is adjusted. After the divergent light at the rear end of the optical amplifier chip 3 is converted into parallel light through the second lens assembly 4, the second lens assembly 4 is fixed.

[0117] Specifically, after the first lens assembly 2 is installed and fixed, the optical amplifier chip 3 is kept powered on, and the spatial position of the second lens assembly 4 in the second positioning groove 13 is adjusted by the adjustment frame, and the seed light and the optical amplifier chip 3 are kept powered on to ensure that the seed light is fully coupled to the incident end 31 of the optical amplifier chip 3. At this time, the optical power of the output end 32 of the optical amplifier chip 3 is amplified. When the amplified light emitted from the output end 32 becomes parallel light after passing through the second lens assembly 4, it indicates that the second lens assembly 4 is adjusted in place, and the second lens assembly 4 is fixed in the second positioning groove 13 by gluing.

[0118] In one embodiment, the steps of fixing the cylindrical mirror 5 are as follows:

[0119] The cylindrical mirror 5 is clamped by the adjustment frame and its spatial position in the third positioning groove 14 is adjusted. When the seed light source emits light, the light emitted from the output end 32 is shaped by the second lens assembly 4 and then becomes parallel light and is emitted to the cylindrical mirror 5. After the cylindrical mirror 5 changes the elliptical light spot into a nearly circular light spot, it means that the cylindrical mirror 5 is adjusted in place, and the cylindrical mirror 5 is fixed in the third positioning groove 14 by gluing.

[0120] In one embodiment, the assembly and positioning steps of the electro-optic modulator assembly 6 include a first pre-assembly step, a second pre-assembly step, and an adjustment and positioning step.

[0121] The first pre-installation step refers to the pre-installation step of the optical fiber 65, the fixed axis portion 64 and the modulator chip 63, including:

[0122] The optical fiber 65 and the fixed axis portion 64 are connected as a whole.

[0123] The spatial position of the fixed axis part 64 at the rear end of the modulator chip 63 is adjusted by the adjustment frame, and light is passed through one end of the optical fiber 65. After the maximum light output power is detected from the front end of the modulator chip 63, the fixed axis part 64 is fixed, and the fixed axis part 64 and the optical fiber 65 are integrated at the rear end of the modulator chip 63.

[0124] Specifically, the optical fiber 65 and the fixed axis portion 64 are first assembled, one end of the optical fiber 65 passes through the through hole of the fixed axis portion 64 and is fixed with glue, the gap between the optical fiber 65 and the fixed axis portion 64 is bonded with glue, and the end faces of the output end 632, the fixed axis portion 64 and the optical fiber 65 facing the output end 632 are precisely polished to reduce end face scattering.

[0125] The modulator chip 63 is placed on the platform, and the fixed axis portion 64 is clamped by the adjustment frame, and the optical fiber 65 is passed through, and one end of the fixed axis portion 64 is precisely coupled and aligned with the output end 632, and it emits light toward the modulator chip 63. The optical power is detected from the input end 631. When the optical power reaches the maximum, it means that the end face of the optical fiber 65 is optically coupled and aligned with the output end 632. Then, the end face of the fixed axis portion 64 and the output end 632 are fixed by gluing, and the end face gap is filled, and the fixed axis portion 64 and the optical fiber 65 are integrated at the rear end of the modulator chip 63.

[0126] The second pre-assembly step refers to the pre-assembly step of the third lens 62 , the modulator chip 63 and the modulator substrate 61 .

[0127] The adjustment and positioning step refers to the step of adjusting and positioning the third lens 62 to be fixed on the modulator substrate 61 and adjusting and fixing the modulator substrate 61 in the fourth positioning groove 15 for installation.

[0128] In one embodiment, the second pre-installation step includes:

[0129] The third lens 62 and the modulator chip 63 connected with the fixed axis portion 64 are pre-mounted on the modulator substrate 61 respectively.

[0130] The third lens 62 and the modulator substrate 61 are clamped by two sets of adjustment frames respectively, and moved to the fourth positioning groove 15 of the heat sink substrate 1 , so that the electro-optic modulator assembly 6 is pre-installed on the heat sink substrate 1 .

[0131] In this embodiment, the modulator chip 63 with the fixed axis portion 64 and the optical fiber 65 integrated at the rear end is first fixed in the sixth positioning groove 612 , and then the third lens 62 is placed at a designated position in the fifth positioning groove 611 of the modulator substrate 61 .

[0132] A set of adjustment frames is used to adjust the third lens 62, and another set of adjustment frames is used to adjust the modulator substrate 61, so as to keep the relative positions of the third lens 62 and the modulator substrate 61 unchanged, and move the modulator substrate 61 into the fourth positioning groove 15 of the heat sink substrate 1 to complete the pre-installation of the electro-optic modulator assembly 6 and the heat sink substrate 1.

[0133] In one embodiment, the adjusting positioning step includes:

[0134] The seed light source and the optical amplifier chip 3 transmit light respectively.

[0135] Move the third lens 62 upward vertically and move the modulator substrate 61 so that the front end surface of the modulator chip 63 receives light and detects the received power of the optical fiber 65. When the output power of the optical fiber 65 reaches the maximum power of the current stage, keep the modulator substrate 61 stationary.

[0136] The third lens 62 is moved down and placed into the fifth positioning groove 611 at the front end of the modulator substrate 61, and the spatial position of the third lens 62 is adjusted until the output power of the optical fiber 65 reaches the maximum power of the current stage, and the third lens 62 is kept stationary.

[0137] The spatial positions of the third lens 62 and the modulator substrate 61 are adjusted at the same time. When the output power of the optical fiber 65 reaches the maximum power of the current stage, the third lens 62 is first fixed in the fifth positioning groove 611, and then the modulator substrate 61 is fixed in the fourth positioning groove 15, and the electro-optic modulator assembly 6 is fixed on the heat sink substrate 1.

[0138] In this embodiment, first, the seed light source located in front of the heat sink substrate 1 is powered on to emit light, and the optical amplifier chip 3 is also powered on to emit light.

[0139] Then, a set of adjustment frames is used to vertically move the third lens 62 upward to leave the fifth positioning groove 611, and a set of adjustment frames is used to move the modulator substrate 61 in the fourth positioning groove 15, so that the input end of the modulator chip 63 can receive light and detect the received power of the optical fiber 65. When the output power of the optical fiber 65 reaches the maximum power G1 of the current stage, it indicates that the spatial position of the modulator chip 63 in the fourth positioning groove 15 meets the requirements. The set of adjustment frames clamping the modulator substrate 61 remains at the current position, thereby keeping the modulator chip 63 still.

[0140] Then, the third lens 62 is moved down by the adjustment frame, and the third lens 62 is placed in the fifth positioning groove 611, and the spatial position of the third lens 62 is adjusted until the output power of the optical fiber 65 reaches the maximum power G2 of the current stage, and G2 is greater than G1, indicating that the spatial position of the third lens 62 in the fifth positioning groove 611 meets the requirements. A set of adjustment frames for keeping the third lens 62 in the fifth positioning groove 611 is immovable.

[0141] Finally, two sets of adjustment frames are used to adjust the spatial positions of the third lens 62 and the modulator substrate 61 respectively. When the output power of the optical fiber 65 reaches the maximum power G3 of the current stage, G3 is greater than G2, indicating that the third lens 62 and the modulator chip 63 are in the best position on the heat sink substrate 1. The third lens 62 is first fixed in the fifth positioning groove 611 by gluing, and then the modulator substrate 61 is fixed in the fourth positioning groove 15, so that the electro-optic modulator assembly 6 is integrated on the heat sink substrate 1.

[0142] As needed, the above technical solutions can be combined to achieve the best technical effect.

[0143] The above are only the principles and preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several other modifications can be made based on the principles of the present invention, which should also be considered as the protection scope of the present invention.

Claims

1. A spatially integrated optical amplification device, characterized in that: It comprises a heat sink substrate (1), a first lens assembly (2), an optical amplifier chip (3), a second lens assembly (4), a cylindrical mirror (5) and an electro-optic modulator assembly (6); The heat sink substrate (1) is provided with a first positioning groove (11), a heat dissipation base (12), a second positioning groove (13), a third positioning groove (14) and a fourth positioning groove (15) in sequence from front to back, wherein the fourth positioning groove (15) is a straight groove extending along the front-to-back direction of the heat sink substrate (1); The first lens assembly (2) is fixed in the first positioning groove (11), and the optical amplifier chip (3) is arranged on the heat dissipation base (12), wherein light emitted from the front end of the optical amplifier chip (3) is converted into parallel light after passing through the first lens assembly (2); The second lens assembly (4) is fixed in the second positioning groove (13) and converts the amplified light emitted from the rear end of the optical amplifier chip (3) into parallel light; The cylindrical mirror (5) is fixed in the third positioning groove (14), and the cylindrical mirror (5) is used to shape the light spot into a nearly circular light spot; The electro-optic modulator assembly (6) is fixed in the fourth positioning groove (15), and the electro-optic modulator assembly (6) comprises a modulator substrate (61), a third lens (62), a modulator chip (63), a fixed axis portion (64), and an optical fiber (65); The modulator chip (63) is integrated on the modulator substrate (61), the third lens (62) is integrated at the front end of the modulator substrate (61), the fixed axis portion (64) is integrated at the rear end of the modulator chip (63), and the optical fiber (65) is glue-connected to the fixed axis portion (64); the third lens (62) is used to couple light passing through the cylindrical mirror (5) to the front end surface of the modulator chip (63).

2. The spatially integrated optical amplification device according to claim 1, characterized in that: The first lens assembly (2) comprises a first optical isolator (22) and a first lens (21); The first optical isolator (22) is used to prevent light from the front end surface of the optical amplifier chip (3) from being reflected back to the seed light source; The first lens (21) is used to receive the seed light signal and focus it onto the front end surface of the optical amplifier chip (3) after passing through the first optical isolator (22) and the first lens (21).

3. The spatially integrated optical amplification device according to claim 1, characterized in that: The second lens assembly (4) comprises a half-wave plate, a second optical isolator (42) and a second lens (41); The half-wave plate is used to ensure that the polarization direction of the output light of the optical amplifier chip (3) after passing through the second optical isolator (42) is consistent with the polarization direction of the modulator chip (63); The second optical isolator (42) is used to prevent the optical signal of the modulator chip (63) from being back-reflected back to the optical amplifier chip (3); The second lens (41) is used to shape the light emitted from the rear end face of the optical amplifier chip (3) into a parallel light beam, which is then directed toward the cylindrical mirror (5).

4. The spatially integrated optical amplification device according to claim 1, characterized in that: The modulator substrate (61) is provided with a fifth positioning groove (611) and a sixth positioning groove (612) in sequence along the front-to-back direction, and the sixth positioning groove (612) is a straight groove extending along the front-to-back direction; The third lens (62) is mounted in the fifth positioning groove (611), the modulator chip (63) is mounted in the sixth positioning groove (612), and the front and rear ends of the modulator chip (63) respectively extend out of the sixth positioning groove (612).

5. A method for preparing the optical amplification device according to any one of claims 1 to 4, characterized in that: The steps include: S1: soldering the optical amplifier chip (3) onto a heat dissipation base (12), energizing the optical amplifier chip (3), and emitting light at both ends of the optical amplifier chip (3); S2: respectively fixing the first lens assembly (2), the second lens assembly (4), and the cylindrical mirror (5) at designated positions in the first positioning groove (11), the second positioning groove (13), and the third positioning groove (14); S3: adjusting the spatial position of the electro-optic modulator assembly (6) in the fourth positioning groove (15) by means of an adjustment frame, receiving the optical signal output by the cylindrical mirror (5) and coupling and aligning it, and fixing the electro-optic modulator assembly (6) after the optical fiber (65) outputs the maximum optical power.

6. The method for preparing an optical amplifier device according to claim 5, characterized in that: The steps of fixing the first lens assembly (2) and the second lens assembly (4) are as follows: The first lens assembly (2) is clamped by an adjustment frame and its position in the first positioning groove (11) is adjusted, and after the divergent light at the front end of the optical amplifier chip (3) is converted into parallel light by the first lens assembly (2), the first lens assembly (2) is fixed; The second lens assembly (4) is clamped by an adjustment frame and its position in the second positioning groove (13) is adjusted, and after the divergent light at the rear end of the optical amplifier chip (3) is converted into parallel light by the second lens assembly (4), the second lens assembly (4) is fixed.

7. The method for preparing an optical amplifier device according to claim 5, characterized in that: The steps for fixing the cylindrical mirror (5) are as follows: The cylindrical mirror (5) is clamped by an adjustment frame and its spatial position in the third positioning groove (14) is adjusted; after the cylindrical mirror (5) changes the elliptical light spot into a near-circular light spot, the cylindrical mirror (5) is fixed.

8. The method for preparing an optical amplifying device according to claim 5, characterized in that: The assembly and positioning steps of the electro-optic modulator assembly (6) include a first pre-assembly step, a second pre-assembly step and an adjustment and positioning step; The first preinstallation step comprises: Connecting the optical fiber (65) and the fixed axis portion (64) into a whole; The spatial position of the fixed axis portion (64) at the rear end of the modulator chip (63) is adjusted by an adjustment frame, and light is passed through one end of the optical fiber (65). After the maximum light output power is detected from the front end of the modulator chip (63), the fixed axis portion (64) is fixed, and the fixed axis portion (64) and the optical fiber (65) are integrated at the rear end of the modulator chip (63).

9. The method for preparing an optical amplifying device according to claim 8, characterized in that: The second preinstallation step comprises: Pre-installing the third lens (62) and the modulator chip (63) connected to the fixed axis portion (64) on the modulator substrate (61) respectively; The third lens (62) and the modulator substrate (61) are respectively clamped by two adjustment frames and moved into the fourth positioning groove (15) of the heat sink substrate (1), so as to pre-install the electro-optic modulator assembly (6) on the heat sink substrate (1).

10. The method for preparing an optical amplifying device according to claim 9, characterized in that: The adjusting and positioning step comprises: The seed light source and the optical amplifier chip (3) transmit light respectively; The third lens (62) is moved upward vertically, and the modulator substrate (61) is moved so that the front end surface of the modulator chip (63) receives light, and the received power of the optical fiber (65) is detected, and when the output power of the optical fiber (65) reaches the maximum power of the current stage, the modulator substrate (61) is kept stationary; The third lens (62) is moved downward to be placed in the fifth positioning groove (611) at the front end of the modulator substrate (61), and the spatial position of the third lens (62) is adjusted until the output power of the optical fiber (65) reaches the maximum power of the current stage, and the third lens (62) is kept stationary; The spatial positions of the third lens (62) and the modulator substrate (61) are adjusted simultaneously. When the output power of the optical fiber (65) reaches the maximum power at the current stage, the third lens (62) is first fixed in the fifth positioning groove (611), and then the modulator substrate (61) is fixed in the fourth positioning groove (15), and the electro-optic modulator assembly (6) is fixed on the heat sink substrate (1).

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