A high-precision visual wafer identification probe station

Abstract

The present invention discloses a high-precision visual wafer identification probe station, which relates to the field of probe station technology, including a driving structure, a probe card alignment structure, a wafer three-level protection assembly and a ceramic arm assembly. The driving structure pulls the protective suction cup on the top thereof to move in the X-axis and Y-axis directions; the probe card alignment structure includes an obtuse plate fixed on the top of the driving structure, an oblique side plate of the obtuse plate is penetrated and fixed with a telescopic cylinder, the telescopic end of the telescopic cylinder is detachably connected to the alignment positioning platform, and the movement of the alignment positioning platform makes the alignment hole close to the alignment camera. The present invention can provide multi-level protection for wafer detection by setting a wafer three-level protection assembly, and the fragmentation goal bracket risk defense structure can determine whether the wafer has the risk of slipping out of the ceramic arm assembly by detecting the installation state of the wafer when the wafer is located on the ceramic arm assembly, thereby improving the accuracy of wafer transmission and strengthening the monitoring of the wafer status.

Description

Technical Field

[0001] The invention relates to the technical field of probe stations, and in particular to a high-precision visual wafer recognition probe station. Background Art

[0002] The probe station is mainly used for testing wafers and dies. It screens wafers before they are packaged, removes defective products, and reduces the cost of back-end packaging. Usually, the probe station can use different types of probe cards according to the size and specifications of the wafer to be tested. The metal probes on the probe card contact the wafer circuit, so that the wafer circuit, probe station, and test machine form a complete loop to build a basic test environment. The use of micro-probes and special fixtures can detect and analyze the performance and characteristics of semiconductor devices, such as measuring the resistivity, resistance, current, potential, etc. of the device, as well as parameters such as photocurrent, spectrum, and reflectivity.

[0003] The probe station is usually composed of a precision sample stage, a high-resolution microscope, a chuck and a probe. The precision sample stage can position the wafer or chip, facilitating real-time monitoring and adjustment of the probe position; the high-resolution microscope can observe the morphology and structure of the sample surface in real time, and magnify the observation of the object to be tested, so as to accurately align the probe tip and prevent it from being on the measuring point of the wafer to be tested; the chuck and the probe can add back electrodes according to the sample to be tested, and the chuck uses a clamp to fix the object to be tested, or uses vacuum to adsorb the wafer.

[0004] However, the protection level constructed by the existing probe station during the transmission of the wafer is relatively small, which makes it difficult to effectively ensure the accuracy of the path during the wafer transmission process. At the same time, it is not conducive to maintaining the real-time transmission of the probe station. For this reason, we propose a high-precision visual wafer identification probe station. Summary of the invention

[0005] The object of the present invention is to provide a high-precision visual wafer recognition probe station to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-precision visual wafer identification probe station, comprising a driving structure, a probe card alignment structure, a wafer three-level protection component and a ceramic arm component, wherein the driving structure pulls the protective suction cup on the top thereof to move in the X-axis and Y-axis directions;

[0007] The probe card needle alignment structure includes an obtuse-angled plate fixed on the top of the driving structure. The obtuse-angled plate is a bent plate with an obtuse angle. A telescopic cylinder is fixed through an oblique side plate of the obtuse-angled plate. The telescopic end of the telescopic cylinder is detachably connected to the needle alignment platform. When the telescopic cylinder is started, the telescopic end is driven to move, and the needle alignment platform is further pulled to move on a straight path. A needle alignment hole is opened through the top of the needle alignment platform. The movement of the needle alignment platform makes the needle alignment hole close to the needle alignment camera.

[0008] The probe card alignment structure also includes an alignment camera and an alignment light source fixed on the top of the driving structure. The alignment light source can fill in the alignment camera with light and adjust the brightness of the field of view of the alignment camera.

[0009] The wafer three-level protection component can be detachably connected to the top of the support structure. The wafer three-level protection component includes a fragmentation goal bracket risk defense structure, an anti-sway loading platform and a wafer correction structure. By setting the wafer three-level protection component, multi-level protection can be provided for wafer detection. Among them, the fragmentation goal bracket risk defense structure can detect whether the wafer slides out of the ceramic arm assembly by detecting the installation state of the wafer when the wafer is located on the ceramic arm assembly. By improving the protection level of the wafer transmission process, the accuracy of wafer transmission is improved, and the monitoring of the wafer status is strengthened;

[0010] The steps for manually loading wafers onto a tray are as follows:

[0011] S1: First pull the tray out of its original position, place the wafer on the tray, and then reset it to its original position;

[0012] S2: The first infrared transmitter and the second infrared transmitter on the pallet emit infrared rays to sense the location of the pallet;

[0013] S3: If the position of the tray in step S is not reset to the specified position, and the first infrared transmitter and the second infrared transmitter do not detect relevant signal data, the first infrared transmitter and the second infrared transmitter send alarm prompt data information to the external control center;

[0014] S4: The external control center issues an alarm.

[0015] The fragmentation goal bracket risk defense structure alarms to prompt the wafer to slip out, and the fragmentation goal bracket risk defense structure senses the tray through the first infrared transmitter and the second infrared transmitter; the anti-sway loading platform includes a pneumatic locking mechanism and a wafer rack;

[0016] The wafer correction structure is used for rotation of wafer correction, and the wafer correction structure includes a vacuum tank, a second sensor and a wafer parking rack, a driver is fixed on the top of the support structure, and the second sensor is used for scanning the edge of the wafer;

[0017] The ceramic arm assembly is fixed on the top of the support structure, and the ceramic arm assembly takes and untakes the wafer;

[0018] The probe station also includes a column and a mounting platform. The top bearing of the mounting platform is connected with a chuck. The top of the mounting platform is fixed with a motor, and the motor drives the chuck to rotate.

[0019] As a further solution of the present invention: the bottom of the driving structure is fixed to the supporting structure, the driving structure includes a Y-axis driving structure and an X-axis driving structure, the top of the Y-axis driving structure is adapted to be connected to the X-axis driving structure, the Y-axis driving structure includes a Y-axis linear motor and a Y-axis lead screw, the Y-axis lead screw is symmetrically distributed on both sides of the Y-axis linear motor, the top of the Y-axis lead screw is movably connected with a first moving seat, the top of the first moving seat is fixed with a Y-axis moving plate, and the output end of the Y-axis linear motor is connected through the lead screw of the X-axis driving structure;

[0020] The X-axis driving structure includes an X-axis linear motor and an X-axis lead screw, which are symmetrically distributed on both sides of the Y-axis linear motor. The top of the X-axis lead screw is movably connected to a second moving seat, and the top of the second moving seat is fixed with an X-axis moving plate.

[0021] As a further solution of the present invention: the protective suction cup includes a top cover and a suction cup surface, and the interior of the suction cup surface forms a first adsorption area, a second adsorption area, a third adsorption area and a fourth adsorption area, which can realize a state in which multiple adsorption areas cooperate to adsorb the wafer, and can select the attraction strength suitable for the quality of the wafer according to the material and size of the wafer, thereby avoiding the risk of wafer breakage and saving wafer inspection costs.

[0022] As a further solution of the present invention: the first adsorption area, the second adsorption area, the third adsorption area and the fourth adsorption area are all annular adsorption areas; the annular adsorption area is conducive to uniform adsorption force on the wafer surface, and the top of the top cover is provided with a plurality of adsorption micropores arranged in a radial circular array, and the adsorption micropores can fix the position of the wafer under the action of atmospheric pressure.

[0023] As a further solution of the present invention: the probe station also includes a parameter detection component fixed on the top of the X-axis moving plate, the parameter detection component includes a cleaning table, a vacuum gauge and a pressure gauge, the top surface of the cleaning table is glued with a cleaning surface, the vacuum gauge detects the vacuum degree in the protective suction cup; the pressure gauge detects whether the pressure of the protective suction cup is higher than the ambient pressure, the ambient pressure is the standard atmospheric pressure of 101.325 kPa, by setting up the cleaning table, the probe can be cleaned to improve the detection accuracy, and by setting up the vacuum gauge and the pressure gauge, the air pressure of the protective suction cup can be monitored in time.

[0024] As a further solution of the present invention: the ceramic arm assembly includes a mounting plate, a connecting rod, an upper arm and a lower arm. The bottom of the mounting plate is fixed to the top of the support structure. The connecting rod is an L-shaped rod, which is fixed to the top of the mounting plate. The upper arm and the lower arm are stacked and clamped at one end of the connecting rod. The upper arm and the lower arm can load and unload wafers.

[0025] As a further solution of the present invention: vacuum adsorption grooves are respectively provided on the top of the upper arm and the lower arm, and a plurality of micro adsorption holes are provided through the inside of the vacuum adsorption grooves, so that the vacuum adsorption grooves can generate adsorption force on the surface of the wafer.

[0026] As a further solution of the present invention: the fragmentation goal bracket risk defense structure includes a limit frame fixed on the top of the supporting structure, one side of the limit frame is connected to a crossbeam by screws, one side of the crossbeam is fixed with a first infrared emitter, one side of the limit frame is fixed with a goal bracket, the goal bracket is an inverted U-shaped bracket, and the bottom of the goal bracket is fixed with a second infrared emitter. The first infrared emitter and the second infrared emitter send alarm prompt data information to the external control center, so that the external control center issues an alarm prompt, so as to timely detect and correct the loading accuracy of the wafer.

[0027] As a further solution of the present invention: the top screw of the crossbeam is fixed with an aiming path indicating structure, the aiming path indicating structure includes a connecting plate, one end of the connecting plate is integrally formed with an aiming circle facing the first infrared emitter, and the aiming path indicating structure can straightly detect the path of the infrared light emitted by the first infrared emitter through the aiming circle.

[0028] As a further solution of the present invention: the pneumatic locking mechanism includes a tray, the top of the tray is connected to the sheet rack, a pneumatic telescopic rod is fixed to the bottom of the tray, a first spur rack is fixed to the telescopic end of the pneumatic telescopic rod, the first spur rack is meshed with a gear, the gear is connected to the bottom bearing of the tray, a second spur rack is meshed with the other side of the gear relative to the side where the first spur rack is located, the first spur rack can be pulled to move by the pneumatic telescopic rod, the first spur rack pulls the gear to rotate, the rotation of the gear drives the second spur rack to move, and the second spur rack acts as a limit on the gear.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. The present invention can provide multi-level protection for wafer detection by setting up a three-level wafer protection component. Among them, the fragmentation goal bracket risk defense structure can detect the installation status of the wafer when the wafer is on the ceramic arm assembly, detect whether the wafer slips out of the ceramic arm assembly, and improve the protection energy level of the wafer transmission process. The accuracy of wafer transmission is improved, and the monitoring of the wafer status is strengthened, which is conducive to maintaining the real-time performance of wafer transmission.

[0031] 2. The present invention uses the first infrared transmitter and the second infrared transmitter to emit infrared rays to sense the position of the tray, and can timely detect whether the position of the tray is reset to the specified position during the wafer loading process, and send alarm prompt data information to the external control center through the first infrared transmitter and the second infrared transmitter, so that the external control center issues an alarm prompt, so as to timely detect and correct the loading accuracy of the wafer.

[0032] 3. The present invention locks the rotation angle of the wafer rack through a pneumatic locking mechanism, which can prevent the wafer on the wafer rack from shifting or shaking, thereby effectively reducing the breakage rate of the wafer.

[0033] 4. The present invention forms the first adsorption area, the second adsorption area, the third adsorption area and the fourth adsorption area inside the suction cup surface, so that multiple adsorption areas can cooperate to adsorb the wafer. The attraction strength suitable for the quality of the wafer can be selected according to the material and size of the wafer, thereby avoiding the risk of wafer breakage and saving wafer inspection costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a diagram of the installation structure of the protective suction cup of the present invention;

[0035] Figure 2 It is a structural diagram of the parameter detection component of the present invention;

[0036] Figure 3 It is the structural diagram of the X-axis linear motor of the present invention;

[0037] Figure 4 This is a diagram of the probe card alignment structure of the present invention;

[0038] Figure 5 This is a complete structural diagram of the protective suction cup of the present invention;

[0039] Figure 6 A top view of the suction cup surface of the present invention;

[0040] Figure 7 This is a connection structure diagram of the wafer three-level protection assembly of the present invention;

[0041] Figure 8 For the present invention Figure 7 Enlarged view of middle D;

[0042] Fig. 9 It is a structural diagram of the ceramic arm assembly of the present invention;

[0043] Fig.10 Bottom perspective structural diagram of the anti-sway loading platform of the present invention.

[0044] In the figure: 1. Support structure; 2. Y-axis linear motor; 201. Y-axis screw rod; 202. First moving seat; 203. Y-axis moving plate; 3. X-axis linear motor; 301. X-axis screw rod; 302. Second moving seat; 303. X-axis moving plate; 4. Probe card needle alignment structure; 401. Obtuse plate; 402. Telescopic cylinder; 403. Needle alignment positioning platform; 404. Needle alignment hole; 405. Needle alignment camera; 406. Needle alignment light source; 5. Parameter detection component; 501. Cleaning table; 502. Vacuum gauge; 503. Pressure gauge; 6. Protective suction cup; 601. First adsorption area; 602. Second adsorption area; 603. Third adsorption area; 604. Fourth adsorption area; 605. Top cover; 606. Suction cup surface; 607. Adsorption Microhole; 7. Mounting table; 8. Fragment goal bracket risk defense structure; 801. Limiting frame; 802. First infrared transmitter; 803. Goal bracket; 804. Connecting plate; 805. Aiming circle; 806. Crossbeam; 807. Second infrared transmitter; 9. Anti-sway loading platform; 901. Tray; 902. Gear; 903. Second spur rack; 904. First spur rack; 905. Pneumatic telescopic rod; 10. Wafer correction structure; 1001. Vacuum tank; 1002. Second sensor; 1003. Wafer parking rack; 1004. Driver; 11. Mounting plate; 12. Vacuum adsorption tank; 13. Upper arm; 14. Lower arm; 15. Connecting rod; 16. Column; 17. Chuck; 18. Sheet rack; 19. Motor. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Embodiment 1:

[0047] like Figure 1 The protective suction cup installation structure diagram of the present invention is shown, including a driving structure, a probe card needle alignment structure 4, a wafer three-level protection component and a ceramic arm component. The driving structure pulls the protective suction cup 6 on the top to move in the X-axis and Y-axis directions, so as to facilitate the adjustment of the position of the protective suction cup 6 on the top of the support structure 1;

[0048] The wafer three-level protection assembly is detachably connected to the top of the support structure 1, and the wafer three-level protection assembly includes a fragmentation goal bracket risk defense structure 8, an anti-sway loading platform 9 and a wafer correction structure 10;

[0049] The fragmentation goal bracket risk defense structure 8 can reduce the risk of wafer breakage by scanning the wafer loading positioning position; the anti-sway loading platform 9 can reduce the swing amplitude of the wafer by locking the positioning position of the wafer rack 18; the wafer correction structure 10 can correct the positioning position of the wafer by scanning the edge of the parked wafer;

[0050] By setting up a three-level wafer protection component, multi-level protection can be provided for wafer detection, wherein the fragmentation goal bracket risk defense structure 8 detects whether the wafer slides out of the ceramic arm assembly by detecting the installation status of the wafer when the wafer is located on the ceramic arm assembly, thereby improving the protection energy level of the wafer transmission process, improving the accuracy of wafer transmission, and strengthening the monitoring of the wafer status; the fragmentation goal bracket risk defense structure 8 alarms to prompt the wafer to slide out, and the fragmentation goal bracket risk defense structure 8 senses the tray 901 through the first infrared emitter 802 and the second infrared emitter 807; the anti-sway loading platform 9 includes a pneumatic locking mechanism and a wafer rack 18, and the wafer correction structure 10 is used for the rotation of the wafer correction.

[0051] like Figure 2 The figure shows the structure diagram of the parameter detection component of the present invention. The probe station also includes a parameter detection component 5 fixed on the top of the X-axis moving plate 303. The parameter detection component 5 includes a cleaning table 501, a vacuum gauge 502 and a pressure gauge 503. The top surface of the cleaning table 501 is glued with a cleaning surface. The vacuum gauge 502 detects the vacuum degree in the protective suction cup 6; the pressure gauge 503 detects whether the pressure of the protective suction cup 6 is higher than the ambient pressure. The ambient pressure is the standard atmospheric pressure of 101.325 kPa. By setting the cleaning table 501, the probe can be cleaned to improve the detection accuracy. By setting the vacuum gauge 502 and the pressure gauge 503, the air pressure of the protective suction cup 6 can be monitored in time.

[0052] like Figure 3 The figure shows the structure diagram of the X-axis linear motor of the present invention. The bottom of the driving structure is fixed to the supporting structure 1. The driving structure includes a Y-axis driving structure and an X-axis driving structure. The top of the Y-axis driving structure is adapted to connect the X-axis driving structure. The Y-axis driving structure includes a Y-axis linear motor 2 and a Y-axis lead screw 201. The output end of the Y-axis linear motor 2 is connected to the Y-axis lead screw 201, and the output end of the Y-axis linear motor 2 drives the Y-axis lead screw 201 to rotate. The Y-axis lead screw 201 is symmetrically distributed on both sides of the Y-axis linear motor 2, which is conducive to maintaining the stability of the movement of the first moving seat 202. The top of the Y-axis lead screw 201 is movably connected with the first moving seat 202, and the top of the first moving seat 202 is fixed with a Y-axis moving plate 203. The output end of the Y-axis linear motor 2 is connected with the lead screw of the X-axis driving structure, and the input end of the Y-axis linear motor 2 is electrically connected to an external power supply.

[0053] The X-axis driving structure includes an X-axis linear motor 3 and an X-axis lead screw 301. The input end of the X-axis linear motor 3 is electrically connected to an external power supply. The output end of the X-axis linear motor 3 is connected to one end of the X-axis lead screw 301 and drives the X-axis lead screw 301 to rotate. The X-axis lead screw 301 is symmetrically distributed on both sides of the Y-axis linear motor 2 to maintain the reliability of the movement of the second movable seat 302. The top of the X-axis lead screw 301 is movably connected to the second movable seat 302, and the top of the second movable seat 302 is fixed with an X-axis movable plate 303.

[0054] like Figure 4 The diagram shows the needle alignment structure of the probe card of the present invention. The probe card needle alignment structure 4 includes an obtuse plate 401 fixed on the top of the driving structure. The angle of the bending part of the obtuse plate 401 is 120°-150°. The obtuse plate 401 is a bent plate with an obtuse angle. A telescopic cylinder 402 is fixed on an inclined side plate of the obtuse plate 401. The telescopic end of the telescopic cylinder 402 is detachably connected to the needle alignment positioning platform 403. When the telescopic cylinder 402 is started, the telescopic end is driven to move, and the needle alignment positioning platform 403 is further pulled to move on a straight path. A needle alignment hole 404 is opened on the top of the needle alignment positioning platform 403. The movement of the needle alignment positioning platform 403 makes the needle alignment hole 404 close to the needle alignment camera 405. The probe card needle alignment structure 4 also includes a needle alignment camera 405 and a needle alignment light source 406 fixed on the top of the driving structure. The needle alignment light source 406 can fill in the light for the needle alignment camera 405 and adjust the brightness of the field of view of the needle alignment camera 405.

[0055] like Figure 5 The figure shows the complete structure of the protective suction cup of the present invention. The protective suction cup 6 includes a top cover 605 and a suction cup surface 606. The interior of the suction cup surface 606 forms a first adsorption area 601, a second adsorption area 602, a third adsorption area 603 and a fourth adsorption area 604, which can realize a state in which multiple adsorption areas cooperate to adsorb the wafer. The attraction strength suitable for the wafer quality can be selected according to the material and size of the wafer, thereby avoiding the risk of wafer breakage and saving wafer detection costs.

[0056] like Figure 6 The figure shows a top view of the suction cup surface of the present invention, wherein the first adsorption area 601, the second adsorption area 602, the third adsorption area 603 and the fourth adsorption area 604 are all annular adsorption areas; the annular adsorption areas are conducive to uniform adsorption force on the surface of the wafer, and the top of the top cover 605 is provided with a plurality of adsorption micropores 607 arranged in a radial circular array, and the adsorption micropores 607 can fix the position of the wafer under the action of atmospheric pressure.

[0057] like Figure 7The figure shows the connection structure diagram of the wafer three-level protection component of the present invention, the wafer correction structure 10 includes a vacuum groove 1001, a second sensor 1002 and a wafer parking rack 1003, a driver 1004 is fixed on the top of the support structure 1, and a plurality of circular grooves are provided on the top of the wafer parking rack 1003 for parking the wafer, the driver 1004 drives the second sensor 1002 to start the correction, and the second sensor 1002 is an infrared sensor; the ceramic arm assembly is fixed on the top of the support structure 1, and the ceramic arm assembly takes and untakes the wafer; the probe station also includes a column 16 and a mounting table 7, the top bearing of the mounting table 7 is connected to a chuck 17, and a motor 19 is fixed on the top of the mounting table 7, and the motor 19 drives the chuck 17 to rotate.

[0058] like Figure 8 The present invention is shown Figure 7 In the enlarged view of D in the middle, the fragment goal bracket risk defense structure 8 includes a limit frame 801 fixed on the top of the support structure 1, one side of the limit frame 801 is screwed with a crossbeam 806, one side of the crossbeam 806 is fixed with a first infrared transmitter 802, one side of the limit frame 801 is fixed with a goal bracket 803, the goal bracket 803 is an inverted U-shaped bracket, and the bottom of the goal bracket 803 is fixed with a second infrared transmitter 807, the first infrared transmitter 802 and the second infrared transmitter 807 send alarm prompt data information to the external control center, so that the external control center sends an alarm prompt, so as to detect and correct the loading accuracy of the wafer in time;

[0059] The top screw of the crossbeam 806 is fixed with an aiming path indication structure, which includes a connecting piece 804, and one end of the connecting piece 804 is integrally formed with an aiming circle 805 facing the first infrared emitter 802. The aiming path indication structure can straightly detect the path of the infrared light emitted by the first infrared emitter 802 through the aiming circle 805.

[0060] like Fig. 9 The figure shows the structure diagram of the ceramic arm assembly of the present invention, the ceramic arm assembly includes a mounting plate 11, a connecting rod 15, an upper arm 13 and a lower arm 14, the bottom of the mounting plate 11 is fixed to the top of the support structure 1, the connecting rod 15 is an L-shaped rod, the connecting rod 15 is fixed to the top of the mounting plate 11, the upper arm 13 and the lower arm 14 are stacked and clamped at one end of the connecting rod 15, the upper arm 13 and the lower arm 14 can load and unload wafers; vacuum adsorption grooves 12 are respectively provided on the tops of the upper arm 13 and the lower arm 14, and a plurality of micro adsorption holes are provided inside the vacuum adsorption grooves 12, and the vacuum adsorption grooves 12 can generate adsorption force on the surface of the wafer.

[0061] like Fig.10The bottom perspective structure diagram of the anti-sway loading platform of the present invention is shown, and the pneumatic locking mechanism includes a tray 901. The top of the tray 901 is connected to the sheet rack 18, and a pneumatic telescopic rod 905 is fixed to the bottom of the tray 901. The telescopic end of the pneumatic telescopic rod 905 is fixed to a first spur rack 904, and the first spur rack 904 is meshed with a gear 902. The gear 902 is connected to the bottom bearing of the tray 901, and the gear 902 is meshed with a second spur rack 903 on the other side of the side where the first spur rack 904 is located. The pneumatic telescopic rod 905 can pull the first spur rack 904 to move, and the first spur rack 904 pulls the gear 902 to rotate. The rotation of the gear 902 drives the second spur rack 903 to move, and the second spur rack 903 acts as a limit for the gear 902.

[0062] The steps for manually loading wafers onto tray 901 are as follows:

[0063] S1: first pull the tray 901 out of the original position, place the wafer on the tray 901, and then reset it to the original position;

[0064] S2: The first infrared transmitter 802 and the second infrared transmitter 807 on the tray 901 transmit infrared rays to sense the location of the tray 901;

[0065] S3: If the position of the tray 901 in step S2 is not reset to the designated position, and the first infrared transmitter 802 and the second infrared transmitter 807 do not detect relevant signal data, the first infrared transmitter 802 and the second infrared transmitter 807 send alarm prompt data information to the external control center;

[0066] S4: The external control center issues an alarm.

[0067] By setting up a three-level wafer protection component, multi-level protection can be provided for wafer detection;

[0068] Among them, the fragmentation goal bracket risk defense structure 8 can detect the installation state of the wafer when the wafer is located on the ceramic arm assembly, detect whether the wafer slides out of the ceramic arm assembly, improve the protection level of the wafer transmission process, improve the accuracy of wafer transmission, and strengthen the monitoring of the wafer status;

[0069] The first infrared transmitter 802 and the second infrared transmitter 807 emit infrared rays to sense the position of the tray 901, and can timely detect whether the position of the tray 901 is reset to the specified position during the wafer loading process, and send alarm prompt data information to the external control center through the first infrared transmitter 802 and the second infrared transmitter 807, so that the external control center issues an alarm prompt, so as to timely detect and correct the loading accuracy of the wafers, and lock the rotation angle of the wafer rack 18 through the pneumatic locking mechanism, so as to prevent the wafers on the wafer rack 18 from shifting or shaking, thereby effectively reducing the breakage rate of the wafers;

[0070] The wafer correction structure 10 absorbs and parks the wafer through the vacuum groove 1001, the wafer parking rack 1003 can park a number of wafers, and the second sensor 1002 can scan the edge of the wafer and locate the wafer parking position.

[0071] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0072] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision visual wafer identification probe station, characterized in that: include: A driving structure, wherein the driving structure pulls the protective suction cup on the top thereof to move in the X-axis and Y-axis directions; The probe card needle alignment structure comprises an obtuse-angle plate fixed on the top of the driving structure, a telescopic cylinder is fixed through an oblique side plate of the obtuse-angle plate, the telescopic end of the telescopic cylinder is detachably connected to the needle alignment platform, and a needle alignment hole is opened through the top of the needle alignment platform; The probe card alignment structure also includes an alignment camera and an alignment light source fixed on the top of the driving structure; The wafer three-level protection component is detachably connected to the top of the support structure. The wafer three-level protection component includes a fragmentation goal bracket risk defense structure, an anti-sway loading platform and a wafer correction structure; The risk defense structure of the fragmentation goal support alarms to prompt the wafer to slip out; the anti-sway loading platform includes a pneumatic locking mechanism and a wafer rack; the wafer correction structure is used for the rotation of the wafer correction, and the wafer correction structure includes a vacuum tank, a second sensor and a wafer parking rack, and a driver is fixed on the top of the support structure; A ceramic arm assembly is fixed on the top of the support structure, and the ceramic arm assembly is used to take and unload the wafer; The probe station also includes a column and a mounting platform. The top bearing of the mounting platform is connected with a chuck. The top of the mounting platform is fixed with a motor, and the motor drives the chuck to rotate.

2. A high-precision visual wafer identification probe station according to claim 1, characterized in that: The bottom of the driving structure is fixed to the supporting structure, the driving structure includes a Y-axis driving structure and an X-axis driving structure, the top of the Y-axis driving structure is adapted to connect the X-axis driving structure, the Y-axis driving structure includes a Y-axis linear motor and a Y-axis lead screw, the Y-axis lead screw is symmetrically distributed on both sides of the Y-axis linear motor, the top of the Y-axis lead screw is movably connected with a first moving seat, the top of the first moving seat is fixed with a Y-axis moving plate, and the output end of the Y-axis linear motor is connected through the lead screw of the X-axis driving structure; The X-axis driving structure includes an X-axis linear motor and an X-axis lead screw, which are symmetrically distributed on both sides of the Y-axis linear motor. The top of the X-axis lead screw is movably connected to a second moving seat, and the top of the second moving seat is fixed with an X-axis moving plate.

3. A high-precision visual wafer recognition probe station according to claim 2, characterized in that: The protective suction cup comprises a top cover and a suction cup surface, and the interior of the suction cup surface forms a first adsorption area, a second adsorption area, a third adsorption area and a fourth adsorption area.

4. A high-precision visual wafer recognition probe station according to claim 3, characterized in that: The first adsorption area, the second adsorption area, the third adsorption area and the fourth adsorption area are all annular adsorption areas; the top of the top cover is provided with a plurality of adsorption micropores arranged in a radial circular array.

5. The high-precision visual wafer recognition probe station according to claim 1, characterized in that: The probe station also includes a parameter detection component fixed on the top of the X-axis moving plate, the parameter detection component includes a cleaning table, a vacuum gauge and a pressure gauge. The top surface of the cleaning table is glued with a cleaning surface. The vacuum gauge detects the vacuum degree in the protective suction cup; the pressure gauge detects whether the pressure of the protective suction cup is higher than the ambient pressure.

6. A high-precision visual wafer recognition probe station according to claim 1, characterized in that: The ceramic arm assembly includes a mounting plate, a connecting rod, an upper arm and a lower arm. The bottom of the mounting plate is fixed to the top of the supporting structure. The connecting rod is an L-shaped rod, which is fixed to the top of the mounting plate. The upper arm and the lower arm are stacked and clamped at one end of the connecting rod.

7. A high-precision visual wafer recognition probe station according to claim 6, characterized in that: The tops of the upper arm and the lower arm are respectively provided with vacuum adsorption grooves, and a plurality of micro adsorption holes are penetrated through the inside of the vacuum adsorption grooves.

8. The high-precision visual wafer recognition probe station according to claim 7, characterized in that: The fragment goal bracket risk defense structure includes a limit frame fixed on the top of the supporting structure, one side of the limit frame is connected to a crossbeam by screws, one side of the crossbeam is fixed with a first infrared transmitter, one side of the limit frame is fixed with a goal bracket, and the bottom of the goal bracket is fixed with a second infrared transmitter.

9. A high-precision visual wafer recognition probe station according to claim 8, characterized in that: The top screw of the crossbeam is fixed with an aiming path indicating structure, which comprises a connecting piece, and one end of the connecting piece is integrally formed with an aiming circle facing the first infrared emitter.

10. A high-precision visual wafer recognition probe station according to claim 9, characterized in that: The pneumatic locking mechanism includes a tray, the top of the tray is connected to the sheet frame, a pneumatic telescopic rod is fixed to the bottom of the tray, a first spur rack is fixed to the telescopic end of the pneumatic telescopic rod, the first spur rack is meshed with a gear, the gear is connected to the bottom bearing of the tray, and a second spur rack is meshed on the other side of the gear relative to the side where the first spur rack is located.

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