A semiconductor packaging fixture calibration device

Abstract

The present invention relates to the field of semiconductor technology, and in particular to a semiconductor packaging jig calibration device. The technical problems are as follows: the part of the semiconductor jig whose size exceeds the error range needs to be manually adjusted and calibrated, the efficiency of manual measurement and inspection is low, and the accuracy is low during the manual cutting and grinding adjustment of the jig, and repeated calibration takes a long time. The technical solution is as follows: A semiconductor packaging jig calibration device includes a first mounting frame and a calibration measuring device, the calibration measuring device is installed on the upper part of the first mounting frame; and also includes: a first machine tool, the first machine tool is installed in the middle of the first mounting frame, and the first machine tool is located in the scanning measurement area below the calibration measuring device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor packaging fixture calibration device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0003] During the semiconductor packaging process, semiconductor jigs are required to assist in packaging. In the prior art, after the initial processing of semiconductor graphite jigs is completed, they need to be manually measured and inspected to measure the dimensions of each position. The parts whose dimensions exceed the error range need to be manually adjusted and calibrated. The efficiency of manual measurement and inspection is low, and the accuracy is low during the manual cutting, grinding and adjustment of the jig, and repeated calibration takes a long time. Summary of the invention

[0004] The present invention proposes a semiconductor packaging jig calibration device, which solves the problems in the prior art that the part of the semiconductor jig whose size exceeds the error range needs to be manually adjusted and calibrated, the efficiency of manual measurement and inspection is low, and the accuracy is low during the manual cutting and grinding adjustment of the jig, and repeated calibration takes a long time.

[0005] The technical solution of the present invention is as follows:

[0006] A semiconductor packaging jig calibration device comprises a first mounting frame and a calibration measuring device, wherein the calibration measuring device is mounted on an upper portion of the first mounting frame;

[0007] Also includes:

[0008] A first machine tool, the first machine tool is installed in the middle of the first mounting frame, and the first machine tool is located in a scanning measurement area below the calibration measuring device;

[0009] A first telescopic driving member, wherein two first telescopic driving members are provided, and the two first telescopic driving members are symmetrically installed on both sides of the first machine tool;

[0010] A first clamping bar, wherein two first clamping bars are provided, and the two first clamping bars are respectively installed at the telescopic ends of the two first telescopic driving members;

[0011] A cutting adjustment component is installed on the first machine tool and is used to adjust and calibrate a fixture with unqualified dimensions.

[0012] As a further technical solution, the cutting adjustment assembly includes:

[0013] A first slide rail, wherein two first slide rails are provided, the two first slide rails are installed on the first machine tool through a bracket, and the two first slide rails are symmetrically arranged;

[0014] A second slide rail, two ends of which are slidably mounted on the two first slide rails through two electric slide seats respectively;

[0015] a first sliding mounting platform, wherein the first sliding mounting platform is slidably disposed on the second sliding rail;

[0016] A first lifting drive member, wherein the first lifting drive member is installed at the bottom of the first sliding mounting platform;

[0017] A cutting tool head is installed at the bottom of the lifting end of the first lifting drive member.

[0018] As a further technical solution, it also includes a dust suction cleaning component, which includes a roller conveyor belt and a dust collector. The roller conveyor belt is installed on one side of the first machine tool, and a plurality of equally spaced conveying rollers are provided on the roller conveyor belt. Two dust collectors are provided, and the two dust collectors are respectively located above and below the roller conveyor belt. The two dust collectors are symmetrically arranged, and the two dust collectors are respectively installed on the first mounting frame through brackets, and the dust suction ports of the two dust collectors are both facing the direction of the roller conveyor belt.

[0019] As a further technical solution, it also includes a pushing component, which includes a second mounting frame, a second telescopic driving member and a pushing plate, the top of the second mounting frame is fixed to the first mounting frame, the second telescopic driving member is installed on the bottom of the second mounting frame, the bottom of the pushing plate slides in contact with the upper surface of the first machine tool, and the pushing plate is connected to the telescopic end of the second telescopic driving member.

[0020] As a further technical solution, a surface cleaning mechanism is also included, and the surface cleaning mechanism includes:

[0021] A second lifting drive member, wherein a fixed end of the second lifting drive member is mounted on the first mounting frame through a bracket;

[0022] An elastic cleaning block, wherein two elastic cleaning blocks are provided, a first elastic cleaning block is installed at the lifting end of the second lifting drive member, and a second elastic cleaning block is located below the first elastic cleaning block, and the second elastic cleaning block is installed on the first mounting frame through a bracket;

[0023] The third mounting frame is provided with two symmetrical groups, and two first winding rollers are rotatably installed on each group of the third mounting frames, and a roll of first cleaning absorbent cloth is wound around the surface of each of the two first winding rollers on one group of the third mounting frames, and the surfaces of the two first winding rollers on the other group of the third mounting frames are wound around the second ends of the two rolls of the first cleaning absorbent cloth, and the two first cleaning absorbent cloths are located in parallel between the two elastic cleaning blocks.

[0024] As a further technical solution, in the first embodiment, the first elastic cleaning block is installed on the lifting end of the second lifting drive member through an electric rotating shaft seat.

[0025] As a further technical solution, an inner tank cleaning mechanism is also included, and the inner tank cleaning mechanism includes:

[0026] A second machine tool, the bottom of which is fixed on a working plane via a support frame, and a rectangular groove is formed on the top of the second machine tool;

[0027] a third telescopic driving member, wherein two third telescopic driving members are provided, and the two third telescopic driving members are symmetrically installed on both sides of the second machine tool;

[0028] A second clamping bar, wherein two second clamping bars are provided, and the two second clamping bars are respectively installed at the telescopic ends of the two third telescopic driving members;

[0029] A third slide rail, two of which are provided, and the two third slide rails are mounted on the second machine tool through a bracket;

[0030] A scraping and cleaning assembly, the scraping and cleaning assembly is installed on the second machine tool, and two symmetrical scraping and cleaning assemblies are provided, and the two scraping and cleaning assemblies slide on the third slide rail;

[0031] An edge blocking assembly, wherein two edge blocking assemblies are symmetrically arranged, and the two edge blocking assemblies are symmetrically installed on the second machine tool.

[0032] As a further technical solution, the scraping and cleaning assembly includes:

[0033] A second sliding mounting platform, wherein the second sliding mounting platform is slidably mounted on the two third slide rails;

[0034] A third lifting drive member, wherein two third lifting drive members are provided, and the two third lifting drive members are installed at the bottom of the second sliding mounting platform;

[0035] A seventh mounting frame, the seventh mounting frame being mounted on the lifting ends of the two third lifting driving members;

[0036] A fourth mounting frame, the fourth mounting frame is T-shaped and is fixedly connected to the bottom of the seventh mounting frame;

[0037] A mounting vertical rod, wherein two mounting vertical rods are provided, and the two mounting vertical rods are fixedly connected to two sides of the fourth mounting frame;

[0038] A rotating shaft rod, one of which is installed at the middle and lower part of each of the vertical mounting rods;

[0039] A cleaning plate, both sides of which are rotatably mounted on the two rotating shafts;

[0040] a fourth telescopic driving member, wherein a fixed end of the fourth telescopic driving member is hinged to the fourth mounting frame, and a telescopic end of the fourth telescopic driving member is hinged to an upper portion of the cleaning plate;

[0041] A fifth mounting frame, wherein two fifth mounting frames are provided, and the two fifth mounting frames are respectively fixed to the bottoms of the two mounting vertical rods;

[0042] An elliptical cylinder, one of the elliptical cylinders is fixedly connected to each of the fifth mounting frames.

[0043] As a further technical solution, the scraping and cleaning assembly further includes:

[0044] A mounting side plate, wherein two mounting side plates are provided, and the two mounting side plates are symmetrically fixed to two ends of the seventh mounting frame;

[0045] A second winding roller, wherein two second winding rollers are provided, and both of the two second winding rollers are rotatably mounted between the two mounting side plates;

[0046] A second cleaning absorbent cloth, a first second winding roller is wound with a roll of the second cleaning absorbent cloth, and a second end of the second cleaning absorbent cloth is wound around the bottom of the cleaning plate and upwardly wound on another second winding roller.

[0047] As a further technical solution, the edge blocking component includes:

[0048] A fourth lifting drive member, wherein two fourth lifting drive members are provided, and the two fourth lifting drive members are installed on the second machine tool;

[0049] An installation upper plate, wherein the installation upper plate is installed at the lifting ends of the two fourth lifting driving members;

[0050] A strip plate, the strip plate is fixed to the middle part of the mounting upper plate through a bracket;

[0051] An extrusion block, wherein the extrusion block is in the shape of a triangular prism, the oblique side of the extrusion block faces a side away from the strip plate, and the extrusion block is elastic;

[0052] A push bar, wherein a notch is formed on the lower side of the strip plate, and the push bar is accommodated in the notch;

[0053] Insertion rods, two of which are provided, the two insertion rods are slidably arranged in the strip plate, and the push bar connects the first ends of the two insertion rods;

[0054] A mounting bar, the mounting bar being fixedly connected to the second ends of the two insertion rods;

[0055] An elastic member, two ends of which are respectively connected to the strip plate and the mounting strip;

[0056] A sixth mounting frame, wherein two sixth mounting frames are provided, and the two sixth mounting frames are symmetrically fixed to the upper parts of both ends of the mounting bar;

[0057] Convex ball, two of the convex balls are provided, and one of the convex balls is fixedly connected to the upper part of each of the sixth mounting frames.

[0058] The beneficial effects of the present invention are as follows: the calibration measuring device measures the overall size of the semiconductor graphite fixture and the slot size on its upper side by laser. If the size is within the allowable error range, it is qualified; if it exceeds the allowable error range, it is unqualified. At this time, the calibration measuring device sends a signal according to the measured difference to control the cutting adjustment component to perform cutting adjustment calibration on the corresponding position of the graphite fixture, thereby realizing automatic measurement and automatic adjustment calibration of the semiconductor graphite fixture, ensuring the qualified rate of production, eliminating the steps of manual measurement and cutting adjustment, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0060] Figure 1 It is a schematic diagram of the structure of the semiconductor packaging fixture calibration equipment of the present invention;

[0061] Figure 2 It is a schematic diagram of the structure of the first machine tool part in the present invention;

[0062] Figure 3 It is a schematic diagram of a first partial structure of the semiconductor packaging jig calibration device of the present invention;

[0063] Figure 4 It is a schematic diagram of a second partial structure of the semiconductor packaging jig calibration device of the present invention;

[0064] Figure 5It is a schematic diagram of the third partial structure of the semiconductor packaging jig calibration device of the present invention;

[0065] Figure 6 This is a schematic diagram of the first structure of the inner tank cleaning mechanism of the present invention;

[0066] Figure 7 It is a second structural schematic diagram of the inner tank cleaning mechanism in the present invention;

[0067] Figure 8 This is a schematic diagram of the first structure of the scraping and cleaning component of the present invention;

[0068] Fig. 9 This is a second structural schematic diagram of the scraping and cleaning component of the present invention;

[0069] Fig.10 This is a schematic diagram of the first structure of the edge blocking component in the present invention;

[0070] Fig.11 It is a schematic diagram of the second structure of the edge blocking component in the present invention;

[0071] In the figure: 1, first mounting frame; 2, calibration measuring device; 3, first machine tool; 4, first telescopic drive member; 5, first clamping strip; 6, first slide rail; 7, second slide rail; 8, first sliding mounting platform; 9, first lifting drive member; 10, cutting tool head; 11, second mounting frame; 12, second telescopic drive member; 13, push plate; 14, roller conveyor belt; 15, vacuum cleaner; 16, second lifting drive member; 17, elastic cleaning block; 18, third mounting frame; 19, first winding roller; 20, first cleaning adsorption cloth; 21, electric rotating shaft seat; 22, second machine tool; 23, third telescopic drive member; 2 4. Second clamping strip; 25. Third slide rail; 26. Second sliding mounting platform; 27. Third lifting drive member; 28. Seventh mounting frame; 29. ​​Fourth mounting frame; 30. Installing vertical rod; 31. Rotating shaft rod; 32. Cleaning plate; 33. Fourth telescopic drive member; 34. Fifth mounting frame; 35. Elliptical cylinder; 36. Installing side plate; 37. Second winding roller; 38. Second cleaning adsorption cloth; 39. Fourth lifting drive member; 40. Installing upper plate; 41. Strip plate; 42. Extrusion block; 43. Insertion rod; 44. Installing strip; 45. Elastic member; 46. Sixth mounting frame; 47. Convex ball; 48. Pushing strip. DETAILED DESCRIPTION

[0072] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0073] Example 1

[0074] like Figure 1-5 As shown, this embodiment provides a semiconductor packaging fixture calibration device, including a first mounting frame 1 and a calibration measuring device 2, wherein the calibration measuring device 2 is mounted on the upper portion of the first mounting frame 1;

[0075] Also includes:

[0076] A first machine tool 3, wherein the first machine tool 3 is installed in the middle of the first mounting frame 1, and the first machine tool 3 is located in a scanning measurement area below the calibration measuring device 2;

[0077] A first telescopic driving member 4, wherein two first telescopic driving members 4 are provided, and the two first telescopic driving members 4 are symmetrically installed on both sides of the first machine tool 3;

[0078] A first clamping bar 5, wherein two first clamping bars 5 are provided, and the two first clamping bars 5 are respectively installed at the telescopic ends of the two first telescopic driving members 4;

[0079] A cutting adjustment component is installed on the first machine tool 3 and is used to adjust and calibrate a fixture with unqualified dimensions.

[0080] In this embodiment, when using the semiconductor packaging jig calibration equipment, the semiconductor graphite jig that has been preliminarily processed is first placed in the measuring area on the top of the first machine tool 3, and then the two first telescopic driving members 4 are extended to drive the two first clamping bars 5 to clamp and fix the two sides of the semiconductor graphite jig, and then the calibration measuring device 2 uses a laser to measure the overall size of the semiconductor graphite jig and the slot size on its upper side. If the size is within the allowable error range, it is qualified, and if it exceeds the allowable error range, it is unqualified. At this time, the calibration measuring device 2 sends a signal based on the measured difference to control the cutting adjustment component to perform cutting adjustment and calibration on the corresponding position of the graphite jig, thereby realizing automatic measurement and automatic adjustment and calibration of the semiconductor graphite jig, ensuring the production qualification rate, eliminating the steps of manual measurement and cutting adjustment, and improving production efficiency.

[0081] The cutting adjustment assembly comprises:

[0082] A first slide rail 6, wherein two first slide rails 6 are provided, and the two first slide rails 6 are installed on the first machine tool 3 through a bracket, and the two first slide rails 6 are symmetrically arranged;

[0083] A second slide rail 7, both ends of which are slidably mounted on the two first slide rails 6 via two electric slide seats;

[0084] A first sliding mounting platform 8, wherein the first sliding mounting platform 8 is slidably disposed on the second slide rail 7;

[0085] a first lifting drive member 9, wherein the first lifting drive member 9 is installed at the bottom of the first sliding mounting platform 8;

[0086] The cutting tool head 10 is installed at the bottom of the lifting end of the first lifting drive member 9.

[0087] After the calibration measuring device 2 completes the measurement of the semiconductor graphite fixture, the controller adjusts the position of the second slide rail 7 according to the measurement data signal, and the first sliding mounting platform 8 on the second slide rail 7 also slides to adjust the position, driving the cutting head 10 to move above the specified position, and then the first lifting drive member 9 drives the cutting head 10 to move downward, and the cutting head 10 can perform cutting and other operations on the specified position to adjust its size to achieve the calibration effect.

[0088] The cutting head 10 can perform cutting, grinding, cutting and the like operations.

[0089] Example 2

[0090] On the basis of the first specific implementation method, Figure 1-5 As shown, it also includes a dust suction cleaning component, which includes a roller conveyor belt 14 and a dust collector 15. The roller conveyor belt 14 is installed on one side of the first machine tool 3. The roller conveyor belt 14 is provided with a plurality of equally spaced conveying rollers. Two dust collectors 15 are provided. The two dust collectors 15 are respectively located above and below the roller conveyor belt 14. The two dust collectors 15 are symmetrically arranged. The two dust collectors 15 are respectively installed on the first mounting frame 1 through brackets, and the dust suction ports of the two dust collectors 15 are both facing the direction of the roller conveyor belt 14.

[0091] It also includes a pushing component, which includes a second mounting frame 11, a second telescopic driving member 12 and a pushing plate 13. The top of the second mounting frame 11 is fixedly connected to the first mounting frame 1, and the second telescopic driving member 12 is installed at the bottom of the second mounting frame 11. The bottom of the pushing plate 13 slides in contact with the upper surface of the first machine tool 3, and the pushing plate 13 is connected to the telescopic end of the second telescopic driving member 12.

[0092] In this embodiment, after the semiconductor graphite jig is calibrated, a large amount of granular impurities and other impurities remain on its surface. Then the first clamping bar 5 releases the clamping, and then the second telescopic driving member 12 is controlled to extend to drive the push plate 13 to move, so that the push plate 13 pushes the semiconductor graphite jig to move onto the roller conveyor belt 14, and then the roller drives the semiconductor graphite jig to move slowly. At the same time, the two vacuum cleaners 15 on the upper and lower sides respectively attract and separate the impurities on the upper and lower sides of the semiconductor graphite jig, thereby achieving the effect of automatically cleaning the granular impurities.

[0093] Example 3

[0094] On the basis of the second specific implementation method, Figure 1-5 As shown, it also includes a surface cleaning mechanism, and the surface cleaning mechanism includes:

[0095] A second lifting drive member 16, wherein a fixed end of the second lifting drive member 16 is mounted on the first mounting frame 1 through a bracket;

[0096] An elastic cleaning block 17, wherein two elastic cleaning blocks 17 are provided, wherein the first elastic cleaning block 17 is installed at the lifting end of the second lifting drive member 16, and the second elastic cleaning block 17 is located below the first elastic cleaning block 17, and the second elastic cleaning block 17 is installed on the first mounting frame 1 through a bracket;

[0097] The third mounting frame 18 is provided with two symmetrical groups, and two first winding rollers 19 are rotatably installed on each group of the third mounting frames 18, and a roll of first cleaning absorbent cloth 20 is wound around the surface of each of the two first winding rollers 19 on one group of the third mounting frames 18, and the surfaces of the two first winding rollers 19 on the other group of the third mounting frames 18 are wound around the second ends of the two rolls of the first cleaning absorbent cloth 20, and the two first cleaning absorbent cloths 20 are located in parallel between the two elastic cleaning blocks 17.

[0098] The first elastic cleaning block 17 is installed on the lifting end of the second lifting driving member 16 through the electric rotating shaft seat 21.

[0099] After the vacuum cleaner 15 is used to clean, there are still other impurities with certain adhesion on the surface of the semiconductor graphite fixture. In the prior art, manual cleaning is required, which is inefficient.

[0100] In this embodiment, the semiconductor graphite jig after being cleaned by the vacuum cleaner 15 is placed on the surface of the first cleaning adsorption cloth 20 above the elastic cleaning block 17 on the lower side, and then the second lifting drive member 16 drives the elastic cleaning block 17 to move downward, and presses the first cleaning adsorption cloth 20 on the upper side down to the upper surface of the semiconductor graphite jig, so that the two elastic cleaning blocks 17 squeeze and wrap the semiconductor graphite jig between them, and then control the electric rotating shaft seat 21 to drive the upper elastic cleaning block 17 to twist, and then the two elastic cleaning blocks 17 squeeze and fit the first cleaning adsorption cloths 20 on the upper and lower sides to the surface of the semiconductor graphite jig. During the twisting process, the first cleaning adsorption cloths 20 on the upper and lower sides will separate the sticky impurities on the surface of the semiconductor graphite jig by friction and transfer them to the first cleaning adsorption cloths 20, thereby cleaning the surface of the semiconductor graphite jig.

[0101] After a single use, the first clean absorbent cloth 20 with impurities attached can be wound up by rotating the four first winding rollers 19, and the clean first clean absorbent cloth 20 moves between the two elastic cleaning blocks 17 to complete the replacement of the first clean absorbent cloth 20.

[0102] Example 4

[0103] On the basis of the third specific implementation method, Figure 1-11 As shown, it also includes an inner tank cleaning mechanism, and the inner tank cleaning mechanism includes:

[0104] A second machine tool 22, the bottom of which is fixed on the working plane through a support frame, and a rectangular groove is formed on the top of the second machine tool 22;

[0105] A third telescopic driving member 23, wherein two third telescopic driving members 23 are provided, and the two third telescopic driving members 23 are symmetrically installed on both sides of the second machine tool 22;

[0106] A second clamping bar 24, wherein two second clamping bars 24 are provided, and the two second clamping bars 24 are respectively installed at the telescopic ends of the two third telescopic driving members 23;

[0107] A third slide rail 25, wherein two third slide rails 25 are provided, and the two third slide rails 25 are mounted on the second machine tool 22 through a bracket;

[0108] A scraping and cleaning assembly, the scraping and cleaning assembly is installed on the second machine tool 22, and two symmetrical scraping and cleaning assemblies are provided, and the two scraping and cleaning assemblies slide on the third slide rail 25;

[0109] The edge blocking assembly includes two symmetrical edge blocking assemblies, and the two edge blocking assemblies are symmetrically mounted on the second machine tool 22 .

[0110] The scraping and cleaning assembly comprises:

[0111] A second sliding mounting platform 26, wherein the second sliding mounting platform 26 is slidably mounted on the two third slide rails 25;

[0112] A third lifting drive member 27, wherein two third lifting drive members 27 are provided, and the two third lifting drive members 27 are installed at the bottom of the second sliding mounting platform 26;

[0113] A seventh mounting frame 28, wherein the seventh mounting frame 28 is mounted on the lifting ends of the two third lifting driving members 27;

[0114] A fourth mounting frame 29, wherein the fourth mounting frame 29 is T-shaped and is fixedly connected to the bottom of the seventh mounting frame 28;

[0115] A mounting vertical rod 30, wherein two mounting vertical rods 30 are provided, and the two mounting vertical rods 30 are fixedly connected to two sides of the fourth mounting frame 29;

[0116] A rotating shaft rod 31, wherein a rotating shaft rod 31 is installed at the middle and lower part of each of the mounting vertical rods 30;

[0117] A cleaning plate 32, both sides of which are rotatably mounted on the two rotating shafts 31;

[0118] A fourth telescopic driving member 33, wherein a fixed end of the fourth telescopic driving member 33 is hinged to the fourth mounting frame 29, and a telescopic end of the fourth telescopic driving member 33 is hinged to the upper portion of the cleaning plate 32;

[0119] A fifth mounting frame 34, wherein two fifth mounting frames 34 are provided, and the two fifth mounting frames 34 are respectively fixed to the bottoms of the two mounting vertical rods 30;

[0120] The elliptical cylinder 35 is fixedly connected to each of the fifth mounting frames 34 .

[0121] The scraping and cleaning assembly also includes:

[0122] A mounting side plate 36, wherein two mounting side plates 36 are provided, and the two mounting side plates 36 are symmetrically fixed to two ends of the seventh mounting frame 28;

[0123] A second winding roller 37, wherein two second winding rollers 37 are provided, and both of the two second winding rollers 37 are rotatably mounted between the two mounting side plates 36;

[0124] The second cleaning adsorbent cloth 38 , a roll of the second cleaning adsorbent cloth 38 is wound around the first second winding roller 37 , and the second end of the second cleaning adsorbent cloth 38 is wound around the bottom of the cleaning plate 32 and upwardly wound around another second winding roller 37 .

[0125] The edge blocking component comprises:

[0126] A fourth lifting drive member 39, wherein two fourth lifting drive members 39 are provided, and the two fourth lifting drive members 39 are installed on the second machine tool 22;

[0127] An installation upper plate 40, wherein the installation upper plate 40 is installed at the lifting ends of the two fourth lifting driving members 39;

[0128] A strip plate 41, wherein the strip plate 41 is fixed to the middle portion of the mounting upper plate 40 through a bracket;

[0129] An extrusion block 42, wherein the extrusion block 42 is in the shape of a triangular prism, the hypotenuse of the extrusion block 42 faces the side away from the strip plate 41, and the extrusion block 42 is elastic;

[0130] A push bar 48, wherein a notch is formed on the lower side of the strip plate 41, and the push bar 48 is accommodated in the notch;

[0131] An insertion rod 43, wherein two insertion rods 43 are provided, and the two insertion rods 43 are slidably disposed in the strip plate 41, and the push bar 48 connects the first ends of the two insertion rods 43;

[0132] A mounting bar 44, the mounting bar 44 being fixedly connected to the second ends of the two insertion rods 43;

[0133] An elastic member 45, two ends of which are respectively connected to the strip plate 41 and the mounting strip 44;

[0134] A sixth mounting bracket 46, wherein two sixth mounting brackets 46 are provided, and the two sixth mounting brackets 46 are symmetrically fixed to the upper portions of both ends of the mounting bar 44;

[0135] The convex ball 47 is provided with two convex balls 47 , and one convex ball 47 is fixedly connected to the upper part of each of the sixth mounting frames 46 .

[0136] After the semiconductor graphite jig is cleaned using a surface cleaning mechanism, due to the presence of a groove on the semiconductor graphite jig, during the jig processing and calibration cutting process, a large amount of impurities accumulate in the groove, and it is not easy to clean in the groove, requiring repeated manual cleaning.

[0137] In this embodiment, the semiconductor graphite jig is placed in the rectangular groove on the second machine tool 22, and then the two third telescopic driving members 23 are extended to drive the two second clamping bars 24 to clamp the two sides of the semiconductor graphite jig. In the initial state, the two cleaning plates 32 in the two scraping and cleaning assemblies are in a close fit state, and then the third lifting driving member 27 is controlled to move downward, and the two cleaning plates 32 move downward to the groove on the semiconductor graphite jig, and the bottom ends contact the middle center line position of the groove, and then the two cleaning plates 32 move to both sides away from each other to clean the two parts in the groove respectively;

[0138] The bottom end of the cleaning plate 32 contacts the middle centerline position of the groove, and then translates on the third slide rail 25 through the second sliding mounting platform 26, so that the bottom end of the cleaning plate 32 begins to translate in the groove. During the movement, the bottom end of the cleaning plate is padded with a second cleaning adsorption cloth 38, so that the second cleaning adsorption cloth 38 can be in friction contact with the inner bottom surface of the groove for cleaning. During the translation process, the two second winding rollers 37 rotate in real time to replace the second cleaning adsorption cloth 38 in real time, ensuring efficient adsorption of impurities in the groove. At the same time, the width of the second cleaning adsorption cloth 38 is greater than that of the cleaning plate 32, and then the end face of the cleaning plate 32 presses the excess part of the second cleaning adsorption cloth 38 against the side wall of the groove, thereby achieving the cleaning of the inner bottom surface and side wall of the semiconductor graphite fixture.

[0139] When the cleaning plate 32 moves to the edge positions on both sides of the semiconductor graphite fixture groove, if the cleaning plate 32 is directly pulled up in a vertical state, some impurities will remain at the edge positions on both sides of the groove. Therefore, the fourth telescopic driving member 33 is controlled to extend, so that the cleaning plate 32 rotates around the rotating shaft rod 31, so that the cleaning plate 32 rotates to an inclined state. While rotating, the second sliding mounting platform 26 is translated and the third lifting driving member 27 is lifted and lowered to adapt to the rotation of the cleaning plate 32, so that the bottom end of the cleaning plate 32 always rests on the bottom of the two side edges of the groove. When the cleaning plate 32 is tilted to a certain angle, that is, at this time, the bottom end of the cleaning plate 32 rests on the bottom of the two side edges of the groove, and then the third lifting driving member 27 is controlled to drive the cleaning plate 32 to rise, thereby driving the cleaning plate 32 to move upward against the side of the groove in an inclined state, and scraping up the impurities accumulated on the bottom edge of the side.

[0140] At the same time, the fourth lifting drive member 39 drives the strip plate 41 to move downward, driving the bottom surface of the push bar 48 to fit the tops of both sides of the groove on the semiconductor graphite fixture, so that the edges of the push bar 48 are aligned with the top edges of both sides of the groove on the semiconductor graphite fixture;

[0141] When the cleaning plate 32 is raised, the fifth mounting frame 34 and the elliptical column 35 also move upward, that is, the elliptical column 35 moves upward synchronously. When the bottom end of the cleaning plate 32 moves to the top edges of both sides of the groove on the semiconductor graphite fixture, the elliptical column 35 also passes the position of the convex ball 47, and then the elliptical column 35 will hit the convex ball 47. The convex ball 47 then moves to drive the mounting bar 44 to compress the elastic member 45, and drives the two insertion rods 43 to move. The insertion rod 43 drives the push bar 48 to move in the direction close to the cleaning plate 32. When the bottom end of the cleaning plate 32 moves to the top edges of both sides of the groove on the semiconductor graphite fixture, a Some impurities not absorbed by the second cleaning adsorption cloth 38 are scraped up, and at this time, the pushing bar 48 moves toward the direction close to the cleaning plate 32, thereby pushing the part of the impurities not absorbed to the second cleaning adsorption cloth 38, so as to prevent the part of the impurities from falling onto the top surfaces on both sides of the groove on the semiconductor graphite fixture, and then the cleaning plate 32 continues to move upward, and the cleaning plate 32 contacts the extrusion block 42, and then the extrusion block 42 is deformed, and the second cleaning adsorption cloth 38 on the surface of the cleaning plate 32 is further squeezed, so that the impurities are completely absorbed on the second cleaning adsorption cloth 38, thereby achieving the effect of cleaning impurities without residue.

[0142] During the process, the two second winding rollers 37 convey the second cleaning adsorption cloth 38 in real time and replace it in real time to ensure the impurity adsorption effect.

[0143] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor packaging jig calibration device, comprising a first mounting frame (1) and a calibration measuring device (2), wherein the calibration measuring device (2) is mounted on an upper portion of the first mounting frame (1); It is characterized in that Also includes: A first machine tool (3), the first machine tool (3) being mounted in the middle of the first mounting frame (1), the first machine tool (3) being located in a scanning measurement area below the calibration measuring device (2); a first telescopic driving member (4), wherein two first telescopic driving members (4) are provided, and the two first telescopic driving members (4) are symmetrically mounted on two sides of the first machine tool (3); A first clamping bar (5), wherein two first clamping bars (5) are provided, and the two first clamping bars (5) are respectively mounted on the telescopic ends of the two first telescopic driving members (4); A cutting adjustment component, the cutting adjustment component being installed on the first machine tool (3) and being used to adjust and calibrate a jig with unqualified dimensions; It is characterized in that it also includes an inner tank cleaning mechanism, and the inner tank cleaning mechanism includes: A second machine tool (22), the bottom of the second machine tool (22) being fixed on a working plane via a support frame, and the top of the second machine tool (22) being provided with a rectangular groove; a third telescopic driving member (23), wherein two third telescopic driving members (23) are provided, and the two third telescopic driving members (23) are symmetrically mounted on two sides of the second machine tool (22); a second clamping strip (24), wherein two second clamping strips (24) are provided, and the two second clamping strips (24) are respectively mounted on the telescopic ends of the two third telescopic driving members (23); A third slide rail (25), two of the third slide rails (25) are provided, and the two third slide rails (25) are mounted on the second machine tool (22) via a bracket; a scraping and cleaning assembly, the scraping and cleaning assembly being mounted on the second machine tool (22), the scraping and cleaning assembly being provided with two symmetrical scraping and cleaning assemblies, the two scraping and cleaning assemblies sliding on the third slide rail (25); an edge blocking assembly, wherein two edge blocking assemblies are symmetrically arranged, and the two edge blocking assemblies are symmetrically mounted on the second machine tool (22); Characterized in that the scraping and cleaning component comprises: a second sliding mounting platform (26), the second sliding mounting platform (26) being slidably mounted on the two third slide rails (25); a third lifting drive member (27), wherein two third lifting drive members (27) are provided, and the two third lifting drive members (27) are mounted on the bottom of the second sliding mounting platform (26); a seventh mounting frame (28), the seventh mounting frame (28) being mounted on the lifting ends of the two third lifting drive members (27); a fourth mounting frame (29), the fourth mounting frame (29) being T-shaped, and the fourth mounting frame (29) being fixedly connected to the bottom of the seventh mounting frame (28); A mounting vertical rod (30), wherein two mounting vertical rods (30) are provided, and the two mounting vertical rods (30) are fixedly connected to two sides of the fourth mounting frame (29); A rotating shaft rod (31), wherein a rotating shaft rod (31) is installed at the middle and lower part of each of the mounting vertical rods (30); A cleaning plate (32), wherein two sides of the cleaning plate (32) are rotatably mounted on the two rotating shaft rods (31); a fourth telescopic driving member (33), wherein a fixed end of the fourth telescopic driving member (33) is hinged to the fourth mounting frame (29), and a telescopic end of the fourth telescopic driving member (33) is hinged to an upper portion of the cleaning plate (32); A fifth mounting frame (34), wherein two fifth mounting frames (34) are provided, and the two fifth mounting frames (34) are respectively fixed to the bottoms of the two mounting vertical rods (30); An elliptical column (35), one of the elliptical columns (35) being fixedly connected to each of the fifth mounting frames (34); Characterized in that the scraping and cleaning component also includes: A mounting side plate (36), wherein two mounting side plates (36) are provided, and the two mounting side plates (36) are symmetrically fixed to two ends of the seventh mounting frame (28); a second winding roller (37), wherein two second winding rollers (37) are provided, and the two second winding rollers (37) are both rotatably mounted between the two mounting side plates (36); A second cleaning absorbent cloth (38), a roll of the second cleaning absorbent cloth (38) is wound around the first second winding roller (37), and the second end of the second cleaning absorbent cloth (38) is passed around the bottom of the cleaning plate (32) and wound upwards around another second winding roller (37).

2. A semiconductor packaging jig calibration device according to claim 1, characterized in that: The cutting adjustment assembly comprises: A first slide rail (6), wherein two first slide rails (6) are provided, the two first slide rails (6) are mounted on the first machine tool (3) via a bracket, and the two first slide rails (6) are symmetrically arranged; A second slide rail (7), the two ends of the second slide rail (7) being slidably mounted on the two first slide rails (6) via two electric slide seats respectively; a first sliding mounting platform (8), the first sliding mounting platform (8) being slidably disposed on the second sliding rail (7); A first lifting drive member (9), the first lifting drive member (9) being mounted on the bottom of the first sliding mounting platform (8); A cutting tool head (10), wherein the cutting tool head (10) is mounted on the bottom of the lifting end of the first lifting drive member (9).

3. A semiconductor packaging jig calibration device according to claim 2, characterized in that: It also comprises a dust suction cleaning assembly, the dust suction cleaning assembly comprising a roller conveyor belt (14) and a dust collector (15), the roller conveyor belt (14) being mounted on one side of the first machine tool (3), the roller conveyor belt (14) being provided with a plurality of equally spaced conveying rollers, two dust collectors (15) being provided, the two dust collectors (15) being respectively located above and below the roller conveyor belt (14), the two dust collectors (15) being symmetrically arranged, the two dust collectors (15) being respectively mounted on the first mounting frame (1) via brackets, and the dust suction ports of the two dust collectors (15) both facing the direction of the roller conveyor belt (14).

4. A semiconductor packaging jig calibration device according to claim 3, characterized in that: The machine tool further comprises a pushing assembly, the pushing assembly comprising a second mounting frame (11), a second telescopic driving member (12) and a pushing plate (13), the top of the second mounting frame (11) being fixedly connected to the first mounting frame (1), the second telescopic driving member (12) being mounted on the bottom of the second mounting frame (11), the bottom of the pushing plate (13) being in sliding contact with the upper surface of the first machine tool (3), and the pushing plate (13) being connected to the telescopic end of the second telescopic driving member (12).

5. The semiconductor packaging jig calibration device according to claim 4, characterized in that: Also included is a surface cleaning mechanism, the surface cleaning mechanism comprising: a second lifting drive member (16), wherein a fixed end of the second lifting drive member (16) is mounted on the first mounting frame (1) via a bracket; an elastic cleaning block (17), wherein two elastic cleaning blocks (17) are provided, a first elastic cleaning block (17) being mounted on the lifting end of the second lifting drive member (16), and a second elastic cleaning block (17) being located below the first elastic cleaning block (17), and the second elastic cleaning block (17) being mounted on the first mounting frame (1) via a bracket; A third mounting frame (18), wherein the third mounting frame (18) is provided with two symmetrical groups, and each group of the third mounting frames (18) is rotatably mounted with two first winding rollers (19), wherein a roll of first cleaning absorbent cloth (20) is wound around the surface of each of the two first winding rollers (19) on one group of the third mounting frames (18), and the surfaces of the two first winding rollers (19) on the other group of the third mounting frames (18) are wound around the second ends of the two rolls of first cleaning absorbent cloth (20), and the two first cleaning absorbent cloths (20) are located between the two elastic cleaning blocks (17) in a parallel state.

6. The semiconductor packaging jig calibration device according to claim 5, characterized in that: The first elastic cleaning block (17) is mounted on the lifting end of the second lifting drive member (16) via an electric rotating shaft seat (21).

7. The semiconductor packaging jig calibration device according to claim 1, characterized in that: The edge blocking component comprises: a fourth lifting drive member (39), wherein two fourth lifting drive members (39) are provided, and the two fourth lifting drive members (39) are mounted on the second machine tool (22); An upper mounting plate (40) is mounted on the lifting ends of the two fourth lifting drive members (39); A strip plate (41), the strip plate (41) being fixedly connected to the middle portion of the mounting upper plate (40) via a bracket; An extrusion block (42), the extrusion block (42) being in the shape of a triangular prism, the oblique edge of the extrusion block (42) being directed toward a side away from the strip plate (41), and the extrusion block (42) being elastic; A push bar (48), wherein a notch is formed on the lower side of the strip plate (41), and the push bar (48) is accommodated in the notch; An insertion rod (43), wherein two insertion rods (43) are provided, and the two insertion rods (43) are slidably disposed in the strip plate (41), and the push bar (48) connects the first ends of the two insertion rods (43); A mounting bar (44), the mounting bar (44) being fixedly connected to the second ends of the two insertion rods (43); An elastic member (45), two ends of the elastic member (45) being respectively connected to the strip plate (41) and the mounting strip (44); A sixth mounting frame (46), two of which are provided, and the two sixth mounting frames (46) are symmetrically fixed to the upper parts of both ends of the mounting strip (44); and a convex ball (47), two of which are provided, and one of which is fixed to the upper part of each sixth mounting frame (46).

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