Wafer cooling device

Abstract

The embodiment of the present disclosure provides a wafer cooling device, including a chamber, a first cooling mechanism, and a second cooling mechanism, wherein the chamber includes a top plate and a bottom plate; the first cooling mechanism includes a first cooling disk, a first cold water pipe, and a lifting platform; the lifting platform and the first cooling disk are respectively arranged on the first side and the second side of the top plate, and the lifting platform is connected to the first power source; the second cooling mechanism includes a second cooling disk and a second cold water pipe; the second cooling disk is fixedly arranged on the first side of the bottom plate; the first wafer lifting mechanism includes a first lifting plate and a plurality of brackets vertically arranged on the second side of the first lifting plate; the first lifting plate is connected to the second power source; the second wafer lifting mechanism includes a second lifting plate and a plurality of support rods vertically arranged on the first side of the second lifting plate; the second lifting plate is connected to the third power source. The technical solution of the embodiment of the present disclosure can cool multiple wafers taken out of the process chamber at the same time, thereby improving the efficiency of cooling the wafers.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor equipment, and in particular to a wafer cooling device. Background Art

[0002] After the wafer completes the process in the process chamber, the temperature is high. In order to accelerate the cooling of the wafer, the wafer is usually taken out of the process chamber and sent to the cold water tray in the transfer chamber. After the wafer is cooled to the appropriate temperature, it is taken out of the transfer chamber. This can greatly reduce the cooling time of the wafer.

[0003] Multiple process chambers usually work together with a transfer chamber. If a transfer chamber is only equipped with one cold water pan, after multiple wafers complete the process at the same time, they need to queue up to enter the cold water pan of the transfer chamber for cooling. Therefore, the cooling speed of the wafers at the end of the queue will be affected, thus affecting the effect of the entire process. If you want to install multiple layers of cold water pans, you need to increase the chamber volume or increase the Z-axis stroke of the vacuum robot to meet the transmission interval of the multiple layers of cold water pans, or design the cold water pan to be relatively thin, so that the cooling circulating water cannot completely cover the area where the wafers are placed, and the cooling effect is greatly reduced. Summary of the invention

[0004] The embodiments of the present disclosure provide a wafer cooling device to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a wafer cooling device, including:

[0006] a chamber, including a top plate and a bottom plate;

[0007] The first cooling mechanism comprises a first cooling plate, a first cold water pipe and a lifting platform; the lifting platform and the first cooling plate are respectively arranged on the first side and the second side of the top plate, the lifting platform is connected to the first power source, and under the drive of the first power source, the first cooling plate and the lifting platform are synchronously lifted and lowered in the vertical direction; the first cold water pipe is fixedly connected to the first cooling plate through the first through hole on the top plate, and a circulation pipeline connected to the first cold water pipe is arranged in the first cooling plate;

[0008] The second cooling mechanism comprises a second cooling disk and a second cold water pipe; the second cooling disk is fixedly arranged on the first side of the bottom plate, the second cold water pipe passes through the bottom plate and is fixedly connected to the second cooling disk, and a circulation pipeline connected to the second cold water pipe is arranged in the second cold water pipe;

[0009] The first wafer lifting mechanism comprises a first lifting plate and a plurality of brackets vertically arranged on a second side of the first lifting plate; the ends of the plurality of brackets are provided with hooks for holding up the wafers; in the extending direction of the plurality of brackets, the top plate and the first cooling plate are provided with second through holes for allowing the brackets to pass through; the first lifting plate is connected to a second power source, and under the drive of the second power source, the first lifting plate and the plurality of brackets are lifted and lowered in a vertical direction so that the hooks receive or place the wafers;

[0010] The second wafer lifting mechanism comprises a second lifting plate and a plurality of support rods vertically arranged on a first side of the second lifting plate; in the extension direction of the plurality of support rods, a third through hole for allowing the support rods to pass through is provided on the bottom plate and the second cooling plate; the second lifting plate is connected to a third power source, and driven by the third power source, the second lifting plate and the plurality of support rods are lifted and lowered in a vertical direction so that the support rods can receive or place the wafer;

[0011] The surfaces of the first side of the first cooling plate and the first side of the second cooling plate are used for placing wafers.

[0012] In one embodiment, the first through hole and the second through hole are sealed with the top plate, and the third through hole is sealed with the bottom plate, so that a sealed environment is formed inside the chamber.

[0013] In one embodiment, a first sealing hose is provided between the first side of the first through hole and the lifting platform, the first cold water pipe portion is provided in the first sealing hose, and the top plate and the lifting platform are sealed.

[0014] In one embodiment, a second sealing hose is provided between the first side of the second through hole and the first lifting plate, the bracket portion is provided in the second sealing hose, and the top plate and the first lifting plate are sealed.

[0015] In one embodiment, a third sealing hose is provided between the second side of the third through hole and the second lifting plate, the support rod is partially disposed in the third sealing hose, and the bottom plate and the second lifting plate are sealed.

[0016] In one embodiment, the first lifting plate is disposed on a first side of the lifting platform, and the lifting platform is provided with a fourth through hole allowing the bracket to pass through.

[0017] In one embodiment, the lifting platform and the first cooling plate are connected via a first cold water pipe, and the first cold water pipe is fixedly connected to the lifting platform.

[0018] In one embodiment, a cache rack is provided on the second side of the first cooling plate, and the cache rack includes a plurality of hooks, wherein the distance between ends of two opposite hooks among the plurality of hooks is smaller than the diameter of the wafer.

[0019] In one embodiment, the cache rack includes at least two layers of hooks, and the at least two layers of hooks are connected in sequence in the vertical direction.

[0020] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a transfer chamber, including the wafer cooling device provided by any embodiment of the present disclosure.

[0021] The disclosed embodiment adopts the above technical solution, and the wafer cooling device can match two or more process chambers and cool multiple wafers taken out of the process chambers at the same time, thereby improving the efficiency of cooling the wafers.

[0022] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments provided according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0024] Figure 1 A schematic structural diagram of a wafer cooling device according to an embodiment of the present disclosure is shown;

[0025] Figure 2 A schematic diagram showing the working state of a wafer cooling device according to an embodiment of the present disclosure is shown;

[0026] Figure 3 A schematic diagram showing the working state of a wafer cooling device according to an embodiment of the present disclosure is shown;

[0027] Figure 4 A schematic diagram showing the working status of a wafer cooling device according to an embodiment of the present disclosure is shown.

[0028] Explanation of the accompanying drawings: 1a, top plate; 1b, bottom plate; 2a, first cooling plate; 2b, second cooling plate; 3, cache rack; 4, lifting platform; 5, first lifting plate; 6a, first cold water pipe; 6b, second cold water pipe; 7a, first sealing hose; 7b, second sealing hose; 7c, third sealing hose; 8, bracket; 9, second lifting plate; 10, support rod; 11, wafer; 12a, first through hole, 12b, second through hole, 12c, third through hole. DETAILED DESCRIPTION

[0029] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0030] Figure 1 FIG. 2 is a schematic diagram showing the structure of a wafer cooling device according to an embodiment of the present disclosure. Figure 1 As shown, the device comprises:

[0031] A chamber, comprising a top plate 1a and a bottom plate 1b;

[0032] The first cooling mechanism comprises a first cooling disk 2a, a first cold water pipe 6a and a lifting platform 4; the lifting platform 4 and the first cooling disk 2a are respectively arranged on the first side and the second side of the top plate 1a, the lifting platform 4 is connected to the first power source, and under the drive of the first power source, the first cooling disk 2a and the lifting platform 4 are synchronously lifted and lowered in the vertical direction; the first cold water pipe 6a is fixedly connected to the first cooling disk 2a through the first through hole 12a on the top plate 1a, and a circulation pipeline connected to the first cold water pipe 6a is arranged in the first cooling disk 2a;

[0033] The second cooling mechanism comprises a second cooling disk 2b and a second cold water pipe 6b; the second cooling disk 2b is fixedly arranged on the first side of the bottom plate 1b, the second cold water pipe 6b passes through the bottom plate 1b and is fixedly connected to the second cooling disk 2b, and a circulation pipeline communicating with the second cold water pipe 6b is arranged in the second cold water pipe 6b;

[0034] The first wafer lifting mechanism comprises a first lifting plate 5 and a plurality of brackets 8 vertically arranged on the second side of the first lifting plate 5; the ends of the plurality of brackets 8 are provided with hooks for holding up the wafer 11; in the extending direction of the plurality of brackets 8, the top plate 1a and the first cooling plate 2a are provided with second through holes 12b for allowing the brackets 8 to pass through; the first lifting plate 5 is connected to the second power source, and under the drive of the second power source, the first lifting plate 5 and the plurality of brackets 8 are lifted and lowered in the vertical direction so that the hooks receive or place the wafer 11;

[0035] The second wafer lifting mechanism comprises a second lifting plate 9 and a plurality of support rods 10 vertically arranged on a first side of the second lifting plate 9; in the extension direction of the plurality of support rods 10, a third through hole 12c for allowing the support rods 10 to pass through is provided on the bottom plate 1b and the second cooling plate 2b; the second lifting plate 9 is connected to a third power source, and driven by the third power source, the second lifting plate 9 and the plurality of support rods 10 are lifted and lowered in a vertical direction so that the support rods 10 receive or place the wafer 11;

[0036] The surfaces of the first side of the first cooling plate 2 a and the second cooling plate 2 b are used for placing the wafer 11 .

[0037] In the embodiment of the present disclosure, Figure 1 For reference, define Figure 1 The upper side of the wafer cooling device in the vertical direction from top to bottom is the first side described in the embodiment of the present disclosure, and the lower side of the wafer cooling device in the vertical direction is the second side described in the embodiment of the present disclosure.

[0038] The top plate 1a and the bottom plate 1b constitute the upper and lower surfaces of the chamber. The chamber may also have a side plate connecting the top plate 1a and the bottom plate 1b, and a window that can be opened and closed is provided on either side of the chamber in the horizontal direction, which is used to allow the wafer transfer device to deliver the wafer 11 into the chamber, or to take the wafer 11 out of the chamber. In some examples, the wafer transfer device may be a manipulator that can move in multiple directions, and may specifically include two groups of manipulators arranged in different directions, which are respectively used to deliver wafers between the wafer cooling device and different upstream and downstream devices or in different environments.

[0039] The first cooling disk 2a and the second cooling disk 2b are respectively arranged at the upper and lower parts of the chamber, wherein the first cooling disk 2a can be lifted and lowered following the lifting platform 4, and the second cooling disk 2b cannot be lifted and lowered. There are circulation pipelines in the first cooling disk 2a and the second cooling disk 2b, and the inlet and outlet of the circulation pipeline are connected to the cold water pipe. Two or more first cold water pipes 6a are fixedly connected to the first cooling disk 2a, and two or more second cold water pipes 6b are fixedly connected to the second cooling disk 2b. The coolant can enter and exit the first cooling disk 2a through the first cold water pipe 6a, and enter and exit the second cooling disk 2b through the second cold water pipe 6b. When the wafer 11 is placed on the cooling disk, the wafer 11 can be quickly cooled and cooled. The coolant can be water. The water pipe of the first cooling disk 2a passes through the top plate 1a. The lifting platform 4 is driven by a first power source composed of a motor or a cylinder, and the lifting platform 4 can move in the vertical direction. The lifting platform 4 is connected to the first cooling disk 2a by a plurality of connecting rods to achieve synchronous lifting. Therefore, when the lifting platform 4 moves, the first cooling plate 2a and the first cold water pipe 6a are driven to move synchronously.

[0040] The second cold water pipe 6b is fixedly connected to the bottom plate 1b when passing through the bottom plate 1b, so that the second cooling plate 2b is fixed on the upper side of the bottom plate 1b, and a gap may be provided between the second cooling plate 2b and the bottom plate 1b.

[0041] The first cooling disk 2a and the second cooling disk 2b cannot be directly delivered to the robot. The first wafer lifting mechanism is used to deliver the wafer 11 between the first cooling disk 2a and the robot, and the second wafer lifting mechanism is used to deliver the wafer 11 between the second cooling disk 2b and the robot. Specifically, when placing the wafer 11 on the first cooling disk 2a, the support 8 of the first wafer lifting mechanism and the first cooling disk 2a need to be lowered to a predetermined height, and the robot delivers the wafer 11 from the side to the top of the first cooling disk 2a, the support 8 rises to lift the wafer 11 from the robot, the robot withdraws, and the support 8 places the wafer 11 on the first cooling disk 2a. Similarly, when placing the wafer 11 on the second cooling disk 2b, the robot delivers the wafer 11 from the side to the top of the second cooling disk 2b, the support rod 10 rises to lift the wafer 11 from the robot, the robot withdraws, and the support rod 10 places the wafer 11 on the second cooling disk 2b. At this time, the first cooling mechanism is located above the chamber and will not interfere with the second cooling mechanism below in taking and placing the wafer 11. During the process of taking and placing the wafer, the robot does not need to move vertically in the chamber, which can also be understood as not needing to increase or change the Z-axis travel of the robot.

[0042] Multiple brackets 8 need to be arranged at the edge of the wafer, and the distance between the ends of the hooks of two pairs of brackets 8 among the multiple brackets 8 is smaller than the diameter of the wafer, so that the hooks can hold up the edge of the wafer. The second through hole 12b on the first cooling plate 2a is used to allow the bracket 8 to pass through, so the second through hole 12b is also at the edge of the wafer. When the wafer 11 is placed on the first cooling plate 2a, the edge of the wafer should partially cover the second through hole 12b, that is, the spacing between the adjacent sides of the two opposite second through holes 12b is smaller than the diameter of the wafer, and the spacing on the other side is slightly larger than the diameter of the wafer.

[0043] According to the solution of the embodiment of the present disclosure, the existing space of the chamber is fully utilized. Without increasing the chamber space and the Z-axis stroke of the robot, two cooling plates are designed in the chamber, which can improve the efficiency of cooling the wafer and enable one wafer cooling device to match two or more process chambers.

[0044] In one embodiment, the first through hole 12a, the second through hole 12b are sealed with the top plate 1a, and the third through hole 12c is sealed with the bottom plate 1b, so that a sealed environment is formed inside the chamber.

[0045] In the embodiment of the present disclosure, a vacuum environment can be formed inside the chamber, and an atmospheric environment can be formed outside the chamber. Each through hole on the top plate 1a and the bottom plate 1b needs to be sealed, and the first through hole 12a, the second through hole 12b, and the third through hole 12c can be sealed by a sealing ring (such as an O-ring, a U-ring, a lip-shaped sealing ring), a packing seal, or a bellows seal.

[0046] According to the solution of the embodiment of the present disclosure, the vacuum environment helps to improve the cooling efficiency of the wafer and reduce the energy loss of the cooling plate.

[0047] In one embodiment, a first sealing hose 7a is provided between the first side of the first through hole 12a and the lifting platform 4 , a portion of the first cold water pipe 6a is provided in the first sealing hose 7a , and the top plate 1a and the lifting platform 4 are sealed.

[0048] In the disclosed embodiment, the first cold water pipe 6a between the top plate 1a and the lifting platform 4 is wrapped in the first sealing hose 7a, and the two ends of the first sealing hose 7a are respectively sealed and connected to the top plate 1a and the lifting platform 4, so that the outside of the first through hole 12a is sealed to ensure that the inside of the chamber can be isolated from the atmospheric environment. The first sealing hose 7a can be a corrugated tube.

[0049] According to the solution of the embodiment of the present disclosure, the first cooling mechanism can be freely raised and lowered while ensuring that the interior of the chamber can be isolated from the atmospheric environment.

[0050] In one embodiment, a second sealing hose 7 b is provided between the first side of the second through hole 12 b and the first lifting plate 5 , the bracket 8 is partially disposed in the second sealing hose 7 b , and the top plate 1 a and the first lifting plate 5 are sealed.

[0051] In the disclosed embodiment, the bracket 8 between the top plate 1a and the first lifting plate 5 is wrapped in the second sealing hose 7b, and the two ends of the second sealing hose 7b are respectively sealed and connected to the top plate 1a and the first lifting plate 5, so that the outside of the first through hole 12a is sealed to ensure that the inside of the chamber can be isolated from the atmospheric environment. The second sealing hose 7b can be a bellows.

[0052] According to the solution of the embodiment of the present disclosure, the first wafer lifting mechanism can be freely raised and lowered while ensuring that the interior of the chamber can be isolated from the atmospheric environment.

[0053] In one embodiment, a third sealing hose 7c is provided between the second side of the third through hole 12c and the second lifting plate 9, the support rod 10 is partially disposed in the third sealing hose 7c, and the bottom plate 1b and the second lifting plate 9 are sealed.

[0054] In the disclosed embodiment, the support rod 10 between the bottom plate 1b and the second lifting plate 9 is wrapped in the third sealing hose 7c, and the two ends of the third sealing hose 7c are respectively sealed and connected to the bottom plate 1b and the second lifting plate 9, so that the outside of the third through hole 12c is sealed to ensure that the inside of the chamber can be isolated from the atmospheric environment. The third sealing hose 7c can be a bellows.

[0055] According to the solution of the embodiment of the present disclosure, the second wafer lifting mechanism can be freely raised and lowered while ensuring that the interior of the chamber can be isolated from the atmospheric environment.

[0056] In one embodiment, the first lifting plate 5 is disposed on a first side of the lifting platform 4 , and the lifting platform 4 is provided with a fourth through hole allowing the bracket 8 to pass through.

[0057] In the disclosed embodiment, the first lifting plate 5 and the second power source connected to the first lifting plate 5 are arranged on the upper side of the lifting platform 4 to avoid being between the lifting platform 4 and the top plate 1a and affecting the lifting stroke of the lifting platform 4.

[0058] According to the solution of the embodiment of the present disclosure, the distance between the lifting platform 4 and the first cold water tray can be reduced, and the height of the cooling device can be reduced.

[0059] In one embodiment, the lifting platform 4 is connected to the first cooling plate 2 a via a first cold water pipe 6 a , and the first cold water pipe 6 a is fixedly connected to the lifting platform 4 .

[0060] In the disclosed embodiment, the first cold water pipe 6a is made of a hard material and can be used as a connecting rod between the lifting platform 4 and the first cooling disk 2a. There can be two first cold water pipes 6a, which are symmetrically arranged on both sides of the first cooling disk 2a. There can also be four first cold water pipes 6a, which are symmetrically arranged on both sides or four corners of the first cooling disk 2a. When the lifting platform 4 is raised or lowered, the first cooling disk 2a is driven to move by the first cold water pipe 6a. The first cold water pipe 6a can be connected to the cooling liquid source through a hose so that the first cold water pipe 6a can move with the lifting platform 4.

[0061] According to the solution of the embodiment of the present disclosure, using the first cold water pipe 6a as a connecting rod helps to reduce the number of first through holes 12a and improve the sealing performance of the chamber.

[0062] In another example, a portion of the first cold water pipe 6a extending into the chamber is a hose, and a portion connected to the top plate is fixedly and sealedly connected to the top plate, and the first cold water pipe 6a is not connected to the lifting platform. The lifting platform 4 drives the first cooling plate 2a to rise and fall through a connecting rod, and when the first cooling plate 2a rises and falls, the first cold water pipe 6a in the chamber is stretched and contracted.

[0063] In one embodiment, a cache rack 3 is provided on the second side of the first cooling plate 2a. The cache rack 3 includes a plurality of hooks. The distance between the ends of two opposite hooks among the plurality of hooks is smaller than the diameter of the wafer.

[0064] In the disclosed embodiment, the first cooling mechanism has a lifting function, and a buffer rack 3 is added under the first cooling plate 2a to temporarily store the wafer 11 in the space between the first cooling plate 2a and the second cooling plate 2b. In one example, there may be three hooks, two of which are respectively arranged on the left and right sides of the manipulator's entry and exit direction, and the third hook is arranged on the side away from the manipulator in the manipulator's entry and exit direction.

[0065] According to the solution of the embodiment of the present disclosure, the cooling device has the function of temporarily storing wafers.

[0066] In one embodiment, the cache rack 3 includes at least two layers of hooks, and the at least two layers of hooks are connected in sequence in the vertical direction.

[0067] According to the solution of the embodiment of the present disclosure, a plurality of wafers 11 can be temporarily stored by fully utilizing the space between the first cooling plate 2a and the second cooling plate 2b.

[0068] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a transfer chamber, including the wafer cooling device provided by any embodiment of the present disclosure.

[0069] In one embodiment, Figure 1 As shown, the top plate and the bottom plate constitute the upper and lower surfaces of the transmission chamber. There is a vacuum environment between the two parts, and the area outside the two parts is the atmospheric environment. The upper cold water tray (first cooling tray) has two or more upper cold water tray water pipes (first cold water pipes). All the upper cold water tray water pipes are fixedly connected to the upper cold water tray. Cooling water can enter and exit the upper cold water tray through the upper cold water tray water pipes to achieve the effect of cooling. The upper cold water tray water pipe passes through the top plate and does not contact the top plate. The upper cold water tray water pipe can move in the vertical direction. The upper cold water tray water pipe is fixedly and sealedly connected to the upper cold water tray lifting plate (lifting platform), and the upper cold water tray water pipe passes through the upper cold water tray lifting plate. The upper cold water tray lifting plate is driven by a motor or a cylinder and can move in the vertical direction. All the first cold water pipes are wrapped by the upper cold water pan bellows (first sealing hose). The two ends of the upper cold water pan bellows are respectively fixed and sealed to the top plate and the upper cold water pan lifting plate. The inner surface of the upper cold water pan bellows is in a vacuum environment, and the outer surface is in an atmospheric environment.

[0070] The wafer lifting plate (first lifting plate) is fixed to the upper cold water plate lifting plate by a cylinder or a motor. When the upper cold water plate lifting plate moves up and down, the wafer lifting plate will also move up and down. At the same time, the upper cold water plate lifting plate will also move up and down relative to the wafer lifting plate through the cylinder. Two or more wafer lifting brackets are installed on the lower surface of the wafer lifting plate, and the wafer can be lifted or placed by moving up and down through the hook structure at the bottom. The wafer lifting plate and the top plate are sealed and connected by the wafer lifting plate bellows (second sealing hose). The inner surface of the wafer lifting plate bellows is in a vacuum environment, and the outer surface is in an atmospheric environment.

[0071] Two sets of wafer buffer racks are installed on the lower surface of the upper cold water tray, and wafers can be placed on or removed from the wafer buffer racks by a robot. The lower cold water tray (second cold water tray) has a similar structure to the upper cold water tray, with two or more lower cold water tray water pipes (second cold water pipes), which pass through the bottom plate, and the two parts are sealed. The wafer lower lifting plate (second lifting plate) is driven by a motor or a cylinder and can move in the vertical direction. Three or more wafer lifting rods (support rods) are installed on the upper surface of the wafer lower lifting plate. The wafer lifting rods can pass through the bottom plate and the lower cold water tray to lift or drop the wafer above the lower cold water tray. The bottom plate and the wafer lower lifting plate are sealed by the wafer lower lifting plate bellows (third sealing hose), and the inner surface of the wafer lower lifting plate bellows is in a vacuum environment and the outer surface is in an atmospheric environment.

[0072] The workflow of the transfer chamber provided in the embodiment of the present disclosure includes:

[0073] like Figure 1 , two wafers are placed on the wafer buffer rack by the atmospheric robot, and then the two wafers are taken away by the vacuum robot for process processing.

[0074] After the first wafer is processed, the upper cold water plate lifting plate drives the wafer upper lifting plate and the upper cold water plate to move downward, and the upper cold water plate moves to the middle position of the transfer chamber. Figure 2 As shown. The first wafer is taken out of the process chamber by the vacuum robot and transferred to the top of the upper cooling water tray. Figure 3 As shown, the wafer lifting plate drives the wafer lifting bracket to move upward, and lifts the wafer from the vacuum manipulator, and the vacuum manipulator withdraws. Then, the wafer lifting plate descends and returns to the initial position, and the wafer falls onto the upper cold water tray and begins to cool. Then the upper cold water tray lifting plate rises and returns to the initial position.

[0075] The second wafer is taken out of the process chamber by the vacuum robot and transferred to the top of the lower cooling water tray. Figure 4 As shown, the wafer lower lifting plate drives the wafer lifting rod to rise, lifts the wafer from the vacuum robot, and the vacuum robot withdraws. The wafer lower lifting plate descends and returns to the initial position, and the wafer falls onto the lower cold water tray and begins to cool.

[0076] After the cooling process is completed, the upper cold water plate lifting plate descends, the wafer upper lifting plate rises, the first wafer is lifted, and the atmospheric manipulator takes the first wafer away. Then the upper cold water plate lifting plate rises, the wafer upper lifting plate descends, and the upper cold water plate lifting plate and the wafer upper lifting plate return to their initial positions. Then the lower wafer lifting plate rises, the second wafer is lifted, the atmospheric manipulator takes the second wafer away, and the lower wafer lifting plate descends and returns to its initial position.

[0077] The other structures of the transmission chamber in the above-mentioned embodiment can adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0078] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0080] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0081] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0082] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0083] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wafer cooling device, comprising: A chamber comprising a top plate (1a) and a bottom plate (1b); The first cooling mechanism comprises a first cooling disk (2a), a first cold water pipe (6a) and a lifting platform (4); the lifting platform (4) and the first cooling disk (2a) are respectively arranged on a first side and a second side of the top plate (1a); the lifting platform (4) is connected to a first power source; under the drive of the first power source, the first cooling disk (2a) and the lifting platform (4) are synchronously lifted and lowered in a vertical direction; the first cold water pipe (6a) is fixedly connected to the first cooling disk (2a) via a first through hole (12a) on the top plate (1a); and a circulation pipeline connected to the first cold water pipe (6a) is provided in the first cooling disk (2a); The second cooling mechanism comprises a second cooling disk (2b) and a second cold water pipe (6b); the second cooling disk (2b) is fixedly arranged on a first side of the bottom plate (1b); the second cold water pipe (6b) passes through the bottom plate (1b) and is fixedly connected to the second cooling disk (2b); and a circulation pipeline connected to the second cold water pipe (6b) is arranged in the second cold water pipe (6b); A first wafer lifting mechanism comprises a first lifting plate (5) and a plurality of brackets (8) vertically arranged on a second side of the first lifting plate (5); ends of the plurality of brackets (8) are provided with hooks for lifting the wafer (11); In the extension direction of the plurality of brackets (8), the top plate (1a) and the first cooling plate (2a) are provided with second through holes (12b) for allowing the brackets (8) to pass through; the first lifting plate (5) is connected to a second power source, and driven by the second power source, the first lifting plate (5) and the plurality of brackets (8) are lifted and lowered in a vertical direction so that the hooks can receive or place wafers (11); The second wafer lifting mechanism comprises a second lifting plate (9) and a plurality of support rods (10) vertically arranged on a first side of the second lifting plate (9); in the extension direction of the plurality of support rods (10), third through holes (12c) are provided on the bottom plate (1b) and the second cooling plate (2b) for allowing the support rods (10) to pass through; the second lifting plate (9) is connected to a third power source, and under the drive of the third power source, the second lifting plate (9) and the plurality of support rods (10) are lifted and lowered in a vertical direction so that the support rods (10) receive or place wafers (11); The surfaces of the first side of the first cooling plate (2a) and the second cooling plate (2b) are used for placing wafers (11); a cache rack (3) is provided on the second side of the first cooling plate (2a), and the cache rack (3) comprises a plurality of hooks, wherein the distance between the ends of two opposite hooks among the plurality of hooks is smaller than the diameter of the wafer.

2. The wafer cooling device according to claim 1, wherein: The first through hole (12a), the second through hole (12b) and the top plate (1a) are sealed, and the third through hole (12c) and the bottom plate (1b) are sealed, so that a sealed environment is formed inside the chamber.

3. The wafer cooling device according to claim 2, wherein: A first sealing hose (7a) is provided between the first side of the first through hole (12a) and the lifting platform (4), the first cold water pipe (6a) is partially arranged in the first sealing hose (7a), and the top plate (1a) and the lifting platform (4) are sealed.

4. The wafer cooling device according to claim 2, wherein: A second sealing hose (7b) is provided between the first side of the second through hole (12b) and the first lifting plate (5), the bracket (8) is partially arranged in the second sealing hose (7b), and the top plate (1a) and the first lifting plate (5) are sealed.

5. The wafer cooling device according to claim 2, wherein: A third sealing hose (7c) is provided between the second side of the third through hole (12c) and the second lifting plate (9), the support rod (10) is partially disposed in the third sealing hose (7c), and the bottom plate (1b) and the second lifting plate (9) are sealed.

6. The wafer cooling device according to claim 1, wherein: The first lifting plate (5) is arranged on a first side of the lifting platform (4), and the lifting platform (4) is provided with a fourth through hole allowing the bracket (8) to pass through.

7. The wafer cooling device according to claim 1, wherein: The lifting platform (4) and the first cooling plate (2a) are connected via the first cold water pipe (6a), and the first cold water pipe (6a) is fixedly connected to the lifting platform (4).

8. The wafer cooling device according to claim 1, wherein: The cache rack (3) comprises at least two layers of hooks, and the at least two layers of hooks are connected in sequence in the vertical direction.

9. A transfer chamber, comprising the wafer cooling device according to any one of claims 1 to 8.

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