Laser cutting technology for circuit board processing

Abstract

The present invention belongs to the technical field of circuit board processing, and particularly relates to a laser grooving process for circuit board processing, wherein a circuit board to be grooved is transported to a grooving area through a loading module on a workbench, and the circuit board is adsorbed and fixed by a mobile adsorption unit; a waste edge clamping mechanism is driven to work in the clamping area so that it is clamped to a sub-area of ​​the circuit board to be grooved; a laser grooving system is used to drive a laser drill bit to move to the sub-area to be grooved for grooving, until the grooving of multiple sub-areas to be grooved is completed; after the grooving is completed, the mobile adsorption unit will push the grooved circuit board to rise to the unloading module, and the waste edge after the grooving will be separated from the circuit board by the waste edge clamping mechanism; the laser grooving process of the present invention can not only perform groove cutting processing on the circuit board, but also quickly and safely separate the waste edge formed by the groove cutting from the circuit board, thereby realizing fast and safe laser cutting processing of special-shaped boards.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a laser grooving process for circuit board processing. Background Art

[0002] Circuit board is also called circuit board. Its names include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board, etc. Circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances.

[0003] When processing existing circuit boards to form special-shaped circuit boards, most of them are first cut through the circuit boards at the positions to be cut through laser drilling, and then the waste edges formed at the cut grooves are manually broken off to achieve the processing of the special-shaped circuit boards. Obviously, this method not only reduces the efficiency of the laser grooving process for circuit board grooving processing, but also easily causes safety hazards to the processing personnel. Summary of the invention

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0005] The present invention is a laser grooving process for circuit board processing, which comprises the following steps:

[0006] S1: The circuit board to be grooved is transported to the groove cutting area through the loading module on the workbench, the circuit board is adsorbed and fixed by the mobile adsorption unit at the groove cutting area, and the circuit board is driven down to the waste edge clamping area;

[0007] S2: importing grooving data through the laser grooving system on the workbench, and dividing the surface of the circuit board into a plurality of sub-areas to be grooved according to the grooving data;

[0008] S3: driving the scrap edge clamping mechanism to work in the clamping area so that it is clamped to the sub-area of ​​the circuit board to be grooved;

[0009] S4: using the laser grooving system to drive the laser drill to move to the sub-area to be grooved for grooving. After grooving of one sub-area is completed, the laser drill moves to the next sub-area to continue grooving until grooving of multiple sub-areas to be grooved is completed.

[0010] S5: When the circuit board is cut into grooves, the mobile adsorption unit will push the circuit board after cutting grooves to the unloading module, and the waste edge after cutting grooves will be separated from the circuit board by the waste edge clamping mechanism. The unloading module will transport the special-shaped circuit board after cutting grooves to the next processing area.

[0011] Furthermore, a loading module and a unloading module are symmetrically arranged on the upper surface of the workbench, and a grooving area is formed between the loading module and the unloading module, and a mobile adsorption unit is arranged at the grooving area for moving, adsorbing and fixing the circuit board to be cut, and waste edge clamping mechanisms are arranged on the front and rear side walls of the grooving area for clamping and detaching waste edges generated after grooving the circuit board, and a laser drill is suspended directly above the grooving area by a bracket and a mobile unit.

[0012] Furthermore, the mobile adsorption unit includes a driving screw, a screw nut, a guide slider, a support strip, a fixed air pipe, a sliding air pipe, an adsorption plate, a push cylinder and a connecting block. A movable guide groove is opened in the left and right horizontal directions of the groove bottom of the groove area, and a driving screw is rotatably installed in the movable guide groove. A guide slider is sleeved on the driving screw through a screw nut, and the guide slider is slidably arranged in the movable guide groove. A support strip is fixed on the upper surface of the guide slider, and the support strip is horizontally arranged front and back in the groove area. A fixed air pipe is symmetrically installed on the support strip, and a sliding air pipe is sealingly and slidably inserted in the fixed air pipe, and the bottom outer ring surface of the fixed air pipe is connected to the guide air pipe, the top of the sliding air pipe is connected to the adsorption plate, and a push cylinder is vertically arranged on the other side of the fixed air pipe, and the upper end surface of the piston rod of the push cylinder is connected to the sliding air pipe through a connecting block.

[0013] Furthermore, a separation and movement component is provided on the supporting strip, and the separation and movement component includes a metal ring, a magnetic ring, a metal block, an insulating block and a magnetic block. A rotating cavity is opened inside the guide slider, and the outer ring surface of the lead screw nut is insulated and sleeved with a metal ring, and the metal ring is located in the rotating cavity, and the cavity wall of the rotating cavity is insulated and provided with a magnetic ring, and the magnetic ring is sleeved on the metal ring, and the front and rear side walls of the groove area are installed with multiple metal blocks along the length direction thereof, and the multiple metal blocks are connected to each other through the insulating block to form a metal strip, and the front and rear ends of the supporting strip are insulated and provided with magnetic blocks, and the magnetic blocks are in contact with the outer side surfaces of the connected metal strips.

[0014] Furthermore, the separation moving assembly also includes a meshing rack, a meshing gear, a driving shaft and an I-shaped slider, a first moving groove is opened inside the supporting strip along its length direction, and a second moving groove is opened above the first moving groove, the width of the first moving groove is greater than the width of the second moving groove, meshing racks are symmetrically fixed to the cavity walls on both sides of the first moving groove, and meshing gears are meshed between the symmetrical meshing racks, the heights of the meshing gears and the meshing racks are less than the groove depth of the first moving groove, a driving shaft is vertically installed on the meshing gear, and the driving shaft is connected to the output shaft of the servo motor fixed inside the I-shaped slider, the I-shaped slider is slidably arranged on the supporting strip, the lower cross block of the I-shaped slider is slidably arranged in the second moving groove, and its vertical block is slidably arranged in the first moving groove, and its upper cross block is slidably fitted to the upper surface of the supporting strip, and the upper surface of the upper cross block of the I-shaped slider is respectively fixed with a fixed air pipe and a pushing cylinder.

[0015] Furthermore, the waste edge clamping mechanism includes a supporting screw, a supporting slider, an end support block and a clamping claw cylinder. A long sliding groove is opened above the front and rear side walls of the cutting groove area, and the long sliding groove is located below the unloading module. The long sliding groove runs through the right side of the workbench. A supporting screw is rotatably installed in the long sliding groove along its length direction, and the right end of the supporting screw is rotatably installed to the end support block through a bearing. A supporting slider is sleeved on the supporting screw through a screw nut, and the supporting slider is slidably set in the long sliding groove. A clamping claw cylinder is fixed to the outer end face of the supporting slider, and the clamping claw of the clamping claw cylinder faces the center of the cutting groove area.

[0016] Furthermore, the waste edge clamping mechanism also includes a T-shaped slider, a clamping plate and a pushing cylinder. The end of the clamping claw is provided with a T-shaped slide groove inwardly, and a T-shaped slider is slidably inserted in the T-shaped slide groove. The outer surface of the vertical block of the T-shaped slider is integrally connected with the clamping plate, and the clamping plate is slidably fitted on the corresponding surface of the clamping claw. A pushing cylinder is horizontally fixed to the bottom of the T-shaped slide groove, and the piston rod of the pushing cylinder is connected to the inner end surface of the T-shaped slider.

[0017] Furthermore, the loading module and the unloading module are both made of a conveyor belt structure.

[0018] The present invention has the following beneficial effects:

[0019] 1. The grooving process of the present invention can not only cut grooves on the circuit board so that it can be quickly processed into a special-shaped circuit board, but also the cooperation of the mobile adsorption unit and the waste edge clamping mechanism can automatically break and separate the waste board formed at the edge of the special-shaped circuit board, without the need for operators to manually break it off. As a result, the laser grooving process can not only cut the grooves on the circuit board, but also quickly and safely separate the waste edges formed by the cutting grooves from the circuit board, thereby realizing fast and safe laser cutting of special-shaped boards.

[0020] 2. The present invention sets a separation moving component on the symmetrical supporting strips. Through the cooperation of the magnetic attraction ring and the metal ring inside the guide slider, the driving screw can drive the symmetrical supporting strips to slide synchronously, and can also drive one of the supporting strips to slide separately, thereby not only realizing the stable and safe transfer of the circuit board to the grooving area, but also can safely and stably adsorb and fix the circuit board, thereby improving the safety of the laser grooving process for the circuit board. The I-shaped slider is driven by the meshing gear and the meshing rack, so that the front and rear symmetrical adsorption plates can slide close to each other and slide separately, thereby changing the position of the adsorption plate to adsorb and fix the circuit board at different positions, so that it will not interfere with the circuit board being grooved.

[0021] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0023] Figure 1 The process flow chart of laser grooving disclosed in the present invention;

[0024] Figure 2 It is a schematic diagram of the structures of the workbench, laser drill head, feeding module, etc. disclosed in the present invention;

[0025] Figure 3 It is a structural schematic diagram of the workbench disclosed in the present invention;

[0026] Figure 4 It is a structural schematic diagram of the mobile adsorption unit and the scrap edge clamping mechanism disclosed in the present invention;

[0027] Figure 5 A cross-sectional view of the supporting strip disclosed in the present invention;

[0028] Figure 6 It is a structural schematic diagram of the scrap edge clamping mechanism disclosed in the present invention;

[0029] Figure 7 It is a cross-sectional view of the workbench disclosed in the present invention.

[0030] In the figure: 1. workbench; 2. loading module; 3. cutting area; 31. moving guide groove; 32. sliding long groove; 4. moving adsorption unit; 41. driving screw; 42. screw nut; 43. guide slider; 44. supporting strip; 441. first moving groove; 442. second moving groove; 45. fixed air pipe; 46. sliding air pipe; 47. adsorption plate; 48. push cylinder; 49. connecting block; 5. separating moving assembly; 51. Metal ring; 52, magnetic ring; 53, metal block; 54, insulating block; 56, meshing rack; 57, meshing gear; 58, driving shaft; 59, I-shaped slider; 6, waste edge clamping mechanism; 61, supporting screw; 62, supporting slider; 63, end support block; 64, clamping claw cylinder; 65, clamping claw; 651, T-type slide; 66, T-type slider; 67, clamping plate; 68, pushing cylinder; 7, laser drill; 8, unloading module. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] See also Figure 1-Figure 7 As shown, the present invention is a laser grooving process for circuit board processing, which includes the following steps:

[0034] S1: The circuit board to be grooved is transported to the groove cutting area 3 through the loading module 2 on the workbench 1, and the circuit board is adsorbed and fixed by the mobile adsorption unit 4 at the groove cutting area 3, and the circuit board is driven down to the waste edge clamping area;

[0035] S2: importing grooving data through the laser grooving system on the workbench 1, and dividing the surface of the circuit board into a plurality of sub-areas to be grooved according to the grooving data;

[0036] S3: driving the scrap edge clamping mechanism 6 to work in the clamping area so as to clamp the scrap edge to the sub-area of ​​the circuit board to be grooved;

[0037] S4: Using the laser grooving system to drive the laser drill 7 to move to the sub-area to be grooved for grooving. After grooving of one sub-area is completed, the laser drill 7 moves to the next sub-area to continue grooving until grooving of multiple sub-areas to be grooved is completed;

[0038] S5: When the circuit board is cut into grooves, the mobile adsorption unit 4 will push the circuit board after cutting grooves to rise to the unloading module 8, and the waste edge after cutting grooves will be separated from the circuit board by the waste edge clamping mechanism 6, and the unloading module 8 will transport the special-shaped circuit board after cutting grooves to the next processing area.

[0039] In this embodiment, a loading module 2 and a unloading module 8 are symmetrically arranged on the upper surface of the workbench 1, and a grooving area 3 is formed between the loading module 2 and the unloading module 8. A mobile adsorption unit 4 is arranged at the grooving area 3 for moving, adsorbing and fixing the circuit board to be cut. A waste edge clamping mechanism 6 is arranged on the front and rear side walls of the grooving area 3. The waste edge clamping mechanism 6 is used to clamp and detach the waste edge generated after the circuit board is grooved. A laser drill head 7 is suspended and supported by a bracket and a mobile unit directly above the grooving area 3.

[0040] Specifically, the loading module 2 will transport the circuit board to be grooved to the groove cutting area 3, and two groups of adsorption components of the mobile adsorption unit 4 will first adsorb and fix the circuit board entering the groove cutting area 3, and then cooperate with the loading module 2 to adsorb and fix the circuit board to the groove cutting area 3, and can also drive the circuit board to drop to the waste edge clamping mechanism 6, so that the waste edge clamping mechanism 6 can clamp the waste edge of the circuit board to be grooved, and then the mobile unit on the bracket will drive the laser drill bit 7 to slide down to the position of the circuit board to be grooved, and then the laser drill bit 7 performs laser cutting on the circuit board to form a cutting groove, and when the cutting of the cutting groove on the circuit board is completed, the laser drill bit 7 rises to the highest position under the drive of the mobile adsorption unit 4, and then the mobile adsorption unit 4 drives the grooved circuit board to rise to be flush with the unloading module 8 of the conveyor belt structure, and when the grooved circuit board is When the circuit board is pushed upward, the waste edge clamping mechanism 6 will clamp and separate the waste edge formed by the cutting groove from the circuit board, and then the mobile adsorption unit 4 will drive the special-shaped circuit board formed after the grooving to enter the unloading module 8, and the separated waste edge will be clamped by the waste clamping mechanism and slide to the waste collection area on the right side of the workbench 1 for waste collection, so that the grooving process of the present invention can not only cut the groove of the circuit board so that it can be quickly processed into a special-shaped circuit board, but also the cooperation of the mobile adsorption unit 4 and the waste edge clamping mechanism 6 can automatically break and separate the waste board formed at the edge of the special-shaped circuit board, without the need for the operator to manually break it off, so that the laser grooving process can not only cut the groove of the circuit board, but also quickly and safely separate the waste edge formed by the cutting groove from the circuit board, thereby realizing fast and safe laser cutting of the special-shaped board.

[0041] In this embodiment, the mobile adsorption unit 4 includes a driving screw 41, a screw nut 42, a guide slider 43, a supporting strip 44, a fixed air pipe 45, a sliding air pipe 46, an adsorption plate 47, a push cylinder 48 and a connecting block 49. The bottom of the groove of the cutting area 3 is provided with a moving guide groove 31 in the horizontal direction, and the driving screw 41 is rotatably installed in the moving guide groove 31. The driving screw 41 is sleeved with a guide slider 43 through the screw nut 42, and the guide slider 43 is slidably arranged in the moving guide groove 31. A supporting strip 44 is fixed on the upper surface of the slider 43, and the supporting strip 44 is horizontally arranged front and back in the groove area 3, a fixed air pipe 45 is symmetrically installed on the supporting strip 44, and a sliding air pipe 46 is sealed and slidably inserted in the fixed air pipe 45, and the bottom outer ring surface of the fixed air pipe 45 is connected to an air guide pipe, and the top of the sliding air pipe 46 is connected to an adsorption plate 47, and a push cylinder 48 is vertically arranged on the other side of the fixed air pipe 45, and the upper end surface of the piston rod of the push cylinder 48 is connected to the sliding air pipe 46 through a connecting block 49;

[0042] Specifically, when the feeding module 2 of the conveyor belt structure conveys the circuit board to be grooved toward the groove cutting area 3, the driving screw 41 will drive at least two supporting strips 44 to slide to the right side of the feeding module 2 through the screw nut 42 and the guide slider 43, so that the symmetrical adsorption plates 47 on the right supporting strip 44 are adsorbed to the lower surface of the circuit board, and then the driving screw 41 drives the right supporting strip 44 to slide to the right, so that it drives the circuit board adsorbed by the adsorption plates 47 to slide to the right and enter the groove cutting area 3. When the circuit board completely enters the groove cutting area 3, the two adjacent fixed air pipes 45 are connected by the air guide hose. At this time, the symmetrical adsorption plates 47 on the left supporting strip 44 will be synchronously adsorbed to the lower surface of the circuit board to achieve the adsorption and fixation of the circuit board, and then the piston rod of the pushing cylinder 48 will contract, so that it drives the sliding through the connecting block 49. The moving air pipe 46 slides downward in the fixed air pipe 45, and then the circuit board will be driven by at least four suction plates 47 to descend to the waste edge clamping mechanism 6, so that the waste edge clamping mechanism 6 can clamp and fix the waste edge to be formed by grooving. When the laser cutting groove of the circuit board is completed, the laser drill head 7 rises to the highest position, and the piston rod of the push cylinder 48 drives the sliding air pipe 46 to extend upward from the fixed air pipe 45 through the connecting block 49, and then the multiple suction plates 47 will drive the adsorbed and fixed and grooved special-shaped circuit boards to move upward to be flush with the unloading module 8 of the conveyor belt structure, and then the driving screw 41 will drive the supporting strip 44 to slide through the guide slider 43, so that the special-shaped circuit board adsorbed by the suction plate 47 will move to the unloading module 8, and then the unloading module 8 will drive the detached special-shaped circuit board to move to the right side of the workbench 1 for transportation and discharge.

[0043] In this embodiment, a separation and movement component 5 is provided on the support strip 44, and the separation and movement component 5 includes a metal ring 51, a magnetic ring 52, a metal block 53, an insulating block 54 and a magnetic block. A rotating cavity is opened inside the guide slider 43, and the outer ring surface of the lead screw nut 42 is insulatedly sleeved with a metal ring 51, and the metal ring 51 is located in the rotating cavity. The cavity wall of the rotating cavity is insulatedly provided with a magnetic ring 52, and the magnetic ring 52 is sleeved on the metal ring 51. The front and rear side walls of the groove area 3 are installed with multiple metal blocks 53 along the length direction thereof, and the multiple metal blocks 53 are connected to each other through the insulating block 54 to form a metal strip. The front and rear ends of the support strip 44 are insulated with magnetic blocks, and the magnetic blocks are in contact with the outer side surfaces of the connected metal strips (the magnetic blocks installed at the front and rear ends of the support strip 44 are preferably designed as electromagnets, and have magnetic adsorption force after conduction);

[0044] Specifically, in order to accurately move the circuit board to be grooved to the groove cutting area 3 and perform stable and fast groove cutting, when the driving screw 41 drives at least two supporting strips 44 to slide toward the side of the left loading module 2, the supporting strip 44 on the left side will first approach the loading module 2. Therefore, it is necessary to control the magnetic attraction ring 52 set in the rotating cavity of the left guide slider 43 to lose its magnetic attraction force. Since the magnetic attraction ring 52 is a magnetic attraction force generated by the power supply of multiple electromagnetic blocks installed on the inner ring surface, it is separated from the metal ring 5 on the outer ring surface of the left screw nut 42. 1 is adsorbed and fixed, and the magnetic block at the end of the left support strip 44 is energized with magnetic adsorption force to be adsorbed and fixed to the corresponding metal block 53, so that it can fix the left support strip 44, and the driving screw 41 continues to rotate, through the connection between the right screw nut 42 and the guide slider 43, so that it drives the right support strip 44 to slide to the left and approach the side of the feeding module 2. When the circuit board to be cut moves to the upper surface of the adsorption plate 47, at least two adsorption plates 47 on the right side will first adsorb and fix the circuit board, and the work of the driving screw 41 will The circuit board adsorbed by the adsorption plate 47 is driven by the support strip 44 to move to the right to the groove cutting area 3. When the lower surface of the left end of the circuit board contacts the two adsorption plates 47 on the left, the magnetic attraction ring 52 in the rotating cavity of the left guide slider 43 is energized and has a magnetic attraction force to adsorb to the metal ring 51, so that the lead screw nut 42 will be connected to the guide slider 43, and then the rotation of the lead screw 41 will drive the two support strips 44 to slide synchronously, so that the circuit board on the feeding module 2 can be further accurately adsorbed and fixed to the groove cutting area 3 for groove cutting. After the grooving of the circuit board is completed, the driving screw 41 will drive the circuit board to move to the unloading module 8 through at least two sets of adsorption plates 47. After the support strip 44 on the right side moves to the extreme position, the support strip 44 will be adsorbed and fixed to the left side of the lower mold module, and the corresponding adsorption plate 47 will be separated from the adsorption and fixation of the circuit board. The support strip 44 on the left side will continue to be driven by the driving screw 41 to push the adsorbed and fixed circuit board toward the unloading module 8, so that the special-shaped circuit board with the grooving completed can be stably and safely transported and discharged through the unloading module 8.

[0045] In this embodiment, the separation moving assembly 5 further includes a meshing rack 56, a meshing gear 57, a driving shaft 58 and an I-shaped slider 59. A first moving groove 441 is provided inside the supporting strip 44 along its length direction, and a second moving groove 442 is provided above the first moving groove 441. The width of the first moving groove 441 is greater than the width of the second moving groove 442. The two side walls of the first moving groove 441 are symmetrically fixed with meshing racks 56, and meshing gears 57 are meshed between the symmetrical meshing racks 56. The meshing gears 57 and the meshing racks 56 are meshed with each other. The height of the meshing gear 57 is less than the depth of the first moving groove 441, a driving shaft 58 is vertically installed on the meshing gear 57, and the driving shaft 58 is connected to the output shaft of the servo motor fixed inside the I-shaped slider 59, the I-shaped slider 59 is slidably arranged on the supporting strip 44, the lower horizontal block of the I-shaped slider 59 is slidably arranged in the second moving groove 442, and its vertical block is slidably arranged in the first moving groove 441, and its upper horizontal block is slidably attached to the upper surface of the supporting strip 44, and the upper surface of the upper horizontal block of the I-shaped slider 59 is respectively fixed with a fixed air pipe 45 and a push cylinder 48;

[0046] Specifically, since the groove positions of the circuit boards are different, in order to avoid the symmetrical adsorption plates 47 on the same support strip 44 interfering with the circuit board being grooved when being adsorbed onto the circuit board; therefore, when it is necessary to make the symmetrical adsorption plates 47 move closer to each other, the micro servo motor installed on the I-shaped slider 59 is controlled to work, so that through the mutual engagement of the meshing gear 57 and the meshing rack 56, the adsorption plates 47 above the I-shaped slider 59 are driven to slide closer to each other, thereby reducing the distance between the two adsorption plates 47; at the same time, the micro servo motor inside one of the I-shaped sliders 59 can also be controlled to work separately, so that through the meshing transmission of the meshing gear 57 and the meshing rack 56, one of the I-shaped sliders can be meshed. The I-shaped slider 59 slides toward another I-shaped slider 59 in a fixed state, so as to facilitate adjustment of the horizontal front-to-back position of the symmetrical adsorption plate 47 on the support strip 44, so as to change the position of the adsorption plate 47 to adsorb and fix the circuit board at different positions; and the I-shaped slider 59 is located in the first movable groove 441 and the second movable groove 442, so that it can drive the adsorption plate 47 to slide horizontally front and back above the support strip 44 under the meshing transmission of the meshing gear 57 and the meshing rack 56, and the width of the first movable groove 441 is greater than the width of the second movable groove 442, which is convenient for installing and fixing the meshing rack 56, and also convenient for the meshing transmission of the meshing gear 57 and the symmetrical meshing rack 56.

[0047] In this embodiment, the scrap edge clamping mechanism 6 includes a supporting screw 61, a supporting slider 62, an end support block 63 and a clamping claw cylinder 64. A sliding long groove 32 is opened above the front and rear side walls of the grooving area 3, and the sliding long groove 32 is located below the unloading module 8. The sliding long groove 32 runs through the right side surface of the workbench 1. The supporting screw 61 is rotatably installed in the sliding long groove 32 along its length direction, and the right end of the supporting screw 61 is rotatably installed to the end support block 63 through a bearing. The supporting slider 62 is sleeved on the supporting screw 61 through a screw nut 42, and the supporting slider 62 is slidably set in the sliding long groove 32. The outer end surface of the supporting slider 62 is fixed with a clamping claw cylinder 64, and the clamping claw 65 of the clamping claw cylinder 64 faces the center of the grooving area 3.

[0048] Specifically, when the adsorption plate 47 drives the adsorbed circuit board to drop to the notch of the sliding long groove 32, the support screw 61 will drive the clamping claw cylinder 64 fixed on the end face of the end support block 63 to slide to the edge of the circuit board to be cut through the support slider 62, and then the clamping claws 65 of the clamping claw cylinder 64 are close to each other, so that they can clamp to the waste edge of the circuit board to be cut, so as to clamp and fix the waste edge of the cutting groove, and when the circuit board after the cutting groove moves upward under the adsorption of the adsorption plate 47, the clamped waste edge will be broken off and separated from the cutting groove, and then there is no need for the processing personnel to manually break off the waste edge at the cutting groove, thereby further improving the efficiency of processing special-shaped circuit boards; and at this time, the support screw 61 continues to work, so that it drives the waste edge clamped by the clamping claw cylinder 64 to slide toward the right end of the sliding long groove 32, so as to facilitate the broken waste edge to be separated from the clamping claw 65 of the clamping claw cylinder 64.

[0049] In this embodiment, the scrap edge clamping mechanism 6 also includes a T-shaped slider 66, a clamping plate 67 and a push cylinder 68. The end of the clamping claw 65 is provided with a T-shaped slide groove 651 inwardly, and the T-shaped slider 66 is slidably inserted in the T-shaped slide groove 651. The outer surface of the vertical block of the T-shaped slider 66 is integrally connected with the clamping plate 67. The clamping plate 67 is slidably fitted on the corresponding surface of the clamping claw 65. The bottom of the T-shaped slide groove 651 is horizontally fixed with a push cylinder 68, and the piston rod of the push cylinder 68 is connected to the inner end surface of the T-shaped slider 66.

[0050] Specifically, in order to facilitate the clamping claw 65 of the clamping claw cylinder 64 to stably clamp the cutting edge of the circuit board, therefore, when the circuit board is lowered to align with the notch of the sliding long groove 32, the piston rod of the push cylinder 68 located in the T-shaped slide groove 651 is extended, so that it pushes the T-shaped slide block 66 to extend from the T-shaped slide groove 651 of the clamping claw 65, thereby facilitating the clamping plate 67 symmetrical up and down to stably clamp the waste edge of the circuit board. At the same time, the T-shaped slide block can be adjusted according to the width of the waste edge cutting. The extended length of 66 makes it convenient to clamp and fix the waste edges of different lengths after different grooving. When the broken waste edges move to the notch of the sliding long groove 32, the symmetrical clamping claws 65 drive the clamping plates 67 to disengage from the clamping of the waste edges, and then the T-shaped slider 66 is driven by the piston rod of the push cylinder 68 to retract into the T-shaped slide groove 651, so as to facilitate the clamping and fixing of the waste edges of the next circuit board to be grooved, and will not affect the normal descent of the circuit board to be aligned with the sliding long groove 32.

[0051] In this embodiment, the loading module 2 and the unloading module 8 are both made of a conveyor belt structure.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0053] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A laser grooving process for circuit board processing, characterized in that: The process includes the following steps: S1: The circuit board to be grooved is transported to the groove cutting area (3) through the loading module (2) on the workbench (1), the circuit board is adsorbed and fixed by the mobile adsorption unit (4) at the groove cutting area (3), and the circuit board is driven down to the waste edge clamping area; S2: importing grooving data through a laser grooving system on a workbench (1), and dividing the surface of the circuit board into a plurality of sub-areas to be grooved according to the grooving data; S3: driving the scrap edge clamping mechanism (6) to work in the clamping area so as to clamp the scrap edge to the sub-area of ​​the circuit board to be grooved; S4: using the laser grooving system to drive the laser drill head (7) to move to the sub-region to be grooved to perform grooving. After grooving of one sub-region is completed, the laser drill head (7) moves to the next sub-region to continue grooving until grooving of multiple sub-regions to be grooved is completed; S5: When the circuit board is slotted, the mobile adsorption unit (4) pushes the slotted circuit board to rise to the unloading module (8), and the waste edge after the slotting is separated from the circuit board by the waste edge clamping mechanism (6). The unloading module (8) transports the slotted special-shaped circuit board to the next processing area; The upper surface of the workbench (1) is symmetrically provided with a loading module (2) and a unloading module (8), and a grooving area (3) is formed between the loading module (2) and the unloading module (8). A movable adsorption unit (4) is provided at the grooving area (3) for moving, adsorbing and fixing the circuit board to be cut. The front and rear side walls of the grooving area (3) are provided with a waste edge clamping mechanism (6), and the waste edge clamping mechanism (6) is used to clamp and detach the waste edge generated after the grooving of the circuit board. A laser drill head (7) is suspended and supported by a bracket and a movable unit directly above the grooving area (3). The movable adsorption unit (4) comprises a driving screw (41), a screw nut (42), a guide slider (43), a support strip (44), and a support bar (45). ), a fixed air pipe (45), a sliding air pipe (46), an adsorption plate (47), a push cylinder (48) and a connecting block (49); a movable guide groove (31) is provided in the horizontal direction of the groove bottom of the groove area (3); a driving screw (41) is rotatably installed in the movable guide groove (31); a guide slider (43) is sleeved on the driving screw (41) through a screw nut (42), and the guide slider (43) is slidably arranged in the movable guide groove (31); a supporting strip (44) is fixed on the upper surface of the guide slider (43), and the supporting strip (44) is horizontally arranged front and back in the groove area (3); a fixed air pipe (45) is symmetrically installed on the supporting strip (44), and a sealing sliding plug is inserted in the fixed air pipe (45). A sliding air pipe (46) is provided, and the bottom outer ring surface of the fixed air pipe (45) is connected to an air guide pipe, the top of the sliding air pipe (46) is connected to an adsorption plate (47), a push cylinder (48) is vertically arranged on the other side of the fixed air pipe (45), and the upper end surface of the piston rod of the push cylinder (48) is connected to the sliding air pipe (46) through a connecting block (49), a separation moving component (5) is arranged on the supporting strip (44), and the separation moving component (5) includes a metal ring (51), a magnetic attraction ring (52), a metal block (53), an insulating block (54) and a magnetic attraction block (55), a rotating cavity is opened inside the guide slider (43), the outer ring surface of the lead screw nut (42) is insulatedly sleeved with a metal ring (51), and the metal ring (51) is located in the rotating cavity, the cavity wall of the rotating cavity is insulated and provided with a magnetic attraction ring (52), the magnetic attraction ring (52) is sleeved on the metal ring (51), the front and rear side walls of the cutting groove area (3) are installed with a plurality of metal blocks (53) along the length direction thereof, and the plurality of metal blocks (53) are connected to each other through insulating blocks (54) to form a metal strip, the front and rear ends of the supporting strip (44) are insulated and provided with magnetic attraction blocks (55), and the magnetic attraction blocks (55) are in contact with the outer side surface of the connected metal strip, the separating moving component (5) further comprises a meshing rack (56), a meshing gear (57), a driving shaft (58) and an I-shaped slider (59), the interior of the supporting strip (44) is provided with a first moving groove (441) along the length direction thereof,A second moving groove (442) is formed above the first moving groove (441), the width of the first moving groove (441) is greater than the width of the second moving groove (442), meshing racks (56) are symmetrically fixed to the cavity walls on both sides of the first moving groove (441), a meshing gear (57) is meshed between the symmetrical meshing racks (56), the height of the meshing gear (57) and the meshing rack (56) is less than the groove depth of the first moving groove (441), and a driving shaft (58) is vertically mounted on the meshing gear (57). , and the drive shaft (58) is connected to the output shaft of the servo motor fixed inside the I-shaped slider (59), the I-shaped slider (59) is slidably arranged on the supporting strip (44), the lower horizontal block of the I-shaped slider (59) is slidably arranged in the second moving groove (442), and the vertical block thereof is slidably arranged in the first moving groove (441), and the upper horizontal block thereof is slidably fitted to the upper surface of the supporting strip (44), and the upper surface of the upper horizontal block of the I-shaped slider (59) is respectively fixed with a fixed air pipe (45) and a push cylinder (48). , 2. A laser grooving process for circuit board processing according to claim 1, characterized in that: The scrap edge clamping mechanism (6) comprises a supporting screw (61), a supporting slider (62), an end support block (63) and a clamping claw cylinder (64). A sliding long groove (32) is provided above the front and rear side walls of the cutting groove area (3), and the sliding long groove (32) is located below the unloading module (8). The sliding long groove (32) passes through the right side surface of the workbench (1). A supporting screw (61) is rotatably installed in the sliding long groove (32) along its length direction, and the right end of the supporting screw (61) is rotatably installed on the end support block (63) through a bearing. A supporting slider (62) is sleeved on the supporting screw (61) through a screw nut (42), and the supporting slider (62) is slidably arranged in the sliding long groove (32). A clamping claw cylinder (64) is fixed to the outer end surface of the supporting slider (62), and the clamping claw (65) of the clamping claw cylinder (64) faces the center of the cutting groove area (3).

3. A laser grooving process for circuit board processing according to claim 2, characterized in that: The scrap edge clamping mechanism (6) further comprises a T-shaped slider (66), a clamping plate (67) and a push cylinder (68); a T-shaped slide groove (651) is provided inwardly at the end of the clamping claw (65), and a T-shaped slider (66) is slidably inserted in the T-shaped slide groove (651); a clamping plate (67) is integrally connected to the lower surface of the vertical block of the T-shaped slider (66); the clamping plate (67) is slidably fitted on the corresponding surface of the clamping claw (65); a push cylinder (68) is horizontally fixed to the bottom of the T-shaped slide groove (651), and a piston rod of the push cylinder (68) is connected to the inner end surface of the T-shaped slider (66).

4. The laser grooving process for circuit board processing according to claim 1, characterized in that: The loading module (2) and the unloading module (8) are both made of a conveyor belt structure.

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