A packaging welding structure for semiconductor devices

Abstract

The present invention discloses a semiconductor device packaging welding structure, belonging to the field of semiconductor welding technology. The semiconductor device packaging welding structure includes a welding machine, wherein a stage is provided in the welding machine, an empty slot is provided on the top of the stage, two center rods are fixedly connected to the side wall of the empty slot, a carrier plate is rotatably connected outside the center rod, the top surface of one of the carrier plates is flush with the top wall of the stage, which is a high-position carrier plate, and the height of the other carrier plate is lower than the height of the carrier plate, a servo motor is provided at the bottom of the empty slot, the other end of the rotating shaft is rotatably connected to the side wall of the empty slot, a moving block is threadedly connected on the threaded slot, and a tilting mechanism for driving the carrier plate is provided between the moving block and the carrier plate. The present invention achieves the effect of quickly transferring the welded semiconductor chip by providing two controllable rotating carrier plates in the stage, thereby improving the welding efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor welding, and in particular relates to a packaging welding structure of a semiconductor device. Background Art

[0002] The semiconductor manufacturing process consists of wafer manufacturing, wafer testing, chip packaging, testing and the subsequent warehousing of finished products. In the chip packaging process, when the wafer processing is completed and tested, the wafer needs to be cut into small chips according to demand, and then the cut chips are attached to the corresponding substrate and the pins are welded, and then packaged. A very important process flow in the semiconductor packaging process is the wire bonding packaging technology, which uses solder and wire bonding machine platforms to weld the bonding wires to the chip electrodes and the bracket functional areas respectively, interconnecting the two to form a conductive path, and complete the connection of the internal and external leads.

[0003] During the welding process, pressurization and heating are mostly used to make the lead come into close contact with the surface to be welded to form a solder joint for the purpose of bonding. After welding, the semiconductor chip placed on the stage will be taken out by the robotic arm that placed it on the stage. The same robotic arm must both place and take out the chip. Due to the range of motion of the robotic arm, the position of the chip before welding is closer to the position of the chip after welding. In addition, the welding time of the semiconductor chip needs to be affected by the operating speed of the robotic arm. The entire action of placing and taking out the semiconductor chip by the same robotic arm will affect the continuous welding efficiency of the semiconductor chip. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the prior art and provide a packaging welding structure for a semiconductor device.

[0005] The technical solution adopted to solve the above technical problems is:

[0006] A packaging welding structure for semiconductor devices includes a welding machine, wherein a stage is provided in the welding machine, a hollow slot is provided on the top of the stage, two center rods are fixedly connected to the side walls of the hollow slot, a carrier is rotatably connected to the outside of the center rods, a top surface of one of the carriers is flush with the top wall of the stage, which is a high-position carrier, and a height of the other carrier is lower than that of the carrier, which is a low-position carrier, a servo motor is installed at the bottom of the hollow slot, a rotating shaft is fixedly connected to the output end of the servo motor, the other end of the rotating shaft is rotatably connected to the side wall of the hollow slot, a threaded slot is provided on the rotating shaft, a moving block is threadedly connected to the threaded slot, and a tilting mechanism for driving the carrier is jointly installed between the moving block and the carrier.

[0007] Furthermore, the center rod passes through the middle position of the loading plate, the bottom walls at both ends of the loading plate are rotatably connected with U-shaped rods respectively, the two ends of the U-shaped rod are rotatably connected to the bottom wall of the loading plate, and a connecting rod is connected between the two U-shaped rods at both ends of the loading platform.

[0008] Furthermore, the tilting mechanism includes a moving ring, a linkage rod, two support rods and four wedge blocks. The moving ring is sleeved on the rotating shaft, and the moving ring is movably sleeved with the rotating shaft. The two support rods are respectively fixedly connected to the top wall of the moving ring and the top wall of the moving block. The linkage rod is fixedly connected between the two support rods. The four wedge blocks are respectively arranged on the bottom walls of the two connecting rods. Each of the bottom walls of the connecting rods is provided with two wedge blocks. The lower ends of the two wedge blocks are placed opposite to each other. One end of the support rod is slidably connected to the bottom wall of the connecting rod, and the support rod is located between the two wedge blocks.

[0009] Furthermore, vertical grooves are respectively provided on the side walls on both sides of the empty groove, vertical rods are slidably connected in the vertical grooves, and a top block is fixedly connected to the two side walls of the vertical rods. The top wall of the top block is sloped, and the high end of the top block is located near one end of the high-position loading board. A lifting plate is fixedly connected to the side wall of the top block, and the bottom wall of one end of the lifting plate is against the top wall of the U-shaped rod at the position of the low-position loading board, and a driving mechanism for driving the top block is installed at the other end of the lifting plate.

[0010] Furthermore, the driving mechanism includes a pushing rod, a moving plate, two oblique rods and a plurality of telescopic springs, the pushing rod is fixedly connected to the bottom wall of the moving block, the moving plate is slidably connected to the bottom wall of the empty slot, the side wall of the pushing rod is abutted against the side wall of the moving plate, the two oblique rods are respectively rotatably connected to the top wall of the moving plate, the two oblique rods are respectively rotatably connected to the bottom wall of the lifting plate away from the end of the U-shaped rod away from the moving plate, the bottom wall of the empty slot is fixedly connected with a vertical plate, one end of the plurality of telescopic springs are respectively fixedly connected to the side walls of the vertical plate, and the other ends are commonly fixedly connected to the side wall of the moving plate away from the pushing rod.

[0011] Furthermore, two sliding rods are fixedly connected to the bottom wall of the moving plate, and two sliding grooves are provided on the bottom wall of the hollow groove, and the two sliding rods are slidably connected to the inner walls of the two sliding grooves respectively.

[0012] Furthermore, the servo motor is located below the low-position loading plate, and the depth of the empty slot is greater than the length of the low-position loading plate.

[0013] Through the above technical solution, the beneficial effects of the present invention are as follows:

[0014] (1) The present invention provides an empty slot and two carriers of different heights in the carrier table, and a tilting mechanism for driving the two carriers is provided at the bottom of the empty slot. After the semiconductor chip on the high-position carrier is welded, the two carriers can be tilted synchronously, so that the semiconductor chip slides onto the low-position carrier. The carrier is controlled to return to its original position, and the semiconductor chip on the low-position carrier is removed by a mechanical arm, and another mechanical arm places a new semiconductor chip on the high-position carrier, thereby improving the overall welding efficiency.

[0015] (2) The present invention sets a top block and a vertical rod between the high-position carrier plate and the low-position carrier plate. When the two carrier plates are tilted, the position of the top block is raised to fill the gap in the middle position after the two carrier plates are tilted, so that the semiconductor chip can slide between the two carrier plates more smoothly, ensuring that the semiconductor chip will not slide into the empty slot. In addition, the top block can be raised and lowered together with the movement of the carrier plate. When the carrier plate returns to the horizontal position, the top block can also return to the original position to avoid affecting the robot arm to take away or place the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a connection schematic diagram of the stage in the present invention;

[0018] Figure 3 is a cross-sectional view of the stage of the present invention;

[0019] Figure 4 yes Figure 3 A partial enlarged view of part A;

[0020] Figure 5 It is a schematic diagram of the structural connection between the moving plate and the bottom of the empty slot in the present invention.

[0021] Figure numerals: 1, welding machine; 2, loading platform; 3, empty slot; 4, center rod; 5, loading plate; 6, servo motor; 7, rotating shaft; 8, threaded groove; 9, moving block; 10, U-shaped rod; 11, moving ring; 12, linkage rod; 13, supporting rod; 14, wedge block; 15, vertical slot; 16, vertical rod; 17, top block; 18, lifting plate; 19, pushing rod; 20, moving plate; 21, inclined rod; 22, telescopic spring; 23, vertical plate; 24, sliding rod; 25, sliding groove; 26, connecting rod. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] like Figure 1 - Figure 5 As shown, the present embodiment provides a packaging welding structure of a semiconductor device, including a welding machine 1, wherein a stage 2 is arranged in the welding machine 1, a hollow groove 3 is opened on the top of the stage 2, two center rods 4 are fixedly connected to the side walls of the hollow groove 3, and a carrier plate 5 is rotatably connected outside the center rod 4, wherein the top surface of one of the carrier plates 5 is flush with the top wall of the stage 2, which is a high-position carrier plate 5, and the height of the other carrier plate 5 is lower than the height of this carrier plate 5, which is a low-position carrier plate 5, and the sizes of the two carrier plates 5 are exactly the same, and the servo motor 6 is located below the low-position carrier plate 5, the depth of the hollow groove 3 is greater than the length of the low-position carrier plate 5, and when the low-position carrier plate 5 is tilted, it will not collide with the servo motor 6 or the side walls of the hollow groove 3. The center rod 4 passes through the middle position of the loading plate 5, and the bottom walls at both ends of the loading plate 5 are rotatably connected with U-shaped rods 10 respectively. The two ends of the U-shaped rod 10 are rotatably connected to the bottom wall of the loading plate 5. A connecting rod 26 is connected between the two U-shaped rods 10 located at both ends of the loading platform 2. There will be a height difference between the two U-shaped rods 10 after the loading plate 5 is tilted, and the connecting rod 26 can connect the two U-shaped rods 10 together.

[0024] The side walls of the empty slot 3 are provided with vertical slots 15, and the vertical slots 15 are slidably connected with vertical rods 16. The cooperation between the vertical rods 16 and the vertical slots 15 makes the rise of the top block 17 more stable. The side walls of the two vertical rods 16 are fixedly connected with the top block 17. The top wall of the top block 17 is sloped. The high end of the top block 17 is located near one end of the high-position loading board 5. After the two loading boards 5 are tilted, the top block 17 can fill the gap between the two, thereby making the sliding process of the semiconductor chip safer. The side wall of the top block 17 is fixedly connected with a lifting plate 18.

[0025] A servo motor 6 is installed at the bottom of the empty slot 3, and a rotating shaft 7 is fixedly connected to the output end of the servo motor 6. The other end of the rotating shaft 7 is rotatably connected to the side wall of the empty slot 3. A threaded groove 8 is opened on the rotating shaft 7, and a moving block 9 is threadedly connected to the threaded groove 8. The moving block 9 has the same size as the moving ring 11 mentioned below. The difference is that the moving block 9 is threadedly connected to the threaded groove 8, while the moving ring 11 is movably sleeved on the rotating shaft 7.

[0026] A tilting mechanism for driving the loading plate 5 is commonly arranged between the moving block 9 and the loading plate 5, and the tilting mechanism includes a moving ring 11, a linkage rod 12, two support rods 13 and four wedge blocks 14. The moving ring 11 is sleeved on the rotating shaft 7, and the moving ring 11 is movably sleeved with the rotating shaft 7. The two support rods 13 are respectively fixedly connected to the top wall of the moving ring 11 and the top wall of the moving block 9, and the linkage rod 12 is fixedly connected between the two support rods 13. The four wedge blocks 14 are respectively arranged on the bottom walls of the two connecting rods 26, and each of the connecting rods 26 is provided with two wedge blocks 14 on the bottom wall. The lower ends of the two wedge blocks 14 are placed opposite to each other, and one end of the support rod 13 is slidably connected to the bottom wall of the connecting rod 26. The support rod 13 is located between the two wedge blocks 14, and the bottom of the connecting rod 26 and the lower end of the wedge block 14 can slide normally, so the support rod 13 can move directly from the bottom of the connecting rod 26 to the wedge block 14.

[0027] The bottom wall of one end of the lifting plate 18 is against the top wall of the U-shaped rod 10 at the position of the low-position loading plate 5. The other end of the lifting plate 18 is provided with a driving mechanism for driving the top block 17. The driving mechanism includes a pushing rod 19, a moving plate 20, two inclined rods 21 and a plurality of telescopic springs 22. The pushing rod 19 is fixedly connected to the bottom wall of the moving block 9. The moving plate 20 is slidably connected to the bottom wall of the empty slot 3. Two sliding rods 24 are fixedly connected to the bottom wall of the moving plate 20. Two sliding slots 25 are provided on the bottom wall of the empty slot 3. The two sliding rods 24 are slidably connected to the inner walls of the two sliding slots 25 respectively. The setting of the sliding rod 24 and the sliding slot 25 enables the moving plate 20 to slide stably along the direction of the sliding slot 25, thereby facilitating the lifting of the top block 17.

[0028] The side wall of the pushing rod 19 is against the side wall of the moving plate 20, and the two inclined rods 21 are rotatably connected to the top wall of the moving plate 20 respectively. The two inclined rods 21 are rotatably connected to the bottom wall of the lifting plate 18 away from the U-shaped rod 10 at one end away from the moving plate 20 respectively. The bottom wall of the empty slot 3 is fixedly connected with a vertical plate 23, and one end of a plurality of telescopic springs 22 is fixedly connected to the side wall of the vertical plate 23 respectively, and the other end is fixedly connected to the side wall of the moving plate 20 away from the pushing rod 19. The force applied to the moving plate 20 by the telescopic springs 22 will keep the moving plate 20 in contact with the pushing rod 19, and the moving plate 20 will always resist the side wall of the pushing rod 19.

[0029] The working principle of this embodiment is as follows: in the initial state, both carriers 5 are in a horizontal state, and both mechanical arms are in a standby state. First, a mechanical arm places the semiconductor chip to be welded on the high-position carrier 5, and then after welding by the welding machine 1, the servo motor 6 is started, and the rotation of the rotating shaft 7 causes the thread groove 8 to rotate at the same time, and the moving block 9 arranged on the thread groove 8 will move along the thread groove 8 in a direction away from the servo motor 6, thereby causing the support rod 13 on the top of the moving block 9 to drive the linkage rod 12 and the other support rod 13 to move synchronously, and the two support rods 13 move along the wedge block 14 at the same time, which will cause the two carriers 5 to rotate around the center rod 4 at the same time, and the inclination of the carrier 5 will cause the semiconductor chip to slide from the high-position carrier 5 to the low-position carrier 5;

[0030] At the same time, the inclination of the low-position loading plate 5 will drive the lifting plate 18 to move. The movement of the moving block 9 will cause the pushing rod 19 at the bottom of the moving block 9 to push the moving plate 20. When the moving plate 20 compresses the telescopic spring 22, the inclined rod 21 will gradually become vertical, thereby causing both ends of the lifting plate 18 to be subjected to an upward force. At this time, the lifting plate 18 will drive the top block 17 to rise along the direction of the vertical groove 15, and the top block 17 at the top of the slope will fill the gap between the two loading plates 5, making the sliding of the semiconductor chip safer and more stable. After the semiconductor chip slides onto the low-position loading plate 5, the servo motor 6 can be driven in reverse to make the two loading plates 5 return to a horizontal position, and the robotic arm can take out the semiconductor chip that has been welded on the low-position loading plate 5.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A semiconductor device packaging welding structure, comprising a welding machine (1), wherein the welding machine (1) is provided with a stage (2), characterized in that: The top of the loading platform (2) is provided with an empty slot (3), and the side walls of the empty slot (3) are fixedly connected with two center rods (4), and a loading plate (5) is rotatably connected to the outside of the center rod (4), wherein the top surface of one of the loading plates (5) is flush with the top wall of the loading platform (2), and this is a high-position loading plate (5), and the height of the other loading plate (5) is lower than the height of this loading plate (5), and this is a low-position loading plate (5). A servo motor (6) is arranged at the bottom of the empty slot (3), and the output end of the servo motor (6) is fixedly connected with a rotating shaft (7), and the other end of the rotating shaft (7) is rotatably connected with the side wall of the empty slot (3), and a threaded slot (8) is provided on the rotating shaft (7), and a moving block (9) is threadedly connected to the threaded slot (8), and a tilting mechanism for driving the loading plate (5) is arranged between the moving block (9) and the loading plate (5).

2. The semiconductor device packaging welding structure according to claim 1, characterized in that: The central rod (4) passes through the middle position of the loading plate (5), and the bottom walls at both ends of the loading plate (5) are rotatably connected to U-shaped rods (10), and the two ends of the U-shaped rod (10) are rotatably connected to the bottom wall of the loading plate (5), and a connecting rod (26) is connected between the two U-shaped rods (10) located at the two ends of the loading platform (2).

3. The semiconductor device packaging welding structure according to claim 2, characterized in that: The tilting mechanism comprises a moving ring (11), a linkage rod (12), two support rods (13) and four wedge blocks (14); the moving ring (11) is sleeved on the rotating shaft (7); the moving ring (11) is movably sleeved with the rotating shaft (7); the two support rods (13) are respectively fixedly connected to the top wall of the moving ring (11) and the top wall of the moving block (9); the linkage rod (12) is fixedly connected between the two support rods (13); the four wedge blocks (14) are respectively arranged on the bottom walls of two connecting rods (26); each bottom wall of the connecting rod (26) is provided with two wedge blocks (14); the lower ends of the two wedge blocks (14) are placed opposite to each other; one end of the support rod (13) is slidably connected to the bottom wall of the connecting rod (26); the support rod (13) is located between the two wedge blocks (14).

4. The semiconductor device packaging welding structure according to claim 1, characterized in that: The side walls of both sides of the empty slot (3) are respectively provided with vertical slots (15), a vertical rod (16) is slidably connected in the vertical slot (15), and a top block (17) is fixedly connected to the side walls of the two vertical rods (16), the top wall of the top block (17) is sloped, the high end of the top block (17) is located close to one end of the high-position loading board (5), and a lifting plate (18) is fixedly connected to the side wall of the top block (17), the bottom wall of one end of the lifting plate (18) abuts against the top wall of the U-shaped rod (10) at the position of the low-position loading board (5), and a driving mechanism for driving the top block (17) is arranged at the other end of the lifting plate (18).

5. The semiconductor device packaging welding structure according to claim 4, characterized in that: The driving mechanism comprises a pushing rod (19), a moving plate (20), two inclined rods (21) and a plurality of telescopic springs (22); the pushing rod (19) is fixedly connected to the bottom wall of the moving block (9); the moving plate (20) is slidably connected to the bottom wall of the empty slot (3); the side wall of the pushing rod (19) abuts against the side wall of the moving plate (20); the two inclined rods (21) are respectively rotatably connected to the top wall of the moving plate (20); the ends of the two inclined rods (21) away from the moving plate (20) are respectively rotatably connected to the bottom wall of the lifting plate (18) away from the U-shaped rod (10); the bottom wall of the empty slot (3) is fixedly connected with a vertical plate (23); one end of the plurality of telescopic springs (22) is respectively fixedly connected to the side wall of the vertical plate (23), and the other end is commonly fixedly connected to the side wall of the moving plate (20) away from the pushing rod (19).

6. The semiconductor device packaging welding structure according to claim 5, characterized in that: The bottom wall of the moving plate (20) is fixedly connected with two sliding rods (24), the bottom wall of the empty slot (3) is provided with two sliding slots (25), and the two sliding rods (24) are respectively slidably connected with the inner walls of the two sliding slots (25).

7. The semiconductor device packaging welding structure according to claim 1, characterized in that: The servo motor (6) is located below the low-position loading plate (5), and the depth of the empty slot (3) is greater than the length of the low-position loading plate (5).

Images