A wafer buffer positioning bracket for a spin coater / developer

Abstract

The present invention discloses a wafer buffer positioning bracket for a coating and developing machine, which includes a support plate, a pneumatic suction cup assembly and a limiting mechanism. An active support plate is provided in the middle of the top end of the support plate body of the pneumatic suction cup assembly. The bottom of the active support plate is controlled to lift through a support plate lifting control assembly. And multiple groups of limiting devices are provided on the annular gear plate of the limiting mechanism. The placement position of the wafer is restricted by the buffer plates of the active limiting assembly. The buffer plates are inclined. The limiting diameter between the buffer plates of multiple limiting devices gradually decreases from top to bottom. The wafer is supported by the active support plate. The active support plate moves downward and at the same time controls the rotation of the active support plate. The position of the wafer is adjusted by the buffer plates in a vibrating manner, and the fixed position of the wafer is corrected and positioned. The wafer is fixed by using a suction cup method, and the fixed position of the wafer is positioned to avoid damaging the wafer by using a clamping method.

Description

Technical Field

[0001] The present invention relates to the field related to a spin coater and developer, and specifically to a wafer buffer type positioning bracket for a spin coater and developer. Background Art

[0002] A developer is a printing processing device that can complete some or all of the processes of developing, rinsing, coating, drying, etc. for a pre-exposed printing plate through semi-automatic and fully automatic procedures. It generally consists of a transmission system, a developing system, a rinsing system, a drying system, a program control system, etc. It mainly performs a series of batch processing on wafers. A wafer is a carrier used in the production of integrated circuits. Generally, a wafer refers to a single crystal silicon wafer. The wafer is driven by a positioning bracket to be transferred in each process;

[0003] Currently, the publicly disclosed CN217468378U discloses "A semiconductor wafer carrying and positioning device". A clamping space is formed between two clamping plates and clamping blocks, and the distance between the two clamping plates and the two clamping blocks can be adjusted according to the diameter of the wafer, so as to clamp and position the wafer. First, place the wafer in the center of the carrier seat, drive the rotating disk to make the two clamping plates clamp the wafer from two directions, and then operate the handle to make the clamping blocks clamp the wafer from the other two directions. When the rubber layers of the clamping blocks and the clamping plates are in contact with the wafer, fix the position of the rotating disk through the fastening bolts, thereby completing the positioning of the wafer;

[0004] Currently, when a wafer is moved, a manipulator equipped with an electrostatic chuck is generally used. The wafer is adsorbed by the electrostatic chuck, and the wafer is moved by the manipulator and placed on the bracket. Generally, a vacuum chuck is used on the bracket to adsorb and fix the wafer, but it is not convenient to position and correct the fixed position of the wafer;

[0005] Although the above-mentioned semiconductor wafer carrying and positioning device realizes the positioning and correction of the wafer through the bracket, as a high-precision product, the wafer is easily damaged by the clamping method. Summary of the Invention

[0006] Therefore, in order to solve the above deficiencies, the present invention provides a wafer buffer type positioning bracket for a spin coater and developer here.

[0007] The present invention is realized in this way. A wafer buffer type positioning bracket for a spin coater and developer is constructed. The device includes a tray, a pneumatic chuck assembly, and a limiting mechanism. The pneumatic chuck assembly is installed in the middle of the tray. A limiting mechanism is provided at the top edge of the pneumatic chuck assembly, and the bottom end of the limiting mechanism is connected to the tray;

[0008] The pneumatic suction cup is used for fixing and rotating control of the wafer. The pneumatic suction cup includes a support disk, a first bearing, a gear ring, a first gear, a first motor, a movable support disk, a vertical rod, and a support disk lifting control component. The bottom of the outer wall of the support disk is rotatably connected to a support plate through the first bearing. A gear ring is sleeved in the middle of the outer wall of the support disk. The outer wall of the gear ring meshes with the first gear. The output shaft of the first motor is drivingly connected to the center of the first gear, and the first motor is fixed to the bottom end of the support plate. A movable support disk is arranged in the middle of the top end of the support disk. Vertical rods are fixed to the left and right sides of the bottom end of the movable support disk. The bottom ends of the vertical rods penetrate through the support disk and are connected to the support disk lifting control component;

[0009] The limiting mechanism includes an annular gear disk, an inner support bearing, an outer support bearing, a driving tooth, a worm gear, a worm gear assembly, and a limiting device. The inner wall and the bottom of the outer wall of the annular gear disk are rotatably connected to the support plate through the inner support bearing and the outer support bearing respectively. A driving tooth is arranged on the top surface of the annular gear disk. A worm gear is sleeved on the top of the outer wall of the annular gear disk. The worm gear assembly is arranged at the edge of the worm gear and is drivingly connected to the worm gear. More than three sets of limiting devices are provided and are evenly arranged around the center of the annular gear disk. The limiting devices are sleeved outside the annular gear disk and the limiting devices mesh with the driving teeth on the top of the annular gear disk;

[0010] The support plate lifting control component is used to control the lifting of the movable support disk. The movable support disk is used to support the wafer. The worm gear assembly is used to control the rotation of the worm gear and the annular gear disk. The rotation of the annular gear disk is used to control the telescopic movement of the movable limiting component of the limiting device. The movable limiting component is used to limit the position of the wafer. More than three sets of movable limiting components perform centering positioning on the wafer.

[0011] Preferably, the limiting device includes a support shell, a second gear, a screw rod, a movable tube, a movable limiting component, a straight rod, and a displacement sensor. A second gear is arranged in the middle of the support shell. A screw rod penetrates through the center of the second gear, and the gear is drivingly connected to the screw rod. The right end of the screw rod extends out of the support shell and is threadedly connected to the inner wall of the movable tube. The right end of the movable tube is fixedly connected to the movable limiting component. The top of the left end of the movable limiting component is fixedly connected to the straight rod. The left end of the straight rod is connected to the displacement sensor, and the displacement sensor is fixed to the inner top of the support shell. The support shell is sleeved outside the annular gear disk and the support shell does not contact the annular gear disk. The bottom end of the support shell is fixedly connected to the support plate. The bottom end of the second gear meshes with the driving teeth on the top of the annular gear disk.

[0012] Preferably, the movable limit assembly includes a movable housing, a movable inclined plate, a limit rod, a partition plate, a magnetic plate, an electromagnet, a reciprocating mechanism, a buffer plate, a connecting rod, a vertical plate and a tension spring. A movable inclined plate is arranged on the right side of the movable housing. Limit rods are fixed on both the upper and lower sides of the left end of the movable inclined plate. A partition plate is vertically fixed in the middle of the movable housing. The left end of the limit rod extends into the movable housing and penetrates through the partition plate. The magnetic plate is fixed on the left side between the two limit rods. An electromagnet is arranged on the left side of the magnetic plate and is fixed on the inner left side wall of the movable housing. The middle of the left end of the movable inclined plate is connected to the reciprocating mechanism. A buffer plate is arranged on the right side of the movable inclined plate. Connecting rods are fixed on both the upper and lower sides of the left end of the buffer plate. The left end of the connecting rod penetrates through the movable inclined plate and is fixedly connected to the vertical plate. The vertical plate is arranged at the edge of the left end of the movable inclined plate, and the right end of the vertical plate is elastically connected to the movable inclined plate through a tension spring. The upper and lower sides of the left end of the movable housing are respectively fixedly connected to a straight rod and a movable tube.

[0013] Preferably, the reciprocating mechanism includes a motor three, a rotating rod, a connecting rod and a connecting piece. The output shaft at the bottom end of the motor three is in transmission connection with one end of the rotating rod. The other end of the rotating rod is rotatably connected to the left end of the connecting rod through a rotating shaft. The right end of the connecting rod is rotatably connected to the connecting piece through a rotating shaft. The connecting piece is fixedly connected to the middle of the left end of the movable inclined plate. The motor three is fixedly connected to the partition plate.

[0014] Preferably, the worm assembly includes a motor two, a gearbox, a worm and a support block. The output shaft at the front end of the motor two is in transmission connection with the worm through a gear set in the gearbox, and the rear end of the worm is rotatably connected to the support block through a bearing. The worm meshes with the worm gear. The bottom ends of the gearbox and the support block are both fixedly connected to the support plate.

[0015] Preferably, the support disc includes a support disc body, a groove, a suction hole and a limit tube. A groove is formed in the middle of the top end of the support disc body. Suction holes are arranged on the top surface of the support disc. Limit tubes are fixedly connected to both the left and right sides in the middle of the support disc body, and a vertical rod vertically penetrates through the limit tubes. The bottom of the outer wall of the support disc body is connected to a bearing one. A toothed ring is fixedly connected to the middle of the outer wall of the support disc body.

[0016] Preferably, the inner wall of the groove fits with the movable support disc. Air holes are formed at the edges of the top and bottom end faces of the movable support disc. A suction hole is formed at the edge of the bottom end inside the groove, and the suction hole at the edge of the bottom end inside the groove is vertically aligned with the air hole at the edge of the bottom end of the movable support disc.

[0017] Preferably, the support plate lifting control assembly includes a rotating plate, a movable ring, a vertical pipe, a second bearing, a movable frame, a sliding groove, a connecting air pipe, an air pump, and an electric push rod. The middle part of the inner side of the rotating plate is penetrated by the movable ring, and the movable ring is fixedly connected to the rotating plate. The vertical pipe vertically penetrates the movable ring, and the bottom end of the vertical pipe is connected to the center of the bottom end of the support plate body. The outer wall of the rotating plate is fixedly connected to the second bearing, and the outer wall of the second bearing is fixedly connected to the movable frame. A sliding groove is formed on the left side of the movable frame. One end of the connecting air pipe penetrates the sliding groove and extends into the rotating plate to be connected to the bottom end of the vertical pipe, and the other end of the connecting air pipe is connected to the air extraction port of the air pump. The bottom end of the movable frame is fixedly connected to the electric push rod.

[0018] Preferably, when viewed from above, the rotating plate, the movable ring, the vertical pipe, and the movable frame are all circular, and the rotating plate, the movable ring, the vertical pipe, the second bearing, and the movable frame are concentrically arranged.

[0019] Preferably, the connection between the vertical pipe and the support plate body is rotationally connected, and a grease seal is provided at the connection.

[0020] The present invention has the following advantages: The present invention provides a wafer buffer type positioning bracket for a coating and developing machine through improvement. Compared with the same type of equipment, the following improvements are made:

[0021] In the wafer buffer type positioning bracket for a coating and developing machine of the present invention, by providing a pneumatic suction cup assembly and a limiting mechanism, a movable support plate is provided in the middle of the top end of the support plate body of the pneumatic suction cup assembly. The bottom of the movable support plate is controlled to lift through the support plate lifting control assembly. Multiple limiting devices are provided on the annular gear disc of the limiting mechanism. The movable limiting assembly of the limiting device can be telescoped according to the size of the wafer. The placement position of the wafer is restricted by the buffer plate of the movable limiting assembly. The buffer plate is inclined. The limiting diameter between the buffer plates of multiple limiting devices gradually decreases from top to bottom. The wafer is supported by the movable support plate. The movable support plate moves downward, and at the same time, the rotation of the movable support plate is controlled. The position of the wafer is adjusted by the buffer plate in a vibrating manner, and the fixed position of the wafer is corrected and positioned. The wafer is fixed by using a suction cup method, and the fixed position of the wafer is positioned to avoid damaging the wafer by using a clamping method. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of the present invention;

[0023] Figure 2 is a schematic internal structure diagram of the pneumatic suction cup assembly of the present invention;

[0024] Figure 3 is a schematic internal structure diagram of the support plate of the present invention;

[0025] Figure 4 It is a schematic internal structure diagram of the strut lifting control assembly of the present invention;

[0026] Figure 5 It is a top view of the structure of the limit mechanism of the present invention;

[0027] Figure 6 It is a top view of the structure of the worm assembly of the present invention;

[0028] Figure 7 It is a schematic internal structure diagram of the limit device of the present invention;

[0029] Figure 8 It is a schematic internal structure diagram of the movable limit assembly of the present invention;

[0030] Figure 9 It is the present invention Figure 8 Partial enlarged view of area A;

[0031] Figure 10 It is a schematic structure diagram of the reciprocating mechanism of the present invention.

[0032] Among them: pallet - 1, pneumatic suction cup assembly - 2, limit mechanism - 3, support disk - 21, bearing one - 22, gear ring - 23, gear one - 24, motor one - 25, movable support disk - 26, vertical rod - 27, strut lifting control assembly - 28, support disk main body - 211, groove - 212, suction hole - 213, limit tube - 214, rotating plate - 281, movable ring -

[0033] 282, vertical tube - 283, bearing two - 284, movable frame - 285, sliding groove - 286, connecting air pipe - 287, air pump - 288, electric push rod - 289, annular tooth disk - 31, inner support bearing - 32, outer support bearing - 33, driving tooth - 34, worm gear - 35, worm assembly - 36, limit device - 37, motor two - 361, gear box - 362, worm - 363, support block - 364, support shell - 371, gear two - 372, screw rod - 373, movable tube - 374, movable limit assembly - 375, straight rod - 376, displacement sensor - 377, movable shell - 3751, movable inclined plate - 3752, limit rod - 3753, partition - 3754, magnetic plate - 3755, electromagnet - 3756, reciprocating mechanism - 3757, buffer plate - 3758, connecting rod - 3759, vertical plate - 37510, tension spring - 37511, motor three - 37571, rotating rod - 37572, connecting rod - 37573, connecting piece - 37574. Detailed implementation mode

[0034] Next, it will be combined with the attached Figures 1 - 10The present invention will be described in detail. The technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] Please refer to Figures 1 - 4 , a wafer buffer positioning bracket for a glue coating and developing machine of the present invention, includes a support plate 1, a pneumatic suction cup assembly 2 and a limiting mechanism 3. The pneumatic suction cup assembly 2 is installed in the middle of the support plate 1. A limiting mechanism 3 is arranged at the top edge of the pneumatic suction cup assembly 2, and the bottom end of the limiting mechanism 3 is connected to the support plate 1;

[0036] The pneumatic suction cup 2 is used for fixing and rotating control of the wafer. The pneumatic suction cup 2 includes a support disk 21, a bearing 1 22, a gear ring 23, a gear 1 24, a motor 1 25, a movable support disk 26, a vertical rod 27 and a support disk lifting control assembly 28. The bottom of the outer wall of the support disk 21 is rotatably connected to the support plate 1 through the bearing 1 22. A gear ring 23 is sleeved in the middle of the outer wall of the support disk 21. The outer wall of the gear ring 23 meshes with the gear 1 24. The output shaft of the motor 1 25 is drivingly connected to the center of the gear 1 24, and the motor 1 25 is fixed to the bottom end of the support plate 1. A movable support disk 26 is arranged in the middle of the top end of the support disk 21. Vertical rods 27 are fixed to the left and right sides of the bottom end of the movable support disk 26. The bottom ends of the vertical rods 27 penetrate through the support disk 21 and are connected to the support disk lifting control assembly 28;

[0037] The support disk 21 includes a support disk main body 211, a groove 212, a suction hole 213 and a limiting tube 214. A groove 212 is opened in the middle of the top end of the support disk main body 211. A suction hole 213 is arranged on the top surface of the support disk 21. Limiting tubes 214 are fixed to the left and right sides of the inner middle part of the support disk main body 211, and the vertical rods 27 vertically penetrate through the limiting tubes 214. The bottom of the outer wall of the support disk main body 211 is connected to the bearing 1 22, and the gear ring 23 is fixed to the middle of the outer wall of the support disk main body 211;

[0038] The inner wall of the groove 212 fits with the movable support disk 26. Air holes are opened at the top and bottom edges of the movable support disk 26. A suction hole 213 is opened at the bottom edge of the inner part of the groove 212, and the suction hole 213 at the bottom edge of the inner part of the groove 212 is vertically aligned with the air hole at the bottom edge of the movable support disk 26. After the movable support disk 26 moves downward and is embedded into the groove 212, the inside of the movable support disk 26 is evacuated, so that the wafer is adsorbed on the movable support disk 26 to fix the wafer;

[0039] The support plate lifting control assembly 28 includes a rotating plate 281, a movable ring 282, a vertical pipe 283, a second bearing 284, a movable frame 285, a sliding groove 286, a connecting air pipe 287, an air pump 288, and an electric push rod 289. The middle part inside the rotating plate 281 penetrates through the movable ring 282, and the movable ring 282 is fixedly connected to the rotating plate 281. The vertical pipe 283 vertically penetrates through the movable ring 282, and the bottom end of the vertical pipe 283 is connected to the center of the bottom end of the support plate main body 211. The outer wall of the rotating plate 281 is fixedly connected to the second bearing 284, and the outer wall of the second bearing 284 is fixedly connected to the movable frame 285. A sliding groove 286 is formed on the left side of the movable frame 285. One end of the connecting air pipe 287 penetrates through the sliding groove 286 and extends into the rotating plate 281 to be connected to the bottom end of the vertical pipe 283, and the other end of the connecting air pipe 287 is connected to the air suction port of the air pump 288. The bottom end of the movable frame 285 is fixedly connected to the electric push rod 289.

[0040] When viewed from above, the rotating plate 281, the movable ring 282, the vertical pipe 283, and the movable frame 285 are all circular in shape, and the rotating plate 281, the movable ring 282, the vertical pipe 283, the second bearing 284, and the movable frame 285 are concentrically arranged, so that when the rotating plate 281 rotates, it rotates through the inner ring of the second bearing 284, and the movable ring 282 rotates along the outer wall of the vertical pipe 283;

[0041] The connection between the vertical pipe 283 and the support plate main body 211 is a rotational connection, and a grease seal is provided at the connection to keep the connection between the support plate main body 211 and the vertical pipe 283 during rotation.

[0042] Please refer to Figures 5 - 10 , for a wafer buffer type positioning bracket for a glue coating and developing machine according to the present invention, the limiting mechanism 3 includes an annular gear disk 31, an inner support bearing 32, an outer support bearing 33, a driving tooth 34, a worm gear 35, a worm assembly 36, and a limiting device 37. The inner wall and the bottom of the outer wall of the annular gear disk 31 are respectively rotationally connected to the support plate 1 through the inner support bearing 32 and the outer support bearing 33. The top surface of the annular gear disk 31 is provided with the driving tooth 34. A worm gear 35 is sleeved on the top of the outer wall of the annular gear disk 31. The worm assembly 36 is arranged at the edge of the worm gear 35 and is in transmission connection with the worm gear 35. There are more than three groups of the limiting devices 37, and they are evenly arranged around the center of the annular gear disk 31. The limiting devices 37 are sleeved on the outside of the annular gear disk 31 and are meshed with the driving tooth 34 on the top of the annular gear disk 31;

[0043] The limiting device 37 includes a support shell 371, a second gear 372, a screw rod 373, a movable tube 374, a movable limiting component 375, a straight rod 376 and a displacement sensor 377. A second gear 372 is arranged in the middle inside the support shell 371. A screw rod 373 penetrates through the center of the second gear 372, and the gear 372 is in transmission connection with the screw rod 373. The right end of the screw rod 373 extends out of the support shell 371 and is in threaded connection with the inner wall of the movable tube 374. The right end of the movable tube 374 is fixedly connected to the movable limiting component 375. The top of the left end of the movable limiting component 375 is fixedly connected to the straight rod 376. The left end of the straight rod 376 is connected to the displacement sensor 377, and the displacement sensor 377 is fixed to the inner top end of the support shell 371. The support shell 371 is sleeved outside the annular gear disk 31, and the support shell 371 does not contact the annular gear disk 31. The bottom end of the support shell 371 is fixedly connected to the support plate 1. The bottom end of the second gear 372 meshes with the driving teeth 34 on the top of the annular gear disk 31;

[0044] The movable limiting component 375 includes a movable shell 3751, a movable inclined plate 3752, a limiting rod 3753, a partition plate 3754, a magnetic plate 3755, an electromagnet 3756, a reciprocating mechanism 3757, a buffer plate 3758, a connecting rod 3759, a vertical plate 37510 and a tension spring 37511. A movable inclined plate 3752 is arranged on the right side of the movable shell 3751. Limiting rods 3753 are fixedly arranged on both the upper and lower sides of the left end of the movable inclined plate 3752. A partition plate 3754 is vertically fixed in the middle inside the movable shell 3751. The left ends of the limiting rods 3753 extend into the movable shell 3751, and the limiting rods 3753 penetrate through the partition plate 3754. The magnetic plate 3755 is fixed on the left side between the two limiting rods 3753. An electromagnet 3756 is arranged on the left side of the magnetic plate 3755, and the electromagnet 3756 is fixed to the inner left side wall of the movable shell 3751. The middle of the left end of the movable inclined plate 3752 is connected to the reciprocating mechanism 3757. A buffer plate 3758 is arranged on the right side of the movable inclined plate 3752. Connecting rods 3759 are fixedly arranged on both the upper and lower sides of the left end of the buffer plate 3758. The left ends of the connecting rods 3759 penetrate through the movable inclined plate 3752 and are fixedly connected to the vertical plate 37510. The vertical plate 37510 is arranged at the left end edge of the movable inclined plate 3752, and the right end of the vertical plate 37510 is elastically connected to the movable inclined plate 3752 through the tension spring 37511. The upper and lower sides of the left end of the movable shell 3751 are respectively fixedly connected to the straight rod 376 and the movable tube 374;

[0045] The reciprocating mechanism 3757 includes a motor three 37571, a rotating rod 37572, a connecting rod 37573, and a connecting member 37574. The output shaft at the bottom end of the motor three 37571 is drivingly connected to one end of the rotating rod 37572. The other end of the rotating rod 37572 is rotatably connected to the left end of the connecting rod 37573 through a rotating shaft. The right end of the connecting rod 37573 is rotatably connected to the connecting member 37574 through a rotating shaft. The connecting member 37574 is fixedly connected to the middle of the left end of the movable inclined plate 3752. The motor three 37571 is fixedly connected to the partition plate 3754.

[0046] The worm gear assembly 36 includes a motor two 361, a gearbox 362, a worm 363, and a support block 364. The output shaft at the front end of the motor two 361 is drivingly connected to the worm 363 through a gear set in the gearbox 362. The rear end of the worm 363 is rotatably connected to the support block 364 through a bearing. The worm 363 meshes with the worm wheel 35. The bottom ends of the gearbox 362 and the support block 364 are both fixedly connected to the support plate 1.

[0047] The annular tooth disc 31 is concentrically arranged with the support disc main body 211 and the movable support disc 26.

[0048] The movable inclined plate 3752 and the buffer plate 3758 are arranged in parallel, and both the movable inclined plate 3752 and the buffer plate 3758 are inclined, so that the limiting diameter between the buffer plates 3758 of the plurality of limiting devices 37 gradually decreases from top to bottom.

[0049] The present invention provides a wafer buffer type positioning bracket for a glue coating and developing machine through improvement, and its working principle is as follows;

[0050] First, when using this equipment, first fix the support plate 1 on the moving bracket;

[0051] Second, when the wafer is moving, a manipulator equipped with an electrostatic chuck is used to adsorb the wafer through the electrostatic chuck, and the wafer is placed on the movable support plate 26 after it moves upward through the movement of the manipulator. The limiting diameter of the movable limiting component 375 is adjusted. Before the adjustment, the electromagnet 3756 is energized to make the electromagnet 3756 adsorb the magnetic plate 3755. The magnetic plate 3755 drives the movable inclined plate 3752 to move outward through the limiting rod 3753, so that when the movable limiting component 375 is adjusted, the movable inclined plates 3752 of the movable limiting component 375 are in an extended state, avoiding the situation that the movable inclined plates 3752 are in a contracted state. When the movable limiting components 375 contract, they may contact the wafer, which has a risk of squeezing the wafer. The power is generated by controlling the second motor 361. The second motor 361 drives the worm 363 to rotate through the gear set in the gearbox 362. The rotation of the worm 363 drives the worm gear 35 to rotate. The worm gear 35 drives the annular gear disk 31 to rotate synchronously. The rotation of the annular gear disk 31 drives the gear two 372 in the limiting device 37 to rotate through the driving teeth 34 at the top, and the gear two 372 in all the limiting devices 37 rotate synchronously. The rotation of the gear two 372 drives the screw 373 at the center of the circle to rotate. The screw 373 drives the movable tube 374 to move through the threaded fit with the movable tube 374. The movement of the movable tube 374 drives the movable limiting component 375 to move synchronously, so that the movable limiting components 375 contract, and the movement of the movable limiting component 375 drives the monitoring rod of the displacement sensor 377 to move synchronously through the straight rod 376. The movement distance of the movable limiting component 375 is detected by the displacement sensor 377, and the numerical values are compared through the displacement sensors 377 in different limiting devices 37 to calibrate the displacement distances of different movable limiting components 375, control the movement of the movable limiting component 375, and adjust the limiting diameter between the buffer plates 3758 of multiple movable limiting components 375;

[0052] Thirdly, after the adjustment of the movable limit component 375 is completed, the power supply to the electromagnet 3756 is disconnected, and the motor three 37571 is controlled to generate power to drive the rotating rod 37572 to rotate through the output shaft. The rotation of the rotating rod 37572 drives the connecting piece 37574 and the movable inclined plate 3752 to reciprocate through the connecting rod 37573. At the same time, the motor one 25 is controlled to drive the motor one 25 to rotate. The rotation of the motor one 25 drives the gear ring 23 and the support disk main body 211 to rotate. The support disk main body 211 drives the movable support disk 26 to rotate through the limit tube 214 and the vertical rod 27, so that the wafer on the movable support disk 26 rotates. At the same time, the electric push rod 289 is controlled to drive the movable frame 285 to move downward. The movable frame 285 drives the rotating plate 281, the bearing two 284 and the movable frame 285 to move downward. And the rotating plate 281 drives the vertical rod 27 and the movable support disk 26 to descend. Since the movable inclined plate 3752 and the buffer plate 3758 are arranged in parallel and both the movable inclined plate 3752 and the buffer plate 3758 are inclined, the limiting diameter between the buffer plates 3758 of the plurality of limiting devices 37 gradually decreases from top to bottom. When the placement position of the wafer is offset, it contacts the buffer plate 3758 during the descent and rotation processes. The buffer plate 3758 adjusts the position of the wafer in a vibrating manner to correct and position the fixed position of the wafer. And when the buffer plate 3758 is stressed, it is buffered by the tension spring 37511 to avoid a large impact force on the wafer. After the movable support disk 26 moves downward and the buffer plate 3758 is pushed out to fit the outer wall of the wafer, after the movable support disk 26 is embedded into the groove 212 of the support disk main body 211, the positioning of the wafer is completed. The air pump 288 is controlled to evacuate the inside of the support disk main body 211 and the movable support disk 26 through the connecting air pipe 287 and the vertical pipe 283, so that the wafer is adsorbed on the support disk main body 211 and the movable support disk 26. Then, the expansion between the movable limit components 375 is controlled to complete the fixation of the wafer.

[0053] The above shows and describes the basic principles, main features and advantages of the present invention. And the standard parts used in the present invention can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. Coupled with the circuit connection adopting the conventional connection method in the prior art, it will not be elaborated here.

[0054] The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer buffer positioning bracket for a glue coating and developing machine, characterized in that: It comprises a support plate (1), a pneumatic suction cup assembly (2) and a limiting mechanism (3), wherein the pneumatic suction cup assembly (2) is installed in the middle of the support plate (1), a limiting mechanism (3) is arranged at the top edge of the pneumatic suction cup assembly (2), and the bottom end of the limiting mechanism (3) is connected to the support plate (1); The pneumatic suction cup (2) is used to fix and control the rotation of the wafer. The pneumatic suction cup (2) comprises a support plate (21), a bearing (22), a gear ring (23), a gear (24), a motor (25), a movable support plate (26), a vertical rod (27) and a support plate lifting control assembly (28). The bottom of the outer wall of the support plate (21) is rotatably connected to the support plate (1) through a bearing (22). The middle part of the outer wall of the support plate (21) is provided with a gear ring (23). The outer wall of the gear ring (23) is meshed with the gear one (24), the output shaft of the motor one (25) is transmission-connected with the center of the gear one (24), and the motor one (25) is fixed to the bottom end of the support plate (1), a movable support plate (26) is arranged at the middle of the top end of the support plate (21), and vertical rods (27) are fixed on both sides of the bottom end of the movable support plate (26), and the bottom end of the vertical rod (27) penetrates the support plate (21) and is connected to the support plate lifting control component (28); The limiting mechanism (3) comprises an annular toothed disc (31), an inner support bearing (32), an outer support bearing (33), a driving latch tooth (34), a worm wheel (35), a worm assembly (36) and a limiting device (37); the inner wall and the bottom of the outer wall of the annular toothed disc (31) are rotatably connected to the support plate (1) via the inner support bearing (32) and the outer support bearing (33), respectively; the top surface of the annular toothed disc (31) is provided with a driving latch tooth (34); A worm wheel (35) is mounted on the top of the outer wall of the disk (31); the worm assembly (36) is arranged at the edge of the worm wheel (35), and the worm assembly (36) is drivingly connected to the worm wheel (35); more than three groups of the limiting devices (37) are arranged, and are evenly arranged at the center of the annular toothed disk (31); the limiting devices (37) are mounted on the outside of the annular toothed disk (31), and the limiting devices (37) and the driving teeth (34) at the top of the annular toothed disk (31) are meshed with each other; The support plate lifting control assembly (28) is used to control the lifting of the movable support plate (26), the movable support plate (26) is used to support the wafer, the worm assembly (36) is used to control the rotation of the worm wheel (35) and the annular gear plate (31), the rotation of the annular gear plate (31) is used to control the extension and retraction of the movable limit assembly (375) of the limit device (37), the movable limit assembly (375) is used to limit the position of the wafer, and more than three groups of movable limit assemblies (375) are used to locate the center of the wafer.

2. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The limiting device (37) comprises a supporting shell (371), a second gear (372), a screw (373), a movable tube (374), a movable limiting assembly (375), a straight rod (376) and a displacement sensor (377). The supporting shell (371) is provided with a second gear (372) in the middle part thereof. The center of the second gear (372) is penetrated by a screw (373). The gear (372) and the screw (373) are transmission-connected. The right end of the screw (373) extends out of the supporting shell (371) and is threadedly connected to the inner wall of the movable tube (374). The right end of the movable tube (374) is connected to the movable limiting assembly (375). The movable limit assembly (375) is fixedly connected, the top of the left end of the movable limit assembly (375) is fixedly connected to the straight rod (376), the left end of the straight rod (376) is connected to the displacement sensor (377), and the displacement sensor (377) is fixed to the inner top of the support shell (371), the support shell (371) is sleeved on the outer side of the annular gear disk (31), and the support shell (371) does not contact the annular gear disk (31), the bottom end of the support shell (371) is fixedly connected to the support plate (1), and the bottom end of the gear 2 (372) is meshed with the driving tooth (34) at the top of the annular gear disk (31).

3. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 2, characterized in that: The movable limiting assembly (375) comprises a movable shell (3751), a movable inclined plate (3752), a limiting rod (3753), a partition (3754), a magnetic plate (3755), an electromagnet (3756), a reciprocating mechanism (3757), a buffer plate (3758), a connecting rod (3759), a vertical plate (37510) and a tension spring (37511). The movable inclined plate (3752) is provided on the right side of the movable shell (3751). 752), the upper and lower sides of the left end of the movable inclined plate (3752) are fixed with limit rods (3753), the inner middle part of the movable shell (3751) is vertically fixed with a partition (3754), the left end of the limit rod (3753) extends into the movable shell (3751), and the limit rod (3753) passes through the partition (3754), the magnetic plate (3755) is fixed on the left side between the two limit rods (3753), and the magnetic plate An electromagnet (3756) is arranged on the left side of the movable shell (3755), and the electromagnet (3756) is fixed to the inner left side wall of the movable shell (3751). The middle part of the left end of the movable inclined plate (3752) is connected to the reciprocating mechanism (3757). A buffer plate (3758) is arranged on the right side of the movable inclined plate (3752). Connecting rods (3759) are fixed on both the upper and lower sides of the left end of the buffer plate (3758). The left end of (3759) passes through the movable inclined plate (3752) and is fixedly connected to the vertical plate (37510), the vertical plate (37510) is arranged at the left edge of the movable inclined plate (3752), and the right end of the vertical plate (37510) is elastically connected to the movable inclined plate (3752) through a tension spring (37511), and the upper and lower sides of the left end of the movable shell (3751) are fixedly connected to the straight rod (376) and the movable tube (374) respectively.

4. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 3, characterized in that: The reciprocating mechanism (3757) comprises a motor three (37571), a rotating rod (37572), a connecting rod (37573) and a connecting piece (37574); the output shaft at the bottom end of the motor three (37571) is transmission-connected to one end of the rotating rod (37572); the other end of the rotating rod (37572) is rotationally connected to the left end of the connecting rod (37573) via a rotating shaft; the right end of the connecting rod (37573) is rotationally connected to the connecting piece (37574) via a rotating shaft; the connecting piece (37574) is fixedly connected to the middle part of the left end of the movable inclined plate (3752); and the motor three (37571) is fixedly connected to the partition (3754).

5. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The worm assembly (36) comprises a second motor (361), a gear box (362), a worm (363) and a support block (364); the output shaft at the front end of the second motor (361) is transmission-connected to the worm (363) via a gear set in the gear box (362); the rear end of the worm (363) is rotationally connected to the support block (364) via a bearing; the worm (363) and the worm wheel (35) are meshed with each other; the bottom ends of the gear box (362) and the support block (364) are fixedly connected to the support plate (1).

6. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The support plate (21) comprises a support plate body (211), a groove (212), an air suction hole (213) and a limit tube (214); a groove (212) is provided in the middle of the top end of the support plate body (211); an air suction hole (213) is provided on the top surface of the support plate (21); limit tubes (214) are fixed on both left and right sides of the inner middle of the support plate body (211); a vertical rod (27) vertically penetrates the limit tube (214); the bottom of the outer wall of the support plate body (211) is connected to a bearing 1 (22); and a gear ring (23) is fixed in the middle of the outer wall of the support plate body (211).

7. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 6, characterized in that: The inner wall of the groove (212) is in contact with the movable support plate (26); air holes are provided at the edges of the top and bottom surfaces of the movable support plate (26); an air suction hole (213) is provided at the inner bottom edge of the groove (212); and the air suction hole (213) at the inner bottom edge of the groove (212) is vertically aligned with the air hole at the bottom edge of the movable support plate (26).

8. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The support plate lifting control assembly (28) comprises a rotating plate (281), a movable ring (282), a vertical pipe (283), a second bearing (284), a movable frame (285), a slide groove (286), a connecting air pipe (287), an air pump (288) and an electric push rod (289). The inner middle part of the rotating plate (281) is penetrated by a movable ring (282), and the movable ring (282) is fixedly connected to the rotating plate (281). The vertical pipe (283) vertically penetrates the movable ring (282), and the bottom end of the vertical pipe (283) is connected to the bottom end of the support plate body (211). The two ends of the vertical pipe (283) and the vertical pipe (284) are connected at the center of the circle, the outer wall of the rotating plate (281) is fixedly connected to the second bearing (284), and the outer wall of the second bearing (284) is fixedly connected to the movable frame (285), a slide groove (286) is provided on the left side of the movable frame (285), one end of the connecting air pipe (287) passes through the slide groove (286) and extends into the rotating plate (281) to be connected to the bottom end of the vertical pipe (283), and the other end of the connecting air pipe (287) is connected to the air extraction port of the air pump (288), and the bottom end of the movable frame (285) is fixedly connected to the electric push rod (289).

9. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 8, characterized in that: The rotating plate (281), the movable ring (282), the vertical tube (283) and the movable frame (285) are all circular in a top view, and the rotating plate (281), the movable ring (282), the vertical tube (283), the second bearing (284) and the movable frame (285) are concentrically arranged.

10. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 8, characterized in that: The vertical pipe (283) is rotatably connected to the supporting plate body (211), and an oil seal is provided at the connection.

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