Semiconductor substrate cleaning device and method

Abstract

The present invention discloses a semiconductor substrate cleaning device and method, and relates to the technical field of cleaning devices. The semiconductor substrate cleaning device comprises a conveyor and a suction cup manipulator arranged on a bottom plate, and a semiconductor substrate body is conveyed on the conveyor, and a cleaning mechanism for cleaning the semiconductor substrate body is arranged on the top of the bottom plate. The semiconductor substrate cleaning device and method, when cleaning, allows the bristles to move back and forth, and at the same time, the impurities after the semiconductor substrate body is cleaned are absorbed by the absorption tube, and it is convenient to automatically adjust the width of the vacuum suction according to the size of the semiconductor substrate body, so as to ensure the effect of the vacuum cleaning, and it is more convenient and quick to use; it is convenient to automatically turn over the semiconductor substrate body, and limit it after turning over, which is more stable and reliable, so that full-angle cleaning can be completed, and it is more convenient and quick to use, and the cleaning efficiency and effect are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning devices, and in particular to a semiconductor substrate cleaning device and method. Background Art

[0002] Semiconductor substrate refers to the basic material used to grow and manufacture semiconductor devices. It is one of the most important components in the semiconductor industry. It carries the key functions of the entire electronic product and is a supporting platform for manufacturing semiconductor chips and other electronic components. It is easily contaminated during production and transmission, so it needs to be cleaned using a cleaning device to remove impurities such as dust and particles on the substrate.

[0003] However, the existing semiconductor substrate cleaning devices and methods do not clean completely when in use, have low cleaning efficiency and poor cleaning effect, and are not convenient for automatic flipping, making it inconvenient to clean the semiconductor substrate at all angles, which also affects the cleaning efficiency and effect. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor substrate cleaning device and method to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor substrate cleaning device, comprising a conveyor and a suction cup manipulator arranged on a bottom plate, wherein a semiconductor substrate body is conveyed on the conveyor, and a cleaning mechanism for cleaning the semiconductor substrate body is arranged on the top of the bottom plate;

[0006] The cleaning mechanism comprises a plurality of symmetrically arranged support plates fixedly connected to the top of the bottom plate, and the upper end of the support plate is fixedly connected to a fixed frame, the top of the fixed frame is connected to two symmetrically arranged first movable plates through a first movable mechanism, and the top of each first movable plate is fixedly connected to an L-shaped plate, the side wall of each L-shaped plate is rotatably connected to a rubber plate through a rotating shaft, and the bottom of the fixed frame is connected to two symmetrically arranged movable blocks through a lifting mechanism, a second movable plate is connected between the two movable blocks through a second movable mechanism, and the top of the second movable plate is fixedly connected to a mounting plate, and the mounting plate A first guide rail is fixedly connected to the top of the plate, and two symmetrically arranged U-shaped plates are slidably connected to the first guide rail, a plurality of bristles arranged in an array are fixedly connected to the top of each U-shaped plate, and a fixed tube is fixedly connected to the top of the mounting plate, a plurality of absorption tubes arranged in an array are fixedly connected to the top of the fixed tube, and an exhaust fan is fixedly connected to the side wall of the second movable plate, a collecting tube is fixedly connected to the outlet of the exhaust fan, and a connecting tube is fixedly connected between the inlet of the exhaust fan and the fixed tube, the flipping of the rubber plate is driven by a driving mechanism, and the movement of the U-shaped plate is driven by a pushing mechanism.

[0007] Preferably, the driving mechanism includes a gear fixedly mounted on the side wall of the rotating shaft, and the top of the moving block is fixedly connected to a second guide rail, a rack is slidably connected to the second guide rail, and the side wall of the rack is fixedly connected to a first connecting plate arranged in an L shape, the lower end of the first connecting plate is fixedly connected to a second connecting plate, and the two ends of the second connecting plate are fixedly connected to a first push plate and a second push plate, and a limiting mechanism for limiting the first connecting plate is provided at the top of one of the L-shaped plates.

[0008] Preferably, the limiting mechanism includes two limiting grooves opened on the top of the L-shaped plate, the two limiting grooves are hemispherical and symmetrically arranged, and the top of the first connecting plate is fixedly connected to two symmetrically arranged first T-shaped guide rods, the side walls of the first T-shaped guide rods are sleeved with first sliders, the side walls of each of the first T-shaped guide rods are sleeved with first springs, and the bottom of the first slider is fixedly connected to a pin.

[0009] Preferably, the pushing mechanism comprises:

[0010] A third connecting plate fixedly connected to each side wall of the U-shaped plate;

[0011] A U-shaped frame is arranged between the two third connecting plates, so that the third connecting plates can slide on both sides of the U-shaped frame and form two sliding surfaces, and the two ends of the U-shaped frame are fixed to the bottoms of the two moving blocks;

[0012] The raised portion is fixedly arranged on the sliding surface of the U-shaped frame so that the third connecting plate can slide along the edge of the raised portion; a plurality of raised portions are arranged at equal intervals.

[0013] Preferably, a telescopic mechanism is provided between the two third connecting plates; the telescopic mechanism comprises two symmetrically arranged first sleeves fixedly connected to the side walls of one of the third connecting plates, and a first sleeve rod is inserted into the first sleeve, one end of the first sleeve rod away from the first sleeve is fixed to the side wall of the other third connecting plate, and the side wall of each first sleeve is sleeved with a second spring.

[0014] Preferably, two symmetrically arranged adjustment mechanisms are provided on the top of the mounting plate, and the adjustment mechanisms are used to adjust the suction width of the absorption tube, each of the adjustment mechanisms includes a sealing plate, and two symmetrically arranged avoidance grooves are opened on the top of the sealing plate, each of the sealing plates is connected to the side wall of the mounting plate through a reset mechanism, and the side wall of each first movable plate is fixedly connected with two symmetrically arranged baffles.

[0015] Preferably, the reset mechanism includes an L-shaped block fixedly connected to the bottom of the sealing plate, and the side wall of the L-shaped block is fixedly connected to two symmetrically arranged second T-shaped guide rods, the side wall of the second T-shaped guide rod is sleeved with a second slider, and the second slider is fixed to the side wall of the mounting plate, and the side wall of each second T-shaped guide rod is sleeved with a third spring.

[0016] Preferably, the first moving mechanism includes two symmetrically arranged fixed plates fixedly connected to the bottom of the fixed frame, and a first guide rod is fixedly connected between the two fixed plates, the first moving plate is sleeved on the side wall of the first guide rod, and a double-headed screw is rotatably connected between the two fixed plates, the first moving plate is threadedly connected to the side wall of the double-headed screw, and a first motor is fixedly connected to the side wall of one of the fixed plates.

[0017] Preferably, the lifting mechanism includes two symmetrically arranged first connecting blocks fixedly connected to the side walls of each moving block, and the top of each first connecting block is fixedly connected to a second set of rods, the side walls of the second set of rods are sleeved with a second sleeve, and the upper end of the second sleeve is fixed to the bottom of the fixed frame, the side wall of one of the moving blocks is fixedly connected to a second connecting block, and the bottom of the second connecting block is fixedly connected to a second motor, the output end of the second motor is fixedly connected to a first threaded rod, and the side wall of the first threaded rod is threadedly connected to a threaded tube, the upper end of the threaded tube is fixedly connected to a third connecting block, and the third connecting block is fixed to the side wall of the fixed frame, the side wall of the mounting plate is fixedly connected to a distance sensor, and the distance sensor is electrically connected to the second motor.

[0018] Preferably, the second moving mechanism includes a second guide rod fixedly connected to the opposite side walls of the two moving blocks, and the second moving plate is sleeved on the side wall of the second guide rod, the opposite side walls of the two moving blocks are rotatably connected with a second threaded rod, and the second moving plate is threadedly connected to the second threaded rod, and the side wall of one of the moving blocks is fixedly connected with a third motor, and the output end of the third motor is fixed to one end of the second threaded rod.

[0019] A semiconductor substrate cleaning method, using the semiconductor substrate cleaning device described above, comprises the following steps:

[0020] S1: When the semiconductor substrate body needs to be cleaned, it is adsorbed between the two rubber plates by the suction cup manipulator, and then the first motor is started. The rotation of the first motor drives the rotation of the double-headed screw, thereby driving the two first moving plates to move closer to each other, thereby driving the two rubber plates to move closer to each other through the L-shaped plate and abut against the semiconductor substrate body, thereby realizing the clamping operation of the semiconductor substrate body;

[0021] S2: starting the third motor, the rotation of the third motor drives the rotation of the second threaded rod, thereby driving the second movable plate to move, and the second movable plate drives the mounting plate to move when moving, and then drives the U-shaped plate and the brush to move, so that the lower surface of the semiconductor substrate body can be cleaned;

[0022] S3: When the second moving plate moves, the third connecting plate is driven to move synchronously. When the third connecting plate abuts against the side wall of the protruding portion, the two third connecting plates are pushed to move away from each other. At the same time, the second spring is stretched. When the third connecting plate passes over the protruding portion, the two third connecting plates can move closer to each other under the action of the second spring. This reciprocating process can make the two third connecting plates move back and forth and drive the two U-shaped plates to move along the first guide rail, so that the brush bristles can clean the semiconductor substrate body more efficiently and effectively.

[0023] S4: When cleaning, the exhaust fan is started, and the impurities after cleaning the semiconductor substrate body are absorbed through the absorption tube, and the impurities enter the exhaust fan through the fixed tube and the rubber plate and are discharged through the collection tube for unified collection, so that the cleaning efficiency of the semiconductor substrate body is higher and the effect is better. In addition, when the semiconductor substrate body is clamped and limited, when the first movable plate moves, it will drive the baffle to move synchronously, thereby pushing the sealing plate to move. At the same time, the third spring is compressed, and when the sealing plate moves, it can block and seal part of the absorption tubes on both sides, so that the width of the air extraction and dust collection is adapted to the width of the semiconductor substrate body, so that the width of the air extraction and dust collection can be automatically adjusted according to the size of the semiconductor substrate body, ensuring the effect of dust collection and cleaning, and being more convenient and quick to use;

[0024] S5: After one surface of the semiconductor substrate body is cleaned, when the second movable plate abuts against the second push plate, the rack is driven to move along the second guide rail through the second connecting plate and the first connecting plate, thereby driving the gear and the rotating shaft to rotate, and then driving the rubber plate and the semiconductor substrate body to rotate, and making the semiconductor substrate body flip 180 degrees, and when the first connecting plate moves, it drives the latch to move synchronously, so that the latch slides out of the limiting groove and then slides on the L-shaped plate, and at the same time, the first spring is compressed, and after the semiconductor substrate body is flipped 180 degrees, it is inserted into another limiting groove under the action of the first spring, so that the first connecting plate and the rack can be limited, and then the rotating shaft and the rubber plate are limited, to avoid arbitrary rotation, which is more stable and reliable;

[0025] S6: Then, the second movable plate is driven by the second movable mechanism to move and reset in the direction close to the second motor, so that the other side of the semiconductor substrate body can be cleaned. After the cleaning is completed, when the second movable plate abuts against the first push plate, similarly, the rubber plate and the semiconductor substrate body can be pushed to flip 180 degrees again and reset. At the same time, the limiting mechanism limits the position. This reciprocating operation can automatically flip the semiconductor substrate body during cleaning to complete full-angle cleaning. It is more convenient and quick to use, and the cleaning efficiency and effect are improved.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The semiconductor substrate cleaning device and method are provided with a cleaning mechanism, etc. When the semiconductor substrate body needs to be cleaned, it is adsorbed between two rubber plates by a suction cup manipulator, then the first motor is started, and the rotation of the first motor drives the rotation of the double-headed screw rod, thereby driving the two first movable plates to move closer to each other, thereby driving the two rubber plates to move closer to each other and abutting against the semiconductor substrate body through the L-shaped plate, thereby achieving a clamping operation on the semiconductor substrate body, then the third motor is started, and the rotation of the third motor drives the rotation of the second threaded rod, thereby driving the second movable plate to move, and when the second movable plate moves, it drives the mounting plate to move, and then drives the U-shaped plate and the brush to move, so that the lower surface of the semiconductor substrate body can be cleaned, and at the same time, when the second movable plate moves, it drives the third connecting plate to move synchronously, and when the third connecting plate abuts against the side wall of the raised portion, the two third connecting plates are pushed to move away from each other, and at the same time, the second spring is stretched, and when the third connecting plate passes over the raised portion, the two third connecting plates are moved away from each other. The connecting plates can move closer to each other under the action of the second spring, and so on and so forth, so that the two third connecting plates can move back and forth, and drive the two U-shaped plates to move along the first guide rail, so that the brush can clean the semiconductor substrate body more efficiently and effectively, and, during cleaning, start the exhaust fan, absorb the impurities cleaned by the semiconductor substrate body through the absorption tube, and enter the exhaust fan through the fixed tube and the rubber plate and then be discharged through the collection tube for unified collection, so that the cleaning efficiency of the semiconductor substrate body is higher and the effect is better, and, when the semiconductor substrate body is clamped and limited, when the first movable plate moves, it will drive the baffle to move synchronously, thereby pushing the sealing plate to move, and at the same time, the third spring is compressed, and when the sealing plate moves, it can block and seal part of the absorption tubes on both sides, so that the width of the vacuum suction is adapted to the width of the semiconductor substrate body, so that the vacuum suction width can be automatically adjusted according to the size of the semiconductor substrate body, to ensure the vacuum cleaning effect while being more convenient and quick to use.

[0028] The semiconductor substrate cleaning device and method are provided with a pushing mechanism, etc., and after one surface of the semiconductor substrate body is cleaned, when the second moving plate abuts against the second pushing plate, the rack is driven to move along the second guide rail through the second connecting plate and the first connecting plate, thereby driving the gear and the rotating shaft to rotate, and then driving the rubber plate and the semiconductor substrate body to rotate, and causing the semiconductor substrate body to flip 180 degrees, and when the first connecting plate moves, it drives the latch to move synchronously, so that the latch slides out of the limiting groove and then slides on the L-shaped plate, and at the same time, the first spring is compressed, and after the semiconductor substrate body is flipped 180 degrees, it is inserted into another limiting groove under the action of the first spring. , so that the first connecting plate and the rack can be limited, and then the rotating shaft and the rubber plate can be limited to avoid arbitrary rotation, which is more stable and reliable. Then, the second moving mechanism drives the second moving plate to move and reset in the direction close to the second motor, so that the other side of the semiconductor substrate body can be cleaned. After the cleaning is completed, when the second moving plate is against the first pushing plate, similarly, the rubber plate and the semiconductor substrate body can be pushed to flip 180 degrees again and reset. At the same time, the limiting mechanism is used to limit the position. This reciprocating operation can be performed to automatically flip the semiconductor substrate body during cleaning to complete full-angle cleaning. It is more convenient and quick to use, and improves the efficiency and effect of cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the use state of the present invention;

[0030] Figure 2 It is a structural schematic diagram of the cleaning mechanism in the present invention;

[0031] Figure 3 It is a structural schematic diagram of the first moving mechanism in the present invention;

[0032] Figure 4 is a schematic structural diagram of the second moving mechanism in the present invention;

[0033] Figure 5 for Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0034] Figure 6 for Figure 3 A schematic diagram of the enlarged structure at B in the middle;

[0035] Figure 7 for Figure 4 Schematic diagram of the enlarged structure at C in the middle;

[0036] Figure 8 for Figure 5 Schematic diagram of the enlarged structure at D in the middle;

[0037] Fig. 9 for Figure 5 Schematic diagram of the enlarged structure at E in the middle.

[0038] In the figure: 1, bottom plate; 2, driving mechanism; 201, gear; 202, second guide rail; 203, rack; 204, first connecting plate; 205, second connecting plate; 206, first push plate; 207, second push plate; 3, pushing mechanism; 301, U-shaped frame; 302, raised portion; 303, third connecting plate; 4, telescopic mechanism; 401, first sleeve; 402, first sleeve rod; 403, second spring; 5, limiting mechanism; 501, limiting groove; 502, first T-shaped guide rod; 503, first slider; 504, first spring; 505, latch; 6, adjustment mechanism; 601, baffle; 602, sealing plate; 603, avoidance groove; 7, reset mechanism; 701, second slider; 702, second T-shaped guide rod; 703, L-shaped block; 704, third spring; 8, second moving mechanism; 802, second guide rod; 803, second threaded rod; 804, third motor; 9, lifting mechanism; 901, first Connecting block; 902, second set of rods; 903, second sleeve; 904, second motor; 905, third connecting block; 906, second connecting block; 907, threaded tube; 908, first threaded rod; 910, distance sensor; 10, conveyor; 11, suction cup manipulator; 12, cleaning mechanism; 1201, support plate; 1202, fixed frame; 1203, L-shaped plate; 1204, rotating shaft; 1205, rubber plate; 1206, moving block; 1207 , second movable plate; 1208, mounting plate; 1209, first guide rail; 1210, U-shaped plate; 1211, bristles; 1212, fixed tube; 1213, absorption tube; 1214, exhaust fan; 1215, connecting tube; 1216, collecting tube; 1217, first movable plate; 13, semiconductor substrate body; 14, first moving mechanism; 1401, fixed plate; 1402, first guide rod; 1403, double-headed screw; 1404, first motor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1-Figure 9The present invention provides a technical solution: a semiconductor substrate cleaning device, comprising a conveyor 10 and a suction cup manipulator 11 arranged on a bottom plate 1, and a semiconductor substrate body 13 is conveyed on the conveyor 10, and a cleaning mechanism 12 for cleaning the semiconductor substrate body 13 is arranged on the top of the bottom plate 1;

[0041] The cleaning mechanism 12 includes a plurality of symmetrically arranged support plates 1201 fixedly connected to the top of the bottom plate 1, and the upper end of the support plate 1201 is fixedly connected to a fixed frame 1202, the top of the fixed frame 1202 is connected to two symmetrically arranged first movable plates 1217 through a first movable mechanism 14, and the top of each first movable plate 1217 is fixedly connected to an L-shaped plate 1203, the side wall of each L-shaped plate 1203 is rotatably connected to a rubber plate 1205 through a rotating shaft 1204, and the bottom of the fixed frame 1202 is connected to the bottom of the fixed frame 1202 through a lifting mechanism 9 is connected to two symmetrically arranged moving blocks 1206, a second moving plate 1207 is connected between the two moving blocks 1206 through a second moving mechanism 8, and the top of the second moving plate 1207 is fixedly connected to a mounting plate 1208, the top of the mounting plate 1208 is fixedly connected to a first guide rail 1209, and the first guide rail 1209 is slidably connected to two symmetrically arranged U-shaped plates 1210, the top of each U-shaped plate 1210 is fixedly connected to a plurality of array-arranged bristles 1211, and the top of the mounting plate 1208 is fixedly connected to the first guide rail 1209. A fixed tube 1212 is connected, and a plurality of absorption tubes 1213 arranged in an array are fixedly connected to the top of the fixed tube 1212, and a side wall of the second movable plate 1207 is fixedly connected to an exhaust fan 1214, and an outlet of the exhaust fan 1214 is fixedly connected to a collecting tube 1216, and a connecting tube 1215 is fixedly connected between the inlet of the exhaust fan 1214 and the fixed tube 1212. The turning of the rubber plate 1205 is driven by the driving mechanism 2, and the movement of the U-shaped plate 1210 is driven by the pushing mechanism 3. When cleaning, The bristles 1211 are made to move back and forth, and at the same time, the impurities cleaned by the semiconductor substrate body 13 are absorbed through the absorption tube 1213, and the width of the vacuum suction is automatically adjusted according to the size of the semiconductor substrate body 13, so as to ensure the vacuum cleaning effect and make it more convenient and quick to use; the semiconductor substrate body 13 is automatically turned over, and the position is limited after turning over, which is more stable and reliable, so that full-angle cleaning can be completed, the use is more convenient and quick, and the cleaning efficiency and effect are improved.

[0042] The driving mechanism 2 includes a gear 201 fixedly sleeved on the side wall of the rotating shaft 1204, and the top of the moving block 1206 is fixedly connected to the second guide rail 202, and the second guide rail 202 is slidably connected to the rack 203, and the side wall of the rack 203 is fixedly connected to the first connecting plate 204 set in an L shape, the lower end of the first connecting plate 204 is fixedly connected to the second connecting plate 205, and the two ends of the second connecting plate 205 are fixedly connected to the first push plate 206 and the second push plate 207, and the top of one of the L-shaped plates 1203 is set A limiting mechanism 5 is provided for limiting the first connecting plate 204. After one surface of the semiconductor substrate body 13 is cleaned, when the second movable plate 1207 abuts against the second push plate 207, the rack 203 is driven to move along the second guide rail 202 through the second connecting plate 205 and the first connecting plate 204, thereby pushing the gear 201 and the rotating shaft 1204 to rotate, thereby driving the rubber plate 1205 and the semiconductor substrate body 13 to rotate, and causing the semiconductor substrate body 13 to flip 180 degrees.

[0043] The limiting mechanism 5 includes two limiting grooves 501 opened on the top of the L-shaped plate 1203, the two limiting grooves 501 are hemispherical and symmetrically arranged, and the top of the first connecting plate 204 is fixedly connected to two symmetrically arranged first T-shaped guide rods 502, the side walls of the first T-shaped guide rods 502 are sleeved with first sliders 503, the side walls of each first T-shaped guide rod 502 are sleeved with first springs 504, and the bottom of the first slider 503 is fixedly connected to a latch 505. When the first connecting plate 204 moves When the first spring 504 is in motion, the latch 505 is driven to move synchronously, so that the latch 505 slides out of the limiting groove 501 and slides on the L-shaped plate 1203. At the same time, the first spring 504 is compressed. After the semiconductor substrate body 13 is flipped 180 degrees, it is inserted into another limiting groove 501 under the action of the first spring 504, so that the first connecting plate 204 and the rack 203 can be limited, and then the rotating shaft 1204 and the rubber plate 1205 can be limited to avoid arbitrary rotation, which is more stable and reliable.

[0044] The pushing mechanism 3 includes a third connecting plate 303 fixedly connected to the side wall of each U-shaped plate 1210, and a telescopic mechanism 4 and a U-shaped frame 301 are arranged between the two third connecting plates 303, so that the third connecting plate 303 can slide on both sides of the U-shaped frame 301 and form two sliding surfaces, the two ends of the U-shaped frame 301 are fixed to the bottom of the two moving blocks 1206, and a plurality of protrusions 302 are fixedly connected to the sliding surface of the U-shaped frame 301, so that the third connecting plate 303 can slide on the edge of the protrusion 302, and the plurality of protrusions 302 are arranged at equal intervals.

[0045] In this embodiment, the protrusion 302 can be a triangular block or an arc block. When the second moving plate 1207 moves, the third connecting plate 303 is driven to move synchronously. When the third connecting plate 303 abuts against the side wall of the protrusion 302, the two third connecting plates 303 are pushed to move away from each other. When the third connecting plate 303 passes over the protrusion 302, the two third connecting plates 303 can move closer to each other under the action of the telescopic mechanism 4. In this way, the two third connecting plates 303 can move back and forth and drive the two U-shaped plates 1210 to move along the first guide rail 1209, so that the bristles 1211 can clean the semiconductor substrate body 13 more efficiently and effectively.

[0046] The telescopic mechanism 4 includes two symmetrically arranged first sleeves 401 fixedly connected to the side walls of one of the third connecting plates 303, and a first sleeve rod 402 is inserted into the first sleeve 401. The end of the first sleeve rod 402 away from the first sleeve 401 is fixed to the side wall of the other third connecting plate 303, and the side wall of each first sleeve 401 is sleeved with a second spring 403, which guides and resets the movement of the third connecting plate 303.

[0047] Two symmetrically arranged adjusting mechanisms 6 are arranged on the top of the mounting plate 1208, and the adjusting mechanisms 6 are used to adjust the air suction width of the absorption tube 1213. Each adjusting mechanism 6 includes a sealing plate 602, and two symmetrically arranged avoidance grooves 603 are provided on the top of the sealing plate 602. Each sealing plate 602 is connected to the side wall of the mounting plate 1208 through a reset mechanism 7, and the side wall of each first movable plate 1217 is fixedly connected with two symmetrically arranged baffles 601. When the semiconductor substrate body 13 is clamped and limited, when the first movable plate 1217 moves, it will drive the baffle 601 to move synchronously, thereby pushing the sealing plate 602 to move. At the same time, the third spring 704 is compressed. When the sealing plate 602 moves, it can block and seal part of the absorption tube 1213 on both sides, so that the width of the vacuum suction is adapted to the width of the semiconductor substrate body 13, so that the vacuum suction width can be automatically adjusted according to the size of the semiconductor substrate body 13, ensuring the vacuum cleaning effect while being more convenient and quick to use.

[0048] The reset mechanism 7 includes an L-shaped block 703 fixedly connected to the bottom of the sealing plate 602, and the side wall of the L-shaped block 703 is fixedly connected to two symmetrically arranged second T-shaped guide rods 702, the side wall of the second T-shaped guide rod 702 is sleeved with a second slider 701, and the second slider 701 is fixed to the side wall of the mounting plate 1208, and the side wall of each second T-shaped guide rod 702 is sleeved with a third spring 704, which plays a guiding and resetting role for the movement of the sealing plate 602.

[0049] The first moving mechanism 14 includes two symmetrically arranged fixed plates 1401 fixedly connected to the bottom of the fixed frame 1202, and a first guide rod 1402 is fixedly connected between the two fixed plates 1401, a first moving plate 1217 is sleeved on the side wall of the first guide rod 1402, and a double-headed screw rod 1403 is rotatably connected between the two fixed plates 1401, the first moving plate 1217 is threadedly connected to the side wall of the double-headed screw rod 1403, and a first motor 1404 is fixedly connected to the side wall of one of the fixed plates 1401, the first motor 1404 is started, and the rotation of the first motor 1404 drives the rotation of the double-headed screw rod 1403, thereby driving the two first moving plates 1217 to move closer to each other.

[0050] The lifting mechanism 9 includes two symmetrically arranged first connecting blocks 901 fixedly connected to the side walls of each moving block 1206, and the top of each first connecting block 901 is fixedly connected to a second sleeve rod 902, the side wall of the second sleeve rod 902 is sleeved with a second sleeve tube 903, and the upper end of the second sleeve tube 903 is fixed to the bottom of the fixed frame 1202, the side wall of one of the moving blocks 1206 is fixedly connected to a second connecting block 906, and the bottom of the second connecting block 906 is fixedly connected to a second motor 904, the output end of the second motor 904 is fixedly connected to a first threaded rod 908, and the side wall of the first threaded rod 908 is threadedly connected to a threaded tube 907, and the upper end of the threaded tube 907 is fixedly connected to a third connecting rod 908. Block 905, and the third connecting block 905 is fixed to the side wall of the fixed frame 1202, the side wall of the mounting plate 1208 is fixedly connected with a distance sensor 910, and the distance sensor 910 is electrically connected to the second motor 904. When cleaning, the distance to the semiconductor substrate body 13 is checked by the distance sensor 910, and by starting the second motor 904, the rotation of the second motor 904 drives the rotation of the first threaded rod 908, thereby driving the moving block 1206 to rise and fall, and then driving the second moving plate 1207 and the mounting plate 1208 to rise and fall, ensuring that the distance between the bristles 1211 and the absorption tube 1213 and the semiconductor substrate body 13 is constant, thereby ensuring the cleaning effect.

[0051] The second moving mechanism 8 includes a second guide rod 802 fixedly connected to the opposite side walls of the two moving blocks 1206, and the second moving plate 1207 is sleeved on the side wall of the second guide rod 802, the opposite side walls of the two moving blocks 1206 are rotatably connected with the second threaded rod 803, and the second moving plate 1207 is threadedly connected to the second threaded rod 803, the side wall of one of the moving blocks 1206 is fixedly connected with the third motor 804, and the output end of the third motor 804 is fixed to one end of the second threaded rod 803, the third motor 804 is started, and the rotation of the third motor 804 drives the rotation of the second threaded rod 803, thereby driving the second moving plate 1207 to move along the side wall of the second guide rod 802.

[0052] A semiconductor substrate cleaning method, using the semiconductor substrate cleaning device, comprises the following steps:

[0053] S1: When the semiconductor substrate body 13 needs to be cleaned, the suction cup manipulator 11 is used to suck it between the two rubber plates 1205, and then the first motor 1404 is started. The rotation of the first motor 1404 drives the rotation of the double-headed screw 1403, thereby driving the two first moving plates 1217 to move closer to each other, thereby driving the two rubber plates 1205 to move closer to each other through the L-shaped plate 1203 and abut against the semiconductor substrate body 13, thereby achieving a clamping operation on the semiconductor substrate body 13;

[0054] S2: starting the third motor 804. The rotation of the third motor 804 drives the rotation of the second threaded rod 803, thereby driving the second movable plate 1207 to move. When the second movable plate 1207 moves, it drives the mounting plate 1208 to move, and then drives the U-shaped plate 1210 and the brush 1211 to move, so that the lower surface of the semiconductor substrate body 13 can be cleaned;

[0055] S3: When the second moving plate 1207 moves, the third connecting plate 303 is driven to move synchronously. When the third connecting plate 303 abuts against the side wall of the protrusion 302, the two third connecting plates 303 are pushed to move away from each other. At the same time, the second spring 403 is stretched. When the third connecting plate 303 passes over the protrusion 302, the two third connecting plates 303 can move closer to each other under the action of the second spring 403. In this way, the two third connecting plates 303 can move back and forth and drive the two U-shaped plates 1210 to move along the first guide rail 1209, so that the bristles 1211 can clean the semiconductor substrate body 13 more efficiently and effectively.

[0056] S4: During cleaning, the exhaust fan 1214 is started, and the impurities cleaned from the semiconductor substrate body 13 are absorbed through the absorption tube 1213, and enter the exhaust fan 1214 through the fixed tube 1212 and the rubber plate 1205, and are discharged through the collection tube 1216 for unified collection, so that the cleaning efficiency of the semiconductor substrate body 13 is higher and the effect is better. In addition, when the semiconductor substrate body 13 is clamped and limited, when the first movable plate 1217 moves, it will drive the baffle 601 to move synchronously, thereby pushing the sealing plate 602 to move. At the same time, the third spring 704 is compressed, and when the sealing plate 602 moves, it can block and seal part of the absorption tubes 1213 on both sides, so that the width of the air extraction and dust collection is adapted to the width of the semiconductor substrate body 13, so that the width of the air extraction and dust collection can be automatically adjusted according to the size of the semiconductor substrate body 13, ensuring the effect of dust collection and cleaning, while being more convenient and quick to use;

[0057] S5: After one surface of the semiconductor substrate body 13 is cleaned, when the second moving plate 1207 is against the second pushing plate 207, the rack 203 is driven to move along the second guide rail 202 through the second connecting plate 205 and the first connecting plate 204, thereby pushing the gear 201 and the rotating shaft 1204 to rotate, and then driving the rubber plate 1205 and the semiconductor substrate body 13 to rotate, and making the semiconductor substrate body 13 flip 180 degrees, and when the first connecting plate 204 moves, it drives the latch 505 to move synchronously, so that the latch 505 slides out of the limiting groove 501 and then slides on the L-shaped plate 1203, and at the same time, the first spring 504 is compressed, and after the semiconductor substrate body 13 flips 180 degrees, it is inserted into another limiting groove 501 under the action of the first spring 504, so that the first connecting plate 204 and the rack 203 can be limited, and then the rotating shaft 1204 and the rubber plate 1205 are limited, to avoid arbitrary rotation, more stable and reliable;

[0058] S6: Then, the second movable plate 1207 is driven by the second movable mechanism 8 to move and reset in the direction close to the second motor 904, so that the other side of the semiconductor substrate body 13 can be cleaned. After the cleaning is completed, when the second movable plate 1207 is against the first push plate 206, similarly, the rubber plate 1205 and the semiconductor substrate body 13 can be pushed to flip 180 degrees and reset again. At the same time, the limiting mechanism 5 is used to limit the position. In this way, the semiconductor substrate body 13 can be automatically turned over during cleaning to complete full-angle cleaning. It is more convenient and quick to use, and the cleaning efficiency and effect are improved.

Claims

1. A semiconductor substrate cleaning device, comprising a conveyor (10) and a suction cup robot (11) arranged on a base plate (1), wherein a semiconductor substrate body (13) is conveyed on the conveyor (10), characterized in that: A cleaning mechanism (12) for cleaning the semiconductor substrate body (13) is provided on the top of the base plate (1); The cleaning mechanism (12) comprises a plurality of symmetrically arranged support plates (1201) fixedly connected to the top of the base plate (1), and the upper end of the support plate (1201) is fixedly connected to a fixed frame (1202), the top of the fixed frame (1202) is connected to two symmetrically arranged first movable plates (1217) via a first movable mechanism (14), and the top of each first movable plate (1217) is fixedly connected to an L-shaped plate (1203), the side wall of each L-shaped plate (1203) is rotatably connected to a rubber plate (1205) via a rotating shaft (1204), and the bottom of the fixed frame (1202) is connected to two symmetrically arranged movable blocks (1206) via a lifting mechanism (9), a second movable plate (1207) is connected between the two movable blocks (1206) via a second movable mechanism (8), and the top of the second movable plate (1207) is fixedly connected to a mounting plate (1208), and the mounting plate (1208) is fixedly connected to the mounting plate (1208). The top of the second movable plate (1207) is fixedly connected to a first guide rail (1209), and two symmetrically arranged U-shaped plates (1210) are slidably connected to the first guide rail (1209), the top of each of the U-shaped plates (1210) is fixedly connected to a plurality of bristles (1211) arranged in an array, and the top of the mounting plate (1208) is fixedly connected to a fixed tube (1212), the top of the fixed tube (1212) is fixedly connected to a plurality of absorption tubes (1213) arranged in an array, and the side wall of the second movable plate (1207) is fixedly connected to an exhaust fan (1214), the outlet of the exhaust fan (1214) is fixedly connected to a collecting tube (1216), and a connecting tube (1215) is fixedly connected between the inlet of the exhaust fan (1214) and the fixed tube (1212), the turning of the rubber plate (1205) is driven by a driving mechanism (2), and the movement of the U-shaped plate (1210) is driven by a pushing mechanism (3).

2. A semiconductor substrate cleaning device according to claim 1, characterized in that: The driving mechanism (2) comprises a gear (201) fixedly sleeved on the side wall of the rotating shaft (1204); the top of the moving block (1206) is fixedly connected to a second guide rail (202); a rack (203) is slidably connected to the second guide rail (202); a first connecting plate (204) arranged in an L shape is fixedly connected to the side wall of the rack (203); a second connecting plate (205) is fixedly connected to the lower end of the first connecting plate (204); and a first pushing plate (206) and a second pushing plate (207) are fixedly connected to the two ends of the second connecting plate (205); a limiting mechanism (5) for limiting the first connecting plate (204) is provided at the top of one of the L-shaped plates (1203).

3. A semiconductor substrate cleaning device according to claim 2, characterized in that: The limiting mechanism (5) comprises two limiting grooves (501) formed on the top of the L-shaped plate (1203), the two limiting grooves (501) being hemispherical and symmetrically arranged, and the top of the first connecting plate (204) is fixedly connected to two symmetrically arranged first T-shaped guide rods (502), the side walls of the first T-shaped guide rods (502) are sleeved with first sliders (503), the side walls of each of the first T-shaped guide rods (502) are sleeved with first springs (504), and the bottom of the first slider (503) is fixedly connected to a latch pin (505).

4. The semiconductor substrate cleaning device according to claim 1, characterized in that: The pushing mechanism (3) comprises: A third connecting plate (303) fixedly connected to a side wall of each U-shaped plate (1210); A U-shaped frame (301) is arranged between two third connecting plates (303), so that the third connecting plates (303) can slide on both sides of the U-shaped frame (301) to form two sliding surfaces, and both ends of the U-shaped frame (301) are fixed to the bottoms of the two moving blocks (1206); The raised portion (302) is fixedly arranged on the sliding surface of the U-shaped frame (301), so that the third connecting plate (303) can slide along the edge of the raised portion (302); a plurality of raised portions (302) are arranged at equal intervals.

5. A semiconductor substrate cleaning device according to claim 4, characterized in that: A telescopic mechanism (4) is arranged between the two third connecting plates (303); the telescopic mechanism (4) comprises two symmetrically arranged first sleeves (401) fixedly connected to the side wall of one of the third connecting plates (303), and a first sleeve rod (402) is inserted into the first sleeve (401), and one end of the first sleeve rod (402) away from the first sleeve (401) is fixed to the side wall of the other third connecting plate (303), and the side wall of each first sleeve (401) is sleeved with a second spring (403).

6. The semiconductor substrate cleaning device according to claim 1, characterized in that: Two symmetrically arranged adjustment mechanisms (6) are arranged on the top of the mounting plate (1208), and the adjustment mechanisms (6) are used to adjust the air suction width of the absorption tube (1213), each of the adjustment mechanisms (6) comprises a sealing plate (602), and two symmetrically arranged avoidance grooves (603) are provided on the top of the sealing plate (602), each of the sealing plates (602) is connected to the side wall of the mounting plate (1208) via a reset mechanism (7), and the side wall of each first movable plate (1217) is fixedly connected to two symmetrically arranged baffles (601).

7. A semiconductor substrate cleaning device according to claim 6, characterized in that: The reset mechanism (7) comprises an L-shaped block (703) fixedly connected to the bottom of the sealing plate (602), and the side wall of the L-shaped block (703) is fixedly connected to two symmetrically arranged second T-shaped guide rods (702), the side wall of the second T-shaped guide rod (702) is sleeved with a second slider (701), and the second slider (701) is fixed to the side wall of the mounting plate (1208), and the side wall of each second T-shaped guide rod (702) is sleeved with a third spring (704).

8. The semiconductor substrate cleaning device according to claim 1, characterized in that: The first moving mechanism (14) comprises two symmetrically arranged fixing plates (1401) fixedly connected to the bottom of the fixing frame (1202), and a first guide rod (1402) is fixedly connected between the two fixing plates (1401); the first moving plate (1217) is sleeved on the side wall of the first guide rod (1402), and a double-headed screw (1403) is rotatably connected between the two fixing plates (1401); the first moving plate (1217) is threadedly connected to the side wall of the double-headed screw (1403), and a first motor (1404) is fixedly connected to the side wall of one of the fixing plates (1401).

9. The semiconductor substrate cleaning device according to claim 1, characterized in that: The lifting mechanism (9) comprises two symmetrically arranged first connecting blocks (901) fixedly connected to the side walls of each moving block (1206), and the top of each first connecting block (901) is fixedly connected to a second set of rods (902), the side walls of the second set of rods (902) are sleeved with a second sleeve (903), and the upper end of the second sleeve (903) is fixed to the bottom of the fixed frame (1202), the side wall of one of the moving blocks (1206) is fixedly connected to the second connecting block (906), and the bottom of the second connecting block (906) is fixedly connected to the second connecting block (906). A second motor (904) is fixedly connected thereto, an output end of the second motor (904) is fixedly connected to a first threaded rod (908), a side wall of the first threaded rod (908) is threadedly connected to a threaded tube (907), an upper end of the threaded tube (907) is fixedly connected to a third connection block (905), and the third connection block (905) is fixed to the side wall of the fixed frame (1202), a side wall of the mounting plate (1208) is fixedly connected to a distance sensor (910), and the distance sensor (910) is electrically connected to the second motor (904).

10. The semiconductor substrate cleaning device according to claim 1, characterized in that: The second moving mechanism (8) comprises a second guide rod (802) fixedly connected to opposite side walls of the two moving blocks (1206), and a second moving plate (1207) sleeved on the side wall of the second guide rod (802), the opposite side walls of the two moving blocks (1206) are rotatably connected to a second threaded rod (803), and the second moving plate (1207) is threadedly connected to the second threaded rod (803), and the side wall of one of the moving blocks (1206) is fixedly connected to a third motor (804), and the output end of the third motor (804) is fixed to one end of the second threaded rod (803).

11. A semiconductor substrate cleaning method, using the semiconductor substrate cleaning device according to any one of claims 1 to 10, characterized in that: The following steps are involved: S1: When the semiconductor substrate body (13) needs to be cleaned, the suction cup manipulator (11) is used to suck it between the two rubber plates (1205), and then the first motor (1404) is started. The rotation of the first motor (1404) drives the rotation of the double-headed screw (1403), thereby driving the two first movable plates (1217) to move closer to each other, thereby driving the two rubber plates (1205) to move closer to each other through the L-shaped plate (1203) and to abut against the semiconductor substrate body (13), thereby achieving a clamping operation on the semiconductor substrate body (13); S2: starting the third motor (804); the rotation of the third motor (804) drives the second threaded rod (803) to rotate, thereby driving the second movable plate (1207) to move; when the second movable plate (1207) moves, it drives the mounting plate (1208) to move, thereby driving the U-shaped plate (1210) and the brush (1211) to move, thereby cleaning the lower surface of the semiconductor substrate body (13); S3: When the second movable plate (1207) moves, the third connecting plate (303) is driven to move synchronously. When the third connecting plate (303) abuts against the side wall of the protruding portion (302), the two third connecting plates (303) are pushed to move away from each other. At the same time, the second spring (403) is stretched. When the third connecting plate (303) passes over the protruding portion (302), the two third connecting plates (303) can move closer to each other under the action of the second spring (403). In this way, the two third connecting plates (303) can move back and forth and drive the two U-shaped plates (1210) to move along the first guide rail (1209). S4: During cleaning, the exhaust fan (1214) is started, and the impurities cleaned from the semiconductor substrate body (13) are absorbed through the absorption tube (1213), and enter the exhaust fan (1214) through the fixed tube (1212) and the rubber plate (1205), and are discharged through the collection tube (1216) for unified collection, so that the cleaning efficiency of the semiconductor substrate body (13) is higher and the effect is better. In addition, when the semiconductor substrate body (13) is clamped and limited, when the first movable plate (1217) moves, it drives the baffle plate (601) to move synchronously, thereby pushing the sealing plate (602) to move. At the same time, the third spring (704) is compressed, and when the sealing plate (602) moves, it can block and seal part of the absorption tube (1213) on both sides, so that the width of the air extraction and dust collection is adapted to the width of the semiconductor substrate body (13), so that the width of the air extraction and dust collection can be automatically adjusted according to the size of the semiconductor substrate body (13); S5: After one surface of the semiconductor substrate body (13) is cleaned, when the second moving plate (1207) abuts against the second pushing plate (207), the rack (203) is driven to move along the second guide rail (202) through the second connecting plate (205) and the first connecting plate (204), thereby driving the gear (201) and the rotating shaft (1204) to rotate, thereby driving the rubber plate (1205) and the semiconductor substrate body (13) to rotate, and causing the semiconductor substrate body (13) to flip 180 degrees, and when the first connecting plate (205) and the first pushing plate (204) are moved, the second moving plate (1207) and the second pushing plate (207) are driven to move along the second guide rail (202), thereby driving the gear (201) and the rotating shaft (1204) to rotate, and then driving the rubber plate (1205) and the semiconductor substrate body (13) to rotate, and causing the semiconductor substrate body (13) to flip 180 degrees. When the connecting plate (204) moves, it drives the latch (505) to move synchronously, so that the latch (505) slides out of the limiting groove (501) and then slides on the L-shaped plate (1203). At the same time, the first spring (504) is compressed. After the semiconductor substrate body (13) is turned over 180 degrees, it is inserted into another limiting groove (501) under the action of the first spring (504), so that the first connecting plate (204) and the rack (203) can be limited, and then the rotating shaft (1204) and the rubber plate (1205) can be limited; S6: Then, the second movable plate (1207) is driven by the second movable mechanism (8) to move and reset in a direction close to the second motor (904), so that the other side of the semiconductor substrate body (13) can be cleaned. After the cleaning is completed, when the second movable plate (1207) abuts against the first push plate (206), the rubber plate (1205) and the semiconductor substrate body (13) can be pushed to flip 180 degrees and reset again. At the same time, the limiting mechanism (5) limits the position. In this way, the semiconductor substrate body (13) can be automatically turned over during cleaning to complete full-angle cleaning.

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