Wafer turnover device and turnover method

Abstract

According to the technical scheme, the wafer turnover device comprises a machine body, a mechanical arm is installed on the machine body, a supporting rod is installed at the tail end of the mechanical arm, a fixing frame is installed on the supporting rod, an adjusting piece is rotationally connected to the fixing frame, a rubber film is installed at the bottom end of a fixing disc, and a sliding disc is connected to the machine body; a spraying strip is connected to the sliding disc, a rolling rod is installed on a rotating shaft of the second motor, and an adhesive tape is installed on the rolling rod; according to the invention, by controlling the rotation of the adjusting sheet, the large-size wafer can be conveniently adsorbed, the adjustment is convenient, gas enters the inner part of the outer ring through the through hole and is slowly sprayed out from the blowing hole, so that the rubber film is blown to bulge, the softness of the rubber film is ensured, the diameter of the outer ring is large, and the large-size wafer can be conveniently adapted; and a certain gap exists between the outer ring and the rubber film under the action of air pressure, so that the rubber film is relatively soft, damage to the wafer is avoided, dust on the surface of the wafer is removed by ion wind, the dust is adhered to an adhesive tape, and secondary adhesion is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer flipping, and in particular to a wafer flipping device and a flipping method. Background Art

[0002] With the rapid development of high-end technologies such as integrated circuit semiconductor wafer transportation, manufacturing and packaging, higher technical requirements are placed on the semiconductor process equipment used in these fields.

[0003] Referring to the Chinese invention patent, the publication number is: CN 116544174A, and the name is: A wafer clamping and flipping device and method, an upper clamping claw plate and a lower clamping claw plate, the edges of the upper clamping claw plate and the lower clamping claw plate are provided with at least one pair of mutually meshing clamping blocks; a clamping drive connected to the upper clamping claw plate, which can drive the upper clamping claw plate to move toward or away from the lower clamping claw plate, and a flipping drive connected to the clamping assembly, which can drive the clamping assembly to flip. The invention provides a wafer clamping and flipping device and method, which can simultaneously realize the centering and flipping of the wafer, has strong compatibility, and flexible control methods.

[0004] However, there are still some problems in actual use:

[0005] 1. The current wafer grabbing system adopts a contact-type clamping claw design, which shows significant adaptability limitations when facing wafers of different sizes. Due to the fixed structure of the clamping claw, its clamping range and adaptability are limited, and it is difficult to accurately match and stably grasp wafers of various specifications. In addition, the precise control of the clamping force has become a major challenge. Excessive force can easily cause damage to the wafer surface, while insufficient force may cause the wafer to fall off or shift, affecting the stability and yield of the production line;

[0006] 2. When using negative pressure adsorption to grab wafers, metal suction cups are generally used as the adsorption interface. However, when the suction force is unevenly distributed due to system or design defects during the adsorption process, the local pressure concentration on the contact surface between the suction cup and the wafer will significantly increase the risk of scratches or scratches on the wafer surface. This physical damage not only affects the quality of the wafer, but may also have an adverse effect on subsequent process steps, reducing overall production efficiency and product qualification rate;

[0007] 3. Existing wafer gripping and flipping systems mostly use a blow-off dust removal method. However, while this method removes dust from the wafer surface, it also brings new problems: the dust particles blown away are easily re-adsorbed on the wafer surface under the action of the electrostatic field, causing secondary pollution. Summary of the invention

[0008] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a wafer flipping device and a flipping method which are easy to adapt to different specifications, have gentle contact, and effectively avoid secondary adhesion of dust.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A wafer flipping device comprises a machine body, a mechanical arm is mounted on the machine body, an adjusting mechanism is connected to the mechanical arm, the adjusting mechanism comprises a support rod, a support rod is mounted on the end of the mechanical arm, a fixing frame is mounted on the support rod, three telescopic bars are slidably connected to the fixing frame, the three telescopic bars are arranged in a "Y" shape, a fixing plate is mounted on the end of the telescopic bar, an adjusting piece is rotatably connected to the fixing frame, three arc grooves are arranged on the adjusting piece, the three arc grooves correspond to the three telescopic bars, the telescopic bar is slidably connected to the adjusting piece through the arc groove, and a first electric push rod for controlling the movement of the fixing plate is mounted on the support rod;

[0011] The fixed plate is connected with an adsorption mechanism, the adsorption mechanism includes a rubber membrane, the bottom end of the fixed plate is installed with a rubber membrane, the rubber membrane is provided with an air suction hole, the fixed plate is installed with a sliding air suction pipe, a hose is installed between the fixed plate and the rubber membrane, the sliding air suction pipe is connected with the air suction hole through the hose, the machine body is provided with an air pump, and the sliding air suction pipe is connected with the input end of the air pump;

[0012] The fixed disk is connected with a switching mechanism, and the switching mechanism includes an inner ring and an outer ring, the inner part of the fixed disk is slidably connected with the inner ring and the outer ring, the inner ring and the outer ring are slidably connected, and a rack is installed on the side where the inner ring and the outer ring are close to each other, and a third gear is rotatably connected to the fixed disk, and a pair of the racks are respectively meshed with the two ends of the third gear, and the bottom ends of the inner ring and the outer ring are used to contact with the rubber membrane, the inner ring and the outer ring are hollow, and the bottom walls of the inner ring and the outer ring are provided with penetrating blowing holes, and the side walls of the fixed disk are provided with penetrating exhaust holes, and the top walls of the inner ring and the outer ring are slidably connected with penetrating sliding air pipes, and the sliding air pipes are connected with a switching component for controlling gas flow, and the body is provided with an air pump, and the sliding air pipe is connected to an output pipe of the air pump;

[0013] The machine body is connected with a dust removal mechanism, the dust removal mechanism includes a sliding disk, the machine body is connected with a sliding disk, the sliding disk is connected with a spray bar, the sliding disk is equipped with a pulse ion air gun, the output pipe of the pulse ion air gun is connected with the spray bar, the inner bottom end of the sliding disk is provided with a suction groove, the machine body is equipped with a dust collector, and the input pipe of the dust collector is connected with the suction groove;

[0014] The sliding disk is connected to an adhesion mechanism, which includes a rotating circle. The sliding disk is located outside the suction groove and is rotatably connected to the rotating circle. A plurality of resistance columns are installed on the rotating circle. A pair of second motors are installed on the sliding disk. A rolling rod is installed on the rotating shaft of the second motor. A sticky tape is installed on one of the rolling rods. The free end of the sticky tape passes around the resistance column on the rotating circle and is fixed to the other rolling rod. The sticky end of the sticky tape faces the middle of the sliding disk.

[0015] Preferably, the switching assembly includes a closing cover, a closing cover is installed on the fixed frame, a piston block is rotatably connected inside the closing cover, a fixed air pipe is slidably connected to the sliding air pipe, the fixed air pipe is installed on the fixed frame, one end of the fixed air pipe is connected to the closing cover, the piston block is installed on the rotating shaft of the adjusting plate, the piston block is in a "Y" shape, the piston block shields one end of the fixed air pipe on the same fixed disk, an external pipe connected to the inside is installed on the outside of the closing cover, the external pipe is connected to the output pipe of the air pump, and the telescopic end of the first electric push rod is fixed on the closing cover.

[0016] Preferably, blocking rods are fixedly connected to the inside of the cavities of the inner ring and the outer ring, and the blocking rods are slidably connected to the sliding air pipe, and the bottom end side wall of the sliding air pipe is provided with a through hole.

[0017] Preferably, a supporting block is slidably connected to the side wall of the body, the sliding disk is slidably connected to the supporting block, a second electric push rod and a third electric push rod are installed on the supporting block, the telescopic end of the second electric push rod is installed on the sliding disk, the telescopic end of the third electric push rod is installed on the body, and the pulse ion air gun is installed on the supporting block.

[0018] Preferably, the sliding plate is located above a pair of second motors and is buckled onto a cover plate, and a groove is provided on the cover plate.

[0019] Preferably, a pair of auxiliary rods are rotatably connected to the sliding disk, the pair of auxiliary rods are located in the middle of a pair of second motors, and the adhesive tape is bypassed from a side where the pair of auxiliary rods are close to each other.

[0020] Preferably, the sliding disk is connected to a driving assembly, the driving assembly includes a rotating joint, the sliding disk is equipped with a rotating joint, the ejection strip is installed on the rotating end of the rotating joint, a connecting pipe is installed at the bottom end of the rotating joint, the input pipe of the dust collector is installed on the connecting pipe, the input pipe of the dust collector is connected to the suction groove through the connecting pipe and the rotating joint, a first gear is installed on the rotating end of the rotating joint, a first motor is installed on the sliding disk, a second gear is installed on the rotating end of the first motor, and the second gear is meshed with the first gear.

[0021] Preferably, a spacing cavity is provided in the middle of the rubber membrane, an air groove is provided on the inner side of the rubber membrane, and the hose is connected with the air suction hole through the air groove.

[0022] Preferably, a fixed air intake pipe is installed on the fixed frame, the fixed air intake pipe is connected with the sliding air intake pipe, and the three fixed air intake pipes are connected with each other.

[0023] The flipping method of the wafer flipping device comprises the following steps:

[0024] S1. The support rod is extended by the mechanical arm on the machine body, the size of the wafer to be grasped is known in advance, the first electric push rod is controlled to retract, one of the fixed plates is pulled to slide, the telescopic bar is extended, the telescopic bar slides inside the arc groove, and the adjustment plate is pulled to rotate, thereby driving the three fixed plates to move away from each other, increasing the distance between the three fixed plates, and adsorbing larger wafers;

[0025] S2, make the rubber film stick to the surface of the wafer, start the vacuum pump, form negative pressure at the suction hole, adsorb the wafer, move and flip the wafer through the robotic arm, connect the external pipe to the high-pressure gas, the rubber film bulges, the outer ring diameter is large, the contact area between the rubber film and the wafer is increased, and the compressed gas is slowly ejected from the blowing hole, and the rubber film remains in a compressible and propped-up state;

[0026] S3. Start the pulse ion air gun and the first motor, the ejection bar rotates, the pulse ion air gun ejects ion wind from the ejection bar to remove dust from the wafer surface, install the adhesive tape on the winding rod, and the adhesive tape is continuously released and reeled in, so that when the ion wind blows out the dust, the dust can be adhered to the adhesive tape.

[0027] Compared with the prior art, the present invention provides a wafer flipping device having the following beneficial effects:

[0028] 1. The wafer flipping device controls the extension of the support rod through the mechanical arm on the machine body, knows the size of the wafer to be grasped in advance, controls the contraction of the first electric push rod, pulls one of the fixed plates to slide, extends the telescopic bar, slides inside the arc groove, pulls the adjusting plate to rotate, thereby driving the three fixed plates to move away from each other, increasing the distance between the three fixed plates, making it easier to adsorb larger wafers and convenient to adjust.

[0029] 2. The wafer flipping device forms negative pressure at the air suction hole through the hose, the spacer cavity and the air groove, which is convenient for grabbing the wafer. The wafer is moved and flipped by the mechanical arm. When the adjusting plate rotates, the outer ring is pushed to slide downward. Under the action of the rack and the third gear, the inner ring moves up, and the gas enters the inside of the outer ring through the through hole and slowly sprays out from the blowing hole, thereby blowing the rubber membrane to bulge. When the wafer is slightly pressed, the internal gas is quickly discharged from the exhaust hole, thereby ensuring the softness of the rubber membrane. The outer ring has a large diameter, which lifts up a larger area of ​​the rubber membrane and increases the rubber membrane and the wafer. The contact area is large enough to accommodate larger wafers. Under the action of air pressure, there is a certain gap between the outer ring and the rubber membrane, which makes the rubber membrane relatively soft and avoids damage to the wafer. At the same time, under the pull of the hose, the rubber membrane is prevented from expanding into an arc shape, thereby ensuring a firm contact between the rubber membrane and the wafer and avoiding the wafer from detaching. Similarly, when adsorbing and grabbing smaller wafers, the first electric push rod is extended to make the three fixed plates approach each other, and the inner ring is in contact with the rubber membrane, so that the rubber membrane with a smaller area and the wafer are in contact and adsorbed to avoid leaving marks on the wafer.

[0030] 3. The wafer flipping device extends the sliding disk, starts the pulse ion wind gun and the first motor, and the pulse ion wind gun sprays ion wind from the spray bar to remove dust from the wafer surface. The spray bar rotates to improve the cleaning efficiency. The second motor drives the adhesive tape to release and retract, driving the rotating circle to rotate. When the ion wind blows out the dust, the dust can adhere to the adhesive tape to avoid secondary attachment, thereby ensuring effective dust removal of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A three-dimensional view of a wafer flipping device and a flipping method proposed by the present invention;

[0032] Figure 2 A view of the connection structure of the fixing frame of the present invention;

[0033] Figure 3 A view of a connection structure of an adjustment sheet of the present invention;

[0034] Figure 4 A view of a connection structure of a switching assembly of the present invention;

[0035] Figure 5 A view of a connection structure of a fixed disk of the present invention;

[0036] Figure 6 A view of the connection structure between the inner ring and the outer ring of the present invention;

[0037] Figure 7 A view of a connection structure between a rack and a third gear of the present invention;

[0038] Figure 8A view of the connection structure of the blowing hole of the present invention;

[0039] Fig. 9 A view of the connection structure of the blocking rod of the present invention;

[0040] Fig.10 A view of a connection structure of a rubber membrane according to the present invention;

[0041] Fig.11 A view of a connection structure of a spray bar according to the present invention;

[0042] Fig.12 A view of a connection structure of a sliding disk of the present invention;

[0043] Fig.13 A view of a connection structure of a bearing block of the present invention;

[0044] Fig.14 It is a view of the connection structure of the rotary joint of the present invention.

[0045] In the figure: 1, machine body; 2, mechanical arm; 3, adjustment mechanism; 31, support rod; 32, telescopic strip; 33, first electric push rod; 34, fixed plate; 35, adjustment plate; 36, arc groove; 37, fixed frame; 4, dust removal mechanism; 41, sliding plate; 42, ejection strip; 43, bearing block; 44, suction groove; 45, dust collector; 46, pulse ion air gun; 47, driving assembly; 471, connecting pipe; 472, rotating joint; 473, first gear; 474, second gear; 475, first motor; 48, second electric push rod; 49, third electric push rod; 5, adsorption mechanism; 51, fixed Intake pipe; 52, sliding intake pipe; 53, rubber membrane; 54, intake hole; 55, hose; 56, partition cavity; 57, air groove; 6, switching mechanism; 61, external pipe; 62, sliding air pipe; 63, fixed air pipe; 64, switching assembly; 641, closing cover; 642, piston block; 643, through hole; 644, blocking rod; 65, inner ring; 66, outer ring; 67, rack; 68, third gear; 69, blowing hole; 7, adhesion mechanism; 71, cover plate; 72, second motor; 73, rolling rod; 74, adhesive tape; 75, rotating circle; 76, resistance column; 77, auxiliary rod; 8, exhaust hole. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0047] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] Example 1: Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 A wafer flipping device includes a body 1, a mechanical arm 2 is installed on the body 1, and an adjusting mechanism 3 is connected to the mechanical arm 2. The adjusting mechanism 3 includes a support rod 31, and the support rod 31 is installed at the end of the mechanical arm 2. A fixed frame 37 is installed on the support rod 31, and three telescopic bars 32 are slidably connected to the fixed frame 37. The three telescopic bars 32 are arranged in a "Y" shape. A fixed plate 34 is installed at the end of the telescopic bar 32, and an adjusting piece 35 is rotatably connected to the fixed frame 37. The adjusting piece 35 is provided with three arc grooves 36, and the three arc grooves 36 correspond to the three telescopic bars 32. The telescopic bars 32 are slidably connected to the adjusting piece 35 through the arc grooves 36. A first electric push rod 33 for controlling the movement of the fixed plate 34 is installed on the support rod 31, so as to facilitate the adjustment of the spacing between the three fixed plates 34 and adapt to wafers of different sizes.

[0049] Example 2: Based on Example 1 Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10The fixed disk 34 is connected with an adsorption mechanism 5, which includes a rubber membrane 53. The bottom end of the fixed disk 34 is provided with a rubber membrane 53, and the rubber membrane 53 is provided with an air suction hole 54. The fixed disk 34 is provided with a sliding air suction pipe 52, and a hose 55 is installed between the fixed disk 34 and the rubber membrane 53. The sliding air suction pipe 52 is connected with the air suction hole 54 through the hose 55. The machine body 1 is provided with an air pump, and the sliding air suction pipe 52 is connected with the input end of the air pump. The fixed disk 34 is connected with a switching mechanism 6, and the switching mechanism 6 includes an inner ring 65 and an outer ring 66. The inner ring 65 and the outer ring 66 are slidably connected inside the fixed disk 34, and the inner ring 65 and the outer ring 66 are slidably connected. 6 are installed with racks 67 on the sides close to each other, and a third gear 68 is rotatably connected to the fixed plate 34. A pair of racks 67 are respectively meshed with the two ends of the third gear 68. The bottom ends of the inner ring 65 and the outer ring 66 are used to contact the rubber film 53. The inner ring 65 and the outer ring 66 are hollow. The bottom walls of the inner ring 65 and the outer ring 66 are provided with penetrating blowing holes 69. The side wall of the fixed plate 34 is provided with penetrating exhaust holes 8. The top walls of the inner ring 65 and the outer ring 66 are slidably connected with a penetrating sliding air pipe 62. The sliding air pipe 62 is connected to a switching component 64 for controlling the flow of gas. The body 1 is equipped with an air pump, and the sliding air pipe 62 is connected to the output pipe of the air pump, so as to facilitate the adsorption of the wafer.

[0050] In the present invention, the switching component 64 includes a closing cover 641, which is installed on the fixed frame 37. The interior of the closing cover 641 is rotatably connected to a piston block 642. The sliding air pipe 62 is slidably connected to a fixed air pipe 63. The fixed air pipe 63 is installed on the fixed frame 37. One end of the fixed air pipe 63 is connected to the closing cover 641. The piston block 642 is installed on the rotating shaft of the adjusting plate 35. The piston block 642 has a "Y"-shaped structure. The piston block 642 shields the end of one of the fixed air pipes 63 on the same fixed disk 34. An external pipe 61 connected to the interior is installed on the outer side of the closing cover 641. The external pipe 61 is connected to the output pipe of the air pump. The telescopic end of the first electric push rod 33 is fixed on the closing cover 641, so as to facilitate switching to the inner ring 65 or the outer ring 66 to adapt to wafers of different sizes.

[0051] In the present invention, the inner cavities of the inner ring 65 and the outer ring 66 are fixedly connected with blocking rods 644, which are slidably connected to the sliding air pipe 62. The bottom side wall of the sliding air pipe 62 is provided with a through hole 643, so as to facilitate the movement of the inner ring 65 or the outer ring 66.

[0052] In the present invention, a spacer cavity 56 is provided in the middle of the rubber membrane 53, an air groove 57 is provided inside the rubber membrane 53, and the hose 55 is connected with the air suction hole 54 through the air groove 57, so that each air suction hole 54 can work.

[0053] In the present invention, a fixed air intake pipe 51 is installed on the fixed frame 37, and the fixed air intake pipe 51 is connected to the sliding air intake pipe 52, and the three fixed air intake pipes 51 are connected to each other, so that it is convenient to connect the three fixed air intake pipes 51 and extract the gas.

[0054] Example 3: Based on Example 2 Fig.11 , Fig.12 , Fig.13 and Fig.14 The machine body 1 is connected with a dust removal mechanism 4, which includes a sliding plate 41, a sliding plate 41 is connected to the machine body 1, a spray bar 42 is connected to the sliding plate 41, the sliding plate 41 is provided with a pulse ion air gun 46, the output pipe of the pulse ion air gun 46 is connected to the spray bar 42, a suction groove 44 is provided at the inner bottom end of the sliding plate 41, the machine body 1 is provided with a dust collector 45, the input pipe of the dust collector 45 is connected to the suction groove 44, the sliding plate 41 is connected with an adhesion mechanism 7, the adhesion mechanism 7 includes The rotating circle 75 and the sliding disk 41 are located outside the suction groove 44 and are rotatably connected to the rotating circle 75. A plurality of resistance posts 76 are installed on the rotating circle 75. A pair of second motors 72 are installed on the sliding disk 41. A rolling rod 73 is installed on the rotating shaft of the second motor 72. A sticky tape 74 is installed on one of the rolling rods 73. The free end of the sticky tape 74 passes around the resistance post 76 on the rotating circle 75 and is fixed on the other rolling rod 73. The sticky end of the sticky tape 74 faces the middle of the sliding disk 41, so as to facilitate the removal of dust.

[0055] In the present invention, a supporting block 43 is slidably connected to the side wall of the body 1, a sliding plate 41 is slidably connected to the supporting block 43, a second electric push rod 48 and a third electric push rod 49 are installed on the supporting block 43, a telescopic end of the second electric push rod 48 is installed on the sliding plate 41, a telescopic end of the third electric push rod 49 is installed on the body 1, and a pulse ion air gun 46 is installed on the supporting block 43 for easy storage when not in use.

[0056] In the present invention, the sliding plate 41 is located above a pair of second motors 72 and is buckled with a cover plate 71 . The cover plate 71 is provided with grooves to protect the second motors 72 and the adhesive tape 74 .

[0057] In the present invention, a pair of auxiliary rods 77 are rotatably connected to the sliding plate 41, and the pair of auxiliary rods 77 are located in the middle of a pair of second motors 72. The adhesive tape 74 is bypassed from the side where the pair of auxiliary rods 77 are close to each other, thereby ensuring a larger area of ​​dust adhesion.

[0058] In the present invention, a driving component 47 is connected to the sliding disk 41, and the driving component 47 includes a rotating joint 472. The sliding disk 41 is equipped with a rotating joint 472, and the ejection bar 42 is installed on the rotating end of the rotating joint 472. A connecting pipe 471 is installed at the bottom end of the rotating joint 472. The input pipe of the dust collector 45 is installed on the connecting pipe 471. The input pipe of the dust collector 45 is connected to the suction groove 44 through the connecting pipe 471 and the rotating joint 472. A first gear 473 is installed on the rotating end of the rotating joint 472. A first motor 475 is installed on the sliding disk 41. A second gear 474 is installed on the rotating end of the first motor 475. The second gear 474 is meshed with the first gear 473, so as to facilitate driving the ejection bar 42 to rotate and improve the cleaning efficiency of the wafer.

[0059] Working principle: The support rod 31 is extended by the mechanical arm 2 on the machine body 1, and the size of the wafer to be grasped is known in advance, and the first electric push rod 33 is controlled to retract, and one of the fixed plates 34 is pulled to slide, and the telescopic bar 32 is extended, and the telescopic bar 32 slides inside the arc groove 36, and the adjustment plate 35 is pulled to rotate, thereby driving the three fixed plates 34 to move away from each other, so that the distance between the three fixed plates 34 is increased, which is convenient for adsorbing larger wafers and easy to adjust;

[0060] The rubber film 53 is attached to the surface of the wafer, and the vacuum pump is started to extract the air inside the fixed suction pipe 51 and the sliding suction pipe 52, and negative pressure is formed at the suction hole 54 through the hose 55, the spacer cavity 56 and the air groove 57, so that the wafer is adsorbed to facilitate the grabbing of the wafer, and the wafer is moved and turned by the robot arm 2. When the adjustment plate 35 rotates, the piston block 642 is driven to rotate, so that the fixed air supply pipe 63 connected to the outer ring 66 is opened, and the fixed air supply pipe 63 connected to the inner ring 65 is blocked, so that when the external pipe 61 is connected to the high-pressure gas, the outer ring 66 is pushed to slide downward, and under the action of the rack 67 and the third gear 68, the inner ring 65 moves up, and the gas enters the interior of the outer ring 66 through the through hole 643, and is slowly ejected from the blowing hole 69, thereby blowing the rubber film 53 to bulge, and the wafer is slightly pressed. When the pressure is applied, the internal gas is quickly released from the exhaust hole 8, thereby ensuring the softness of the rubber membrane 53. The outer ring 66 has a large diameter, which lifts up the rubber membrane 53 with a larger area, increasing the contact area between the rubber membrane 53 and the wafer, so as to facilitate the adaptation to wafers of larger sizes. Under the action of air pressure, there is a certain gap between the outer ring 66 and the rubber membrane 53, so that the rubber membrane 53 is relatively soft to avoid damage to the wafer. At the same time, under the pull of the hose 55, the rubber membrane 53 is prevented from expanding into an arc shape, thereby ensuring a firm contact between the rubber membrane 53 and the wafer to avoid the wafer from detaching. Similarly, when a smaller wafer is adsorbed and grasped, the first electric push rod 33 is extended to make the three fixing plates 34 approach each other, and the inner ring 65 is in conflict with the rubber membrane 53, so that the rubber membrane 53 with a smaller area and the wafer are in conflict and adsorbed, avoiding leaving marks on the wafer.

[0061] When the wafer surface needs to be cleaned, the third electric push rod 49 is started, the supporting block 43 is extended, the second electric push rod 48 is started, the sliding plate 41 is extended, so that the wafer is moved to the inside of the sliding plate 41, the pulse ion air gun 46 and the first motor 475 are started, and the first gear 473 and the rotating end of the rotating joint 472 are driven to rotate through the second gear 474, thereby driving the ejection bar 42 to rotate, and the pulse ion air gun 46 ejects ion wind from the ejection bar 42, thereby removing dust from the wafer surface, and ejecting The strip 42 rotates to improve the cleaning efficiency, and at the same time the dust collector 45 is started to suck in the dust through the suction slot 44. Before using the dust removal, the cover 71 is opened, the adhesive tape 74 is installed on the rolling rod 73, and the adhesive tape 74 is passed around the rotating circle 75, the resistance column 76 and the auxiliary rod 77. When in use, the adhesive tape 74 is driven by the second motor 72 to release and retract, driving the rotating circle 75 to rotate, so that when the ion wind blows out the dust, the dust can be adhered to the adhesive tape 74 to avoid secondary adhesion, thereby ensuring effective dust removal of the wafer.

[0062] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer flipping device, comprising a body (1), on which a mechanical arm (2) is mounted, characterized in that: The mechanical arm (2) is connected to an adjustment mechanism (3), the adjustment mechanism (3) comprising a support rod (31), the support rod (31) being installed at the end of the mechanical arm (2), a fixing frame (37) being installed on the support rod (31), three telescopic bars (32) being slidably connected to the fixing frame (37), the three telescopic bars (32) being arranged in a "Y" shape, a fixing plate (34) being installed at the end of the telescopic bars (32), an adjustment plate (35) being rotatably connected to the fixing frame (37), the adjustment plate (35) being provided with three arc grooves (36), the three arc grooves (36) corresponding to the three telescopic bars (32), the telescopic bars (32) being slidably connected to the adjustment plate (35) via the arc grooves (36), and a first electric push rod (33) for controlling the movement of the fixing plate (34) being installed on the support rod (31); The fixed disk (34) is connected to an adsorption mechanism (5), the adsorption mechanism (5) comprises a rubber membrane (53), the bottom end of the fixed disk (34) is provided with a rubber membrane (53), the rubber membrane (53) is provided with an air suction hole (54), the fixed disk (34) is provided with a sliding air suction pipe (52), a hose (55) is provided between the fixed disk (34) and the rubber membrane (53), the sliding air suction pipe (52) is connected to the air suction hole (54) through the hose (55), the machine body (1) is provided with an air pump, and the sliding air suction pipe (52) is connected to the input end of the air pump; The fixed disk (34) is connected to a switching mechanism (6), the switching mechanism (6) comprising an inner ring (65) and an outer ring (66), the inner ring (65) and the outer ring (66) are slidably connected inside the fixed disk (34), the inner ring (65) and the outer ring (66) are slidably connected to each other, a rack (67) is installed on one side of the inner ring (65) and the outer ring (66) close to each other, a third gear (68) is rotatably connected to the fixed disk (34), a pair of the racks (67) are respectively meshed with two ends of the third gear (68), the inner ring (65) and the outer ring (66) are slidably connected to each other, The bottom end of the inner ring (66) is used to contact the rubber membrane (53), the inner ring (65) and the outer ring (66) are hollow, the bottom walls of the inner ring (65) and the outer ring (66) are provided with penetrating blowing holes (69), the side wall of the fixed plate (34) is provided with penetrating exhaust holes (8), the top walls of the inner ring (65) and the outer ring (66) are slidably connected with penetrating sliding air pipes (62), the sliding air pipes (62) are connected with a switching component (64) for controlling the flow of gas, the body (1) is equipped with an air pump, and the sliding air pipe (62) is connected to the output pipe of the air pump; The machine body (1) is connected to a dust removal mechanism (4), the dust removal mechanism (4) comprises a sliding disk (41), the machine body (1) is connected to a sliding disk (41), the sliding disk (41) is connected to a spray bar (42), the sliding disk (41) is provided with a pulse ion air gun (46), the output pipe of the pulse ion air gun (46) is connected to the spray bar (42), the inner bottom end of the sliding disk (41) is provided with a suction groove (44), the machine body (1) is provided with a dust collector (45), the input pipe of the dust collector (45) is connected to the suction groove (44); The sliding disk (41) is connected to an adhesion mechanism (7), and the adhesion mechanism (7) comprises a rotating circle (75). The sliding disk (41) is located outside the suction groove (44) and is rotatably connected to the rotating circle (75). A plurality of abutment columns (76) are mounted on the rotating circle (75). A pair of second motors (72) are mounted on the sliding disk (41). A rolling rod (73) is mounted on the rotating shaft of the second motor (72). A sticky tape (74) is mounted on one of the rolling rods (73). The free end of the sticky tape (74) passes around the abutment column (76) on the rotating circle (75) and is fixed to the other rolling rod (73). The sticky end of the sticky tape (74) faces the middle of the sliding disk (41).

2. A wafer flipping device according to claim 1, characterized in that: The switching assembly (64) comprises a closing cover (641), the closing cover (641) is mounted on the fixing frame (37), a piston block (642) is rotatably connected inside the closing cover (641), a fixed air supply pipe (63) is slidably connected to the sliding air supply pipe (62), the fixed air supply pipe (63) is mounted on the fixing frame (37), one end of the fixed air supply pipe (63) is connected to the closing cover (641), the piston block (642) is mounted on the rotating shaft of the adjustment plate (35), the piston block (642) is in a "Y"-shaped structure, the piston block (642) shields the end of one of the fixed air supply pipes (63) on the same fixing plate (34), an external pipe (61) connected to the inside is mounted on the outside of the closing cover (641), the external pipe (61) is connected to the output pipe of the air pump, and the telescopic end of the first electric push rod (33) is fixed on the closing cover (641).

3. A wafer flipping device according to claim 2, characterized in that: The cavities of the inner ring (65) and the outer ring (66) are both fixedly connected with blocking rods (644), and the blocking rods (644) are slidably connected to the sliding air supply pipe (62), and the bottom end side wall of the sliding air supply pipe (62) is provided with a through hole (643).

4. The wafer flipping device according to claim 1, characterized in that: A bearing block (43) is slidably connected to the side wall of the body (1), the sliding disk (41) is slidably connected to the bearing block (43), a second electric push rod (48) and a third electric push rod (49) are installed on the bearing block (43), the telescopic end of the second electric push rod (48) is installed on the sliding disk (41), the telescopic end of the third electric push rod (49) is installed on the body (1), and the pulse ion wind gun (46) is installed on the bearing block (43).

5. The wafer flipping device according to claim 1, characterized in that: The sliding plate (41) is located above a pair of second motors (72) and is buckled with a cover plate (71), and a groove is provided on the cover plate (71).

6. The wafer flipping device according to claim 1, characterized in that: A pair of auxiliary rods (77) are rotatably connected to the sliding plate (41), and the pair of auxiliary rods (77) are located in the middle of a pair of second motors (72). The adhesive tape (74) is passed around from one side of the pair of auxiliary rods (77) that are close to each other.

7. The wafer flipping device according to claim 1, characterized in that: The sliding disk (41) is connected to a driving assembly (47), the driving assembly (47) comprising a rotating joint (472), the sliding disk (41) is provided with a rotating joint (472), the ejection strip (42) is provided on the rotating end of the rotating joint (472), a connecting pipe (471) is provided at the bottom end of the rotating joint (472), an input pipe of the dust collector (45) is provided on the connecting pipe (471), the input pipe of the dust collector (45) is communicated with the suction groove (44) through the connecting pipe (471) and the rotating joint (472), a first gear (473) is provided on the rotating end of the rotating joint (472), a first motor (475) is provided on the sliding disk (41), a second gear (474) is provided on the rotating end of the first motor (475), and the second gear (474) is meshed with the first gear (473).

8. The wafer flipping device according to claim 1, characterized in that: A spacing cavity (56) is provided in the middle of the rubber membrane (53), an air groove (57) is provided inside the rubber membrane (53), and the hose (55) is connected to the air suction hole (54) through the air groove (57).

9. The wafer flipping device according to claim 1, characterized in that: A fixed air intake pipe (51) is installed on the fixed frame (37), the fixed air intake pipe (51) is connected to the sliding air intake pipe (52), and the three fixed air intake pipes (51) are connected to each other.

10. A flipping method for a wafer flipping device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, controlling the support rod (31) to extend through the mechanical arm (2) on the machine body (1), knowing in advance the size of the wafer to be grasped, controlling the first electric push rod (33) to retract, pulling one of the fixed plates (34) to slide, extending the telescopic bar (32), sliding the telescopic bar (32) inside the arc groove (36), pulling the adjustment plate (35) to rotate, thereby driving the three fixed plates (34) to move away from each other, increasing the distance between the three fixed plates (34), and adsorbing the larger wafer; S2, the rubber film (53) is attached to the surface of the wafer, and the vacuum pump is started to form a negative pressure at the suction hole (54) to adsorb the wafer. The wafer is moved and turned over by the mechanical arm (2), and the external pipe (61) is connected to the high-pressure gas. The rubber film (53) swells, and the outer ring (66) has a large diameter, which increases the contact area between the rubber film (53) and the wafer. The compressed gas is slowly ejected from the blowing hole (69), and the rubber film (53) remains in a compressible and propped-up state; S3, start the pulse ion wind gun (46) and the first motor (475), the ejection bar (42) rotates, the pulse ion wind gun (46) ejects ion wind from the ejection bar (42) to remove dust from the surface of the wafer, and the adhesive tape (74) is installed on the winding rod (73). The adhesive tape (74) is continuously released and reeled in, so that when the ion wind blows out the dust, the dust can be adhered to the adhesive tape (74).

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