A semiconductor processing substrate flipping device and its flipping method

Abstract

The present invention relates to the field of semiconductor processing technology, and discloses a semiconductor processing substrate flipping device and a flipping method thereof, including a main body and two connecting plates. Both connecting plates are fixedly connected to the top of the main body. A lifting hole is provided at the middle axis on the left side of the dual-axis motor. The device further includes a transmission mechanism, which is arranged between the two connecting plates. The transmission mechanism includes two limit sliding frames, and the two limit sliding frames are respectively slidably connected inside the two lifting holes. The present invention can automatically clamp the substrate on the fitting bottom plate during the descending process of the limit sliding frame, replacing the clamping device with a separate driving mechanism, avoiding the situation that when the driving mechanism on the clamping device fails and the substrate moves into the clamping device for rotation, the substrate may not be clamped tightly and fall off, reducing the phenomenon of substrate damage caused by falling during the flipping process, thereby improving the efficiency of semiconductor processing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and particularly to a semiconductor processing substrate flipping device and a flipping method thereof. Background Technique

[0002] Currently, a semiconductor material is fixed on a processing substrate by melting wax, and then machine processing is carried out (the processing substrate is generally made of materials such as quartz, ceramics, and silicon). In semiconductor processing, it is necessary to turn over the substrate.

[0003] Generally, during the substrate transfer process, the substrate will move onto the flipping device, and then the clamping device on the flipping device clamps the substrate. Then, the motor drives the clamping device to flip 180° to flip the clamped substrate. However, when clamping the substrate, a separate driving mechanism drives the clamping mechanism. Therefore, precise debugging is required before using this flipping device. And when the driving mechanism on the clamping device fails, the substrate moving into the clamping device for rotation will cause the substrate to fall due to insufficient clamping, which will not only damage the substrate but also affect the efficiency of semiconductor processing. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor processing substrate flipping device and a flipping method thereof to solve the problems raised in the above background technique.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a semiconductor processing substrate flipping device and a flipping method thereof, including a main body and two connecting plates. The two connecting plates are both fixedly connected to the top of the main body. Lifting holes are respectively formed in the two connecting plates, and further include:

[0007] A transmission mechanism, which is arranged between the two connecting plates. The transmission mechanism includes two limiting sliding frames, and the two limiting sliding frames are respectively slidably connected inside the two lifting holes;

[0008] A positioning mechanism, which is arranged at the bottom of the limiting sliding frame. The positioning mechanism includes a strip-shaped sliding hole frame, the strip-shaped sliding hole frame is rotatably connected to the bottom of the limiting sliding frame, one end of the strip-shaped sliding hole frame away from the limiting sliding frame is slidably connected to a double-headed rotating frame, and the same end of the double-headed rotating frame away from the strip-shaped sliding hole frame is rotatably connected to an inner rotating frame;

[0009] A pressing mechanism, which is arranged at the end of the inner rotating frame away from the double-headed rotating frame. The pressing mechanism includes a pull bar, the pull bar is fixedly connected to the end of the inner rotating frame away from the double-headed rotating frame, a double-strip-shaped hole frame is slidably connected to the outer wall of the pull bar, one end of the double-strip-shaped hole frame away from the pull bar is fixedly connected to a pressing frame, and one end of the pressing frame away from the double-strip-shaped hole frame is fixedly connected to a pressing wheel.

[0010] Furthermore, a support frame is fixedly connected to the bottom of the main body. On one side of the two connecting plates facing each other, two limiting blocks are fixedly connected respectively. On the inner wall of the top of the lifting hole, a rotating hole frame is fixedly connected. On the top of the connecting plate, a pressing connection frame is fixedly connected. At one end of the outer wall of the connecting plate away from the main body, a rotating connection frame is fixedly connected.

[0011] Furthermore, the transmission mechanism further includes an electric lifting rod. The electric lifting rod is fixedly connected to the center of the top of the support frame. At the output end of the electric lifting rod, a connection frame is fixedly connected. At both ends of the top of the connection frame close to the two connecting plates, two transmission frames are fixedly connected respectively. A separation groove is formed between the two transmission frames. The limiting sliding frame is fixedly connected to the outer walls of the two transmission frames. The bottom of the edge of the top of the transmission frame abuts against the bottom of the limiting block.

[0012] Furthermore, a clamping mechanism is arranged inside the rotating hole frame. The clamping mechanism includes a belt wheel rotating frame. The belt wheel rotating frame is rotatably connected inside the rotating hole frame. On the right side of the belt wheel rotating frame, a fitting abutting plate is fixedly connected. On the top of the fitting abutting plate near one end of the belt wheel rotating frame, a sliding plate is slidably connected. The bottom of the sliding plate abuts against the inner wall of the bottom of the separation groove. A belt is sleeved on the outer wall of the belt wheel rotating frame and the output end of the double-shaft motor.

[0013] Furthermore, the bottom of the fitting abutting plate abuts against the inner wall of the bottom of the separation groove. A sliding cavity is formed through the left side of the belt wheel rotating frame. On one side of the sliding plate close to the belt wheel rotating frame, a positioning jack is formed. The positioning jack corresponds to and is used in cooperation with the sliding cavity. On the top of the sliding plate, an extension frame is fixedly connected. On the top of the extension frame away from the sliding plate, a buffer pressing frame is slidably connected. A spring is fixedly connected between the top of the buffer pressing frame and the extension frame, and the buffer pressing frame slidably penetrates through the extension frame.

[0014] Furthermore, the positioning mechanism further includes a positioning insertion rod. The positioning insertion rod is slidably connected inside the sliding cavity, and when the positioning jack corresponds to the sliding cavity, the positioning insertion rod just enters the positioning jack.

[0015] Furthermore, at one end of the positioning insertion rod away from the belt wheel rotating frame, an outer connection frame is fixedly connected. The inner wall of the outer connection frame is rotatably connected to an inner rotating frame. One end of the inner rotating frame away from the outer connection frame is slidably connected to the outer wall of the rotating connection frame.

[0016] Furthermore, a strip-shaped sliding hole is formed at the connection between the double-strip hole frame and the pull bar. The double-strip hole frame is rotatably connected to the pressing connection frame. Inside the pressing wheel, a roller is arranged, and the roller inside the pressing wheel abuts against the top of the sliding plate.

[0017] A method for flipping a semiconductor processing substrate includes the following steps:

[0018] S1: By placing the device between two substrate transfer devices, during the normal transfer process of the substrate transfer, the substrate will be transferred onto the conveyor belt on the transfer rack, and the transfer rack will drive the substrate to completely enter between the two connecting plates;

[0019] S2: The electric lifting rod drives the connecting frame to descend, driving the two groups of transfer racks to slide down inside the lifting holes through the limit sliding racks, thereby separating the transfer racks from the substrate;

[0020] S3: When the limit sliding rack slides down inside the lifting hole, it will drive the strip-shaped sliding hole rack to slide and rotate while sliding at one end of the double-headed rotating rack away from the inner rotating rack. When the limit sliding rack descends a certain distance, it will pull the double-headed rotating rack to follow and descend, so that the end of the double-headed rotating rack away from the strip-shaped sliding hole rack rotates at the end of the inner rotating rack away from the pull bar, increasing the distance between the double-headed rotating rack and the inner rotating rack, gradually driving the double-headed rotating rack and the strip-shaped sliding hole rack to form a straight line, driving the outer connecting frame and the positioning plug rod to be pushed into the interior of the sliding cavity, and making the positioning plug rod slide at a place on the top of the fitting backing plate inside the sliding cavity;

[0021] S4: When the outer connecting frame drives the positioning plug rod to slide inside the sliding cavity, at the same time, the inner rotating rack rotates inside the outer connecting frame, so that the connection between the inner rotating rack and the pull bar slides while rotating on the rotating connecting frame, so that the pull bar slides and rotates inside the double-strip hole rack. By the pull bar pushing the double-strip hole rack to apply an upward thrust, the connection between the double-strip hole rack and the pressing frame rotates on the pressing connecting frame, thereby driving the pressing wheel to press down, making the pressing wheel move towards the top of the sliding plate, so that the pressing wheel squeezes the top of the sliding plate, and the bottom of the buffer pressing frame squeezes and clamps the substrate on the fitting backing plate;

[0022] S5: While performing the extrusion and clamping, the positioning jack is corresponding to the sliding cavity, so that the positioning plug rod enters the positioning jack to position the position of the sliding plate. Through the connection between the belt at the output end of the double-shaft motor and the belt wheel rotating frame, the belt wheel rotating frame is driven to rotate inside the hole rack, thereby driving the fitting backing plate and the substrate clamped between the fitting backing plate and the buffer pressing frame to rotate.

[0023] The present invention has the following beneficial effects:

[0024] (1) When the outer connection frame drives the positioning insertion rod to slide inside the sliding cavity in the present invention, the inner rotating frame rotates inside the outer connection frame at the same time, and the included angle between the inner rotating frame and the outer connection frame gradually increases, so that the connection between the inner rotating frame and the pull bar rotates and slides on the rotating connection frame, thereby enabling the pull bar to rotate and slide inside the double-strip hole frame. By the pull bar pushing the double-strip hole frame to apply an upward thrust, the connection between the double-strip hole frame and the lower pressing frame rotates on the pressing connection frame, thereby driving the pressing wheel to press downwards, causing the pressing wheel to move towards the top of the sliding plate, so that the pressing wheel squeezes the top of the sliding plate, cushioning the extrusion and clamping of the substrate on the fitting abutting plate by the bottom of the buffer lower pressing frame, stretching the spring between the top of the buffer lower pressing frame and the extension frame, and at the same time, the positioning insertion hole corresponds to the sliding cavity, enabling the positioning insertion rod to enter the positioning insertion hole to position the sliding plate, so that the substrate on the fitting abutting plate can be automatically clamped during the descent of the limit sliding frame, replacing the clamping device with a separate drive mechanism, avoiding the substrate moving into the clamping device and rotating when the drive mechanism on the clamping device fails, resulting in the substrate not being clamped and falling, reducing the phenomenon of the substrate being damaged due to falling during the flipping process, and thus improving the efficiency of semiconductor processing.

[0025] (2) In the present invention, by placing the device between two substrate transfer devices, during the normal transfer process of the substrate transfer, the substrate will be transferred onto the conveyor belt on the transfer frame, and the transfer frame drives the substrate to completely enter between the two connecting plates. The electric lifting rod drives the connecting frame to descend, driving the two groups of transfer frames to slide down inside the lifting holes through the limit sliding frame, so that the transfer frame is separated from the substrate, leaving a spacing for the substrate to flip between the substrate and the transfer frame when the substrate is flipped. After the transfer frame descends, the substrate falls on the top of the fitting abutting plate. At the same time, after the transfer frame descends, the bottom of the sliding plate loses the force against the inner wall of the bottom of the separation groove, causing the sliding plate to descend inside the fitting abutting plate, so that the bottom of the buffer lower pressing frame abuts against the top of the substrate, facilitating the limit sliding frame to press against the sliding plate through the pressing wheel during the descent process, and squeezing and clamping the buffer lower pressing frame against the top of the substrate, improving the practicability of the device.

[0026] (3) Through the rotational connection between the bottom of the limit sliding frame and the strip-shaped sliding hole frame, when the limit sliding frame slides downward inside the lifting hole, it will drive the strip-shaped sliding hole frame to slide and rotate simultaneously at one end of the double-headed rotating frame away from the inner rotating frame. After the limit sliding frame descends a certain distance, it will pull the double-headed rotating frame to descend along with it, so that the end of the double-headed rotating frame away from the strip-shaped sliding hole frame rotates at the end of the inner rotating frame away from the pull bar, increasing the distance between the double-headed rotating frame and the inner rotating frame. Gradually, the double-headed rotating frame and the strip-shaped sliding hole frame are driven to form a straight line, thereby driving the outer connection frame and the positioning insertion rod to be pushed into the interior of the sliding cavity. The positioning insertion rod slides on the top of the fitting abutment plate inside the sliding cavity, so that after the positioning insertion hole corresponds to the sliding cavity, the positioning insertion rod can pass through the sliding cavity and be inserted into the positioning insertion hole, thereby positioning the positions of the positioning insertion hole and the fitting abutment plate, avoiding the phenomenon that the sliding plate resets due to the separation of the top of the sliding plate from the pressing wheel during the flipping process, thus avoiding affecting the flipping of the substrate and improving the automation performance of the device.

[0027] (4) After clamping the substrate on the fitting abutment plate, through the connection between the belt at the output end of the double-shaft motor and the pulley rotating frame, the pulley rotating frame is driven to rotate inside the rotating hole frame, thereby driving the fitting abutment plate and the substrate clamped between the fitting abutment plate and the buffer pressing frame to rotate, so as to flip the substrate. When the transmission frame resets, the flipped substrate is automatically released through the reverse steps described above. After the transmission frame contacts the substrate, the substrate is conveyed backward. Then, as the transmission frame descends, the pulley rotating frame rotates, driving the fitting abutment plate and the sliding plate to reset, facilitating the next flipping of the substrate.

[0028] Of course, it is not necessary for any product implementing the present invention to simultaneously achieve all the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 It is a cross-sectional view of the overall structure of the present invention;

[0032] Figure 3 It is a schematic diagram of the main structure of the present invention;

[0033] Figure 4 It is a schematic diagram of the transmission mechanism structure of the present invention;

[0034] Figure 5Schematic diagram of the positioning mechanism of the present invention;

[0035] Figure 6 Schematic diagram of the clamping mechanism of the present invention;

[0036] Figure 7 Schematic diagram of the pressing mechanism of the present invention;

[0037] Figure 8 is Figure 3 Enlarged view of part A in

[0038] Figure 9 Method diagram of the present invention.

[0039] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0040] In the figure: 1, main body; 101, support frame; 102, dual-axis motor; 103, connecting plate; 104, limit block; 105, lifting hole; 106, rotating hole frame; 107, pressing connection frame; 108, rotating connection frame; 2, transmission mechanism; 201, electric lifting rod; 202, connection frame; 203, transmission frame; 204, separation groove; 205, limit sliding frame; 3, clamping mechanism; 301, belt pulley rotating frame; 302, fitting and pressing plate; 303, sliding plate; 304, sliding cavity; 305, positioning jack; 306, extension frame; 307, buffer pressing frame; 4, positioning mechanism; 401, positioning plug rod; 402, outer connection frame; 403, inner rotating frame; 404, strip-shaped sliding hole frame; 405, double-headed rotating frame; 5, pressing mechanism; 501, pull bar; 502, double-strip-shaped hole frame; 503, pressing frame; 504, pressing wheel. Specific implementation manner

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] Example 1, please refer to Figures 1-9 As shown, the present invention is a semiconductor processing substrate flipping device and its flipping method, including a main body 1 and two connecting plates 103. The two connecting plates 103 are both fixedly connected to the top of the main body 1, and lifting holes 105 are respectively opened on the two connecting plates 103. It further includes:

[0043] The transmission mechanism 2 is arranged between two connecting plates 103. The transmission mechanism 2 includes two limiting sliding frames 205, and the two limiting sliding frames 205 are respectively slidably connected inside two lifting holes 105. The transmission mechanism 2 further includes an electric lifting rod 201. The electric lifting rod 201 is fixedly connected to the center of the top of the support frame 101. The output end of the electric lifting rod 201 is fixedly connected with a connecting frame 202. Both ends of the top of the connecting frame 202 close to the two connecting plates 103 are fixedly connected with two transmission frames 203. A separation groove 204 is formed between the two transmission frames 203. The limiting sliding frame 205 is fixedly connected to the outer walls of the two transmission frames 203. The top edge of the transmission frame 203 abuts against the bottom of the limiting block 104. During the normal transmission process of the substrate, it will be transmitted onto the conveyor belt on the transmission frame 203. The transmission frame 203 drives the substrate to completely enter between the two connecting plates 103. The electric lifting rod 201 drives the connecting frame 202 to descend, driving the two groups of transmission frames 203 to slide down inside the lifting holes 105 through the limiting sliding frames 205, so that the transmission frame 203 is separated from the substrate. When the substrate is flipped, a space can be left between the substrate and the transmission frame 203 for the substrate to be flipped. After the transmission frame 203 descends, the substrate falls on the top of the fitting bottom plate 302;

[0044] The positioning mechanism 4 is arranged at the bottom of the limit sliding frame 205. The positioning mechanism 4 includes a strip-shaped sliding hole frame 404 which is rotatably connected to the bottom of the limit sliding frame 205. A double-headed rotating frame 405 is slidably connected to one end of the strip-shaped sliding hole frame 404 away from the limit sliding frame 205. An inner rotating frame 403 is rotatably connected to the same end of the double-headed rotating frame 405 away from the strip-shaped sliding hole frame 404. The positioning mechanism 4 further includes a positioning insertion rod 401 which is slidably connected inside the sliding cavity 304. And when the positioning insertion hole 305 corresponds to the sliding cavity 304, the positioning insertion rod 401 just enters into the positioning insertion hole 305. One end of the positioning insertion rod 401 away from the belt pulley rotating frame 301 is fixedly connected with an outer connection frame 402. The inner wall of the outer connection frame 402 is rotatably connected to the inner rotating frame 403. One end of the inner rotating frame 403 away from the outer connection frame 402 is slidably connected to the outer wall of the rotating connection frame 108. When the outer connection frame 402 drives the positioning insertion rod 401 to slide inside the sliding cavity 304, at the same time, the inner rotating frame 403 rotates inside the outer connection frame 402, and the included angle between the inner rotating frame 403 and the outer connection frame 402 gradually becomes larger, so that the connection position between the inner rotating frame 403 and the pull bar 501 rotates and slides on the rotating connection frame 108, and the pull bar 501 rotates and slides inside the double-strip-shaped hole frame 502. Through the rotational connection between the bottom of the limit sliding frame 205 and the strip-shaped sliding hole frame 404, when the limit sliding frame 205 slides down inside the lifting hole 105, it will drive the strip-shaped sliding hole frame 404 to slide and rotate at one end of the double-headed rotating frame 405 away from the inner rotating frame 403. When the limit sliding frame 205 descends a certain distance, it will pull the double-headed rotating frame 405 to descend along with the limit sliding frame 205. Thus, one end of the double-headed rotating frame 405 away from the strip-shaped sliding hole frame 404 rotates at one end of the inner rotating frame 403 away from the pull bar 501, making the distance between the double-headed rotating frame 405 and the inner rotating frame 403 become larger, gradually driving the double-headed rotating frame 405 and the strip-shaped sliding hole frame 404 to form a straight line, thereby driving the outer connection frame 402 and the positioning insertion rod 401 to be pushed towards the inside of the sliding cavity 304, and making the positioning insertion rod 401 slide towards a place at the top of the fitting abutting plate 302 inside the sliding cavity 304;

[0045] The pressing mechanism 5 is arranged at one end of the inner rotating frame 403 away from the double-headed rotating frame 405. The pressing mechanism 5 includes a tension bar 501. The tension bar 501 is fixedly connected to one end of the inner rotating frame 403 away from the double-headed rotating frame 405. A double-bar-shaped hole frame 502 is slidably connected to the outer wall of the tension bar 501. One end of the double-bar-shaped hole frame 502 away from the tension bar 501 is fixedly connected to a downward pressing frame 503. One end of the downward pressing frame 503 away from the double-bar-shaped hole frame 502 is fixedly connected to a pressing wheel 504. A bar-shaped sliding hole is formed at the connection between the double-bar-shaped hole frame 502 and the tension bar 501. The double-bar-shaped hole frame 502 is rotatably connected to the pressing connection frame 107. A roller is arranged inside the pressing wheel 504, and the roller inside the pressing wheel 504 abuts against the top of the sliding plate 303. By pushing the double-bar-shaped hole frame 502 with the tension bar 501 to apply an upward thrust, the connection between the double-bar-shaped hole frame 502 and the downward pressing frame 503 rotates on the pressing connection frame 107, thereby driving the pressing wheel 504 to press downward, causing the pressing wheel 504 to move toward the top of the sliding plate 303, so that the pressing wheel 504 squeezes the top of the sliding plate 303;

[0046] A support frame 101 is fixedly connected to the bottom of the main body 1. Two limiting blocks 104 are fixedly connected to the opposite sides of the two connecting plates 103. A rotating hole frame 106 is fixedly connected to the top inner wall of the lifting hole 105. A pressing connection frame 107 is fixedly connected to the top of the connecting plate 103. A rotating connection frame 108 is fixedly connected to the outer wall of the connecting plate 103 away from the main body 1;

[0047] Inside the drilling frame 106, there is a clamping mechanism 3. The clamping mechanism 3 includes a pulley rotating frame 301, and the pulley rotating frame 301 is rotatably connected inside the drilling frame 106. A fitting abutting plate 302 is fixedly connected to the right side of the pulley rotating frame 301. A sliding plate 303 is slidably connected to one end of the top of the fitting abutting plate 302 close to the pulley rotating frame 301. The bottom of the sliding plate 303 abuts against the inner wall of the bottom of the partition groove 204. A belt is sleeved on the outer wall of the pulley rotating frame 301 and the output end of the double-shaft motor 102. The bottom of the fitting abutting plate 302 abuts against the inner wall of the bottom of the partition groove 204. A sliding cavity 304 is penetrated and opened on the left side of the pulley rotating frame 301. A positioning insertion hole 305 is opened on the side of the sliding plate 303 close to the pulley rotating frame 301. The positioning insertion hole 305 corresponds and is used in cooperation with the sliding cavity 304. An extension frame 306 is fixedly connected to the top of the sliding plate 303. A buffer pressing frame 307 is slidably connected to one end of the top of the extension frame 306 away from the sliding plate 303. A spring is fixedly connected between the top of the buffer pressing frame 307 and the extension frame 306, and the buffer pressing frame 307 slidably penetrates through the extension frame 306. The bottom of the buffer pressing frame 307 squeezes and clamps the substrate on the fitting abutting plate 302, stretching the spring between the top of the buffer pressing frame 307 and the extension frame 306. At the same time, the positioning insertion hole 305 corresponds to the sliding cavity 304, and the positioning insertion rod 401 enters into the positioning insertion hole 305 to position the sliding plate 303, so that the substrate on the fitting abutting plate 302 can be automatically clamped during the descent of the limit sliding frame 205. After the transfer frame 203 descends, the bottom of the sliding plate 303 loses the force of abutting against the inner wall of the bottom of the partition groove 204, causing the sliding plate 303 to descend inside the fitting abutting plate 302, so that the bottom of the buffer pressing frame 307 abuts against the top of the substrate, facilitating the limit sliding frame 205 to abut against the sliding plate 303 through the pressing wheel 504 during the descent process.

[0048] During use, when the outer connection frame 402 drives the positioning insertion rod 401 to slide inside the sliding cavity 304, the inner rotating frame 403 rotates inside the outer connection frame 402 at the same time, and the included angle between the inner rotating frame 403 and the outer connection frame 402 gradually increases, causing the connection between the inner rotating frame 403 and the pull bar 501 to rotate and slide on the rotating connection frame 108, so that the pull bar 501 rotates and slides inside the double-strip hole frame 502. By the push of the pull bar 501 on the double-strip hole frame 502, an upward thrust is applied, causing the connection between the double-strip hole frame 502 and the pressing frame 503 to rotate on the pressing connection frame 107, thereby driving the pressing wheel 504 to press downwards, causing the pressing wheel 504 to move towards the top of the sliding plate 303, so that the pressing wheel 504 squeezes the top of the sliding plate 303, causing the bottom of the buffer pressing frame 307 to squeeze and clamp the substrate on the fitting abutting plate 302, stretching the spring between the top of the buffer pressing frame 307 and the extension frame 306. At the same time, the positioning jack 305 is aligned with the sliding cavity 304, and the positioning insertion rod 401 enters the positioning jack 305 to position the sliding plate 303, so that the substrate on the fitting abutting plate 302 can be automatically clamped during the descent of the limit sliding frame 205.

[0049] Embodiment 2. Please refer to Figures 1-9 As shown, during use, by placing the device between two substrate transfer devices, during the normal transfer of the substrate, it will be transferred onto the conveyor belt on the transfer frame 203. The transfer frame 203 drives the substrate to completely enter between the two connecting plates 103. The electric lifting rod 201 drives the connecting frame 202 to descend, driving the two groups of transfer frames 203 to slide down inside the lifting holes 105 through the limit sliding frame 205, so that the transfer frame 203 is separated from the substrate. When the substrate is flipped, a space for the substrate to flip can be left between the substrate and the transfer frame 203. After the transfer frame 203 descends, the substrate falls on the top of the fitting abutting plate 302. At the same time, after the transfer frame 203 descends, the bottom of the sliding plate 303 loses the force against the inner wall of the bottom of the separation groove 204, causing the sliding plate 303 to descend inside the fitting abutting plate 302, so that the bottom of the buffer pressing frame 307 abuts against the top of the substrate, facilitating the limit sliding frame 205 to press against the sliding plate 303 through the pressing wheel 504 during the descent, and squeezing and clamping the buffer pressing frame 307 against the top of the substrate;

[0050] Through the rotational connection between the bottom of the limit sliding frame 205 and the strip-shaped sliding hole frame 404, when the limit sliding frame 205 slides downward inside the lifting hole 105, it will drive the strip-shaped sliding hole frame 404 to slide and rotate at one end of the double-headed rotating frame 405 away from the inner rotating frame 403. When the limit sliding frame 205 descends a certain distance, it will pull the double-headed rotating frame 405 to descend along with the limit sliding frame 205, so that the end of the double-headed rotating frame 405 away from the strip-shaped sliding hole frame 404 rotates at the end of the inner rotating frame 403 away from the pull bar 501, increasing the distance between the double-headed rotating frame 405 and the inner rotating frame 403, gradually driving the double-headed rotating frame 405 and the strip-shaped sliding hole frame 404 to form a straight line, thereby driving the outer connection frame 402 and the positioning insertion rod 401 to be pushed into the interior of the sliding cavity 304, making the positioning insertion rod 401 slide inside the sliding cavity 304 to a position on the top of the fitting abutting plate 302. Thus, after the positioning insertion hole 305 corresponds to the sliding cavity 304, the positioning insertion rod 401 can pass through the sliding cavity 304 and be inserted into the positioning insertion hole 305, thereby positioning the positions of the positioning insertion hole 305 and the fitting abutting plate 302;

[0051] After clamping the substrate on the fitting abutting plate 302, through the connection between the belt at the output end of the dual-axis motor 102 and the pulley rotating frame 301, the pulley rotating frame 301 is driven to rotate inside the rotating hole frame 106, thereby driving the fitting abutting plate 302 and the substrate clamped between the fitting abutting plate 302 and the buffer pressing frame 307 to rotate, thus flipping the substrate. When the transfer frame 203 resets, the flipped substrate is automatically released through the above opposite steps. After the transfer frame 203 contacts the substrate, the substrate is conveyed backward. Then, by lowering the transfer frame 203, the pulley rotating frame 301 rotates, driving the fitting abutting plate 302 and the sliding plate 303 to reset, facilitating the next flipping of the substrate.

[0052] A semiconductor processing substrate flipping device and its flipping method include the following steps:

[0053] S1: By placing the device between two substrate transfer devices, during the normal transfer process of the substrate transfer, the substrate will be transferred onto the conveyor belt of the transfer frame 203, and the transfer frame 203 drives the substrate to completely enter between the two connecting plates 103;

[0054] S2: The electric lifting rod 201 drives the connecting frame 202 to descend, driving the two groups of transfer frames 203 to slide downward inside the lifting hole 105 through the limit sliding frame 205, so that the transfer frame 203 is separated from the substrate;

[0055] S3: When the limit sliding frame 205 slides downward inside the lifting hole 105, it will drive the strip-shaped sliding hole frame 404 to slide and rotate at one end of the double-headed rotating frame 405 away from the inner rotating frame 403. When the limit sliding frame 205 descends a certain distance, it will pull the double-headed rotating frame 405 to follow the limit sliding frame 205 to descend, so that one end of the double-headed rotating frame 405 away from the strip-shaped sliding hole frame 404 rotates at one end of the inner rotating frame 403 away from the pull bar 501, increasing the distance between the double-headed rotating frame 405 and the inner rotating frame 403, gradually driving the double-headed rotating frame 405 and the strip-shaped sliding hole frame 404 to form a straight line, driving the outer connecting frame 402 and the positioning insertion rod 401 to be pushed into the inside of the sliding cavity 304, so that the positioning insertion rod 401 slides inside the sliding cavity 304 to a position on the top of the fitting abutting plate 302;

[0056] S4: When the outer connecting frame 402 drives the positioning insertion rod 401 to slide inside the sliding cavity 304, at the same time, the inner rotating frame 403 rotates inside the outer connecting frame 402, so that the connection between the inner rotating frame 403 and the pull bar 501 slides and rotates on the rotating connection frame 108, so that the pull bar 501 slides and rotates inside the double-strip hole frame 502. By the pull bar 501 pushing the double-strip hole frame 502 to apply an upward thrust, the connection between the double-strip hole frame 502 and the pressing frame 503 rotates on the pressing connection frame 107, thereby driving the pressing wheel 504 to press downward, so that the pressing wheel 504 moves toward the top of the sliding plate 303, so that the pressing wheel 504 squeezes the top of the sliding plate 303, so that the bottom of the buffer pressing frame 307 squeezes and clamps the substrate on the fitting abutting plate 302;

[0057] S5: While performing the extrusion and clamping, the positioning jack 305 corresponds to the sliding cavity 304, so that the positioning insertion rod 401 enters the positioning jack 305 to position the sliding plate 303. Through the connection between the belt at the output end of the double-shaft motor 102 and the belt pulley rotating frame 301, the belt pulley rotating frame 301 is driven to rotate inside the rotating hole frame 106, thereby driving the fitting abutting plate 302 and the substrate clamped between the fitting abutting plate 302 and the buffer pressing frame 307 to rotate.

[0058] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor limit the invention to the specific embodiments described. Obviously, according to the content of this specification, many modifications and changes can be made. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A semiconductor processing substrate turning device, comprising a main body (1) and two connecting plates (103), wherein the two connecting plates (103) are fixedly connected to the top of the main body (1), and the two connecting plates (103) are respectively provided with lifting holes (105), characterized in that: Also includes: A transmission mechanism (2), the transmission mechanism (2) being arranged between the two connecting plates (103), the transmission mechanism (2) comprising two position-limiting sliding frames (205), the two position-limiting sliding frames (205) being respectively slidably connected inside the two lifting holes (105); A positioning mechanism (4), the positioning mechanism (4) being arranged at the bottom of the position-limiting sliding frame (205), the positioning mechanism (4) comprising a strip-shaped sliding hole frame (404), the strip-shaped sliding hole frame (404) being rotatably connected to the bottom of the position-limiting sliding frame (205), the end of the strip-shaped sliding hole frame (404) away from the position-limiting sliding frame (205) being slidably connected to a double-head rotating frame (405), and the same end of the double-head rotating frame (405) away from the strip-shaped sliding hole frame (404) being rotatably connected to an inner rotating frame (403); A clamping mechanism (5), wherein the clamping mechanism (5) is arranged at one end of the inner rotating frame (403) away from the double-head rotating frame (405), and the clamping mechanism (5) includes a pull rod (501), and the pull rod (501) is fixedly connected to one end of the inner rotating frame (403) away from the double-head rotating frame (405), and the outer wall of the pull rod (501) is slidably connected to a double-strip hole frame (502), and the end of the double-strip hole frame (502) away from the pull rod (501) is fixedly connected to a lower pressing frame (503), and the end of the lower pressing frame (503) away from the double-strip hole frame (502) is fixedly connected to a clamping wheel (504).

2. A semiconductor processing substrate turning device according to claim 1, characterized in that: The bottom of the main body (1) is fixedly connected to a support frame (101), two limiting blocks (104) are fixedly connected to opposite sides of the two connecting plates (103), a rotating hole frame (106) is fixedly connected to the inner wall of the top of the lifting hole (105), a pressing connecting frame (107) is fixedly connected to the top of the connecting plate (103), and a rotating connecting frame (108) is fixedly connected to the end of the outer wall of the connecting plate (103) away from the main body (1).

3. A semiconductor processing substrate turning device according to claim 2, characterized in that: The transmission mechanism (2) further comprises an electric lifting rod (201), the electric lifting rod (201) being fixedly connected to the center of the top of the support frame (101), the output end of the electric lifting rod (201) being fixedly connected to a connecting frame (202), the top of the connecting frame (202) being close to the two connecting plates (103) at both ends thereof being fixedly connected to two transmission frames (203), a separation groove (204) being provided between the two transmission frames (203), the limiting sliding frame (205) being fixedly connected to the outer walls of the two transmission frames (203), and the top edge of the transmission frame (203) being abutted against the bottom of the limiting block (104).

4. A semiconductor processing substrate turning device according to claim 3, characterized in that: The rotary hole frame (106) is provided with a clamping mechanism (3) inside, and the clamping mechanism (3) comprises a pulley rotating frame (301), and the pulley rotating frame (301) is rotatably connected inside the rotary hole frame (106), and a fitting abutment plate (302) is fixedly connected to the right side of the pulley rotating frame (301), and a sliding plate (303) is slidably connected to the top of the fitting abutment plate (302) near the end of the pulley rotating frame (301), and the bottom of the sliding plate (303) abuts against the inner wall of the bottom of the dividing groove (204), and a belt is sleeved on the outer wall of the pulley rotating frame (301) and the output end of the dual-axis motor (102).

5. The semiconductor processing substrate turning device according to claim 4, characterized in that: The bottom of the engaging abutment plate (302) abuts against the inner wall of the bottom of the dividing groove (204); a sliding cavity (304) is provided through the left side of the pulley rotating frame (301); a positioning hole (305) is provided on the side of the sliding plate (303) close to the pulley rotating frame (301); the positioning hole (305) and the sliding cavity (304) are used in correspondence; an extension frame (306) is fixedly connected to the top of the sliding plate (303); a buffer pressing frame (307) is slidably connected to the end of the top of the extension frame (306) away from the sliding plate (303); a spring is fixedly connected between the top of the buffer pressing frame (307) and the extension frame (306), and the buffer pressing frame (307) slides through the extension frame (306).

6. The semiconductor processing substrate turning device according to claim 5, characterized in that: The positioning mechanism (4) further comprises a positioning rod (401), which is slidably connected inside the sliding cavity (304), and when the positioning socket (305) corresponds to the sliding cavity (304), the positioning rod (401) just enters into the positioning socket (305).

7. The semiconductor processing substrate turning device according to claim 6, characterized in that: One end of the positioning rod (401) away from the pulley rotating frame (301) is fixedly connected to an external connection frame (402), the inner wall of the external connection frame (402) is rotatably connected to the inner rotating frame (403), and one end of the inner rotating frame (403) away from the external connection frame (402) is slidably connected to the outer wall of the rotating connecting frame (108).

8. The semiconductor processing substrate turning device according to claim 7, characterized in that: A strip-shaped sliding hole is provided at the connection between the double-strip hole frame (502) and the pull bar (501); the double-strip hole frame (502) is rotatably connected to the clamping connection frame (107); a roller is provided inside the clamping wheel (504), and the roller inside the clamping wheel (504) abuts against the top of the sliding plate (303).

9. A semiconductor processing substrate flipping method, using a semiconductor processing substrate flipping device as claimed in claim 8, characterized in that: The following steps are involved: S1: By placing the device between two sections of substrate transmission devices, the substrate will be transmitted to the transmission belt on the transmission frame (203) during normal transmission, and the transmission frame (203) will drive the substrate to completely enter between the two connecting plates (103); S2: driving the connecting frame (202) to descend through the electric lifting rod (201), driving the two sets of transmission frames (203) to slide down inside the lifting hole (105) through the limiting sliding frame (205), thereby separating the transmission frame (203) from the substrate; S3: When the position-limiting sliding frame (205) slides down inside the lifting hole (105), it drives the strip-shaped sliding hole frame (404) to slide and rotate at the end of the double-head rotating frame (405) away from the inner rotating frame (403). When the position-limiting sliding frame (205) descends a certain distance, it pulls the double-head rotating frame (405) to follow the position-limiting sliding frame (205) to descend, so that the end of the double-head rotating frame (405) away from the strip-shaped sliding hole frame (404) rotates at the inner rotating frame (403). The frame (403) rotates away from one end of the pull bar (501), so that the distance between the double-headed rotating frame (405) and the inner rotating frame (403) becomes larger, gradually driving the double-headed rotating frame (405) and the strip-shaped sliding hole frame (404) to form a straight line, driving the outer connecting frame (402) and the positioning rod (401) to push into the inside of the sliding cavity (304), so that the positioning rod (401) slides inside the sliding cavity (304) toward a place on the top of the embedded abutment plate (302); S4: When the outer connection frame (402) drives the positioning rod (401) to slide inside the sliding cavity (304), the inner rotating frame (403) is rotated inside the outer connection frame (402), so that the connection between the inner rotating frame (403) and the pull rod (501) rotates and slides on the rotating connection frame (108), so that the pull rod (501) rotates and slides inside the double-strip hole frame (502), and the double-strip hole is pushed by the pull rod (501). The frame (502) applies an upward thrust, so that the connection between the double-strip hole frame (502) and the lower pressure frame (503) rotates on the clamping connection frame (107), thereby driving the clamping wheel (504) to press downward, so that the clamping wheel (504) moves toward the top of the sliding plate (303), so that the clamping wheel (504) presses the top of the sliding plate (303), and the bottom of the buffer lower pressure frame (307) squeezes and clamps the substrate on the embedded abutment plate (302); S5: While performing extrusion and clamping, the positioning socket (305) corresponds to the sliding cavity (304), so that the positioning rod (401) enters the positioning socket (305) to position the sliding plate (303), and the belt at the output end of the dual-axis motor (102) is connected to the pulley rotating frame (301), driving the pulley rotating frame (301) to rotate inside the rotating hole frame (106), thereby driving the embedded abutment plate (302) and the substrate clamped between the embedded abutment plate (302) and the buffer lower pressure frame (307) to rotate.

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