Monitoring method and system for instrument manufacturing factory

By acquiring and analyzing data from operators and manufacturing machines in instrument manufacturing plants, the automated monitoring system solves the problems of waste of manual monitoring resources and safety hazards, achieving more comprehensive and safe monitoring.

CN119024780BActive Publication Date: 2025-03-07JIANGSU UNIV OF TECH
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Patent Information

Application Number
CN202411086609.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-08
Publication Date
2025-03-07
Estimated Expiration
2044-08-08

AI Technical Summary

Technical Problem

In the prior art, the monitoring of instrument manufacturing plants mainly relies on labor, and there are problems of waste of resources and safety hazards.

Method used

By obtaining the work information of the operator and the working intensity value of the manufacturing machine, an automated monitoring system is used to monitor the workers and the machine, including check-in data, facial feature comparison and calculation and analysis of the working intensity value.

Benefits of technology

It realizes comprehensive monitoring without manual participation, improving the safety and comprehensive monitoring of the factory.

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Abstract

The present invention discloses a monitoring method and system for an instrument manufacturing factory, wherein the monitoring method for the instrument manufacturing factory comprises the following steps: obtaining the on-duty information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; monitoring each operator in the instrument manufacturing factory according to the on-duty information, and monitoring each manufacturing machine in the instrument manufacturing factory according to the work intensity value. Thus, the monitoring of the instrument manufacturing factory can be realized without human participation, and not only the operators can be monitored, but also each manufacturing machine can be monitored, the monitoring is more comprehensive, and the safety of the manufacturing factory is greatly improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of monitoring of instrument manufacturing plants, and in particular to a monitoring method and system for an instrument manufacturing plant. Background Art

[0002] In the related art, when monitoring an instrument manufacturing factory, manual monitoring is usually adopted, which not only consumes human resources, but also has certain limitations and poses certain safety hazards. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a monitoring method for an instrument manufacturing factory, which can realize the monitoring of the instrument manufacturing factory without human participation. It can not only monitor the operating workers, but also monitor each manufacturing machine. The monitoring is more comprehensive, which greatly improves the safety of the manufacturing factory.

[0004] The technical solution adopted by the present invention is as follows:

[0005] A monitoring method for an instrument manufacturing factory comprises the following steps: obtaining the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; monitoring each operator in the instrument manufacturing factory according to the work information, and monitoring each manufacturing machine in the instrument manufacturing factory according to the work intensity value.

[0006] In one embodiment of the present invention, the work information includes check-in data and facial feature images, the check-in data includes check-in location, check-in time and check-in personnel information, and monitoring the operator according to the work information includes: determining whether the check-in location is within the normal office range, and determining whether the check-in time is later than the normal office start time; if the check-in location is not within the normal office range, or the check-in time is later than the normal office start time, reporting the check-in personnel information to the monitoring terminal and issuing an alarm.

[0007] In one embodiment of the present invention, monitoring the operator according to the work information also includes: if the check-in location is within the normal office range and the check-in time is no later than the normal office start time, performing image correction on the facial feature image; performing feature comparison on the facial feature image after image correction with the corresponding stored feature image; if the feature comparison fails, reporting the check-in personnel information to the monitoring terminal and issuing an alarm.

[0008] In one embodiment of the present invention, performing image correction on the facial feature image includes: calculating the image quality score of the facial feature image by the following formula:

[0009]

[0010] Wherein, P is the image quality score; α max is the maximum value of the pixel value of the facial feature image, α mi n is the minimum value of the pixel value of the facial feature image, γ is the average value of the pixel value of the facial feature image; the pixels of the facial feature image are adjusted according to the image quality score of the facial feature image.

[0011] In one embodiment of the present invention, obtaining the working intensity value of the manufacturing machine used for instrument manufacturing includes: obtaining the current temperature and the current continuous working time of the manufacturing machine; and calculating the working intensity value of the manufacturing machine according to the current temperature and the current continuous working time by the following formula:

[0012] Q = k1T + k2t,

[0013] Among them, Q is the working intensity value, k1 is the first weight value, T is the current temperature, k2 is the second weight value, and t is the current continuous working time.

[0014] In one embodiment of the present invention, each manufacturing machine in the instrument manufacturing factory is monitored according to the work intensity value, including: arranging the work intensity value of the manufacturing machine at each time point in ascending order, and calculating the Euclidean distance between two adjacent work intensity values ​​respectively; using a support vector machine to summarize the calculated Euclidean distances, and uploading the summarized results to a monitoring terminal, wherein the summarized results include: the Euclidean distance is less than a first set threshold, the Euclidean distance is greater than a second set threshold, and the Euclidean distance is greater than or equal to the first set threshold and less than or equal to the second set threshold.

[0015] A monitoring system for an instrument manufacturing factory comprises: an acquisition module, which is used to acquire the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; and a monitoring module, which is used to monitor each operator in the instrument manufacturing factory according to the work information, and monitor each manufacturing machine in the instrument manufacturing factory according to the work intensity value.

[0016] A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the monitoring method of the instrument manufacturing factory mentioned above is implemented.

[0017] A non-temporary computer-readable storage medium stores a computer program, which, when executed by a processor, implements the above-mentioned monitoring method for an instrument manufacturing plant.

[0018] Beneficial effects of the present invention:

[0019] The present invention can realize the monitoring of the instrument manufacturing factory without human intervention, and can not only monitor the operating workers, but also monitor various manufacturing machines, so the monitoring is more comprehensive, which greatly improves the safety of the manufacturing factory. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A flow chart of a monitoring method for an instrument manufacturing factory according to an embodiment of the present invention;

[0021] Figure 2 A block diagram of a monitoring system for an instrument manufacturing plant according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figure 1 As shown, the monitoring method of the instrument manufacturing factory in the embodiment of the present invention may include the following steps:

[0024] S1, obtaining the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing.

[0025] In one embodiment of the present invention, the work information may include check-in data and facial feature images, and the check-in data includes check-in location, check-in time, and check-in person information.

[0026] In one embodiment of the present invention, obtaining the working intensity value of a manufacturing machine used for instrument manufacturing may include the following steps:

[0027] First, the current temperature and the current continuous working time of the manufacturing machine are obtained. Second, the working intensity value of the manufacturing machine is calculated according to the current temperature and the current continuous working time by the following formula:

[0028] Q = k1T + k2t,

[0029] Wherein, Q is the working intensity value, k1 is the first weight value, T is the current temperature, k2 is the second weight value, and t is the current continuous working time. Wherein, the first weight value and the second weight value can be set according to actual conditions.

[0030] S2, monitor each operator in the instrument manufacturing factory according to the work information, and monitor each manufacturing machine in the instrument manufacturing factory according to the work intensity value.

[0031] In one embodiment of the present invention, it is possible to first determine whether the check-in location is within the normal office range, and whether the check-in time is later than the normal office start time. If the check-in location is not within the normal office range, or the check-in time is later than the normal office start time, the check-in personnel information will be reported to the monitoring terminal and an alarm will be issued.

[0032] If the check-in location is within the normal office scope and the check-in time is no later than the normal office start time, the facial feature image is further corrected, and the corrected facial feature image is compared with the corresponding stored feature image. If the feature comparison fails, the check-in personnel information is reported to the monitoring terminal and an alarm is issued; if the feature comparison succeeds, the check-in personnel information is uploaded to the monitoring terminal. The stored feature image can be the feature image collected and stored when the operator joins the company, and can be updated in real time according to the joining time to ensure the accuracy of the feature image.

[0033] In one embodiment of the present invention, the image quality score of the facial feature image may be calculated using the following formula:

[0034]

[0035] Where P is the image quality score; α max is the maximum pixel value of the facial feature image, α min is the minimum pixel value of the facial feature image, and γ is the average pixel value of the facial feature image.

[0036] Then, the pixels of the facial feature image are adjusted according to the image quality score of the facial feature image. If the image quality score is less than the first preset score, the pixels of the facial feature image are increased; if the image quality score is greater than the second preset score, the pixels of the facial feature image are decreased. The first preset score and the second preset score can be calibrated according to actual conditions, and the first preset score is less than the second preset score.

[0037] In one embodiment of the present invention, monitoring each manufacturing machine in an instrument manufacturing factory according to the work intensity value includes the following steps:

[0038] First, the work intensity values ​​of the manufacturing machines at each time point are arranged in ascending order, and the Euclidean distances of two adjacent work intensity values ​​are calculated respectively. Then, the calculated Euclidean distances are summarized using a support vector machine, and the summarized results are uploaded to the monitoring terminal, where the summarized results include: the Euclidean distance is less than the first set threshold, the Euclidean distance is greater than the second set threshold, and the Euclidean distance is greater than or equal to the first set threshold and less than or equal to the second set threshold. The first set threshold and the second set threshold can be calibrated according to actual conditions.

[0039] In one embodiment of the present invention, the induction function corresponding to the support vector machine is:

[0040]

[0041] Among them, A max is the second set threshold, A min is the first set threshold, L i is the i-th Euclidean distance, k is the total number of Euclidean distances calculated based on adjacent work intensity values, and f is the induction function.

[0042] It should be noted that when the summarized result is that the Euclidean distance is less than the first set threshold, or the Euclidean distance is greater than the second set threshold, it means that the working intensity of the manufacturing machine is too low or too high. At this time, an alarm is issued when the working intensity value and the corresponding summarized result are uploaded to the monitoring terminal.

[0043] In this way, not only the operating workers can be monitored, but also each manufacturing machine can be monitored. The monitoring is more comprehensive, which greatly improves the safety of the manufacturing plant.

[0044] In summary, according to the monitoring method of the instrument manufacturing factory of the embodiment of the present invention, the on-duty information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing are obtained, and each operator in the instrument manufacturing factory is monitored according to the on-duty information, and each manufacturing machine in the instrument manufacturing factory is monitored according to the work intensity value. Thus, the monitoring of the instrument manufacturing factory can be realized without human participation, and not only the operators can be monitored, but also each manufacturing machine can be monitored, and the monitoring is more comprehensive, which greatly improves the safety of the manufacturing factory.

[0045] Corresponding to the monitoring method of the instrument manufacturing factory in the above embodiment, the present invention also proposes a monitoring system of the instrument manufacturing factory.

[0046] like Figure 2 As shown, the monitoring system for an instrument manufacturing factory according to an embodiment of the present invention includes: an acquisition module 100 and a monitoring module 200 .

[0047] Among them, the acquisition module 100 is used to obtain the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; the monitoring module 200 is used to monitor each operator in the instrument manufacturing factory according to the work information, and monitor each manufacturing machine in the instrument manufacturing factory according to the work intensity value.

[0048] In one embodiment of the present invention, the work information includes check-in data and facial feature images, the check-in data includes the check-in location, check-in time and check-in personnel information, and the monitoring module 200 is specifically used to: determine whether the check-in location is within the normal office range, and determine whether the check-in time is later than the normal office start time; if the check-in location is not within the normal office range, or the check-in time is later than the normal office start time, the check-in personnel information is reported to the monitoring terminal and an alarm is issued.

[0049] In one embodiment of the present invention, the monitoring module 200 is also specifically used for: if the check-in location is within the normal office range and the check-in time is no later than the normal office start time, performing image correction on the facial feature image; performing feature comparison on the facial feature image after image correction with the corresponding stored feature image; if the feature comparison fails, reporting the check-in personnel information to the monitoring terminal and issuing an alarm.

[0050] In one embodiment of the present invention, the monitoring module 200 is further used to calculate the image quality score of the facial feature image by the following formula:

[0051]

[0052] Where P is the image quality score; α max is the maximum pixel value of the facial feature image, α min is the minimum value of the pixel value of the facial feature image, and γ is the average value of the pixel value of the facial feature image; the pixels of the facial feature image are adjusted according to the image quality score of the facial feature image.

[0053] In one embodiment of the present invention, the acquisition module 100 is specifically used to: acquire the current temperature and the current continuous working time of the manufacturing machine; and calculate the working intensity value of the manufacturing machine according to the current temperature and the current continuous working time by the following formula:

[0054] Q = k1T + k2t,

[0055] Among them, Q is the working intensity value, k1 is the first weight value, T is the current temperature, k2 is the second weight value, and t is the current continuous working time.

[0056] In one embodiment of the present invention, the monitoring module 200 is specifically used to: arrange the work intensity values ​​of the manufacturing machine at each time point in ascending order, and calculate the Euclidean distances between two adjacent work intensity values ​​respectively; use a support vector machine to summarize the calculated Euclidean distances, and upload the summarized results to the monitoring terminal, wherein the summarized results include: the Euclidean distance is less than a first set threshold, the Euclidean distance is greater than a second set threshold, and the Euclidean distance is greater than or equal to the first set threshold and less than or equal to the second set threshold.

[0057] It should be noted that for details not disclosed in the monitoring system of the instrument manufacturing plant in the embodiment of the present invention, please refer to the details disclosed in the monitoring method of the instrument manufacturing plant in the embodiment of the present invention, and the specific details will not be described here.

[0058] According to the monitoring system of the instrument manufacturing factory of the embodiment of the present invention, the acquisition module obtains the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing, and the monitoring module monitors each operator in the instrument manufacturing factory according to the work information, and monitors each manufacturing machine in the instrument manufacturing factory according to the work intensity value. Thus, the monitoring of the instrument manufacturing factory can be realized without human participation, and not only the operators can be monitored, but also each manufacturing machine can be monitored, the monitoring is more comprehensive, and the safety of the manufacturing factory is greatly improved.

[0059] Corresponding to the above embodiment, the present invention also provides a computer device.

[0060] The computer device of the embodiment of the present invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the monitoring method of the instrument manufacturing factory of the above embodiment is implemented.

[0061] The computer device according to the embodiment of the present invention can monitor the instrument manufacturing factory without human intervention, and can monitor not only the operating workers but also the various manufacturing machines, so the monitoring is more comprehensive and the safety of the manufacturing factory is greatly improved.

[0062] Corresponding to the above embodiment, the present invention also proposes a non-transitory computer-readable storage medium.

[0063] The non-transitory computer-readable storage medium of the embodiment of the present invention stores a computer program, and when the program is executed by a processor, the monitoring method of the instrument manufacturing plant described above is implemented.

[0064] According to the non-temporary computer-readable storage medium of the embodiment of the present invention, the monitoring of the instrument manufacturing factory can be realized without human intervention. Not only the operating workers can be monitored, but also each manufacturing machine can be monitored. The monitoring is more comprehensive, which greatly improves the safety of the manufacturing factory.

[0065] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0066] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0069] In addition, each functional unit in each embodiment of the present invention may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0070] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A monitoring method for an instrument manufacturing factory, characterized in that: The following steps are involved: Acquire the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; Each operating worker in the instrument manufacturing factory is monitored according to the work information, and each manufacturing machine in the instrument manufacturing factory is monitored according to the work intensity value; wherein, monitoring each manufacturing machine in the instrument manufacturing factory according to the work intensity value includes: arranging the work intensity values ​​of the manufacturing machines at each time point in ascending order, and calculating the Euclidean distances of two adjacent work intensity values ​​respectively; using a support vector machine to summarize the calculated Euclidean distances, and uploading the summarized results to a monitoring terminal, wherein the summarized results include: the Euclidean distance is less than a first set threshold, the Euclidean distance is greater than a second set threshold, and the Euclidean distance is greater than or equal to the first set threshold and less than or equal to the second set threshold.

2. The monitoring method for an instrument manufacturing factory according to claim 1, characterized in that: The work information includes sign-in data and facial feature images, the sign-in data includes sign-in location, sign-in time and sign-in personnel information, and monitoring the operator according to the work information includes: Determine whether the check-in location is within the normal office range, and determine whether the check-in time is later than the normal office start time; If the sign-in location is not within the normal office scope, or the sign-in time is later than the normal office start time, the sign-in personnel information is reported to the monitoring terminal and an alarm is issued.

3. The monitoring method for an instrument manufacturing factory according to claim 2, characterized in that: Monitoring the operator according to the work information also includes: If the check-in location is within the normal office range and the check-in time is not later than the normal office start time, performing image correction on the facial feature image; Perform feature comparison between the facial feature image after image correction and the corresponding stored feature image; If the feature comparison fails, the sign-in personnel information is reported to the monitoring terminal and an alarm is issued.

4. The monitoring method for an instrument manufacturing factory according to claim 3, characterized in that: Performing image correction on the facial feature image includes: The image quality score of the facial feature image is calculated by the following formula: , in, rating the quality of the image; is the maximum value of the pixel value of the facial feature image, is the minimum pixel value of the facial feature image, is the average value of the pixel values ​​of the facial feature image; Pixels of the facial feature image are adjusted according to the image quality score of the facial feature image.

5. The monitoring method for an instrument manufacturing factory according to claim 1, characterized in that: Obtaining the working intensity value of the manufacturing machine used for instrument manufacturing, including: Obtaining the current temperature and current continuous working time of the manufacturing machine; The working intensity value of the manufacturing machine is calculated according to the current temperature and the current continuous working time by the following formula: , in, is the work intensity value, is the first weight value, is the current temperature, is the second weight value, is the current continuous working time.

6. A monitoring system for an instrument manufacturing plant, characterized in that: include: An acquisition module, the acquisition module is used to acquire the work information of each operator in the instrument manufacturing factory and the work intensity value of each manufacturing machine used for instrument manufacturing; A monitoring module, the monitoring module is used to monitor each operating worker in the instrument manufacturing factory according to the work information, and to monitor each manufacturing machine in the instrument manufacturing factory according to the work intensity value; wherein the monitoring module is specifically used to: arrange the work intensity value of the manufacturing machine at each time point in ascending order, and calculate the Euclidean distance between two adjacent work intensity values ​​respectively; use a support vector machine to summarize the calculated Euclidean distances, and upload the summarized results to the monitoring terminal, wherein the summarized results include: the Euclidean distance is less than a first set threshold, the Euclidean distance is greater than a second set threshold, and the Euclidean distance is greater than or equal to the first set threshold and less than or equal to the second set threshold.

7. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the monitoring method for an instrument manufacturing factory according to any one of claims 1 to 5 is implemented.

8. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the monitoring method of an instrument manufacturing factory according to any one of claims 1 to 5 is implemented.

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