A circuit board etching method and device

Abstract

The present invention provides a circuit board etching method and device. The method comprises: obtaining circuit board data and etching process data; inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result; obtaining a compensation amount according to a target side corrosion amount and the side corrosion amount prediction result; adjusting the etching process data according to the compensation amount to obtain adjusted etching process data; etching the target circuit board according to the adjusted etching process data. The present invention not only solves the problem of side corrosion of the circuit board, but also improves the etching efficiency and product qualification rate of the circuit board, and can reduce production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board etching, and also to a circuit board etching method and device. Background Art

[0002] During the etching process of the circuit board, after the surface of the circuit board contacts the etching liquid, the etching liquid will spread from all sides of the circuit board, resulting in corrosion on the sides or all sides of the circuit board that normally corrodes. This phenomenon is called side corrosion. Side corrosion has a great impact on the accuracy of circuit board etching. For example, due to the side corrosion phenomenon, the actual line width etched on the circuit board may deviate from the width on the design drawing. At present, in order to solve the side corrosion problem, the line process is usually adjusted to meet customer design requirements. However, this will increase the workload on the production line, reduce production efficiency and increase communication costs. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a circuit board etching method and device so as to improve the production efficiency of the circuit board while solving the circuit board side corrosion problem.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A first aspect of the present invention provides a circuit board etching method, comprising:

[0006] Obtain circuit board data and etching process data;

[0007] Inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result;

[0008] Obtaining a compensation amount according to a target side corrosion amount and a predicted result of the side corrosion amount;

[0009] Adjusting the etching process data according to the compensation amount to obtain adjusted etching process data;

[0010] The target circuit board is etched according to the adjusted etching process data.

[0011] Optionally, obtain circuit board data and etching process data, including:

[0012] Acquire material data and circuit data of a circuit board, and preprocess the material data and circuit data of the circuit board to obtain circuit board data;

[0013] Obtain etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data and etching liquid spray pressure data, pre-process the etching liquid composition data, the etching liquid concentration data, the etching liquid temperature data, the etching liquid spray speed data and the etching liquid spray pressure data to obtain etching process data.

[0014] Optionally, inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result includes:

[0015] Quantitatively processing the circuit board data and the etching process data to obtain quantitative data;

[0016] Performing format conversion on the quantized data to obtain input parameters;

[0017] The input parameters are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result.

[0018] Optionally, inputting the input parameters into a side corrosion amount prediction model to obtain a side corrosion amount prediction result includes:

[0019] Performing a reaction simulation process on the first relational sub-model of the input parameter input side corrosion amount prediction model to obtain a first output result;

[0020] Performing flow simulation processing on the second relational sub-model of the input parameter input-side corrosion amount prediction model to obtain a second output result;

[0021] A side corrosion amount prediction result is obtained according to the first output result and the second output result.

[0022] Optionally, obtaining a compensation amount according to a target side corrosion amount and a prediction result of the side corrosion amount includes:

[0023] Comparing the target side corrosion amount with the side corrosion amount prediction result to obtain a comparison result;

[0024] The compensation amount is obtained according to the comparison result and the preset addition value.

[0025] Optionally, adjusting the etching process data according to the compensation amount to obtain adjusted etching process data includes:

[0026] The circuit board data is adjusted according to the compensation amount and K=B+b to obtain adjusted circuit board data; wherein K is the adjusted circuit board data, B is the line width data in the circuit board data, and b is the compensation amount;

[0027] The etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data in the etching process data are adjusted according to the compensation amount and the adjusted circuit board data to obtain the adjusted etching process data.

[0028] Optionally, etching the target circuit board according to the adjusted etching process data includes:

[0029] Performing format conversion on the adjusted etching process data to obtain control parameters;

[0030] The control parameters are input into a controller of a spray etching device, so that the spray etching device performs etching processing on a target circuit board according to the control parameters.

[0031] A second aspect of the present invention provides an etching device for a circuit board, comprising:

[0032] An acquisition module, used to acquire circuit board data and etching process data;

[0033] A first processing module, used for inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result;

[0034] A second processing module, used for obtaining a compensation amount according to a target side corrosion amount and a prediction result of the side corrosion amount;

[0035] A third processing module, used for adjusting the etching process data according to the compensation amount to obtain adjusted etching process data;

[0036] The fourth processing module is used to perform etching processing on the target circuit board according to the adjusted etching process data.

[0037] According to a third aspect of the present invention, a computing device is provided, comprising: a processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to the first aspect is executed.

[0038] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions, which, when executed on a computer, causes the computer to execute the method described in the first aspect.

[0039] The above solution of the present invention includes at least the following beneficial effects:

[0040] The above scheme of the present invention uses the side corrosion amount prediction model to predict the side corrosion amount of the circuit board under the data by acquiring the circuit board data and etching process data, and then obtains the compensation amount according to the target side corrosion amount and the side corrosion amount prediction result, and then adjusts the etching process data, and etches the target circuit board. While solving the side corrosion problem of the circuit board, it improves the etching efficiency and product qualification rate of the circuit board, and can reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 is a schematic flow chart of a circuit board etching method in an embodiment of the present invention;

[0042] Figure 2 It is a schematic diagram of the structure of the etching device of the circuit board in the embodiment of the present invention. DETAILED DESCRIPTION

[0043] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0044] like Figure 1 As shown, an embodiment of the present invention provides a circuit board etching method, comprising the following steps:

[0045] Step 101, obtaining circuit board data and etching process data;

[0046] Step 102, inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result;

[0047] Step 103, obtaining a compensation amount according to the target side corrosion amount and the side corrosion amount prediction result;

[0048] Step 104, adjusting the etching process data according to the compensation amount to obtain adjusted etching process data;

[0049] Step 105 , etching the target circuit board according to the adjusted etching process data.

[0050] The etching method for a circuit board proposed in an embodiment of the present invention uses the obtained circuit board data and etching process data, and uses a side corrosion amount prediction model to predict the side corrosion amount of the circuit board under the data, and then obtains the compensation amount according to the target side corrosion amount and the side corrosion amount prediction result, and then adjusts the etching process data and etches the target circuit board. While solving the side corrosion problem of the circuit board, it improves the etching efficiency and product qualification rate of the circuit board, and can reduce the production cost.

[0051] In an optional embodiment of the present invention, step 101 includes:

[0052] Step 1011, obtaining material data and circuit data of a circuit board, and preprocessing the material data and circuit data of the circuit board to obtain circuit board data;

[0053] Specifically, data on the types of materials used in the circuit board, such as copper, aluminum, etc., can be obtained, and data on the thickness of the circuit board can be obtained. It is also necessary to obtain data on the width of the circuit to be etched on the circuit board, etc., and these data can be pre-processed by data cleaning, screening, etc. to delete erroneous data and improve the accuracy of the obtained circuit board data. Here, the circuit board data can include data on the types of materials used in the pre-processed circuit board, data on the thickness of the pre-processed circuit board, data on the width of the circuit to be etched on the circuit board, etc.

[0054] Step 1012, obtaining etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data and etching liquid spray pressure data, pre-processing the etching liquid composition data, the etching liquid concentration data, the etching liquid temperature data, the etching liquid spray speed data and the etching liquid spray pressure data to obtain etching process data.

[0055] Specifically, before etching the circuit board, relevant parameters of the etching process will be formulated, such as etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data, etc. Therefore, these data can be obtained according to the specific etching process, and then these data can be inspected, cleaned, and screened, and erroneous data or data that does not meet the preset process requirements are deleted to improve the accuracy of the acquired etching process data. Here, the etching process data may include etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data, etc.

[0056] In an optional embodiment of the present invention, step 102 includes:

[0057] Step 1021, quantizing the circuit board data and the etching process data to obtain quantized data;

[0058] Specifically, the quantitative processing mainly extracts specific values ​​or variables in the data, such as copper or aluminum in the circuit board data, the thickness of the circuit board, the width of the line, the etching solution concentration value, etching solution temperature, etching solution spray speed and etching solution spray pressure in the etching process data, and uses these as quantitative data for subsequent processing.

[0059] Step 1022, converting the format of the quantized data to obtain input parameters;

[0060] Specifically, the quantitative data is encoded and input in the format required by the subsequent model. If the model is based on software, the quantitative data can be input into the corresponding fields of the software, and the filled fields are used as input parameters; if the model is based on mathematical equations, the quantitative data can be substituted into the corresponding variables in the equations, and the corresponding variables with specific values ​​are used as input parameters. Here, specific selections can be made as needed to meet the format requirements of the model and improve processing efficiency.

[0061] Step 1023, input the input parameters into the side corrosion amount prediction model to obtain the side corrosion amount prediction result.

[0062] In an optional embodiment of the present invention, the side corrosion amount prediction model in step 1023 includes:

[0063] The first relation sub-model obtained according to the circuit board data and the etching process data ;

[0064] The second relationship sub-model obtained according to the circuit board data and the etching process data and .

[0065] Where V is the etching reaction rate, expressed as the depth or mass of etching per unit time, k is the reaction rate constant (usually determined experimentally), is the concentration of the etching solution, exp is an exponential function used to describe the effect of activation energy on the reaction rate, is the activation energy of the reaction, which indicates the minimum energy required for the reactant molecules to undergo a chemical reaction, and R is the gas constant (usually 8.314 ), T is the reaction temperature (in Kelvin K), which indicates the temperature of the etching solution or reaction environment during the etching process; is the fluid density; It is the velocity vector of the fluid, indicating the speed and direction of a point in the fluid; is the rate of change of density with time; is the spatial divergence of the product of density and velocity (i.e., mass flow), which describes how mass flows in or out through the boundaries of a fluid; is the rate of change of velocity with time, i.e. acceleration; is the convective acceleration term, which describes the acceleration of the fluid due to its own motion; is the pressure gradient term, which represents the force due to the pressure difference; is the viscous force term, where is the dynamic viscosity, is the Laplace operator, describing the drag due to the viscosity of the fluid; is the gravity term, where is the gravitational acceleration vector; is an external force term, which indicates other forces acting on the fluid in addition to the above forces, such as electromagnetic force, etc. It should be noted that, in this embodiment, the fluid refers to etching liquid.

[0066] Specifically, the first relationship sub-model reflects the relationship between the etching reaction rate and the etching solution concentration and temperature, and the etching reaction rate directly affects the side corrosion amount. The second relationship sub-model takes into account the etching solution spray speed, etching solution spray pressure and the geometric shape of the circuit board surface to predict the flow and distribution of the etching solution on the circuit board surface. During the etching process, the flow of the etching solution will affect the distribution and reaction rate of the etchant, and thus affect the side corrosion amount.

[0067] In an optional embodiment of the present invention, the side corrosion amount prediction model further includes:

[0068] The third relationship sub-model obtained according to the circuit board data and the etching process data ;

[0069] in, is the rate of change of temperature with time; is thermal conductivity (also called thermal conductivity), which describes the ability of a material (the material of the circuit board) to conduct heat; is the fluid density; It is the specific heat capacity at constant pressure, which describes the amount of heat absorbed or released by a unit mass of a substance when the temperature increases or decreases by 1 degree Celsius at constant pressure; is the spatial second-order derivative of temperature, also known as the Laplace operator acting on temperature, which describes the rate of change of temperature in space (i.e., the divergence of the temperature gradient); q is the heat source term, which represents the heat generated per unit volume; is the heat conduction term, which describes the heat transfer due to the temperature gradient; is the contribution of the heat source to the temperature change.

[0070] Here, the third relationship sub-model predicts the effect of temperature gradient on etching reaction rate and side corrosion amount based on thermal conductivity and temperature change during etching; during etching, temperature change will affect etching reaction rate and physical properties of etching solution, thus affecting side corrosion amount.

[0071] In an optional embodiment of the present invention, step 1023 includes:

[0072] Step 10231, performing reaction simulation processing on the first relational sub-model of the input parameter input-side corrosion amount prediction model to obtain a first output result;

[0073] Specifically, the initial conditions and boundary conditions are first determined. The initial conditions include the shape, size, material properties of the circuit board before etching, and the initial concentration and temperature of the etching solution; the boundary conditions include the contact surface between the etching solution and the circuit board, the external environment (such as temperature and pressure), etc. Then the input parameters are input into the first relational sub-model of the side corrosion prediction model to calculate the etching reaction rate and output it as the first output result.

[0074] Step 10232, performing flow simulation processing on the second relational sub-model of the input side corrosion amount prediction model using the input parameter to obtain a second output result;

[0075] Specifically, the initial conditions and boundary conditions are determined first. The initial conditions include the shape, size, material properties of the circuit board before etching, and the initial concentration and temperature of the etching solution; the boundary conditions include the contact surface between the etching solution and the circuit board, the external environment (such as temperature, pressure), etc. Then the parameters are input into the second relational sub-model of the side corrosion prediction model to simulate the flow and distribution of substances in the etching solution, which helps to understand how the etching solution interacts with the surface of the circuit board. It is also necessary to simulate the flow dynamics in the etching solution according to the second relational sub-model to reveal the scouring effect of the etching solution on the surface of the circuit board, thereby affecting the side corrosion amount. Here, the simulated flow and distribution of substances in the etching solution and the simulated flow dynamics in the etching solution are output as the second output result.

[0076] Here, when the side corrosion amount prediction model also includes the third relationship sub-model, it is also necessary to input the input parameters into the third relationship sub-model to simulate the heat transfer during the etching process. Temperature is an important factor affecting the etching rate and the side corrosion amount.

[0077] Step 10233: Obtain a side corrosion amount prediction result based on the first output result and the second output result.

[0078] Specifically, the etching depth can be calculated according to the etching reaction rate and the etching time, and the etching depth is equal to the product of the etching reaction rate and the etching time. The side corrosion amount prediction result is obtained by simulating the flow and distribution of substances in the etching solution and the flow dynamics in the etching solution.

[0079] In an optional embodiment of the present invention, the input parameters and the side corrosion amount prediction model can be input together into a simulation software, such as CFD (computational fluid dynamics) software. By running the side corrosion amount prediction model in the software, the side corrosion amount prediction result can be automatically output.

[0080] In an optional embodiment of the present invention, step 103 includes:

[0081] Step 1031, comparing the target side corrosion amount with the side corrosion amount prediction result to obtain a comparison result;

[0082] Specifically, it is necessary to first determine the target side corrosion amount, which can be obtained based on experience or experiments; in the actual etching process, due to the influence of various factors (such as etching solution uniformity, equipment stability, etc.), the actual side corrosion amount may be different from the target side corrosion amount. Therefore, the side corrosion amount in the actual etching process can be obtained based on the prediction of the side corrosion amount in the actual etching process. The calculation of the compensation amount is based on the difference between the target side corrosion amount and the side corrosion amount prediction results, as well as the requirements of the target line width. Therefore, it is necessary to compare the target side corrosion amount with the side corrosion amount prediction results, and then set the compensation amount based on the comparison results.

[0083] Step 1032: Obtain a compensation amount according to the comparison result and the preset addition value.

[0084] Specifically, if the side corrosion amount prediction result in the comparison result is greater than the target side corrosion amount, it means that the actual side corrosion will be more serious than expected, so more compensation needs to be added to offset this difference. At this time, compensation amount = target line width - (design line width + target side corrosion amount - side corrosion amount prediction result), where the design line width is the original design width without considering side corrosion compensation. Among them, the target side corrosion amount includes a preset addition value to consider reaching the expected line width under the influence of side corrosion.

[0085] If the predicted side corrosion amount in the comparison result is less than the target side corrosion amount, it means that the actual side corrosion will be lighter than expected, but a certain amount of compensation is still required to ensure the realization of the target line width. In this case, the compensation amount can be appropriately reduced, but it still needs to maintain a certain positive value to cope with unforeseen factors. The specific value of the compensation amount needs to be determined based on the actual situation and the requirements of the target line width.

[0086] In an optional embodiment of the present invention, step 104 includes:

[0087] Step 1041, adjusting the circuit board data according to the compensation amount and K=B+b to obtain adjusted circuit board data; wherein K is the adjusted circuit board data, B is the line width data in the circuit board data, and b is the compensation amount;

[0088] Specifically, the adjustment of the circuit board data is mainly to adjust the line width. Assume that a circuit board needs to be etched, the target line width of the circuit board is 0.1mm, and the side corrosion amount prediction result is 0.01mm. In order to ensure that the line width after etching meets the design requirements, the circuit board data needs to be adjusted. The adjustment method is as follows:

[0089] First, the amount of compensation needs to be determined. Based on the predicted side corrosion amount (0.01mm) and the target line width (0.1mm), the required compensation amount is calculated. In this embodiment, the compensation amount should be equal to the target side corrosion amount, that is, 0.01mm (because the width loss caused by side corrosion needs to be compensated by increasing the design width). However, in actual operation, in order to be on the safe side, some additional compensation amounts may be slightly increased to deal with unforeseen factors, such as the unevenness of the etching solution, the instability of the equipment, etc. Therefore, the final compensation amount may be slightly larger than 0.01mm, such as 0.015mm (where 0.005 is the preset added value).

[0090] Then, this compensation amount needs to be taken into account in the design stage. The original design width should be the target line width minus the compensation amount, but in this embodiment, the compensation amount is calculated after the side corrosion prediction result and the target width are known, so the line width in the circuit board data can be directly adjusted to 0.115mm during design (if the additional compensation amount is 0.015mm).

[0091] Step 1042, adjusting the etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data in the etching process data according to the compensation amount and the adjusted circuit board data to obtain adjusted etching process data.

[0092] Specifically, the method of adjusting the etching process data may include: according to the actual situation, the concentration of the etching solution may be adjusted to control the etching rate and the amount of side corrosion. A higher concentration may speed up the etching rate, but it may also increase the risk of side corrosion; a lower concentration may reduce the etching rate, but it helps to reduce side corrosion; according to the actual situation, the temperature of the etching solution may be adjusted to maintain the stability of the etching rate. The increase in temperature usually speeds up the chemical reaction rate, but it may also aggravate the side corrosion; according to the actual situation, the spray speed may be adjusted to ensure the uniform distribution of the etching solution on the surface of the circuit board. Uneven spraying may cause excessive or insufficient etching in local areas. According to the actual situation, the etching solution composition data, etching solution concentration data, etching solution temperature data, etching solution spray speed data, and etching solution spray pressure data are adjusted to reduce the amount of side corrosion.

[0093] In an optional embodiment of the present invention, step 105 includes:

[0094] Step 1051, converting the adjusted etching process data into a format to obtain control parameters;

[0095] Specifically, depending on the etching equipment, the adjusted etching process data can be converted into a format according to the required format of the corresponding etching equipment, so that the converted etching process data can be directly input into the etching equipment as a control parameter, so that the etching equipment etches the circuit board according to the control parameter.

[0096] Step 1052, inputting the control parameters into a controller of a spray etching device, so that the spray etching device performs etching processing on the target circuit board according to the control parameters.

[0097] Specifically, according to the spray speed value of the control parameter, the rotation speed or valve opening of the spray pump in the spray etching equipment is adjusted, and whether the speed meets the standard is confirmed by measuring or observing the spray effect; the spray pressure is adjusted to the spray pressure value in the control parameter through the pressure gauge or pressure regulating device in the spray etching equipment; the angle and distance values ​​in the control parameters are used to adjust the position and angle of the spray head in the spray etching equipment to ensure that the spray liquid can evenly cover the surface of the circuit board; the precise etching time is set in the spray etching equipment, and automatic control can be achieved through a timer or a control program.

[0098] A specific embodiment of the etching method of the circuit board proposed in the embodiment of the present invention is:

[0099] Step 111, obtaining data.

[0100] According to the design requirements or design drawings of the circuit board, data on the types of materials used in the circuit board, the thickness of the circuit board, the width of the circuit to be etched on the circuit board, etc. can be obtained; according to the requirements of the etching process or the expected design, data on the composition of the etching liquid, the concentration of the etching liquid, the temperature of the etching liquid, the spray speed of the etching liquid, and the spray pressure of the etching liquid can be obtained. All the acquired data will be inspected, cleaned, and screened, and the wrong data or data that does not meet the expected requirements will be deleted to improve the accuracy of the acquired data.

[0101] Step 112, predicting the amount of side corrosion.

[0102] Calculate the etching reaction rate according to the first relation sub-model in the side corrosion amount prediction model;

[0103] The second relation sub-model and the third relation sub-model in the side corrosion amount prediction model are input into the computational fluid dynamics software to simulate the fluid flow during the etching process, so as to determine the flow rate and concentration distribution of the etching solution on the board surface of the circuit board, as well as the heat transfer (i.e., temperature) during the etching process;

[0104] The influence of the board geometry (such as grooves, protrusions, depressions, etc.) on fluid flow and etching solution distribution can be simulated by modifying the boundary conditions;

[0105] In each time step, the current etching reaction rate is calculated using the updated etching solution concentration profile and temperature profile. Then, the etching reaction rate is multiplied by the time step to get the etching depth increment within the time step. This increment is added to the previous etching depth to calculate the total etching depth;

[0106] The amount of side corrosion can be predicted by analyzing the flow pattern and residence time of the fluid at the edge of the geometric feature. Higher flow rates and lower residence times usually mean lower side corrosion, while eddy currents or stagnant areas may lead to higher side corrosion. The results of the simulation output by computational fluid dynamics software (such as flow rate, concentration distribution, and temperature distribution) can be used to identify the areas where side corrosion is most likely to occur. These areas are usually located where the fluid flow changes sharply, such as eddy current areas, jet impact areas, etc. The side corrosion rates of these areas are obtained based on the flow and concentration characteristics of these areas, and the side corrosion rates are multiplied by the expected etching time to obtain the predicted side corrosion amount.

[0107] Step 113, calculating the compensation amount.

[0108] According to the comparison result between the target side corrosion amount and the predicted side corrosion amount, the compensation amount is calculated or set to compensate for the influence of the side corrosion on the line width and improve the accuracy of line etching.

[0109] Step 114, adjusting etching process data.

[0110] The line width is adjusted according to the compensation amount, and then the etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data in the etching process data are adjusted to reduce the side corrosion amount and improve the accuracy of line etching.

[0111] Step 115, etching the target circuit board.

[0112] According to the adjusted etching process data, the target circuit board is etched using etching equipment.

[0113] The etching method for a circuit board according to an embodiment of the present invention predicts the amount of side corrosion in an actual etching process and adjusts etching process data, thereby helping to reduce the amount of side corrosion and improve the accuracy of circuit etching.

[0114] like Figure 2 As shown, an embodiment of the present invention provides an etching device 200 for a circuit board, comprising:

[0115] An acquisition module 201 is used to acquire circuit board data and etching process data;

[0116] The first processing module 202 is used to input the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result;

[0117] The second processing module 203 is used to obtain a compensation amount according to the target side corrosion amount and the side corrosion amount prediction result;

[0118] A third processing module 204 is used to adjust the etching process data according to the compensation amount to obtain adjusted etching process data;

[0119] The fourth processing module 205 is used to perform etching processing on the target circuit board according to the adjusted etching process data.

[0120] Optionally, obtain circuit board data and etching process data, including:

[0121] Acquire material data and circuit data of a circuit board, and preprocess the material data and circuit data of the circuit board to obtain circuit board data;

[0122] Obtain etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data and etching liquid spray pressure data, pre-process the etching liquid composition data, the etching liquid concentration data, the etching liquid temperature data, the etching liquid spray speed data and the etching liquid spray pressure data to obtain etching process data.

[0123] Optionally, inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result includes:

[0124] Quantitatively processing the circuit board data and the etching process data to obtain quantitative data;

[0125] Performing format conversion on the quantized data to obtain input parameters;

[0126] The input parameters are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result.

[0127] Optionally, inputting the input parameters into a side corrosion amount prediction model to obtain a side corrosion amount prediction result includes:

[0128] Performing a reaction simulation process on the first relational sub-model of the input parameter input side corrosion amount prediction model to obtain a first output result;

[0129] Performing flow simulation processing on the second relational sub-model of the input parameter input-side corrosion amount prediction model to obtain a second output result;

[0130] A side corrosion amount prediction result is obtained according to the first output result and the second output result.

[0131] Optionally, obtaining a compensation amount according to a target side corrosion amount and a prediction result of the side corrosion amount includes:

[0132] Comparing the target side corrosion amount with the side corrosion amount prediction result to obtain a comparison result;

[0133] The compensation amount is obtained according to the comparison result and the preset addition value.

[0134] Optionally, adjusting the etching process data according to the compensation amount to obtain adjusted etching process data includes:

[0135] The circuit board data is adjusted according to the compensation amount and K=B+b to obtain adjusted circuit board data; wherein K is the adjusted circuit board data, B is the line width data in the circuit board data, and b is the compensation amount;

[0136] The etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data in the etching process data are adjusted according to the compensation amount and the adjusted circuit board data to obtain the adjusted etching process data.

[0137] Optionally, etching the target circuit board according to the adjusted etching process data includes:

[0138] Performing format conversion on the adjusted etching process data to obtain control parameters;

[0139] The control parameters are input into a controller of a spray etching device, so that the spray etching device performs etching processing on a target circuit board according to the control parameters.

[0140] The etching device for a circuit board proposed in an embodiment of the present invention uses a side corrosion amount prediction model to predict the side corrosion amount of the circuit board under the acquired circuit board data and etching process data, and then obtains a compensation amount according to the target side corrosion amount and the side corrosion amount prediction result, and then adjusts the etching process data and etches the target circuit board. While solving the side corrosion problem of the circuit board, it improves the etching efficiency and product qualification rate of the circuit board, and can reduce production costs.

[0141] It should be noted that the device is a device corresponding to the above method, and all implementations in the above method embodiment are applicable to the embodiment of the device and can achieve the same technical effect. This embodiment will not be repeated.

[0142] The embodiment of the present invention further provides a computing device, comprising: a processor, and a memory storing a computer program, wherein when the computer program is executed by the processor, the method described in any one of the above embodiments is executed. All implementations in the above method embodiments are applicable to the embodiments of the device, and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0143] The embodiment of the present invention further provides a computer-readable storage medium on which instructions are stored. When the instructions are executed on a computer, the computer executes the method as described in any one of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0144] It should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0145] In the above-mentioned embodiments, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be noted that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0146] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A circuit board etching method, characterized in that: include: Obtain circuit board data and etching process data; Inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result; Obtaining a compensation amount according to a target side corrosion amount and a predicted result of the side corrosion amount; Adjusting the etching process data according to the compensation amount to obtain adjusted etching process data; Performing etching processing on the target circuit board according to the adjusted etching process data; The circuit board data and the etching process data are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result, including: Quantitatively processing the circuit board data and the etching process data to obtain quantitative data; Performing format conversion on the quantized data to obtain input parameters; Inputting the input parameters into the side corrosion amount prediction model to obtain the side corrosion amount prediction result; Wherein, the side corrosion amount prediction model includes: The first relation sub-model obtained according to the circuit board data and the etching process data ; The second relationship sub-model obtained according to the circuit board data and the etching process data and ; Where V is the etching reaction rate, k is the reaction rate constant, is the concentration of the etching solution, exp is the exponential function, is the activation energy of the reaction, R is the gas constant, and T is the reaction temperature; is the fluid density; is the velocity vector of the fluid; is the rate of change of density with time; is the spatial divergence of the product of density and velocity; is the rate of change of velocity with time; is the convective acceleration term; is the pressure gradient term; is the viscous force term, where is the dynamic viscosity, is the Laplace operator force; is the gravity term, where is the gravitational acceleration vector; is the external force term; The input parameters are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result, including: Performing a reaction simulation process on the first relational sub-model of the input parameter input side corrosion amount prediction model to obtain a first output result; Performing flow simulation processing on the second relational sub-model of the input parameter input-side corrosion amount prediction model to obtain a second output result; A side corrosion amount prediction result is obtained according to the first output result and the second output result.

2. The etching method for a circuit board according to claim 1, characterized in that: Obtain circuit board data and etching process data, including: Acquire material data and circuit data of a circuit board, and preprocess the material data and circuit data of the circuit board to obtain circuit board data; Obtain etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data and etching liquid spray pressure data, pre-process the etching liquid composition data, the etching liquid concentration data, the etching liquid temperature data, the etching liquid spray speed data and the etching liquid spray pressure data to obtain etching process data.

3. The etching method for a circuit board according to claim 1, characterized in that: According to the target side corrosion amount and the side corrosion amount prediction result, a compensation amount is obtained, including: Comparing the target side corrosion amount with the side corrosion amount prediction result to obtain a comparison result; The compensation amount is obtained according to the comparison result and the preset addition value.

4. The etching method for a circuit board according to claim 1, characterized in that: The etching process data is adjusted according to the compensation amount to obtain adjusted etching process data, including: The circuit board data is adjusted according to the compensation amount and K=B+b to obtain adjusted circuit board data; wherein K is the adjusted circuit board data, B is the line width data in the circuit board data, and b is the compensation amount; The etching liquid composition data, etching liquid concentration data, etching liquid temperature data, etching liquid spray speed data, and etching liquid spray pressure data in the etching process data are adjusted according to the compensation amount and the adjusted circuit board data to obtain the adjusted etching process data.

5. The etching method for a circuit board according to claim 1, characterized in that: Performing etching processing on the target circuit board according to the adjusted etching process data includes: Performing format conversion on the adjusted etching process data to obtain control parameters; The control parameters are input into a controller of a spray etching device, so that the spray etching device performs etching processing on a target circuit board according to the control parameters.

6. A circuit board etching device, characterized in that: include: An acquisition module, used to acquire circuit board data and etching process data; A first processing module, used for inputting the circuit board data and the etching process data into a side corrosion amount prediction model to obtain a side corrosion amount prediction result; A second processing module, used for obtaining a compensation amount according to a target side corrosion amount and a prediction result of the side corrosion amount; A third processing module, used for adjusting the etching process data according to the compensation amount to obtain adjusted etching process data; A fourth processing module, used for performing etching processing on the target circuit board according to the adjusted etching process data; The circuit board data and the etching process data are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result, including: Quantitatively processing the circuit board data and the etching process data to obtain quantitative data; Performing format conversion on the quantized data to obtain input parameters; Inputting the input parameters into the side corrosion amount prediction model to obtain the side corrosion amount prediction result; Wherein, the side corrosion amount prediction model includes: The first relation sub-model obtained according to the circuit board data and the etching process data ; The second relationship sub-model obtained according to the circuit board data and the etching process data and ; Where V is the etching reaction rate, k is the reaction rate constant, is the concentration of the etching solution, exp is the exponential function, is the activation energy of the reaction, R is the gas constant, and T is the reaction temperature; is the fluid density; is the velocity vector of the fluid; is the rate of change of density with time; is the spatial divergence of the product of density and velocity; is the rate of change of velocity with time; is the convective acceleration term; is the pressure gradient term; is the viscous force term, where is the dynamic viscosity, is the Laplace operator force; is the gravity term, where is the gravitational acceleration vector; is the external force term; The input parameters are input into the side corrosion amount prediction model to obtain the side corrosion amount prediction result, including: Performing a reaction simulation process on the first relational sub-model of the input parameter input side corrosion amount prediction model to obtain a first output result; Performing flow simulation processing on the second relational sub-model of the input parameter input-side corrosion amount prediction model to obtain a second output result; A side corrosion amount prediction result is obtained according to the first output result and the second output result.

7. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 5 is performed.

8. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 5.

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