A probe for a semiconductor probe test bench and its usage method

Abstract

The present invention relates to the technical field of semiconductor probes, and discloses a probe for a semiconductor probe test bench and its usage method, including a power mechanism. The power mechanism further includes a sliding track. When the electric telescopic rod presses downwards, the electric telescopic rod pushes the device housing downwards through a pulling plate. At this time, the device housing drives the pulling circular plate and the induction column to move downwards. When the receiver contacts the semiconductor, the reset spring and the compression spring will absorb the excessive downward force generated by the device housing, so that the receiver is optimized from traditional hard contact to elastic contact. When the device housing moves upwards, the device housing drives the pulling circular plate and the induction column to move upwards through the reset spring. When the end of the cleaning rod away from the roller moves along the outer wall of the induction column, the bottom of the receiver will be squeezed by the cleaning rod and finally form the state shown in the figure. Through the application of the above components, self-cleaning of the receiver is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor probe devices, and particularly to a probe for a semiconductor probe test bench and its usage method. Background Art

[0002] Semiconductor probe test benches are usually used to test and analyze semiconductor chips or devices. And the probe is an important part of the test bench. It is mainly used to detect parameters such as the connection, resistance, and capacitance between different circuits in the semiconductor chip. Specifically, the functions of the probe for a semiconductor probe test bench include that the probe can be connected to the circuit on the chip through the contact point, thereby detecting the connectivity in the circuit. This helps to determine whether the structure and function of the chip meet the design requirements. The probe can measure parameters such as resistance, capacitance, and inductance between different circuits in the chip. This helps to evaluate the performance and quality of the chip and find possible defects. When problems are found in the chip during the test process, the probe can help locate the fault point. By comparing the parameters of different circuits, the location of the fault point can be found, which helps to repair the chip problem.

[0003] However, the use of probes requires great caution because they will exert certain pressure and wear on the contact points of the chip, and improper use may damage the chip. In view of the above problems, the following solutions are proposed. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a probe for a semiconductor probe test bench, including a power mechanism. The power mechanism further includes a sliding track, a sliding plate is fixedly connected to the side wall of the sliding track, and a fixing plate is fixedly connected to the top of the sliding track;

[0005] A cleaning mechanism, the cleaning mechanism includes a fixed column fixedly connected to the side wall of the sliding track, a cleaning base is fixedly connected to the end of the fixed column away from the sliding track, and a cleaning rod is slidably connected to the inner wall of the through hole on the side wall of the cleaning base;

[0006] A removing mechanism, the removing mechanism includes a control bracket slidably connected to the inner wall of the sliding plate, a pressing rod is fixedly connected to the bottom of the control bracket, and a seesaw is rotatably connected to the end of the pressing rod away from the control bracket.

[0007] Preferably, the power mechanism further includes an electric telescopic rod fixedly connected to the bottom of the fixing plate, a pulling plate is fixedly connected to the end of the electric telescopic rod away from the fixing plate, and a miscellaneous material outlet is opened on the side wall of the sliding track. This mechanism provides an installation position for the subsequent mechanisms, and plays a stabilizing effect during operation, ensuring the normal operation of the equipment and avoiding problems such as bumps.

[0008] Preferably, the power mechanism further includes a rotating hole formed in the inner wall of the miscellaneous material outlet. A fixed frame is fixedly connected to the side wall of the sliding track. An equipment housing is fixedly connected to the outer wall of the pulling plate. The inner wall of the equipment housing is slidably connected to the outer wall of the upper track of the sliding track. When the electric telescopic rod drives the equipment housing to move upward, the equipment housing will move upward under the influence of the equipment housing. When the equipment housing moves upward and drives the control bracket to move upward through the extrusion rod, the control bracket pulls the extrusion rod, forcing the rocker to rotate downward, so that the rocker is parallel to the cleaning base to collect the impurities dropped by the receiver. When the electric telescopic rod presses downward, the control bracket moves downward and forces the rocker to retract, avoiding the rocker from affecting the equipment detection. When the rocker retracts, the impurities are discharged outward through the miscellaneous material outlet, preventing the impurities from falling on the surface of the semiconductor and affecting the product quality.

[0009] Preferably, the cleaning mechanism further includes an extrusion plate fixedly connected to the side wall of the cleaning rod. A roller is rotatably connected to the inner wall of the extrusion plate. A pulling spring is fixedly connected to the outer wall of the cleaning rod. The end of the pulling spring away from the cleaning rod is fixedly connected to the side wall of the cleaning base.

[0010] Preferably, the cleaning mechanism further includes a pulling circular plate slidably connected to the inner wall of the equipment housing. An induction column is fixedly connected to the bottom of the pulling circular plate. The outer wall of the induction column is slidably connected to the inner wall of the through hole on the equipment housing. A receiver is fixedly connected to the end of the induction column away from the pulling circular plate. A reset spring is fixedly connected to the bottom of the pulling circular plate. The end of the reset spring away from the pulling circular plate is fixedly connected to the inner wall of the equipment housing. The two ends of the extrusion rod away from the control bracket are fixedly connected to the side wall of the equipment housing. When the electric telescopic rod presses downward, the electric telescopic rod pushes the equipment housing downward through the pulling plate. At this time, the equipment housing drives the pulling circular plate and the induction column to move downward. When the receiver contacts the semiconductor, the reset spring will absorb the excessive downward force generated by the equipment housing, optimizing the traditional hard contact of the receiver to elastic contact. When the receiver contacts the surface of the semiconductor, it will not damage the outer wall of the semiconductor due to the pressing force, improving the stability of the equipment when detecting the semiconductor.

[0011] Preferably, the cleaning mechanism includes a stress column rotatably connected to the inner wall of the rotating hole. The outer wall of the stress column is rotatably connected to the inner wall of the through hole on the rocker. A collection bag is fixedly connected to the top of the rocker. The end of the collection bag away from the rocker is fixedly connected to the inner wall of the miscellaneous material outlet. A discharge bag is connected through the side wall of the collection bag. When the equipment housing moves upward, the equipment housing drives the pulling circular plate and the induction column to move upward through the reset spring. When the end of the cleaning rod away from the roller moves along the outer wall of the induction column, the bottom of the receiver will be squeezed by the cleaning rod and finally form a state as shown in Figure 5 By applying the above components, self-cleaning of the receiver is achieved, avoiding the outer wall of the receiver being contaminated with impurities during long-term operation and affecting the detection effect of the equipment.

[0012] Preferably, the cleaning mechanism further includes a collection groove formed in the outer wall of the collection bag. A compression spring is fixedly connected to the bottom of the equipment housing. The end of the compression spring away from the equipment housing is fixedly connected to the top of the cleaning base. A plurality of pressure-receiving plates are fixedly connected to the bottom of the equipment housing. The outer walls of the plurality of pressure-receiving plates are slidably connected to the outer wall of the roller. When the equipment housing is pressed down, the pressure-receiving plates also descend synchronously. At this time, the inclined surface on the pressure-receiving plate will force the roller and the extrusion plate to move outward. The extrusion plate drives the cleaning rod to move outward, so that the cleaning rod loses its restraint on the receiver, preventing the induction column from being affected by the cleaning rod when the induction column descends, causing the return spring to accumulate mechanical power. When the induction column loses its restraint, the induction column will be affected by the return spring and the compression spring and generate a great impact force, causing the receiver to impact downward and damage the outer surface of the semiconductor.

[0013] A probe for a semiconductor probe test bench and its usage method include the following steps:

[0014] S1: Before use, it is fixed at the required position through a fixing frame, and the power supply of the electric telescopic rod is turned on. When the required electronic component to be detected appears at the bottom, the equipment housing is pushed downward by the electric telescopic rod;

[0015] S2: When the equipment housing moves downward, the induction column carries the receiver to break through the restriction of the cleaning rod and move downward, and drives the roller and the extrusion plate to move outward through the pressure-receiving plate;

[0016] S3: After the detection is completed, the electric telescopic rod moves upward, driving the induction column to move upward. When the receiver moves upward, the end of the cleaning rod away from the roller will squeeze the outer walls of the induction column and the receiver.

[0017] The present invention has the following beneficial effects:

[0018] (1) When the electric telescopic rod presses downward in the present invention, the electric telescopic rod pushes the equipment housing downward through the pulling plate. At this time, the equipment housing drives the pulling round plate and the induction column to move downward. When the receiver contacts the semiconductor, the return spring and the compression spring will absorb the excess downward force generated by the equipment housing, optimizing the contact of the receiver from traditional hard contact to elastic contact, so that when the receiver contacts the semiconductor surface, it will not damage the outer wall of the semiconductor due to the pressing force, improving the stability of the equipment when detecting the semiconductor.

[0019] (2) When the equipment housing moves upward in the present invention, the equipment housing drives the pulling round plate and the induction column to move upward through the return spring. When the end of the cleaning rod away from the roller moves along the outer wall of the induction column, the bottom of the receiver will be squeezed by the cleaning rod and finally form the state shown in the figure. Through the application of the above components, self-cleaning of the receiver is realized, avoiding the outer wall of the receiver being contaminated with impurities after long-term work and affecting the detection effect of the equipment.

[0020] (3) When the device housing is pressed down in the present invention, the pressure-receiving plate also descends synchronously. At this time, the inclined surface on the pressure-receiving plate will force the roller and the extrusion plate to move outwards. The extrusion plate drives the cleaning rod to move outwards, causing the cleaning rod to lose its restraint on the receiver. This avoids the influence of the cleaning rod on the induction column when the induction column descends, enabling the compression spring and the reset spring to accumulate mechanical power. When the induction column loses its restraint, the induction column will be affected by the reset spring and the compression spring and generate a great impact force, causing the receiver to impact downward and damaging the surface of the semiconductor.

[0021] (4) When the electric telescopic rod drives the device housing to move upwards in the present invention, the device housing will move upwards under the influence of the device housing. When the device housing moves upwards and drives the control bracket to move upwards through the extrusion rod, the control bracket pulls the extrusion rod, forcing the rocker to rotate downward around the force-receiving column, making the rocker parallel to the cleaning base and keeping the collection trough in an open state to collect the impurities dropped by the receiver. When the electric telescopic rod presses down, the control bracket moves downward and forces the rocker to fold up, avoiding the rocker affecting the device detection. And when the rocker folds up, the impurities inside the collection bag are discharged outwards through the miscellaneous material outlet, preventing the impurities from falling on the surface of the semiconductor and affecting the product quality. Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is an exploded schematic view of the overall structural components of the present invention;

[0024] Figure 2 It is a schematic view of the overall structure of the present invention;

[0025] Figure 3 It is an exploded schematic view of the power mechanism components of the present invention;

[0026] Figure 4 It is a cross-sectional schematic view of the power mechanism of the present invention;

[0027] Figure 5 It is a schematic view of the cleaning mechanism of the present invention;

[0028] Figure 6 It is of the present invention Figure 5 An enlarged view of A in;

[0029] Figure 7 It is a cross-sectional schematic view of the cleaning mechanism of the present invention;

[0030] Figure 8 This is a schematic diagram of the working process of the present invention.

[0031] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0032] In the figure: 1, power mechanism; 101, sliding track; 102, sliding plate; 103, fixing plate; 104, electric telescopic rod; 105, pulling plate; 106, miscellaneous material outlet; 107, rotating hole; 108, fixing frame; 109, equipment housing; 2, cleaning mechanism; 201, fixing column; 202, cleaning base; 203, cleaning rod; 204, extrusion plate; 205, roller; 206, pulling spring; 207, pulling round plate; 208, sensing column; 209, receiver; 210, reset spring; 3, cleaning mechanism; 301, control bracket; 302, extrusion rod; 303, tipping plate; 304, stress column; 305, collection bag; 306, discharge bag; 307, collection tank; 308, compression spring; 309, pressure receiving plate. Specific embodiments

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] Embodiment 1, please refer to Figure 1 - Figure 3 This invention is a probe for a semiconductor probe test bench, including a power mechanism 1. The power mechanism 1 further includes a sliding track 101. A sliding plate 102 is fixedly connected to the side wall of the sliding track 101, and a fixing plate 103 is fixedly connected to the top of the sliding track 101.

[0035] A cleaning mechanism 2, the cleaning mechanism 2 includes a fixing column 201 fixedly connected to the side wall of the sliding track 101. One end of the fixing column 201 away from the sliding track 101 is fixedly connected to a cleaning base 202, and a cleaning rod 203 is slidably connected to the inner wall of the through hole on the side wall of the cleaning base 202;

[0036] A cleaning mechanism 3, the cleaning mechanism 3 includes a control bracket 301 slidably connected to the inner wall of the sliding plate 102. A compression rod 302 is fixedly connected to the bottom of the control bracket 301, and a tipping plate 303 is rotatably connected to one end of the compression rod 302 away from the control bracket 301.

[0037] The power mechanism 1 further includes an electric telescopic rod 104 fixedly connected to the bottom of the fixed plate 103. One end of the electric telescopic rod 104 away from the fixed plate 103 is fixedly connected with a pulling plate 105. A miscellaneous material outlet 106 is provided at the side wall of the sliding track 101. This mechanism provides an installation position for the subsequent mechanism, and plays a stabilizing effect during operation, ensuring the normal operation of the equipment and avoiding problems such as bumps.

[0038] The power mechanism 1 further includes a rotating hole 107 provided in the inner wall of the miscellaneous material outlet 106. A fixed frame 108 is fixedly connected to the side wall of the sliding track 101. The outer wall of the pulling plate 105 is fixedly connected with an equipment housing 109. The inner wall of the equipment housing 109 is slidably connected to the outer wall of the upper track of the sliding track 101. When the electric telescopic rod 104 drives the equipment housing 109 to move upward, the equipment housing 109 will move upward under the influence of the equipment housing 109. When the equipment housing 109 moves upward and drives the control bracket 301 to move upward through the extrusion rod 302, the control bracket 301 pulls the extrusion rod 302, forcing the seesaw 303 to rotate downward, so that the seesaw 303 is parallel to the cleaning base 202 to collect the impurities dropped by the collection receiver 209. When the electric telescopic rod 104 presses downward, the control bracket 301 moves downward, forcing the seesaw 303 to retract, avoiding the seesaw 303 affecting the equipment detection. And when the seesaw 303 retracts, the impurities are discharged outward through the miscellaneous material outlet 106, avoiding the impurities falling on the surface of the semiconductor and affecting the product quality.

[0039] Embodiment 2, please refer to Figure 4 - Figure 8 , the present invention is a probe for a semiconductor probe test bench. On the basis of Example 1, the cleaning mechanism 2 further includes an extrusion plate 204 fixedly connected to the side wall of the cleaning rod 203. A roller 205 is rotatably connected to the inner wall of the extrusion plate 204. A pulling spring 206 is fixedly connected to the outer wall of the cleaning rod 203. One end of the pulling spring 206 away from the cleaning rod 203 is fixedly connected to the side wall of the cleaning base 202.

[0040] The cleaning mechanism 2 further includes a pulling circular plate 207 slidably connected to the inner wall of the device housing 109. A sensing post 208 is fixedly connected to the bottom of the pulling circular plate 207. The outer wall of the sensing post 208 is slidably connected to the inner wall of the through hole on the device housing 109. A receiver 209 is fixedly connected to the end of the sensing post 208 away from the pulling circular plate 207. A return spring 210 is fixedly connected to the bottom of the pulling circular plate 207. The end of the return spring 210 away from the pulling circular plate 207 is fixedly connected to the inner wall of the device housing 109. The two ends of the pressing rod 302 away from the control bracket 301 are fixedly connected to the side wall of the device housing 109. When the electric telescopic rod 104 presses downwards, the electric telescopic rod 104 pushes the device housing 109 downwards through the pulling plate 105. At this time, the device housing 109 drives the pulling circular plate 207 and the sensing post 208 to move downwards. When the receiver 209 contacts the semiconductor, the return spring 210 will absorb the excessive downward force generated by the device housing 109, optimizing the contact of the receiver 209 from traditional hard contact to elastic contact. When the receiver 209 contacts the surface of the semiconductor, the receiver 209 will not damage the outer wall of the semiconductor due to the pressing force, improving the stability of the device when detecting the semiconductor.

[0041] The cleaning mechanism 3 is rotatably connected to a force-bearing post 304 on the inner wall of the rotation hole 107. The outer wall of the force-bearing post 304 is rotatably connected to the inner wall of the through hole on the rocker 303. A collection bag 305 is fixedly connected to the top of the rocker 303. The end of the collection bag 305 away from the rocker 303 is fixedly connected to the inner wall of the miscellaneous material outlet 106. A discharge bag 306 is connected through the side wall of the collection bag 305. When the device housing 109 moves upwards, the device housing 109 drives the pulling circular plate 207 and the sensing post 208 to move upwards through the return spring 210. When the end of the cleaning rod 203 away from the roller 205 moves along the outer wall of the sensing post 208, the bottom of the receiver 209 will be pressed by the cleaning rod 203 and finally form a state as shown in Figure 5 the figure. Through the application of the above components, self-cleaning of the receiver 209 is achieved, avoiding the outer wall of the receiver 209 being contaminated with impurities during long-term operation, which affects the detection effect of the device.

[0042] The cleaning mechanism 3 further includes a collection groove 307 formed on the outer wall of the collection bag 305. A compression spring 308 is fixedly connected to the bottom of the equipment housing 109. One end of the compression spring 308 away from the equipment housing 109 is fixedly connected to the top of the cleaning base 202. A plurality of pressure plates 309 are fixedly connected to the bottom of the equipment housing 109. The outer walls of the plurality of pressure plates 309 are slidably connected to the outer walls of the rollers 205. When the equipment housing 109 is pressed down, the pressure plates 309 also descend synchronously. At this time, the inclined surfaces on the pressure plates 309 will force the rollers 205 and the extrusion plate 204 to move outward. The extrusion plate 204 drives the cleaning rod 203 to move outward, so that the cleaning rod 203 loses its restraint on the receiver 209. To prevent the induction column 208 from being affected by the cleaning rod 203 when the induction column 208 descends and causing the return spring 210 to accumulate mechanical power. When the induction column 208 loses its restraint, the induction column 208 will generate a great impact force under the influence of the return spring 210 and the compression spring 308, resulting in the receiver 209 being impacted downward and damaging the surface of the semiconductor.

[0043] The detection method of this detection device includes the following steps:

[0044] S1: Before use, it is fixed at the required position through the fixing frame 108, and the power supply of the electric telescopic rod 104 is turned on. When the required electronic component to be detected appears at the bottom, the equipment housing 109 is pushed downward by the electric telescopic rod 104;

[0045] S2: When the equipment housing 109 moves downward, the induction column 208 drives the receiver 209 to break through the restriction of the cleaning rod 203 and move downward, and drives the rollers 205 and the extrusion plate 204 to move outward through the pressure plate 309;

[0046] S3: After the detection is completed, the electric telescopic rod 104 moves upward, driving the induction column 208 to move upward. When the receiver 209 moves upward, the end of the cleaning rod 203 away from the roller 205 will squeeze the outer walls of the induction column 208 and the receiver 209.

[0047] A specific application of this embodiment is as follows: When the electric telescopic rod 104 presses downward, the electric telescopic rod 104 pushes the device housing 109 downward through the pulling plate 105. At this time, the device housing 109 drives the pulling circular plate 207 and the induction column 208 to move downward. When the receiver 209 contacts the semiconductor, the return spring 210 will absorb the excess downward force generated by the device housing 109, optimizing the receiver 209 from traditional hard contact to elastic contact. When the receiver 209 contacts the semiconductor surface, the receiver 209 will not damage the outer wall of the semiconductor due to the pressing force. When the device housing 109 moves upward, the device housing 109 drives the pulling circular plate 207 and the induction column 208 to move upward through the return spring 210. When the end of the cleaning rod 203 away from the roller 205 moves along the outer wall of the induction column 208, the bottom of the receiver 209 will be squeezed by the cleaning rod 203 and finally form a state as shown in Figure 5 When the above components are applied, self-cleaning of the receiver 209 is achieved, avoiding the outer wall of the receiver 209 being contaminated with impurities due to long-term operation. When the device housing 109 is pressed downward, the pressure-receiving plate 309 also descends synchronously. At this time, the inclined surface on the pressure-receiving plate 309 will force the roller 205 and the extrusion plate 204 to move outward. The extrusion plate 204 drives the cleaning rod 203 to move outward, causing the cleaning rod 203 to lose its restraint on the receiver 209, avoiding the influence of the cleaning rod 203 on the induction column 208 when the induction column 208 descends, enabling the return spring 210 to accumulate mechanical power. When the induction column 208 loses restraint, the induction column 208 will be affected by the return spring 210 and the compression spring 308 to generate a great impact force, causing the receiver 209 to impact downward and damage the outer surface of the semiconductor. When the electric telescopic rod 104 drives the device housing 109 to move upward, the device housing 109 will move upward under the influence of the device housing 109. When the device housing 109 moves upward and drives the control bracket 301 to move upward through the extrusion rod 302, the control bracket 301 pulls the extrusion rod 302, forcing the rocker 303 to rotate downward, making the rocker 303 parallel to the cleaning base 202 to collect the impurities dropped by the receiver 209. When the electric telescopic rod 104 presses downward, the control bracket 301 moves downward and forces the rocker 303 to retract, avoiding the rocker 303 affecting device detection. And when the rocker 303 retracts, the impurities are discharged outward through the miscellaneous material outlet 106, avoiding the impurities falling on the semiconductor surface and affecting product quality.

[0048] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A probe for a semiconductor probe test bench, comprising a power mechanism (1), the power mechanism (1) further comprising a sliding track (101), a sliding plate (102) being fixedly connected to the side wall of the sliding track (101), and a fixed plate (103) being fixedly connected to the top of the sliding track (101), characterized in that: Also includes: A cleaning mechanism (2), the cleaning mechanism (2) comprising a fixing column (201) fixedly connected to a side wall of the sliding track (101), one end of the fixing column (201) away from the sliding track (101) being fixedly connected to a cleaning base (202), and a cleaning rod (203) being slidably connected to an inner wall of a through hole in the side wall of the cleaning base (202); A cleaning mechanism (3), the cleaning mechanism (3) comprising a control bracket (301) slidably connected to the inner wall of the sliding plate (102), the bottom of the control bracket (301) being fixedly connected to an extrusion rod (302), one end of the extrusion rod (302) away from the control bracket (301) being rotatably connected to a seesaw (303), the top of the seesaw (303) being fixedly connected to a collection bag (305), one end of the collection bag (305) away from the seesaw (303) being fixedly connected to the inner wall of the miscellaneous material outlet (106), and a discharge bag (306) being through-connected to the side wall of the collection bag (305); The cleaning mechanism (2) further comprises an extrusion plate (204) fixedly connected to the side wall of the cleaning rod (203); a roller (205) is rotatably connected to the inner wall of the extrusion plate (204); a pulling spring (206) is fixedly connected to the outer wall of the cleaning rod (203); and one end of the pulling spring (206) away from the cleaning rod (203) is fixedly connected to the side wall of the cleaning base (202).

2. A probe for a semiconductor probe test station according to claim 1, characterized in that: The power mechanism (1) further comprises an electric telescopic rod (104) fixedly connected to the bottom of the fixed plate (103); one end of the electric telescopic rod (104) away from the fixed plate (103) is fixedly connected to a pulling plate (105); and a miscellaneous material outlet (106) is provided on the side wall of the sliding track (101).

3. A probe for a semiconductor probe test station according to claim 2, characterized in that: The power mechanism (1) further comprises a rotation hole (107) formed on the inner wall of the miscellaneous material outlet (106); a fixing frame (108) is fixedly connected to the side wall of the sliding track (101); a device housing (109) is fixedly connected to the outer wall of the pulling plate (105); and the inner wall of the device housing (109) is slidably connected to the outer wall of the upper track of the sliding track (101).

4. A probe for a semiconductor probe test station according to claim 3, characterized in that: The cleaning mechanism (2) further comprises a pulling circular plate (207) slidably connected to the inner wall of the device housing (109); a sensing column (208) is fixedly connected to the bottom of the pulling circular plate (207); an outer wall of the sensing column (208) is slidably connected to the inner wall of a through hole on the device housing (109); an end of the sensing column (208) away from the pulling circular plate (207) is fixedly connected to a receiver (209); a reset spring (210) is fixedly connected to the bottom of the pulling circular plate (207); an end of the reset spring (210) away from the pulling circular plate (207) is fixedly connected to the inner wall of the device housing (109); and both ends of the extrusion rod (302) away from the control bracket (301) are fixedly connected to the side walls of the device housing (109).

5. The probe for a semiconductor probe test station according to claim 4, characterized in that: The cleaning mechanism (3) is rotatably connected to a force-bearing column (304) at the inner wall of the rotating hole (107), and the outer wall of the force-bearing column (304) is rotatably connected to the inner wall of the through hole on the seesaw (303).

6. The probe for a semiconductor probe test station according to claim 5, characterized in that: The cleaning mechanism (3) further comprises a collecting groove (307) provided on the outer wall of the collecting bag (305); a compression spring (308) is fixedly connected to the bottom of the device housing (109); one end of the compression spring (308) away from the device housing (109) is fixedly connected to the top of the cleaning base (202); a plurality of compression plates (309) are fixedly connected to the bottom of the device housing (109); and the outer walls of the plurality of compression plates (309) are slidably connected to the outer wall of the roller (205).

7. The semiconductor probe test bench probe according to any one of claims 1 to 6, characterized in that: The method for using the probe comprises the following steps: S1: before use, the device is fixed at a desired position by means of a fixing frame (108), and the power supply of the electric telescopic rod (104) is turned on. When the desired detection electronic component appears at the bottom, the device housing (109) is pushed downward by means of the electric telescopic rod (104); S2: When the device housing (109) moves downward, the sensing column (208) carries the receiver (209) and moves downward beyond the restriction of the cleaning rod (203), and drives the roller (205) and the extrusion plate (204) to move outward through the pressure plate (309); S3: After the detection is completed, the electric telescopic rod (104) moves upward, driving the sensing column (208) to move upward. When the receiver (209) moves upward, the end of the cleaning rod (203) away from the roller (205) will squeeze the outer wall of the sensing column (208) and the receiver (209).

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