Chip power supply testing device and method

Abstract

The present invention provides a chip power supply test method, including placing multiple parallel resistors on a test circuit board, the test circuit board is used to simulate a chip, the resistance values ​​of the multiple parallel resistors are variable, the test circuit board is placed on a heat dissipation structure, an initial resistance value is set, the temperature of a heat dissipation housing, a test circuit board, and a chip power supply is measured, and the tested temperature is compared with a preset upper temperature limit under a specific heat dissipation environment, and the resistance value is adjusted based on the comparison result; by adjusting the resistance value of the resistor on the test circuit board, it is used to detect the power supply capacity of the chip power supply under a specific heat dissipation environment. The present invention sets a test circuit board for a resistor circuit to simulate a chip, places the test circuit board under a specific heat dissipation environment, and changes the resistance value of the resistor circuit according to the feedback of the temperature detection result to simulate the power supply capacity of the power supply under the real heat dissipation performance in an actual working environment, while not causing damage to the power supply.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing, and in particular relates to a chip power supply testing device and method. Background Art

[0002] With the rapid development of chip technology, chips using advanced process technologies such as 10nm (nanometer), 12nm, 14nm, and 16nm have been launched one after another, which not only provides strong hardware support for the development of artificial intelligence (AI), Internet of Things (IoT) and other fields, but also greatly promotes the application of cutting-edge technologies such as intelligent computing, edge computing and high-performance computing. These advanced process chips, with their higher integration, lower power consumption and faster computing speed, enable terminal devices to run complex algorithms more intelligently and efficiently, meeting the growing demand for data processing.

[0003] At the same time, these technological advances have also brought unprecedented challenges to related industries such as circuit design and chip applications. Designers must face a series of problems such as how to achieve more complex circuit layouts in a limited space, how to ensure signal integrity, and how to optimize power management. In addition, as chip size continues to shrink, the physical limits and technical difficulties in the manufacturing process are also increasing, which requires the industry to continuously innovate manufacturing processes and technical means to overcome the obstacles brought about by Moore's Law gradually approaching its limits.

[0004] FPGA chip is a special integrated circuit that can be programmed and configured by the user according to their needs after manufacturing to achieve specific digital logic functions. Unlike traditional fixed logic ASIC (application-specific integrated circuit), FPGA is highly flexible because they can be reprogrammed to perform different tasks after leaving the factory.

[0005] Existing FPGA chips face the problems of heat dissipation and power supply capacity testing in application, which mainly includes whether the chip heat dissipation and power supply can match. Therefore, it is necessary to design a chip power supply testing device and method to test whether the chip heat dissipation capacity matches the power supply capacity in different usage scenarios. Summary of the invention

[0006] The present invention provides a chip power supply testing device and method, which simulates a load of chip dimensions and is installed in an actual working environment to test whether the heat dissipation of a test device or a test circuit board matches the power supply.

[0007] Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

[0008] To achieve one or part or all of the above purposes or other purposes, a chip power supply test method provided by a technical solution of the present invention includes placing multiple parallel resistors on a test circuit board, the test circuit board is used to simulate a chip, the resistance values ​​of the multiple parallel resistors are variable, the test circuit board is placed on a heat dissipation structure, an initial resistance value is set, the chip power supply supplies power to the test circuit board, the temperature of the heat dissipation housing, the test circuit board, and the chip power supply is measured, and the measured temperature is compared with the preset temperature upper limit of the heat dissipation housing, the test circuit board, and the chip power supply under a specific heat dissipation environment, and the resistance value is adjusted based on the comparison result; by adjusting the resistance value of the resistor on the test circuit board, it is used to detect the power supply capacity of the chip power supply under a specific heat dissipation environment. The solution of the present invention simulates the chip by setting a test circuit board of a resistance circuit, placing the test circuit board under a specific heat dissipation environment, and changing the resistance value of the resistance circuit according to the temperature detection result to simulate whether the heat dissipation performance of the test circuit board matches the power supply under the actual working temperature, thereby characterizing whether the heat dissipation performance of the chip matches the power supply.

[0009] The specific heat dissipation environment refers to the heat dissipation structure cooling the chip with a constant or variable heat dissipation power based on the working environment of the chip or the chip size.

[0010] The method for adjusting the resistance value of the parallel resistors on the test circuit board is that in the parallel resistor circuit, each parallel resistor is connected to the test circuit board through a switch tube, and the switch tube is turned off by signal control to select the parallel resistor to be connected to the test circuit board.

[0011] The temperatures of the heat dissipation housing, the test circuit board and the chip power supply are measured by temperature sensors. The temperature acquisition circuit collects the temperature on the temperature sensor and compares it with the preset upper temperature limits of the heat dissipation housing, the test circuit board and the chip power supply under a specific heat dissipation environment. The comparison result is read by the processor, and the processor sends a control signal to control the on and off of the corresponding switch tube, thereby controlling the corresponding resistor to be connected to the test circuit board.

[0012] The method for adjusting the resistance value of the resistor on the test circuit board is to add a parallel resistor to the test circuit board when the measured temperature result is lower than the preset temperature upper limit for a period of time exceeding the preset time.

[0013] The measured temperature result is higher than the preset temperature upper limit of the heat dissipation housing, test circuit board and chip power supply under a specific heat dissipation environment for a period of time exceeding a preset time, testing the actual power supply capacity of the power supply; when the number of parallel resistors in the test circuit board reaches the upper limit, the power supply capacity of the chip power supply under a specific heat dissipation environment meets the design requirements.

[0014] When the measured temperatures of the heat dissipation housing, the test circuit board and the chip power supply are lower than the preset upper temperature limits of the heat dissipation housing, the test circuit board and the chip power supply for more than 10 minutes, a parallel resistor is added to the test circuit board until the number of parallel resistors in the test circuit board reaches the upper limit.

[0015] The test circuit board has the same dimensions as the chip; each parallel resistor has the same resistance value, and the total resistance value calculated by the design voltage and design current of the chip power supply is the resistance value after all resistors in the parallel resistor circuit are connected.

[0016] The initial resistance value is set to be the resistance value of 10 resistors connected in parallel.

[0017] Based on the test results, a curve showing the relationship between the number of resistors or the resistance value and the current change, as well as a curve showing the relationship between the temperature change and the current change are produced.

[0018] The processor calculates the resistance value and the current size based on the number of resistors read, and outputs the relationship curve between the number of resistors or the resistance value and the current change; the processor outputs the relationship curve between the temperature change and the current change based on the temperature value collected by the temperature acquisition circuit.

[0019] Another technical solution of the present invention provides a chip power supply testing device, which uses the above-mentioned chip power supply testing method for testing, including: a test circuit board, on which multiple parallel resistors are arranged, and a control switch is arranged between each resistor and the test circuit board; the test circuit board is installed on the chip circuit board; a heat dissipation structure, in which the test circuit board is placed, and the heat dissipation structure includes a heat dissipation shell; a processing board, which is provided with a temperature acquisition circuit, a processor and a communication interface; the temperature acquisition circuit is connected to temperature sensors respectively placed on the test circuit board, the heat dissipation shell, and the chip power supply through cables; the processor is connected to the temperature sensor signal, and the processor is respectively connected to the multiple control switches on the test circuit board through control signal lines; the chip power supply is connected to the power supply end on the test circuit board through a power line.

[0020] A heat-conducting layer is arranged between the test circuit board and the heat dissipation structure.

[0021] The test circuit board is an aluminum substrate.

[0022] Compared with the prior art, the beneficial effects of the present invention mainly include: the chip power supply test device and method of the present invention can automatically match the flow capacity by setting a low-voltage and high-current load of a resistance circuit on the test circuit board, and combining the actual ambient temperature feedback and the set temperature upper limit, so that the test process is more intelligent, convenient, efficient and fast. At the same time, the test circuit board of the present invention is the same size as the actual size of the chip. The test circuit board equipped with a load resistor is installed in an actual working environment with a heat dissipation structure, and the temperature of the device or the test circuit board is monitored, which can be used to simulate whether the heat dissipation performance of the heat dissipation environment of chips of different sizes matches the power supply capacity.

[0023] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the structure of the chip power supply testing device of the present invention. DETAILED DESCRIPTION

[0026] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0027] Embodiment 1

[0028] Embodiment 1 provides a chip power supply test method, which is used to test whether the power supply capacity of the chip power supply matches the heat dissipation capacity of the test equipment or the test circuit board under a specific environment. The chip power supply test method includes the following steps: using a test circuit board and a resistive load arranged on the test circuit board to simulate an actual chip. In Embodiment 1, an aluminum substrate is selected as the test circuit board to illustrate the present invention. In actual operation, other test circuit boards with better heat dissipation effects can also be selected, and a resistive circuit is arranged on the aluminum substrate. The VCCINT power supply output terminal on the chip circuit board is powered by the resistive aluminum substrate.

[0029] The resistance value of the resistor circuit can be changed, and the aluminum substrate is installed in the heat dissipation structure (chip heat dissipation structure). According to the heat dissipation requirements of a specific chip in a certain working environment, the heat dissipation environment is simulated, and the heat dissipation structure is used to dissipate the heat of the aluminum substrate at a fixed power or variable power. In order to simulate the heat dissipation environment of chips of different sizes, the shape of the aluminum substrate can be set to the size of the chip package shape. The chip is usually rectangular or square, so the aluminum substrate can be designed into rectangles or squares of different sizes. At the same time, the power of the heat dissipation structure is adjusted to the power required for heat dissipation of the chip size to simulate the heat dissipation of chips of different sizes.

[0030] Measure the temperature of the aluminum substrate, the heat dissipation housing and the chip power supply. In order to facilitate the reading of the temperature, the temperature sensors are placed on the aluminum substrate, the heat dissipation housing and the chip power supply in sequence, and the temperatures of the aluminum substrate, the heat dissipation housing and the chip power supply are collected through the temperature acquisition circuit;

[0031] After obtaining the temperatures of the aluminum substrate, heat dissipation shell and chip power supply, compare the measured temperatures of the aluminum substrate, heat dissipation shell and chip power supply obtained from the test with the preset upper temperature limits of the aluminum substrate, heat dissipation shell and chip power supply under a specific heat dissipation environment (common temperature indicators, FPGA temperature ≤100°C, power supply temperature ≤90°C, casing temperature ≤75°C). The specific heat dissipation environment here is mainly affected by the chip size and chip working environment. The heat dissipation structure is selected according to the chip size and chip working environment to perform heat dissipation work under a specific power.

[0032] If the measured temperature of the aluminum substrate, the heat dissipation housing, and the chip power supply is lower than the preset temperature upper limit for a duration exceeding the preset time (the preset time here can be adjusted according to demand), the resistance value of the resistance circuit is adjusted, and the resistance of the resistance circuit is connected to the test circuit board in parallel. Each resistor is controlled by a control switch when connected to the test circuit board, and the resistance value of each resistor is the same. More specifically, the total resistance value calculated by the design voltage and design current of the chip power supply is the resistance value of all the resistance values ​​in the parallel resistance circuit after being connected, and the initial resistance value of the initial resistance circuit is greater than the total resistance value calculated by the design voltage and design current of the power supply. The number of resistors is subject to the size of the aluminum substrate. After each connection of the resistor, the total resistance value of the resistor circuit can be reduced, thereby increasing the current value, thereby increasing the power of the resistor circuit, and the heat generated is also increased accordingly.

[0033] The resistance value of the resistance circuit is adjusted in this way: when the measured temperature is lower than the preset temperature upper limit for a period of time exceeding the preset time, a parallel resistor is added to the resistance circuit until the number of parallel resistors reaches the upper limit. In this case, it can be considered that the power supply capacity of the chip power supply meets the design requirements under a specific heat dissipation environment; or if the temperature measurement result is higher than the preset temperature upper limit, the actual power supply capacity of the power supply (power supply parameters and other data) can be measured.

[0034] At the same time, after the test is completed, a result curve is drawn according to the test results, including a curve of the relationship between the number of resistors or the resistance value and the current change, or a curve of the relationship between the temperature of the aluminum substrate, the heat dissipation shell and the chip power supply and the current value change, or a curve of the relationship between the resistance value and the temperature change, and other test result curves.

[0035] In order to facilitate the control of the test process, a temperature acquisition circuit is used to collect the temperature values ​​of the chip power supply, the heat dissipation housing and the temperature sensor on the aluminum substrate, and the collected temperature values ​​are transmitted to the processor. The processor is connected to the control switch through multiple rows of signal lines. The processor has a preset temperature value upper limit and a control program. Based on the temperature value in the temperature acquisition circuit, a control signal is sent to the control switch to adjust the resistance value of the resistance circuit, further improving the processing efficiency. At the same time, the controller can output a variety of test result curves.

[0036] The following is a circuit application of the XCVU13P chip, a chip power supply design voltage of 0.72V, and a design current of 80A as an example for specific description. The XCVU13P chip power supply test method includes the following steps:

[0037] 1) Solder the XCVU13P circuit board, remove the XCVU13P chip from the circuit board; connect the output end of the VCCINT power supply to the resistor aluminum substrate through flying wires;

[0038] 2) Replace the XCVU13P chip with a resistor aluminum substrate. The size of the resistor aluminum substrate is 52.5mm×52.5mm. It is installed on the heat dissipation structure of the XCVU13P circuit board through thermal conductive adhesive. At the same time, install the multi-channel temperature sensor on the resistor aluminum substrate, the power supply under test, the heat dissipation housing and other positions;

[0039] 3) Place the installed XCVU13P device (XCVU13P circuit board + heat dissipation structure) in the specified working environment;

[0040] 4) Power supply and setting of upper temperature limit are realized through the communication interface on the processing board, for example, setting the operating temperature to 85°C;

[0041] 5) XCVU13P device is powered on and the test begins. The initial resistance value is 10 resistors in parallel.

[0042] 6) The processing board compares the multi-channel temperature measurement results with the preset temperature upper limit: when the temperature measurement result is lower than the preset upper limit, after the continuous time exceeds 10 minutes (the time can be set), the control adds one parallel resistor; until the temperature measurement result is higher than the preset upper limit or the number of parallel resistors reaches the upper limit (when powered by 0.72V, a maximum of 25 can be connected), it is considered that the power supply capacity of the power supply (equipment) in a specific heat dissipation environment has been reached;

[0043] 7) The processing board outputs the test results: parallel resistance quantity change curve, temperature change curve.

[0044] The relationship between the number of parallel resistors and the on-current obtained from the test is shown in the following table:

[0045] Table 1 Relationship between the number of parallel resistors and the on-current

[0046]

[0047] Embodiment 2

[0048] Embodiment 2 provides a chip power supply test device, see Figure 1 , including a resistor aluminum substrate and a processing board. There is a parallel resistor circuit on the resistor aluminum substrate. The resistor is a chip resistor. Each parallel resistor is set with a control switch when connected to the aluminum substrate. Figure 1 Taking 25 parallel resistors as an example, 25 control switches are provided on the 25 parallel circuits, each of which is a power MOS tube, and each control switch is controlled to open or close by a control signal.

[0049] It also includes a processing board, on which there are a processor and a temperature acquisition circuit, the processor is connected to a plurality of parallel control switch signals on the resistive aluminum substrate through a signal line, the processor is connected to the temperature acquisition circuit signal, and is used to receive the real-time temperature fed back by the temperature acquisition circuit, the aluminum substrate and the resistive circuit thereon are used to simulate the chip, the aluminum substrate and the resistive circuit thereon are placed in the heat dissipation structure on the chip circuit board, and temperature sensors are arranged on the heat dissipation housing of the heat dissipation structure, the chip power supply and the aluminum substrate, and the temperature acquisition circuit is connected to these temperature sensors through cables, and is used to receive the real-time temperature. The temperature acquisition circuit in the second embodiment is a temperature acquisition ADC, which has multiple temperature acquisition ports, and the cables on these temperature acquisition ports are connected to the temperature sensors.

[0050] A communication interface is also provided on the processing board, and the communication interface is used to power the equipment on the processing board. At the same time, the communication interface is also connected to the processor to set the upper temperature limit, so that the processor can control the shutdown of the control switch on the resistor aluminum substrate after receiving the real-time temperature feedback.

[0051] The chip power supply test device of the second embodiment uses the chip power supply test method of the first embodiment for testing. The chip power supply test method has been introduced in detail in the first embodiment, and will not be described in detail here.

[0052] The above is a detailed introduction to a chip power supply test device and method provided by the present invention. This article uses specific examples to illustrate the structure and working principle of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, the present invention can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A chip power supply testing method, characterized in that: include, Placing a plurality of parallel resistors on a test circuit board, the test circuit board is used to simulate a chip, the resistance values ​​of the plurality of parallel resistors are variable, and the test circuit board is placed in a heat dissipation structure; The method for adjusting the resistance value of the parallel resistor on the test circuit board is that, in the parallel resistor circuit, each parallel resistor is connected to the test circuit board through a switch tube, and the switch tube is turned off by signal control, and the parallel resistor is selected to be connected to the test circuit board; An initial resistance value is set, the chip power supply supplies power to the test circuit board, the temperature of the heat dissipation housing, the test circuit board, and the chip power supply is measured, and the measured temperature is compared with the preset temperature upper limits of the heat dissipation housing, the test circuit board, and the chip power supply under a specific heat dissipation environment, and the resistance value is adjusted based on the comparison result; The method for adjusting the resistance value of the resistor on the test circuit board is to add a parallel resistor to the test circuit board when the measured temperature result is lower than the preset temperature upper limit for a period of time exceeding the preset time; The total resistance value calculated by the design voltage and design current of the chip power supply is the resistance value of all the resistors in the parallel resistance circuit after they are connected; By adjusting the resistance value of the resistor on the test circuit board, the power supply capacity of the chip power supply under a specific heat dissipation environment is detected; when the measured temperature result is higher than the preset upper temperature limit of the heat dissipation housing, the test circuit board and the chip power supply under the specific heat dissipation environment for more than a preset time or the number of parallel resistors in the test circuit board reaches the upper limit, the power supply capacity of the chip power supply under the specific heat dissipation environment meets the design requirements.

2. A chip power supply testing method according to claim 1, characterized in that: The specific heat dissipation environment refers to the heat dissipation structure cooling the chip with a constant or variable heat dissipation power based on the working environment of the chip or the chip size.

3. A chip power supply testing method according to claim 1, characterized in that: The temperatures of the heat dissipation housing, the test circuit board and the chip power supply are measured by temperature sensors. The temperature acquisition circuit collects the temperature on the temperature sensor and compares it with the preset upper temperature limits of the heat dissipation housing, the test circuit board and the chip power supply under a specific heat dissipation environment. The comparison result is read by the processor, and the processor sends a control signal to control the on and off of the corresponding switch tube, thereby controlling the corresponding resistor to be connected to the test circuit board.

4. A chip power supply testing method according to claim 1, characterized in that: When the measured temperatures of the heat dissipation housing, the test circuit board and the chip power supply are lower than the preset upper temperature limits of the heat dissipation housing, the test circuit board and the chip power supply for more than 10 minutes, a parallel resistor is added to the test circuit board until the number of parallel resistors in the test circuit board reaches the upper limit.

5. A chip power supply testing method according to claim 1, characterized in that: The outer dimensions of the test circuit board are the same as those of the chip; Each resistor in parallel has the same resistance value.

6. A chip power supply testing method according to claim 1, characterized in that: The initial resistance value is set to be the resistance value of 10 resistors connected in parallel.

7. A chip power supply testing method according to claim 1, characterized in that: Based on the test results, a curve showing the relationship between the number of resistors or the resistance value and the current change, as well as a curve showing the relationship between the temperature change and the current change are produced.

8. A chip power supply testing method according to claim 7, characterized in that: The processor calculates the resistance value and the current based on the number of resistors read, and outputs a curve showing the relationship between the number of resistors or the resistance value and the current; The processor outputs the temperature change and current change relationship curve based on the temperature value collected by the read temperature acquisition circuit.

9. A chip power supply testing device, using the chip power supply testing method according to any one of claims 1 to 8 for testing, characterized in that: include: A test circuit board, on which a plurality of parallel resistors are arranged, and a control switch is arranged between each resistor and the test circuit board; The test circuit board is mounted on the chip circuit board; A heat dissipation structure, wherein the test circuit board is placed in the heat dissipation structure, and the heat dissipation structure comprises a heat dissipation housing; A processing board, provided with a temperature acquisition circuit, a processor and a communication interface; The temperature acquisition circuit is connected to temperature sensors respectively placed on the test circuit board, the heat dissipation housing, and the chip power supply through cables; The processor is connected to the temperature sensor signal, and the processor is connected to the plurality of control switches on the test circuit board through control signal lines; The chip power supply is connected to the power supply terminal on the test circuit board through a power line.

10. A chip power supply testing device according to claim 9, characterized in that: A heat-conducting layer is arranged between the test circuit board and the heat dissipation structure.

11. A chip power supply testing device according to claim 9, characterized in that: The test circuit board is an aluminum substrate.

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