A heat sink for a semiconductor power module

Abstract

The application relates to a heat sink of a semiconductor power module, which comprises a single-face heat dissipation shell or a double-face heat dissipation shell, the top of the single-face heat dissipation shell is provided with a heat dissipation concave cavity, the side of the single-face heat dissipation shell is formed with two interfaces which are arranged at opposite angles and are communicated with the heat dissipation concave cavity; the double-face heat dissipation shell comprises two cover bodies which are symmetrically arranged upwards and downwards and are fixedly sealed with each other, the inside of the two cover bodies is combined to form a heat dissipation inner cavity; a plurality of heat dissipation column units are further formed on the bottom wall of the heat dissipation concave cavity or the top wall and the bottom wall of the heat dissipation inner cavity, and the heat dissipation column unit comprises a plurality of heat dissipation columns; the application reduces the cost and simplifies the operation; the problem of poor universality is solved; in addition, the installation difficulty is greatly reduced to effectively guarantee the heat dissipation and sealing effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor power modules, in particular to a heat sink of a semiconductor power module. BACKGROUND

[0002] The semiconductor power module is a power power electronic device which is composed of semiconductor as the main material according to certain functions and then is re-sealed into a module; it is usually composed of semiconductor devices, heat dissipation structures and packaging (including pins and shells) and the like, and the heat dissipation structure of the semiconductor power module must rely on an external heat sink; according to the different heat dissipation structures of the semiconductor power module, the semiconductor power module can be divided into single-sided heat dissipation power modules and double-sided heat dissipation power modules; in order to adapt to the two forms, the external heat sink is also divided into single-sided heat sinks and double-sided heat sinks.

[0003] The conventional single-sided heat dissipation power module is sealed by first welding the heat dissipation surface of the single-sided heat dissipation power module to a bottom plate with pin fins, then sealing between the heat dissipation surface of the single-sided heat dissipation power module and the bottom plate by using an O-ring, and then fixed on the heat sink by bolts; the most important disadvantage is that the operation steps are complicated, the shape and specifications of the heat sink need to be customized according to the power module, the universality is poor, and the cost is high.

[0004] The conventional double-sided heat dissipation power module needs to weld a bottom plate with pin fins on the upper and lower heat dissipation surfaces of the double-sided heat dissipation power module and prepare two heat sinks, then seal between each heat dissipation surface and the bottom plate by using an O-ring, and then fix the double-sided heat dissipation power module between the upper and lower heat sinks by bolts; since there is a tolerance in the height of each power module, at least one heat dissipation surface of the power module cannot be in the same plane, so the installation is difficult, thereby affecting the heat dissipation and sealing effect.

[0005] Therefore, it is urgent to solve the problem. SUMMARY

[0006] In view of the above status of the prior art, the technical problem to be solved by the present application is to provide a heat sink of a semiconductor power module which reduces the cost and simplifies the operation, solves the problem of poor universality, greatly reduces the installation difficulty and effectively guarantees the heat dissipation and sealing effect.

[0007] The technical scheme adopted by the present application to solve the above technical problem is: a heat sink of a semiconductor power module, comprising a single-sided heat dissipation shell or a double-sided heat dissipation shell, characterized in that a heat dissipation cavity is formed in the top of the single-sided heat dissipation shell, two interfaces are formed on the side of the single-sided heat dissipation shell, the two interfaces are diagonally opposite to each other and are in communication with the heat dissipation cavity, and a water pipe is in communication between each interface and the heat dissipation cavity.

[0008] The double-sided heat dissipation shell comprises two cover bodies which are symmetrically arranged and fixed to each other, and the inside of the two cover bodies is combined to form a heat dissipation inner cavity; the edge of the opening of each cover body is outwardly formed with two groove bodies which are diagonally arranged; the openings of the two groove bodies on the upper cover body are respectively fixed to the openings of the two groove bodies on the lower cover body to form two water passing pipes which are in communication with the heat dissipation inner cavity.

[0009] The bottom wall of the heat dissipation cavity or the top wall and the bottom wall of the heat dissipation inner cavity is further formed with a plurality of heat dissipation column units, and the heat dissipation column unit comprises a plurality of heat dissipation columns.

[0010] The number of the heat dissipation column units on the bottom wall of the heat dissipation cavity is one.

[0011] The number of the heat dissipation column units on the top wall of the heat dissipation inner cavity is equal to the number of the heat dissipation column units on the bottom wall of the heat dissipation inner cavity and is at least one.

[0012] At least one heat dissipation column unit on the top wall or the bottom wall of the heat dissipation inner cavity is sequentially arranged from left to right.

[0013] The end face shape of the heat dissipation column is a plane, a conical surface, a truncated conical surface or a sawtooth surface.

[0014] The end of the heat dissipation column is further embedded with a telescopic head which can move up and down and has an elastic recovery function.

[0015] The end face shape of the telescopic head is a plane, a conical surface, a truncated conical surface or a sawtooth surface.

[0016] The end of the heat dissipation column or the telescopic head with a plane, a conical surface or a truncated conical surface end face is further provided with at least one groove, and the groove is used for storing welding or sintering materials.

[0017] Preferably, at least two partition plates are further formed between the inner walls of the front and rear sides of the cover body and are used for being attached to the outer walls of the left side or the right side of the power module, the number of the partition plates is matched with the number of the heat dissipation column units on the top wall or the bottom wall of the heat dissipation inner cavity so that each heat dissipation column unit has two partition plates above or below.

[0018] Preferably, the lower side edge of each partition plate in the upper cover body is fixed to the upper side edge of the corresponding partition plate in the lower cover body.

[0019] Preferably, a flow guide chamber is formed between the two partition plates on the leftmost side of the heat dissipation inner cavity and the left inner wall of the heat dissipation inner cavity and between the two partition plates on the rightmost side of the heat dissipation inner cavity and the right inner wall of the heat dissipation inner cavity, and the two water passing pipes are in communication with the two flow guide chambers.

[0020] Compared with the prior art, the application has the advantages that the power module is not welded on the bottom plate with pin fins, but the pin fin structure is integrated into the single-sided heat dissipation shell or the double-sided heat dissipation shell, and the power module can be directly sealed and fixed on the top of the single-sided heat dissipation shell or the inside of the double-sided heat dissipation shell, so that the use of the O-ring for sealing is not necessary, thereby saving materials and reducing costs, and reducing the packaging steps between the power module and the heat sink to simplify the operation; and the multiple single-sided heat dissipation shells or double-sided heat dissipation shells can be simply and conveniently connected in series according to the number of the power modules to solve the problem of poor universality; in addition, the height tolerance between the power modules can be completely eliminated by using the telescopic head, thereby greatly reducing the installation difficulty to effectively ensure the heat dissipation and sealing effect. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a front view of the single-sided heat dissipation shell of the application;

[0022] Figure 2 It is a front view of the double-sided heat dissipation shell of the application;

[0023] Figure 3 It is a schematic diagram of the end face shape of the heat dissipation column being a plane, a conical surface, a truncated conical surface or a jagged surface;

[0024] Figure 4 It is a schematic diagram of the end face shape of the telescopic head being a plane, a conical surface, a truncated conical surface or a jagged surface;

[0025] Figure 5 It is a recess schematic diagram of the heat dissipation column end face shape being a plane, a conical surface or a truncated conical surface;

[0026] Figure 6 It is a recess schematic diagram of the telescopic head end face shape being a plane, a conical surface or a truncated conical surface;

[0027] Figure 7 It is a front view of the single-sided heat dissipation shell after the power module is installed;

[0028] Figure 8 It is a front view of the double-sided heat dissipation shell after the power module is installed;

[0029] Figure 9 It is a schematic diagram of the multiple single-sided heat dissipation shells connected in series;

[0030] Figure 10 It is a schematic diagram of the multiple double-sided heat dissipation shells connected in series;

[0031] Figure 11 It is a schematic diagram of the double-sided heat dissipation shell with multiple power modules installed inside. DETAILED DESCRIPTION

[0032] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms "first", "second", and similar terms do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "comprise", and similar terms are intended to mean that the elements or objects listed after the terms encompass the elements or objects recited after the terms, and equivalent thereof, and do not preclude other elements or objects. The terms "connected" or "linked" or similar terms do not limit to physical or mechanical connections or links, but can include electrical connections or links, whether direct or indirect. The terms "upper", "lower", "left", "right", and similar terms are used only to indicate relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships can also be changed accordingly.

[0033] In order to keep the following description of the embodiments of the present application clear and concise, the detailed description of known functions and known components is omitted.

[0034] As shown in Figures 1-2 A heat sink of a semiconductor power module includes a single-sided heat dissipation shell 1 or a double-sided heat dissipation shell 2. The single-sided heat dissipation shell 1 has a heat dissipation cavity 11 formed in the top thereof, and two interfaces 12 formed in the side surface thereof and arranged at opposite corners and in communication with the heat dissipation cavity 11. The double-sided heat dissipation shell 2 includes two cover bodies 21 arranged symmetrically and fixedly sealed to each other. The interiors of the two cover bodies 21 are combined to form a heat dissipation inner cavity 22. The edge of the opening of each cover body 21 is outwardly formed with two groove bodies 23 arranged at opposite corners. The openings of the two groove bodies 23 on the upper cover body 21 are respectively fixedly sealed to the openings of the two groove bodies 23 on the lower cover body 21 to form two water passing pipes 24 in communication with the heat dissipation inner cavity 22. The bottom wall of the heat dissipation cavity 11 or the top wall and the bottom wall of the heat dissipation inner cavity 22 are further formed with a plurality of heat dissipation column units, each of which includes a plurality of heat dissipation columns 3.

[0035] The number of the heat dissipation column units arranged on the bottom wall of the heat dissipation cavity 11 is one.

[0036] The number of the heat dissipation column units arranged on the top wall of the heat dissipation inner cavity 22 is equal to the number of the heat dissipation column units arranged on the bottom wall of the heat dissipation inner cavity 22, and is at least one.

[0037] The at least one heat dissipation column unit arranged on the top wall or the bottom wall of the heat dissipation inner cavity 22 is arranged in sequence from left to right.

[0038] At least two partition plates 25 are formed between the inner walls of the front and back of the cover 21, and are used to fit on the outer walls of the left or right of the power module 6. The number of partition plates 25 is matched with the number of heat dissipation column units on the top wall or bottom wall of the heat dissipation inner cavity 22, so that each heat dissipation column unit has two partition plates 25 above or below.

[0039] The lower side edges of each partition plate 25 in the upper cover 21 are respectively sealed and fixed on the upper side edges of the corresponding partition plate 25 in the lower cover 21.

[0040] Two partition plates 25 on the leftmost side of the heat dissipation inner cavity 22 and the left inner wall of the heat dissipation inner cavity 22 form a flow guide chamber 26, and two water pipes 24 are respectively connected to the two flow guide chambers 26.

[0041] As shown in Figure 3 The end face of the heat dissipation column 3 is a plane, a conical surface, a truncated conical surface, or a jagged surface, and (a), (b), (c), and (d) respectively represent the schematic diagram when the end face of the heat dissipation column 3 is a plane, a conical surface, a truncated conical surface, or a jagged surface.

[0042] The end of the heat dissipation column 3 is also embedded with a telescopic head 4 that can move up and down and has an elastic recovery function, which is used to offset the vertical position tolerance caused by the flatness error of the welding surface of the power module 6 and the end of the heat dissipation column 3.

[0043] As shown in Figure 4 The end face of the telescopic head 4 is a plane, a conical surface, a truncated conical surface, or a jagged surface, and (a), (b), (c), and (d) respectively represent the schematic diagram when the end face of the telescopic head 4 is a plane, a conical surface, a truncated conical surface, or a jagged surface.

[0044] As shown in Figures 5-6 The end of the heat dissipation column 3 or the telescopic head 4 with a plane, a conical surface, or a truncated conical surface end face is also provided with at least one groove 5 for accommodating the welding or sintering material 7, and (a), (b), and (c) respectively represent the schematic diagram of the groove 5 when the end face of the heat dissipation column 3 or the telescopic head 4 is a plane, a conical surface, or a truncated conical surface.

[0045] As shown in Figures 7-8 A packaging method of a heat sink of a semiconductor power module, comprising the following steps:

[0046] S1: arranging a welding or sintering material 7;

[0047] S11: If single-sided cooling is adopted, a single-sided heat dissipation shell 1 is taken and a certain amount of welding or sintering material 7 is applied to the end of each heat dissipation column 3 or telescopic head 4 on the single-sided heat dissipation shell 1, so that the welding or sintering material 7 is stored in each groove 5;

[0048] If the end face of the heat dissipation column 3 or telescopic head 4 is a sawtooth face, the welding or sintering material 7 only needs to be stored between any two adjacent sawteeth;

[0049] S12: If double-sided cooling is adopted, a double-sided heat dissipation shell 2 is taken and a certain amount of welding or sintering material 7 is applied to the end of each heat dissipation column 3 or telescopic head 4 in each cover 21 on the double-sided heat dissipation shell 2, so that the welding or sintering material 7 is stored in each groove 5;

[0050] If the end face of the heat dissipation column 3 or telescopic head 4 is a sawtooth face, the welding or sintering material 7 only needs to be stored between any two adjacent sawteeth;

[0051] S2: Fix the power module 6;

[0052] S21: If single-sided cooling is adopted, the bottom of the power module 6 is fixed and sealed to the top of the single-sided heat dissipation shell 1 by welding or sintering, so as to close the opening of the heat dissipation cavity 11;

[0053] S22: If double-sided cooling is adopted, the power module 6 is placed into the heat dissipation inner cavity 22 and the inner wall of each partition plate 25 is attached to the left or right outer wall of the power module 6, and then the two covers 21 are spliced and sealed by welding or sintering;

[0054] S3: The end of each heat dissipation column 3 or telescopic head 4 is fixed to the bottom of the power module 6 to realize heat conduction connection;

[0055] S31: If single-sided cooling is adopted, the end of each heat dissipation column 3 or telescopic head 4 is tightly pressed against the bottom of the power module 6, and then the welding or sintering material 7 at the end of each heat dissipation column 3 or telescopic head 4 is solidified using a matching welding or sintering device, so that the end of each heat dissipation column 3 or telescopic head 4 is fixed to the bottom of the power module 6.

[0056] S32: If double-sided cooling is adopted, the end of each heat dissipation column 3 or telescopic head 4 is tightly pressed against the top or bottom of the power module 6, and then the welding or sintering material 7 at the end of each heat dissipation column 3 or telescopic head 4 is solidified using a matching welding or sintering device, so that the end of each heat dissipation column 3 or telescopic head 4 is fixed to the top or bottom of the power module 6.

[0057] Cooling principle:

[0058] If single-sided cooling is used, the heat generated by the power module 6 is transferred to each heat dissipation column 3, cooling water is introduced into any one interface 12 to enter the heat dissipation cavity 11 through the water pipe 24, and then the heat on each heat dissipation column 3 is taken away, and finally the cooling water is discharged outward through another interface 12 to realize circulating heat dissipation; if double-sided cooling is used, the heat generated by the power module 6 is also transferred to each heat dissipation column 3, cooling water is introduced into any one water pipe 24 to enter the corresponding flow guide chamber 26 through the water pipe 24, and then the cooling water is divided into two streams and flows to the upper and lower sides of the power module 6, respectively, and then the heat on each heat dissipation column 3 is taken away, and finally the cooling water is introduced into another flow guide chamber 26 to be combined and discharged outward through another water pipe 24 to realize circulating heat dissipation.

[0059] Embodiment 1:

[0060] As shown in Figure 9 , a plurality of single-sided heat dissipation shells 1 are arranged in sequence, and then the two interfaces 12 near each other on two adjacent single-sided heat dissipation shells 1 are connected in series, so that a cooling water circulation system can be shared.

[0061] Embodiment 2:

[0062] As shown in Figure 10 , if the number of heat dissipation column units on the top wall or the bottom wall of the heat dissipation inner cavity 22 is one, a plurality of double-sided heat dissipation shells 2 are arranged in sequence, and then the two water pipes 24 near each other on two adjacent double-sided heat dissipation shells 2 are connected in series, so that a cooling water circulation system can be shared.

[0063] Embodiment 3:

[0064] As shown in Figure 11 , if the number of heat dissipation column units on the top wall or the bottom wall of the heat dissipation inner cavity 22 is greater than one, only one double-sided heat dissipation shell 2 is needed, and each power module 6 is arranged between any two adjacent partition plates 25 inside the double-sided heat dissipation shell 2, so that a cooling water circulation system can be shared by a plurality of power modules 6.

[0065] The application does not need to weld the power module 6 on the bottom plate with pin fins, but integrates the pin fin structure into the inside of the single-side heat dissipation shell 1 or the double-side heat dissipation shell 2, and directly seals and fixes the power module 6 on the top of the single-side heat dissipation shell 1 or the inside of the double-side heat dissipation shell 2, so as to save the sealing by the O-ring, save the material and reduce the cost, reduce the packaging steps between the power module 6 and the radiator and simplify the operation; and the multiple single-side heat dissipation shells 1 or double-side heat dissipation shells 2 can be simply and conveniently connected in series according to the number of the power module 6, so as to solve the poor universality; in addition, the height tolerance between the power modules 6 can be completely eliminated by using the telescopic head 4, so as to greatly reduce the installation difficulty and effectively ensure the heat dissipation and sealing effect.

[0066] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that it can still modify the technical solutions recorded in the foregoing examples, or replace some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat sink for a semiconductor power module, comprising a single-sided or double-sided heat sink, characterized in that, The top of the single-sided heat dissipation shell is provided with a heat dissipation cavity, and the side of the single-sided heat dissipation shell has two interfaces that are arranged diagonally to each other and are connected to the heat dissipation cavity. Both interfaces are connected to the heat dissipation cavity by a water pipe. The double-sided heat dissipation shell includes two symmetrically arranged covers that are sealed and fixed to each other. The interiors of the two covers are joined together to form a heat dissipation cavity. At the opening edge of each cover, two diagonally arranged grooves are formed outward. The openings of the two grooves on the upper cover are sealed and fixed to the openings of the two grooves on the lower cover to form two water pipes that are connected to the heat dissipation cavity. Several heat dissipation column units are also formed on the bottom wall of the heat dissipation cavity or the top and bottom walls of the heat dissipation inner cavity, and the heat dissipation column unit includes multiple heat dissipation columns. The number of heat dissipation column units located on the bottom wall of the heat dissipation cavity is 1; The number of heat dissipation column units located on the top wall of the heat dissipation cavity is equal to the number of heat dissipation column units located on the bottom wall of the heat dissipation cavity, and each is at least one. At least one of the heat dissipation column units located on the top or bottom wall of the heat dissipation cavity is arranged sequentially from left to right; The end face shape of the heat dissipation column is a plane, a cone, a frustum, or a serrated surface; The end of the heat dissipation column is also fitted with a telescopic head that can move up and down and has an elastic recovery function; The end face shape of the telescopic head is a plane, a cone, a frustum, or a serrated surface; The end of the heat dissipation column or the telescopic head, which has a flat, conical, or frustum-shaped end face, is further provided with at least one groove, which is used to store welding or sintering materials.

2. The heat sink for a semiconductor power module according to claim 1, characterized in that, At least two partition plates are formed between the inner walls of the front and rear sides of the cover for attaching to the outer wall of the left or right side of the power module. The number of partition plates is coordinated with the number of heat dissipation column units on the top or bottom wall of the heat dissipation cavity so that there are two partition plates above or below any heat dissipation column unit.

3. The heat sink for a semiconductor power module according to claim 2, characterized in that, The lower edge of each partition plate inside the upper cover is sealed and fixed to the upper edge of the corresponding partition plate inside the lower cover.

4. The heat sink for a semiconductor power module according to claim 3, characterized in that, A flow guide chamber is formed between the two partition plates located on the far left of the heat dissipation cavity and the left inner wall of the heat dissipation cavity, and between the two partition plates located on the far right of the heat dissipation cavity and the right inner wall of the heat dissipation cavity. The two water pipes are respectively connected to the two flow guide chambers.

Images