Sensor circuit board assembly device and operation method thereof

Abstract

The present invention discloses a sensor circuit board assembly device and an operation method thereof, which belongs to the technical field of circuit board assembly, and comprises a workbench, a tray loading assembly located in front of the workbench, a dividing plate installed on the workbench, and a workpiece placement station, a bending station, a glue dispensing station, a bonding station, an edge card loading station, a detection station and a blanking station are arranged on the dividing plate; a detection assembly 1 corresponding to the workpiece placement station and installed on the workbench, a bending assembly corresponding to the bending station and installed on the workbench, a glue dispensing assembly corresponding to the glue dispensing station and installed on the workbench, a bonding assembly corresponding to the bonding station and installed on the workbench, a detection assembly 2 corresponding to the detection station and installed on the workbench, and a blanking assembly corresponding to the blanking station and installed on the workbench. The device can realize the full automation process of assembling chips, ceramic sheets and edge cards into circuit boards.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board assembly, and in particular relates to a sensor circuit board assembly device and an operation method thereof. Background Art

[0002] Currently, the circuit boards in automotive sensors generally include chips, ceramic sheets and side cards. Glue is manually dispensed on the ceramic sheets, and then the chip is glued to the ceramic sheets. Finally, the side cards are used to clamp the chip and the ceramic sheets to form a circuit board. The outer shell is then manually installed.

[0003] Since the circuit boards in automotive sensors are small in size, it is not convenient for machines to assemble the circuit boards. They are generally assembled manually, which requires a lot of manpower and cannot guarantee the accuracy of the assembly. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a sensor circuit board assembly device and an operating method thereof.

[0005] The present invention provides the following technical solutions:

[0006] A sensor circuit board assembly device comprises a workbench, a tray loading assembly located in front of the workbench, a dividing plate installed on the workbench, the dividing plate being provided with a workpiece placement station, a bending station, a gluing station, a laminating station, an edge card loading station, an inspection station and a blanking station; a detection assembly 1 corresponding to the workpiece placement station and installed on the workbench, a bending assembly corresponding to the bending station and installed on the workbench, a gluing assembly corresponding to the gluing station and installed on the workbench, a laminating assembly corresponding to the laminating station and installed on the workbench, a detection assembly 2 corresponding to the detection station and installed on the workbench, and a blanking assembly corresponding to the blanking station and installed on the workbench.

[0007] Specifically, each workstation is installed on the base one, the mounting platform is elastically installed on the base one through a guide column and a composite spring, and an anti-collision ring is installed at the bottom of the guide column.

[0008] Specifically, the detection component includes an outer cover, a grating is installed on the inner wall of the outer cover, and a through hole is provided on the top of the outer cover, the through hole is located directly above the loading station, and the aperture is directly above the through hole. The aperture is installed on a bracket, and a camera is installed on the bracket, and the camera is located directly above the aperture.

[0009] Specifically, the bending assembly includes a bending base, a cylinder 1 is installed on the bending base through a mounting seat, a lower pressure seat is installed on the cylinder 1, and both ends of the lower pressure seat are movably installed on the bending base through linear guide rails, a pressure block 1 is installed on the front side of the lower pressure seat, and pressure pins are installed on both sides of the pressure block. At the same time, the pressure block is installed on the bottom of the lower pressure seat through a spring, and the bending block is installed on the lower pressure seat through the pressure block.

[0010] Specifically, the glue dispensing component includes a pillar, and the glue dispensing machine is installed on the pillar through a three-axis module, and a recycling box is also installed on the pillar.

[0011] Specifically, the bonding assembly includes a bonding seat, a lifting cylinder installed on support one, cylinder two installed on the lifting cylinder, cylinder two passes through the bonding seat, a suction cup is installed on cylinder two, the suction cup is located directly above the bonding station, camera four is installed on the top of the bonding seat, and light sources are symmetrically installed on both sides of the bonding seat.

[0012] Specifically, the detection component 2 includes a support 2, and a camera 2 and a camera 3 are symmetrically installed at both ends of the support 2.

[0013] Specifically, the unloading component includes support three, the mounting block is movably mounted on support three through motor two, and slide cylinders are installed on the sides of the mounting block, clamping cylinder two is installed on the slide cylinder, and the guide plate is placed on one side of the mounting block through support three, and the guide plate guides the workpiece to the NG box; at the same time, the sensor is placed directly above the unloading station through support two.

[0014] Specifically, the pallet loading assembly includes a frame, a transport rail passing through the frame, photoelectric sensors located on both sides of the transport rail and installed on the frame, the loading platform is located in the frame, the mounting plate is movably mounted on the loading platform through a three-axis module 2, the rotating plate is movably mounted on the mounting plate through a motor 1, a rotating cylinder is installed at the end of the rotating plate, a fixed plate is installed on the rotating cylinder, and a clamping cylinder 1 is installed at both ends of the fixed plate.

[0015] Based on the above device, the present invention also proposes an operating method using the above sensor circuit board assembly device, comprising the following steps:

[0016] S1, with n known process flows and m different types of workpieces, the indexing plate is divided into n equal parts, and there are m×n workstations on the indexing plate;

[0017] S2, at the loading station, workers place the chips and ceramic sheets on the two ends of the tooling, and the tray loading assembly transfers the tray to the corresponding position;

[0018] S3, at the bending station, the chip is bent by a bending assembly;

[0019] S4, at the glue dispensing station, the glue dispensing component dispenses epoxy glue onto the ceramic sheet;

[0020] S5, at the bonding station, the bonding component moves the bent chip onto the epoxy glue of the ceramic sheet;

[0021] S6, at the edge card loading station, manually clamp the edge card on the bonded ceramic sheet to clamp the ceramic sheet and the chip;

[0022] S7, at the inspection station, the inspection component 2 inspects whether the chip and the edge card are in place;

[0023] S8, if the position is wrong, when arriving at the unloading station, the unloading component will transfer the workpiece to the NG position. If the position is correct, the unloading component will transfer the workpiece to the pallet.

[0024] The beneficial effects of the present invention are:

[0025] This device can realize the fully automated process of assembling chips, ceramic sheets and edge cards into circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 is a three-dimensional diagram of the present invention;

[0028] Figure 2 It is a schematic diagram of the structure of the present invention;

[0029] Figure 3 is a three-dimensional diagram of the circuit board of the present invention;

[0030] Figure 4 is a three-dimensional diagram of the detection component 1 in the present invention;

[0031] Figure 5 It is a schematic diagram of the structure of the tooling in the present invention;

[0032] Figure 6 is a positional relationship diagram of the mounting platform and the base 1 in the present invention;

[0033] Figure 7 is a three-dimensional diagram of the bending assembly of the present invention;

[0034] Figure 8 It is a structural schematic diagram of the bending assembly in the present invention;

[0035] Fig. 9 is a three-dimensional diagram of the dispensing assembly of the present invention;

[0036] Fig.10 is a three-dimensional diagram of the bonding component of the present invention;

[0037] Fig.11 is a three-dimensional diagram of the detection component 2 in the present invention;

[0038] Fig.12 is a three-dimensional diagram of the blanking assembly in the present invention;

[0039] Fig.13is a three-dimensional diagram of the tray loading assembly of the present invention;

[0040] Fig.14 It is a schematic diagram of the internal structure of the tray loading assembly in the present invention;

[0041] Fig.15 is a three-dimensional diagram of the side card discharge assembly in the second embodiment of the present invention;

[0042] Fig.16 is a three-dimensional diagram of the adjustment component in the second embodiment of the present invention;

[0043] Fig.17 is a three-dimensional diagram of the cutting component in the second embodiment of the present invention;

[0044] Fig.18 It is a three-dimensional diagram of the clamping assembly in the second embodiment of the present invention.

[0045] The following are marked in the figure: 1. Tray loading assembly; 2. Mounting table; 3. Indexing plate; 4. Detection assembly 1; 5. Bending assembly; 6. Glue dispensing assembly; 7. Laminating assembly; 8. Detection assembly 2; 9. Unloading assembly; 10. Workbench; 11. Chip; 12. Ceramic sheet; 13. Side card; 14. Tooling; 15. Base 1; 16. Guide column; 17. Anti-collision ring; 18. Side card unloading assembly; 19. Reset spring; 20. Bending groove;

[0046] 101, transport rail; 102, photoelectric sensor; 103, frame; 104, loading platform; 105, three-axis module 2; 106, mounting plate; 107, motor 1; 108, rotating plate; 109, rotating cylinder; 110, fixed plate; 111, gripper cylinder 1;

[0047] 401, outer cover; 402, bracket 1; 403, camera 1; 404, aperture; 405, grating;

[0048] 501, bending base; 502, mounting seat; 503, cylinder 1; 504, lower pressure seat; 505, linear guide; 506, pressure block 1; 507, pressure pin 1; 508, bending block; 509, pressure block; 510, spring;

[0049] 601, glue dispenser; 602, pillar; 603, three-axis module 1; 604, recycling box;

[0050] 701, fitting seat; 702, support seat 1; 703, cylinder 2; 704, suction cup; 705, light source; 706, camera 4;

[0051] 801, support 2; 802, camera 2; 803, camera 3;

[0052] 901, support three; 902, support two; 903, sensor; 904, motor two; 905, mounting block; 906, gripper cylinder two; 907, guide plate; 908, support three; 909, NG box;

[0053] 1801, discharging roll; 1802, adjusting assembly; 1803, cutting assembly; 1804, pressing assembly;

[0054] 18021, motor three; 18022, bottom plate; 18023, left track; 18024, right track; 18025, rotating wheel; 18026, cover plate; 18027, limit block; 18028, back plate; 18029, guide nail;

[0055] 18031, base two; 18032, guide shaft; 18033, limit step; 18034, cylinder three; 18035, bracket three; 18036, top cover; 18037, support column; 18038, moving block; 18039, step; 180310, roller; 180311, rear track; 180312, receiving seat; 180313, linear guide; 180314, cutting block; 180315, positioning block;

[0056] 18041. Bracket four; 18042. Cylinder four; 18043. Connecting plate; 18044. Pressing pin two; 18045. Pressing block two; 18046. Limiting block; 18047. Limiting groove. DETAILED DESCRIPTION

[0057] like Figure 3 As shown, the circuit board in the current automobile sensor generally includes a chip 11, a ceramic sheet 12 and a side card 13. Glue is manually dispensed on the ceramic sheet 12, and then the chip 11 is correspondingly glued to the ceramic sheet 12. Finally, the side card 13 is correspondingly clamped between the chip 11 and the ceramic sheet 12 to form a circuit board, and the shell is subsequently installed manually.

[0058] Embodiment 1

[0059] like Figure 1 and 2As shown, the present invention provides a sensor circuit board assembly device, including a workbench 10, a tray loading component 1 located in front of the workbench 10, a dividing plate 3 installed on the workbench 10, and the dividing plate 3 is provided with a workpiece placement station, a bending station, a gluing station, a bonding station, an edge card loading station, an inspection station and a blanking station; a detection component 1 4 corresponding to the workpiece placement station and installed on the workbench 10, a bending component 5 corresponding to the bending station and installed on the workbench 10, a gluing component 6 corresponding to the gluing station and installed on the workbench 10, a bonding component 7 corresponding to the bonding station and installed on the workbench 10, a detection component 2 8 corresponding to the detection station and installed on the workbench 10, and a blanking component 9 corresponding to the blanking station and installed on the workbench.

[0060] Please focus on Figure 5 and Figure 6 Each workstation is installed on a base 15, and the mounting table 2 is elastically installed on the base 15 through a guide column 16 and a composite spring 19. An anti-collision ring 17 is installed at the bottom of the guide column 16. The anti-collision ring 17 is to prevent the guide column 16 from directly colliding with the workbench 10 when the mounting table moves downward, thereby affecting the workpiece on the mounting table 2; wherein the tooling 14 is installed on the mounting table 2, and a bending groove 20 is provided on the tooling 14.

[0061] The dividing plate 3 uses a dividing plate with n equal parts. This device is suitable for m workpieces of different types. Therefore, m×n workstations can be set on the dividing plate 3, and the workstations of different types are staggered. When the assembly of one type of workpiece is completed, the next workstation is aligned with the initial workstation to directly start the assembly of another type of workpiece, so that the operation can quickly switch the assembly work of different types of workpieces.

[0062] Please focus on Figure 2 and Figure 5 First, a worker places the chip 11 and the ceramic sheet 12 at the two ends of the tooling 14 respectively, and then the bending component 5 bends the chip 11, and then the glue dispensing component 6 dispenses epoxy glue on the ceramic sheet 12, and then the bonding component 7 moves the bent chip 11 to the epoxy glue of the ceramic sheet 12, so that the chip 11 is fixed on the ceramic sheet 12, and then the side card 13 is manually clamped on the bonded ceramic sheet 12, so as to clamp the ceramic sheet 12 and the chip 11, and finally arrives at the inspection station, and the inspection component 8 detects whether the chip 11 and the side card 13 are in place; if the position is wrong, when it arrives at the unloading station, the unloading component 9 transfers the workpiece to the NG position, and if the position is correct, the unloading component 9 transfers the workpiece to the pallet, and at this time the pallet loading component 1 has transferred the pallet to the corresponding position.

[0063] Please focus on Figure 4The detection component 4 includes an outer cover 401, and a grating 405 is installed on the inner wall of the outer cover 401 for sensing whether the worker's hand is inserted into the loading station. A through hole is provided at the top of the outer cover 401, and the through hole is located directly above the loading station. At the same time, an aperture 404 is directly above the through hole. The aperture 404 is installed on a bracket 402, and a camera 403 is installed on the bracket 402, and the camera 403 is located directly above the aperture 404.

[0064] At the beginning of assembly, the worker places the chip 11 and the ceramic sheet 12 on the tooling 14. At this time, the grating 405 senses the worker, and then the camera 403 takes pictures of the positions of the chip 11 and the ceramic sheet 12 to detect whether their positions are accurate. After the worker retracts his hand, the grating 405 can sense again, transmit the signal, turn on the dividing plate 3, and send the workpiece to the next station.

[0065] Please focus on Figure 7 and 8 The bending assembly 5 includes a bending base 501, a cylinder 503 is installed on the bending base 501 through a mounting base 502, a lower pressure seat 504 is installed on the cylinder 503, and both ends of the lower pressure seat 504 are movably installed on the bending base 501 through linear guide rails 505, a pressure block 506 is installed on the front side of the lower pressure seat 504, and pressure pins 507 are installed on both sides of the pressure block 506, and the pressure pins 507 are used to resist the mounting platform 2, and at the same time, a pressure block 509 is installed on the bottom of the lower pressure seat 504 through a spring 510, and the spring 510 is used to prevent the pressure block 509 from damaging the chip 11 when it resists the chip 11, and a bending block 508 is installed on the lower pressure seat 506 through the pressure block 509, and the bending block 508 is used to bend the chip 11.

[0066] When cylinder 1 503 is turned on, cylinder 1 503 drives the lower pressure seat 504 to move downward, and the pressing block 509 presses against the chip 11. At the same time, the bending block 508 is located at the bending groove 20 and presses against the chip 11. Then the spring 510 and the return spring 19 are compressed, and the pressure pin 1 507 presses against the mounting table 2. At the same time, the bending block 508 bends the chip 11 along the bending groove 20.

[0067] Please focus on Fig. 9 The dispensing assembly 6 includes a pillar 602 , and the dispensing machine 601 is installed on the pillar 602 through a three-axis module 603 , and a recovery box 604 is also installed on the pillar 602 .

[0068] When the indexing plate 3 with the workpiece rotates to the glue dispensing station, the glue dispensing machine 601 applies glue to the ceramic sheet 12 on the tooling.

[0069] Please focus on 10. The bonding component 7 includes a bonding seat 701. The lifting cylinder is installed on the support 1 702. The cylinder 2 703 is installed on the lifting cylinder. The cylinder 2 703 passes through the bonding seat 701. A suction cup 704 is installed on the cylinder 2 703. The suction cup 704 is located directly above the bonding station. A camera 4 706 is installed on the top of the bonding seat 701, and light sources 705 are symmetrically installed on both sides of the bonding seat 701. The light source 705 is used to illuminate the workpiece, so that the camera 4 706 can shoot the state of the workpiece.

[0070] When the dividing plate 3 rotates with the workpiece to the bonding station, the suction cup 704 is first driven by the lifting cylinder to suck the workpiece, and then the cylinder 2 703 is turned on to drive the chip 11 to move to the gluing position of the ceramic sheet 12. Then the camera 4 706 takes a picture of the workpiece to verify whether the position of the chip 11 is aligned with the ceramic sheet 12.

[0071] Then the dividing plate 3 rotates with the workpiece to the side card loading station, and the side card 13 is manually clamped to the ceramic sheet 12 and the chip 11, and the bottom of the side card 13 needs to correspond to the sensing position of the bottom of the ceramic sheet 12 one by one.

[0072] Please focus on Fig.11 The detection component 2 8 includes a support 2 801 , and a camera 2 802 and a camera 3 803 are symmetrically installed at both ends of the support 2 801 .

[0073] When the dividing plate 3 rotates with the workpiece to the inspection station, camera 2 802 photographs the upper surface of the workpiece to detect whether the edge card 13, chip 11 and ceramic sheet 12 are aligned, and camera 3 803 photographs whether the bottom of the edge card 13 is aligned one by one with the sensing position of the bottom of the ceramic sheet 12.

[0074] Please focus on Fig.12 The unloading component 9 includes a support three 901, a mounting block 905 is movably mounted on the support three 901 through a motor two 904, and a slide cylinder is mounted on the side of the mounting block 905, a clamping cylinder two 906 is mounted on the slide cylinder, and a guide plate 907 is placed on one side of the mounting block 905 through a support three 908, and the guide plate 907 guides the workpiece to the NG box 909; at the same time, a sensor 903 is placed directly above the unloading station through a support two 902, and the sensor 903 is used to detect whether there is a workpiece in the tooling 14. If not, the dividing plate 3 can be directly rotated to the next process to save time.

[0075] After the workpiece passes through the inspection station, if it is judged to be unqualified, the clamping cylinder 906 clamps the workpiece, and the motor 904 drives the clamping cylinder 906 to rotate 90 degrees and place it on the NG box 909; if it is judged to be qualified, the motor 904 drives the clamping cylinder 906 to rotate 180 degrees and place it on the pallet.

[0076] Please focus on Fig.13 and Fig.14 The pallet loading assembly 1 includes a frame 103, a transport rail 101 passing through the frame 103, and photoelectric sensors 102 located on both sides of the transport rail 101 and installed on the frame 103. Since the transport rail 101 will transport pallets of different models, but the heights of pallets of different models are different, the photoelectric sensor 102 is used to detect the required model of pallet. The loading platform 104 is located in the frame 103, and the mounting plate 106 is movably mounted on the loading platform 104 through the three-axis module 105. The rotating plate 108 is movably mounted on the mounting plate 106 through the motor 107. A rotating cylinder 109 is installed at the end of the rotating plate 108, and a fixed plate 110 is installed on the rotating cylinder 109. The two ends of the fixed plate 110 are installed with a clamping cylinder 111.

[0077] Since the pallet will enter a high-temperature dryer before being sent into the process, in order to avoid burning the staff, the pallet is fed in using the pallet loading component 1. When the photoelectric sensor 102 detects the pallet, the motor 107 rotates the rotating plate 108 to send the clamping cylinder 111 to the top of the transport cabinet 101, and then the three-axis module 2 105 controls the clamping cylinder 111 to move to the top of the pallet. The clamping cylinder 111 clamps the pallet and then transfers it to the conveyor belt to feed the pallet. The unloading component 9 transfers the workpiece to the pallet.

[0078] The dividing plate 3, camera 1 403, grating 405, aperture 404, cylinder 1 503, dispensing machine 601, three-axis module 1 603, camera 4 706, cylinder 2 703, lifting cylinder, light source 705, suction cup 704, camera 2 802, camera 3 803, motor 2 904, gripper cylinder 2 906, sensor 903, transport rail 101, photoelectric sensor 102, motor 1 107, three-axis module 2 105, gripper cylinder 1 111 and rotating cylinder 109 are communicatively coupled to the control panel.

[0079] The control panel contains a PLC controller, which can program the numerical control system. The PLC is used as the central control system, and the touch screen is used to realize the program input and operation control of the whole machine, so as to realize the full automation of the transportation process. The control system can be used as a system that connects various actuators to move according to the logical trajectory, and the actuators can be controlled by programming to run according to the required operation steps.

[0080] Based on the above device, the first embodiment of the present invention further proposes an operating method using the above sensor circuit board assembly device, comprising the following steps:

[0081] Step 1: According to the known n process flows and m workpieces of different models, the indexing plate 3 is selected as an n-equally divided indexing plate, and m×n workstations are arranged on the indexing plate 3;

[0082] Step 2: At the loading station, a worker places the chip 11 and the ceramic sheet 12 on the two ends of the tooling 14 respectively, and the tray loading assembly 1 transfers the tray to the corresponding position;

[0083] Step 3: At the bending station, the chip 11 is bent by the bending assembly 5;

[0084] Step 4: At the glue dispensing station, the glue dispensing component 6 dispenses epoxy glue onto the ceramic sheet 12;

[0085] Step 5: At the bonding station, the bonding component 7 moves the bent chip 11 onto the epoxy adhesive of the ceramic sheet 12;

[0086] Step 6: At the edge card loading station, manually clamp the edge card 13 on the bonded ceramic sheet 12 to clamp the ceramic sheet 12 and the chip 11;

[0087] Step 7: At the inspection station, the inspection component 2 8 inspects whether the chip 11 and the edge card 13 are in place;

[0088] Step eight, if the position is wrong, when arriving at the unloading station, the unloading component 9 transfers the workpiece to the NG position; if the position is correct, the unloading component 9 transfers the workpiece to the pallet.

[0089] The device can realize a fully automated process of assembling the chip 11, the ceramic sheet 12 and the edge card 13 into a circuit board.

[0090] Embodiment 2

[0091] like Fig.15 As shown, the sensor circuit board assembly device disclosed in the second embodiment includes an edge card discharge assembly 18, and other devices and their installation positions and usage methods are the same as those of the first embodiment.

[0092] The edge card discharging assembly 18 includes a discharging reel 1801, an adjustment assembly 1802, and a cutting assembly 1803 which are arranged in sequence, and a clamping assembly 1804 located above the edge card discharging station. The edge card is discharged from the discharging reel 1801 and fed into the adjustment assembly 1802. The adjustment assembly 1802 drives the edge card to continue to move forward to the cutting assembly 1803. The cutting assembly 1803 cuts the lower edge card 13 and feeds it onto the workpiece to clamp the chip 11 and the ceramic sheet 12.

[0093] Please focus on Fig.16The adjustment component 1802 includes a base plate 18022, a rotating wheel 18025 is movably mounted on the base plate 18022 through a motor three 18021, and a left track 18023 and a right track 18024 are respectively arranged on both sides of the rotating wheel 18025, and a back plate 18028 is mounted on the base plate 18022, a limit block 18027 is mounted on the back plate 18028, and a cover plate 18026 is installed on both the left track 18023 and the right track 18024, the limit block 18027 and the cover plate 18026 are used to limit the movement of the side card 13; wherein a plurality of guide nails 18029 are evenly arranged on the rotating wheel 18025 around the axis of the rotating wheel 18025, and the guide nails 18029 are used to guide the movement of the side card 13 and correct the position of the side card 13 at the same time.

[0094] The side card 13 is fed into the right track 18024 by the discharge roll 1801. When the side card 13 reaches the rotating wheel 18025, the guide pin 18029 hooks the hole on the side card 13. At the same time, the rotating wheel 18025 rotates, and the guide pin 18029 drives the side card 13 to move forward. At the same time, the subsequent holes of the side card 13 are hooked on the subsequent guide pins 18029, thereby guiding and correcting the position of the side card 13 to avoid the side card 13 from being skewed. Then, the rotating wheel 18025 feeds the side card 13 into the left track 18023.

[0095] Please focus on Fig.17 The cutting assembly 1803 includes a bracket 3 18035, a base 2 18031 mounted on the bracket 3 18035, a top cover 18036 movably mounted on the base 2 18031 through a guide shaft 18032 in cooperation with a cylinder 3 18034, a limiting step 18033 is provided on the guide shaft 18032, and the limiting step 18033 is used to limit the moving range of the top cover 18036, and support columns 18037 are symmetrically installed in the top cover 18036, and both ends of the moving block 18038 are placed on the steps 18039 of the support columns 18037 through rollers 180310, and a cutting block 180314 is installed on the moving block 18038, and a linear guide rail 1803 is installed in the base 2 18031. 13. A receiving seat 180312 is installed on the linear guide 180313, and a rear track 180311 is installed on the base 2 18031. The end face of the receiving seat 180312 is lower than the end face of the rear track 180311. The rear track 180311 is used to receive the side card 13 sent from the left track 18023, and a positioning block 180315 is provided just above one end of the rear track 180311 close to the cutting block 180314. The positioning block 180315 is installed on the moving block 18038. The bottom surface of the cutting block 180314 is lower than the bottom surface of the positioning block 180315. At the same time, a cylinder five is installed on the rear of the base 2 18031, and the cylinder five is used to push the moving block 18038.

[0096] The side card 13 in the left track 18023 enters the rear track 180311. When the side card 13 moves to the receiving seat 180312, the cylinder three 18034 is turned on. Under the action of gravity, the positioning block 180315 presses the side card 13 on one side to limit the movement of the side card 13 on one side. At the same time, the cutting block 180314 cuts the side card 13 on the other side. This device avoids the side card 13 being damaged by the direct force of the cylinder three 18034. By adjusting the weight of the moving block 18038, the side card 13 can be cut while avoiding damage.

[0097] At this time, the moving block 18038 falls on the linear guide rail 180313, and the cutting block 180314 cooperates with the receiving seat 180312 to clamp the cut side card 13, and then the cylinder five is turned on. The cylinder five pushes the moving block 18038, and the moving block 18038 moves along the step 18039 through the roller 180310, driving the side card 13 to move forward. This device converts the moving friction into rolling friction, which not only reduces wear, but also makes the movement of the moving block 18038 very light and flexible.

[0098] Please focus on Fig.18 The clamping assembly 1804 includes a bracket 18041, a connecting plate 18043 is movably mounted on the bracket 18041 through a cylinder 18042, a pressing pin 18044, a pressing block 18045 and a limiting block 18046 are installed on the connecting plate 18043, and a limiting groove 18047 is provided on the limiting block 18046.

[0099] When cylinder four 18042 is turned on, pressure pin two 18044 presses against tooling 14, and pressure block two 18045 presses against the workpiece. After cylinder five is turned on, cylinder five sends the edge card 13 clamped by the cutting block 180314 and the receiving seat 180312 onto the workpiece along the limiting groove 18047 to ensure that the edge card 13 clamps the chip 11 and the ceramic sheet 12.

[0100] Dividing plate 3, camera 1 403, grating 405, aperture 404, cylinder 1 503, dispensing machine 601, three-axis module 1 603, camera 4 706, cylinder 2 703, lifting cylinder, light source 705, suction cup 704, camera 2 802, camera 3 803, motor 2 904, gripper cylinder 2 906, sensor 903, transport rail 101, photoelectric sensor 102, motor 1 107, three-axis module 2 105, gripper cylinder 1 111, rotating cylinder 109, motor 3 18021, cylinder 3 18034, cylinder 5 and cylinder 4 18042 are communicatively coupled to the control panel.

[0101] Based on the above device, the second embodiment of the present invention further proposes an operation method using the above sensor circuit board assembly device, including the following steps:

[0102] Step 1: According to the known n process flows and m workpieces of different models, the indexing plate 3 is selected as an n-equally divided indexing plate, and m×n workstations are arranged on the indexing plate 3;

[0103] Step 2: At the loading station, a worker places the chip 11 and the ceramic sheet 12 on the two ends of the tooling 14 respectively, and the tray loading assembly 1 transfers the tray to the corresponding position;

[0104] Step 3: At the bending station, the chip 11 is bent by the bending assembly 5;

[0105] Step 4: At the glue dispensing station, the glue dispensing component 6 dispenses epoxy glue onto the ceramic sheet 12;

[0106] Step 5: At the bonding station, the bonding component 7 moves the bent chip 11 onto the epoxy adhesive of the ceramic sheet 12;

[0107] Step 6: At the edge card loading station, the edge card is unloaded from the unloading roll 1801 and fed into the adjustment assembly 1802. The adjustment assembly 1802 drives the edge card to continue to move forward to the cutting assembly 1803. The cutting assembly 1803 cuts the lower edge card 13 and feeds it onto the workpiece to clamp the chip 11 and the ceramic sheet 12.

[0108] Step 7: At the inspection station, the inspection component 2 8 inspects whether the chip 11 and the edge card 13 are in place;

[0109] Step eight, if the position is wrong, when arriving at the unloading station, the unloading component 9 transfers the workpiece to the NG position; if the position is correct, the unloading component 9 transfers the workpiece to the pallet.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A sensor circuit board assembly device, characterized in that: It includes a workbench, a tray loading assembly located in front of the workbench, a dividing plate installed on the workbench, on which a workpiece placing station, a bending station, a gluing station, a laminating station, an edge card loading station, an inspection station and a material unloading station are arranged; a detection assembly 1 corresponding to the workpiece placing station and installed on the workbench, a bending assembly corresponding to the bending station and installed on the workbench, a gluing assembly corresponding to the gluing station and installed on the workbench, a laminating assembly corresponding to the laminating station and installed on the workbench, a detection assembly 2 corresponding to the detection station and installed on the workbench, and a material unloading assembly corresponding to the material unloading station and installed on the workbench; The bonding component can verify whether the chip position is aligned with the ceramic sheet. Then, at the edge card loading station, the edge card is manually clamped on the bonded ceramic sheet to clamp the ceramic sheet and the chip. Then, the detection component 2 detects whether the edge card, chip and ceramic sheet are aligned, and at the same time, it photographs whether the bottom of the edge card is aligned with the sensing position at the bottom of the ceramic sheet.

2. A sensor circuit board assembly device according to claim 1, characterized in that: Each workstation is installed on the base one, and the mounting platform is elastically installed on the base one through a guide column and a composite spring, and an anti-collision ring is installed at the bottom of the guide column.

3. A sensor circuit board assembly device according to claim 1, characterized in that: The detection component 1 includes an outer cover, a grating is installed on the inner wall of the outer cover, and a through hole is provided on the top of the outer cover, the through hole is located directly above the loading station, and the aperture is directly above the through hole. The aperture is installed on a bracket 1, and a camera 1 is installed on the bracket 1, and the camera 1 is located directly above the aperture.

4. A sensor circuit board assembly device according to claim 1, characterized in that: The bending assembly includes a bending base, a cylinder 1 is installed on the bending base through a mounting seat, a lower pressure seat is installed on the cylinder 1, and both ends of the lower pressure seat are movably installed on the bending base through linear guide rails, a pressure block 1 is installed on the front side of the lower pressure seat, and pressure nails are installed on both sides of the pressure block. At the same time, the pressure block is installed on the bottom of the lower pressure seat through a spring, and the bending block is installed on the lower pressure seat through the pressure block.

5. The sensor circuit board assembly device according to claim 1, characterized in that: The dispensing assembly comprises a pillar, a dispensing machine is mounted on the pillar through a three-axis module, and a recovery box is also mounted on the pillar.

6. The sensor circuit board assembly device according to claim 1, characterized in that: The bonding component includes a bonding seat, a lifting cylinder installed on support one, cylinder two installed on the lifting cylinder, cylinder two passes through the bonding seat, a suction cup is installed on cylinder two, the suction cup is located directly above the bonding station, camera four is installed on the top of the bonding seat, and light sources are symmetrically installed on both sides of the bonding seat.

7. A sensor circuit board assembly device according to claim 1, characterized in that: The detection component 2 includes a support 2, and cameras 2 and 3 are symmetrically installed at both ends of the support 2.

8. The sensor circuit board assembly device according to claim 1, characterized in that: The unloading assembly includes support three, the mounting block is movably mounted on support three through motor two, and slide cylinders are installed on the sides of the mounting block, clamping cylinder two is installed on the slide cylinder, and the guide plate is placed on one side of the mounting block through support three, and the guide plate guides the workpiece to the NG box; at the same time, the sensor is placed directly above the unloading station through support two.

9. The sensor circuit board assembly device according to claim 1, characterized in that: The pallet loading assembly includes a frame, a transport rail passing through the frame, photoelectric sensors located on both sides of the transport rail and installed on the frame, a loading platform located in the frame, a mounting plate movably mounted on the loading platform through a three-axis module 2, a rotating plate movably mounted on the mounting plate through a motor 1, a rotating cylinder installed at the end of the rotating plate, a fixed plate installed on the rotating cylinder, and a clamping cylinder 1 installed at both ends of the fixed plate.

10. An operating method using a sensor circuit board assembly device as claimed in claim 1, characterized in that: The following steps are involved: S1, with n known process flows and m different types of workpieces, the indexing plate is divided into n equal parts, and there are m×n workstations on the indexing plate; S2, at the loading station, workers place the chips and ceramic sheets on the two ends of the tooling, and the tray loading assembly transfers the tray to the corresponding position; S3, at the bending station, the chip is bent by a bending assembly; S4, at the glue dispensing station, the glue dispensing component dispenses epoxy glue onto the ceramic sheet; S5, at the bonding station, the bonding component moves the bent chip onto the epoxy glue of the ceramic sheet; S6, at the edge card loading station, manually clamp the edge card on the bonded ceramic sheet to clamp the ceramic sheet and the chip; S7, at the inspection station, the inspection component 2 inspects whether the chip and the edge card are in place; S8, if the position is wrong, when arriving at the unloading station, the unloading component will transfer the workpiece to the NG position. If the position is correct, the unloading component will transfer the workpiece to the pallet.

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