A high color gamut Mini LED light-emitting element and a manufacturing method thereof, and a display device

Abstract

The present application provides a high color gamut Mini LED light-emitting element and a preparation method and a display device thereof. The high color gamut Mini LED light-emitting element includes an LED chip and a color conversion film. The color conversion film is arranged on the light-emitting side of the LED chip. The color conversion film includes a heat dissipation substrate and a color conversion layer arranged on the side of the heat dissipation substrate away from the LED chip; wherein the color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit passes through the color conversion layer. In the high color gamut Mini LED light-emitting element provided by the present application, the color conversion layer can improve the color rendering ability of the high color gamut Mini LED light-emitting element and improve its color gamut, and the slit that passes through the color conversion layer and is arranged on the heat dissipation substrate can improve the heat dissipation ability of the color conversion layer, thereby improving the reliability of the high color gamut Mini LED light-emitting element.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and specifically to a high color gamut Mini LED light-emitting element and a method for preparing the same. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. It has been widely used in lighting, display, medical treatment, optical communication and other fields due to its advantages of low energy consumption, small size, long life, good stability, fast response and stable wavelength. Taking the display field as an example, in many scenarios such as office and entertainment, users will use medium and large-sized display devices to carry out activities such as watching movies, e-sports, video editing, image processing, etc., which have high requirements on the color expression of the display device. At present, liquid crystal display devices are still the mainstream of medium and large-sized display devices.

[0003] The liquid crystal display device generally includes two parts: a backlight module and a liquid crystal display panel. The LED light board in the backlight module is used to generate basic light for display. The basic light is processed by the light-homogenizing component in the backlight source and becomes a uniform surface light source to be emitted into the liquid crystal display panel. The liquid crystal display panel includes an array substrate, a liquid crystal layer and a color film substrate. The basic light emitted by the LED light board is sequentially emitted from the liquid crystal display panel through the light-homogenizing component, the array substrate, the liquid crystal layer and the color film substrate and is perceived by the user. Specifically, the emitted light of the LED light-emitting element in the LED light board is white light. The array substrate can control the deflection of the liquid crystal molecules in each sub-pixel unit area, so that the white light in a specific sub-pixel unit area can be transmitted to the color film substrate in the corresponding sub-pixel unit area. After the white light is filtered by the color filter in the color film substrate, each sub-pixel unit area can emit only red, green and blue monochromatic light in a fixed wavelength range in the white light, thereby realizing color display. That is, the spectrum of the white light emitted by the LED light-emitting element plays a key role in the color performance of the display device. When the monochromatic spectral purity of the white light emitted by the LED light-emitting element is low and the color gamut performance is poor, it will directly affect the color performance of the monochromatic output light of each sub-pixel unit area, thereby affecting the overall color performance of the liquid crystal display device and reducing its market competitiveness.

[0004] In the related art, the color gamut can be improved by using a blue LED chip + quantum dot color conversion layer. However, the applicant found that since the quantum dot color conversion layer is sensitive to temperature, heat will inevitably be generated during the light emission of the blue LED chip, which will cause the temperature of the quantum dot color conversion layer to rise, resulting in the problem of color conversion layer failure, affecting the reliability of the LED light-emitting element. Therefore, how to improve the heat dissipation capacity of the color conversion layer while achieving a high color gamut, thereby improving the reliability of the LED light-emitting element, is a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0005] The present application provides a high color gamut Mini LED light-emitting element and a preparation method and a display device, which can effectively solve the problem of poor reliability of the LED light-emitting element due to insufficient heat dissipation capacity of the color conversion layer for improving the color gamut of the LED light-emitting element in the related art.

[0006] In a first aspect, the present application provides a high color gamut Mini LED light-emitting element and a method for preparing the same. The high color gamut Mini LED light-emitting element comprises:

[0007] LED chips;

[0008] A color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film comprises a heat dissipation substrate and a color conversion layer arranged on a side of the heat dissipation substrate away from the LED chip;

[0009] The color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit penetrates the color conversion layer.

[0010] Optionally, each of the color conversion units includes a plurality of color conversion parts and a hollow part, and the plurality of color conversion parts are arranged around the hollow part, wherein each of the color conversion parts includes a chamfer, and in any two adjacent color conversion parts, the two chamfers are arranged adjacent to each other.

[0011] Optionally, the orthographic projection pattern of the color conversion portion on the heat dissipation substrate is a quasi-square with a chamfer, wherein, in the quasi-square, the length of the side connected to the chamfer is a, and the length of the side not connected to the chamfer is b, wherein 0<a≤b / 2.

[0012] Optionally, the high color gamut Mini LED light-emitting element further includes reflective white wall glue, and the reflective white wall glue covers the side wall of the LED chip and the side wall of the color conversion film.

[0013] Optionally, the color conversion film further includes an inorganic packaging layer, and the color conversion film further includes an inorganic packaging layer, and the inorganic packaging layer covers the side wall of the heat dissipation substrate and the side wall of the color conversion layer.

[0014] Optionally, the reflective white wall adhesive includes a first groove and a second groove, the LED chip is located in the first groove, and the color conversion film is located in the second groove, wherein the side wall of the first groove is located on the outside of the side wall of the second groove, and the side wall of the inorganic encapsulation layer is located on the outside of the side wall of the LED chip.

[0015] Optionally, the inorganic encapsulation layer includes a first part and a second part, the first part is arranged around the periphery of the heat dissipation substrate and the color conversion layer, and the second part is arranged on the side of the color conversion layer away from the heat dissipation substrate, wherein the second part covers each of the color conversion units and fills the slit, and the inorganic encapsulation layer is doped with thermal conductive particles.

[0016] Optionally, the high color gamut Mini LED light-emitting element further includes: a protective film, wherein the protective film is arranged on a side of the color conversion film away from the LED chip, and the protective film covers the color conversion film and the reflective white wall glue.

[0017] Optionally, the high color gamut Mini LED light-emitting element further includes:

[0018] A carrier board, on which the LED chip is arranged;

[0019] The lens is arranged on the carrier board, and the lens has a cavity, and the LED chip and the color conversion film are arranged in the cavity.

[0020] In a second aspect, the present application provides a method for preparing a high color gamut Mini LED light-emitting element, the method for preparing a high color gamut Mini LED light-emitting element comprising the following steps:

[0021] preparing a color conversion film;

[0022] The color conversion film is arranged on the light emitting surface of the LED chip;

[0023] The step of preparing the color conversion film comprises:

[0024] Providing a heat dissipation substrate;

[0025] forming a color conversion layer on the heat dissipation substrate;

[0026] forming a patterned photoresist layer on the color conversion layer;

[0027] Using the photoresist layer as a mask, patterning the color conversion layer to form a color conversion film;

[0028] The color conversion film includes the heat dissipation substrate and the color conversion layer, the color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit penetrates the color conversion layer.

[0029] In a third aspect, the present application provides a display device, the display device comprising:

[0030] Backlight module, including LED light board;

[0031] A liquid crystal display panel is arranged on the light-emitting side of the backlight module, and the liquid crystal display panel comprises an array substrate, a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is located between the array substrate and the color filter substrate;

[0032] Wherein, the LED light board includes any one of the high color gamut Mini LED light-emitting elements described above.

[0033] Beneficial effects of this application:

[0034] The present application provides a high color gamut Mini LED light-emitting element, a preparation method thereof, and a display device. The high color gamut Mini LED light-emitting element includes an LED chip and a color conversion film. The color conversion film is arranged on the light-emitting side of the LED chip. The color conversion film includes a heat dissipation substrate and a color conversion layer arranged on the side of the heat dissipation substrate away from the LED chip; wherein the color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit passes through the color conversion layer. The present application improves the heat dissipation efficiency of the color conversion layer by disposing the color conversion layer on a heat dissipation substrate, and creatively adopts a patterned color conversion layer to separate the multiple color conversion units in the color conversion layer that perform color conversion functions, thereby increasing the heat dissipation area, increasing the number of heat dissipation channels, and improving the problem of failure of color conversion particles in the local color conversion layer caused by heat accumulation. In addition, since a slit is provided between any two adjacent color conversion units, and the slit passes through the color conversion layer in its extension direction, an effective heat dissipation channel can be formed, so that the heat on the color conversion unit can be transferred to the outside laterally along the slit, thereby achieving the purpose of rapid heat dissipation of the color conversion layer and improving the reliability of the high color gamut Mini LED light-emitting element. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0036] Figure 1 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 1 of the present application.

[0037] Figure 2 This is a schematic top view of the color conversion film provided in Example 1 of the present application.

[0038] Figure 3 A schematic flow chart of a method for preparing a high color gamut Mini LED light-emitting element provided in some embodiments of the present application.

[0039] Figure 4 A schematic diagram of the preparation process of the color conversion film provided in some embodiments of the present application.

[0040] Figure 5 A schematic cross-sectional view of a display device provided in some embodiments of the present application.

[0041] Figure 6 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 2 of the present application.

[0042] Figure 7 This is a schematic top view of the color conversion film provided in Example 2 of the present application.

[0043] Figure 8 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 3 of the present application.

[0044] Fig. 9 This is a schematic top view of the color conversion film provided in Example 3 of the present application.

[0045] Fig.10 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 4 of the present application.

[0046] Fig.11 This is a schematic top view of the color conversion film provided in Example 4 of the present application.

[0047] Fig.12 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 5 of the present application.

[0048] Fig.13 This is a schematic top view of the color conversion film provided in Example 5 of the present application.

[0049] Fig.14 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 6 of the present application.

[0050] Fig.15 This is a schematic top view of the color conversion film provided in Example 6 of the present application.

[0051] Fig.16 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 7 of the present application.

[0052] Fig.17 This is a schematic top view of the color conversion film provided in Example 7 of the present application.

[0053] Fig.18 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 8 of the present application.

[0054] Fig.19 This is a schematic top view of the color conversion film provided in Example 8 of the present application.

[0055] Description of reference numerals:

[0056] LED chip 10; color conversion film 20; heat dissipation substrate 21; color conversion layer 22; color conversion unit 221; color conversion part 2211; hollow part 2212; slit 222; bonding improvement layer 23; inorganic encapsulation layer 24; first part 241; second part 242; adhesive layer 30; carrier board 40; lens 50; cavity 51; reflective white wall glue 60; first groove 61; second groove 62; protective film 70; first inorganic film 71; second inorganic film 72; high color gamut Mini LED light-emitting element 100; lamp board 200; backlight module 300; liquid crystal display panel 400; array substrate 500; color filter substrate 600; liquid crystal layer 700; chamfer C1. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0058] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0059] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0061] Embodiment 1

[0062] Figure 1 This is a cross-sectional schematic diagram of the high color gamut Mini LED light-emitting element provided in Example 1 of the present application. Figure 2 This is a top view schematic diagram of the color conversion film provided in Example 1 of the present application. Figure 1 and Figure 2 As shown, in the first aspect, embodiment 1 of the present application provides a high color gamut Mini LED light-emitting element 100, wherein the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0063] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the LED chip 10 is a blue light LED chip, and the color conversion layer 22 in the color conversion film 20 can realize the color conversion function to convert part of the blue light emitted by the blue light LED chip into light of other wavelengths, and after mixing with the blue light, form high color gamut white light, and emit it, thereby achieving the purpose of improving the color gamut. On this basis, in view of the problem that the blue light LED chip will inevitably generate heat during the light emission process, which will lead to an increase in the temperature of the color conversion layer 22 and an increase in the risk of failure of the color conversion layer 22, the present application improves the heat dissipation efficiency of the color conversion layer 22 by setting the color conversion layer 22 on the heat dissipation substrate 21, and creatively adopts a patterned color conversion layer 22 to separate the multiple color conversion units 221 in the color conversion layer 22 that have a color conversion function, so as to increase the heat dissipation area, increase the heat dissipation channels, and improve the problem of failure of color conversion particles in the local color conversion layer 22 caused by heat accumulation. In addition, since a slit 222 is provided between any two adjacent color conversion units 221, and the slit 222 penetrates the color conversion layer 22 in its extension direction, an effective heat dissipation channel can be formed, so that the heat on the color conversion unit 221 can be transferred to the outside laterally along the slit 222, thereby achieving the purpose of rapid heat dissipation of the color conversion layer 22, and improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0064] It should be noted that the applicant has discovered in internal research that the color conversion particles in the color conversion layer 22 have energy loss in the color conversion process, which leads to self-heating, which will also cause the temperature of the color conversion layer 22 to rise, thereby inducing the problem of failure of the color conversion layer 22. Since a slit 222 is provided between any two adjacent color conversion units 221, and the slit 222 penetrates the color conversion layer 22 in its extension direction, an effective heat dissipation channel can be formed, so that the heat generated by each color conversion unit 221 itself can be transferred to the outside laterally along the slit 222, thereby achieving the purpose of rapid heat dissipation of the color conversion layer 22 and improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0065] In some embodiments of the present application, the LED chip in the high color gamut Mini LED light-emitting element 100 is a MiniLED chip, and the size of the Mini LED chip is between 100 microns and 300 microns.

[0066] In some embodiments of the present application, each of the color conversion units 221 includes a plurality of color conversion parts 2211 and a hollow part 2212, and the plurality of color conversion parts 2211 are arranged around the hollow part 2212, wherein each of the color conversion parts 2211 includes a chamfer C1, and, in any two adjacent color conversion parts 2211, the two chamfers C1 are arranged adjacent to each other.

[0067] Reference Figure 2 As shown, in the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the color conversion unit 221 has a patterned design, and the patterned color conversion unit 221 includes a plurality of color conversion parts 2211 arranged at intervals from each other, thereby increasing the heat dissipation area of ​​the color conversion unit 221, increasing the heat dissipation channels, further improving the heat dissipation capacity of the color conversion layer 22, and improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0068] In addition, since each of the color conversion portions 2211 includes a chamfer C1, and in any two adjacent color conversion portions 2211, the two chamfers C1 are arranged adjacent to each other, the design area of ​​the hollow portion 2212 surrounded by the plurality of color conversion portions 2211 can be increased, so that more blue light can be emitted from the hollow portion 2212 in the central area of ​​the color conversion unit 221 with almost no thermal effect, which can improve the light type of the output light of the color conversion layer 22, improve the uniformity of the light intensity distribution, reduce the self-heating effect, and improve reliability.

[0069] In some embodiments of the present application, the orthographic projection figure of the color conversion unit 2211 on the heat dissipation substrate 21 is a quasi-square with a chamfer C1, wherein, in the quasi-square, the length of the side connected to the chamfer C1 is a, and the length of the side not connected to the chamfer C1 is b, wherein 0<a≤b / 2.

[0070] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the present application designs the orthographic projection pattern of the color conversion portion 2211 on the heat dissipation substrate 21 and controls the size of the chamfer C1 to adjust the wavelength distribution of the light emitted through the color conversion portion 2211, thereby adjusting the color temperature and improving the optical effect of the high color gamut Mini LED light-emitting element 100. Since in the quasi-square, the side length of the side connected to the chamfer C1 is a, the side length of the side not connected to the chamfer C1 is b, and 0<a≤b / 2, it is possible to avoid the problem of too high an overall proportion of blue light and abnormal color temperature of mixed white light due to the excessively large chamfer C1 area.

[0071] In some embodiments of the present application, the chamfer angle of the chamfer C1 is 45°, and the length of the chamfer C1 is 1 / 2 of the side length of a square.

[0072] In some embodiments of the present application, in the color conversion layer 22, each of the color conversion parts 2211 is provided with color conversion particles, and the color conversion particles may include quantum dots and / or fluorescent powder.

[0073] In some embodiments of the present application, the color conversion particles include red quantum dots and green quantum dots, or red fluoride phosphor and green quantum dots.

[0074] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the color gamut can be effectively improved by adopting red and green quantum dots, or red fluoride phosphor and green quantum dots, and the problem that the red quantum dots, green quantum dots, and red fluoride phosphor are sensitive to temperature and easily fail due to high temperature can be effectively improved by adopting the structural design of the patterned color conversion layer 22.

[0075] In some embodiments of the present application, the material of the heat dissipation substrate 21 includes sapphire and / or an organic film, and the organic film may be polyimide or polyethylene terephthalate.

[0076] In some embodiments of the present application, the high color gamut Mini LED light-emitting element 100 further includes a bonding layer 30 , and the bonding layer 30 is disposed between the LED chip 10 and the color conversion film 20 .

[0077] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the present application bonds and fixes the LED chip 10 and the color conversion film 20 by providing a bonding layer 30 between the LED chip 10 and the color conversion film 20 .

[0078] In some embodiments of the present application, the bonding layer 30 includes a substrate and heat-insulating particles doped in the substrate, wherein the thermal conductivity of the heat-insulating particles is less than the thermal conductivity of the substrate. For example, the substrate may be UV-curable glue.

[0079] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the present application can reduce the thermal effect of the LED chip 10 on the color conversion layer 22 by doping the isolation particles in the substrate, thereby further improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0080] In some embodiments of the present application, the packaging form of the high color gamut Mini LED light-emitting element 100 is chip scale packaging (full name in English: Chip Scale Package, abbreviated as: CSP) or near chip scale packaging (full name in English: Near Chip Scale Package, abbreviated as: NCSP).

[0081] In some embodiments of the present application, the high color gamut Mini LED light-emitting element 100 further includes a carrier board 40 , wherein the LED chip 10 is disposed on the carrier board 40 .

[0082] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the LED chip 10 is electrically connected to the carrier 40, and the carrier 40 is made of a high thermal conductivity material to improve the heat dissipation efficiency of the LED chip 10. Exemplarily, the carrier 40 is a ceramic carrier 40, and the ceramic carrier 40 includes a ceramic substrate and an electrical connection layer arranged on both sides of the ceramic substrate, the ceramic substrate has a through hole, and the electrical connection layers on both sides of the ceramic substrate are electrically connected to each other through the through hole, the electrical connection layer on one side of the ceramic substrate is welded and fixed to the LED chip 10, and the electrical connection layer on the other side of the ceramic substrate is electrically connected to an external driving element, such as a driving circuit board and a driving IC.

[0083] In some embodiments of the present application, the high color gamut Mini LED light-emitting element 100 further includes a lens 50 , wherein the lens 50 is disposed on the carrier 40 , the lens 50 has a cavity 51 , and the LED chip 10 and the color conversion film 20 are disposed in the cavity 51 .

[0084] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the lens 50 is arranged on the carrier 40, and the lens 50 can adjust the light emission angle of the high color gamut Mini LED light-emitting element 100 so that the high color gamut Mini LED light-emitting element 100 can be adapted to different types of products.

[0085] In some embodiments of the present application, the substrate of the lens 50 can be glass or sealant. The sealant can be prepared by dispensing and molding processes to well cover the LED chip 10 and the color conversion film 20, thereby improving the sealing of the cavity 51, and further improving the water-proof oxygen intrusion capability of the high color gamut Mini LED light-emitting element 100.

[0086] In some embodiments of the present application, the lens 50 further includes thermally conductive particles doped into the sealant to enhance the thermal conductivity of the lens 50 .

[0087] In a second aspect, Embodiment 1 of the present application provides a method for preparing a high color gamut Mini LED light-emitting element. Figure 3 A schematic diagram of a process for preparing a high color gamut Mini LED light-emitting element provided in some embodiments of the present application; Figure 4 A schematic diagram of the preparation process of the color conversion film provided in some embodiments of the present application. Figures 1 to 4 As shown, the method for preparing the high color gamut MiniLED light-emitting element 100 includes step S10 and step S20. Step S10 includes: preparing a color conversion film 20; step S20 includes: setting the color conversion film 20 on the light-emitting surface of the LED chip 10. Wherein, in step S10, the step of preparing and forming the color conversion film 20 includes step S11, step S12, step S13 and step S14, wherein step S11 includes: providing a heat dissipation substrate 21; step S12 includes: forming a color conversion layer 22 on the heat dissipation substrate 21; step S13 includes: forming a patterned photoresist layer on the color conversion layer 22; step S14 includes: using the photoresist layer as a mask, patterning the color conversion layer 22 to form the color conversion film 20; wherein the color conversion film 20 includes the heat dissipation substrate 21 and the color conversion layer 22, the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0088] In the method for preparing the high color gamut Mini LED light-emitting element 100 provided in the first embodiment of the present application, the present application prepares a color conversion layer 22 on a heat dissipation substrate 21, and through patterning design of the color conversion layer 22, a color conversion film 20 with excellent heat dissipation capability is formed, thereby improving the reliability of the high color gamut Mini LED light-emitting element 100. In addition, the present application introduces a photoresist layer and utilizes a photolithography process to prepare a color conversion unit 221 with high precision, thereby being able to improve the heat dissipation capability and reliability while taking into account the color conversion capability of the color conversion unit 221, thereby ensuring the light output effect of the high color gamut Mini LED light-emitting element 100.

[0089] In some embodiments of the present application, in step S20, the step of setting the color conversion film 20 on the light emitting surface of the LED chip 10 includes: coating an adhesive layer 30 on the light emitting surface of the LED chip 10; setting the heat dissipation substrate 21 in the color conversion film 20 on the surface of the adhesive layer 30 on the side away from the LED chip 10; and subjecting the adhesive layer 30 to UV irradiation to cure the adhesive layer 30 and connect the LED chip 10 and the color conversion film 20.

[0090] Figure 5 This is a cross-sectional schematic diagram of a display device provided in some embodiments of the present application. Figure 5 As shown, in the third aspect, embodiment 1 of the present application also provides a display device, wherein the display device includes a backlight module 300 and a liquid crystal display panel 400, wherein the backlight module 300 includes an LED light board 200, and the liquid crystal display panel 400 is arranged on the light emitting side of the backlight module 300, and the liquid crystal display panel 400 includes an array substrate 500, a color film substrate 600 and a liquid crystal layer 700, and the liquid crystal layer 700 is located between the array substrate 500 and the color film substrate 600; wherein the LED light board 200 includes the high color gamut Mini LED light-emitting element 100 described in any one of the above items.

[0091] Embodiment 2

[0092] Embodiment 2 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Figure 6 A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Example 2 of the present application; Figure 7 This is a top view schematic diagram of the color conversion film provided in Example 2 of the present application. Figure 6 and Figure 7 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0093] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 2 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 1 of the present application, and Example 2 of the present application will not repeat the same parts.

[0094] In some embodiments of the present application, the high color gamut Mini LED light-emitting element 100 further includes a reflective white wall glue 60 , and the reflective white wall glue 60 covers the side wall of the LED chip 10 and the side wall of the color conversion film 20 .

[0095] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the reflective white wall glue 60 can reflect light, so the blue light emitted through the side wall of the LED chip 10 can be emitted from the light-emitting surface of the LED chip 10 after being reflected by the reflective white wall glue 60, thereby improving the edge blue light leakage problem. In addition, the light emitted through the side wall of the color conversion film 20 can be emitted from the light-emitting surface of the color conversion film 20 after being reflected by the reflective white wall glue 60, thereby improving the light efficiency of the high color gamut Mini LED light-emitting element 100.

[0096] In some embodiments of the present application, the edge of the heat dissipation substrate 21 is located outside the edge of the color conversion layer 22 to form a micro-step at the junction of the edge of the heat dissipation substrate 21 and the edge of the color conversion layer 22, so that the reflective white wall glue 60 can better adhere to the side wall of the color conversion layer 22.

[0097] Embodiment 3

[0098] Embodiment 3 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Figure 8 A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Example 3 of the present application; Fig. 9 This is a top view schematic diagram of the color conversion film provided in Example 3 of the present application. Figure 8 and Fig. 9 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0099] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 3 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 2 of the present application, and Example 3 of the present application will not repeat the same parts.

[0100] In some embodiments of the present application, the color conversion film 20 includes a heat dissipation substrate 21, a color conversion layer 22, and a bonding improvement layer 23 arranged between the heat dissipation substrate 21 and the color conversion layer 22, wherein the heat dissipation substrate 21 is a sapphire substrate, the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0101] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, since the heat dissipation substrate 21 is a sapphire substrate with strong heat dissipation capacity, it is beneficial to improve the heat dissipation capacity of the color conversion film 20, reduce the failure risk of the color conversion layer 22, and improve the reliability of the high color gamut Mini LED light-emitting element 100. However, the applicant found in internal research that when the patterned color conversion layer 22 is directly prepared on the sapphire substrate, due to the small volume of the color conversion part 2211 in the color conversion unit 221 in the color conversion layer 22, it is easy to cause quality problems due to insufficient bonding with the sapphire substrate, affecting the optical effect and reliability of the high color gamut Mini LED light-emitting element 100. Therefore, the present application adds a bonding improvement layer 23 between the color conversion layer 22 and the heat dissipation substrate 21 to improve the film formation stability of the patterned structure in the color conversion layer 22, thereby improving the optical effect and reliability of the high color gamut Mini LED light-emitting element 100.

[0102] In some embodiments of the present application, the bonding force improving layer 23 covers the heat dissipation substrate 21 .

[0103] In some embodiments of the present application, the bonding improving layer 23 includes silicon oxide.

[0104] Embodiment 4

[0105] Embodiment 4 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Fig.10 A schematic cross-sectional view of a high color gamut Mini LED light-emitting element provided in Embodiment 4 of the present application; Fig.11 This is a top view schematic diagram of the color conversion film provided in Example 4 of the present application. Fig.10 and Fig.11As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0106] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in the fourth embodiment of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in the third embodiment of the present application, and the fourth embodiment of the present application will not repeat the same parts.

[0107] In some embodiments of the present application, the color conversion film 20 includes a heat dissipation substrate 21, a color conversion layer 22, and a bonding improvement layer 23 arranged between the heat dissipation substrate 21 and the color conversion layer 22, wherein the color conversion film 20 also includes an inorganic packaging layer 24, and the inorganic packaging layer 24 covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22.

[0108] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the inorganic encapsulation layer 24 covering the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22 can further improve the ability of the color conversion film 20 to resist water and oxygen intrusion, thereby further improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0109] In some embodiments of the present application, the inorganic encapsulation layer 24 can be formed by chemical vapor deposition or atomic layer deposition after the patterning process of the color conversion layer 22. The inorganic encapsulation layer 24 can avoid direct contact between the reflective white wall glue 60 and the color conversion layer 22, thereby reducing the quality requirements for the reflective white wall glue 60 and improving the problem of failure of the color conversion layer 22 caused by the poor quality of the reflective white wall glue 60.

[0110] Embodiment 5

[0111] Embodiment 5 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Fig.12 A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Example 5 of the present application; Fig.13 This is a top view schematic diagram of the color conversion film provided in Example 5 of the present application. Fig.12 and Fig.13 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0112] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 5 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 4 of the present application, and Example 4 of the present application will not repeat the same parts.

[0113] In some embodiments of the present application, the color conversion film 20 also includes an inorganic packaging layer 24, the inorganic packaging layer 24 covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22, wherein the reflective white wall glue 60 includes a first groove 61 and a second groove 62, the LED chip 10 is located in the first groove 61, and the color conversion film 20 is located in the second groove 62, wherein the side wall of the first groove 61 is located on the outside of the side wall of the second groove 62, and the side wall of the inorganic packaging layer 24 is located on the outside of the side wall of the LED chip 10.

[0114] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the present application sets a first groove 61 and a second groove 62 of different sizes, so that the space in the thickness direction of the reflective white wall glue 60 can be used to set the inorganic encapsulation layer 24. Compared with the fourth embodiment, the area of ​​the color conversion film 20 can be increased, thereby improving the color conversion efficiency and increasing the effective light output area of ​​the high color gamut Mini LED light-emitting element 100.

[0115] In some embodiments of the present application, the orthographic projection of the inorganic package on the carrier 40 does not overlap with the orthographic projection of the LED chip 10 on the carrier 40 .

[0116] Embodiment 6

[0117] Embodiment 6 of the present application provides a high color gamut Mini LED light-emitting element, a preparation method thereof, and a display device. Fig.14A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Example 6 of the present application; Fig.15 This is a top view schematic diagram of the color conversion film provided in Example 6 of the present application. Fig.14 and Fig.15 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0118] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 6 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 5 of the present application, and Example 4 of the present application will not repeat the same parts.

[0119] In some embodiments of the present application, the color conversion film 20 also includes an inorganic encapsulation layer 24, which covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22, wherein each of the color conversion units 221 includes a plurality of color conversion parts 2211 and a hollow part 2212, and the plurality of color conversion parts 2211 are arranged around the hollow part 2212, and the inorganic encapsulation layer 24 also fills the slit 222 and the hollow part 2212.

[0120] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, since the inorganic encapsulation layer 24 not only covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22, but also fills the slit 222 and the hollow portion 2212, the ability of the color conversion film 20 to resist water and oxygen intrusion can be further improved, thereby further improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0121] Embodiment 7

[0122] Embodiment 7 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Fig.16 A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Embodiment 7 of the present application; Fig.17 This is a top view schematic diagram of the color conversion film 20 provided in the seventh embodiment of the present application. Fig.16and Fig.17 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0123] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 7 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 6 of the present application, and Example 4 of the present application will not repeat the same parts.

[0124] In some embodiments of the present application, the color conversion film 20 also includes an inorganic packaging layer 24, which covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22, wherein the inorganic packaging layer 24 includes a first part 241 and a second part 242, wherein the first part 241 is arranged around the periphery of the heat dissipation substrate 21 and the color conversion layer 22, and the second part 242 is arranged on the side of the color conversion layer 22 away from the heat dissipation substrate 21, wherein the second part 242 covers each of the color conversion units 221 and fills the slit 222, and the inorganic packaging layer 24 is doped with thermal conductive particles (not shown in the figure).

[0125] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, since the first part 241 in the inorganic encapsulation layer 24 is arranged around the periphery of the heat dissipation substrate 21 and the color conversion layer 22, the second part 242 covers each of the color conversion units 221 and fills the slit 222, thereby being able to better protect the color conversion layer 22 and enhance the ability of the color conversion film 20 to resist water and oxygen intrusion, thereby further enhancing the reliability of the high color gamut Mini LED light-emitting element 100.

[0126] In addition, since the inorganic packaging layer 24 is doped with thermally conductive particles, the thermal conductivity of the inorganic packaging layer 24 can be improved, so that the heat in the color conversion unit 221 can be quickly transferred to the high color gamut Mini LED light-emitting element 100 through the inorganic packaging layer 24 in the slit 222, thereby reducing the risk of failure of the color conversion layer 22 due to overheating and improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0127] In some embodiments of the present application, each of the color conversion units 221 includes multiple color conversion parts 2211 and a hollow part 2212, the multiple color conversion parts 2211 are arranged around the hollow part 2212, and the second part 242 in the inorganic encapsulation layer 24 fills the slit 222 and the hollow part 2212.

[0128] Embodiment 8

[0129] Embodiment 8 of the present application provides a high color gamut Mini LED light-emitting element, a method for preparing the same, and a display device. Fig.18 A cross-sectional schematic diagram of a high color gamut Mini LED light-emitting element provided in Example 8 of the present application; Fig.19 This is a top view schematic diagram of the color conversion film provided in Example 8 of the present application. Fig.18 and Fig.19 As shown, the high color gamut Mini LED light-emitting element 100 includes an LED chip 10 and a color conversion film 20, wherein the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, and the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a plurality of color conversion units 221 arranged in an array, and a slit 222 arranged between any two adjacent color conversion units 221, and in the extension direction of the slit 222, the slit 222 penetrates the color conversion layer 22.

[0130] It should be noted that the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 8 of the present application are similar to the structure / process of the high color gamut Mini LED light-emitting element 100 and its preparation method, and the display device provided in Example 3 of the present application, and Example 8 of the present application will not repeat the same parts.

[0131] In some embodiments of the present application, the high color gamut Mini LED light-emitting element 100 further includes a protective film 70 , which is disposed on a side of the color conversion film 20 away from the LED chip 10 , and covers the color conversion film 20 and the reflective white wall glue 60 .

[0132] In the high color gamut Mini LED light-emitting element 100 provided in the embodiment of the present application, the present application improves the sealing effect of the color conversion film 20 by setting a protective film 70 on the side of the color conversion film 20 away from the LED chip 10, thereby improving the reliability of the high color gamut Mini LED light-emitting element 100.

[0133] In some embodiments of the present application, the protective film 70 may include a first inorganic film 71 and a second inorganic film 72 that are alternately arranged, and the refractive indexes of the first inorganic film 71 and the second inorganic film 72 are different, so as to improve the sealing effect of the color conversion film 20 while improving the light extraction efficiency of the high color gamut Mini LED light-emitting element 100.

[0134] In some embodiments of the present application, the material of one of the first inorganic film 71 and the second inorganic film 72 may be aluminum oxide, and the material of the other of the first inorganic film and the second inorganic film 72 may be titanium oxide. The first inorganic film 71 and the second inorganic film 72 may be formed by atomic layer deposition or molecular layer deposition.

[0135] In summary, the present application provides a high color gamut Mini LED light-emitting element and a preparation method and a display device thereof. The high color gamut Mini LED light-emitting element includes an LED chip and a color conversion film, wherein the color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film includes a heat dissipation substrate and a color conversion layer arranged on the side of the heat dissipation substrate away from the LED chip; wherein the color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit passes through the color conversion layer. The present application improves the heat dissipation efficiency of the color conversion layer by disposing the color conversion layer on a heat dissipation substrate, and creatively adopts a patterned color conversion layer to separate the multiple color conversion units in the color conversion layer that perform color conversion functions, thereby increasing the heat dissipation area, increasing the number of heat dissipation channels, and improving the problem of failure of color conversion particles in the local color conversion layer caused by heat accumulation. In addition, since a slit is provided between any two adjacent color conversion units, and the slit passes through the color conversion layer in its extension direction, an effective heat dissipation channel can be formed, so that the heat on the color conversion unit can be transferred to the outside laterally along the slit, thereby achieving the purpose of rapid heat dissipation of the color conversion layer and improving the reliability of the high color gamut Mini LED light-emitting element.

[0136] The above is a detailed introduction to a high color gamut Mini LED light-emitting element and its preparation method and display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A high color gamut Mini LED light-emitting element, characterized in that: The high color gamut Mini LED light-emitting element comprises: LED chips; A color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film comprises a heat dissipation substrate and a color conversion layer arranged on a side of the heat dissipation substrate away from the LED chip; The color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit penetrates the color conversion layer; Each of the color conversion units includes a plurality of color conversion parts and a hollow part, and the plurality of color conversion parts are arranged around the hollow part, wherein each of the color conversion parts includes a chamfer, and in any two adjacent color conversion parts, the two chamfers are arranged adjacent to each other; Wherein, each of the color conversion parts is provided with color conversion particles, and the color conversion particles include red quantum dots and green quantum dots, or red fluoride phosphor and green quantum dots.

2. The high color gamut Mini LED light-emitting element according to claim 1, characterized in that: The orthographic projection pattern of the color conversion portion on the heat dissipation substrate is a quasi-square with a chamfer, wherein in the quasi-square, the side length of the side connected to the chamfer is a, and the side length of the side not connected to the chamfer is b, wherein 0<a≤b / 2.

3. The high color gamut Mini LED light-emitting element according to claim 1, characterized in that: The high color gamut Mini LED light-emitting element also includes reflective white wall glue, and the reflective white wall glue covers the side wall of the LED chip and the side wall of the color conversion film.

4. The high color gamut Mini LED light-emitting element according to claim 3, characterized in that: The color conversion film further includes an inorganic packaging layer, and the inorganic packaging layer covers the side wall of the heat dissipation substrate and the side wall of the color conversion layer.

5. The high color gamut Mini LED light-emitting element according to claim 4, characterized in that: The reflective white wall glue includes a first groove and a second groove, the LED chip is located in the first groove, and the color conversion film is located in the second groove, wherein the side wall of the first groove is located on the outside of the side wall of the second groove, and the side wall of the inorganic encapsulation layer is located on the outside of the side wall of the LED chip.

6. The high color gamut Mini LED light-emitting element according to claim 4, characterized in that: The inorganic encapsulation layer includes a first part and a second part, the first part is arranged around the periphery of the heat dissipation substrate and the color conversion layer, and the second part is arranged on the side of the color conversion layer away from the heat dissipation substrate, wherein the second part covers each of the color conversion units and fills the slit, and the inorganic encapsulation layer is doped with thermal conductive particles.

7. The high color gamut Mini LED light-emitting element according to claim 3, characterized in that: The high color gamut Mini LED light-emitting element further includes: a protective film, which is arranged on a side of the color conversion film away from the LED chip, and the protective film covers the color conversion film and the reflective white wall glue.

8. A method for preparing a high color gamut Mini LED light-emitting element, characterized in that: The method for preparing the high color gamut Mini LED light-emitting element comprises the following steps: preparing a color conversion film; The color conversion film is arranged on the light emitting surface of the LED chip; The step of preparing the color conversion film comprises: Providing a heat dissipation substrate; forming a color conversion layer on the heat dissipation substrate; forming a patterned photoresist layer on the color conversion layer; Using the photoresist layer as a mask, patterning the color conversion layer to form a color conversion film; The color conversion film includes the heat dissipation substrate and the color conversion layer, the color conversion layer includes a plurality of color conversion units arranged in an array, and a slit arranged between any two adjacent color conversion units, and in the extension direction of the slit, the slit penetrates the color conversion layer; Each of the color conversion units includes a plurality of color conversion parts and a hollow part, and the plurality of color conversion parts are arranged around the hollow part, wherein each of the color conversion parts includes a chamfer, and in any two adjacent color conversion parts, the two chamfers are arranged adjacent to each other; Wherein, each of the color conversion parts is provided with color conversion particles, and the color conversion particles include red quantum dots and green quantum dots, or red fluoride phosphor and green quantum dots.

9. A display device, characterized in that: The display device comprises: Backlight module, including LED light board; A liquid crystal display panel is arranged on the light-emitting side of the backlight module, and the liquid crystal display panel comprises an array substrate, a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is located between the array substrate and the color filter substrate; Wherein, the LED light board includes the high color gamut Mini LED light-emitting element as described in any one of claims 1 to 7.

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