Preparation technology of flat switch for exploding foil initiation system

Abstract

The present invention discloses a preparation process for a planar switch of an exploding foil initiation system, comprising the following steps: punching a substrate; filling the holes with slurry: filling the conductive holes of the punched raw porcelain tape with tungsten-manganese conductive slurry; conductor printing: using gap screen printing technology to print the tungsten-manganese conductive slurry on the corresponding substrate layer according to the designed pattern to form a conductive layer; lamination molding; scribing and high-temperature sintering; surface treatment; gas sealing: sealing the planar switch workpiece to be packaged with a cover plate using gold-tin solder under a specific atmosphere; and interface surface treatment. The present invention uses high-temperature sintering technology to print the conductive layer and fill the conductive holes with the corresponding tungsten-manganese conductive slurry, thereby better improving the switch's ablation resistance and achieving high-energy discharge. At the same time, the gas sealing step is used to achieve both the gas filling and packaging functions of the planar switch, which not only ensures the airtightness of the product package but also ensures that the internal atmosphere of the product meets the design requirements.

Description

Technical Field

[0001] The invention relates to the field of exploding foil initiation systems, in particular to a preparation process of a planar switch of an exploding foil initiation system. Background Art

[0002] The exploding foil initiation system is a highly safe and reliable in-line pyrotechnic device primarily used for detonating explosive charges and igniting propellants in solid rocket engines. The high-voltage switch is a key component in the system, determining the output characteristics of the initiator and directly impacting its performance. If the pulse current in the initiation circuit rises too slowly or has a low peak value, the exploding foil will melt or explode slowly due to the reduced energy consumption, rendering the system unreliable.

[0003] In some existing technologies, the mature high-voltage switch used in China is the traditional vertical cold cathode trigger tube. This type of switch is large in size, complex in manufacturing process, and high in cost. It relies on wire connections, which makes the entire system unable to be minimized to the greatest extent. It also increases the inductance and resistance of the system, reducing the transmission of ignition energy.

[0004] In order to solve the problem of large volume, some other existing technologies adopt the form of planar switches. For example, the Chinese invention patent (application number CN201910041889.0) discloses a closed planar three-electrode switch chip based on LTCC process. Figure 1 As shown, the metal layer may include the three electrodes of the planar three-electrode switch, the cathode, the cathode and the anode, as well as pads for connecting to external circuit devices. The cathode is located between the cathode and the anode. The structural layer A is placed on the metal layer and includes an electrode cavity and a pad groove for exposing the pad. During the packaging process, the base layer, metal layer, structural layer A and structural layer B are stacked and aligned layer by layer in this order, and then placed in a static press for hot pressing. However, this existing technology has the following problems:

[0005] (1) The prior art uses low-temperature co-fired ceramic technology to prepare a planar three-electrode switch chip, and correspondingly uses low-temperature metal as the electrode material, that is, metal paste such as Au and Ag as the electrode material. However, although low-temperature metal also has a certain ablation resistance, the ablation resistance effect is limited for switches that are used multiple times.

[0006] (2) In the packaging process, the prior art stacks and aligns the base layer, metal layer, structural layer A, and structural layer B in this order, and then places them in a static press for hot pressing. However, this method does not allow for adjustment of the atmosphere (pressure and gas content) within the electrode cavity according to design requirements, and hot pressing structural layer A directly against the metal layer can easily damage the metal layer. Summary of the Invention

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a process for preparing a planar switch of an exploding foil initiation system.

[0008] The object of the present invention is achieved through the following technical solutions:

[0009] A first aspect of the present invention provides a process for preparing a planar switch of an exploding foil initiation system, comprising the following steps:

[0010] Substrate punching: Place the alumina green porcelain tape in a special steel frame, fix the position, and punch holes according to the pattern of the green porcelain tape to be punched to form a substrate layer with conductive holes;

[0011] Filling the hole with slurry: Fill the conductive holes of the punched green porcelain tape with tungsten-manganese conductive slurry;

[0012] Conductor printing: Using the gap screen printing technology, the tungsten manganese conductor paste is printed on the corresponding substrate layer according to the design pattern to form a conductive layer;

[0013] Overlay molding: The printed green porcelain tapes are stacked in order according to the layer sequence, and then compacted using an isostatic press;

[0014] Scribing: The compacted substrate layer is scribed using a laser;

[0015] High-temperature sintering: The diced product is sintered in a sintering furnace to obtain a planar switch workpiece to be packaged;

[0016] Surface treatment: Place gold-tin solder on the cover sealing of the flat switch workpiece to be packaged;

[0017] Inflatable sealing: In a specific atmosphere, the planar switch workpiece to be packaged is sealed with the cover plate using gold-tin solder, and the sealing pressure is controlled so that the atmosphere and pressure in the cavity after sealing meet the design requirements;

[0018] Interface surface treatment: The interface patch conductor parts are surface-plated with nickel and gold.

[0019] More preferably, in an exemplary embodiment, in the conductor printing step, the printed thickness is controlled to be 15 μm-20 μm, and the conductor is baked at 70° C. for 10 minutes.

[0020] In the lamination step, the isostatic press was operated at a pressure of 500 psi, a temperature of 70°C, and a duration of 15 min.

[0021] In the high temperature sintering step, the sintering temperature is 1600 degrees Celsius.

[0022] More preferably, in an exemplary embodiment, after the high temperature sintering step, the method further comprises:

[0023] Appearance inspection: Perform appearance and size inspection on the sintered samples.

[0024] More preferably, in an exemplary embodiment, after the interface surface treatment step, the method further comprises:

[0025] Inspection and testing: Testing product performance.

[0026] More preferably, in an exemplary embodiment, the inflation sealing adopts an inflation packaging system, comprising:

[0027] The packaging station comprises a packaging table, a packaging protection cover arranged on the packaging table, and a heating component arranged in the packaging protection cover;

[0028] The furnace exhaust system includes a furnace exhaust component and a furnace air pressure measuring component. The furnace exhaust component is used to exhaust air from the packaging protective cover, and the furnace air pressure measuring component is used to measure the air pressure in the packaging protective cover.

[0029] The furnace temperature control system includes a temperature measuring component and a temperature control component, wherein the temperature measuring component is used to measure the temperature inside the packaging protective cover, and the temperature control component is used to control the heating component according to the measurement result of the temperature measuring component;

[0030] The gas mixing and inflation system includes a gas mixing and exhaust component, a gas mixing component and an inflation component. The gas mixing and exhaust component is used to exhaust gas from the pipes and gas mixing components involved in the gas mixing and inflation system and measure the air pressure. The gas mixing component is used to mix the gas source for packaging. The inflation component is used to fill the mixed gas into the packaging protective cover.

[0031] More preferably, in an exemplary embodiment, the gas mixing assembly includes a gas mixing bottle and a plurality of gas sources connected to the gas mixing bottle, and a gas source inflation valve is connected between each gas source and the gas mixing bottle;

[0032] The gas mixing and pumping component pumps gas from the pipes and gas mixing bottles involved in the gas mixing and charging system and measures the air pressure;

[0033] The inflation component is a filling and inflation valve arranged between the gas mixing bottle and the packaging protective cover.

[0034] More preferably, in an exemplary embodiment, the inflation sealing includes the following sub-steps:

[0035] Preparation: Open the packaging protective cover, place the planar switch workpiece to be packaged and the cover layer to be packaged on the packaging table in sequence, and close the packaging protective cover; wherein solder is provided on the planar switch workpiece to be packaged;

[0036] Furnace exhaust: Open the furnace exhaust component of the furnace exhaust system, wait until the furnace pressure measuring component detects that the vacuum degree in the package protection cover reaches the preset value, turn on the furnace temperature control system, and heat the package protection cover according to the set temperature control curve;

[0037] Air extraction and mixing: Open the air mixing and extraction component of the air mixing and inflation system, and extract air from the pipes and air mixing components involved in the air mixing and inflation system. After detecting that the vacuum degree reaches the preset value, close the air mixing and extraction component, and use the air mixing component to mix air according to the design requirements;

[0038] Inflation and pressure maintenance: When the temperature inside the package protective cover reaches the design temperature stage, open the inflation component to fill the gas in the mixing component into the package protective cover. When the air pressure inside the package protective cover reaches the design requirement, keep it warm for a period of time to allow the gas to fully and evenly fill the entire flat switch workpiece inside the package protective cover;

[0039] Heating and melting: After the insulation is completed, the temperature control system controls the packaging protective cover to continue to heat up until the solder used for sealing is evenly melted;

[0040] Cooling: Cool down to room temperature according to design requirements, open the package protection cover and take out the planar switch workpiece after restart packaging.

[0041] The beneficial effects of the present invention are:

[0042] In an exemplary embodiment of the present invention, compared with the low-temperature metal printing used in the prior art, in this exemplary embodiment, a high-temperature sintering technology is used to print the conductive layer and fill the conductive holes using the corresponding tungsten-manganese conductor paste, thereby better improving the switch's ablation resistance and high-energy discharge.

[0043] At the same time, compared with the existing technology that uses static pressure packaging, the inflation and packaging steps are used to achieve the two functions of inflation and packaging of the planar switch, which can not only ensure the airtightness of the product packaging, but also ensure that the internal atmosphere of the product meets the design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic diagram of a three-electrode planar switch packaging structure in the prior art;

[0045] Figure 2 A flow chart of a process for preparing a planar switch of an exploding foil initiation system provided in an exemplary embodiment of the present invention;

[0046] Figure 3 A circuit diagram of the inspection and testing steps in the manufacturing process of a planar switch of an exploding foil initiation system provided in an exemplary embodiment of the present invention;

[0047] Figure 4This is a schematic structural diagram of an air-filled packaging system used in an air-filled sealing step in a process for preparing a planar switch of an exploding foil initiation system according to an exemplary embodiment of the present invention;

[0048] Figure 5 This is a flow chart of the inflation and sealing steps in the preparation process of a planar switch of an exploding foil initiation system provided in an exemplary embodiment of the present invention;

[0049] Figure 6 An exploded view of a planar switch workpiece provided by an exemplary embodiment of the present invention;

[0050] Figure 7 A schematic diagram of the installation of a planar switch workpiece to be packaged provided by an exemplary embodiment of the present invention;

[0051] Figure 8 A schematic structural diagram of an electrode layer of a planar switch workpiece provided by an exemplary embodiment of the present invention;

[0052] In the figure, 1-first conductive layer, 101-columnar teeth, 102-patch teeth, 2-first substrate layer, 201-conductive slots, 3-second conductive layer, 301-first conductive component, 302-second conductive component, 303-third conductive component, 304-conductive seat, 305-conductive teeth, 306-conductive columns, 4-second substrate layer, 401-conductive holes, 402-first corner, 403-second corner, 404-third corner, 405-fourth corner, 5-electrode layer, 501-anode, 50101-anode Conductive end, 50102-anode trigger end, 502-first trigger pole, 50201-conductive end of the first trigger pole, 50202-trigger end of the first trigger pole, 503-second trigger pole, 50301-conductive end of the second trigger pole, 50302-trigger end of the second trigger pole, 504-cathode, 50401-conductive end of the cathode, 50402-trigger end of the cathode, 505-secondary gap, 506-main gap, 6-wall layer, 7-third conductive layer, 8-cover layer, 9-internal cavity. DETAILED DESCRIPTION

[0053] The technical solution of the present invention is described clearly and completely below with reference to the accompanying drawings. It is apparent that the embodiments described are only a portion of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are intended to fall within the scope of protection of the present invention.

[0054] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" are based on the directions or positional relationships described in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0055] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention.

[0056] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0057] See also Figure 2 , Figure 2 A flow chart showing a process for preparing a planar switch of an exploding foil initiation system provided in an exemplary embodiment of the present invention includes the following steps:

[0058] Substrate punching: Place the alumina green porcelain tape in a special steel frame, fix the position, and punch holes according to the pattern of the green porcelain tape to be punched to form a substrate layer with conductive holes;

[0059] Filling the hole with slurry: Fill the conductive holes of the punched green porcelain tape with tungsten-manganese conductive slurry;

[0060] Conductor printing: Using the gap screen printing technology, the tungsten manganese conductor paste is printed on the corresponding substrate layer according to the design pattern to form a conductive layer;

[0061] Overlay molding: The printed green porcelain tapes are stacked in order according to the layer sequence, and then compacted using an isostatic press;

[0062] Scribing: The compacted substrate layer is scribed using a laser;

[0063] High-temperature sintering: The diced product is sintered in a sintering furnace to obtain a planar switch workpiece to be packaged;

[0064] Surface treatment: Place gold-tin solder on the cover sealing of the flat switch workpiece to be packaged;

[0065] Inflatable sealing: In a specific atmosphere, the planar switch workpiece to be packaged is sealed with the cover plate using gold-tin solder, and the sealing pressure is controlled so that the atmosphere and pressure in the cavity after sealing meet the design requirements;

[0066] Interface surface treatment: The interface patch conductor parts are surface-plated with nickel and gold.

[0067] Specifically, compared with the low-temperature metal printing used in the prior art, in this exemplary embodiment, high-temperature sintering technology is used to print the conductive layer and fill the conductive holes using the corresponding tungsten-manganese conductor paste, thereby better improving the switch's anti-ablation performance and high-energy discharge.

[0068] At the same time, compared with the existing technology that adopts the form of static pressure packaging, in this exemplary embodiment, an inflation sealing step is used to achieve the two functions of inflation and packaging of the planar switch, which not only ensures the airtightness of the product packaging, but also ensures that the internal atmosphere of the product meets the design requirements.

[0069] More preferably, in an exemplary embodiment, in the conductor printing step, the printed thickness is controlled to be 15 μm-20 μm, and the conductor is baked at 70° C. for 10 minutes.

[0070] In the lamination step, the isostatic press was operated at a pressure of 500 psi, a temperature of 70°C, and a duration of 15 min.

[0071] In the high temperature sintering step, the sintering temperature is 1600 degrees Celsius.

[0072] Specifically, in this exemplary embodiment, specific implementation parameters of the conductor printing step, the lamination molding step, and the high-temperature sintering step are given.

[0073] More preferably, in an exemplary embodiment, after the high temperature sintering step, the method further comprises:

[0074] Appearance inspection: Perform appearance and size inspection on the sintered samples.

[0075] Specifically, in this exemplary embodiment, an appearance inspection step is provided after the high-temperature sintering step to reduce the impact of high-temperature sintering on the sample. It should be noted that the appearance inspection can be either manual inspection or machine vision inspection.

[0076] More preferably, in an exemplary embodiment, after the interface surface treatment step, the method further comprises:

[0077] Inspection and testing: Testing product performance.

[0078] Specifically, in this exemplary embodiment, after the preparation is completed, the product will be tested for performance. The planar high voltage switch test is carried out in accordance with the trigger tube test specification. The test circuit schematic is shown in FIG. Figure 3 As shown, the pulse control unit outputs a low-voltage pulse signal to turn on the energy storage capacitor. After pulse transformation and amplification, a triggering high-voltage pulse is generated. The cathode of the planar switch breaks down and turns on under the action of the triggering high-voltage pulse, causing conduction between the cathode and anode. This releases energy from the main capacitor and transfers it to the load, completing the function of low-voltage pulse signal controlling high energy.

[0079] According to the test circuit schematic, the self-breakdown voltage, operating voltage, trigger voltage, delay time and other related parameters of the planar switch are tested using a fully automatic high-voltage switch measuring instrument. This test system uses automated operation and automatically collects and records test data. It has the characteristics of high efficiency and high reliability and is widely used in trigger tube production testing.

[0080] More preferably, in an exemplary embodiment, Figure 4 As shown, the inflation sealing adopts an inflation packaging system, including:

[0081] The packaging station comprises a packaging table, a packaging protection cover arranged on the packaging table, and a heating component arranged in the packaging protection cover;

[0082] The furnace exhaust system includes a furnace exhaust component and a furnace air pressure measuring component. The furnace exhaust component is used to exhaust air from the packaging protective cover, and the furnace air pressure measuring component is used to measure the air pressure in the packaging protective cover.

[0083] The furnace temperature control system includes a temperature measuring component and a temperature control component, wherein the temperature measuring component is used to measure the temperature inside the packaging protective cover, and the temperature control component is used to control the heating component according to the measurement result of the temperature measuring component;

[0084] The gas mixing and inflation system includes a gas mixing and exhaust component, a gas mixing component and an inflation component. The gas mixing and exhaust component is used to exhaust gas from the pipes and gas mixing components involved in the gas mixing and inflation system and measure the air pressure. The gas mixing component is used to mix the gas source for packaging. The inflation component is used to fill the mixed gas into the packaging protective cover.

[0085] Specifically, in this exemplary embodiment, the gas filling packaging process can achieve both the gas filling and packaging functions of the planar switch, which not only ensures the airtightness of the product packaging, but also ensures that the internal atmosphere of the product meets the design requirements. Specifically:

[0086] The air pressure inside the packaging protective cover can be measured by the air pressure measuring component in the furnace, and the air extraction condition of the exhaust component in the furnace and the air inflation condition of the air inflation component can be adjusted accordingly, so as to meet the air pressure conditions before packaging and the air pressure conditions during packaging (the corresponding ones are the internal cavity air pressure corresponding to the position of the electrode layer of the planar switch); at the same time, the temperature inside the packaging protective cover can be measured by the temperature control system in the furnace to meet the temperature conditions in each stage; finally, since the mixing component in the mixing and inflation system is used to mix the gas source for packaging, the gas mixed each time can be adjusted according to actual needs, so as to meet various design requirements of the internal atmosphere of the planar switch, that is, under the premise of maintaining the high purity of the gas inside the product, it is further ensured that the product performance meets the design requirements, which greatly shortens the process manufacturing process and improves the production efficiency of the product.

[0087] More preferably, in an exemplary embodiment, the furnace exhaust assembly and the mixed gas exhaust assembly both adopt an oil-free exhaust method, that is, a combination of a dry pump and a molecular pump.

[0088] More preferably, in an exemplary embodiment, Figure 4 As shown, the gas mixing assembly includes a gas mixing bottle and multiple gas sources connected to the gas mixing bottle, and a gas source inflation valve is connected between each gas source and the gas mixing bottle;

[0089] The mixed gas extraction component includes a mixed gas extraction module and a mixed gas pressure measurement module. The mixed gas extraction module extracts gas from the pipes and mixed gas bottles involved in the mixed gas charging system, and the mixed gas pressure measurement module measures the pressure.

[0090] The inflation component is a filling and inflation valve arranged between the gas mixing bottle and the packaging protective cover.

[0091] Specifically, in this exemplary embodiment, various implementations and internal connection relationships of the gas mixing and pumping component, the gas mixing component, and the gas charging component in the gas mixing and charging system are disclosed.

[0092] More preferably, in an exemplary embodiment, Figure 5 As shown, the inflatable packaging includes the following steps:

[0093] Preparation: Open the packaging protective cover, place the planar switch workpiece to be packaged and the cover layer to be packaged on the packaging table in sequence, and close the packaging protective cover; wherein solder (preferably gold-tin solder) is provided on the planar switch workpiece to be packaged;

[0094] Furnace exhaust: Open the furnace exhaust component of the furnace exhaust system, wait until the furnace pressure measuring component detects that the vacuum degree in the package protection cover reaches the preset value, turn on the furnace temperature control system, and heat the package protection cover according to the set temperature control curve;

[0095] Air extraction and mixing: Open the air mixing and extraction component of the air mixing and inflation system, and extract air from the pipes and air mixing components involved in the air mixing and inflation system. After detecting that the vacuum degree reaches the preset value, close the air mixing and extraction component, and use the air mixing component to mix air according to the design requirements;

[0096] Inflation and pressure maintenance: When the temperature inside the package protective cover reaches the design temperature stage, open the inflation component to fill the gas in the mixing component into the package protective cover. When the air pressure inside the package protective cover reaches the design requirement, keep it warm for a period of time (preferably 30 minutes) to allow the gas to fully and evenly fill the entire flat switch workpiece in the package protective cover;

[0097] Heating and melting: After the insulation is completed, the temperature control system controls the packaging protective cover to continue to heat up until the solder used for sealing is evenly melted;

[0098] Cooling: Cool down to room temperature according to design requirements, open the package protection cover and take out the planar switch workpiece after restart packaging.

[0099] Specifically, in this exemplary embodiment, the same inventive concept as the system is used, that is, the air pressure in the packaging protective cover is measured by the in-furnace air pressure measuring component, and the exhaust condition of the in-furnace exhaust component and the inflation condition of the inflation component are adjusted accordingly, so as to meet the air pressure conditions before packaging and the air pressure conditions during packaging (corresponding to the internal cavity air pressure corresponding to the position of the planar switch electrode layer); at the same time, the temperature in the packaging protective cover can be measured by the in-furnace temperature control system to meet the temperature conditions of each stage; finally, since the mixing component in the mixing and inflation system is used to mix the gas source for packaging, the gas mixed each time can be adjusted according to actual needs, so as to meet various design requirements of the internal atmosphere of the planar switch, that is, on the premise of maintaining the high purity of the gas inside the product, it is further ensured that the product performance meets the design requirements, greatly shortening the process manufacturing process and improving the production efficiency of the product.

[0100] More preferably, in an exemplary embodiment, the vacuum degree in the furnace exhaust step and the exhaust and gas mixing step is judged to be better than 10 -3 Pa.

[0101] More preferably, in an exemplary embodiment, Figure 6 and Figure 7 As shown, the planar switch workpiece to be packaged includes, from bottom to top, a first conductive layer 1, a first substrate layer 2, a second conductive layer 3, a second substrate layer 4, an electrode layer 5, a wall layer 6, and a third conductive layer 7, on which solder is provided;

[0102] After the packaging is completed, the upper end of the wall layer 6 is connected to the cover layer 8 through the third conductive layer 7, and the lower end of the wall layer 6 is connected to the second substrate layer 4. Figure 4As shown (the cover layer 8 is not shown), the cover layer 8, the wall layer 6 and the second substrate layer 4 form an internal cavity 9; the electrode layer 5 is located in the internal cavity 9 and is disposed on the second substrate layer 4;

[0103] The conductive ends of each electrode of the electrode layer 5 are electrically connected to the outside through the second conductive layer 3 and the first conductive layer 1 in sequence. The second substrate layer 4 is provided with a conductive hole 401 matching the electrode layer 5 and the second conductive layer 3. The first substrate layer 2 is provided with a conductive groove 201 matching the second conductive layer 3 and the first conductive layer 1.

[0104] Specifically, in this exemplary embodiment, the electrode layer 5 is located inside the internal cavity 9 formed by the cover layer 8, the wall layer 6 and the second substrate layer 4. The entire electrode layer 5 is located inside the internal cavity 9, and the upper end of the wall layer 6 is connected to the cover layer 8 (metal cover layer) through the third conductive layer 7, thereby achieving airtightness.

[0105] At the same time, the conductive ends of each electrode of the electrode layer 5 are reliably electrically connected to the outside through the second conductive layer 3 and the first conductive layer 1 in turn. The corresponding result during the connection process is that the second substrate layer 4 is provided with a conductive hole 401 matching the electrode layer 5 and the second conductive layer 3, and the first substrate layer 2 is provided with a conductive groove 201 matching the second conductive layer 3 and the first conductive layer 1, that is: the electrode of the electrode layer 5 is connected to the second conductive layer 3 through the conductive hole 401 of the second substrate layer 4, the second conductive layer 3 is connected to the first conductive layer 1 through the conductive groove 201 of the first substrate layer 2, and the first conductive layer 1 is located below the first substrate layer 2.

[0106] By adopting this connection method and the heating and melting steps and the cooling steps in the process flow, the electrode layer 5 is not hot-pressed on the installation structure, and is complete and reliable; and the entire electrode layer is located in the internal cavity 9, and the entire ionization process is in the internal cavity 9, with strong integrity; finally, through the arrangement of two substrates and two conductive layers, the external connection of the electrode layer 5 is set at the bottom of the entire packaging structure, which is convenient for subsequent patching.

[0107] More preferably, in an exemplary embodiment, Figure 8 As shown, the electrode layer 5 includes an anode 501, a first trigger electrode 502, a second trigger electrode 503 and a cathode 504. The first trigger electrode 502 and the second trigger electrode 503 are respectively arranged on both sides of the cathode 504, forming a secondary gap 505 respectively; the first trigger electrode 502, the second trigger electrode 503 and the cathode 504 are all arranged opposite to the anode 501, forming a main gap 506.

[0108] Specifically, the electrode layout structure in this exemplary embodiment adopts a bypass trigger electrode layout, that is, the first trigger electrode 502 and the second trigger electrode 503 are respectively arranged on both sides of the cathode 504, and the first trigger electrode 502, the second trigger electrode 503, and the cathode 504 are on one side, and the anode 501 is on the other side (and is preferably arranged in a position directly opposite the cathode 504).

[0109] Before operation, the cathode 504 and the anode 501 maintain a DC high voltage and remain insulated; when formal operation begins, a specific pulse voltage signal is applied between the cathode 504 and the trigger electrode (the first trigger electrode 502 and the second trigger electrode 503), and the secondary gap 505 between the cathode 504 and the trigger electrode (between the cathode 504 and the first trigger electrode 502, and between the cathode 504 and the second trigger electrode 503) is broken down and connected under the action of the trigger high-voltage pulse, and the spark discharge provides an initial charged ion source, which enters the main gap 506 between the cathode 504 and the anode 501 under the action of the anode 501 voltage. During this process, the number of ion collisions increases continuously and sharply, and finally the anode 501 and the cathode 504 are connected through the discharge arc.

[0110] With this layout, the maximum electric field between the anode 501 and the cathode 504 is concentrated near the central axis, and the triggering spark particle source is located at the main gap 506. The discharge channel corresponding to the main gap 506 (the gap between the cathode 504 and the anode 501) extends from the end face of the anode 501 to the cathode 504 area near the central axis. The discharge channel can be quickly established across the main gap, thereby shortening the switching delay time and improving the switching synchronization. The discharge channel is relatively stable, which improves the working stability.

[0111] At the same time, trigger electrodes (a first trigger electrode 502 and a second trigger electrode 503) are distributed on both sides of the cathode 504. The discharge path is on both sides of the cathode 504, which helps to increase the effective contact area of ​​the discharge arc and improve the cathode's ability to resist ablation.

[0112] Moreover, compared with the prior art method in which the trigger electrode is located between the cathode and the anode in the three-electrode configuration, the cathode 504 of this exemplary embodiment is located between the trigger electrodes, thereby reducing the bombardment of ions on the trigger electrodes during the discharge of the main gap 506 and helping to increase the number of times the planar switch can be used.

[0113] More preferably, in an exemplary embodiment, Figure 8 As shown, the first trigger electrode 502 and the second trigger electrode 503 are axially symmetrically arranged on both sides of the cathode 504.

[0114] Specifically, in this exemplary embodiment, the positions of the first trigger electrode 502 and the second trigger electrode 503 are set in an axially symmetrical manner, so that the first trigger electrode 502 and the second trigger electrode 503 have the same effect on the cathode 504 when initially triggering the high voltage pulse, and production is convenient.

[0115] In addition, you can also use Figure 7 The asymmetric structure shown.

[0116] More preferably, in an exemplary embodiment, Figure 8 As shown, the cathode 504 is located inside the first trigger electrode 502 and the second trigger electrode 503 , that is, located in the non-main gap 506 area.

[0117] Specifically, in this exemplary embodiment, since the cathode 504 is located inside the first trigger electrode 502 and the second trigger electrode 503, that is, located in the non-main gap 506 area, the bombardment of ions on the cathode 504 during the discharge of the main gap 506 is further reduced, and the number of times the planar switch is used is further improved.

[0118] More preferably, in an exemplary embodiment, Figure 8 As shown, the conductive end 50401 of the cathode is farther away from the anode 501 than the trigger end 50402 of the cathode, the conductive end 50101 of the anode is farther away from the main gap 506 than the trigger end 50102 of the anode, the conductive end 50201 of the first trigger pole is farther away from the secondary gap 505 than the trigger end 50202 of the first trigger pole, and the conductive end 50301 of the second trigger pole is farther away from the secondary gap 505 than the trigger end 50302 of the second trigger pole.

[0119] Specifically, the anode 501, the first trigger electrode 502, the second trigger electrode 503 and the cathode 504 all have a conductive end and a trigger end, wherein: a conductive hole 401 is opened at the position of the conductive end corresponding to the second substrate layer 4 for connecting an external electrical signal; and the trigger end is used to trigger charged ions and discharge arcs (generated according to actual steps and situations).

[0120] In this exemplary embodiment, the conductive end 50401 of the cathode is farther away from the anode 501 than the trigger end 50402 of the cathode, so that the conductive end 50401 of the cathode is farther away from the secondary gap 505 and the main gap 506, reducing the bombardment of the conductive end 50401 of the cathode by charged particles or discharge arcs, thereby improving the service life.

[0121] More preferably, in an exemplary embodiment, Figure 8As shown, the second substrate layer 4 is a square substrate layer, and the square second substrate layer 4 includes a first corner 402, a second corner 403, a third corner 404 and a fourth corner 405 in a clockwise or counterclockwise direction; the conductive end 50101 of the anode is located at the first corner 402, the conductive end 50201 of the first trigger pole is located at the second corner 403, the conductive end 50401 of the cathode is located at the third corner 404, and the conductive end 50301 of the second trigger pole is located at the fourth corner 405.

[0122] Specifically, in this exemplary embodiment, a square substrate layer and a corresponding layout are used, which makes production more convenient.

[0123] More preferably, in an exemplary embodiment, Figure 7 As shown, the second conductive layer 3 includes: a first conductive component 301 used in conjunction with the cathode 504 , a second conductive component 302 used in conjunction with the anode 501 , and a third conductive component 303 used in conjunction with the first trigger electrode 502 and the second trigger electrode 503 .

[0124] Specifically, in this exemplary embodiment, the first conductive component 301 connected to the cathode 504 and the second conductive component 302 connected to the anode 501 are each independently provided with conductive control; and since the first trigger electrode 502 and the second trigger electrode 503 can share the same control method, the cathode connection is achieved through the third conductive component 303, thereby reducing the control circuit.

[0125] More preferably, in an exemplary embodiment, Figure 7 As shown, the first conductive component 301, the second conductive component 302 and the third conductive component 303 each include a conductive base 304, a conductive tooth 305 connected to the conductive base 304 and a conductive column 306 provided on the conductive base 304, the conductive tooth 305 matches the structure of the conductive groove 201 of the first substrate layer 2, and the conductive column 306 matches the structure of the conductive hole 401 of the second substrate layer 4 and corresponds to the conductive end position of the corresponding electrode;

[0126] The first conductive component 301 and the second conductive component 302 each include a conductive column 306 , and the third conductive component 303 includes two conductive columns 306 (only one is shown in the figure) corresponding to the first trigger electrode 502 and the second trigger electrode 503 , respectively.

[0127] Specifically, in this exemplary embodiment, the specific conductive structure of each conductive component in the second conductive layer 3 is disclosed, wherein: the conductive seat 304 is used to connect the conductive teeth 305 and the conductive column 306; the conductive teeth 305 match the conductive groove 201 structure of the first substrate layer 2, thereby completing the electrical connection with the first conductive layer 1; the conductive column 306 matches the conductive hole 401 structure of the second substrate layer 4, and corresponds to the conductive end position of the corresponding electrode, thereby completing the electrical connection with the electrode layer 5.

[0128] More preferably, in an exemplary embodiment, Figure 7 As shown, the first conductive layer 1 includes vertically arranged columnar teeth 101 and patch teeth 102 . The columnar teeth 101 pass through the conductive slots 201 of the first substrate layer 2 and are connected to the conductive teeth 305 . The patch teeth 102 are arranged at the bottom of the first substrate layer 2 .

[0129] Specifically, in this exemplary embodiment, a specific conductive structure of the first conductive layer 1 is disclosed, wherein: the columnar teeth 101 pass through the conductive slots 201 of the first substrate layer 2 for connecting with the conductive teeth 305 of the second conductive layer 3; the patch teeth 102 are arranged at the bottom of the first substrate layer 2 for realizing subsequent patch installation.

[0130] Meanwhile, when the structure of the planar switch workpiece to be packaged of the above exemplary embodiment is adopted, the corresponding steps in the preparation process of the planar switch of the exploding foil initiation system include:

[0131] (1) Punching of substrate: Place the alumina green tape in a special steel frame, fix the position, and punch holes according to the pattern of the green tape to be punched to form a substrate layer with conductive holes.

[0132] In this step, three alumina green tapes are required, corresponding to the first substrate layer 2, the second substrate layer 4 and the wall layer 6. Then, a conductive groove 201 is opened on the first substrate layer 2, a conductive hole 401 is opened on the second substrate layer 4, and a large hole forming the internal cavity 9 is opened on the wall layer 6.

[0133] (2) Filling the hole with slurry: Use tungsten-manganese conductive slurry to fill the conductive holes of the green porcelain tape after punching.

[0134] In this step, the conductive grooves 201 of the first substrate layer 2 are filled with tungsten-manganese conductive paste to form columnar teeth 101 ; and the conductive holes 401 of the second substrate layer 4 are filled with tungsten-manganese conductive paste to form conductive pillars 306 .

[0135] (3) Conductor printing: Using the gap screen printing technology, the tungsten manganese conductor paste is printed on the corresponding substrate layer according to the design pattern to form a conductive layer.

[0136] In this step, tungsten-manganese conductor paste is printed on the back of the first substrate layer 2 to form the patch teeth 102 in the first conductive layer 1, tungsten-manganese conductor paste is printed on the front of the first substrate layer 2 to form the conductive seat 304 and conductive teeth 305 of the second conductive layer 3, tungsten-manganese conductor paste is printed on the front of the second substrate layer 4 to form the anode 501, the first trigger electrode 502, the second trigger electrode 503 and the cathode 504 of the electrode layer 5, and tungsten-manganese conductor paste is printed on the front of the wall layer 6 to form the third conductive layer 7.

[0137] (4) Overlay molding: The printed raw porcelain tapes are aligned and stacked in order of layers, and then compacted using an isostatic press.

[0138] In this step, the printed first substrate layer 2, second substrate layer 4 and wall layer 6 are aligned and stacked in sequence, and then compacted using an isostatic press.

[0139] (5) Slicing: The compacted substrate layer is slicing with a laser.

[0140] In this step, the compacted substrate layer is diced to obtain individual diced products.

[0141] (6) High-temperature sintering: The diced product is sintered in a sintering furnace to obtain a planar switch workpiece to be packaged;

[0142] In this step, the diced product is sintered in a sintering furnace to obtain a planar switch workpiece to be packaged, such as Figure 6 shown.

[0143] (7) Surface treatment: gold-tin solder is applied to the cover plate sealing portion of the planar switch workpiece to be packaged;

[0144] In this step, gold-tin solder is provided on the third conductive layer 7 of the planar switch workpiece to be packaged.

[0145] (8) Gas sealing: In a specific atmosphere, the planar switch workpiece to be packaged is sealed with the cover plate using gold-tin solder, and the sealing pressure is controlled so that the atmosphere and pressure in the cavity after sealing meet the design requirements.

[0146] In this step, the third conductive layer 7 and the cover layer 8 of the planar switch workpiece to be packaged are sealed with gold-tin solder, and the relevant parameters of the internal cavity 9 formed therein are adjusted by restarting the sealing atmosphere and pressure.

[0147] (9) Interface surface treatment: The interface patch conductor parts are subjected to surface nickel and gold electroplating.

[0148] In this step, the patch teeth 102 disposed on the bottom of the first substrate layer 2 are subjected to surface electroplating with nickel and gold.

[0149] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications can be made based on the above descriptions. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications derived therefrom remain within the scope of protection of the present invention.

Claims

1. The manufacturing process of the planar switch of the exploding foil initiation system is characterized by: The following steps are involved: Substrate punching: Place the alumina green porcelain tape in a special steel frame, fix the position, and punch holes according to the pattern of the green porcelain tape to be punched to form a substrate layer with conductive holes; Filling the hole with slurry: Fill the conductive holes of the punched green porcelain tape with tungsten-manganese conductive slurry; Conductor printing: Using the gap screen printing technology, the tungsten manganese conductor paste is printed on the corresponding substrate layer according to the design pattern to form a conductive layer; Overlay molding: The printed green porcelain tapes are stacked in order according to the layer sequence, and then compacted using an isostatic press; Scribing: The compacted substrate layer is scribed using a laser; High-temperature sintering: The diced product is sintered in a sintering furnace to obtain a planar switch workpiece to be packaged; Surface treatment: Place gold-tin solder on the cover sealing of the flat switch workpiece to be packaged; Inflatable sealing: In a specific atmosphere, the planar switch workpiece to be packaged is sealed with the cover plate using gold-tin solder, and the sealing pressure is controlled so that the atmosphere and pressure in the cavity after sealing meet the design requirements; Interface surface treatment: Electroplating nickel and gold on the interface patch conductor parts; Wherein: the inflation sealing adopts an inflation packaging system, including: The packaging station comprises a packaging table, a packaging protection cover arranged on the packaging table, and a heating component arranged in the packaging protection cover; The furnace exhaust system includes a furnace exhaust component and a furnace air pressure measuring component. The furnace exhaust component is used to exhaust air from the packaging protective cover, and the furnace air pressure measuring component is used to measure the air pressure in the packaging protective cover. The furnace temperature control system includes a temperature measuring component and a temperature control component, wherein the temperature measuring component is used to measure the temperature inside the packaging protective cover, and the temperature control component is used to control the heating component according to the measurement result of the temperature measuring component; The gas mixing and inflation system includes a gas mixing and exhausting component, a gas mixing component, and an inflation component. The gas mixing and exhausting component is used to exhaust gas from the pipeline and gas mixing component involved in the gas mixing and inflation system and measure the air pressure. The gas mixing component is used to mix gas with the packaging gas source. The inflation component is used to fill the mixed gas into the packaging protective cover. The gas mixing assembly includes a gas mixing bottle and multiple gas sources connected to the gas mixing bottle, and a gas source inflation valve is connected between each gas source and the gas mixing bottle; The gas mixing and pumping component pumps gas from the pipes and gas mixing bottles involved in the gas mixing and charging system and measures the air pressure; The inflation component is a filling and inflation valve arranged between the gas mixing bottle and the packaging protective cover; The inflation sealing comprises the following sub-steps: Preparation: Open the packaging protective cover, place the planar switch workpiece to be packaged and the cover layer to be packaged on the packaging table in sequence, and close the packaging protective cover; wherein solder is provided on the planar switch workpiece to be packaged; Furnace exhaust: Open the furnace exhaust component of the furnace exhaust system, wait until the furnace pressure measuring component detects that the vacuum degree in the package protection cover reaches the preset value, turn on the furnace temperature control system, and heat the package protection cover according to the set temperature control curve; Air extraction and mixing: Open the air mixing and extraction component of the air mixing and inflation system, and extract air from the pipes and air mixing components involved in the air mixing and inflation system. After detecting that the vacuum degree reaches the preset value, close the air mixing and extraction component, and use the air mixing component to mix air according to the design requirements; Inflation and pressure maintenance: When the temperature inside the package protective cover reaches the design temperature stage, open the inflation component to fill the gas in the mixing component into the package protective cover. When the air pressure inside the package protective cover reaches the design requirement, keep it warm for a period of time to allow the gas to fully and evenly fill the entire flat switch workpiece inside the package protective cover; Heating and melting: After the insulation is completed, the temperature control system controls the packaging protective cover to continue to heat up until the solder used for sealing is evenly melted; Cooling: Cool down to room temperature according to design requirements, open the package protection cover and take out the planar switch workpiece after restart packaging.

2. The process for preparing a planar switch for an exploding foil initiation system according to claim 1, characterized in that: In the conductor printing step, the printed thickness is controlled at 15 μm-20 μm and baked at 70°C for 10 minutes; In the lamination step, the isostatic press was operated at a pressure of 500 psi, a temperature of 70°C, and a duration of 15 min. In the high temperature sintering step, the sintering temperature is 1600 degrees Celsius.

3. The process for preparing the planar switch of the exploding foil initiation system according to claim 1, characterized in that: After the high temperature sintering step, it also includes: Appearance inspection: Perform appearance and size inspection on the sintered samples.

4. The process for preparing a planar switch for an exploding foil initiation system according to claim 1, characterized in that: After the interface surface treatment step, it also includes: Inspection and testing: Testing product performance.

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