A device for detecting welding defects of integrated circuit component pins

Abstract

The invention discloses a device for detecting defects in the pin welding of integrated circuit components, which relates to the field of component welding quality detection, including a multi-degree-of-freedom conveying mechanism and a visual detection mechanism. A coding mechanism and a positioning mechanism are also arranged within the conveying range of the multi-degree-of-freedom conveying mechanism. The coding mechanism includes a base, an adjustment plate and a coding box. The coding box is mounted on the adjustment plate. The top surface and one side wall of the coding box are both opened. A plurality of U-shaped support plates are arranged in the coding box. The U-shaped opening of the U-shaped support plate faces the side wall opening of the coding box. One end of the adjusting plate away from the opening of the side wall of the coding box is spherically hinged on the base. One end of the adjusting plate close to the opening of the side wall of the coding box is provided with a lifting assembly. The lifting assembly is used for lifting the adjusting plate to deflect around the hinge position to present an inclined state. The lifting position of the lifting assembly and the hinge position of the adjusting plate are arranged along the diagonal position of the coding box, thereby realizing automated precise loading tooling, making the detection result more accurate, and improving the detection efficiency.

Description

Technical Field

[0001] The invention relates to the field of component welding quality detection, and in particular to a device for detecting welding defects of integrated circuit component pins. Background Art

[0002] As the performance of servers continues to improve, the number of components on the circuit board in the server board is increasing. Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts of industries such as electrical appliances, radios, and instruments, such as capacitors, transistors, hairsprings, springs, and other sub-components. Electronic components are installed on circuit boards by welding and form integrated circuits with chips. The welding quality of electronic components directly affects the operating status of integrated circuits. Therefore, it is very important to detect the welding quality of electronic components to avoid over-welding or under-welding. Over-welding can easily cause welding connections between components, resulting in short circuits in integrated circuits, while under-welding can easily cause components to fall off, which also affects the operation of integrated circuits. Since the soldering position of the components is located on the bottom of the circuit board, the circuit board needs to be turned over when inspecting the soldering quality, and then a visual inspection device is used to inspect the soldering quality. The standard soldering parts are input into the visual inspection device in advance, and the soldering position of the circuit board to be inspected is visually captured and compared with the standard soldering parts to determine whether there is too much soldering or too little soldering. The use of visual inspection equipment has the advantages of fast inspection speed and accurate inspection results, but it has high requirements on the precision of the circuit board. The soldering position of the circuit board needs to accurately correspond to the visual acquisition position. However, it is difficult to keep the circuit board with soldered components horizontal, mainly because the soldering positions of different components are The height is inconsistent. When the circuit board is turned over and placed on the inspection table, the circuit board cannot be kept level due to the influence of components, and the tooling accuracy is poor, which affects the accuracy of the test results. Secondly, in current enterprise production, a clamping tool is used to clamp the circuit board in mid-air for inspection. Due to the different sizes and shapes of circuit boards, especially the differences in the shapes of circuit boards, it is necessary to configure a clamping tool corresponding to the size and shape of the circuit board, which has a high cost. At the same time, it is difficult to realize automated tooling using a clamping tool, and its production efficiency is lower than that of automated production. Therefore, the current quality inspection of component pin welding lacks a device that can accurately and automatically load materials. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an integrated circuit component pin welding defect detection device to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: an integrated circuit component pin welding defect detection device, comprising a multi-degree-of-freedom conveying mechanism and a visual inspection mechanism, wherein the visual inspection mechanism is arranged within the conveying range of the multi-degree-of-freedom conveying mechanism, and a material coding mechanism and a positioning mechanism are also arranged within the conveying range of the multi-degree-of-freedom conveying mechanism, wherein the material coding mechanism comprises a base, an adjustment plate and a material coding box, wherein the material coding box is mounted on the adjustment plate, and both the top surface and one side wall of the material coding box are opened, wherein a plurality of U-shaped support plates are arranged in the material coding box, and the plurality of U-shaped support plates are arranged at equal intervals along the height direction of the material coding box, and the U-shaped opening of the U-shaped support plate faces the side wall opening of the material coding box, and the end of the adjustment plate away from the side wall opening of the material coding box is spherically hinged on the base, and the end of the adjustment plate close to the side wall opening of the material coding box is provided with a lifting assembly, wherein the lifting assembly is used to lift the adjustment plate to deflect around the hinge position to be in an inclined state, and the lifting position of the lifting assembly and the hinge position of the adjustment plate are arranged along the diagonal position of the material coding box;

[0005] The positioning mechanism includes a positioning platform and a positioning support assembly. Two groups of the positioning support assemblies are spaced apart on the top surface of the positioning platform. The positioning support assembly includes a plurality of support columns arranged in a rectangular array. The axes of the support columns are vertically arranged, and the support columns are slidably arranged on the positioning platform.

[0006] Furthermore, a mounting circular hole is opened on the top surface of the positioning platform at a position corresponding to the support column, an elastic rubber sleeve is fixed in the mounting circular hole, the support column is interference fit in the elastic rubber sleeve, and a positioning scale is set on the side wall of the support column along its own axis.

[0007] Furthermore, the length of the support column gradually increases along the center position close to the positioning platform, a limiting plate is fixed at the bottom of the support column, and a plurality of limiting teeth are fixed at a position of the limiting plate close to the side wall of the positioning platform. The plurality of limiting teeth are arranged at equal intervals along the height direction of the limiting plate, and a limiting gap is formed between two adjacent limiting teeth. A limiting slide is correspondingly arranged for each row of the support columns, and the plurality of limiting slides are staggered along the height direction of the positioning platform. The limiting slide is slidably arranged on the positioning platform, and the limiting slide is stuck in the limiting gap of the support columns of a corresponding row.

[0008] Furthermore, a horizontal slide groove is provided on the side wall of the positioning platform at the position where the limiting slide plate is set, and the horizontal slide groove is connected to the corresponding mounting circular hole. The limiting slide plate is slidably adapted to the horizontal slide groove, and a mounting cross plate is fixed at one end of the limiting slide plate away from the support column. Fixing bolts are slidably penetrated at both ends of the mounting cross plate, and the fixing bolts are threadedly connected to the positioning platform.

[0009] Furthermore, a hinge column is fixed on the top of the base, a hinge ball is fixed on the top of the hinge column, a spherical groove is opened on the bottom of the adjustment plate, and the hinge ball is movably adapted in the spherical groove, the lifting assembly includes a lifting cylinder and a spring, one set of diagonal positions of the adjustment plate are connected to a spring, the spring is connected to the base, the cylinder body of the lifting cylinder is installed on the base, the telescopic shaft of the lifting cylinder contacts the adjustment plate, and the lifting cylinder and the hinge ball are arranged at another set of diagonal positions of the adjustment plate.

[0010] Furthermore, a negative pressure cavity is formed in one of the side walls of the material stacking box, and the negative pressure cavity is connected to a negative pressure pump through a negative pressure pipe. An adsorption cavity is arranged in the side of the U-shaped support plate close to the negative pressure cavity. An adsorption hole is provided on the top surface of the U-shaped support plate, and the adsorption hole is connected to the adsorption cavity. A first connecting hole is provided on the inner wall of the material stacking box at a position connected to the U-shaped support plate, and a second connecting hole is provided on the side of the U-shaped support plate close to the negative pressure cavity. Both ends of the first connecting hole are respectively connected to the negative pressure cavity and the second connecting hole, and the second connecting hole is connected to the adsorption cavity.

[0011] Furthermore, each of the U-shaped support plates is correspondingly provided with a switching slide, and the switching slide is slidably fitted in the negative pressure cavity. A conducting hole is provided through the side wall of the switching slide, and one end of the switching slide passes through the material stacking box and is provided with an air pressure balance hole, which is not connected to the conducting hole. An air inlet hole is provided on one side of the switching slide close to the U-shaped support plate, and the air inlet hole is connected to the air pressure balance hole. The switching slide adjusts the negative pressure state of the U-shaped support plate by sliding, that is:

[0012] When the conducting hole is connected to the first connecting hole, the air inlet hole contacts the inner wall of the stacking box and is in a blocked state, so that the U-shaped support plate generates negative pressure to adsorb the PCB board;

[0013] When the air inlet hole is connected to the first connecting hole, the conducting hole contacts the inner wall of the material stacking box and is in a blocked state, so that external air enters the adsorption cavity to balance the air pressure.

[0014] Furthermore, the switching slide is located at one end of the negative pressure cavity and is connected to an adjusting spring, the adjusting spring is connected to the material stacking box, the top surface of the switching slide at one end where the air pressure balance hole is provided is provided with a wedge-shaped surface, a linear drive module is vertically installed on the adjusting plate, the sliding seat of the linear drive module is connected to the vertical pressing plate, and the wedge-shaped surface of the switching slide is located on the moving path of the vertical pressing plate.

[0015] Furthermore, the multi-degree-of-freedom conveying mechanism includes a fixed frame and two groups of clamping mechanisms, the two groups of clamping mechanisms are arranged on the fixed frame at upper and lower intervals, the clamping mechanism includes a horizontal beam, a rectangular base plate and a finger cylinder, the horizontal beam is slidably arranged on the fixed frame, the rectangular base plate is slidably arranged at the bottom of the horizontal beam, the moving direction of the horizontal beam is perpendicular to the moving direction of the rectangular base plate, a height adjustment cylinder is vertically installed on the rectangular base plate, the finger cylinder is located below the rectangular base plate, the telescopic shaft of the height adjustment cylinder passes through the rectangular base plate and is connected to the cylinder body of the finger cylinder, and the inner sides of the two clamping jaws of the finger cylinder are connected to clamping sheets.

[0016] Furthermore, a transverse mounting groove is provided at a position where the clamping mechanism is provided on the fixed frame, a first lead screw is rotatably provided in the transverse mounting groove, the horizontal beam is threadedly mounted on the first lead screw, a first motor is installed on the fixed frame, the output shaft of the first motor is transmission-connected to the first lead screw, a longitudinal mounting groove is provided at the bottom of the horizontal beam, a second lead screw is rotatably provided in the longitudinal mounting groove, a lead screw slider is threadedly mounted on the second lead screw, the lead screw slider is slidably adapted to the longitudinal mounting groove, the rectangular base plate is mounted on the lead screw slider, a second motor is installed at one end of the horizontal beam, and the output shaft of the second motor is transmission-connected to the second lead screw.

[0017] The beneficial effects of the present invention are:

[0018] The circuit board is supported by multiple support columns so that the back side of the circuit board is exposed upwards. The corresponding support columns are moved downward according to the positions of components on the circuit board, so that the circuit board can be supported avoiding the components. At the same time, several support columns are sunk to corresponding shapes according to the shape of the circuit board, so that the support columns on the sides of the circuit board are higher than the circuit board to limit the movement of the circuit board, so that the circuit board can be tooled to adapt to the shape of the circuit board and the position of the components, realizing automated and precise loading and tooling, making the detection results more accurate and improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The structure of the device for detecting the pin welding defects of integrated circuit components of the present invention is shown in FIG. Figure 1 ;

[0020] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 It is a top view of a positioning platform in a device for detecting defects in the pin welding of integrated circuit components;

[0022] Figure 4 for Figure 3 Middle AA section view;

[0023] Figure 5 for Figure 4 Enlarged view of point C in the middle;

[0024] Figure 6 This is a schematic diagram of the installation of an adjustment plate in a device for detecting pin welding defects of integrated circuit components of the present invention;

[0025] Figure 7 A state diagram of negative pressure of a U-shaped support plate in a device for detecting pin welding defects of integrated circuit components of the present invention;

[0026] Figure 8 This is a normal state diagram of a U-shaped support plate in a device for detecting pin welding defects of integrated circuit components of the present invention;

[0027] Fig. 9 The structure of the device for detecting the pin welding defects of integrated circuit components of the present invention is shown in FIG. Figure 2 ;

[0028] Fig.10 for Fig. 9 Enlarged view of point B in the middle;

[0029] Fig.11 It is a structural schematic diagram of a horizontal beam in a device for detecting welding defects of pins of integrated circuit components of the present invention;

[0030] In the figure, 1-base, 2-adjusting plate, 3-stack box, 4-U-shaped support plate, 5-positioning platform, 6-support column, 7-mounting circular hole, 8-elastic rubber sleeve, 9-limiting plate, 10-limiting tooth, 11-limiting slide plate, 12-horizontal slide groove, 13-mounting cross plate, 14-fixing bolt, 15-hinge column, 16-hinge ball, 17-lifting cylinder, 18-spring, 19-negative pressure chamber, 20-adsorption chamber, 21-adsorption hole, 22-first connecting hole, 23-second connecting hole, 24-switching slide plate, 25-conducting hole, 26-air pressure balance hole, 27-air inlet hole, 28-adjusting spring, 29-wedge surface, 30-linear drive module, 31-sliding seat, 32-vertical downward pressure plate, 33-fixed frame, 34-horizontal beam, 35-rectangular bottom plate, 36-finger cylinder, 37-clamping sheet, 38-lateral mounting groove, 39-first lead screw, 40-first motor, 41-longitudinal mounting groove, 42-second lead screw, 43-screw slider, 44-second motor, 45-height adjustment cylinder, 46-negative pressure connecting hole. DETAILED DESCRIPTION

[0031] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0032] Embodiment 1: Figures 1 to 11As shown, a device for detecting defects in the pin welding of integrated circuit components comprises a multi-degree-of-freedom conveying mechanism and a visual inspection mechanism, wherein the visual inspection mechanism is arranged within the conveying range of the multi-degree-of-freedom conveying mechanism, wherein a coding mechanism and a positioning mechanism are also arranged within the conveying range of the multi-degree-of-freedom conveying mechanism, wherein the coding mechanism comprises a base 1, an adjusting plate 2 and a coding box 3, wherein the coding box 3 is mounted on the adjusting plate 2, wherein the top surface and one side wall of the coding box 3 are both opened, wherein a plurality of U-shaped support plates 4 are arranged in the coding box 3, wherein the plurality of U-shaped support plates 4 are arranged at equal intervals along the height direction of the coding box 3, wherein the U-shaped opening of the U-shaped support plate 4 faces the side wall opening of the coding box 3, wherein one end of the adjusting plate 2 away from the side wall opening of the coding box 3 is spherically hinged on the base 1, and the adjusting plate 2 is close to the coding box 3. A lifting assembly is provided at one end of the opening of the side wall of the box 3. The lifting assembly is used to lift the adjustment plate 2 to deflect around the hinge position to an inclined state. The lifting position of the lifting assembly and the hinge position of the adjustment plate 2 are arranged along the diagonal position of the stacking box 3. The positioning mechanism includes a positioning platform 5 and a positioning support assembly. Two groups of positioning support assemblies are arranged at intervals on the top surface of the positioning platform 5. The positioning support assembly includes a plurality of support columns 6 arranged in a rectangular array. The axis of the support column 6 is vertically arranged, and the support column 6 is slidably penetrated on the positioning platform 5. The circuit board to be tested is stacked on the U-shaped support plate 4 of the stacking box 3. The circuit board is supported separately by the U-shaped support plate 4 so that the circuit boards with soldered components will not affect each other. The circuit board is The components pass through so that the components are suspended and will not interfere with the U-shaped support plate 4. The multi-degree-of-freedom conveying mechanism clamps the circuit board through the side wall opening of the coding box 3 and places it on the support column 6 of the positioning platform 5. The two groups of positioning support components are arranged at intervals so that there is space between the two groups of positioning support components for the multi-degree-of-freedom conveying mechanism to clamp and load materials. Before inspection, the standard parts are first entered into the visual inspection mechanism. In order to facilitate the adjustment of the height position of each support column 6, the standard parts are placed on the positioning support assembly. First, the support column 6 in contact with it is moved down according to the shape of the circuit board, thereby forming a sunken tooling area, and then the corresponding support column 6 is moved down according to the position of the components on the circuit board, thereby forming a component tooling area in the sunken tooling area, and the contacting electrical The downward movement height of the support column 6 of the road plate is consistent, so that the circuit board can be supported horizontally, and the tooling area is adjusted accordingly according to the size of the components, so as to avoid the components, and avoid the problem of interference between the components and the support column 6, and then adjust the visual inspection mechanism so that the visual inspection mechanism captures the inspection position of the standard parts and the inspection area to form a standard inspection position, and finally take out the standard parts for batch welding inspection of the circuit board, and place the circuit board to be inspected in the tooling area, that is, the circuit board can accurately correspond to the standard inspection position, so that the welding quality inspection of the components on the circuit board can be completed quickly and accurately, and the support column 6 on the side of the circuit board is higher than the circuit board, and the circuit board can also be limited, so that the circuit board will not be offset during the inspection process;During specific implementation, the visual inspection mechanism uses an industrial camera to capture the inspection position for comparison with the standard parts. This is a mature technology and will not be repeated here. Stacking boxes 3 are set on both sides of the visual inspection mechanism, one of which is used to stack the circuit boards to be inspected, and the other is used to stack the circuit boards with qualified inspection quality. Unqualified stacking boxes are placed within the conveying range of the multi-degree-of-freedom conveying mechanism, and the unqualified products detected are placed in the unqualified stacking boxes, so as to distinguish qualified products from unqualified products; because the circuit boards need to be placed on the U-shaped support plate 4 of the stacking box 3, the size of the side wall opening of the stacking box 3 and the U-shaped support plate 4 are larger than the size of the circuit boards, which is convenient for quickly stacking the circuit boards in the stacking box 3, but the circuit boards need to be accurately stacked. Loading is in the sinking tooling area, therefore, the circuit board needs to be accurately stacked in the stacking box 3 to obtain the accurate loading coordinates of the circuit board, so that the circuit board can be accurately loaded in the tooling area, and the position of the circuit board in the stacking box 3 is fine-tuned by adjusting the plate 2, so that the circuit board can be accurately stacked in the stacking box 3. Specifically, the lifting assembly lifts the adjusting plate 2 upward, and since the hinge position of the adjusting plate 2 and the lifting position are on the diagonal line, the stacking box 3 is lifted along the diagonal position to be in an inclined state, so that the circuit board on the U-shaped support plate 4 moves close to the corner position of the lower end of the stacking box 3, so that the two sides of the circuit board contact the two vertical inner walls of the stacking box 3 respectively to complete the positioning, so that the stacking position of the circuit board can be accurately determined, and accurate loading can be achieved. ;

[0033] Embodiment 2: Based on Embodiment 1, Figure 1 , Fig. 9 , Fig.10 and Fig.11As shown, the multi-degree-of-freedom conveying mechanism includes a fixed frame 33 and two groups of clamping mechanisms, the two groups of clamping mechanisms are arranged on the fixed frame 33 at an upper and lower interval, the clamping mechanism includes a horizontal beam 34, a rectangular bottom plate 35 and a finger cylinder 36, the horizontal beam 34 is slidably arranged on the fixed frame 33, the rectangular bottom plate 35 is slidably arranged at the bottom of the horizontal beam 34, the moving direction of the horizontal beam 34 is perpendicular to the moving direction of the rectangular bottom plate 35, a height adjustment cylinder 45 is vertically installed on the rectangular bottom plate 35, the finger cylinder 36 is located below the rectangular bottom plate 35, the telescopic axis of the height adjustment cylinder 45 passes through the rectangular bottom plate 35 and is connected to the cylinder body of the finger cylinder 36, the inner sides of the two clamping claws of the finger cylinder 36 are connected with clamping sheets 37, and two groups of clamping mechanisms are provided, one group The clamping mechanism loads the circuit boards to be inspected in the stacking box 3 onto the positioning platform 5, and another group of clamping mechanisms places the inspected circuit boards in the qualified stacking box or the unqualified stacking box according to the inspection results, so that the loading and unloading of the circuit boards can be carried out simultaneously, thereby improving the inspection efficiency of the circuit boards; the finger cylinder 36 is driven to move between the stacking box 3 and the visual inspection mechanism through the movement of the horizontal beam 34 to realize the X-axis movement, the finger cylinder 36 is driven to move in the Y-axis direction through the rectangular bottom plate 35, and the finger cylinder 36 is driven to move in the Z-axis direction through the height adjustment cylinder 45, so that the finger cylinder 36 can move in three degrees of freedom in the spatial coordinate system, and the two clamping sheets 37 are driven by the finger cylinder 36 to move to complete the clamping and releasing operations of the circuit board.

[0034] Furthermore, if Figures 9 to 11 As shown, a transverse mounting groove 38 is provided at the position where the clamping mechanism is provided on the fixing frame 33, a first lead screw 39 is rotatably provided in the transverse mounting groove 38, a horizontal beam 34 is threadedly mounted on the first lead screw 39, a first motor 40 is installed on the fixing frame 33, an output shaft of the first motor 40 is connected to the first lead screw 39 in a transmission manner, a longitudinal mounting groove 41 is provided at the bottom of the horizontal beam 34, a second lead screw 42 is rotatably provided in the longitudinal mounting groove 41, a lead screw slider 43 is threadedly mounted on the second lead screw 42, the lead screw slider 43 is slidably adapted to the longitudinal mounting groove 41, and the moment The shaped bottom plate 35 is installed on the screw slider 43, and a second motor 44 is installed at one end of the horizontal beam 34. The output shaft of the second motor 44 is connected to the second screw 42. The first motor 40 drives the first screw 39 to rotate, so that the horizontal beam 34 moves linearly along the axial direction of the first screw 39 to achieve X-axial movement. The second motor 44 drives the second screw 42 to rotate, so that the screw slider 43 moves linearly along the axial direction of the second screw 42 to achieve Y-axial movement. It is driven by a screw, has high movement accuracy, and can achieve accurate loading of circuit boards.

[0035] Embodiment 3: Based on Embodiment 2, Figures 1 to 5As shown, mounting holes 7 are provided on the top surface of the positioning platform 5 at positions corresponding to the support columns 6, and elastic rubber sleeves 8 are fixed in the mounting holes 7. The support columns 6 are interference fit in the elastic rubber sleeves 8. Positioning scales are provided on the side walls of the support columns 6 along their own axial directions. The length of the support columns 6 gradually increases as they approach the center position of the positioning platform 5. A limiting plate 9 is fixed to the bottom of the support column 6. A plurality of limiting teeth 10 are fixed to the position of the limiting plate 9 near the side wall of the positioning platform 5. The limiting teeth 10 are arranged at equal intervals along the height direction of the limiting plate 9, and a limiting gap is formed between two adjacent limiting teeth 10. A limiting slide plate 11 is provided corresponding to each row of the support columns 6, and a plurality of limiting slide plates 11 are staggered along the height direction of the positioning platform 5. 11 is slidably arranged on the positioning platform 5, the limiting slide plate 11 is stuck in the limiting gap of the support column 6 of the corresponding row, the side wall of the positioning platform 5 is provided with a horizontal slide groove 12 at the position where the limiting slide plate 11 is arranged, the horizontal slide groove 12 is connected to the corresponding mounting circular hole 7, the limiting slide plate 11 is slidably adapted to the horizontal slide groove 12, the end of the limiting slide plate 11 away from the support column 6 is fixed with a mounting cross plate 13, both ends of the mounting cross plate 13 are slidably penetrated with fixing bolts 14, the fixing bolts 14 are threadedly connected to the positioning platform 5, the elastic rubber sleeve 8 is fitted on the support column 6 through its own deformation interference sleeve, so that there is a large friction between the support column 6 and the elastic rubber sleeve 8, and the position of the support column 6 can be stabilized by this friction, so that when the limiting slide plate 11 is out of the limiting gap, The position height of the support column 6 can still be maintained, which is convenient for adjusting the position height of the support column 6; during operation, first remove each limit plate 11, that is, remove the fixing bolt 14 and take out the limit plate 11, so that the support column 6 is in an unlocked state, and then the worker places the standard parts on the two sets of positioning support components, and adjusts the position of the support column 6 accordingly by observing the contact between the circuit board and the support column 6. First, move the support column 6 that contacts the circuit board downward by a certain distance to form a tooling area, and judge the downward movement of the support column 6 by the positioning scale, so that after the support column 6 moves downward, the limit plate 11 can still be stuck in one of the limit gaps, and then continue to move the corresponding support column 6 downward according to the contact between the support column 6 and the components, so as to form a tooling area. A component tooling area is formed in the domain, so that the support column 6 avoids the components to avoid interference, and at the same time avoids the influence of the components, so that the circuit board is placed in a horizontal state on the positioning platform 5, and then the detection position of the standard circuit board is captured by the visual detection mechanism, and then the upper limit slide plate 11 is installed, so that the limit slide plate 11 is stuck in the limit gap of the adjacent limit teeth 10, thereby locking the support column 6, so that a stable tooling area and a component tooling area are formed between the support columns 6, and finally the standard circuit board is taken out for detection. It only needs to place the circuit board in the coding box 3 in the tooling area through the multi-degree-of-freedom conveying mechanism to realize accurate loading of the circuit board. The operation is simple, and automation is realized, which improves the detection accuracy and detection efficiency;In specific implementation, the installation position of the limiting slide 11 can limit the support columns 6 in the two groups of positioning support assemblies at the same time. The support columns are divided into two parts along the center position of the positioning platform 5. One part is limited by the limiting slide 11 installed on one side of the positioning platform 5, and the other part is limited by the limiting slide 11 installed on the other side of the positioning platform 5. The limiting slide 11 is symmetrically installed on the two opposite side walls of the positioning platform 5, so that there is enough space to install the limiting slide 11, and at the same time, the limiting slide 11 on the same side can be staggered along the height direction of the positioning platform 5. The limiting slide 11 and the paired support column 6 form a component, and the upper and lower staggered arrangement prevents the components from affecting each other, so that the locking and unlocking of each support column 6 can be completed smoothly. ;

[0036] Embodiment 4: Based on Embodiment 3, Figure 1 and Figure 6 As shown, a hinge column 15 is fixed on the top of the base 1, and a hinge ball 16 is fixed on the top of the hinge column 15. A spherical groove is opened at the bottom of the adjustment plate 2, and the hinge ball 16 is movably adapted in the spherical groove. The lifting assembly includes a lifting cylinder 17 and a spring 18. One set of diagonal positions of the adjustment plate 2 is connected with the spring 18, and the spring 18 is connected to the base 1. The cylinder body of the lifting cylinder 17 is installed on the base 1, and the telescopic shaft of the lifting cylinder 17 contacts the adjustment plate 2. The lifting cylinder 17 and the hinge ball 16 are arranged at another set of diagonal positions of the adjustment plate 2. The adjustment plate 2 is lifted by the lifting cylinder 17, so that the adjustment plate 2 The hinge position of the hinge ball 16 is used as the base point for deflection, and the lifting cylinder 17 acts on the diagonal position of the hinge position of the adjustment plate 2. At the same time, the hinge ball 16, the lifting cylinder 17 and the two springs 18 correspond to the four corners of the stacking box 3 respectively, so that the adjustment plate 2 drives the stacking box 3 to deflect with one corner position as the hinge point, so that the circuit board on the U-shaped support plate 4 can move toward the corner of the lower end, completing the horizontal and vertical positioning, so that the circuit board can be accurately stacked in the stacking box 3; in specific implementation, the top surface of the U-shaped support plate 4 is smoothed, so that after the U-shaped support plate 4 is tilted, the circuit board thereon can easily slide for positioning and adjustment.

[0037] Embodiment 5: Although the circuit board has been positioned in the stacking box 3, the circuit board will still move under the production vibration, resulting in the circuit board waiting to be tested to be offset, which makes it impossible to accurately load the circuit board into the tooling area. Therefore, based on the embodiment 4, Figure 1 , Figure 7 and Figure 8As shown, a negative pressure cavity 19 is formed in one of the side walls of the stacking box 3, and the negative pressure cavity 19 is connected to the negative pressure pump through a negative pressure pipe. An adsorption cavity 20 is arranged in the side of the U-shaped support plate 4 close to the negative pressure cavity 19, and an adsorption hole 21 is opened on the top surface of the U-shaped support plate 4, and the adsorption hole 21 is connected to the adsorption cavity 20. The inner wall of the stacking box 3 is provided with a first connecting hole 22 at the position connected to the U-shaped support plate 4, and a second connecting hole 23 is opened on the side of the U-shaped support plate 4 close to the negative pressure cavity 19. The two ends of the first connecting hole 22 are connected to the negative pressure cavity 19 and the second connecting hole 23, respectively, and the second connecting hole 23 is connected to the adsorption cavity 20. The negative pressure pump generates negative pressure in the negative pressure cavity 19, acts on the adsorption cavity 20 through the first connecting hole 22 and the second connecting hole 23, and finally acts on the circuit board through the adsorption hole 21 to adsorb the circuit board. After the circuit board is positioned in the stacking box 3, the circuit board is adsorbed by negative pressure to prevent the circuit board from moving.

[0038] Embodiment 6: Since the circuit boards are loaded one by one for testing, the loaded circuit boards need to cut off the negative pressure, while the other circuit boards need to maintain the negative pressure state. If a separate air pipe is configured for each U-shaped support plate 4, and the negative pressure is cut off and opened by the valve on the air pipe, the cost is high, and the control procedure is complicated and prone to failure. Therefore, on the basis of embodiment 5, as Figures 1 to 9As shown, each U-shaped support plate 4 is correspondingly provided with a switching slide plate 24, and the switching slide plate 24 is slidably fitted in the negative pressure cavity 19. A conducting hole 25 is penetrated through the side wall of the switching slide plate 24, and one end of the switching slide plate 24 passes through the material coding box 3 and is provided with an air pressure balance hole 26, and the air pressure balance hole 26 is not connected with the conducting hole 25. An air inlet hole 27 is provided on the side of the switching slide plate 24 close to the U-shaped support plate 4, and the air inlet hole 27 is connected to the air pressure balance hole 26. The switching slide plate 24 adjusts the negative pressure state of the U-shaped support plate 4 by sliding, that is, when the conducting hole 25 is connected to the first connecting hole 22, the air inlet hole 27 contacts the inner wall of the material coding box 3 and is in a blocked state, so that the U-shaped support plate 4 generates negative pressure to adsorb the PCB board; when the air inlet hole 27 is connected to the first connecting hole 22, the conducting hole 25 contacts the inner wall of the material coding box 3 and is in a blocked state, so that the outside air enters the adsorption cavity 20 to balance the air pressure, and each U-shaped support plate 4 is controlled mechanically. The negative pressure state of the support plate 4 is that when a circuit board on a certain U-shaped support plate 4 is loaded, the switching slide plate 24 corresponding to the U-shaped support plate 4 moves, so that the air inlet hole 27 corresponds to the first connecting hole 22, so that the adsorption chamber 20 is connected to the outside through the air pressure balance hole 26. Under the action of the air pressure difference, the outside air enters the adsorption chamber 20 to balance the pressure difference in the adsorption chamber 20, thereby eliminating the negative pressure adsorption effect on the circuit board, so that the circuit board on the U-shaped support plate 4 can be loaded normally, while the switching slide plates 24 on the remaining U-shaped support plates 4 remain stationary, and are still in the state where the conducting hole 25 is connected to the first connecting hole 22, so that the negative pressure environment in the negative pressure chamber 19 can act on the adsorption chamber 20. In order to ensure that the negative pressure environment in the adsorption chamber 20 can be smoothly formed, a negative pressure connecting hole 46 is opened at the other end of the switching slide plate 24, and the negative pressure connecting hole 46 is connected to the negative pressure chamber 19, so that the adsorption chamber 20 can form a stable negative pressure environment.

[0039] Furthermore, if Figures 1 to 8As shown, the switching slide 24 is located at one end of the negative pressure cavity 19 and is connected to an adjusting spring 28, and the adjusting spring 28 is connected to the material stacking box 3. The top surface of the switching slide 24 at one end of which the air pressure balance hole 26 is provided is provided with a wedge-shaped surface 29. A linear drive module 30 is vertically installed on the adjusting plate 2. The slide seat 31 of the linear drive module 30 is connected to the vertical pressing plate 32. The wedge-shaped surface 29 of the switching slide 24 is located on the moving path of the vertical pressing plate 32. The vertical pressing plate 32 is driven from top to bottom by the linear drive module 30, so that the vertical pressing plate 32 presses down the switching slide 24 one by one, and the material stacking box 3 is provided with a pressure balance hole 26. The loading method is also from top to bottom. The vertical downward pressing plate 32 acts on the wedge surface 29 of the switching slide 24. Under the guidance of the wedge surface 29, the switching slide 24 squeezes the adjusting spring 28 to move. When the side wall of the vertical downward pressing plate 32 contacts the end of the switching slide 24, the switching slide 24 moves into place. At this time, the air inlet 27 is connected to the first connecting hole 22, thereby balancing the air pressure in the adsorption chamber 20, thereby realizing the sequential loading of the circuit boards, and the loaded circuit boards cut off the negative pressure adsorption state, while the other circuit boards still maintain the negative pressure adsorption state, so as to maintain the positioning state of the circuit boards.

Claims

1. An integrated circuit component pin welding defect detection device, comprising a multi-degree-of-freedom conveying mechanism and a visual inspection mechanism, wherein the visual inspection mechanism is arranged within the conveying range of the multi-degree-of-freedom conveying mechanism, and is characterized in that: A material stacking mechanism and a positioning mechanism are also provided within the conveying range of the multi-degree-of-freedom conveying mechanism. The material stacking mechanism comprises a base (1), an adjustment plate (2) and a material stacking box (3). The material stacking box (3) is mounted on the adjustment plate (2). The top surface and one side wall of the material stacking box (3) are both opened. A plurality of U-shaped support plates (4) are provided in the material stacking box (3). The plurality of U-shaped support plates (4) are arranged at equal intervals along the height direction of the material stacking box (3). The U-shaped support plates (4) are arranged at equal intervals along the height direction of the material stacking box (3). The U-shaped opening faces the side wall opening of the stacking box (3); one end of the adjustment plate (2) away from the side wall opening of the stacking box (3) is spherically hinged on the base (1); one end of the adjustment plate (2) close to the side wall opening of the stacking box (3) is provided with a lifting assembly, the lifting assembly is used to lift the adjustment plate (2) to deflect around the hinge position to an inclined state, and the lifting position of the lifting assembly and the hinge position of the adjustment plate (2) are arranged along the diagonal position of the stacking box (3); The positioning mechanism comprises a positioning platform (5) and a positioning support assembly, two groups of the positioning support assemblies are arranged at intervals on the top surface of the positioning platform (5), the positioning support assembly comprises a plurality of support columns (6) arranged in a rectangular array, the axes of the support columns (6) are arranged vertically, and the support columns (6) are slidably arranged on the positioning platform (5); The top surface of the positioning platform (5) is provided with a mounting circular hole (7) at a position corresponding to the support column (6), an elastic rubber sleeve (8) is fixed in the mounting circular hole (7), the support column (6) is interference-fitted in the elastic rubber sleeve (8), and the side wall of the support column (6) is provided with a positioning scale along its own axial direction; The length of the support column (6) gradually increases along the center position close to the positioning platform (5); a limiting plate (9) is fixed at the bottom of the support column (6); a plurality of limiting teeth (10) are fixed at a position of the limiting plate (9) close to the side wall of the positioning platform (5); the plurality of limiting teeth (10) are arranged at equal intervals along the height direction of the limiting plate (9); a limiting gap is formed between two adjacent limiting teeth (10); a limiting slide plate (11) is correspondingly arranged for each row of the support columns (6); a plurality of limiting slide plates (11) are staggered along the height direction of the positioning platform (5); the limiting slide plates (11) are slidably arranged on the positioning platform (5); and the limiting slide plates (11) are stuck in the limiting gap of the support columns (6) of a corresponding row; A horizontal slide groove (12) is provided on the side wall of the positioning platform (5) at the position where the limiting slide plate (11) is arranged, and the horizontal slide groove (12) is connected to the corresponding mounting circular hole (7). The limiting slide plate (11) is slidably adapted to the horizontal slide groove (12), and a mounting cross plate (13) is fixed to one end of the limiting slide plate (11) away from the support column (6), and fixing bolts (14) are slidably penetrated at both ends of the mounting cross plate (13), and the fixing bolts (14) are threadedly connected to the positioning platform (5).

2. The device for detecting pin welding defects of integrated circuit components according to claim 1, characterized in that: A hinge column (15) is fixed on the top of the base (1), and a hinge ball (16) is fixed on the top of the hinge column (15). A spherical groove is opened at the bottom of the adjustment plate (2), and the hinge ball (16) is movably adapted in the spherical groove. The lifting component includes a lifting cylinder (17) and a spring (18). One set of diagonal positions of the adjustment plate (2) is connected to the spring (18), and the spring (18) is connected to the base (1). The cylinder body of the lifting cylinder (17) is installed on the base (1), and the telescopic shaft of the lifting cylinder (17) contacts the adjustment plate (2). The lifting cylinder (17) and the hinge ball (16) are arranged at another set of diagonal positions of the adjustment plate (2).

3. The device for detecting pin welding defects of integrated circuit components according to claim 2, characterized in that: A negative pressure cavity (19) is formed in one side wall of the stacking box (3), and the negative pressure cavity (19) is connected to a negative pressure pump via a negative pressure pipe. An adsorption cavity (20) is arranged in a side of the U-shaped support plate (4) close to the negative pressure cavity (19). An adsorption hole (21) is provided on the top surface of the U-shaped support plate (4), and the adsorption hole (21) is connected to the adsorption cavity (20). A first connecting hole (22) is provided on the inner wall of the stacking box (3) at a position connected to the U-shaped support plate (4). A second connecting hole (23) is provided on a side of the U-shaped support plate (4) close to the negative pressure cavity (19). Two ends of the first connecting hole (22) are respectively connected to the negative pressure cavity (19) and the second connecting hole (23), and the second connecting hole (23) is connected to the adsorption cavity (20).

4. The device for detecting pin welding defects of integrated circuit components according to claim 3, characterized in that: Each of the U-shaped support plates (4) is provided with a corresponding switching slide plate (24), the switching slide plate (24) being slidably fitted in the negative pressure cavity (19), a conducting hole (25) being provided through the side wall of the switching slide plate (24), one end of the switching slide plate (24) passing through the material stacking box (3) and provided with an air pressure balance hole (26), the air pressure balance hole (26) being not connected to the conducting hole (25), an air inlet hole (27) being provided on a side of the switching slide plate (24) close to the U-shaped support plate (4), the air inlet hole (27) being connected to the air pressure balance hole (26), the switching slide plate (24) adjusting the negative pressure state of the U-shaped support plate (4) by sliding, that is: When the conducting hole (25) is connected to the first connecting hole (22), the air inlet hole (27) contacts the inner wall of the material stacking box (3) and is in a blocked state, so that the U-shaped support plate (4) generates negative pressure to adsorb the PCB board; When the air inlet (27) is connected to the first connecting hole (22), the conducting hole (25) contacts the inner wall of the material stacking box (3) to be in a blocked state, allowing external air to enter the adsorption cavity (20) to balance the air pressure.

5. The device for detecting pin welding defects of integrated circuit components according to claim 4, characterized in that: The switching slide (24) is located at one end of the negative pressure cavity (19) and is connected to an adjusting spring (28), and the adjusting spring (28) is connected to the material stacking box (3). The top surface of the switching slide (24) at one end where the air pressure balance hole (26) is provided is provided with a wedge-shaped surface (29). A linear drive module (30) is vertically mounted on the adjusting plate (2), and a slide seat (31) of the linear drive module (30) is connected to a vertical pressing plate (32). The wedge-shaped surface (29) of the switching slide (24) is located on the moving path of the vertical pressing plate (32).

6. The device for detecting pin welding defects of integrated circuit components according to claim 1, characterized in that: The multi-degree-of-freedom conveying mechanism comprises a fixed frame (33) and two groups of clamping mechanisms, the two groups of clamping mechanisms are arranged on the fixed frame (33) at an interval from top to bottom, the clamping mechanism comprises a horizontal beam (34), a rectangular bottom plate (35) and a finger cylinder (36), the horizontal beam (34) is slidably arranged on the fixed frame (33), the rectangular bottom plate (35) is slidably arranged at the bottom of the horizontal beam (34), the moving direction of the horizontal beam (34) is perpendicular to the moving direction of the rectangular bottom plate (35), a height adjustment cylinder (45) is vertically installed on the rectangular bottom plate (35), the finger cylinder (36) is located below the rectangular bottom plate (35), the telescopic shaft of the height adjustment cylinder (45) passes through the rectangular bottom plate (35) and is connected to the cylinder body of the finger cylinder (36), and the inner sides of the two clamping claws of the finger cylinder (36) are connected to clamping sheets (37).

7. The device for detecting soldering defects of integrated circuit component pins according to claim 6, characterized in that: A transverse mounting groove (38) is provided through the position where the clamping mechanism is provided on the fixing frame (33), a first lead screw (39) is rotatably provided in the transverse mounting groove (38), the horizontal beam (34) is threadedly sleeved on the first lead screw (39), a first motor (40) is installed on the fixing frame (33), an output shaft of the first motor (40) is drivingly connected to the first lead screw (39), a longitudinal mounting groove (41) is provided at the bottom of the horizontal beam (34), a second lead screw (42) is rotatably provided in the longitudinal mounting groove (41), a lead screw slider (43) is threadedly sleeved on the second lead screw (42), the lead screw slider (43) is slidably adapted to the longitudinal mounting groove (41), the rectangular bottom plate (35) is installed on the lead screw slider (43), a second motor (44) is installed at one end of the horizontal beam (34), an output shaft of the second motor (44) is drivingly connected to the second lead screw (42).

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