Ultrasonic testing equipment for semiconductor defect detection

Abstract

The present invention relates to the field of semiconductor detection technology, and discloses: an ultrasonic detection device for semiconductor defect detection, comprising: a box body, a barrel body, a fixed component, a rotating component and a lifting component, the surface of the box body is fixedly connected with a control button, the inner wall of the box body is fixedly connected with an ultrasonic component, the inside of the box body is fixedly connected with the barrel body, the inside of the box body is provided with a fixed component, the inside of the barrel body is provided with a driving component, a rotating component and a lifting component, through the coordinated use of an air supply pipe and a fixed plate, an external gas source is connected with the air supply pipe, and then the external gas is transported to the inside of the air supply cylinder through the air supply pipe, thereby driving the fixed cylinder to move, and the fixed cylinder drives the fixed plate to contact with the semiconductor through a sliding cylinder, when the fixed plate continues to squeeze the semiconductor, the fixed plate squeezes the spring through the sliding cylinder to retract the spring, thereby preventing the fixed plate from damaging the semiconductor, thereby achieving a lossless fixation effect.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor detection technology, and in particular to an ultrasonic detection device for semiconductor defect detection. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors refer to materials whose electrical conductivity is controllable, ranging from insulators to conductors. From the perspective of science, technology and economic development, semiconductors affect people's daily work and life. Ultrasonic scanning is a very important means of detecting defects such as solder delamination, voids, and cracks inside semiconductor devices. Ultrasonic testing is a non-destructive testing technology that uses the reflection, refraction and scattering phenomena generated when ultrasonic waves propagate inside the material to detect defects such as defects, cracks, bubbles, and voids inside the material. Ultrasonic testing can provide high-resolution images, detect micron-level defects, and is harmless to the human body.

[0003] Publication No. CN117233265B is an ultrasonic defect detection device for semiconductors. The ultrasonic defect detection device for semiconductors includes a stacking component, an installation docking component, a detection component, a receiving component, a flipping component and a re-inspection component. The present invention realizes the safe transmission of semiconductors, efficient grasping and transfer, and can adapt to semiconductors of different sizes for stable fixation, which helps to obtain more accurate detection results more easily in the subsequent detection process, effectively ensures the stability of the position and posture of the semiconductor, reduces the detection error, and improves the reliability of the detection. At the same time, it realizes the stable positioning of the semiconductor and ultrasonic non-destructive testing, and improves the accuracy and efficiency of the detection through adaptive receiving devices and adjustment of the incident angle, thereby jointly ensuring high-quality detection of semiconductors.

[0004] Although the above patents and the prior art can ensure the stability of the position and posture of the semiconductor, reduce the detection error, improve the reliability of detection, and realize stable positioning of the semiconductor and ultrasonic non-destructive testing, and improve the accuracy and efficiency of detection by means of adaptive receiving devices and adjustment of the incident angle, it is easy to cause damage to the semiconductor when the semiconductor is fixed, and when adjusting the direction, manual adjustment is adopted to adjust the receiver and the transmitter by rotating the corresponding rotating column, which is more troublesome to operate, and when it is necessary to detect the clamping surfaces on both sides of the semiconductor, since the semiconductor is in a suspended state, the semiconductor is easy to fall when the clamping surfaces on both sides of the semiconductor are detected, thereby causing damage to the semiconductor. Therefore, we propose an ultrasonic detection device for semiconductor defect detection. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the shortcomings of the prior art, the present invention provides an ultrasonic detection equipment for semiconductor defect detection, which has the advantages of non-destructive fixation, convenient angle adjustment and prevention of falling damage, etc., and solves the problem that the semiconductor is easily damaged when it is fixed. When adjusting the direction, manual adjustment is adopted, and the receiver and the transmitter are adjusted by rotating the corresponding rotating columns, which is relatively troublesome to operate. In addition, when it is necessary to detect the clamping surfaces on both sides of the semiconductor, since the semiconductor is in a suspended state, the semiconductor is easy to fall when the clamping surfaces on both sides of the semiconductor are detected, thereby causing the problem of semiconductor damage.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purposes of lossless fixation, convenient angle adjustment and prevention of falling damage, the present invention provides the following technical solutions: an ultrasonic detection equipment for semiconductor defect detection, comprising: a box body, a barrel body, a fixed component, a rotating component and a lifting component, the surface of the box body is fixedly connected with a control button, the inner wall of the box body is fixedly connected with an ultrasonic component, the interior of the box body is fixedly connected with the barrel body, the interior of the box body is provided with a fixed component, the interior of the barrel body is provided with a driving component, a rotating component and a lifting component, the interior of the driving component is provided with a switching component, the fixed component has a function of fixing the semiconductor, the driving component has a function of providing power for the rotation of the rotating component and the lifting of the lifting component, the rotating component has a function of rotating the fixed component, and then rotating the semiconductor through the fixed component, and the lifting component has a function of preventing the semiconductor from falling when detecting both sides of the semiconductor.

[0009] Furthermore, an annular groove and a limiting groove are provided inside the barrel body, a sliding rod is slidably connected inside the annular groove, a disc is fixedly connected to the surface of the sliding rod, the annular groove facilitates the sliding of the sliding rod, the sliding rod supports the disc, and the disc clamps the lifting platform.

[0010] Furthermore, the fixing assembly includes a support plate fixedly connected to the inside of the box body, the support plate is rotatably connected to a gas cylinder inside, one end of the gas cylinder is rotatably connected to a gas pipe, the inside of the gas cylinder is slidably connected to a fixed cylinder via a first key groove, the inside of the fixed cylinder is fixedly connected to a spring, the inside of the fixed cylinder is slidably connected to a slide cylinder via a second key groove, one end of the slide cylinder is fixedly connected to one end of the spring, and the end of the slide cylinder away from the spring is fixedly connected to the fixing plate, the support plate has the function of facilitating the rotation of the gas cylinder, the gas pipe has the function of conveying gas to and extracting gas from the inside of the gas cylinder, thereby driving the fixed cylinder to move left and right, the fixed cylinder has the function of driving the slide cylinder to move left and right, the slide cylinder has the function of driving the fixed plate to move left and right, the fixed plate has the function of fixing the semiconductor, and the spring has the function of preventing the slide cylinder from excessive movement.

[0011] Furthermore, the driving assembly includes a motor fixedly connected to the bottom wall of the barrel body, the output end of the motor is fixedly connected to a worm, the surface of the worm is provided with a conductive tube and a first driving sprocket, the top of the worm is provided with an insertion groove, the surface of the worm is provided with a plurality of limiting holes, the motor has the function of driving the worm to rotate, the worm has the function of driving the first driving sprocket to rotate, the first driving sprocket has the function of driving the lifting assembly to operate, and the insertion groove has the function of placing an insertion block.

[0012] Furthermore, the rotating assembly includes a rotating rod rotatably connected to the inside of the box and a second driven sprocket fixedly connected to the surface of the air cylinder, a worm wheel and a second driving sprocket are fixedly connected to the surface of the rotating rod, the worm wheel and the worm are meshed for transmission, the second driving sprocket and the second driven sprocket are transmitted via a second chain, the worm wheel has the function of driving the rotating rod to rotate, the rotating rod has the function of driving the second driving sprocket to rotate, the second driving sprocket has the function of driving the second driven sprocket to rotate via the second chain, and the second driven sprocket has the function of driving the air cylinder to rotate.

[0013] Furthermore, the lifting assembly includes a screw rotatably connected to the inside of the barrel body, a first driven sprocket is fixedly connected to the surface of the screw, the first driven sprocket and the first driving sprocket are transmitted by a first chain, a screw barrel is threadedly connected to the surface of the screw, a sliding bar is fixedly connected to the surface of the screw barrel, the sliding bar is slidably connected to the inside of the limiting groove, the first driven sprocket has the function of driving the screw to rotate, the screw has the function of driving the screw barrel to move up and down, the sliding bar has the function of assisting the screw barrel to move up and down, and the screw barrel has the function of driving the lifting platform to move up and down.

[0014] Furthermore, the lifting assembly also includes a lifting platform clamped in the inside of the disc, a first magnetic block is embedded in the bottom of the lifting platform, an insertion block is fixedly connected to the bottom of the lifting platform, the shape of the insertion block is adapted to the shape of the insertion slot, and a limit plate is fixedly connected to the top of the lifting platform. The lifting platform has the function of supporting the semiconductor, the first magnetic block has the function of connecting the screw barrel, the insertion block has the function of connecting the worm, and the limit plate has the function of preventing the semiconductor from shaking.

[0015] Furthermore, the switching component includes a slide groove opened inside the first active sprocket, an electromagnetic ring is fixedly connected inside the slide groove, the surface of the electromagnetic ring is in contact with the outer surface of the conductive tube, a second magnetic block is fixedly connected inside the slide groove, an end surface of the second magnetic block away from the electromagnetic ring is fixedly connected to a limiting rod, the shape of the limiting rod is adapted to the shapes of a plurality of limiting holes, the slide groove facilitates the movement of the second magnetic block and fixes the electromagnetic ring, the electromagnetic ring drives the second magnetic block to move, the second magnetic block drives the limiting rod to move, and the limiting rod connects to the worm.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the present invention provides an ultrasonic testing device for semiconductor defect detection, which has the following beneficial effects:

[0018] 1. The ultrasonic detection equipment for semiconductor defect detection connects the external gas source with the gas pipe through the coordinated use of the gas pipe and the fixed plate, and then transmits the external gas to the inside of the gas cylinder through the gas pipe, thereby driving the fixed cylinder to move. The fixed cylinder drives the fixed plate to contact the semiconductor through the sliding cylinder. When the fixed plate continues to squeeze the semiconductor, the fixed plate squeezes the spring through the sliding cylinder to retract the spring, thereby preventing the fixed plate from damaging the semiconductor, thereby achieving a lossless fixation effect.

[0019] 2. The ultrasonic detection equipment for semiconductor defect detection starts the motor through the coordinated use of the driving component and the rotating component. The motor drives the worm wheel to rotate through the worm, and the worm wheel drives the second active sprocket to rotate through the rotating rod. The second active sprocket drives the second driven sprocket to rotate through the second chain, so that the air cylinder drives the fixed plate to rotate through the fixed cylinder and the sliding cylinder, and then the fixed plate drives the semiconductor to rotate, so that the surface of the semiconductor is aligned with the ultrasonic component, which makes it easier for the ultrasonic component to detect the semiconductor, thereby achieving the effect of convenient angle adjustment.

[0020] 3. The ultrasonic detection equipment for semiconductor defect detection, through the coordinated use of the driving component and the lifting component, energizes the conductive cylinder, so that the electromagnetic ring generates a magnetic force that repels the second magnetic block, and then the electromagnetic ring drives the second magnetic block to move, so that the limit rod enters the limit hole, and then starts the motor, the motor drives the first active sprocket to rotate through the worm, the first active sprocket drives the first driven sprocket to rotate through the first chain, so that the screw drives the screw barrel to move upward, and then the semiconductor is placed through the fixing component, so that the semiconductor enters the top of the lifting platform and is located in the middle of the two limit plates, so that the semiconductor will not fall directly onto the lifting platform, thereby achieving the effect of preventing falling damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the internal three-dimensional structure of the box body of the present invention;

[0023] Figure 3 This is a schematic diagram of the internal three-dimensional structure of the barrel of the present invention;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the interior of the barrel of the present invention from another perspective;

[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of the driving component of the present invention;

[0026] Figure 6 It is a schematic diagram of the three-dimensional structure of the rotating assembly of the present invention;

[0027] Figure 7 It is a schematic diagram of the three-dimensional structure of the fixing assembly of the present invention;

[0028] Figure 8 It is a schematic diagram of the cross-sectional three-dimensional structure of the fixing tube of the present invention;

[0029] Fig. 9 It is a schematic diagram of the three-dimensional structure of the lifting assembly of the present invention;

[0030] Fig.10 It is a schematic diagram of the three-dimensional structure of the lifting platform of the present invention;

[0031] Fig.11 It is a schematic diagram of the three-dimensional structure of the barrel body of the present invention;

[0032] Fig.12 It is a schematic diagram of the sectional three-dimensional structure of the first driving sprocket of the present invention.

[0033] In the figure: 1, box body; 11, control button; 12, ultrasonic component; 13, barrel body; 131, annular groove; 132, limit groove; 14, disc; 141, slide bar; 2, fixed component; 21, support plate; 22, gas cylinder; 221, gas pipe; 23, fixed cylinder; 231, spring; 232, slide cylinder; 233, fixed plate; 3, driving component; 31, motor; 32, worm; 321, conductive cylinder; 322, first driving sprocket; 323, first chain; 324, insertion slot; 4, rotating assembly; 41, rotating rod; 411, worm gear; 412, second driving sprocket; 413, second chain; 42, second driven sprocket; 5, lifting assembly; 51, screw rod; 511, first driven sprocket; 512, screw barrel; 513, slide bar; 52, lifting platform; 521, limit plate; 522, first magnetic block; 523, insertion block; 6, switching assembly; 61, slide slot; 611, electromagnetic ring; 62, second magnetic block; 621, limit rod. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] For specific embodiment 1, please refer to Figures 1 to 8 , an ultrasonic testing device for semiconductor defect detection, comprising: a box body 1, a barrel body 13, a fixed component 2, a rotating component 4 and a lifting component 5, a control button 11 is fixedly connected to the surface of the box body 1, the barrel body 13 is fixedly connected to the inside of the box body 1, a fixed component 2 is arranged inside the box body 1, a driving component 3, a rotating component 4 and a lifting component 5 are arranged inside the barrel body 13, a switching component 6 is arranged inside the driving component 3, the fixed component 2 has the function of fixing the semiconductor, the driving component 3 has the function of providing power for the rotation of the rotating component 4 and the lifting of the lifting component 5, the rotating component 4 has the function of rotating the fixed component 2, and then rotating the semiconductor through the fixed component 2, and the lifting component 5 has the function of preventing the semiconductor from being damaged when detecting both sides of the semiconductor. To achieve the function of conductor falling, an annular groove 131 and a limiting groove 132 are provided inside the barrel body 13, a sliding rod 141 is slidably connected inside the annular groove 131, a disc 14 is fixedly connected to the surface of the sliding rod 141, a fixing assembly 2 comprises a supporting plate 21 fixedly connected inside the box body 1, a gas cylinder 22 is rotatably connected inside the supporting plate 21, one end of the gas cylinder 22 is rotatably connected to a gas pipe 221, a fixing cylinder 23 is slidably connected inside the gas cylinder 22 through a first key groove, a spring 231 is fixedly connected inside the fixing cylinder 23, a sliding cylinder 232 is slidably connected inside the fixing cylinder 23 through a second key groove, one end of the sliding cylinder 232 is fixedly connected to one end of the spring 231, and one end of the sliding cylinder 232 away from the spring 231 is fixedly connected to a fixing plate 233;

[0036] It should be noted that a solenoid valve is provided on the surface of the gas delivery pipe 221, a suction pump is provided at one end of the gas delivery pipe 221, and the solenoid valve is electrically connected to the control button 11, and the switch and closing of the solenoid valve are controlled by the control button 11, thereby realizing the control of the gas inside the gas delivery cylinder 22, and the deformation force of the spring 231 is smaller than the hardness of the semiconductor, thereby not damaging the semiconductor, and although the gas delivery cylinder 22 and the fixed cylinder 23 are both slidingly connected, the connection between the gas delivery cylinder 22 and the fixed cylinder 23 fits tightly, so there will be no gas leakage, and the opposite surfaces of the two fixed plates 233 are provided with rubber layers, and the rubber layers can effectively prevent the fixed plates 233 from squeezing the semiconductor;

[0037] The external gas source is connected to the gas delivery pipe 221, and then the external gas is delivered to the inside of the gas delivery cylinder 22 through the gas delivery pipe 221, thereby driving the fixed cylinder 23 to move, and the fixed cylinder 23 drives the fixed plate 233 to contact the semiconductor through the slide cylinder 232. When the fixed plate 233 continues to squeeze the semiconductor, the fixed plate 233 squeezes the spring 231 through the slide cylinder 232, so that the spring 231 retracts, thereby preventing the fixed plate 233 from damaging the semiconductor;

[0038] For specific embodiment 2, please refer to Figures 1 to 6 According to the ultrasonic detection device for semiconductor defect detection provided in the specific embodiment 1, this embodiment provides a further technical solution:

[0039] The inner wall of the box body 1 is fixedly connected to the ultrasonic component 12, the driving component 3 includes a motor 31 fixedly connected to the bottom wall of the barrel body 13, the output end of the motor 31 is fixedly connected to the worm 32, the surface of the worm 32 is provided with a conductive tube 321 and a first driving sprocket 322, and the surface of the worm 32 is provided with a plurality of limiting holes, the rotating component 4 includes a rotating rod 41 rotatably connected to the inside of the box body 1 and a second driven sprocket 42 fixedly connected to the surface of the gas cylinder 22, the surface of the rotating rod 41 is fixedly connected to a worm wheel 411 and a second driving sprocket 412, the worm wheel 411 and the worm 32 are meshed for transmission, and the second driving sprocket 412 and the second driven sprocket 42 are transmitted through a second chain 413;

[0040] It should be noted that the ultrasonic component 12 includes electronic components such as an ultrasonic transmitter and an ultrasonic receiver. The ultrasonic transmitter emits ultrasonic waves to detect the inside of the semiconductor. After the detection is completed, the ultrasonic receiver receives the internal situation of the semiconductor and then provides feedback.

[0041] The motor 31 is started, and the motor 31 drives the worm wheel 411 to rotate through the worm 32. The worm wheel 411 drives the second driving sprocket 412 to rotate through the rotating rod 41. The second driving sprocket 412 drives the second driven sprocket 42 to rotate through the second chain 413, so that the air delivery cylinder 22 drives the fixing plate 233 to rotate through the fixing cylinder 23 and the sliding cylinder 232, and then the fixing plate 233 drives the semiconductor to rotate, so that the surface of the semiconductor is aligned with the ultrasonic component 12, so that the ultrasonic component 12 can detect the semiconductor;

[0042] For specific embodiment 3, please refer to Figures 1 to 12 According to the ultrasonic detection device for semiconductor defect detection provided in the second specific embodiment, this embodiment provides a further technical solution:

[0043] The lifting assembly 5 includes a screw rod 51 rotatably connected to the inside of the barrel 13, a first driven sprocket 511 is fixedly connected to the surface of the screw rod 51, the first driven sprocket 511 and the first driving sprocket 322 are driven by a first chain 323, a screw barrel 512 is threadedly connected to the surface of the screw rod 51, a slide bar 513 is fixedly connected to the surface of the screw barrel 512, and the slide bar 513 is slidably connected to the inside of the limit groove 132. The lifting assembly 5 also includes a lifting platform 52 clamped inside the disc 14, and the bottom of the lifting platform 52 is embedded with There is a first magnetic block 522, the top of the lifting platform 52 is fixedly connected to the limit plate 521, the switching component 6 includes a slide groove 61 opened inside the first active sprocket 322, the inside of the slide groove 61 is fixedly connected to the electromagnetic ring 611, the surface of the electromagnetic ring 611 is in contact with the outer surface of the conductive cylinder 321, the inside of the slide groove 61 is fixedly connected to the second magnetic block 62, the surface of one end of the second magnetic block 62 away from the electromagnetic ring 611 is fixedly connected to the limit rod 621, and the shape of the limit rod 621 is adapted to the shape of the plurality of limit holes;

[0044] It should be noted that the insertion block 523 at the bottom of the lifting platform 52 is separated from the insertion slot 324 in the initial state, and after the motor 31 drives the fixing component 2 to rotate and the lifting platform 52 rises, the semiconductor and the limit plate 521 are on the same horizontal plane, and a rubber layer is provided on the top of the lifting platform 52, which can prevent the semiconductor from directly contacting the lifting platform 52 and provide friction for the semiconductor to move, thereby preventing the semiconductor from moving during the rotation of the lifting platform 52;

[0045] The conductive cylinder 321 is energized to make the electromagnetic ring 611 generate a magnetic force that repels the second magnetic block 62, so that the electromagnetic ring 611 drives the second magnetic block 62 to move, so that the limiting rod 621 enters the limiting hole, and then the motor 31 is started. The motor 31 drives the first active sprocket 322 to rotate through the worm 32, and the first active sprocket 322 drives the first driven sprocket 511 to rotate through the first chain 323, so that the screw 51 drives the screw cylinder 512 to move upward, and then the semiconductor is placed through the fixing component 2, so that the semiconductor enters the top of the lifting platform 52 and is located in the middle of the two limiting plates 521, so that the semiconductor will not fall directly onto the lifting platform 52, thereby avoiding damage to the semiconductor;

[0046] For specific example 4, please refer to Figures 1 to 10 According to the ultrasonic detection device for semiconductor defect detection provided in the specific embodiment 3, this embodiment provides a further technical solution:

[0047] An insertion slot 324 is formed at the top of the worm 32, and an insertion block 523 is fixedly connected to the bottom of the lifting platform 52, and the shape of the insertion block 523 matches the shape of the insertion slot 324;

[0048] The motor 31 drives the lifting platform 52 to rotate through the worm 32 and the insert block 523, and the lifting platform 52 drives the disc 14 to rotate, so that the slide bar 141 rotates in the annular groove 131, and then the semiconductor on the top of the lifting platform 52 rotates, so that the two sides of the semiconductor face the ultrasonic component 12 respectively, so that the ultrasonic component 12 can detect the semiconductor.

[0049] Working principle: When in use, connect the external gas source with the gas pipe 221, and deliver the gas to the inside of the gas pipe 221 through the suction pump. The solenoid valve is controlled to open by the control button 11, and then the gas is delivered to the inside of the gas cylinder 22, so that the gas drives the fixed cylinder 23 to move. The fixed cylinder 23 drives the fixed plate 233 to contact the semiconductor through the slide cylinder 232, so that the fixed plate 233 fixes the semiconductor. When the fixed plate 233 continues to squeeze the semiconductor, the fixed plate 233 squeezes the spring 231 through the slide cylinder 232, so that the spring 231 retracts, and the slide cylinder 232 is stored in the fixed cylinder 23, so as to prevent the fixed plate 233 from damaging the semiconductor. When the semiconductor needs to be tested, the motor 31 is started by the control button 11, and the motor 3 The worm 32 drives the worm wheel 411 to rotate, the worm wheel 411 drives the second active sprocket 412 to rotate through the rotating rod 41, the second active sprocket 412 drives the second driven sprocket 42 to rotate through the second chain 413, so that the gas delivery cylinder 22 drives the fixed cylinder 23 to rotate through the first key groove, the fixed cylinder 23 drives the slide cylinder 232 to rotate through the second key groove, so that the slide cylinder 232 drives the fixed plate 233 to rotate, and then the fixed plate 233 drives the semiconductor to rotate, so that the surface, top, back and bottom of the semiconductor are respectively aligned with the ultrasonic component 12, so that the ultrasonic component 12 can detect the semiconductor. When it is necessary to detect both sides of the semiconductor, the conductive cylinder 321 is energized through the control button 11, so that the electromagnetic ring 611 generates a magnetic field with the second magnetic block 611. 2 repulsive magnetic forces, thereby causing the electromagnetic ring 611 to drive the second magnetic block 62 to move, and the second magnetic block 62 drives the limiting rod 621 to move, so that the limiting rod 621 enters the limiting hole on the surface of the worm 32, and then the motor 31 is started by the control button 11, and the motor 31 drives the first active sprocket 322 to rotate through the worm 32, and the first active sprocket 322 drives the first driven sprocket 511 to rotate through the first chain 323, and the first driven sprocket 511 drives the screw rod 51 to rotate, so that the screw rod 51 drives the screw barrel 512 to move upward, and the slide bar 513 slides inside the limiting groove 132, and then the gas inside the gas delivery cylinder 22 is slowly extracted through the suction pump and the gas delivery pipe 221, so that the fixed cylinder 23 returns to the initial position, thereby driving the slide barrel 232 and the fixed cylinder 23 to rotate. The fixed plate 233 moves to separate the fixed plate 233 assembly from the semiconductor. As the semiconductor gradually loses the support of the fixed plate 233, the semiconductor enters the top of the lifting platform 52 and is located in the middle of the two limit plates 521, so that the semiconductor will not fall directly onto the lifting platform 52, thereby avoiding the semiconductor from instantly contacting the lifting platform 52, thereby causing damage to the semiconductor. When it is necessary to inspect both sides of the semiconductor, the motor 31 is reversed by controlling the control button 11. The motor 31 drives the first active sprocket 322 to rotate through the worm 32. The first active sprocket 322 drives the first driven sprocket 511 to rotate through the first chain 323. The first driven sprocket 511 drives the screw 51 to rotate, so that the screw 51 drives the screw barrel 512 to move downward.Then, the insertion block 523 at the bottom of the lifting platform 52 enters the insertion groove 324, and then the control button 11 is used to control the motor 31 to start, and the conductive tube 321 is powered off, so that the electromagnetic ring 611 loses its magnetism. Since the electromagnetic ring 611 loses its magnetism, the second magnetic block 62 is adsorbed with the electromagnetic ring 611, and the electromagnetic ring 611 drives the second magnetic block 62 to move, and the second magnetic block 62 drives the limit rod 621 to move, so that the limit rod 621 is away from the limit hole on the surface of the worm 32, and then the motor 31 drives the lifting platform 52 to rotate through the worm 32 and the insertion block 523, and the lifting platform 52 drives the disk 14 to rotate, so that the slide bar 141 rotates in the annular groove 131, and then the semiconductor on the top of the lifting platform 52 rotates, and then the two sides of the semiconductor face the ultrasonic component 12 respectively, so that the ultrasonic component 12 can detect the semiconductor, thereby performing a full range of detection on the semiconductor to avoid the occurrence of incomplete detection.

Claims

1. An ultrasonic testing device for semiconductor defect detection, comprising: A box body (1), a barrel body (13), a fixed component (2), a rotating component (4) and a lifting component (5), characterized in that: a control button (11) is fixedly connected to the surface of the box body (1), an ultrasonic component (12) is fixedly connected to the inner wall of the box body (1), the barrel body (13) is fixedly connected to the inside of the box body (1), a fixed component (2) is arranged inside the box body (1), a driving component (3), a rotating component (4) and a lifting component (5) are arranged inside the barrel body (13), a switching component (6) is arranged inside the driving component (3), an annular groove (131) and a limiting groove (132) are opened inside the barrel body (13), and the inside of the annular groove (131) is slidably connected to the inside of the annular groove (131). A slide bar (141) is provided, the surface of the slide bar (141) is fixedly connected to a disk (14), the fixed assembly (2) comprises a support plate (21) fixedly connected to the inside of the box body (1), the inside of the support plate (21) is rotatably connected to a gas cylinder (22), one end of the gas cylinder (22) is rotatably connected to a gas pipe (221), the inside of the gas cylinder (22) is slidably connected to a fixed cylinder (23) via a first key groove, the inside of the fixed cylinder (23) is fixedly connected to a spring (231), the inside of the fixed cylinder (23) is slidably connected to a slide cylinder (232) via a second key groove, one end of the slide cylinder (232) is fixedly connected to one end of the spring (231), and the slide cylinder (232) is away from the spring ( The driving assembly (3) comprises a motor (31) fixedly connected to the bottom wall of the barrel (13), the output end of the motor (31) being fixedly connected to a worm (32), the surface of the worm (32) being provided with a conductive cylinder (321) and a first active sprocket (322), the top of the worm (32) being provided with an insertion groove (324), the surface of the worm (32) being provided with a plurality of limiting holes, the rotating assembly (4) comprising a rotating rod (41) rotatably connected to the inside of the box (1) and a second driven sprocket (42) fixedly connected to the surface of the gas delivery cylinder (22), the surface of the rotating rod (41) being fixedly connected to a worm wheel (411) and a second active sprocket ( 412), the worm wheel (411) is meshed with the worm (32) for transmission, the second driving sprocket (412) and the second driven sprocket (42) are transmitted via a second chain (413), the lifting assembly (5) comprises a screw (51) rotatably connected to the inside of the barrel (13), the surface of the screw (51) is fixedly connected to the first driven sprocket (511), the first driven sprocket (511) and the first driving sprocket (322) are transmitted via a first chain (323), the surface of the screw (51) is threadedly connected to a screw barrel (512), the surface of the screw barrel (512) is fixedly connected to a slide bar (513), and the slide bar (513) is slidably connected to the inside of the limiting groove (132),The lifting assembly (5) further comprises a lifting platform (52) clamped inside the disc (14); a first magnetic block (522) is embedded in the bottom of the lifting platform (52); an insertion block (523) is fixedly connected to the bottom of the lifting platform (52); the shape of the insertion block (523) is adapted to the shape of the insertion slot (324); and a limiting plate (521) is fixedly connected to the top of the lifting platform (52); The switching assembly (6) comprises a slide groove (61) provided inside the first driving sprocket (322), an electromagnetic ring (611) being fixedly connected inside the slide groove (61), a surface of the electromagnetic ring (611) being in contact with an outer surface of the conductive cylinder (321), a second magnetic block (62) being fixedly connected inside the slide groove (61), a limiting rod (621) being fixedly connected to a surface of one end of the second magnetic block (62) away from the electromagnetic ring (611), and a shape of the limiting rod (621) being adapted to a shape of a plurality of limiting holes; The fixing component (2) has the function of fixing the semiconductor; the driving component (3) provides power for the rotation of the rotating component (4) and the lifting of the lifting component (5); the rotating component (4) rotates the fixing component (2), thereby rotating the semiconductor through the fixing component (2); the lifting component (5) has the function of preventing the semiconductor from falling when inspecting both sides of the semiconductor.

Images