A DSP EFEM automatic sampling inspection method, system, medium and product

Abstract

The present application discloses a DSP EFEM automatic sampling inspection method, system, medium, and product, relating to the field of semiconductor manufacturing and packaging testing. The system includes: a DSP EFEM control system, a first robot, a second robot, and a detection device. The DSP EFEM control system controls the first robot and the second robot to transfer one wafer to be sampled from a first unloading buffer unit to a transfer unit, and then transfer the wafer from the transfer unit to a sampling loading unit. After the transfer is completed, the wafer to be sampled on the sampling loading unit is inspected by the detection device. After the inspection is completed, the DSP EFEM control system controls the first robot and the second robot to transfer one wafer to be sampled from the sampling loading unit to the transfer unit, and then transfer the wafer from the transfer unit to the second unloading buffer unit. The present application avoids wafer damage caused by manual operation, improves efficiency, and saves labor costs.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing and packaging testing, and in particular to a DSP EFEM automatic sampling inspection method, system, medium and product. Background Art

[0002] In the field of semiconductor manufacturing and packaging testing, wafer manufacturing is one of the core links, and its quality directly determines the performance and reliability of the final product. In the wafer manufacturing process, double-sided grinding and polishing equipment (DSP) is a key process and plays a vital role in improving the surface flatness of the wafer and reducing the surface roughness. However, in the DSP production process, the polished wafers need to be automatically unloaded by the DSP EFEM (Equipment Front End Modules) equipment into the unloading port frame in a pure water environment for random testing to ensure that their quality meets the standards.

[0003] With the rapid development of semiconductor technology, the requirements for wafer manufacturing are increasing. Even slight variations in wafer surface quality can significantly impact chip performance. Therefore, random inspections of polished wafers have become an essential quality control measure. Traditional random inspections often rely on manual labor, which is not only inefficient but also susceptible to human factors, leading to unstable and uncertain inspection results.

[0004] In view of the above problems, the present invention aims to solve the technical problems in the prior art of low manual operation efficiency, easy contamination and damage, and unstable results in the wafer sampling process. Summary of the Invention

[0005] The purpose of this application is to provide a DSP EFEM automatic sampling inspection method, system, medium and product, which can improve the sampling inspection efficiency, reduce the impact of human factors on the sampling inspection results, and reduce the risk of contamination and damage to wafers during the sampling inspection process, thereby ensuring the stability and reliability of wafer quality.

[0006] To achieve the above objectives, this application provides the following solutions:

[0007] In a first aspect, the present application provides a subject DSP EFEM automatic sampling inspection system, comprising:

[0008] DSP EFEM control system, first robot, second robot and detection equipment;

[0009] The DSP EFEM control system is connected to the first robot and the second robot respectively; the first robot and the second robot are arranged in the DSP EFEM device, and the DSP EFEM device includes a production execution system, a first material unloading buffer unit, a transfer unit, a sampling loading unit, and a second material unloading buffer unit;

[0010] The DSP EFEM control system is also connected to the production execution system and the detection equipment respectively, and is used to control the first robot and the second robot to transfer I wafers to be sampled one by one from the first unloading buffer unit to the transfer unit according to the sampling inspection start instruction sent by the production execution system, and then transfer them from the transfer unit to the sampling inspection loading unit, and generate a wafer removal signal after the transfer is completed and send it to the detection equipment, where I is the number of wafers to be sampled;

[0011] The detection device is used to detect the wafers to be inspected on the inspection loading unit according to the received wafer removal signal, and generate a detection completion signal after the detection is completed;

[0012] The sampling inspection loading unit is used to place wafers to be sampled and wafers that have been inspected;

[0013] The second unloading buffer unit is used to place the wafers that have completed inspection and are returned from the sampling loading unit;

[0014] The DSP EFEM control system is also used to control the first robot and the second robot to transfer I wafers that have completed inspection one by one from the sampling loading unit to the transfer unit according to the received inspection completion signal, and then transfer them from the transfer unit to the second unloading cache unit.

[0015] Optionally, the DSP EFEM automatic sampling inspection system further includes: a sensing module, the sensing module being connected to the DSP EFEM control system;

[0016] The sensing module is provided on the transfer unit, and is used to determine whether a wafer is placed in the transfer unit and generate a transfer signal;

[0017] The DSP EFEM control system is also used to control the first robot to return to the first origin position, or control the second robot to return to the second origin position according to the received transfer signal, wherein the first origin position is any position whose distance from the first unloading cache unit does not exceed a preset threshold, and the second origin position is any position whose distance from the sampling loading unit does not exceed a preset threshold.

[0018] Optionally, the DSP EFEM automatic sampling inspection system further includes: a first position sensor and a second position sensor, both of which are connected to the DSP EFEM control system;

[0019] The first position sensor is provided on the first robot, and is used to monitor the position information of the first robot in real time, and to generate a first origin signal when the first robot is located at the first origin position;

[0020] The second position sensor is provided on the second robot, and is used for monitoring the position information of the second robot in real time, and generating a second origin signal when the second robot is located at the second origin position;

[0021] The DSP EFEM control system is also used to control the second robot to move to the transfer unit or the sampling loading unit according to the received first origin signal; and control the first robot to move to the first unloading buffer unit or the transfer unit according to the received second origin signal.

[0022] Optionally, the second blanking cache unit is also used to place the remaining wafers in the first blanking cache unit.

[0023] In a second aspect, the present application provides a DSP EFEM automatic sampling method, comprising:

[0024] Remove the wafers, obtain the number of wafers to be inspected I according to the received inspection start instruction, and control the first robot to transfer the i-th wafer to be inspected from the first unloading buffer unit to the transfer unit, and then control the second robot to transfer the i-th wafer to be inspected from the transfer unit to the inspection loading unit, and repeat the above process until i = I, where i = 1, 2, 3...I;

[0025] Detect wafers. When receiving the wafer removal signal, control the detection equipment to detect the wafers to be inspected;

[0026] Put the wafer back. When the inspection completion signal is received, control the second robot to transfer the i-th wafer that has completed inspection from the sampling loading unit to the transfer unit, and then the first robot transfers the i-th wafer that has completed inspection from the transfer unit to the second unloading cache unit. Repeat the above process until i=I, and the sampling inspection ends.

[0027] Optionally, the wafer removal step specifically includes:

[0028] According to the sampling inspection start instruction, the first robot is controlled to transfer the i-th wafer to be sampled from the first unloading buffer unit to the transfer unit, and the first robot is controlled to return to the first origin position according to the transfer signal;

[0029] According to the first origin signal, the second robot is controlled to transfer the i-th wafer to be inspected from the transfer unit to the inspection loading unit;

[0030] According to the second origin signal, the first robot is controlled to transfer the i+1th wafer to be inspected from the first unloading buffer unit to the transfer unit, and the first robot is controlled to return to the first origin position according to the transfer signal, and the above process is repeated until i=I.

[0031] Optionally, the step of placing the wafer back specifically includes:

[0032] According to the detection completion signal, the second robot is controlled to transfer the i-th wafer that has completed the inspection from the sampling loading unit to the transfer unit, and the second robot is controlled to return to the second origin position according to the transfer signal;

[0033] According to the second origin signal, the first robot is controlled to transfer the i-th wafer that has completed inspection from the transfer unit to the second unloading buffer unit;

[0034] According to the first origin signal, the second robot is controlled to transfer the i+1th inspected wafer from the sampling loading unit to the transfer unit, and the second robot is controlled to return to the second origin position according to the transfer signal. The above process is repeated until i=I, and the sampling inspection ends.

[0035] Optionally, in the wafer detection step, when a wafer removal signal is received, the step further includes:

[0036] The first robot is controlled to transfer the remaining wafers in the first unloading buffer unit to the second unloading buffer unit one by one.

[0037] In a third aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of any one of the above-mentioned DSP EFEM automatic sampling methods.

[0038] In a fourth aspect, the present application provides a computer program product, comprising a computer program, which, when executed by a processor, implements the steps of any one of the above-mentioned DSP EFEM automatic sampling methods.

[0039] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0040] This application provides a DSP EFEM automated sampling inspection method, system, medium, and product. These methods automatically determine the number of wafers to be inspected and monitor the unloading status of the double-sided grinding and polishing equipment in real time. Once unloading is confirmed to be complete, the sampling inspection process is immediately initiated, eliminating the need for manual intervention and saving valuable labor costs. Furthermore, fully automated operation eliminates the risk of wafer damage associated with manual operation, ensuring the safety and integrity of the wafers during the sampling inspection process. During the sampling inspection process, the DSP EFEM control system controls the first and second robots to accurately grab wafers to be inspected from the first unloading buffer unit and transport them to the first sampling inspection loading port. Upon receiving a wafer removal signal, the wafers to be inspected are inspected. This step not only improves the accuracy and efficiency of the sampling inspection but also further reduces the possibility of human error. Upon receiving a wafer removal signal, the DSP EFEM control system also controls the first robot to transfer the remaining wafers from the first unloading buffer unit to the second unloading buffer unit. Based on the received inspection completion signal, the DSP EFEM control system controls the first and second robots to safely return the inspected wafers to the second unloading buffer unit, completing the entire sampling inspection process. Through this series of automated steps, the methods, systems, media, and products of this application not only fully automate the sampling inspection process but also address the efficiency issues associated with manual delays. Fully automated operations ensure the timeliness and accuracy of sampling inspections, significantly improving the overall operational efficiency of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 This is an equipment layout diagram of a DSP EFEM automatic sampling inspection system in one embodiment of the present application;

[0043] Figure 2 A flowchart of a DSP EFEM automatic sampling method provided in one embodiment of the present application;

[0044] Figure 3 A flowchart of a DSP EFEM automatic sampling method provided in another embodiment of the present application;

[0045] Figure 4 A schematic diagram of the process of returning wafers after inspection according to an embodiment of the present application.

[0046] Reference numerals: DSP - double-sided grinding and polishing equipment, ULDBF1 - first blanking cache unit, ULDBF2 - second blanking cache unit, Stage - transfer unit, LDPort - random sampling loading unit, Wafer1 - first display module, Wafer2 - second display module, Wafer3 - third display module. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0048] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0049] In an exemplary embodiment, Figure 1 FIG. 1 shows an equipment layout diagram of a DSP EFEM automatic sampling inspection system. The DSP EFEM automatic sampling inspection system includes: a DSP EFEM control system, a first robot, a second robot, and a detection device.

[0050] DSP EFEM control system, first robot, second robot and detection equipment;

[0051] The DSP EFEM control system is connected to the first robot and the second robot respectively; the first robot and the second robot are arranged in the DSP EFEM device, and the DSP EFEM device includes a production execution system, a first unloading buffer unit ULDBF1, a transfer unit Stage, a sampling loading unit LDPort, and a second unloading buffer unit ULDBF2;

[0052] The DSP EFEM control system is also connected to the production execution system and the detection equipment respectively, and is used to control the first robot and the second robot to transfer I wafers to be sampled one by one from the first unloading buffer unit ULDBF1 to the transfer unit Stage according to the sampling inspection start instruction sent by the production execution system, and then transfer them from the transfer unit Stage to the sampling inspection loading unit LDPort, and generate a wafer removal signal after the transfer is completed and send it to the detection equipment, where I is the number of wafers to be sampled;

[0053] The detection device is used to detect the wafer to be inspected on the inspection loading unit LDPort according to the received wafer removal signal, and generate a detection completion signal after the detection is completed;

[0054] The random inspection loading unit LDPort is used to place wafers to be inspected and wafers that have been inspected;

[0055] The second unloading buffer unit ULDBF2 is used to place the wafers returned from the sampling loading unit LDPort after inspection;

[0056] The DSP EFEM control system is also used to control the first robot and the second robot to transfer I wafers that have completed inspection one by one from the random inspection loading unit LDPort to the transfer unit Stage according to the received inspection completion signal, and then transfer them from the transfer unit Stage to the second unloading buffer unit ULDBF2.

[0057] Wherein, in implementing this embodiment, the DSP EFEM automatic sampling inspection system further includes:

[0058] A sensing module is connected to the DSP EFEM control system. The sensing module is arranged on the transfer unit Stage and is used to determine whether a wafer is placed on the transfer unit Stage and generate a transfer signal.

[0059] The DSP EFEM control system is also used to control the first robot to return to the first origin position, or control the second robot to return to the second origin position according to the received transfer signal, wherein the first origin position is any position whose distance from the first unloading buffer unit ULDBF1 does not exceed the preset threshold, and the second origin position is any position whose distance from the random inspection loading unit LDPort does not exceed the preset threshold.

[0060] A first position sensor and a second position sensor, both of which are connected to the DSP EFEM control system; the first position sensor is arranged on the first robot, and is used to monitor the position information of the first robot in real time, and generate a first origin signal when the first robot is located at a first origin position; the second position sensor is arranged on the second robot, and is used to monitor the position information of the second robot in real time, and generate a second origin signal when the second robot is located at a second origin position.

[0061] In this embodiment, the first and second position sensors can be configured as first and second encoders, respectively mounted on the shafts of the servo motors attached to the wheels of the first and second robots. As the servo motors rotate, the encoders rotate synchronously, accurately measuring the rotation angle or displacement of the motors and transmitting this information to the DSP EFEM control system, thereby enabling the DSP EFEM control system to monitor the position information of the first and second robots in real time.

[0062] The DSP EFEM control system is further used to control the second robot to move to the transfer unit Stage or the sampling loading unit LDPort according to the received first origin signal; and control the first robot to move to the first unloading buffer unit ULDBF1 or the transfer unit Stage according to the received second origin signal.

[0063] In this embodiment, the second unloading buffer unit ULDBF2 is also used to place the remaining wafers in the first unloading buffer unit ULDBF1.

[0064] In this embodiment, the DSP EFEM automatic sampling system further includes a first display module Wafer1, a second display module Wafer2 and a third display module Wafer3, and the first display module Wafer1, the second display module Wafer2 and the third display module Wafer3 are all connected to the DSP EFEM control system.

[0065] The first display module Wafer1 is used to display the number of wafers in the first unloading buffer unit ULDBF1, the second display module Wafer2 is used to display the number of wafers in the second unloading buffer unit ULDBF2, and the third display module Wafer3 is used to display the number of wafers in the sampling loading unit LDPort.

[0066] In another embodiment of the present application, Figure 2 As shown, a DSP EFEM automatic sampling method is provided, which includes the following steps 101 to 103. In which:

[0067] Step 101, take out the wafer, obtain the number I of wafers to be inspected according to the received inspection start instruction, and control the first robot to transfer the i-th wafer to be inspected from the first unloading buffer unit ULDBF1 to the transfer unit Stage, and then the second robot transfers the i-th wafer to be inspected from the transfer unit Stage to the inspection loading unit LDPort, and repeat the above process until i=I, where i=1, 2, 3...I.

[0068] Step 102 , inspecting the wafers. When a wafer removal signal is received, the inspection equipment is controlled to inspect the wafers to be inspected.

[0069] Step 103, put the wafer back. When the inspection completion signal is received, control the second robot to transfer the i-th inspection-completed wafer from the sampling inspection loading unit LDPort to the transfer unit Stage, and then the first robot transfers the i-th inspection-completed wafer from the transfer unit Stage to the second unloading buffer unit ULDBF2. Repeat the above process until i=I, and the sampling inspection ends.

[0070] The implementation of steps 101 to 103 above can achieve full automation of the sampling inspection process and solve the efficiency problem of manual delay operation.

[0071] Among them, implementing this embodiment, such as Figure 3 As shown, step 101 can be replaced by the following steps 201 to 204:

[0072] Step 201: According to the sampling inspection start instruction, the first robot is first controlled to move to the air drying module in the DSP EFEM device to dry the fork arm. After the fork arm is dried, the first robot is controlled to move from the air drying module to the first unloading buffer unit ULDBF1 to take out the i-th wafer to be sampled.

[0073] In step 202, after taking out the i-th wafer to be inspected, the DSP EFEM control system controls the first robot to transfer the i-th wafer to be inspected to the air drying module for drying. After the i-th wafer to be inspected is dried, the first robot is controlled to transfer the i-th wafer to be inspected to the transfer unit Stage, and the first robot is controlled to return to the first origin position according to the transfer signal.

[0074] Step 203 : According to the first origin signal, the second robot is controlled to transfer the i-th wafer to be inspected from the transfer unit Stage to the inspection loading unit LDPort.

[0075] Step 204, according to the second origin signal, control the first robot to transfer the i+1th wafer to be inspected from the first unloading buffer unit ULDBF1 to the transfer unit Stage, and control the first robot to return to the first origin position according to the transfer signal, and repeat the above process until i=I.

[0076] In another exemplary embodiment of the present application, when the wafer removal signal is received in step 102 , the step further includes: controlling the first robot to transfer the remaining wafers on the first unloading buffer unit ULDBF1 to the second unloading buffer unit ULDBF2 one by one.

[0077] In another exemplary embodiment of the present application, Figure 4 As shown, step 103 can be replaced by the following steps 301 to 303:

[0078] Step 301: When the detection completion signal is received, the second position sensor is used to determine whether the second robot is located in the DSP loading and unloading and LDBF loading process. If the second robot is not located in the DSP loading and unloading and LDBF loading process, the second robot is controlled to transfer the i-th wafer that has completed detection from the sampling loading unit LDPort to the transfer unit Stage, and the second robot is controlled to return to the second origin position according to the transfer signal.

[0079] Step 302 : According to the second origin signal, the first robot is controlled to transfer the i-th wafer that has completed inspection from the transfer unit to the second unloading buffer unit ULDBF2 .

[0080] Step 303, according to the first origin signal, control the second robot to transfer the i+1th inspected wafer from the sampling loading unit LDPort to the transfer unit Stage, and control the second robot to return to the second origin position according to the transfer signal, repeat the above process until i=I, and end the sampling inspection.

[0081] This application also provides an application scenario that utilizes the aforementioned DSP EFEM automated sampling inspection method. Specifically, the DSP EFEM automated sampling inspection method provided in this embodiment can be applied to sampling inspection scenarios in wafer back-end processing. This sampling inspection scenario includes key steps such as wafer grinding and polishing, sampling inspection preparation, sampling inspection execution, result classification, and subsequent processing. After wafers to be sampled complete the grinding and polishing phase, they enter the sampling inspection preparation phase managed by the DSP EFEM control system. During this phase, the wafers are placed in the first unloading buffer unit, awaiting the triggering of the sampling inspection command. When the production execution system issues the sampling inspection start command and specifies the number of wafers to be sampled, the DSP EFEM automated sampling inspection method is initiated. Through the precise control of the coordinated operation of the first and second robots, wafers are sequentially transferred from the transfer unit to the sampling inspection loading port unit for detailed quality inspection. After inspection, the wafers are classified and transferred to the second unloading buffer unit or a designated processing area based on the inspection results.

[0082] The DSP EFEM automated sampling method provided in this embodiment belongs to the quality sampling phase of the wafer back-end processing flow. In this phase, efficient, accurate, and reliable wafer sampling is achieved through high-precision robotic operation, real-time signal feedback, and automated control. Specifically, during the sampling process, the system automatically monitors the wafer's position, status, and sampling progress, and flexibly adjusts the sampling strategy based on actual conditions to ensure the smooth progress of the sampling process. This not only reduces manual intervention and the risk of human error, but also improves the accuracy and consistency of sampling through automated control, providing strong support for quality control in the semiconductor manufacturing industry.

[0083] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0084] In an exemplary embodiment, a computer program product is provided, including a computer program. When the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0085] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0086] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0087] The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processors involved in the various embodiments provided herein may include, but are not limited to, general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic units, data processing logic units based on quantum computing, and the like.

[0088] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A DSP EFEM automatic sampling system, characterized in that: The DSP EFEM automatic sampling inspection system includes: DSP EFEM control system, first robot, second robot and detection equipment; The DSP EFEM control system is connected to the first robot and the second robot respectively; the first robot and the second robot are arranged in the DSP EFEM device, and the DSP EFEM device includes a production execution system, a first material unloading buffer unit, a transfer unit, a sampling loading unit, and a second material unloading buffer unit; The DSP EFEM control system is also connected to the production execution system and the detection equipment respectively, and is used to control the first robot and the second robot to transfer I wafers to be sampled one by one from the first unloading buffer unit to the transfer unit according to the sampling inspection start instruction sent by the production execution system, and then transfer them from the transfer unit to the sampling inspection loading unit, and generate a wafer removal signal after the transfer is completed and send it to the detection equipment, where I is the number of wafers to be sampled; The detection device is used to detect the wafers to be sampled on the sampling loading unit according to the received wafer removal signal, and generate a detection completion signal after the detection is completed; The sampling inspection loading unit is used to place wafers to be sampled and wafers that have been inspected; The second unloading buffer unit is used to place the wafers that have completed inspection and are returned from the sampling loading unit; The DSP EFEM control system is further configured to control the first robot and the second robot to transfer one wafer after inspection from the sampling loading unit to the transfer unit according to the received inspection completion signal, and then transfer the wafer from the transfer unit to the second unloading buffer unit; When the MES issues a sampling start command and specifies the number of wafers to be sampled, the DSP EFEM automatic sampling method is initiated. The DSP EFEM automatic sampling method includes: Remove the wafers, obtain the number of wafers to be inspected I according to the received inspection start instruction, and control the first robot to transfer the i-th wafer to be inspected from the first unloading buffer unit to the transfer unit, and then control the second robot to transfer the i-th wafer to be inspected from the transfer unit to the inspection loading unit, and repeat the above process until i=I, where i=1, 2, 3...I; Detect wafers. When receiving the wafer removal signal, control the detection equipment to detect the wafers to be inspected; Put the wafer back. When the inspection completion signal is received, the second robot is controlled to transfer the i-th inspection-completed wafer from the sampling inspection loading unit to the transfer unit. Then the first robot transfers the i-th inspection-completed wafer from the transfer unit to the second unloading buffer unit. Repeat the above process until i=1, and the sampling inspection is completed. In the wafer detection step, when a wafer removal signal is received, the step further includes: Controlling the first robot to transfer the remaining wafers in the first unloading buffer unit to the second unloading buffer unit one by one; The second blanking cache unit is further used to place the remaining wafers in the first blanking cache unit; The DSP EFEM automatic sampling inspection system further includes: a sensing module, the sensing module being connected to the DSP EFEM control system; The sensing module is provided on the transfer unit, and is used to determine whether a wafer is placed in the transfer unit and generate a transfer signal; The DSP EFEM control system is also used to control the first robot to return to the first origin position, or control the second robot to return to the second origin position according to the received transfer signal, wherein the first origin position is any position whose distance from the first unloading cache unit does not exceed a preset threshold, and the second origin position is any position whose distance from the sampling loading unit does not exceed a preset threshold.

2. The DSP EFEM automatic sampling system according to claim 1 is characterized in that: The DSP EFEM automatic sampling inspection system further includes: a first position sensor and a second position sensor, both of which are connected to the DSP EFEM control system; The first position sensor is provided on the first robot, and is used to monitor the position information of the first robot in real time, and to generate a first origin signal when the first robot is located at the first origin position; The second position sensor is provided on the second robot, and is used for monitoring the position information of the second robot in real time, and generating a second origin signal when the second robot is located at the second origin position; The DSP EFEM control system is also used to control the second robot to move to the transfer unit or the sampling loading unit according to the received first origin signal; and control the first robot to move to the first unloading buffer unit or the transfer unit according to the received second origin signal.

3. A DSP EFEM automatic sampling method, characterized in that: The DSP EFEM automatic sampling inspection method applies the DSP EFEM automatic sampling inspection system according to any one of claims 1 to 2, and the DSP EFEM automatic sampling inspection method includes: Remove the wafers, obtain the number of wafers to be inspected I according to the received inspection start instruction, and control the first robot to transfer the i-th wafer to be inspected from the first unloading buffer unit to the transfer unit, and then control the second robot to transfer the i-th wafer to be inspected from the transfer unit to the inspection loading unit, and repeat the above process until i=I, where i=1, 2, 3...I; Detect wafers. When receiving the wafer removal signal, control the detection equipment to detect the wafers to be inspected; Put the wafer back. When the inspection completion signal is received, the second robot is controlled to transfer the i-th inspection-completed wafer from the sampling inspection loading unit to the transfer unit. Then the first robot transfers the i-th inspection-completed wafer from the transfer unit to the second unloading buffer unit. Repeat the above process until i=1, and the sampling inspection is completed. In the wafer detection step, when a wafer removal signal is received, the step further includes: Controlling the first robot to transfer the remaining wafers in the first unloading buffer unit to the second unloading buffer unit one by one; The step of placing the wafer back specifically includes: According to the detection completion signal, the second robot is controlled to transfer the i-th wafer that has completed the inspection from the sampling loading unit to the transfer unit, and the second robot is controlled to return to the second origin position according to the transfer signal; According to the second origin signal, the first robot is controlled to transfer the i-th wafer that has completed inspection from the transfer unit to the second unloading buffer unit; According to the first origin signal, the second robot is controlled to transfer the i+1th inspected wafer from the sampling loading unit to the transfer unit, and the second robot is controlled to return to the second origin position according to the transfer signal. The above process is repeated until i=I, and the sampling inspection ends.

4. The DSP EFEM automatic sampling method according to claim 3, characterized in that: The wafer removal step specifically includes: According to the sampling inspection start instruction, the first robot is controlled to transfer the i-th wafer to be sampled from the first unloading buffer unit to the transfer unit, and the first robot is controlled to return to the first origin position according to the transfer signal; According to the first origin signal, the second robot is controlled to transfer the i-th wafer to be inspected from the transfer unit to the inspection loading unit; According to the second origin signal, the first robot is controlled to transfer the i+1th wafer to be inspected from the first unloading cache unit to the transfer unit, and the first robot is controlled to return to the first origin position according to the transfer signal, and the above process is repeated until i=I.

5. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the DSP EFEM automatic sampling method according to any one of claims 3 to 4 is implemented.

6. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the DSP EFEM automatic sampling method according to any one of claims 3 to 4 is implemented.

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