A semiconductor chip wet etching device

Abstract

The present invention belongs to the technical field of semiconductor chip processing, and discloses a semiconductor chip wet etching device, including a base, a liquid storage shell fixedly connected to the front of the base, an effective component additive and a concentration sensor fixedly connected to the inside of the liquid storage shell, a liquid inlet pipe connected to the right side of the liquid storage shell, a liquid pump fixedly connected to the rear end of the liquid inlet pipe, a liquid outlet pipe connected to the top of the liquid pump, and a liquid separator shell fixedly connected to the upper end of the liquid outlet pipe. The present invention clamps and aligns the lower surface of the semiconductor chip with the lower surface of the arc pad, and the telescopic rod drives the sliding sleeve and the clamping mechanism to move downward, so that the lower surface of the semiconductor chip is slightly lower than the upper surface of the etching groove, and then the nozzle is opened to etch the upper surface of the semiconductor chip, and the lower surface of the semiconductor chip is immersed in the etching solution inside the etching groove for etching, thereby solving the problem that when the existing equipment performs double-sided etching processing, it is necessary to change the surface, which is not only cumbersome to operate but also has low processing efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor chip processing, and in particular relates to a semiconductor chip wet etching device. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Not only silicon chips, but also common semiconductor materials such as gallium arsenide and germanium. The semiconductor chip wet etching device is a key equipment used in semiconductor manufacturing, mainly used to remove specific material layers on the surface of the wafer through chemical solutions, thereby achieving the formation of fine patterns.

[0003] In the existing wet etching process of semiconductor chips, the chip to be processed is generally fixed in one place, and the processing liquid is sprayed onto the chip through a nozzle. Only the upper surface of the semiconductor chip can be etched. However, in certain specific cases, it is necessary to etch both sides of the semiconductor chip. When the existing equipment performs double-sided etching, it is necessary to change the surface, which is not only cumbersome to operate but also has low processing efficiency. When processing the second side, the existing semiconductor clamping device will come into contact with the processed semiconductor etching surface, which will scratch the etching surface and result in a low yield rate. During the use of the etching solution, the effective ingredients therein will be consumed, and it also contains solid impurities, which makes it unable to meet the etching requirements, but it still contains a large amount of effective ingredients and cannot be fully utilized, resulting in waste. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor chip wet etching device to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical scheme: a semiconductor chip wet etching device comprises a base, a liquid storage shell is fixedly connected to the front side of the base, an effective ingredient adder and a concentration sensor are fixedly connected to the inside of the liquid storage shell, a liquid inlet pipe is connected to the right side of the liquid storage shell, a liquid pump is fixedly connected to the rear end of the liquid inlet pipe, a liquid outlet pipe is connected to the top of the liquid pump, a liquid separation shell is fixedly connected to the upper end of the liquid outlet pipe, a transparent sealing cover is fixedly connected to the lower surface of the liquid separation shell, a plurality of nozzles are fixedly installed in the middle of the transparent sealing cover, two etching grooves are provided on the upper surface of the base, a plurality of groups of partitions are fixedly connected to the bottom of the etching groove, a counterattack plate is fixedly connected to the upper surface of the partition, a collecting shell is slidably connected to the front side of the bottom of the etching groove, an arc plate is fixedly connected to the left and right side walls of the etching groove, and a fixed plate is rotatably connected to the left and right sides behind the transparent sealing cover.

[0006] Preferably, two sliding cavities are provided inside the base, a telescopic rod is fixedly installed in the middle of the sliding cavity, the telescopic end of the telescopic rod is fixedly connected to a connecting plate, the left and right sides of the connecting plate are fixedly connected to sliding sleeves, the middle of the sliding sleeve is slidably connected to the sliding rod, the front end of the sliding sleeve is fixedly connected to a clamping mechanism, the upper surface of the clamping mechanism is rotatably connected to a rotating ring, and the lower surface of the rotating ring is fixedly connected to a plurality of limit blocks arranged equidistantly around the circumference.

[0007] Preferably, the clamping mechanism includes a mounting shell, the interior of the mounting shell is fixedly connected to a plurality of circumferentially equidistantly arranged fixed blocks, one side of the fixed block is fixedly connected to a curved spring, one side of the curved spring is fixedly connected to a pushing inclined block, the inner side of the mounting shell is fixedly connected to a plurality of circumferentially equidistantly arranged sleeves, the interior of the sleeve is fixedly connected to a compression spring, the outer end of the compression spring is fixedly connected to a connecting rod, the inner end of the connecting rod is fixedly connected to an arc pad, and the outer end of the connecting rod is fixedly connected to a ball head.

[0008] Preferably, the liquid pump is fixedly connected to the right side of the base, the bottom ends of the two fixed plates are fixedly connected to the base, the sliding rod is fixedly connected to the base, and the nozzle is located directly above the clamping mechanism.

[0009] Preferably, the bottom of the etching groove is inclined with the front lower and the back higher, and the left and right sides of the counter-attack plate are arc-shaped.

[0010] Preferably, the push bevel block is slidably connected to the mounting shell, the sleeve is slidably connected to the connecting rod, an arc groove is provided on the inner side of the push bevel block, the arc groove is adapted to abut against the ball head, and one side of the push bevel block is adapted to abut against the limit block.

[0011] The beneficial effects of the present invention are as follows:

[0012] 1. The present invention increases the distance between the arc pads by rotating the rotating ring, puts the semiconductor chip to be etched in, and slowly loosens the rotating ring to clamp the semiconductor chip with the arc pad. When double-sided etching is performed, the lower surface of the semiconductor chip is aligned with the lower surface of the arc pad, and the telescopic rod drives the sliding sleeve and the clamping mechanism to move downward, so that the lower surface of the semiconductor chip is slightly lower than the upper surface of the etching groove. Then the nozzle is opened to etch the upper surface of the semiconductor chip, while the lower surface of the semiconductor chip is immersed in the etching solution inside the etching groove for etching, thereby solving the problem that the existing equipment needs to change the surface when performing double-sided etching processing, which is not only cumbersome to operate but also has low processing efficiency.

[0013] 2. The present invention rotates the rotating ring, which drives the limiting block below to rotate clockwise, thereby driving the pushing bevel block to slide and squeeze the curved spring. Since the connecting rod is pushed by the compression spring, the ball head abuts against the arc groove of the pushing bevel block. When the pushing bevel block rotates, the connecting rod pushes the connecting rod to move outward, thereby increasing the distance between the arc pads, placing the semiconductor chip to be etched, and slowly loosening the rotating ring to clamp the semiconductor chip with the arc pad, thereby solving the problem that when the existing equipment is performing second-side processing, the existing semiconductor clamping device will contact the processed semiconductor etching surface, scratch the etching surface, and cause a low yield rate.

[0014] 3. The present invention continuously sprays out the etching solution, and the upper layer solution of the etching tank will overflow into the interior of the front liquid storage shell. The concentration sensor will detect the concentration of the effective components of the solution inside the liquid storage shell. When the concentration is low, the effective component adder will release a certain amount of effective component solution in the high-concentration etching solution, so that the effective components of the etching solution can meet the target requirements, and the etching solution can be utilized and recycled to the greatest extent, thereby solving the problem that the etched solution cannot meet the etching requirements but still contains a large amount of effective components and cannot be fully utilized, resulting in waste.

[0015] 4. The etching solution sprayed from the nozzle of the present invention eventually falls into the interior of the etching groove, and the solid particles and impurities generated during etching will fall into the bottom of the etching groove. Due to the arrangement of the counter-plate and the arc plate, the solid particles and impurities will not be brought into the upper solution inside the etching groove. The solid particles and impurities at the bottom of the etching groove will slide along the bottom of the etching groove into the interior of the collecting shell and be collected. As the etching solution from the nozzle is continuously sprayed, the upper layer of the etching groove will overflow into the interior of the etching groove or the liquid storage shell in front, so that the etching solution inside the etching groove is in a flowing state, thereby ensuring the etching effect of the lower surface of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the appearance of the present invention;

[0017] Figure 2 A half-section schematic diagram of a transparent sealing cover of the present invention;

[0018] Figure 3 It is a cross-sectional schematic diagram of the base of the present invention;

[0019] Figure 4 It is a schematic diagram of the clamping mechanism of the present invention;

[0020] Figure 5 A half-section schematic diagram of the clamping mechanism of the present invention;

[0021] Figure 6 For the present invention Figure 5 Enlarged schematic diagram at point A in the middle.

[0022] In the figure: 1, base; 2, liquid storage shell; 3, active ingredient additive; 4, concentration sensor; 5, liquid inlet pipe; 6, liquid pump; 7, liquid outlet pipe; 8, liquid separation shell; 9, transparent sealing cover; 10, nozzle; 11, etching groove; 12, partition; 13, counterattack plate; 14, collecting shell; 15, arc plate; 16, fixed plate; 17, sliding cavity; 18, telescopic rod; 19, connecting plate; 20, sliding sleeve; 21, sliding rod; 22, clamping mechanism; 221, mounting shell; 222, fixed block; 223, curved spring; 224, pushing inclined block; 225, cylinder sleeve; 226, compression spring; 227, connecting rod; 228, arc pad; 229, ball head; 23, rotating ring; 24, limit block. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] like Figures 1 to 6 As shown, an embodiment of the present invention provides a semiconductor chip wet etching device, comprising a base 1, a liquid storage shell 2 is fixedly connected to the front of the base 1, an effective component additive 3 and a concentration sensor 4 are fixedly connected to the inside of the liquid storage shell 2, a liquid inlet pipe 5 is connected to the right side of the liquid storage shell 2, a liquid pump 6 is fixedly connected to the rear end of the liquid inlet pipe 5, a liquid outlet pipe 7 is connected to the top of the liquid pump 6, a liquid separation shell 8 is fixedly connected to the upper end of the liquid outlet pipe 7, a transparent sealing cover 9 is fixedly connected to the lower surface of the liquid separation shell 8, a plurality of nozzles 10 are fixedly installed in the middle of the transparent sealing cover 9, two etching grooves 11 are provided on the upper surface of the base 1, a plurality of partitions 12 are fixedly connected to the bottom of the etching groove 11, a counter-attack plate 13 is fixedly connected to the upper surface of the partition 12, and a bottom front side sliding A collecting shell 14 is connected, and the left and right side walls of the etching groove 11 are fixedly connected with an arc plate 15. The left and right sides behind the transparent sealing cover 9 are rotatably connected with a fixed plate 16. Its function is to continuously spray the etching solution through the nozzle 10, and the upper solution of the etching groove 11 will overflow into the interior of the front liquid storage shell 2. The concentration sensor 4 will detect the concentration of the effective components of the solution inside the liquid storage shell 2. When the concentration is low, the effective component adder 3 will release a certain amount of effective component solution in the high-concentration etching solution, so that the effective components of the etching solution meet the target requirements, so that the etching solution can be utilized and recycled to the greatest extent, and the problem of waste caused by the solution after etching cannot meet the etching requirements but still contains a large amount of effective components and cannot be fully utilized.

[0025] Among them, two sliding chambers 17 are provided inside the base 1, a telescopic rod 18 is fixedly installed in the middle of the sliding chamber 17, the telescopic end of the telescopic rod 18 is fixedly connected to a connecting plate 19, the left and right sides of the connecting plate 19 are fixedly connected to a sliding sleeve 20, the middle of the sliding sleeve 20 is slidably connected to a sliding rod 21, the front end of the sliding sleeve 20 is fixedly connected to a clamping mechanism 22, the upper surface of the clamping mechanism 22 is rotatably connected to a rotating ring 23, and the lower surface of the rotating ring 23 is fixedly connected to a plurality of circumferentially equidistantly arranged limit blocks 24, whose function is that the etching solution sprayed from the nozzle 10 finally falls into the interior of the etching groove 11, and the etching is produced during etching. The generated solid particles and impurities will fall into the bottom of the etching groove 11. Due to the setting of the counter-attack plate 13 and the arc plate 15, the solid particles and impurities will not be brought into the upper solution inside the etching groove 11. The solid particles and impurities at the bottom of the etching groove 11 will slide along the bottom of the etching groove 11 into the interior of the collecting shell 14 and be collected. As the etching solution is continuously sprayed out of the nozzle 10, the upper layer of the etching groove 11 will overflow into the front etching groove 11 or the interior of the liquid storage shell 2, so that the etching solution inside the etching groove 11 is in a flowing state, thereby ensuring the etching effect of the lower surface of the semiconductor chip.

[0026] The clamping mechanism 22 includes a mounting shell 221, a plurality of circumferentially equidistantly arranged fixed blocks 222 are fixedly connected inside the mounting shell 221, a curved spring 223 is fixedly connected to one side of the fixed block 222, a pushing inclined block 224 is fixedly connected to one side of the curved spring 223, a plurality of circumferentially equidistantly arranged sleeves 225 are fixedly connected to the inner side of the mounting shell 221, a compression spring 226 is fixedly connected to the inner side of the sleeve 225, a connecting rod 227 is fixedly connected to the outer end of the compression spring 226, an arc pad 228 is fixedly connected to the inner end of the connecting rod 227, and a ball head 229 is fixedly connected to the outer end of the connecting rod 227, which functions to drive the lower limit by rotating the rotating ring 23. Block 24 rotates clockwise, thereby driving the pushing bevel block 224 to slide and squeeze the curved spring 223. Since the connecting rod 227 is pushed by the compression spring 226, the ball head 229 abuts against the arc groove of the pushing bevel block 224. When the pushing bevel block 224 rotates, the connecting rod 227 will push the connecting rod 227 to move outward, thereby increasing the distance between the arc pads 228, and placing the semiconductor chip to be etched. By slowly loosening the rotating ring 23, the arc pads 228 clamp the semiconductor chip, thereby solving the problem that when the existing equipment is performing second-side processing, the existing semiconductor clamping device will contact the processed semiconductor etching surface, causing scratches on the etching surface and resulting in a low yield rate.

[0027] Among them, the liquid pump 6 is fixedly connected to the right side of the base 1, the bottom ends of the two fixed plates 16 are fixedly connected to the base 1, the sliding rod 21 is fixedly connected to the base 1, the nozzle 10 is located directly above the clamping mechanism 22, the bottom of the etching groove 11 is inclined with the front lower and the back higher, the left and right sides of the counter-attack plate 13 are arc-shaped, the push inclined block 224 is slidably connected to the mounting shell 221, the sleeve 225 is slidably connected to the connecting rod 227, the push inclined block 224 is provided with an arc groove on the inner side, the arc groove is adapted to abut against the ball head 229, and one side of the push inclined block 224 is adapted to abut against the limit block 24, and its function is to increase the distance between the arc pads 228 by rotating the rotating ring 23. Put the semiconductor chip to be etched in, and slowly loosen the rotating ring 23 to allow the arc pad 228 to clamp the semiconductor chip. When double-sided etching is performed, align the lower surface of the semiconductor chip with the lower surface of the arc pad 228, and the telescopic rod 18 drives the sliding sleeve 20 and the clamping mechanism 22 to move downward, so that the lower surface of the semiconductor chip is slightly lower than the upper surface of the etching groove 11. Then the nozzle 10 is opened to etch the upper surface of the semiconductor chip, while the lower surface of the semiconductor chip is immersed in the etching solution inside the etching groove 11 for etching, thereby solving the problem that the existing equipment needs to change the surface when performing double-sided etching processing, which is not only cumbersome to operate but also has low processing efficiency.

[0028] Working principle:

[0029] Before using the present invention, an etching solution of appropriate concentration is added to the liquid storage shell 2 and the etching tank 11, and an effective component solution with a high concentration etching solution is added to the effective component adder 3, and the telescopic rod 18 is in the longest state;

[0030] When the present invention is used, the transparent sealing cover 9 is rotated to open, and the rotating ring 23 is rotated. The rotating ring 23 drives the limiting block 24 below to rotate clockwise, thereby driving the pushing inclined block 224 to slide and squeeze the curved spring 223. Since the connecting rod 227 is pushed by the compression spring 226, the ball head 229 abuts against the arc groove of the pushing inclined block 224. When the pushing inclined block 224 rotates, the connecting rod 227 will push the connecting rod 227 to move outward, thereby increasing the distance between the arc pads 228, and putting the semiconductor chip to be etched in. The rotating ring 23 is slowly loosened to clamp the semiconductor chip by the arc pad 228. When single-sided etching is performed, the upper surface of the semiconductor chip is aligned with the upper surface of the arc pad 228. When double-sided etching is performed, the lower surface of the semiconductor chip is aligned with the lower surface of the arc pad 228.

[0031] After the semiconductor chip is clamped, the transparent sealing cover 9 is closed, the liquid pump 6 is started, the etching solution in the liquid storage shell 2 is extracted through the liquid inlet pipe 5 and pumped into the liquid separation shell 8 through the liquid outlet pipe 7, the nozzle 10 is opened, and the etching solution in the liquid separation shell 8 is sprayed on the upper surface of the semiconductor chip directly below, so as to perform single-sided etching on the upper surface of the semiconductor chip. During the solution spraying process, the solution can be prevented from splashing due to the obstruction of the rotating ring 23, which can prevent the solution from affecting the etching of other semiconductor chips; when double-sided etching is performed, the telescopic rod 18 is shortened to drive the connecting plate 19 to move downward by an appropriate distance, and the connecting plate 19 drives the sliding sleeve 20 and the clamping mechanism 22 to move downward, so that the lower surface of the semiconductor chip is slightly lower than the upper surface of the etching groove 11, and then the nozzle 10 is opened to etch the upper surface of the semiconductor chip, and the lower surface of the semiconductor chip is immersed in the etching solution inside the etching groove 11, so as to perform etching;

[0032] The etching solution sprayed by the nozzle 10 eventually falls into the interior of the etching groove 11. The solid particles and impurities generated during etching will fall into the bottom of the etching groove 11. Due to the arrangement of the counter-attack plate 13 and the arc plate 15, the solid particles and impurities will not be brought into the upper solution inside the etching groove 11. The solid particles and impurities at the bottom of the etching groove 11 will slide along the bottom of the etching groove 11 into the interior of the collecting shell 14 and be collected. As the nozzle 10 continuously sprays the etching solution, the upper layer of the etching groove 11 will overflow into the front etching groove 11 or the interior of the liquid storage shell 2, so that the etching solution inside the etching groove 11 is in a flowing state, thereby ensuring the etching effect on the lower surface of the semiconductor chip. The concentration sensor 4 will detect the concentration of the effective component of the solution inside the liquid storage shell 2. When the concentration is low, the effective component adder 3 will release a certain amount of effective component solution in the high-concentration etching solution, so that the effective component of the etching solution reaches the target requirement, thereby making the etching solution utilized and recycled to the greatest extent.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip wet etching device, comprising a base (1), a liquid storage shell (2) fixedly connected to the front of the base (1), an active ingredient additive (3) and a concentration sensor (4) fixedly connected inside the liquid storage shell (2), a liquid inlet pipe (5) connected to the right side of the liquid storage shell (2), a liquid pump (6) fixedly connected to the rear end of the liquid inlet pipe (5), characterized in that: The top of the liquid pump (6) is connected to a liquid outlet pipe (7), the upper end of the liquid outlet pipe (7) is fixedly connected to a liquid separation shell (8), the lower surface of the liquid separation shell (8) is fixedly connected to a transparent sealing cover (9), a plurality of nozzles (10) are fixedly installed in the middle of the transparent sealing cover (9), two etching grooves (11) are provided on the upper surface of the base (1), a plurality of groups of partitions (12) are fixedly connected to the bottom of the etching groove (11), a counterattack plate (13) is fixedly connected to the upper surface of the partition (12), a collecting shell (14) is slidably connected to the front side of the bottom of the etching groove (11), and the left and right side walls of the etching groove (11) are fixedly connected to arc plates (13). 5), the left and right sides of the rear of the transparent sealing cover (9) are rotatably connected to fixed plates (16); the base (1) has two sliding cavities (17) formed inside, a telescopic rod (18) is fixedly installed in the middle of the sliding cavity (17), the telescopic end of the telescopic rod (18) is fixedly connected to a connecting plate (19), the left and right sides of the connecting plate (19) are fixedly connected to sliding sleeves (20), the middle of the sliding sleeve (20) is slidably connected to a sliding rod (21), the front end of the sliding sleeve (20) is fixedly connected to a clamping mechanism (22), the upper surface of the clamping mechanism (22) is rotatably connected to a rotating ring (23), and the rotating ring (23) is fixedly connected to the sliding sleeve (20). ) is fixedly connected to the lower surface of a plurality of circumferentially equidistantly arranged limit blocks (24); the clamping mechanism (22) comprises a mounting shell (221), the interior of the mounting shell (221) is fixedly connected to a plurality of circumferentially equidistantly arranged fixed blocks (222), one side of the fixed block (222) is fixedly connected to a curved spring (223), one side of the curved spring (223) is fixedly connected to a push inclined block (224), the inner side of the mounting shell (221) is fixedly connected to a plurality of circumferentially equidistantly arranged sleeves (225), the interior of the sleeve (225) is fixedly connected to a compression spring (226), the outer end of the compression spring (226) is fixedly connected to a connecting rod (227), the inner end of the connecting rod (227) is fixedly connected to an arc pad (228), and the outer end of the connecting rod (227) is fixedly connected to a ball head (229); the arc pad (228) clamps the semiconductor chip, and when double-sided etching is performed, the lower surface of the semiconductor chip is aligned with the lower surface of the arc pad (228), and the telescopic rod (18) drives the sliding sleeve (20) and the clamping mechanism (22) to move downward, so that the lower surface of the semiconductor chip is slightly lower than the upper surface of the etching groove (11), and then the nozzle (10) is opened to etch the upper surface of the semiconductor chip, while the lower surface of the semiconductor chip is immersed in the etching solution inside the etching groove (11) for etching.

2. A semiconductor chip wet etching device according to claim 1, characterized in that: The liquid pump (6) is fixedly connected to the right side of the base (1), the bottom ends of the two fixed plates (16) are fixedly connected to the base (1), the sliding rod (21) is fixedly connected to the base (1), and the nozzle (10) is located directly above the clamping mechanism (22).

3. A semiconductor chip wet etching device according to claim 2, characterized in that: The bottom of the etching groove (11) is inclined with the front lower and the back higher, and the left and right sides of the counter-attack plate (13) are arc-shaped.

4. A semiconductor chip wet etching device according to claim 3, characterized in that: The push inclined block (224) is slidably connected to the mounting shell (221), the sleeve (225) is slidably connected to the connecting rod (227), an arc groove is provided inside the push inclined block (224), the arc groove is adapted to abut against the ball head (229), and one side of the push inclined block (224) is adapted to abut against the limit block (24).

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