A resin loading mechanism and a semiconductor packaging device

Abstract

The present invention belongs to the technical field of semiconductor packaging, and provides a resin loading mechanism, which includes a third base capable of reciprocating linearly; a fourth moving layer provided with a fourth moving substrate, and the fourth moving layer is movably arranged relative to the third base through the fourth moving substrate; a tray handling mechanism arranged on the fourth moving substrate, and the tray handling mechanism is used for the transmission of resin and the recycling of empty resin trays; the tray handling mechanism includes a second main clamping mechanism and a second auxiliary clamping mechanism, wherein the second main clamping mechanism is used for the picking and handling of resin trays, and the second auxiliary clamping mechanism is used for the fixation of films. By setting the second main clamping mechanism and the second auxiliary clamping mechanism, the handling of resin trays and the fixation of films are separately arranged. While ensuring that the resin trays can be fully automatically loaded, the resin trays can be reciprocally recycled, and the separation of the film from the resin tray is controlled by the second auxiliary clamping mechanism, without complex operation processes, thus improving the packaging loading efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip substrate packaging, and particularly to a resin loading mechanism and a semiconductor packaging device. Background Art

[0002] Over time, semiconductor technology has continuously advanced, and more complex semiconductor devices such as integrated circuits and large-scale integrated circuits have gradually emerged. The development of these technologies has greatly promoted the progress of fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] The compression packaging of the chip substrate is an essential step. For traditional compression packaging equipment of chip substrates, manual resin feeding is required. On the one hand, the accuracy of resin laying is low, and the danger coefficient of manual operation increases. At the same time, the production efficiency is low. Therefore, how to achieve the automatic transmission of resin is an urgent problem for those in this field. Summary of the Invention

[0004] The present invention provides a resin loading mechanism to solve the safety problems, accuracy problems, low packaging efficiency caused by manual feeding assistance in the above-mentioned technical background, and the problem of how to achieve the automatic transmission of resin. Another aspect of the present invention is to provide a semiconductor packaging device.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A resin loading mechanism includes:

[0007] A third base capable of making reciprocating linear motion;

[0008] A fourth moving layer provided with a fourth moving substrate, and the fourth moving layer is movably arranged relative to the third base through the fourth moving substrate;

[0009] A tray handling mechanism is arranged on the fourth moving substrate, and the tray handling mechanism is used for the transmission of resin and the recycling of empty resin trays.

[0010] In some embodiments, it further includes a third moving layer provided with a third moving substrate. The third moving substrate is movably arranged on the third base, the fourth moving layer is movably arranged on the third moving layer, and the moving directions of the fourth moving layer and the third moving layer are the same and perpendicular to the moving direction of the third base.

[0011] In some embodiments, a fourth guide rail is provided on the third base, a fourth slider is provided on the fourth guide rail, the third moving substrate is arranged on the fourth slider, and the axial direction of the fourth guide rail is the same as the moving direction of the fourth moving layer.

[0012] In some embodiments, a fifth guide rail is provided on the third translation substrate, and a fifth slider is provided on the fifth guide rail. The axial direction of the fifth guide rail is the same as the axial direction of the fourth guide rail.

[0013] In some embodiments, there are at least two fourth guide rails, and the at least two fourth guide rails are arranged in parallel at intervals. At least one fourth slider is provided on each of the fourth guide rails;

[0014] There are at least two fifth guide rails, and the at least two fifth guide rails are arranged in parallel at intervals. At least one fifth slider is provided on each of the fifth guide rails.

[0015] In some embodiments, a fourth driving assembly is further included. The fourth driving assembly includes a fourth driving motor, a fourth driving pulley, a fourth driven pulley, and a fourth synchronous belt. The fourth driving motor is arranged on the third moving substrate, the fourth driving pulley is arranged on the output shaft of the fourth driving motor, the fourth driven pulley is rotatably arranged on the fourth moving substrate, and the fourth synchronous belt is wound around the fourth driving pulley and the fourth driven pulley;

[0016] Wherein, a third connecting block is provided on the third base, and a fourth connecting block is provided on the fourth moving substrate. The third connecting block is fixedly connected to the fourth synchronous belt, and the fourth connecting block is connected to the fourth synchronous belt.

[0017] In some embodiments, in the initial position, the third connecting block is close to the fourth driven pulley, and the fourth connecting block is close to the fourth driving pulley. When the third moving layer and the fourth moving layer are fully extended, the third connecting block is close to the fourth driving pulley, and the fourth connecting block is close to the fourth driven pulley.

[0018] In some embodiments, the tray handling mechanism includes a second upper base and a second lower base connected to each other from top to bottom. The second upper base is connected to the lower side of the second translation substrate, and a second main clamping mechanism and a second auxiliary clamping mechanism are provided on the second lower base;

[0019] The second main clamping mechanism includes two second main clamping linkages arranged in parallel with each other. The second main clamping linkages are movably arranged on the second lower base, and second main clamping jaws that can be opened and closed are arranged at both ends of the second main clamping linkages;

[0020] The second auxiliary clamping mechanism includes two auxiliary moving seats arranged opposite to the second lower base. A first main clamping block capable of lifting and a fixed second auxiliary clamping block are provided on the auxiliary moving seats;

[0021] The first main clamping block can move up and down relative to the first sub-clamping block, so as to realize the opening and closing between the first main clamping block and the first sub-clamping block;

[0022] The two sub-moving seats can move away from or towards each other, so as to drive the second sub-clamping block to open and close.

[0023] In some embodiments, the present invention further provides a semiconductor packaging device, including:

[0024] The resin loading mechanism as described in each of the above embodiments;

[0025] A second installation platform, on which at least one third guide rail is provided, a third slider is provided on the third guide rail, and the third base is arranged on the third slider;

[0026] A third driving component, which is used to drive the resin loading mechanism to perform a reciprocating linear movement along the third guide rail.

[0027] In some embodiments, the third driving component includes a third driving motor arranged on the third base, a second gear is provided at the output end of the third driving motor, a second straight rack is provided on the second installation platform, the second straight rack is arranged parallel to the third guide rail, and the second gear meshes with the second straight rack.

[0028] Compared with the prior art, the beneficial effects brought by the present invention are:

[0029] By arranging a reciprocating resin loading mechanism on the second installation platform, and arranging a tray handling mechanism on the resin loading mechanism for resin transmission and secondary recycling of the tray, the whole process does not require manual feeding. At the same time, combining the second main clamping mechanism and the second sub-clamping mechanism on the tray handling mechanism, the tray is clamped, transported and fixed by the second main clamping mechanism, and then the second sub-clamping mechanism is used to fix the film under the resin tray, so as to ensure the stable transmission of the resin and avoid the separation between the film and the resin tray, resulting in the resin spilling out.

[0030] Additional aspects and advantages of the present application will be given in part in the following description, and these will become obvious from the following description, or can be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is the first three-dimensional view of the resin loading mechanism of the present invention;

[0032] Figure 2 is the top view of the resin loading mechanism of the present invention;

[0033] Figure 3 is the exploded view of the resin state mechanism of the present invention;

[0034] Figure 4 Another perspective schematic diagram in Figure 3 ;

[0035] Figure 5 Exploded view of the tray handling mechanism of the present invention;

[0036] Figure 6 Another alternative structure schematic diagram of the tray handling mechanism of the present invention;

[0037] Figure 7 Is Figure 2 The sectional view taken along H-H in

[0038] Figure 8 Schematic diagram of the resin loading mechanism of the present invention provided on the second mounting platform. Specific embodiments

[0039] The following further describes the present application in detail with reference to specific drawings. In the description of this embodiment, unless otherwise specified, the orientation or positional relationship indicated by terms such as "left" and "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the present application must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0040] In one embodiment, as Figure 1 shown, the resin loading mechanism 800 includes a third base 801, a third moving layer, and a fourth moving layer. The third base 801 is slidably provided on the second mounting platform 102. The third moving layer can extend to one side relative to the third base 801, and the fourth moving layer can extend to one side relative to the third moving layer and in the same direction as the extension direction of the third moving layer. At the same time, the moving directions of the third moving layer and the fourth moving layer are both perpendicular to the moving direction of the third base 801. The tray handling mechanism 4034 is provided on the fourth moving substrate for handling resin trays.

[0041] Furthermore, as Figure 3 and Figure 4As shown, the third moving layer includes a third moving substrate 802, which is slidably arranged on the third base 801. A fourth driving motor 8021 is provided on the third moving substrate 801. A fourth driving pulley 8022 is connected to the output shaft of the fourth driving motor 8021. A rotating fourth driven pulley 8024 is provided on the third moving substrate 802, and the two are connected by a fourth synchronous belt 8025. Two parallel fourth guide rails 8013 are arranged on the third base 801, and at least one fourth slider 8023 is arranged on each fourth guide rail 8013. The third moving substrate 802 is fixedly arranged on the fourth slider 8023. Among them, a third connecting block 8014 is provided on the third base 801, and the third connecting block 8014 is fixedly connected to the fourth synchronous belt 8025, so as to drive the third moving substrate 802 to move relative to the third base 801.

[0042] Further, the fourth moving layer includes a fourth moving substrate 803. A tray handling mechanism 4034 is arranged on the fourth moving substrate 803, which is used for handling empty resin trays 80344 or handling resin trays 80344 with laid films and resins. Two parallel fifth guide rails 8026 are arranged on the third moving substrate 802, and fifth sliders 8032 are arranged on the fifth guide rails 8026. The fourth moving substrate 803 is fixedly arranged on the fifth sliders 8032. In this embodiment, in order to reduce the driving devices, such as Figure 7 As shown, a fourth connecting block 8033 is arranged on the fourth moving substrate 803, and the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025. In the initial position, the third connecting block 8014 is close to the fourth driven pulley 8024, and the fourth connecting block 8033 is close to the fourth driving pulley 8022. When the fourth driving motor 8021 rotates, it drives the third moving layer and the fourth moving layer to move relative to the third connecting block 8014 on the third base 801. At the same time, since the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025, and the fourth connecting block 8033 is fixedly connected to the fourth moving substrate 803, the fourth moving substrate 803 moves synchronously with the third moving substrate 802.

[0043] Optionally, the fourth moving substrate 803 can also be driven by a separate driving device, such as a motor lead screw slider structure, or a motor combined with a synchronous pulley and synchronous belt structure, or a cylinder structure with a push rod.

[0044] In one embodiment, such as Figure 5As shown, the pallet handling mechanism 4034 includes a second upper base 40341 and a second lower base 40342 that are fixedly connected to each other from top to bottom. A preset distance is provided between the second upper base 40341 and the second lower base 40342. The second upper base 40341 is fixedly connected to the second moving substrate 403. The second pallet clamping assembly further includes a second main clamping mechanism and a second auxiliary clamping mechanism, and the specific mechanisms are as follows;

[0045] Refer again to Figure 5 , the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping linkages 403423 arranged in parallel with each other, and a main clamping cylinder 403433 having two opening and closing free ends, and the two free ends can move away from each other or move towards each other simultaneously to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422. Among them, the four second main clamping jaws 403424 are divided into two groups, and each group is fixedly arranged at both ends of the second main clamping linkage 403423. The second main clamping jaws 403424 are adapted to the clamping grooves 403441 on the resin pallet 40344. The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed at the two opening and closing free ends of the main clamping cylinder 403433. By the two free ends of the main clamping cylinder 403433 moving towards or away from each other, the four second main clamping jaws 403424 are driven to perform opening and closing actions, so as to grasp or release the resin pallet 40344; in this embodiment, the second main clamping jaws 403424 are hooks with an L-shaped structure.

[0046] Further, four second main guide rails 403426 are provided on the second lower base 40342, and four corresponding second main sliders 403425 are provided on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is the same as the opening and closing direction of the free ends of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixedly arranged at both ends of the corresponding two second main clamping linkages 403423, so as to support the second main clamping linkages 403423.

[0047] Optionally, as Figure 6As shown, the second main jaw 403424 can also be set as a rotating structure. Two second main clamping linkages 403434 arranged in parallel are rotatably arranged on the second lower base 40342. Specifically, four rotating brackets 403435 are arranged on the second lower base 40342, and the second main clamping linkages 403434 are rotatably arranged on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is arranged between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping linkages 403434. One end of the second main clamping rocker 403436 is fixedly connected to the second main clamping linkage 40344, and the other end of the second main clamping rocker 403436 is movably connected to a free end of the main clamping cylinder 403433. For example, a first connecting rod with a first connecting slot opening in a strip structure is provided. One end of the first connecting rod is movably connected to a free end of the main clamping cylinder 403433, and the end of the first connecting rod with the first connecting slot opening is arranged on the side away from the second lower base 40342, so as to make the first connecting slot opening compensate for the movement of the first connecting rod in the vertical direction and avoid movement interference. The first connecting slot opening can be a rectangular structure or a U-shaped groove structure, so that the openable free end of the main clamping cylinder 403433 can drive the second main jaw 403424 to rotate. For example, when the two free ends of the main clamping cylinder 403433 open and separate, the second main jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamping cylinder 403433 close and approach, the second main jaw 403424 cooperates with and abuts against the clamping groove 403441 of the resin tray.

[0048] As Figure 5As shown in the figure, the second sub-clamping mechanism includes a sub-clamping cylinder 403421. There are two free ends on the sub-clamping cylinder 403421 that can move towards or away from each other. A sub-moving seat 403428 is arranged at the free end of the sub-clamping cylinder 403421. A first sub-clamping block 403431 is arranged on the sub-moving seat 403428. The first sub-clamping block 403431 can clamp and wrap one side edge of the resin tray 40344. A liftable first main clamping block 403430 is arranged on the sub-moving seat 403428. Specifically, a second lifting cylinder 403429 is arranged on the sub-moving seat 403428. The free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. Through the lifting of the first main clamping block 403430, the closing and opening with the first sub-clamping block 403431 are realized to clamp and fix the film. Then, in combination with the sub-clamping cylinder 403421, the sub-moving seat 403428 is brought closer, so as to realize the fixation of the edge of the film carrying the resin, and make the film fixed relative to the resin tray 40344. In this embodiment, the sub-moving seat 403428, the first sub-clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are all in two groups and are symmetrically arranged with respect to the second upper base 40341, so as to clamp and fix the film at the edge of the resin tray 40344 and make the resin tray 40344 and the film move synchronously.

[0049] Furthermore, a second sub-guide rail 403411 is arranged on the second upper base 40341. A second sub-slider 403432 is arranged on the second sub-guide rail 403411. The second sub-slider 403432 is connected to the sub-moving seat 403428, so as to provide support for the sub-moving seat 403428. The axial direction of the second sub-guide rail 403411 is consistent with the opening and closing movement direction of the free end of the sub-clamping cylinder 403421.

[0050] In this embodiment, as Figure 5 shown, the first sub-clamping block 403431 and the first main clamping block 403430 are located on two opposite side edges of the resin tray 40344, and the second main clamping jaw 403424 is located on the other two opposite side edges of the resin tray 40344.

[0051] In one embodiment, as Figure 8As shown in the figure, the present invention also provides a semiconductor packaging device, which mainly includes the resin loading mechanism in each of the above embodiments, a second mounting platform 102, on which there is at least one third guide rail 1025, and a third slider 8013 is arranged on the third guide rail 1025. A third base 801 is fixedly arranged on the third slider 8013; a third driving component is used to drive the resin loading mechanism 800 to perform a reciprocating linear movement along the third guide rail 8013. Specifically, in this embodiment, the third driving component includes a third driving motor 8011 arranged on the third base 801, and a second gear 8012 is arranged at the output end of the third driving motor 8011. A second straight rack 1026 is arranged on the second mounting platform 102, and the second straight rack 1026 is arranged parallel to the third guide rail 1025, and the second gear 8012 is engaged with the second straight rack 1026 for transmission.

[0052] Optionally, the transmission mode of the second gear 8012 and the second straight rack 1026 can be replaced by a screw rod slider structure, or a synchronous belt and synchronous pulley transmission structure can be adopted. At this time, the third driving motor 8011 needs to be arranged on the second mounting platform.

[0053] Optionally, the third driving component can also be directly replaced by a linear push rod cylinder, and the third base can be fixedly connected to the free end of the linear push rod cylinder.

[0054] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made. These improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A resin loading mechanism, characterized in that: include: The third base is capable of reciprocating linear movement; A fourth moving layer is provided with a fourth moving substrate, and the fourth moving layer is movably arranged relative to the third base via the fourth moving substrate; A tray transport mechanism, disposed on the fourth movable base plate, the tray transport mechanism being used for transporting resin and recovering empty resin trays; The pallet transport mechanism comprises a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism; The second main clamping mechanism comprises two second main clamping connecting rods arranged in parallel with each other, the second main clamping connecting rods are movably arranged on the second lower base, and second main clamping claws that can be opened and closed are arranged at both ends of the second main clamping connecting rods; The second secondary clamping mechanism comprises two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block capable of being raised and lowered and a second secondary clamping block arranged in a fixed manner; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block; The two auxiliary movable seats can move away from or towards each other, thereby driving the second auxiliary clamping block to open and close.

2. A resin loading mechanism according to claim 1, characterized in that: It also includes a third moving layer, which is provided with a third moving substrate. The third moving substrate is movably arranged on the third base. The fourth moving layer is movably arranged on the third moving layer. The moving directions of the fourth moving layer and the third moving layer are consistent and perpendicular to the moving direction of the third base.

3. A resin loading mechanism according to claim 2, characterized in that: The third base is provided with a fourth guide rail, the fourth guide rail is provided with a fourth slider, the third movable substrate is arranged on the fourth slider, and the axial direction of the fourth guide rail is consistent with the moving direction of the fourth movable layer.

4. A resin loading mechanism according to claim 3, characterized in that: A fifth guide rail is disposed on the third translation substrate, a fifth slider is disposed on the fifth guide rail, and an axial direction of the fifth guide rail is consistent with an axial direction of the fourth guide rail.

5. A resin loading mechanism according to claim 4, characterized in that: There are at least two fourth guide rails, at least two of which are arranged in parallel and spaced apart, and each of the fourth guide rails is provided with at least one fourth slider; There are at least two fifth guide rails, and at least two of the fifth guide rails are arranged in parallel and spaced apart, and each of the fifth guide rails is provided with at least one fifth sliding block.

6. A resin loading mechanism according to claim 4, characterized in that: It also includes a fourth drive assembly, the fourth drive assembly includes a fourth drive motor, a fourth driving pulley, a fourth driven pulley and a fourth synchronous belt, the fourth drive motor is arranged on the third movable base plate, the fourth driving pulley is arranged on the output shaft of the fourth drive motor, the fourth driven pulley is rotatably arranged on the fourth movable base plate, and the fourth synchronous belt is wound around the fourth driving pulley and the fourth driven pulley; Among them, a third connecting block is arranged on the third base, and a fourth connecting block is arranged on the fourth movable base plate. The third connecting block is fixedly connected to the fourth synchronous belt, and the fourth connecting block is connected to the fourth synchronous belt.

7. A resin loading mechanism according to claim 6, characterized in that: In the initial position, the third connecting block is close to the fourth driven pulley, and the fourth connecting block is close to the fourth driving pulley. When the third moving layer and the fourth moving layer are fully extended, the third connecting block is close to the fourth driving pulley, and the fourth connecting block is close to the fourth driven pulley.

8. A semiconductor packaging device, characterized in that include: The resin loading mechanism according to any one of claims 1 to 7; A second mounting platform, on which at least one third guide rail is provided, on which a third slider is provided, and on which the third base is provided; The third driving assembly is used to drive the resin loading mechanism to move back and forth linearly along the third guide rail.

9. The semiconductor packaging device according to claim 8, characterized in that: The third driving assembly includes a third driving motor arranged on the third base, the output end of the third driving motor is provided with a second gear, the second mounting platform is provided with a second spur rack, the second spur rack is arranged parallel to the third guide rail, and the second gear is meshed with the second spur rack.

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